Method for manufacturing a light-emitting device, as well as a light-emitting device and a light-emitting module.

Abstract

To provide a method for manufacturing a light emitting device and a light emitting device that can facilitate electrical connection between a light source and a mounting member.SOLUTION: A light emitting device manufacturing method includes a step of preparing a light source 10, the light source including a plurality of light emitting units 11, a support substrate including having a first upper surface, a plurality of first terminal portions including a plurality of terminals each of which is paired with and electrically connected to each of the plurality of light emitting portions on the first upper surface, and one or more first wire connection portions WT1, and a light reflective member 13 that covers the plurality of light emitting portions and has a recess for exposing one or more first wire connection portions on the support substrate, a step of preparing a control unit having a second upper surface, and including, on the second upper surface, a first area where the light source can be arranged, and one or more second wire connection portions WT2 arranged in a second area other than the first area 1, a step of arranging the light source in the first region of the control unit, and a step of connecting the first wire connection portion and the second wire connection portion with a first wire.SELECTED DRAWING: Figure 1B

Description

[Technical Field]

[0001] This disclosure relates to a method for manufacturing a light-emitting device, as well as a light-emitting device and a light-emitting module. [Background technology]

[0002] In recent years, light sources using light-emitting elements such as light-emitting diodes have come into widespread use. For example, Patent Documents 1 and 2 disclose a light source that includes multiple light-emitting elements, in which white reflective members are filled between adjacent light-emitting elements. [Prior art documents] [Patent Documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2014-139979 [Patent Document 2] Japanese Patent Publication No. 2015-35532 [Overview of the project] [Problems that the invention aims to solve]

[0004] When arranging the light sources disclosed in Patent Documents 1 and 2 on a mounting substrate or other mounting material, one example is to employ wire bonding technology to electrically connect the light source and the mounting material with wires.

[0005] This disclosure aims to provide a method for manufacturing a light-emitting device and a light-emitting device that facilitates the electrical connection between a light source and a mounting component. [Means for solving the problem]

[0006] The method for manufacturing the light-emitting device relating to this disclosure is: The process of preparing a light source, Multiple light-emitting parts, A support substrate having a first upper surface, the first upper surface comprising a plurality of first terminal portions including a plurality of terminals electrically connected in pairs to each of the plurality of light-emitting portions, and one or more first wire connection portions, A light-reflecting member that covers the plurality of light-emitting parts and has recesses that expose the one or more first wire connection parts on the support substrate, A step of preparing a light source equipped with, A step of preparing a control unit having a second upper surface, the second upper surface comprising a first region on which the light source can be arranged, and one or more second wire connection parts arranged in the second region other than the first region, The steps include: arranging the light source in the first region of the control unit; The process includes connecting the first wire connection part and the second wire connection part with the first wire.

[0007] Furthermore, the light-emitting device relating to this disclosure is It is a light source, Multiple light-emitting parts, A support substrate having a first upper surface, the first upper surface comprising a plurality of first terminal portions including a plurality of terminals electrically connected in pairs to each of the plurality of light-emitting portions, and one or more first wire connection portions, A light-reflecting member that covers the plurality of light-emitting parts and has recesses that expose the one or more first wire connection parts on the support substrate, A light source equipped with, A control unit having a second upper surface, the second upper surface having a first region on which the light source can be placed, and one or more second wire connection parts located in the second region other than the first region, and the control unit having the light source placed on the first region, A first wire connecting the first wire connection and the second wire connection, The device comprises a first resin member that fits into the recess and covers the first wire connection portion. [Effects of the Invention]

[0008] According to the present disclosure, it is possible to provide a method for manufacturing a light-emitting device and a light-emitting device that can facilitate an electrical connection between a light source and a mounting member.

Brief Description of the Drawings

[0009] [Figure 1A] It is a schematic plan view showing a light-emitting device according to an embodiment of the present disclosure. [Figure 1B] It is a schematic plan view showing a light-emitting device in a state where the first resin member and the second resin member in FIG. 1A are omitted. [Figure 1C] It is a schematic cross-sectional view when viewed in the direction of the arrow of the IC-IC line cross-section in FIG. 1A. [Figure 2A] It is a schematic plan view for explaining a depression of a light-emitting device according to an embodiment of the present disclosure. [Figure 2B] It is a schematic plan view for explaining a modified example of a depression of a light-emitting device according to an embodiment of the present disclosure. [Figure 2C] It is a schematic plan view for explaining a modified example of a depression of a light-emitting device according to an embodiment of the present disclosure. [Figure 3A] It is a schematic plan view showing a light-emitting module according to an embodiment of the present disclosure. [Figure 3B] It is a schematic plan view showing a light-emitting module in a state where the first resin member to the third resin member in FIG. 3A are omitted. [Figure 3C] It is a schematic cross-sectional view when viewed in the direction of the arrow of the III C-III C line cross-section in FIG. 3A. [Figure 4] It is a schematic cross-sectional view showing a light-emitting module according to another embodiment of the present disclosure. [Figure 5] It is a schematic cross-sectional view for explaining a first manufacturing method of a light-emitting device according to the present disclosure. [Figure 6A] It is a schematic cross-sectional view for explaining a first manufacturing method of a light-emitting device according to the present disclosure. [Figure 6B] It is a schematic plan view for explaining a first manufacturing method of a light-emitting device according to the present disclosure. [Figure 7A] It is a schematic cross-sectional view for explaining a first manufacturing method of a light-emitting device according to the present disclosure. [Figure 7B] This is a schematic plan view illustrating a first method for manufacturing the light-emitting device relating to this disclosure. [Figure 7C] This is a schematic cross-sectional view illustrating a modified example of the first method for manufacturing the light-emitting device according to this disclosure. [Figure 8A] This is a schematic cross-sectional view illustrating a first method for manufacturing the light-emitting device according to this disclosure. [Figure 8B] This is a schematic cross-sectional view illustrating a modified example of the first method for manufacturing the light-emitting device according to this disclosure. [Figure 9A] This is a schematic cross-sectional view illustrating a first method for manufacturing the light-emitting device according to this disclosure. [Figure 9B] This is a schematic plan view illustrating a first method for manufacturing the light-emitting device relating to this disclosure. [Figure 10A] This is a schematic cross-sectional view illustrating a first method for manufacturing the light-emitting device according to this disclosure. [Figure 10B] This is a schematic plan view illustrating a first method for manufacturing the light-emitting device relating to this disclosure. [Figure 11A] This is a schematic cross-sectional view illustrating a first method for manufacturing the light-emitting device according to this disclosure. [Figure 11B] This is a schematic plan view illustrating a first method for manufacturing the light-emitting device relating to this disclosure. [Figure 12] This is a schematic plan view illustrating a first method for manufacturing the light-emitting device relating to this disclosure. [Figure 13] This is a schematic cross-sectional view illustrating a first method for manufacturing the light-emitting device according to this disclosure. [Figure 14] This is a schematic cross-sectional view illustrating a first method for manufacturing the light-emitting device according to this disclosure. [Figure 15] This is a schematic cross-sectional view illustrating a first method for manufacturing the light-emitting device according to this disclosure. [Figure 16] This is a schematic cross-sectional view illustrating the manufacturing method of the light-emitting module related to this disclosure. [Figure 17] This is a schematic cross-sectional view illustrating the manufacturing method of the light-emitting module related to this disclosure. [Figure 18]This is a schematic cross-sectional view illustrating a second method for manufacturing the light-emitting device according to this disclosure. [Figure 19] This is a schematic cross-sectional view illustrating a second method for manufacturing the light-emitting device according to this disclosure. [Figure 20] This is a schematic cross-sectional view illustrating a second method for manufacturing the light-emitting device according to this disclosure. [Figure 21] This is a schematic cross-sectional view illustrating a second method for manufacturing the light-emitting device according to this disclosure. [Figure 22] This is a schematic cross-sectional view illustrating a second method for manufacturing the light-emitting device according to this disclosure. [Modes for carrying out the invention]

[0010] Embodiments of this disclosure will be described below with reference to the drawings. The manufacturing method of the light-emitting device, as well as the light-emitting device and light-emitting module described below, are intended to embody the technical concept of this disclosure, and unless otherwise specified, this disclosure is not limited to the following.

[0011] In each drawing, components having the same function may be denoted by the same reference numeral. For convenience, multiple embodiments may be shown to facilitate explanation or understanding of key points. Partial substitution or combination of configurations shown in different embodiments is possible. In later embodiments, descriptions of matters common to those described earlier may be omitted, and only the differences may be explained. In particular, similar effects and benefits from similar configurations will not be mentioned sequentially in each embodiment. The size and positional relationships of components shown in each drawing may be exaggerated to clarify the explanation. End view diagrams showing only the cut surface may be used as cross-sectional views.

[0012] In the following description, terms indicating specific directions or positions (e.g., “up,” “down,” and other terms including these terms) may be used. However, these terms are used only to indicate relative directions or positions in the referenced drawings. In this specification, the positional relationship expressed as “up (or down)” includes, for example, the case where two members are in contact, and the case where the two members are not in contact, but one member is located above (or below) the other.

[0013] <Light-emitting device> As shown in Figures 1A to 1C, a light-emitting device 1 according to one embodiment of the present disclosure comprises a light source 10, a control unit 20, a first wire W1 that electrically connects the light source 10 and the control unit 20, and a first resin member R1 that covers the first wire connection portion WT1 on the light source 10. The light-emitting device 1 may further comprise a second resin member R2 that covers the second wire connection portion WT2 on the control unit 20. The components of the light-emitting device 1 will be described in detail below.

[0014] [light source] The light source 10 comprises a plurality of light-emitting units 11, a support substrate 12 on which the plurality of light-emitting units 11 are arranged, and a light-reflective member 13 covering the plurality of light-emitting units 11. The light source 10 illustrated in Figure 1A has a light-emitting surface P on its upper surface that includes the light-emitting surfaces of the plurality of light-emitting units 11, and the lower surface opposite to the upper surface is the mounting surface.

[0015] [Light-emitting part] The multiple light-emitting units 11 can be lit individually or in groups by, for example, a control unit 20, which will be described later. As shown in Figure 1A, it is preferable that the multiple light-emitting units 11 are aligned at equal intervals in a first direction and a second direction intersecting the first direction when viewed from above. Figure 1A illustrates a configuration in which the light-emitting units 11 are aligned in a 5x5 grid.

[0016] The multiple light-emitting units 11 may all be connected in series and lit together, or they may be connected in parallel and lit individually. Alternatively, a combination of series and parallel connections may be used, with each series-connected group being lit separately. For example, by connecting the multiple light-emitting units 11 in parallel, each light-emitting unit 11 can be individually controlled by the control unit 20. This allows each light-emitting unit 11 to be lit individually at a desired brightness, thereby improving the contrast of the light emitted from the light source 10.

[0017] The light-emitting device 1 according to this embodiment can be used, for example, as a flash light source for an imaging device. The imaging device is mounted, for example, in a mobile communication terminal. When the light-emitting device 1 according to this embodiment is used as a flash light source for an imaging device, it is possible to switch between, for example, a wide-angle mode in which all light-emitting parts 11 emit light and a narrow-angle mode in which only the light-emitting parts 11 located near the center emit light and the light-emitting parts 11 located on the outside do not emit light. The narrow-angle mode has a narrower illumination angle than the wide-angle mode. Because the light-emitting device 1 can switch the illumination light in correspondence with the wide-angle mode and the narrow-angle mode, it becomes possible to perform shooting according to the shooting mode of the imaging device, such as macro or telephoto.

[0018] In a top view, it is preferable that the distance between the light-emitting surfaces of adjacent light-emitting parts 11 is short. The distance between the light-emitting surfaces of adjacent light-emitting parts 11 is preferably, for example, 0.01 to 0.16 times and 0.02 to 0.08 times the maximum length of the light-emitting surface of the light-emitting part 11. The distance between the light-emitting surfaces of adjacent light-emitting parts 11 is preferably, for example, 10 μm to 200 μm and 20 μm to 100 μm. By setting the distance between the light-emitting surfaces of adjacent light-emitting parts 11 as described above, the dark area between the light-emitting parts 11 can be reduced.

[0019] The light-emitting section 11 has a light-emitting element 11a. The light-emitting section 11 may also have a translucent member 14 positioned above the light-emitting element 11a. The translucent member 14 is, for example, a plate-shaped member with a substantially rectangular shape when viewed from above, and is provided to cover the upper surface of the light-emitting element 11a. The translucent member 14 includes, for example, at least one selected from the group consisting of a wavelength conversion layer containing a wavelength conversion material, a light diffusion layer containing a light diffusion member, and a transparent layer that does not contain a wavelength conversion material or a light diffusion member. The translucent member 14 includes, for example, a wavelength conversion layer 14a and a light diffusion layer 14b.

[0020] The light-emitting element 11a has a semiconductor structure G and electrodes E. Electrodes E have at least two electrodes, each functioning as either an anode or a cathode. In the light-emitting element 11a shown in Figure 1C, electrodes E are located below the semiconductor structure G. The semiconductor structure G may include a support substrate and a semiconductor layer placed on the support substrate. In this case, the support substrate, semiconductor layer, and electrodes E are arranged in that order.

[0021] The semiconductor structure G includes an n-side semiconductor layer, a p-side semiconductor layer, and an active layer sandwiched between the n-side and p-side semiconductor layers. The active layer may be a single quantum well (SQW) structure or a multiple quantum well (MQW) structure including multiple well layers. The semiconductor structure G includes multiple semiconductor layers made of nitride semiconductors. The nitride semiconductor is In x Al y Ga 1-x-y The semiconductor comprises all compositions in which the composition ratios x and y are varied within their respective ranges in the chemical formula N (0 ≤ x, 0 ≤ y, x + y ≤ 1). The emission peak wavelength of the active layer can be appropriately selected depending on the purpose. The active layer is configured to emit, for example, visible light or ultraviolet light.

[0022] The semiconductor structure G may include a plurality of light emitting parts each including an n-side semiconductor layer, an active layer, and a p-side semiconductor layer. When the semiconductor structure G includes a plurality of light emitting parts, each light emitting part may include well layers having different emission peak wavelengths, or may include well layers having the same emission peak wavelength. Note that the same emission peak wavelength includes cases where there is a variation of about several nm. The combination of the emission peak wavelengths of the plurality of light emitting parts can be appropriately selected. For example, when the semiconductor structure G includes two light emitting parts, examples of the combination of the light emitted from each light emitting part include combinations of blue light and blue light, green light and green light, red light and red light, ultraviolet light and ultraviolet light, blue light and green light, blue light and red light, or green light and red light. For example, when the semiconductor structure G includes three light emitting parts, an example of the combination of the light emitted from each light emitting part is a combination of blue light, green light, and red light. Each light emitting part may include one or more well layers having an emission peak wavelength different from that of other well layers.

[0023] The wavelength conversion layer 14a wavelength-converts at least a part of the light from the light emitting element 11a. The wavelength conversion layer 14a is a plate-like member having a substantially rectangular shape in a top view. Examples of the wavelength conversion member included in the wavelength conversion layer 14a include yttrium aluminum garnet-based phosphors (e.g., (Y,Gd)3(Al,Ga)5O 12 :Ce), lutetium aluminum garnet-based phosphors (e.g., Lu3(Al,Ga)5O 12 :Ce), terbium aluminum garnet-based phosphors (e.g., Tb3(Al,Ga)5O 12 :Ce), CCA-based phosphors (e.g., Ca 10 (PO4)6Cl2:Eu), SAE-based phosphors (e.g., Sr4Al 14 O 25 :Eu), chlorosilicate-based phosphors (e.g., Ca8MgSi4O 16 Cl2:Eu), silicate-based phosphors (e.g., (Ba,Sr,Ca,Mg)2SiO4:Eu), β-sialon-based phosphors (e.g., (Si,Al)3(O,N)4:Eu), or α-sialon-based phosphors (e.g., Ca(Si,Al) 12(O,N) 16 : Nitride-based phosphors such as oxynitride phosphors like (Eu), LSN-based phosphors (e.g., (La,Y)3Si6N 11 :Ce), BSESN-based phosphors (e.g., (Ba,Sr)2Si5N8:Eu), SLA-based phosphors (e.g., SrLiAl3N4:Eu), CASN-based phosphors (e.g., CaAlSiN3:Eu) or SCASN-based phosphors (e.g., (Sr,Ca)AlSiN3:Eu), KSF-based phosphors (e.g., K2SiF6:Mn), KSAF-based phosphors (e.g., K2(Si 1-x Al x )F 6-x :Mn where x satisfies 0 < x < 1), or fluoride-based phosphors such as MGF-based phosphors (e.g., 3.5MgO·0.5MgF2·GeO2:Mn), quantum dots having a perovskite structure (e.g., (Cs,FA,MA)(Pb,Sn)(F,Cl,Br,I)3 where FA and MA represent formamidinium and methylammonium, respectively), II-VI group quantum dots (e.g., CdSe), III-V group quantum dots (e.g., InP), or quantum dots having a chalcopyrite structure (e.g., (Ag,Cu)(In,Ga)(S,Se)2) can be used.

[0024] The wavelength conversion layer 14a includes those obtained by incorporating the above wavelength conversion member into a resin material, ceramics, glass, etc., and sintered bodies of the wavelength conversion member. Further, the wavelength conversion layer 14a may be one in which a resin layer containing the wavelength conversion member is disposed on one surface of a molded body of a resin material, ceramics, glass, etc.

[0025] When emitting white light from a plurality of light emitting portions 11, for example, a light emitting element 11a that emits light in blue and a wavelength conversion layer 14a including a wavelength conversion member that emits light in yellow by the light from the light emitting element 11a can be combined.

[0026] The light diffusion layer 14b diffuses light that enters its interior. The light diffusion layer 14b is a plate-shaped member with a substantially rectangular shape when viewed from above. The light diffusion layer 14b is provided so as to cover the upper surface of the wavelength conversion layer 14a. For example, the light diffusion layer 14b can be made of a resin material containing a light-diffusing member such as titanium oxide, barium titanate, aluminum oxide, or silicon oxide. In this embodiment, the planar shape of the light diffusion layer 14b is the same as the planar shape of the wavelength conversion layer 14a. The planar shape of the light diffusion layer 14b may be larger or smaller than the planar shape of the wavelength conversion layer 14a.

[0027] When the translucent member 14 includes a wavelength conversion layer 14a and a light diffusion layer 14b, the light diffusion layer 14b may include a wavelength conversion member instead of, or in addition to, the light diffusion member. In other words, both the wavelength conversion layer 14a and the light diffusion layer 14b may contain a wavelength conversion member. Preferably, the light diffusion layer 14b includes a wavelength conversion member that emits light having an emission peak wavelength in the range of 450 nm to 480 nm. Examples of such wavelength conversion members include (Sr,Ca)2MgSi2O8:Eu or Ca 10(PO4)6Cl2:Eu can be used. By incorporating the above-mentioned wavelength conversion member into the light diffusion layer 14b located on the outermost surface of the light-emitting part 11, the color of the light diffusion layer 14b when viewed from above tends to be white when the light source 10 is not emitting light. This allows, for example, if the color of the light-reflective member 13, which will be described later, is white, the color of the entire top surface of the light source 10 when it is not emitting light can be made to be the same color (white). As a result, for example, the aesthetic appearance of the light-emitting device 1 can be improved when viewed from the outside. Furthermore, when using a light-emitting element 11a that emits blue light, a region with low relative emission intensity may occur in the emission spectrum of the light-emitting device, for example, in the wavelength range of 465 nm to 480 nm. In contrast, by including a wavelength conversion member in the light diffusion layer 14b that emits light having an emission peak wavelength in the range of 450 nm to 480 nm, the relative emission intensity of the region with low relative emission intensity in the emission spectrum of the light-emitting device 1 can be increased. This tends to increase the luminous flux of the light-emitting device 1. Furthermore, the wavelength conversion component included in the light diffusion layer 14b also has the effect of diffusing the light incident on the light diffusion layer 14b.

[0028] The outer edge of the light-transmitting member 14 may coincide with the outer edge of the light-emitting element 11a when viewed from above, or it may be located outside the outer edge of the light-emitting element 11a. This reduces the amount of light emitted from the light-emitting element 11a that is taken out to the outside without passing through the light-transmitting member 14. The outer edge of the light-transmitting member 14 may also be located inside the outer edge of the light-emitting element 11a when viewed from above.

[0029] [Support substrate] The support substrate 12 is a substrate on which a plurality of light-emitting units 11 can be arranged. The support substrate 12 comprises, for example, a base material containing an insulating material and wiring arranged on the surface of the base material. The support substrate 12 may further have a portion of the wiring arranged inside.

[0030] The support substrate 12 has an upper surface (first upper surface U1). The support substrate 12 has a plurality of first terminal portions T1 and one or more first wire connection portions WT1 on the first upper surface U1. The first terminal portions T1 and the first wire connection portions WT1 are part of the wiring. The first terminal portions T1 include a plurality of terminals and are electrically connected in pairs to the light-emitting portions 11. Each light-emitting portion 11 is arranged on a pair of first terminal portions T1, and the electrodes E of each light-emitting portion 11 are electrically connected to the terminals of the first terminal portions T1. The electrodes E of each light-emitting portion 11 and the terminals of the first terminal portions T1 are electrically connected via a conductive material such as silver paste. The terminals of the first terminal portions T1 are, for example, positive terminals and negative terminals.

[0031] The first wire connection section WT1 is a wiring section to which one end of the first wire W1, which will be described later, is connected. The first wire connection section WT1 is electrically connected to the second wire connection section WT2 of the control unit 20, which will be described later, by the first wire W1. This allows the current output from the control unit 20 to be supplied to the support substrate 12, and each light-emitting element 11a included in the multiple light-emitting sections 11 of the light source 10 to be lit individually or in groups.

[0032] The first wire connection sections WT1 may be arranged in rows opposite to each other in a top view, sandwiching a plurality of first terminal sections T1. In Figure 2A, four first wire connection sections WT1 are arranged in rows. In Figure 2A, for illustrative purposes, the control unit 20, the first wire W1, and the first resin member R1 are omitted, and only the first wire connection sections WT1 and a part of the support substrate 12 are visible. The arrangement and number of first wire connection sections WT1 are not limited to those described above, as long as current is appropriately supplied to each light-emitting section 11.

[0033] It is preferable to use an insulating material as the base material for the support substrate 12. It is preferable to use a material for the support substrate 12 that does not easily transmit light emitted from the light-emitting part 11 or ambient light, and has a certain level of mechanical strength. Specifically, the support substrate 12 can be constructed using ceramics such as aluminum oxide, aluminum nitride, mullite, and silicon nitride, or resins such as phenolic resin, epoxy resin, polyimide resin, BT resin (bismaleimide triazine resin), and polyphthalamide as the base material.

[0034] The wiring, including the first terminal portion T1 and the first wire connection portion WT1, can be made of at least one of the following materials: copper, iron, nickel, tungsten, chromium, aluminum, silver, gold, titanium, palladium, rhodium, or alloys thereof.

[0035] [Light-reflective material] The light-reflective member 13 has reflectivity to the light emitted by the light-emitting units 11. The light-reflective member 13 covers the sides of the multiple light-emitting units 11 so that the upper surfaces of the multiple light-emitting units 11 are exposed. The light-reflective member 13 is also positioned between adjacent light-emitting units 11. By positioning the light-reflective member 13 between the light-emitting units 11, it is possible to reduce the overlap between the emitted light from one light-emitting unit 11 and the emitted light from an adjacent light-emitting unit 11. This reduces the amount of emitted light from one light-emitting unit 11 entering the adjacent light-emitting unit 11 when, for example, one light-emitting unit 11 is emitting light and an adjacent light-emitting unit 11 is not. As a result, a light-emitting device with high contrast can be achieved.

[0036] In the light-emitting device 1 according to this embodiment, the light-reflective member 13 covers the side surface of the light-emitting element 11a, the side surface of the wavelength conversion layer 14a, and the side surface of the light-diffusing layer 14b. On the light-emitting surface of the light-emitting section 11, the upper surface of the light-diffusing layer 14b is exposed from the light-reflective member 13. The light-emitting surface is the main light extraction surface. The light-reflective member 13 also covers the side and bottom surfaces of the semiconductor structure G of the light-emitting element 11a. The light-reflective member 13 covers the side surface of the electrode E of the light-emitting element 11a. The bottom surface of the electrode E is exposed from the light-reflective member 13.

[0037] In a top view, the distance between the light-emitting surfaces of adjacent light-emitting parts 11 (width of the light-reflective member 13) is preferably, for example, 0.01 to 0.16 times and 0.02 to 0.08 times the maximum length of the light-emitting surface of the light-emitting part 11. The distance between the light-emitting surfaces of adjacent light-emitting parts 11 is preferably, for example, 10 μm to 200 μm and 20 μm to 100 μm. This makes it possible to create a light-emitting module with high contrast while making the light-emitting device 1 compact in a top view.

[0038] The light-reflecting member 13 has a recess C1 that exposes one or more first wire connection portions WT1 on the support substrate 12. Since the first wire connection portions WT1 are not covered by the light-reflecting member 13, the first wire W1 can be easily connected to the first wire connection portions WT1. In the light-emitting device 1 according to this embodiment, as shown in Figure 1C, the light-reflecting member 13 is spaced apart from the first wire connection portions WT1. The light-reflecting member 13 also has an upper surface 13U, a lower surface 13B located on the opposite side of the upper surface 13U, and an outer surface 13S connecting the upper surface 13U and the lower surface 13B. The recess C1 of the light-reflecting member 13 has an opening C that is continuously provided on the lower surface 13B and the outer surface 13S of the light-reflecting member 13. The opening C shown in Figure 1C does not reach the upper surface 13U of the light-reflecting member 13. This reduces the likelihood of the resin material forming the first resin member R1 creeping up onto the light-emitting surface P of the light source 10 when it is placed in the recess C1. As a result, it is possible to suppress the unintentional influence of the first resin member R1 on the orientation of the light source 10.

[0039] In this embodiment, as shown in Figure 1C, the recess C1 of the light-reflective member 13 is provided on the outer surface 13S on the side where the first wire connection portion WT1 is formed. Furthermore, the depth of the recess C1 increases in the direction from the outer surface 13S of the light-reflective member 13 toward the inner side, from the upper surface 13U side toward the lower surface 13B side. The maximum length L1 in the height direction of the opening C of the recess C1 is, for example, 0.3 times or more and 0.9 times or less, and preferably 0.5 times or more and 0.9 times or less, the length L0 from the upper surface 13U to the lower surface 13B of the light-reflective member 13. Furthermore, the maximum length L2 in the direction from the outer surface 13S toward the inner side of the opening C of the recess C1 is, for example, 0.3 times or more and 5 times or less, and preferably 0.5 times or more and 2 times or less, the length L0 from the upper surface 13U to the lower surface 13B of the light-reflective member 13. The maximum length L2 may be longer than the maximum length L1.

[0040] The first resin member R1, described later, fits into the recess C1. By providing the recess C1, which has an opening C that does not reach the upper surface 13U of the light-reflective member 13, it is possible to reduce the first resin member R1 from crawling up onto the light-emitting surface P of the light source 10. This reduces the effect of the first resin member R1 crawling up onto the light-emitting surface P of the light source 10 on the orientation of the light source 10. Furthermore, by having the recess C1 on the outer surface 13S of the light-reflective member 13, the contact area between the light-reflective member 13 and the first resin member R1 can be increased compared to a light-emitting device in which the light-reflective member 13 does not have the recess C1. This improves the adhesion between the light-reflective member 13 and the first resin member R1.

[0041] In the light-emitting device 1 of this embodiment, the recesses C1 of the light-reflective member 13 are arranged in a row along a plurality of first wire connection portions WT1 in a top view, as shown in Figure 2A. However, the recesses C1 of the light-reflective member 13 are not limited to the above configuration, as long as the light-reflective member 13 is located at a distance from the first wire connection portions WT1. For example, the recesses C1 of the light-reflective member 13 may be recesses that penetrate from the top surface to the bottom surface of the light-reflective member 13, as shown in Figure 2B. At the bottom surface of the recess C1, the first wire connection portions WT1 and a part of the support substrate 12 are exposed from the light-reflective member 13. The recesses C1 may be provided individually for each first wire connection portion WT1, as shown in Figure 2B, or for a plurality of first wire connection portions WT1. Furthermore, the recesses C1 of the light-reflective member 13 may be recesses that penetrate from the top surface to the bottom surface of the light-reflective member 13 and reach the side surface of the light-reflective member 13, as shown in Figure 2C. At the bottom of the recess C1, the first wire connection portion WT1 and a part of the support substrate 12 are exposed from the light-reflective member 13. In Figures 2B and 2C, for illustrative purposes, the control unit 20, the first wire W1, and the first resin member R1 are omitted, and the first wire connection portion WT1 and a part of the support substrate 12 are made visible.

[0042] The light-reflective member 13 can be made of a resin material containing a light-reflective substance such as a white pigment. Examples of light-reflective substances include titanium dioxide, zinc oxide, magnesium oxide, magnesium carbonate, magnesium hydroxide, calcium carbonate, calcium hydroxide, calcium silicate, magnesium silicate, barium titanate, barium sulfate, aluminum hydroxide, aluminum oxide, zirconium oxide, silicon oxide, etc. It is preferable to use one of these alone or two or more of these in combination. Furthermore, it is preferable to use a resin material mainly composed of thermosetting resins such as epoxy resin, silicone resin, silicone-modified resin, and phenolic resin, or a resin material mainly composed of thermoplastic resins such as polyphthalamide resin, polybutylene terephthalate, and unsaturated polyester as the base material.

[0043] [Control Unit] The control unit 20 is located below the light source 10, and the light source 10 is positioned on its upper surface (second upper surface U2). The control unit 20 controls multiple light-emitting units 11 individually or in groups, and an IC is one example of this. By stacking the light source 10 and the control unit 20 in the height direction, it is not necessary to secure separate areas for the light source 10 and the control unit 20 on the same mounting surface of the mounting substrate. This makes it possible to reduce the size of the light-emitting device 1 when viewed from above.

[0044] The control unit 20 has a first region A1 and a second region A2 on its second upper surface U2. The first region A1 is the region where the light source 10 can be placed and corresponds to the central region of the control unit 20. The second region A2 corresponds to the region outside the first region A1 and has a plurality of second wire connection parts WT2.

[0045] In the light-emitting device 1 according to this embodiment, the multiple second wire connection sections WT2 are arranged in a row in the second region A2, flanking the multiple light-emitting sections 11. The arrangement direction of the multiple second wire connection sections WT2 coincides with the arrangement direction of the multiple first wire connection sections WT1. In Figure 1B, four second wire connection sections WT2 are arranged in a row. Note that the arrangement and number of second wire connection sections WT2 are not limited to the above, as long as current is appropriately supplied to each light-emitting section 11.

[0046] The first wire connection part WT1 provided on the support substrate 12 and the second wire connection part WT2 provided on the control unit 20 are electrically connected by the first wire W1. This allows the current output from the control unit 20 to be supplied to the support substrate 12, and each light-emitting element 11a included in the multiple light-emitting parts 11 of the light source 10 to be lit individually.

[0047] The second wire connector WT2 can be made of the same material as the first wire connector WT1.

[0048] [First wire] The first wire W1 is a component for supplying current output from the control unit 20 to the support substrate 12. The first wire W1 electrically connects the first wire connection part WT1 provided on the support substrate 12 and the second wire connection part WT2 provided on the control unit 20. As the first wire W1, for example, a metal such as gold, copper, silver, platinum, aluminum, or palladium, or an alloy containing one or more of these, can be used.

[0049] [First resin component] The first resin member R1 covers the first wire connection portion WT1. The first resin member R1 is an insulating resin material, and for example, it has light reflectivity. The first resin member R1 may be made of the same material as the light-reflecting member 13, or it may be made of a different material. The first resin member R1 may be positioned in contact with the surface of the recess C1. By positioning the first resin member R1 in the recess C1, the contact area between the light-reflecting member 13 and the first resin member R1 can be increased compared to a light-emitting device in which the light-reflecting member 13 does not have a recess C1. This improves the adhesion between the light-reflecting member 13 and the first resin member R1. In addition, in the light-emitting device 1 of this embodiment, the first resin member R1 covers the first wire W1. By covering the first wire W1 with the first resin member R1, for example, when an external force is applied to the light-emitting device 1, the first resin member R1 protects the first wire W1 and has the effect of reducing deformation of the first wire W1. Furthermore, because the first resin member R1 is light-reflecting, it reflects a portion of the light from the light source 10 that is emitted toward the first wire W1, making it easier to extract upwards. In addition, because the first resin member R1 covers the first wire W1, the first wire W1 becomes less visible when the light-emitting device 1 is viewed from above, thus improving the aesthetic appearance of the light-emitting device 1.

[0050] [Second resin component] The light-emitting device 1 may further include a second resin member R2. The second resin member R2 covers the second wire connection portion WT2. The second resin member R2 is an insulating resin member, similar to the first resin member R1, and for example, it has light reflectivity. The second resin member R2 may be made of the same material as the first resin member R1, or it may be made of a different material. In the light-emitting device 1 of this embodiment, the second resin member R2 covers the first wire W1 and the second wire W2, which will be described later. By covering the first wire W1, etc., with the second resin member R2, for example, when an external force is applied to the light-emitting device 1, the second resin member R2 plays a role in protecting the first wire W1, etc., and has the effect of reducing deformation of the first wire W1, etc. Furthermore, because the second resin member R2 has light reflectivity, a portion of the light from the light source 10 that is emitted toward the first wire W1, etc. is reflected by the second resin member R2, making it easier to extract upwards. Furthermore, since the second resin member R2 covers the first wire W1 and the second wire W2, the first wire W1 and the second wire W2 become less visible when the light-emitting device 1 is viewed from above, thus improving the aesthetic appearance of the light-emitting device 1. Alternatively, the second wire connection portion WT2 may be covered by the first resin member R1 without providing the second resin member R2.

[0051] The first resin member R1 and the second resin member R2 may have curved upper surfaces, as shown in Figure 1C. Furthermore, in the height direction, the highest point of the second resin member R2 may be lower than the highest point of the first resin member R1. Note that the upper surfaces of the first resin member R1 and the second resin member R2 may be flat surfaces without curved surfaces, or they may be a combination of flat and curved surfaces.

[0052] Next, a light-emitting module 2 according to one embodiment of the present disclosure will be described with reference to Figures 3A and 3B. The light-emitting module 2 according to one embodiment of the present disclosure comprises a light-emitting device 1, a mounting substrate 30 on which the light-emitting device 1 is arranged on the upper surface, and a second wire W2 that electrically connects the light-emitting device 1 and the mounting substrate 30. The light-emitting module 2 may further comprise a second resin member R2, a third resin member R3, and a lens 60. Hereinafter, each component of the light-emitting module 2 will be described in detail. The light-emitting device 1 is as described above and will not be described further.

[0053] [Mounted circuit board] The mounting substrate 30 is located below the control unit 20. It is preferable that the mounting substrate 30 be made of a material that does not easily transmit light emitted from the light source 10 or ambient light. The mounting substrate 30 can be constructed using, for example, ceramics such as aluminum oxide, aluminum nitride, or mullite, or resins such as phenolic resin, epoxy resin, polyimide resin, BT resin, or polyphthalamide as the base material.

[0054] The mounting substrate 30 has a region on its third upper surface U3 where the light-emitting device 1 is placed, and a region outside the region where the light-emitting device 1 is placed. The region outside the region where the light-emitting device 1 is placed is provided with one or more third wire connection portions WT3.

[0055] Multiple third wire connection sections WT3 may be arranged in a row in a top view with the light-emitting device 1 in between, as shown in Figure 3B. The arrangement direction of the third wire connection sections WT3 coincides, for example, with the arrangement direction of the first wire connection section WT1 and the arrangement direction of the second wire connection section WT2.

[0056] One or more third wire connectors WT3 are electrically connected to a second wire connector WT2 provided on the control unit 20 by a second wire W2. This allows current to be supplied from the mounting board 30 to the control unit 20 by the second wire W2. The third wire connectors WT3 can be made of the same material as the first wire connectors WT1.

[0057] [Third resin component] The third resin member R3 covers the third wire connection portion WT3. Like the first resin member R1 and the second resin member R2, the third resin member R3 is an insulating material to prevent electrical short circuits to the third wire connection portion WT3. The third resin member R3 also has, for example, light reflectivity. The third resin member R3 may be made of the same material as the first resin member R1 or the second resin member R2, or it may be made of a different material. In the light-emitting module 2 of this embodiment, the third resin member R3 covers a portion of the second wire W2. The second wire W2 is covered by a portion of the second resin member R2 and a portion of the third resin member R3.

[0058] The first resin member R1, the second resin member R2, and the third resin member R3 may have curved upper surfaces, as shown in Figure 3C. Furthermore, in the height direction, the highest point of the third resin member R3 may be lower than the highest point of the second resin member R2, and the highest point of the second resin member R2 may be lower than the highest point of the first resin member R1.

[0059] <Flash module with built-in light-emitting module> Next, a flash light-emitting module incorporating the light-emitting module of this embodiment will be described with reference to Figure 4. In the flash light-emitting module of this embodiment, a lens 60 is positioned above the light source 10. As an example, a first lens 61 may be provided on the light source 10, and a second lens 62 may be provided on top of it. The second lens 62 is, for example, a Fresnel lens. A Fresnel lens is positioned so that the lower surface with its uneven surface faces the light source 10, allowing light emitted from the light source 10 to enter and exit from its flat upper surface. By using a Fresnel lens, the thickness of the lens 60 can be reduced. In the light-emitting module 2 according to this embodiment, the light source 10 and the control unit 20 are stacked in the height direction, so the thickness of the light-emitting module tends to be thicker compared to a light-emitting module in which the light source 10 and the control unit 20 are arranged separately. Therefore, by making the lens 60 or a part of the lens 60 a Fresnel lens, it is possible to suppress the overall thickness of the light-emitting module from becoming thicker. This makes it possible to miniaturize the light-emitting module 2.

[0060] <Manufacturing method for light-emitting devices> Next, a method for manufacturing a light-emitting device according to one embodiment of the present disclosure will be described. The method for manufacturing a light-emitting device according to one embodiment of the present disclosure includes the steps of preparing a light source, preparing a control unit, arranging the light source on the control unit, and electrically connecting the light source and the control unit with a first wire. The method for manufacturing a light-emitting device according to one embodiment of the present disclosure may further include the step of arranging a first resin member after the step of electrically connecting with the first wire. The method for manufacturing a light-emitting device according to one embodiment of the present disclosure includes a first manufacturing method and a second manufacturing method. First, the steps of the first manufacturing method will be described with reference to Figures 5 to 15.

[0061] <First method for manufacturing a light-emitting device> [Preparing the light source] The process of preparing the light source includes the steps of arranging a plurality of light-emitting parts on the first upper surface of the support substrate and forming a light-reflective member on the first upper surface of the support substrate that covers the plurality of light-emitting parts.

[0062] -The process of arranging multiple light-emitting units- First, as shown in Figure 5, the light-emitting elements 11a that constitute the light-emitting section 11 are prepared. Each light-emitting element 11a has a semiconductor structure G and electrodes E. Next, each light-emitting element 11a is placed on the first terminal section T1 of the support substrate 12. The electrodes E of each light-emitting element 11a and the terminals of the first terminal section T1 are electrically connected via a conductive material such as silver paste.

[0063] Then, as shown in Figures 6A and 6B, a translucent member 14 is placed on the light-emitting element 11a. The translucent member 14 may include a wavelength conversion layer 14a and a light diffusion layer 14b as described above. The step of placing the translucent member 14 on the light-emitting element 11a comprises the steps of: placing an uncured bonding member on the upper surface of the light-emitting element 11a; placing the translucent member 14 on the light-emitting element 11a via the uncured bonding member; and bonding the light-emitting element 11a and the translucent member 14 by curing or solidifying the uncured bonding member. The uncured bonding member is, for example, a translucent resin member. In the manufacturing method according to this embodiment, the light diffusion layer 14b contains a light diffusion member such as titanium dioxide, and the wavelength conversion layer 14a contains a wavelength conversion member such as a YAG phosphor. The light-emitting section 11, including the light-emitting element 11a and the translucent member 14, is arranged in a grid pattern on the support substrate 12 in a top view, as shown in Figure 6B. Furthermore, the first wire connection section WT1 is arranged in a row with multiple light-emitting sections 11 in between when viewed from above.

[0064] -Process for forming light-reflective material- The process of forming the light-reflective member 13 includes the steps of: placing a covering member S to cover the first wire connection portion WT1; covering the covering member S and the plurality of light-emitting portions 11 with the light-reflective member 13; and removing the covering member S and forming a recess C1 in the area where the covering member S was placed. In this specification, the same term "light-reflective member" may be used for the light-reflective member 13 before and after the step in which a part of it is removed.

[0065] First, as shown in Figures 7A and 7B, one or more first wire connection portions WT1 are covered with a covering member S. The covering member S is a member used to form a recess C1 in the light-reflecting member 13 during the process of forming the light-reflecting member 13, and is removed in a later step. Preferably, the covering member S is a water-soluble member that can be dissolved in water. In the examples shown in Figures 7A and 7B, the first wire connection portion WT1 is covered with a single layer of covering member S. Alternatively, as shown in Figure 7C, the first wire connection portion WT1 may be covered with multiple layers of covering member S. By forming the covering member S in multiple layers, for example, the height, depth, or width of the recess C1 provided in the light-reflecting member 13 can be set to a desired size.

[0066] A preferred configuration for the covering member S is one in which the height of the covering member S is lower than the height of the light-emitting part 11. By making the height of the covering member S lower than the height of the light-emitting part 11, the recess C1 of the light-reflecting member 13 can be made to not reach the upper surface of the light-reflecting member 13. This makes it possible to suppress the resin material that will become the first resin member R1 (described later) from reaching the light-emitting surface P of the light source 10 when it is placed in the recess C1. The height of the covering member S may be higher than the height of the light-emitting part 11. In this case, for example, as shown in Figures 2B and 2C, a recess C1 can be formed that penetrates from the upper surface to the lower surface of the light-reflecting member 13.

[0067] In a more preferable configuration using the covering member S, the covering member S continuously covers all the first wire connection portions WT1 arranged in a single row. In the manufacturing method according to this embodiment, as shown in Figure 7B, the covering member S is arranged on the first side surface 121 and the second side surface 122 of the support substrate 12, respectively. The covering member S arranged on the first side surface 121 and the second side surface 122 each continuously covers all the first wire connection portions WT1 so as to reach both the third side surface 123 and the fourth side surface 124 in a top view. The width of the covering member S in the direction from the first side surface 121 to the second side surface 122 is preferably, for example, 1 / 15 to 1 / 3 times the maximum length of the support substrate 12, and preferably 1 / 10 to 1 / 3 times. The width of the covering member S is preferably, for example, 100 μm to 1000 μm, and preferably 300 μm to 500 μm. By continuously covering all first wire connection sections WT1 arranged in a single row with the covering member S, the time required for the process of placing the covering member S can be reduced compared to the case where the covering member S is placed individually on each first wire connection section WT1. The position and shape of the covering member S can be changed according to the shape of the recess C1 of the light-reflecting member 13. For example, the covering member S may be arranged to cover each first wire connection section WT1 individually.

[0068] Next, as shown in Figure 8A, a light-reflective member 13 is formed to cover the covering member S and the plurality of light-emitting parts 11. The light-reflective member 13 covers the top and side surfaces of each light-emitting part 11, the top surface of the covering member S, and a portion of the first top surface U1 of the support substrate 12. Also, a portion of the light-reflective member 13 is positioned between adjacent light-emitting parts 11. The light-reflective member 13 can be formed, for example, by compression molding using a mold. The light-reflective member 13 is, for example, a resin material containing a light-reflective substance such as a white pigment. In the configuration shown in Figure 8A, the light-reflective member 13 covers the entire surface of the covering member S. Alternatively, as shown in Figure 8B, the light-reflective member 13 may cover the upper part of the covering member S, while leaving the sides of the covering member S exposed from the light-reflective member 13. Furthermore, when forming the recess C1 shown in Figure 2B, the light-reflective member 13 is provided so that the top surface of the covering member S is exposed from the light-reflective member 13. This makes it possible to form a recess C1 that penetrates from the upper surface to the lower surface of the light-reflective member 13. Furthermore, when forming the recess C1 shown in Figure 2C, the light-reflective member 13 is provided such that a portion of the upper surface and side surface of the covering member S is exposed from the light-reflective member 13. This makes it possible to form a recess C1 that penetrates from the upper surface to the lower surface of the light-reflective member 13 and reaches the side surface of the light-reflective member 13.

[0069] Next, as shown in Figures 9A and 9B, a portion of the surface of the light-reflective member 13 is removed from the top side to expose the light-emitting surfaces of each light-emitting part 11 from the light-reflective member 13. The step of removing the light-reflective member 13 is performed, for example, using a grinding device. In the step of removing the light-reflective member 13, if the translucent member 14 includes a wavelength conversion layer 14a and a light diffusion layer 14b, it is preferable to remove a portion of the light diffusion layer 14b of the translucent member 14, but not the wavelength conversion layer 14a. By removing the light-reflective member 13 in such a way that a portion of the light diffusion layer 14b is removed, the light-emitting surfaces of each light-emitting part 11 can be exposed from the light-reflective member 13 on the top surface of the light-reflective member 13. On the top surface of the light-reflective member 13, the top surface of the light-reflective member 13 and the top surface of the light diffusion layer 14b are located on the same plane. Furthermore, by not removing the wavelength conversion layer 14a, it is possible to reduce variations in the emission color of the light-emitting device 1 caused by variations in the thickness of the wavelength conversion layer 14a. In the step of removing the light-reflective member 13, it is preferable to remove the light-reflective member 13 without removing the coating member S, as shown in Figures 9A and 9B. In other words, it is preferable that the upper surface of the light-reflective member 13 after grinding is higher in the height direction than the highest part of the coating member S. This makes it possible to create a shape in which the depression C1 formed after removing the coating member S does not reach the upper surface of the light-reflective member 13. In the step of removing the light-reflective member 13, a part of the upper surface of the coating member S may also be removed along with the light-reflective member 13. This makes it possible to form a depression C1 that penetrates from the upper surface to the lower surface of the light-reflective member 13, as shown in Figure 2B, for example.

[0070] Next, as shown in Figures 10A and 10B, the light-reflecting member 13 located above the covering member S and a portion of the covering member S are removed. As a result, the covering member S is exposed from the light-reflecting member 13 in a top view. The step of exposing the covering member S is performed, for example, using a cutting device with a dicing blade. Furthermore, in the step of exposing the covering member S, it is preferable that the removal process is carried out in such a way that a portion of the upper part of the covering member S is removed while separating it from the first wire connection portion WT1. In other words, it is preferable that the removal process is carried out in such a way that a portion of the covering member S remains on the first wire connection portion WT1. This makes it possible to suppress damage to the surface of the first wire connection portion WT1 by the dicing blade or the like. As a result, the possibility of a decrease in the connection strength between the first wire connection portion WT1 and the first wire W1 due to damage to the surface of the first wire connection portion WT1 can be reduced. By performing the step of exposing the covering member S, the outer surface of the light-reflecting member 13 forms a coplanar plane with a portion of the covering member S.

[0071] Next, as shown in Figures 11A and 11B, the covering member S is removed. The step of removing the covering member S includes, for example, dissolving the covering member S in an aqueous solution (water, for example) and removing it. For example, the structure manufactured through the steps up to this point is immersed in a container containing an aqueous solution for 5 minutes to 3 hours, preferably 10 minutes to 1 hour. At this time, a step of vibrating the container may be further performed. This makes it easier to remove the covering member S. By removing the covering member S, the space where the covering member S was removed becomes a depression C1. The light-reflective member 13 in which the depression C1 is formed has an upper surface, a lower surface located on the opposite side of the upper surface, an outer surface connecting the upper surface and the lower surface, and a depression C1 provided on a part of the lower side of the outer surface. The depression C1 has an opening provided continuously on the lower surface and outer surface of the light-reflective member 13. Also, in a top view, one or more first wire connection parts WT1 are exposed from the light-reflective member 13.

[0072] The process of preparing the light source may be carried out by the manufacturing method described above, or it may be carried out by acquisition, including purchase.

[0073] [Preparation of the control unit] Next, the control unit 20 is prepared. The step of preparing the control unit may be performed before, after, or simultaneously with the step of preparing the light source. As shown in Figure 12, the control unit 20 has a second upper surface U2, and on the second upper surface U2, it comprises a first region A1 on which the light source 10 can be placed, and one or more second wire connection parts WT2 placed in the second region A2 other than the first region A1. The multiple second wire connection parts WT2 are arranged in a row on the second region A2, flanking the first region A1. In the manufacturing method of this embodiment, no wiring is formed in the first region A1. The step of preparing the control unit may be performed by manufacturing the control unit 20, or by acquisition including purchase.

[0074] [Steps to position light sources] Next, as shown in Figure 13, the light source 10 is placed on the control unit 20. The light source 10 is placed on the first region A1 on the second upper surface U2 of the control unit 20. The light source 10 is joined to the first region A1 of the control unit 20, for example, via a bonding member such as silver paste. Note that in this state, the light source 10 and the control unit 20 are not yet electrically connected.

[0075] [Process of electrically connecting with the first wire] Next, the light source 10 and the control unit 20 are electrically connected by the first wire W1. Specifically, as shown in Figure 14, the first wire connection part WT1 on the support substrate 12 and the second wire connection part WT2 on the control unit 20 are connected by the first wire W1. This allows current from the control unit 20 to be supplied to the light source 10 by the first wire W1. The process of connecting with the first wire may involve connecting one end of the first wire W1 to the first wire connection part WT1, and then connecting the other end of the first wire W1 to the second wire connection part WT2. Note that the process of electrically connecting with the first wire may be performed after the process of placing the light-emitting device 1 on the mounting substrate, which will be described later.

[0076] [Step of placing the first resin component] The manufacturing method of this embodiment may further include a step of arranging the first resin member. In the step of arranging the first resin member, a first resin member R1 is arranged which fits into the recess C1 of the light-reflective member 13 and covers the first wire connection portion WT1. As shown in Figure 15, the step of arranging the first resin member includes a step of discharging and arranging the uncured first resin material R11 constituting the first resin member R1 from above the first wire connection portion WT1. The first resin material R11 covers the first wire connection portion WT1 and flows into the recess C1, with a portion of the first resin material R11 being arranged in the recess C1. Because the light-reflective member 13 has a recess C1, the uncured first resin material R11 is more likely to remain in the recess C1, and it is possible to suppress the first resin material R11 from crawling up to the upper surface of the light-reflective member 13. This makes it possible to suppress the first resin member R1 after curing or solidification from unintentionally affecting the orientation of the light source 10. The uncured first resin material R11 constituting the first resin member R1 is, for example, discharged from the nozzle DP of a dispensing device (e.g., a dispenser) that dispenses the resin material.

[0077] It is preferable that the first resin member R1 is positioned to cover the first wire W1. By covering the first wire W1, the first resin member R1 protects the first wire W1 when, for example, an external force is applied to the light-emitting device 1, thereby suppressing deformation of the first wire W1. Furthermore, because the first resin member R1 is light-reflecting, it reflects a portion of the light emitted from the light source 10 toward the first wire W1, making it easier to extract upwards. In addition, by covering the first wire W1 with the first resin member R1, the first wire W1 becomes less visible when the light-emitting device 1 is viewed from above, thereby improving the aesthetic appearance of the light-emitting device 1. The first wire W1 may be covered by both the first resin member R1 and the second resin member R2, which will be described later.

[0078] It is preferable that the first resin member R1 covers all of the first wire connection portions WT1 arranged in a row. In other words, it is preferable that the nozzle DP of the dispensing device continuously dispensing the first resin material R11 while moving along the direction of arrangement of the first wire connection portions WT1 arranged in a row. This allows all of the first wire connection portions WT1 to be covered with the first resin material R11 at once. The first resin material R11 may also be provided on the first wire connection portions WT1 by moving the workpiece inside the dispensing device where the light-emitting device is located, with the nozzle DP of the dispensing device fixed. The same applies to the second resin material R21 and the third resin material R31, which will be described later.

[0079] [Step of placing the second resin component] The manufacturing method of this embodiment may further include a step of arranging a second resin member. In the step of arranging the second resin member, a second resin member R2 that covers the second wire connection portion WT2 on the control unit 20 is arranged. Note that the step of arranging the second resin member may be performed after or before the step of arranging the first resin member. As shown in Figure 15, the step of arranging the second resin member includes a step of discharging and arranging the uncured second resin material R21 constituting the second resin member R2 from above the second wire connection portion WT2. It is preferable that the second resin member R2 covers the first wire W1 together with the first resin member R1. This effectively protects the first wire W1 from external forces.

[0080] It is preferable that the second resin member R2 covers all of the second wire connection parts WT2 arranged in a row. In other words, it is preferable that the nozzle DP of the discharge device continuously discharges the second resin material R21 while moving along the direction in which the second wire connection parts WT2 are arranged in a row. This allows all of the second wire connection parts WT2 to be covered with the second resin material R21 at once.

[0081] The uncured first resin material R11 constituting the first resin member R1 and the uncured second resin material R21 constituting the second resin member R2 may be cured or solidified simultaneously in a heating process or the like, or they may be cured or solidified individually. It is preferable that the two uncured resin materials be cured or solidified simultaneously. This reduces the time required for the curing or solidification process compared to when the curing or solidification process is performed individually.

[0082] As a suitable discharge rate for the resin material, the discharge rates for the second resin material R21 and the first resin material R11 should be increased in that order. By making the discharge rate of the first resin material R11 less than that of the second resin material R21, it becomes easier to reduce the amount of the first resin material R11 that creeps up onto the light-emitting surface P of the light source 10. In addition, by reducing the amount of resin material covering the first wire connection part WT1 that is close to the multiple light-emitting parts 11, it becomes easier to reduce the thermal shock exerted by the multiple light-emitting parts 11 on the vicinity of the first wire connection part WT1. Note that the steps of arranging the first resin member R1 and arranging the second resin member may be performed after the step of arranging the light-emitting device 1 on the mounting substrate, which will be described later.

[0083] By following the above steps, the light-emitting device of this disclosure can be manufactured.

[0084] <Manufacturing method for light-emitting modules> Next, a method for manufacturing a light-emitting module according to one embodiment of the present disclosure will be described. The method for manufacturing a light-emitting module according to one embodiment of the present disclosure includes the steps of: preparing a mounting substrate; placing the light-emitting device obtained by the above-described method for manufacturing a light-emitting device on the third upper surface of the mounting substrate; and connecting the second wire connection portion on the control unit and the third wire connection portion on the mounting substrate with a second wire. Each step will be described with reference to Figures 16 and 17.

[0085] [Process for preparing the mounting board] First, a mounting substrate 30 is prepared. The mounting substrate 30 has a third upper surface U3, and one or more third wire connection portions WT3 are provided on the third upper surface U3. The mounting substrate 30 also has a region on the third upper surface U3 in which the light-emitting device 1 is placed and a region outside the region in which the light-emitting device 1 is placed. One or more third wire connection portions WT3 are placed in the region outside the region in which the light-emitting device 1 is placed. The third wire connection portions WT3 are arranged in a row on either side of the region in which the light-emitting device 1 is placed. The light-emitting device obtained by the manufacturing method of the light-emitting device described above is placed on the mounting substrate 30.

[0086] [Steps to install the light-emitting device] Next, the light-emitting device 1 is placed on the mounting substrate 30. Specifically, the light-emitting device 1 is placed on the third upper surface U3 of the mounting substrate 30 via a bonding material such as silver paste. At this stage, the light-emitting device 1 and the mounting substrate 30 are not yet electrically connected.

[0087] [Second wire connection process] Next, the light-emitting device 1 and the mounting substrate 30 are electrically connected by the second wire W2. Specifically, as shown in Figure 16, the second wire connection part WT2 on the control unit 20 and the third wire connection part WT3 on the mounting substrate 30 are electrically connected by the second wire W2. This allows current from the mounting substrate 30 to be supplied to the control unit 20 by the second wire W2. In the second wire connection step, one end of the second wire W2 may be connected to the second wire connection part WT2, and then the other end of the second wire W2 may be connected to the third wire connection part WT3. Alternatively, the first wire connection step may be performed immediately before the second wire connection step, and the first and second wire connection steps may be performed consecutively. This allows, for example, two wire connection steps to be performed consecutively within the same wire bonding apparatus. As a result, the time required for the wire connection steps can be reduced. Also, the first wire W1 and the second wire W2 may be a single continuous wire. In this case, for example, wire bonding may be performed on the first wire connection WT1, the second wire connection WT2, and the third wire connection WT3 in this order, and the first wire connection WT1, the second wire connection WT2, and the third wire connection WT3 may be connected with a single wire. Similarly, wire bonding may be performed on the third wire connection WT3, the second wire connection WT2, and the first wire connection WT1 in this order, and the first wire connection WT1, the second wire connection WT2, and the third wire connection WT3 may be connected with a single wire.

[0088] [Step of placing the third resin component] The manufacturing method of this embodiment may further include a step of arranging a third resin member. In the step of arranging the third resin member, a third resin member R3 that covers the third wire connection portion WT3 is arranged. As shown in Figure 17, the step of arranging the third resin member includes a step of discharging and arranging the uncured third resin material R31 constituting the third resin member R3 from above the third wire connection portion WT3. The uncured third resin material R31 may be provided using a discharging device (e.g., a dispenser) that dispenses resin material, similar to the first resin material R11 and the second resin material R21. It is preferable that the third resin member R3 is arranged to cover the second wire W2. By covering the second wire W2 with the third resin member R3, for example, when an external force is applied to the light-emitting module 2, the third resin member R3 plays a role in protecting the second wire W2, and can suppress deformation of the second wire W2. The second wire W2 may be covered with both the second resin member R2 and the third resin member R3.

[0089] The steps of arranging the first resin member and arranging the second resin member may be performed during the process of preparing the light-emitting device, or they may be performed consecutively with the step of arranging the third resin member. It is preferable that the steps of arranging the first resin member, arranging the second resin member, and arranging the third resin member be performed consecutively. This allows, for example, the process of arranging three resin members to be performed consecutively within the same dispensing device. As a result, the time required for the resin member arranging process can be reduced.

[0090] As a suitable discharge volume for the resin material, the discharge volume may be increased in the order of third resin material R31, second resin material R21, and first resin material R11.

[0091] <Second method for manufacturing a light-emitting device> Next, a second method for manufacturing a light-emitting device according to one embodiment of the present disclosure will be described with reference to Figures 18 to 22. The second method differs from the first method described above in the step of preparing the light source. Specifically, the second method differs from the first method in the step of forming the light-reflective member. Therefore, in the following description, the steps that differ from the first method (the step of preparing the light source) will be described in detail, and the common steps (the step of arranging the light source and the step of coating with resin material) will be omitted as appropriate.

[0092] [Preparing the light source] First, as shown in Figure 6A, a support substrate 12 and a plurality of light-emitting units 11 arranged on the first upper surface U1 of the support substrate 12 are prepared in the same manner as in the first manufacturing method.

[0093] Next, a light-reflective member covering the plurality of light-emitting parts 11 is formed on the first upper surface U1 of the support substrate 12. In the second manufacturing method, the step of forming the light-reflective member includes the steps of immersing the plurality of light-emitting parts 11 in the uncured light-reflective material 131 with the surface of the support substrate 12 on which the plurality of light-emitting parts 11 are arranged facing the uncured light-reflective material 131, and curing or solidifying the uncured light-reflective material 131 to form a recess C1 on the outer circumference of the resulting light-reflective member 13.

[0094] First, as shown in Figure 18, the multiple light-emitting parts 11 are immersed in the uncured light-reflective material 131 with the surface of the support substrate 12 on which the multiple light-emitting parts 11 are arranged (first upper surface U1) facing the uncured light-reflective material 131. The immersion process is carried out so that the light-reflective material 131 is separated from the first upper surface U1 of the support substrate 12. By immersing in this manner, the amount of coverage of the first wire connection part WT1 on the support substrate 12 by the light-reflective material 131 is reduced. As a result, the first wire W1 can be easily connected to the first wire connection part WT1. Furthermore, because the immersion process is carried out so that the light-reflective material 131 is separated from the first upper surface U1 of the support substrate 12, as shown in Figure 19, when the support substrate 12 is lifted upward, a recess is formed at the end of the light-reflective material 131 such that the thickness of the light-reflective material 131 becomes thinner toward the outer surface of the light-reflective material 131. In this embodiment, the shortest distance between the end of the light-reflective material 131 and the first wire connection portion WT1 in a direction perpendicular to the upper surface of the support substrate 12 is greater than the shortest distance between the light-reflective material 131 located between the light-emitting portions 11 and the support substrate 12. In the manufacturing method of this embodiment, recesses are also formed in the light-reflective material 131 located between adjacent light-emitting portions 11. Subsequently, the light-reflective material 131 is hardened or solidified by a heating process or the like. As a result, a light-reflective member 13 that covers the multiple light-emitting portions 11 is formed, as shown in Figure 20.

[0095] Next, as shown in Figure 21, a portion of the surface of the light-reflective member 13 is removed from the top side to expose the light-emitting surfaces of each light-emitting part 11 from the light-reflective member 13. The step of removing the light-reflective member 13 is performed, for example, using a grinding device. In the step of removing the light-reflective member 13, it is preferable to remove a portion of the light-diffusing layer 14b of the translucent member 14, similar to the first manufacturing method, but not remove the wavelength conversion layer 14a.

[0096] Next, as shown in Figure 22, a portion of the light-reflective member 13 located on the first wire connection portion WT1 is removed. This step of removing a portion of the light-reflective member is performed, for example, using a cutting device with a dicing blade. By removing a portion of the light-reflective member 13 located on the first wire connection portion WT1, the wire bonding process with the first wire W1 can be facilitated. A recess C1 is formed on the outer surface of the light-reflective member 13. The light-reflective member 13 and the first wire connection portion WT1 are separated by the recess C1. Because the light-reflective member 13 is separated from the first wire connection portion WT1 without covering it, the first wire W1 can be easily connected to the first wire connection portion WT1.

[0097] Subsequently, the light-emitting device of this disclosure can be manufactured by going through the [step of arranging the light source] and the [step of coating with a resin member] described in the first manufacturing method. Furthermore, the light-emitting module of this disclosure can be manufactured by going through the steps of preparing the above-described mounting substrate, arranging the light-emitting device obtained by the light-emitting device manufacturing method on the mounting substrate, and connecting the control unit and the mounting substrate with a second wire.

[0098] The embodiments disclosed herein are illustrative in all respects and do not constitute a limiting interpretation. Therefore, the technical scope of this disclosure is not construed solely by the embodiments described above, but is defined based on the claims. Furthermore, the technical scope of this disclosure includes all modifications within the meaning and scope of equivalence to the claims.

[0099] This disclosure includes the following embodiments. [Section 1] The process of preparing a light source, Multiple light-emitting parts, A support substrate having a first upper surface, the first upper surface comprising a plurality of first terminal portions including a plurality of terminals electrically connected in pairs to each of the plurality of light-emitting portions, and one or more first wire connection portions, A light-reflecting member that covers the plurality of light-emitting parts and has recesses that expose the one or more first wire connection parts on the support substrate, A step of preparing a light source equipped with, A step of preparing a control unit having a second upper surface, the second upper surface comprising a first region on which the light source can be arranged, and one or more second wire connection parts arranged in the second region other than the first region, The steps include: arranging the light source in the first region of the control unit; A method for manufacturing a light-emitting device, comprising the step of connecting the first wire connection part and the second wire connection part with a first wire. [Section 2] The step of preparing the aforementioned light source is: The steps include arranging the plurality of light-emitting units on the first upper surface of the support substrate, The process includes forming a light-reflective member on the first upper surface of the support substrate that covers the plurality of light-emitting parts, The step of forming the light-reflective member is as follows: A step of arranging a covering member that covers the one or more first wire connection portions, A step of covering the covering member and the plurality of light-emitting parts with the light-reflective member, A method for manufacturing a light-emitting device according to item 1, comprising the steps of removing the covering member and forming the depression in the area where the covering member was located. [Section 3] In the step of arranging the covering member, the height of the covering member is lower than the height of the light-emitting part, the method for manufacturing a light-emitting device according to [Item 1] or [Item 2]. [Section 4] Multiple first wire connection portions are provided, and the multiple first wire connection portions are arranged in rows opposite each other in a top view, with the multiple first terminal portions in between. A method for manufacturing a light-emitting device according to any one of items [1] to [3], wherein in the step of arranging the covering member, the covering member continuously covers all of the first wire connection portions arranged in a row. [Section 5] In the step of arranging the covering member, the covering member is a water-soluble member, The method for manufacturing a light-emitting device according to any one of [Item 2] to [Item 5], wherein the step of forming the depression includes a step of dissolving and removing the water-soluble member with water. [Section 6] The step of preparing the aforementioned light source is: The steps include arranging the plurality of light-emitting units on the first upper surface of the support substrate, The process includes forming a light-reflective member on the first upper surface of the support substrate that covers the plurality of light-emitting parts, The step of forming the light-reflective member is as follows: The process of preparing an uncured light-reflective material, The process involves immersing the plurality of light-emitting parts in the uncured light-reflective material with the surface of the support substrate on which the plurality of light-emitting parts are arranged facing the uncured light-reflective material, A method for manufacturing a light-emitting device according to item 1, comprising the step of curing or solidifying the uncured light-reflective material to form the recess on the outer periphery of the obtained light-reflective member. [Section 7] In the process of preparing the light source, the light-reflecting member has an upper surface, a lower surface located on the opposite side of the upper surface, and an outer surface connecting the upper surface and the lower surface. The method for manufacturing a light-emitting device according to any one of items [1] to [6], wherein the recess in the light-reflective member has an opening provided continuously on the lower surface and the outer surface. [Section 8] A method for manufacturing a light-emitting device according to any one of items [1] to [6], further comprising the step of placing a first resin member that fits into the recess and covers the first wire connection portion after the step of connecting with the first wire. [Section 9] A method for manufacturing a light-emitting device according to any one of [Clause 1] to [Clause 8], further comprising the step of arranging a second resin member that covers the second wire connection portion. [Section 10] A step of preparing a mounting substrate having a third upper surface and having one or more third wire connection portions on the third upper surface, A step of placing the light-emitting device obtained by the method for manufacturing a light-emitting device described in any one of items [1] to [9] on the third upper surface of the mounting substrate, A method for manufacturing a light-emitting module, comprising the step of connecting the second wire connection portion of the control unit and the third wire connection portion of the mounting substrate with a second wire. [Section 11] The method for manufacturing a light-emitting module according to item 10, further comprising the step of arranging a third resin member that covers the third wire connection portion. [Section 12] A light source, Multiple light-emitting parts, A support substrate having a first upper surface, the first upper surface comprising a plurality of first terminal portions including a plurality of terminals electrically connected in pairs to each of the plurality of light-emitting portions, and one or more first wire connection portions, A light-reflecting member that covers the plurality of light-emitting parts and has recesses that expose the one or more first wire connection parts on the support substrate, A light source equipped with, A control unit having a second upper surface, the second upper surface having a first region on which the light source can be placed, and one or more second wire connection parts located in the second region other than the first region, and the control unit having the light source placed on the first region, A first wire connecting the first wire connection and the second wire connection, A light-emitting device comprising a first resin member that fits into the recess and covers the first wire connection portion. [Section 13] The light-emitting device according to [Claim 12], wherein the first resin member does not reach the light-emitting surface of the light source. [Section 14] Multiple first wire connection sections are provided, and in a top view, the multiple first wire connection sections are arranged in rows opposite each other, with the multiple first terminal sections in between. The light-emitting device according to [Clause 12] or [Clause 13], wherein the first resin member continuously covers all of the first wire connection portions arranged in a row. [Section 15] The light-emitting device according to any one of items

[12] to

[14] , further comprising a second resin member covering the second wire connection portion. [Section 16] The light-reflecting member has an upper surface, a lower surface located opposite to the upper surface, and an outer surface connecting the upper surface and the lower surface. The light-emitting device according to any one of items

[12] to

[14] , wherein the recess in the light-reflective member has an opening provided continuously on the lower surface and the outer surface. [Section 17] A light-emitting device as described in any one of paragraphs

[12] to

[14] , A mounting substrate having a third upper surface, on which the light-emitting device is arranged, and comprising one or more third wire connection portions arranged in a region of the third upper surface other than the region on which the light-emitting device is arranged, A light-emitting module comprising a second wire connecting the second wire connection portion of the control unit and the third wire connection portion of the mounting substrate. [Section 18] The light-emitting module according to [Claim 17] further comprises a third resin member covering the third wire connection portion. [Explanation of symbols]

[0100] 1. Light-emitting device 2 Light-emitting modules 10 light source 11 Light-emitting part 11a Light-emitting element 12 Support substrate 121 First aspect 122 Second aspect 123 Third aspect 124 Fourth aspect 13 Light-reflective material 13U top 13B Bottom side 13S outer surface 131 Light reflective materials 14 Translucent material 14a Wavelength conversion layer 14b Light Diffusion Layer 20 Control Unit 30 Implemented circuit boards 60 lenses 61 First Lens 62 Second Lens A1 1st area A2 2nd area C opening C1 depression DP dispensing device nozzle E-electrode G Semiconductor Structure P Light-emitting surface R1 First resin component R2 Second resin component R3 Third resin component R11 1st resin material R21 2nd resin material R31 Third resin material S Covering member T1 1st terminal section U1 1st top surface U2 2nd top surface U3 3rd top surface W1 First wire W2 Second wire WT1 First Wire Connection WT2 Second Wire Connection WT3 Third Wire Connection

Claims

1. The process of preparing a light source, Multiple light-emitting parts, A support substrate having a first upper surface, the first upper surface comprising a plurality of first terminal portions including a plurality of terminals electrically connected in pairs to each of the plurality of light-emitting portions, and one or more first wire connection portions, A light-reflecting member that covers the plurality of light-emitting parts and has recesses that expose the one or more first wire connection parts on the support substrate, A step of preparing a light source equipped with, A step of preparing a control unit having a second upper surface, the second upper surface comprising a first region on which the light source can be arranged, and one or more second wire connection portions arranged in the second region other than the first region, The steps include: arranging the light source in the first region of the control unit; A method for manufacturing a light-emitting device, comprising the step of connecting the first wire connection part and the second wire connection part with a first wire, The step of preparing the aforementioned light source is: The steps include arranging the plurality of light-emitting units on the first upper surface of the support substrate, The process includes forming a light-reflective member on the first upper surface of the support substrate to cover the plurality of light-emitting parts, The step of forming the light-reflective member is as follows: A step of arranging a covering member that covers the one or more first wire connection portions, A step of covering the covering member and the plurality of light-emitting parts with the light-reflective member, A method for manufacturing a light-emitting device, comprising the steps of removing the covering member and forming the depression in the area where the covering member was located.

2. The process of preparing a light source, Multiple light-emitting parts, A support substrate having a first upper surface, the first upper surface comprising a plurality of first terminal portions including a plurality of terminals electrically connected in pairs to each of the plurality of light-emitting portions, and one or more first wire connection portions, A light-reflecting member that covers the plurality of light-emitting parts and has recesses that expose the one or more first wire connection parts on the support substrate, A step of preparing a light source equipped with, A step of preparing a control unit having a second upper surface, the second upper surface comprising a first region on which the light source can be arranged, and one or more second wire connection portions arranged in the second region other than the first region, The steps include: arranging the light source in the first region of the control unit; A method for manufacturing a light-emitting device, comprising the step of connecting the first wire connection part and the second wire connection part with a first wire, The step of preparing the aforementioned light source is: The steps include arranging the plurality of light-emitting units on the first upper surface of the support substrate, The process includes forming a light-reflective member on the first upper surface of the support substrate to cover the plurality of light-emitting parts, The step of forming the light-reflective member is as follows: The process of preparing an uncured light-reflective material, The process involves immersing the plurality of light-emitting parts in the uncured light-reflective material with the surface of the support substrate on which the plurality of light-emitting parts are arranged facing the uncured light-reflective material, A method for manufacturing a light-emitting device, comprising the steps of curing or solidifying the uncured light-reflective material to form the recess on the outer periphery of the resulting light-reflective member.

3. The method for manufacturing a light-emitting device according to claim 1, wherein in the step of arranging the covering member, the height of the covering member is lower than the height of the light-emitting part.

4. Multiple first wire connection portions are provided, and in a top view, the multiple first wire connection portions are arranged in rows opposite each other, with the multiple first terminal portions in between. The method for manufacturing a light-emitting device according to claim 1, wherein in the step of arranging the covering member, the covering member continuously covers all of the first wire connection portions arranged in a row.

5. In the step of arranging the covering member, the covering member is a water-soluble member, The method for manufacturing a light-emitting device according to claim 1, wherein the step of forming the depression includes a step of dissolving and removing the water-soluble member with water.

6. In the process of preparing the light source, the light-reflecting member has an upper surface, a lower surface located on the opposite side of the upper surface, and an outer surface connecting the upper surface and the lower surface. The method for manufacturing a light-emitting device according to any one of claims 1 to 5, wherein the recess in the light-reflective member has an opening provided continuously on the lower surface and the outer surface.

7. A method for manufacturing a light-emitting device according to any one of claims 1 to 5, further comprising the step of placing a first resin member that fits into the recess and covers the first wire connection portion after the step of connecting with the first wire.

8. The method for manufacturing a light-emitting device according to claim 7, further comprising the step of arranging a second resin member that covers the second wire connection portion.

9. A step of preparing a mounting substrate having a third upper surface and having one or more third wire connection portions on the third upper surface, A step of placing the light-emitting device obtained by the method for manufacturing a light-emitting device according to any one of claims 1 to 5 on the third upper surface of the mounting substrate, A method for manufacturing a light-emitting module, comprising the step of connecting the second wire connection portion of the control unit and the third wire connection portion of the mounting substrate with a second wire.

10. The method for manufacturing a light-emitting module according to claim 9, further comprising the step of arranging a third resin member that covers the third wire connection portion.

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