Antenna package and image display device containing the same

Abstract

To provide an antenna package having improved radiation properties and spatial efficiency, and an image display device including the same.SOLUTION: An antenna package and an image display device including the same are disclosed. An antenna package according to one aspect includes an antenna device and a circuit board. The circuit board includes a core layer, a feeding line formed on the core layer and bonded to the antenna device, and a CPW ground formed on the core layer to be physically separated from the feeding line and the antenna device.SELECTED DRAWING: Figure 8

Description

Technical Field

[0001] The present invention relates to an antenna package and an image display device including the same.

Background Art

[0002] In recent years, with the progress of the information society, wireless communication technologies such as Wi-Fi and Bluetooth (registered trademark) have been combined with image display devices and realized in the form of, for example, smartphones. In this case, an antenna is coupled to the image display device and can execute a communication function.

[0003] Recently, with the evolution of mobile communication technologies, for example, an antenna for performing communication in a high-frequency or ultra-high-frequency band needs to be coupled to an image display device.

[0004] For example, as various functional elements are mounted on an image display device, it is necessary to expand the frequency coverage of the antenna capable of transmission and reception. Further, when the antenna has a plurality of polarization directions, the radiation efficiency increases and the antenna coverage can be further increased.

[0005] However, when the driving frequency of the antenna increases, signal loss may increase, and the antenna gain may also decrease as the length of the transmission path increases. Further, as described above, when the radiation coverage of the antenna increases, the radiation density or the antenna gain decreases, and the radiation efficiency / reliability may decrease.

[0006] Furthermore, it is not easy to design an antenna that has multiple polarization and broadband characteristics and provides a high antenna gain within the limited space of an image display device.

Summary of the Invention

Problems to be Solved by the Invention

[0007] An object of the present invention is to provide an antenna package having improved radiation characteristics and space efficiency.

[0008] The object of the present invention is to provide an image display device that includes an antenna package having improved radiation characteristics and spatial efficiency. [Means for solving the problem]

[0009] 1. An antenna package comprising an antenna element and a circuit board, wherein the circuit board comprises a core layer, a feed line formed on the core layer and joined to the antenna element, and a CPW (Co-Planar Waveguide) ground formed on the core layer and physically separated from the feed line and the antenna element.

[0010] 2. In item 1 above, the CPW ground has the same distance from the feed line from one end furthest from the antenna element to the other end closest to the antenna element, in this antenna package.

[0011] 3. In item 1 above, the CPW ground moves away from the feed line as it approaches the antenna element in the antenna package.

[0012] 4. In item 3 above, the CPW ground includes a first region having the same distance from the feed line and a second region that moves further away from the feed line as it approaches the antenna element, in an antenna package.

[0013] 5. In item 4 above, the second region is an antenna package that is stepped away from the feed line, chamfered away, or rounded away.

[0014] 6. The antenna package in item 1 above, wherein the antenna element includes a dielectric layer, a radiator disposed on the upper surface of the dielectric layer, a first transmission line and a second transmission line extending in different directions on the upper surface of the dielectric layer and connected to the radiator, an upper parasitic element disposed adjacent to the upper part of the radiator on the upper surface of the dielectric layer, and a lower parasitic element disposed adjacent to the lower part of the radiator and the transmission line on the upper surface of the dielectric layer.

[0015] 7. The antenna package in item 6 above, wherein the feed line includes a first feed line connected to the first transmission line and a second feed line connected to the second transmission line, and the CPW ground includes a central ground located between the first feed line and the second feed line, a first side ground located across the first feed line and facing the central parasitic element, and a second side ground located across the second feed line and facing the central parasitic element.

[0016] 8. In item 6 above, the CPW ground is an antenna package located around the lower parasitic element.

[0017] 9. An antenna package in which, in item 8 above, the separation distance between the CPW ground and the lower parasitic element is 20 μm or more.

[0018] 10. An antenna package in which, according to item 6, the radiator includes convex and concave portions, and the first transmission line and the second transmission line are connected to different concave portions of the concave portion.

[0019] 11. The antenna package relating to item 6 above, wherein the first transmission line includes a first feed portion and a first bent portion extending from the first feed portion and connected to the radiator, and the second transmission line includes a second feed portion and a second bent portion extending from the second feed portion and connected to the radiator.

[0020] 12. In item 6 above, the upper parasitic element comprises a first upper parasitic element and a second upper parasitic element separated from each other, in an antenna package.

[0021] 13. The antenna package in item 12, wherein the radiator includes convex and concave portions, and the first upper parasitic element and the second upper parasitic element are arranged adjacent to each other in different concave portions of the concave portion.

[0022] 14. In item 13 above, the first upper parasitic element and the second upper parasitic element are an antenna package in which the protrusions located on the upper part of the radiator are opposite each other.

[0023] 15. The antenna package in item 6 above, wherein the lower parasitic element includes a central parasitic element disposed between the first transmission line and the second transmission line, a first lateral parasitic element disposed opposite the central parasitic element with the first transmission line in between, and a second lateral parasitic element disposed opposite the central parasitic element with the second transmission line in between.

[0024] 16. The antenna package relating to item 15, wherein the first lateral parasitic element includes a first parasitic body facing the central parasitic element across the first transmission line, a first parasitic extension protruding from the first parasitic body, and a first parasitic bend extending from the first parasitic extension toward the radiator, and the second lateral parasitic element includes a second parasitic body facing the central parasitic element across the second transmission line, a second parasitic extension protruding from the second parasitic body, and a second parasitic bend extending from the second parasitic extension toward the radiator.

[0025] 17. The antenna package in item 16, wherein the radiator has a mesh structure, and the central parasitic element, the first parasitic body, and the second parasitic body have a solid structure.

[0026] 18. In the above item 17, the portion of the first transmission line between the central parasitic element and the first parasitic body has a solid structure, the remaining portion of the first transmission line has a mesh structure, the portion of the second transmission line between the central parasitic element and the second parasitic body has a solid structure, and the remaining portion of the second transmission line has a mesh structure, antenna package.

[0027] 19. In the above item 16, the radiator has a mesh structure, and the central parasitic element, the first parasitic body, and the second parasitic body each include a mesh portion and a solid portion, antenna package.

[0028] 20. In the above item 6, the radiator has a four-leaf clover shape or a cross shape, antenna package.

[0029] 21. An image display device including the antenna package according to item 1 above.

Advantages of the Invention

[0030] According to an exemplary embodiment, the antenna element can include a radiator including a plurality of convex portions and concave portions, and a plurality of transmission lines connected to the radiator in different directions. The combination of the radiator and the transmission lines can provide substantially a plurality of polarization directions and a plurality of frequency band coverages.

[0031] According to an exemplary embodiment, by connecting a circuit board having a CPW or GCPW structure to the antenna element, the antenna gain and directivity can be improved by improving the isolation.

[0032] According to an exemplary embodiment, a triple-band antenna can be realized by applying feeding signals with different phases to the antenna element.

[0033] According to exemplary embodiments, multiple parasitic elements can be arranged around the radiator and transmission line. The multiple parasitic elements facilitate the formation of multiple resonant frequencies, thereby enabling a substantially effective triple-band antenna. [Brief explanation of the drawing]

[0034] [Figure 1] Figure 1 is a schematic cross-sectional view showing an antenna element according to an exemplary embodiment. [Figure 2] Figure 2 is a schematic plan view showing an antenna element according to an exemplary embodiment. [Figure 3] Figure 3 is a schematic plan view showing an antenna element according to an exemplary embodiment. [Figure 4] Figure 4 is a schematic plan view showing an antenna element according to an exemplary embodiment. [Figure 5] Figure 5 is a schematic plan view showing an antenna element according to an exemplary embodiment. [Figure 6] Figure 6 is a schematic plan view showing an antenna element according to an exemplary embodiment. [Figure 7] Figure 7 is a schematic plan view showing an antenna package according to an exemplary embodiment. [Figure 8] Figure 8 is a schematic plan view showing an antenna package according to an exemplary embodiment. [Figure 9] Figure 9 is a schematic plan view showing an antenna package according to an exemplary embodiment. [Figure 10] Figure 10 is a schematic plan view showing an antenna package according to an exemplary embodiment. [Figure 11] Figure 11 is a schematic plan view showing an antenna package according to an exemplary embodiment. [Figure 12] Figure 12 is a schematic cross-sectional view showing a circuit board with a CPW structure according to an exemplary embodiment. [Figure 13] Figure 13 is a schematic cross-sectional view showing a circuit board with a GCPW structure according to an exemplary embodiment. [Figure 14]Figure 14 is a schematic cross-sectional view illustrating an image display device according to an exemplary embodiment. [Figure 15] Figure 15 is a schematic plan view illustrating an image display device according to an exemplary embodiment. [Modes for carrying out the invention]

[0035] Embodiments of the present invention will be described more specifically below with reference to the drawings. However, the drawings accompanying this specification illustrate preferred embodiments of the present invention and, together with the detailed description of the invention, serve to further aid in understanding the technical concept of the present invention. Therefore, the present invention is not to be construed as being limited only to what is shown in the drawings.

[0036] The antenna elements described herein may be microstrip patch antennas fabricated in the form of transparent film. These antenna elements can be applied, for example, to electronic devices for 3G, 4G, 5G, or higher high-frequency or ultra-high-frequency mobile communications.

[0037] Furthermore, embodiments of the present invention provide an image display device including the antenna element. The image display device can be realized in the form of various electronic devices such as smartphones, tablets, laptops, wearable devices, and digital cameras.

[0038] The application of the aforementioned antenna element is not limited to image display devices, but may also be to various objects or structures such as vehicles, home appliances, and buildings.

[0039] In the following diagram, the two directions parallel to the upper surface of the dielectric layer and intersecting each other perpendicularly are defined as the x and y directions, and the direction perpendicular to the upper surface of the dielectric layer is defined as the z direction. For example, the x direction may correspond to the width direction of the antenna element, the y direction to the length direction of the antenna element, and the z direction to the thickness direction of the antenna element.

[0040] Figure 1 is a schematic cross-sectional view showing an antenna element according to an exemplary embodiment.

[0041] Referring to Figure 1, the antenna element 100 according to an exemplary embodiment may include a dielectric layer 105 and an antenna conductive layer 110.

[0042] The dielectric layer 105 may include an insulating material having a predetermined dielectric constant. According to exemplary embodiments, the dielectric layer 105 may include an inorganic insulating material such as glass, silicon oxide, silicon nitride, or metal oxide, or an organic insulating material such as epoxy resin, acrylic resin, or imide resin. The dielectric layer 105 can function as a film substrate for the antenna element 100 on which the antenna conductive layer 110 is formed.

[0043] According to exemplary embodiments, the dielectric layer 105 may contain a transparent resin material. For example, the dielectric layer 105 may contain polyester resins such as polyethylene terephthalate, polyethylene isophthalate, polyethylene naphthalate, and polybutylene terephthalate; cellulosin resins such as diacetylcellulose and triacetylcellulose; polycarbonate resins; acrylic resins such as polymethyl (meth)acrylate and polyethyl (meth)acrylate; styrene resins such as polystyrene and acrylonitrile-styrene copolymers; polyolefin resins such as polyethylene, polypropylene, polyolefins having a cyclo- or norbornene structure, and ethylene-propylene copolymers; vinyl chloride resins; amide resins such as nylon and aromatic polyamides; imide resins; polyethersulfone resins; sulfone resins; polyetheretherketone resins; sulfurized polyphenylene resins; vinyl alcohol resins; vinylidene chloride resins; vinylbutyral resins; arylate resins; polyoxymethylene resins; epoxy resins; urethane or acrylic urethane resins; and silicone resins. These can be used individually or in combination of two or more.

[0044] According to exemplary embodiments, adhesive films such as optically clear adhesive (OCA) and optically clear resin (OCR) may be included in the dielectric layer 105.

[0045] According to exemplary embodiments, the dielectric layer 105 may be formed as a substantially single layer or as a multilayer structure of at least two or more layers.

[0046] The dielectric layer 105 forms capacitance or inductance, which can adjust the frequency band that the antenna element 100 can drive or sense. According to some embodiments, the dielectric constant of the dielectric layer 105 can be adjusted to a range of about 1.5 to 12, preferably about 2 to 12. If the dielectric constant of the dielectric layer 105 exceeds about 12, the driving frequency may drop too low, making it impossible to achieve driving in the desired high-frequency or ultra-high-frequency band.

[0047] According to an exemplary embodiment, the insulating layer (e.g., the enclosure layer, passivation layer, etc. of the display panel) in the image display device on which the antenna element 100 is mounted can also be provided as the dielectric layer 105.

[0048] The antenna conductive layer 110 can be placed on the upper surface of the dielectric layer 105.

[0049] The antenna conductive layer 110 may include low-resistance metals such as silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), palladium (Pd), chromium (Cr), titanium (Ti), tungsten (W), niobium (Nb), tantalum (Ta), vanadium (V), iron (Fe), manganese (Mn), cobalt (Co), nickel (Ni), zinc (Zn), tin (Sn), molybdenum (Mo), and calcium (Ca), or alloys containing at least one of these. These can be used individually or in combination of two or more.

[0050] For example, the antenna conductive layer 110 may include silver (Ag) or a silver alloy (e.g., silver-palladium-copper (APC) alloy), or copper (Cu) or a copper alloy (e.g., copper-calcium (CuCa) alloy), taking into consideration the realization of low resistance or fine linewidth patterning.

[0051] According to exemplary embodiments, the antenna conductive layer 110 may include transparent conductive oxides such as indium tin oxide (ITO), indium zinc oxide (IZO), indium zinc tin oxide (ITZO), and zinc oxide (ZnOx).

[0052] In some embodiments, the antenna conductive layer 110 may include a laminated structure of a transparent conductive oxide layer and a metal layer, for example, a two-layer structure of a transparent conductive oxide layer and a metal layer, or a three-layer structure of a transparent conductive oxide layer, a metal layer, and a transparent conductive oxide layer. In this case, the metal layer can improve flexibility while lowering resistance and improving signal transmission speed, and the transparent conductive oxide layer can improve corrosion resistance and transparency.

[0053] In one embodiment, the antenna conductive layer 110 may also include a metamaterial.

[0054] In some embodiments, the antenna conductive layer 110 may include a blackening treatment section. This reduces the reflectivity on the surface of the antenna conductive layer 110, thereby reducing the visibility of the pattern due to light reflection.

[0055] According to one embodiment, a blackened layer can be formed by converting the surface of the metal layer contained in the antenna conductive layer 110 to a metal oxide or metal sulfide. According to one embodiment, a blackened layer such as a black material coating layer or plating layer can be formed on the antenna conductive layer 110 or the metal layer. Here, the black material or plating layer may include silicon, carbon, copper, molybdenum, tin, chromium, nickel, cobalt, or oxides, sulfides, alloys containing at least one of these.

[0056] The composition and thickness of the blackened layer can be adjusted considering the effect of reducing reflectivity and the radiation characteristics of the antenna.

[0057] According to an exemplary embodiment, the antenna element 100 may further include a ground layer 90. By including the ground layer 90 in the antenna element 100, vertical radiation characteristics can be achieved.

[0058] The ground layer 90 can be placed on the bottom surface of the dielectric layer 105. The ground layer 90 can be superimposed on the antenna conductive layer 110 with the dielectric layer 105 in between. For example, the ground layer 90 can be superimposed on the radiator of the antenna conductive layer 110 (labeled "120" in Figure 2).

[0059] In one embodiment, the conductive member of the image display device or display panel on which the antenna element 100 is mounted can be provided in the ground layer 90. For example, the conductive member may include electrodes or wiring such as gate electrodes, source / drain electrodes, pixel electrodes, common electrodes, data lines, and scan lines of thin-film transistors (TFTs) included in the display panel.

[0060] In some embodiments, a SUS plate, a sensor component such as a digitizer, and a metal component such as a heat dissipation sheet, which are placed on the back of the image display device, can also be provided in the ground layer 90.

[0061] Figure 2 is a schematic plan view showing an antenna element according to an exemplary embodiment.

[0062] Referring to Figure 2, as described in Figure 1, the antenna element 100a according to an exemplary embodiment may include an antenna conductive layer 110 disposed on the dielectric layer 105. The antenna conductive layer 110 may include a radiator 120, transmission lines 130, 135, and parasitic elements 140, 141, 142, 150, 155.

[0063] According to exemplary embodiments, the radiator 120 or the frame of the radiator 120 may include a plurality of protrusions 122 and recesses 124. As shown in Figure 2, the protrusions 122 and recesses 124 may have a curved shape.

[0064] According to an exemplary embodiment, the convex portions 122 and concave portions 124 can be alternately and repeatedly arranged along the outer surface of the radiator 120 in the planar direction. For example, four convex portions 122 and four concave portions 124 can be alternately and repeatedly arranged along the outer surface of the radiator 120.

[0065] As shown in Figure 2, the radiator 120 can have a curved cross shape. For example, the radiator 120 can have a substantially four-leaf clover shape.

[0066] According to an exemplary embodiment, a radiator 120 can be connected to a plurality of transmission lines 130, 135. For example, a first transmission line 130 and a second transmission line 135 can be connected to the radiator 120.

[0067] According to exemplary embodiments, the transmission lines 130 and 135 may contain substantially the same conductive material as the radiator 120. Furthermore, the transmission lines 130 and 135 may be integrally connected to the radiator 120 and formed as substantially a single component, or they may be formed as separate components from the radiator 120.

[0068] The first transmission line 130 and the second transmission line 135 can be arranged symmetrically with respect to each other. For example, the first transmission line 130 and the second transmission line 135 can be arranged symmetrically with respect to the center line of the radiator 120 in the y-direction.

[0069] Each of the transmission lines 130 and 135 may include a feeding portion and a bent portion. For example, the first transmission line 130 may include a first feeding portion 132 and a first bent portion 134, and the second transmission line 135 may include a second feeding portion 131 and a second bent portion 133.

[0070] The first feed section 132 and the second feed section 131 can each be electrically connected to a power supply line included in a circuit board, such as a flexible printed circuit board (FPCB) (see Figure 10). According to some embodiments, the first feed section 132 and the second feed section 131 can be extended in the y direction. The first feed section 132 and the second feed section 131 may be substantially parallel to each other.

[0071] The first bent portion 134 and the second bent portion 133 bend toward the radiator 120 from the first feed portion 132 and the second feed portion 131, respectively, and extend toward the radiator 120 from the ends of the first feed portion 132 and the second feed portion 131, so that they can be directly connected to or in contact with the radiator 120.

[0072] The first bend 134 and the second bend 133 can each extend in different directions and connect to the radiator 122. According to an exemplary embodiment, the angle between the extension directions of the first bend 134 and the second bend 133 may be substantially about 90°.

[0073] For example, the first bend 134 may be inclined at a 45° angle clockwise with respect to the y-direction. The second bend 133 may be inclined at a 45° angle counterclockwise with respect to the y-direction.

[0074] The structure and arrangement of the bent sections 133 and 134 allow power to be supplied to the radiator 120 in two directions substantially perpendicular to each other via the first transmission line 130 and the second transmission line 135. This makes it possible to achieve dual polarization characteristics from a single radiator 120. For example, both vertical and horizontal radiation characteristics can be achieved from the radiator 120.

[0075] According to some embodiments, the bent portions 133 and 134 can be connected to recesses 124 of the radiator 120. As shown in Figure 2, the first bent portion 134 and the second bent portion 133 can be connected to different recesses 124, respectively.

[0076] According to one embodiment, the first bent portion 134 and the second bent portion 133 can be connected to the recess 124 located below the center line extending in the x-direction of the radiator 122, among the four recesses 124. "Lower part" can refer to the portion or region adjacent to the feed portions 131 and 132 in the planar direction, with respect to the center line extending in the x-direction of the radiator 122.

[0077] According to an exemplary embodiment, the antenna element 100a may include parasitic elements 140, 141, 142, 150, 155 that are physically separated from the radiator 120 and the transmission lines 130, 135.

[0078] The parasitic elements may include lower parasitic elements 140, 141, and 142 located adjacent to the transmission lines 130 and 135, and upper parasitic elements 150 and 155 located adjacent to the radiator 120.

[0079] The lower parasitic elements 140, 141, and 142 are located below the center line extending in the x-direction of the radiator 122 and can be arranged around the transmission lines 130 and 135. The lower parasitic elements 140, 141, and 142 may include a central parasitic element 140, a first side parasitic element 142, and a second side parasitic element 141. According to one embodiment, the central parasitic element 140 may be omitted.

[0080] The central parasitic element 140 can be placed between the first transmission line 130 and the second transmission line 135. According to one embodiment, the central parasitic element 140 can be placed between the first feed section 132 and the second feed section 131.

[0081] The first lateral parasitic element 142 and the second lateral parasitic element 141 can be arranged adjacent to each other on both sides of the central parasitic element 140. The first lateral parasitic element 142 may include a first parasitic body 144, a first parasitic extension 146, and a first parasitic bend 148. The second lateral parasitic element 141 may include a second parasitic body 143, a second parasitic extension 145, and a second parasitic bend 147.

[0082] The first parasitic body 144 can face the central parasitic element 140 across the first transmission line 130. The second parasitic body 143 can face the central parasitic element 140 across the second transmission line 135.

[0083] The first parasitic extension 146 and the second parasitic extension 145 can extend outward from the first parasitic body 144 and the second parasitic body 143, respectively. The first parasitic extension 146 and the second parasitic extension 145 can extend in the y direction.

[0084] The first parasitic fold 148 and the second parasitic fold 147 can extend toward the radiator 120 from the ends of the first parasitic extension 146 and the second parasitic extension 145, respectively. In one embodiment, the first parasitic fold 148 and the second parasitic fold 147 may be substantially parallel to the first fold 134 and the second fold 133, respectively.

[0085] The upper parasitic elements 150 and 155 can be positioned above the radiator 120 with respect to its centerline in the x-direction. "Upper" can refer to the part or region that is farther from the feed sections 131 and 132, or opposite to the feed sections 131 and 132, with respect to the centerline extending in the x-direction of the radiator 120 in the planar direction.

[0086] The upper parasitic elements 150 and 155 can be positioned adjacent to the radiator 120. According to an exemplary embodiment, the upper parasitic elements 150 and 155 can be positioned adjacent to a recess 124 included in the upper part of the radiator 120. For example, the upper parasitic elements 150 and 155 can be partially positioned in the recess formed by the recess 124.

[0087] The upper parasitic elements 150, 155 may include a first upper parasitic element 150 and a second upper parasitic element 155. The first upper parasitic element 150 and the second upper parasitic element 155 can be positioned adjacent to each other in different recesses 124 of the radiator 120.

[0088] According to an exemplary embodiment, the first upper parasitic element 150 and the second upper parasitic element 155 can be arranged to face each other with a protrusion 122 included in the upper part of the radiator 120 in between.

[0089] According to one embodiment, the first upper parasitic element 150 and the second upper parasitic element 155 may be substantially circular in shape. However, the shapes of the first upper parasitic element 150 and the second upper parasitic element 155 can be appropriately changed (e.g., elliptical, polygonal) depending on the shape of the radiator 120.

[0090] According to exemplary embodiments, the radiators 120, transmission lines 130, 135, and parasitic elements 140, 141, 142, 150, 155 can all be arranged at the same level or in the same layer on the upper surface of the dielectric layer 105. For example, the radiators 120, transmission lines 130, 135, and parasitic elements 140, 141, 142, 150, 155 can all be patterned and formed from the same conductive layer.

[0091] According to the exemplary embodiment described above, the shape of the radiator 120 is formed to include a convex portion 122 and a concave portion 124, and the first and second transmission lines 130 and 135 can be connected to the different concave portions 124 of the radiator 120 in directions that intersect each other. The dual transmission line structure described above enables the radiator 120 to achieve dual polarization characteristics.

[0092] According to one embodiment, power supply signals having different phases from each other can be applied to the first and second transmission lines 130 and 135, respectively. For example, a first power supply signal and a second power supply signal having a phase difference of about 120° to 200°, preferably about 120° to 180°, and more preferably 180°, can be applied to the first and second transmission lines 130 and 135, respectively.

[0093] The combination of applying a phase difference signal, the structure of a dual transmission line, and the shape of the radiator 120 allows the antenna element 100a to be provided as a broadband antenna with multiple resonant frequency bands.

[0094] The aforementioned parasitic elements 140, 141, 142, 150, and 155 are provided as floating elements not connected to other conductors, and are positioned adjacent to the radiator 120 and transmission lines 130 and 135, thereby facilitating the formation of each band of the multiple resonant frequencies realized by the antenna element 100a.

[0095] The aforementioned parasitic elements 140, 141, 142, 150, and 155 distinguish between different resonant frequency bands, allowing the antenna element 100a to function as a de facto multiband antenna. Furthermore, by arranging the lower parasitic elements 140, 141, and 142 around the transmission lines 130 and 135, and arranging the upper parasitic elements 150 and 155 adjacent to the top of the radiator 120, signal enhancement in the low-frequency and high-frequency bands, as well as the formation of multibands, can be achieved uniformly.

[0096] According to one embodiment, the antenna element 100a can be provided as a triple-band antenna. For example, three resonant frequency peaks in the range of 10-40 GHz or 20-40 GHz can be provided from the antenna element 100a.

[0097] According to one embodiment, a first resonant frequency peak in the range of 20 to 25 GHz, a second resonant frequency peak in the range of 27 to 35 GHz, and a third resonant frequency peak in the range of 35 to 40 GHz can be realized from the antenna element 100a.

[0098] Figures 3 and 4 are schematic plan views showing an antenna element according to an exemplary embodiment. The antenna elements 100b and 100c in Figures 3 and 4 may be embodiments of the antenna element 100 in Figure 1. Detailed descriptions of configurations and structures that are substantially the same or similar as those in Figures 1 and 2 are omitted.

[0099] Referring to Figure 3, the antenna conductive layer 110 may include a mesh structure. According to an exemplary embodiment, the radiator 120 and upper parasitic elements 150, 155 may include a mesh structure as a whole, while the transmission lines 130, 135 and lower parasitic elements 140, 141, 142 may include a mesh structure in part.

[0100] For example, the parasitic bodies 143 and 144 of the central parasitic element 140 and the side parasitic elements 140 and 141 may include a solid structure, and the feed sections 131 and 132 of the transmission lines 130 and 135 may include a mesh structure in part.

[0101] According to one embodiment, the first feed section 132 may include a first mesh section 132a and a first solid section 132b. The second feed section 131 may include a second mesh section 131a and a second solid section 131b.

[0102] The first solid portion 132b can be placed between the central parasitic element 140 having a solid structure and the first parasitic body 144. The second solid portion 131b can be placed between the central parasitic element 140 having a solid structure and the second parasitic body 143.

[0103] The remaining portion of the side parasitic elements 141 and 142, excluding the parasitic bodies 143 and 144, has a mesh structure, and the remaining portion of the transmission lines 130 and 135, excluding the solid portions 131b and 132b, can also have a mesh structure.

[0104] According to one embodiment, the portion of the antenna conductive layer 110 having a mesh structure can be placed in the display area of ​​the image display device. This improves the transmittance of the antenna conductive layer 110 and prevents a decrease in the image quality of the image display device.

[0105] According to one embodiment, a dummy mesh pattern (not shown) can be formed around the portion of the antenna conductive layer 110 that is placed in the display area. In this case, by making the pattern structure uniform, it is possible to prevent the antenna conductive layer 110 from being visible to the user.

[0106] According to one embodiment, the portion of the solid antenna conductive layer 110 can be placed in the light-shielding area or bezel area of ​​an image display device. This makes it possible to improve power supply efficiency using a low-resistance solid metal film and promote the formation of multiband by the lower parasitic elements 140, 141, and 142.

[0107] Referring to Figure 4, the central parasitic element 140 and the parasitic bodies 143,144 may also include a partially mesh structure.

[0108] The central parasitic element 140 may include a mesh element portion 140a and a solid element portion 140b. The first parasitic body 144 may include a first mesh body 144a and a second solid body 144b. The second parasitic body 143 may include a second mesh body 143a and a second solid body 143b.

[0109] The length of the mesh portion can also be extended in the feed portions 131 and 132 of the transmission lines 130 and 135. For example, the first mesh portion 132a can be positioned between the first mesh body 144a and the mesh element portion 140a. The second mesh portion 131a can be positioned between the second mesh body 143a and the mesh element portion 140a.

[0110] For example, when the display area of ​​an image display device is expanded and the bezel area is reduced, the central parasitic element 140 and the parasitic bodies 143 and 144 can also be partially fitted with a mesh structure to improve optical characteristics.

[0111] Figures 5 and 6 are schematic plan views showing an antenna element according to an exemplary embodiment. The antenna elements 100d and 100e in Figures 5 and 6 may be an embodiment of the antenna element 100 in Figure 1. Detailed descriptions of configurations and structures that are substantially the same or similar to those in Figures 1 and 2 are omitted.

[0112] Referring to Figure 5, the radiator 120 can have a cross shape. For example, the radiator 120 may include a first radiation bar 123 and a second radiation bar 125 that extend perpendicularly to each other and intersect each other. For example, the first radiation bar 123 may extend in the y direction and the second radiation bar 125 may extend in the x direction.

[0113] Projections may be defined by the radiation bars 123 and 125, and recesses may be defined by the space between the radiation bars 123 and 125. Upper parasitic elements 150 and 155 can be positioned adjacent to the recesses contained in the upper part of the radiator 120. The upper parasitic elements 150 and 155 may have, for example, a rectangular shape.

[0114] Referring to Figure 6, the end portions of the first radiation bar 123 and the second radiation bar 125 can each have a curved shape.

[0115] As mentioned above, the shape of the radiator 120 can be appropriately modified considering the radiation efficiency and multiband generation efficiency, and is not limited to the shapes of the embodiments shown in Figures 2 to 6.

[0116] Figure 7 is a schematic plan view showing an antenna package according to an exemplary embodiment. Detailed descriptions of configurations and structures that are substantially identical or similar to those in Figures 1 to 6 are omitted.

[0117] Referring to Figure 7, an exemplary antenna package may include an antenna element 100 and a circuit board 200.

[0118] The circuit board 200 may also be a flexible printed circuit board (FPCB).

[0119] The circuit board 200 may include a core layer 210 containing a flexible resin and power supply lines 221 and 222 formed on the core layer 210.

[0120] According to exemplary embodiments, the core layer 210 may include a liquid crystal polymer layer. The core layer 210 may further include a low-dielectric adhesive layer having a dielectric loss tangent (Df) similar to or lower than that of the liquid crystal polymer layer. The low-dielectric adhesive layer may include at least one of an epoxy monomer, an olefin, or a modified polyimide resin.

[0121] The power supply line 220 may include silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), palladium (Pd), chromium (Cr), titanium (Ti), tungsten (W), niobium (Nb), tantalum (Ta), vanadium (V), iron (Fe), manganese (Mn), cobalt (Co), nickel (Ni), zinc (Zn), tin (Sn), molybdenum (Mo), calcium (Ca), or alloys containing at least one of these. These can be used individually or in combination of two or more. Preferably, the power supply lines 221 and 222 may include copper (Cu) or a copper alloy.

[0122] The power supply lines 221 and 222 may include a first power supply line 221 and a second power supply line 222. Each of the first power supply line 221 and the second power supply line 222 can be attached to the first feed section 132 and the second feed section 131 via a conductive intermediary structure such as an anisotropic conductive film (ACF). This allows the first power supply line 221 to be electrically connected to the first feed section 132 and the second power supply line 222 to be electrically connected to the second feed section 131.

[0123] The ends of the first feed section 132 and the second feed section 131, which are connected to the power supply line 220, can be provided by a first antenna port and a second antenna port, respectively. A power supply signal can be applied from the antenna drive IC chip 340 (see Figure 14) via the first and second antenna ports.

[0124] As described above, a multiband antenna can be realized by applying a feed signal having a phase difference (for example, a phase difference of 120° to 180°) to the radiator 120 via the first antenna port and the second antenna port.

[0125] Figures 8 to 11 are schematic plan views showing an antenna package according to an exemplary embodiment. Detailed descriptions of configurations and structures that are substantially identical or similar to those in Figures 1 to 7 are omitted.

[0126] Referring to Figures 8 to 11, the circuit board 200 may further include CPW (Co-Planar Waveguide) grounds 231, 232, and 233 formed on the core layer 210.

[0127] The CPW grounds 231, 232, and 233 are physically isolated from the power supply lines 221, 222 and the lower parasitic elements 140, 141, and 142, and can be positioned around the power supply lines 221, 222 and the lower parasitic elements 140, 141, and 142. The CPW grounds 231, 232, and 233 may include a central ground 233, a first side ground 231, and a second side ground 232.

[0128] The central ground 233 can be positioned between the first power supply line 221 and the second power supply line 222.

[0129] The first side ground 231 and the second side ground 232 can be positioned adjacent to each other on either side of the central ground 233. For example, the first side ground 231 can face the central ground 233 across the first power supply line 221. Similarly, the second side ground 232 can face the central ground 233 across the second power supply line 222.

[0130] According to the exemplary embodiment, in order to prevent coupling between the CPW grounds 231, 232, 233 and the lower parasitic elements 140, 141, 142, the separation distance d in the planar direction between the CPW grounds 231, 232, 233 and the lower parasitic elements 140, 141, 142 may be at least 20 μm.

[0131] For example, as shown in Figure 8, the separation distances between the CPW grounds 231, 232, and 233 and the power supply lines may be substantially the same along the y-direction.

[0132] In some embodiments, as shown in Figures 9 to 11, at least a portion of the CPW grounds 231, 232, 233 can be formed to move away from the feed lines 221, 222 along the y-direction toward the antenna element 100.

[0133] For example, the CPW grounds 231, 232, 233 may include a first region 231a, 232a, 233a that is the same distance away from the feed lines 221, 222, and a second region 231b, 232b, 233b that is away from the feed lines 221, 222 along the y-direction toward the antenna element 100.

[0134] For example, the second regions 231b, 232b, and 233b can be separated from the power supply lines 221 and 222 in a step-like manner (Figure 9), a chamfer-like manner (Figure 10), or a round-like manner (Figure 11).

[0135] The aforementioned design of CPW grounds 231, 232, and 233 can reduce signal loss due to impedance mismatch at high or ultra-high frequencies.

[0136] By placing CPW grounds 231, 232, and 233 around the power supply lines 221 and 222, a CPW (coplanar waveguide) or GCPW (grounded coplanar waveguide) structure can be formed. This improves the degree of isolation between the power supply lines 221 and 222.

[0137] Figure 12 is a schematic cross-sectional view showing a circuit board with a CPW structure according to an exemplary embodiment. Figure 13 is a schematic cross-sectional view showing a circuit board with a GCPW structure according to an exemplary embodiment.

[0138] As shown in Figure 12, a circuit board with a CPW structure can have CPW grounds 231, 232, 233 and power supply lines 221, 222 located on the upper surface of the core layer 210. As shown in Figure 13, a circuit board with a GCPW structure can have an additional ground 230 located on the lower surface of the core layer 210 in the CPW structure. In some embodiments, the CPW grounds 231, 232, 233 located on the upper surface of the core layer 210 can also be electrically connected to the ground 230 located on the lower surface of the core layer 210 via vias.

[0139] Figure 14 is a schematic cross-sectional view illustrating an image display device according to an exemplary embodiment, and Figure 15 is a schematic plan view illustrating an image display device according to an exemplary embodiment.

[0140] Referring to Figures 14 and 15, the image display device 400 can be implemented, for example, in the form of a smartphone, and Figure 15 shows the front or window surface of the image display device 400. The front of the image display device 400 may include a display area 410 and a peripheral area 420. The peripheral area 420 may correspond to, for example, a light-shielding area or bezel of the image display device 400.

[0141] The antenna element 100 included in the antenna package can be positioned facing the front of the image display device 400, for example, on the display panel 405. The radiator 120 can be superimposed on the display area 410.

[0142] In this case, the radiator 120 can include a mesh structure, which can prevent a decrease in transmittance caused by the radiator 120. The lower parasitic elements 140, 141, 142 and feed sections 131, 132 included in the antenna element 100 include a solid structure and can be placed in the peripheral region 420 to prevent a decrease in image quality.

[0143] According to an exemplary embodiment, the circuit board 200 can be bent and positioned on the back of the image display device 400 and extend toward the chip mounting board 300 on which the antenna drive IC chip 340 is mounted.

[0144] The circuit board 200 and the chip mounting board 300 can also be coupled to each other by a connector 320 to form an antenna package together. The connector 320 and the antenna driver IC chip 340 can be electrically connected via a connection circuit 310.

[0145] For example, the chip mounting board 300 may be a rigid printed circuit board (Rigid PCB).

[0146] As shown in Figure 15, the antenna element 100 may include a plurality of antenna units 101, 102, including the aforementioned radiator, transmission line, and parasitic elements. Adjacent antenna units 101, 102 may share side parasitic elements. For ease of illustration, the CPW ground is omitted from Figure 15. The feed line 220 in Figure 15 may include first and second feed lines 221, 222.

Claims

1. Antenna element and The antenna element includes a circuit board bonded to it, The aforementioned circuit board is The core layer, A power supply line formed on the core layer and joined to the antenna element, It includes a CPW (Co-planar waveguide) ground formed on the core layer and physically separated from the power supply line and the antenna element, The aforementioned antenna cable Dielectric layer and, A radiator disposed on the upper surface of the dielectric layer, A transmission line including a first transmission line and a second transmission line extending in different directions on the upper surface of the dielectric layer and connected to the radiator, The dielectric layer includes a lower parasitic element positioned on the upper surface of the radiator adjacent to the lower part of the radiator and the transmission line, The CPW ground is an antenna package located around the lower parasitic element.

2. The antenna package according to claim 1, wherein the separation distance between the CPW ground and the power supply line is constant.

3. The antenna package according to claim 1, wherein at least a portion of the CPW ground moves away from the feed line as it approaches the antenna element.

4. The aforementioned CPW ground is A first region where the distance from the power supply line is constant, The antenna package according to claim 3, further comprising a second region that moves away from the power supply line as it approaches the antenna element.

5. The antenna package according to claim 4, wherein the second region has a stepped or chamfered shape.

6. The aforementioned antenna cable The antenna package according to claim 1, further comprising an upper parasitic element disposed adjacent to the upper part of the radiator on the upper surface of the dielectric layer.

7. The aforementioned power supply line is A first power supply line connected to the first transmission line, It includes a second power supply line connected to the second transmission line, The aforementioned CPW ground is A central ground is positioned between the first power supply line and the second power supply line, A first side ground is positioned opposite the central ground with the first power supply line in between, The antenna package according to claim 6, further comprising a second side ground positioned opposite the central ground with respect to the second power supply line.

8. The antenna package according to claim 6, wherein the separation distance in the planar direction between the CPW ground and the lower parasitic element is 20 μm or more.

9. The radiating body includes convex and concave portions, The antenna package according to claim 6, wherein the first transmission line and the second transmission line are connected to different recesses among the recesses.

10. The first transmission line is, The first feed section and It includes a first bent portion that extends from the first feed portion and is connected to the radiator, The second transmission line is, The second feed section, The antenna package according to claim 6, further comprising a second bent portion extending from the second feed portion and connected to the radiator.

11. The antenna package according to claim 6, wherein the upper parasitic elements include a first upper parasitic element and a second upper parasitic element separated from each other.

12. The radiating body includes convex and concave portions, The antenna package according to claim 11, wherein the first upper parasitic element and the second upper parasitic element are arranged adjacent to different recesses among the recesses.

13. The antenna package according to claim 12, wherein the first upper parasitic element and the second upper parasitic element face each other with respect to a protrusion located on the upper part of the radiating body.

14. The aforementioned lower parasitic site is A central parasitic element disposed between the first transmission line and the second transmission line, A first side parasitic element is positioned opposite the central parasitic element across the first transmission line, The antenna package according to claim 6, further comprising a second lateral parasitic element positioned opposite the central parasitic element across the second transmission line.

15. The first side parasitic element is, A first parasitic body facing the central parasitic element across the first transmission line, A first parasitic extension protruding from the first parasitic body, It includes a first parasitic extension portion extending toward the radiator, The second side parasitic element is, A second parasitic body facing the central parasitic element across the second transmission line, A second parasitic extension protruding from the second parasitic body, The antenna package according to claim 14, further comprising a second parasitic bend extending toward the radiator from the second parasitic extension.

16. The aforementioned radiator has a mesh structure, The antenna package according to claim 15, wherein the central parasitic element, the first parasitic body, and the second parasitic body have a solid structure.

17. The portion of the first transmission line between the central parasitic element and the first parasitic body has a solid structure, and the remaining portion of the first transmission line has a mesh structure. The antenna package according to claim 16, wherein the portion of the second transmission line between the central parasitic element and the second parasitic body has a solid structure, and the remaining portion of the second transmission line has a mesh structure.

18. The aforementioned radiator has a mesh structure, The antenna package according to claim 15, wherein the central parasitic element, the first parasitic body, and the second parasitic body each include a mesh portion and a solid portion.

19. The antenna package according to claim 6, wherein the radiator has a four-leaf clover shape or a cross shape.

20. An image display device comprising the antenna package described in claim 1.

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