Cutting device and method for manufacturing cut products
The cutting device addresses the inefficiency of lighting adjustments in existing devices by using dual inspection mechanisms and transport systems for flexible surface inspection, achieving high productivity and versatility.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- TOWA
- Filing Date
- 2024-02-26
- Publication Date
- 2026-06-29
AI Technical Summary
Existing cutting devices require time-consuming adjustments and replacements of lighting configurations to inspect different surfaces of cut pieces, which reduces productivity.
A cutting device with dual inspection mechanisms and transport mechanisms that allow for efficient inspection of both surfaces of cut pieces without needing to change lighting configurations, enabling high productivity cutting and inspection.
Enables high productivity cutting and inspection by allowing flexible inspection of both surfaces of cut pieces without lighting adjustments, enhancing versatility and efficiency.
Smart Images
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Abstract
Description
Technical Field
[0001] The present disclosure relates to a cutting device and a method for manufacturing cut products.
Background Art
[0002] Japanese Patent Application Laid-Open No. 2023-076250 (Patent Document 1) discloses an invention related to a cutting device. This cutting device cuts a cutting object (package substrate) into a plurality of cut products (electronic components). This cutting device separately includes an inspection mechanism for inspecting the lower surface of the electronic component and an inspection mechanism for inspecting the upper surface of the electronic component. More specifically, a first optical inspection camera is arranged on the upstream side in the transport direction of the electronic component, and a second optical inspection camera is arranged on the downstream side.
[0003] In the case of the above cutting device, the mold surface of the electronic component is inspected by the first optical inspection camera, and then the ball / lead surface of the electronic component is inspected by the second optical inspection camera. The inspection mechanism usually includes illumination suitable for the inspection object. In the case of the above cutting device, as the illumination used together with the first optical inspection camera, illumination suitable for inspecting the mold surface is provided, and as the illumination used together with the second optical inspection camera, illumination suitable for inspecting the ball / lead surface is provided.
Prior Art Documents
Patent Documents
[0004]
Patent Document 1
Summary of the Invention
Problems to be Solved by the Invention
[0005] In recent years, the needs for cutting devices have diversified. For example, it is desirable to be able to efficiently cut a wider variety of objects and to efficiently inspect the cut pieces obtained. For instance, one side of an object to be cut may be a molded surface entirely sealed with resin, while the other side may be a ball / lead surface partially sealed with resin. To obtain multiple cut pieces from such an object, let's consider using the cutting device disclosed in Patent Document 1 (Japanese Patent Application Publication No. 2023-076250).
[0006] In order to properly cut the object to be cut using the above cutting device, the object to be cut is fixed on the processing table with its molded surface facing upwards, and the blade is brought close to the object from the molded surface side to cut it. Subsequently, if the device configuration of Patent Document 1 is used as is, the ball / lead surface of the object to be cut will be inspected by the first optical inspection camera on the upstream side, and the molded surface will be inspected by the second optical inspection camera on the downstream side.
[0007] As the current lighting is unsuitable for the inspection target, in order to perform a proper inspection, the lighting used with the first optical inspection camera must be replaced with lighting suitable for inspecting the ball / lead surface, and the lighting used with the second optical inspection camera must be replaced with lighting suitable for inspecting the mold surface. In addition, adjustments such as alignment and focusing of each inspection mechanism are necessary. Such replacements and adjustments are time-consuming and require effort.
[0008] This disclosure aims to provide a cutting device capable of cutting and inspecting with high productivity, and a method for manufacturing cut products. [Means for solving the problem]
[0009] The cutting device disclosed herein, A processing table that holds the object to be cut, A cutting mechanism that cuts the object to be cut held on the processing table to divide it into multiple cut pieces, A first conveying mechanism that holds and conveys multiple cut pieces, A second conveying mechanism that holds and conveys multiple cut pieces, A first inspection mechanism that inspects the first surface of multiple cut pieces while the multiple cut pieces are positioned at a first inspection location, The system includes a second inspection mechanism that inspects the second surface of multiple cut pieces while the multiple cut pieces are positioned at a second inspection location, The first transport mechanism is configured to transport a plurality of the cut pieces to both the first inspection position and the second inspection position. The second transport mechanism is also configured to transport a plurality of the cut pieces to both the first inspection position and the second inspection position.
[0010] The method for manufacturing a cut product in this disclosure uses the above-mentioned cutting apparatus, A step of dividing the object to be cut, which is held on the processing table, into a plurality of cut pieces, With the first transport mechanism arranging the multiple cut pieces at the second inspection position, the second inspection mechanism inspects the second surface of the multiple cut pieces; A step of transferring a plurality of the cut pieces from the first conveying mechanism to the second conveying mechanism, The process includes the step of inspecting the first surface of the multiple cut pieces using the first inspection mechanism, with the multiple cut pieces positioned at the first inspection position by the second transport mechanism.
[0011] The method for manufacturing a cut product in this disclosure uses the above-mentioned cutting apparatus, A step of dividing the object to be cut, which is held on the processing table, into a plurality of cut pieces, With the first transport mechanism arranging the multiple cut pieces at the first inspection position, the first inspection mechanism inspects the first surface of the multiple cut pieces; A step of transferring a plurality of the cut pieces from the first conveying mechanism to the second conveying mechanism, The process includes the step of arranging a plurality of the cut pieces at a second inspection position using the second transport mechanism, and then inspecting the second surface of the plurality of cut pieces using the second inspection mechanism.
Advantages of the Invention
[0012] According to the present disclosure, a cutting device capable of performing cutting and inspection with high productivity, and a method for manufacturing a cut product can be obtained.
Brief Description of the Drawings
[0013] [Figure 1] It is a plan view schematically showing the cutting device 1. [Figure 2] It is a front view schematically showing a portion between the processing table 5M and the mounting table 14 in the cutting device 1, and shows a state SA1 in which the first transfer mechanism 7 is arranged at the picking-up position T1 and sucks the cut product S1 held on the processing table 5M from above. [Figure 3] It shows a state SA2 in which the cut product S1 is arranged at the first inspection position Q1 by the first transfer mechanism 7. [Figure 4] It shows a state SA3 in which the second transfer mechanism 11 located at the receiving position U1 receives and holds the cut product S1 held by the first transfer mechanism 7 from the first transfer mechanism 7. [Figure 5] It shows a state SA4 in which the cut product S1 is arranged at the second inspection position Q2 by the second transfer mechanism 11. [Figure 6] It shows a state SA5 in which the second transfer mechanism 11 places the cut product S1 on the mounting table 14 at the mounting position U2. [Figure 7] It shows a state SB1 in which the first transfer mechanism 7 is arranged at the picking-up position T1 and sucks the cut product S1 held on the processing table 5M from above. [Figure 8] It shows a state SB2 in which the cut product S1 is arranged at the second inspection position Q2 by the first transfer mechanism 7. [Figure 9] It shows a state SB3 in which the second transfer mechanism 11 located at the receiving position U1 receives and holds the cut product S1 held by the first transfer mechanism 7 from the first transfer mechanism 7. [Figure 10]It shows the state SB4 in which the cut product S1 is placed at the first inspection position Q1 by the second transfer mechanism 11. [Figure 11] It shows the state SB5 in which the second transfer mechanism 11 places the cut product S1 on the placement table 14 at the placement position U2. [Figure 12] It shows the state SC5 in which the first transfer mechanism 7 receives and holds the cut product S1 held by the second transfer mechanism 11 from the second transfer mechanism 11. [Figure 13] It shows the state SC6 in which the first transfer mechanism 7 places the cut product S1 on the placement table 14 at the placement position U2.
Embodiments for Carrying out the Invention
[0014] Hereinafter, embodiments of the present disclosure will be described. In the embodiments described below, when referring to the number, quantity, etc., unless otherwise specified, the scope of the present disclosure is not necessarily limited to such number, quantity, etc. Each component is not necessarily essential for the present disclosure, unless otherwise specified. The same parts and corresponding parts are given the same reference numerals, and repeated descriptions may not be repeated.
[0015] (Cutting device 1) FIG. 1 is a plan view schematically showing the cutting device 1. The cutting device 1 includes a cutting module A1 (FIG. 1) and an inspection / storage module B1. The cutting device 1 includes a monitor 20 and a computer 50, and operates by receiving various input commands. In FIG. 1, the monitor 20 and the computer 50 are provided in the inspection / storage module B1, but may be provided in the cutting module A1. The cutting device 1 cuts a cutting object (package substrate) to individualize the cutting object into a plurality of cut products (package parts). Hereinafter, together with the details of the cutting device 1, a manufacturing method of the cut product S1 using the cutting device 1 will be described.
[0016] [[ID=In the case of package substrates, for example, a substrate or lead frame on which a semiconductor chip is mounted is encapsulated in resin. Examples of package substrates include BGA (Ball Grid Array) package substrates, LGA (Land Grid Array) package substrates, CSP (Chip Size Package) package substrates, LED (Light Emitting Diode) package substrates, and QFN (Quad Flat No-leaded) package substrates.
[0017] The cutting device 1 further inspects each of the multiple individual cut pieces (electronic components). An image of each cut piece is captured, and each cut piece is inspected based on the image. Inspection data is generated through this inspection, and each cut piece is classified as either a "good product" or a "defective product".
[0018] Here, a package substrate is used as the object to be cut P1 (Figure 1), and the cutting device 1 divides the object to be cut P1 into multiple cut pieces S1 (Figure 2). In the following description, of the two sides of the object to be cut P1 or cut pieces S1, the side that is resin-sealed will be referred to as the molded surface F1 (Figure 2), and the side opposite to the molded surface F1 will be referred to as the ball / lead surface F2 (Figure 2).
[0019] [Embodiment 1] (Cutting module A1) The cutting module A1 produces multiple cut pieces S1 (Figure 2) by cutting the object to be cut P1 (Figure 1). The inspection and storage module B1 inspects each of the multiple cut pieces S1 and then stores the cut pieces S1 in a tray. In the cutting device 1, each component is detachable and interchangeable with respect to other components.
[0020] The cutting module A1 includes a substrate supply unit 3, a positioning unit 4, processing tables 5M and 5N, a cutting mechanism 6, and a first transport mechanism 7. The substrate supply unit 3 supplies the objects to be cut P1 one by one to the positioning unit 4 by pushing them out from the magazine M1. The objects to be cut P1 are positioned with the ball / lead surface F2 (Figure 2) facing upwards.
[0021] The positioning unit 4 positions the object to be cut P1, which has been extruded from the substrate supply unit 3, onto the rail unit 4a. The cutting device 1 has a twin-cut table configuration with two processing tables 5M and 5N. The positioning unit 4 transports the object to be cut P1 to the processing tables 5M and 5N, and the processing tables 5M and 5N hold the object to be cut P1.
[0022] Each of the processing tables 5M and 5N includes a holding member 5a, a rotating mechanism 5b, and a moving mechanism 5c. The holding member 5a holds the object to be cut P1, which has been transported by the positioning unit 4, by suction from below. The rotating mechanism 5b rotates the holding member 5a in the direction of θ1 in Figure 1 (i.e., rotates it in the XY plane of Figure 1). The moving mechanism 5c moves the holding member 5a along the Y axis in the figure.
[0023] For example, after the processing table 5M has picked up the object to be cut P1, the object to be cut P1 is imaged by the first position confirmation camera 5d, and the position of the object to be cut P1 is confirmed. Confirmation using the first position confirmation camera 5d is, for example, confirmation of the position of a mark provided on the object to be cut P1. This mark is, for example, a mark used to determine the cutting position of the object to be cut P1.
[0024] Subsequently, the processing table 5M moves along the Y-axis in the diagram toward the cutting mechanism 6. After the processing table 5M moves below the cutting mechanism 6, alignment is performed, and then the object to be cut P1 is cut by moving the processing table 5M and the cutting mechanism 6 relative to each other. The cutting mechanism 6 cuts the object to be cut P1 using the blade 6a, thereby dividing the object to be cut P1 into multiple cut pieces S1.
[0025] Each time the object P1 is cut by the blade 6a of the cutting mechanism 6, the object P1 (cut product S1) is imaged and confirmed by the second position confirmation camera 6b provided in the cutting mechanism 6. Confirmation using the second position confirmation camera 6b is, for example, confirmation of the cut position and the width of the cut object P1.
[0026] After the cutting of the object P1 is complete, the processing table 5M moves away from the cutting mechanism 6 along the Y-axis in the figure, while holding the multiple individual cut pieces S1. During this movement, the first cleaner 5e cleans and dries the top surface (ball / lead surface F2 (Figure 2)) of the cut pieces S1.
[0027] Figure 2 is a schematic front view showing the portion between the processing table 5M and the mounting table 14 in the cutting device 1. The first transport mechanism 7 has a main body 7a and a moving shaft 7b, and while the main body 7a holds the cut product S1, the cut product S1 can be transported along the moving shaft 7b.
[0028] After cleaning and drying by the first cleaner 5e (Figure 1) is completed, as shown in Figure 2, the first transport mechanism 7 is positioned at the pick-up position T1, and the first transport mechanism 7 picks up the cut piece S1 held on the processing table 5M from above. Figure 2 shows SA1, where the first transport mechanism 7 is positioned at the pick-up position T1 and is picking up the cut piece S1 held on the processing table 5M from above. After picking up the cut piece S1 from the processing table 5M, the first transport mechanism 7 transports the cut piece S1 toward the first inspection mechanism 8 and the second inspection mechanism 9 of the inspection and storage module B1.
[0029] As shown in Figure 3, the cut piece S1 is conveyed upward (arrow AR1), then positioned facing the cleaning nozzle 10a and drying nozzle 10b of the second cleaner 10, respectively (arrows AR2, AR3), where the lower surface (molded surface F1) of the cut piece S1 is cleaned and dried. After that, the cut piece S1 is further conveyed by the first conveying mechanism 7 and positioned facing the first inspection mechanism 8 (first inspection position Q1) (arrow AR4). Figure 3 shows SA2, where the cut piece S1 is positioned at the first inspection position Q1 by the first conveying mechanism 7.
[0030] (Inspection and storage module B1) Referring to Figures 1 and 3, the inspection and storage module B1 (Figure 1) includes a first inspection mechanism 8, a second inspection mechanism 9, a second transport mechanism 11, a mounting table 14, and an extraction unit 15. The first inspection mechanism 8 has a first optical inspection camera 12 and a first illumination 16. The first illumination 16 is provided above the first optical inspection camera 12, and the first illumination 16 irradiates light onto the cut product S1 when the first optical inspection camera 12 is performing inspection.
[0031] As shown in Figure 3, with the cut product S1 positioned at the first inspection position Q1 by the first transport mechanism 7, the first optical inspection camera 12 images the molded surface F1 (first surface) of the cut product S1. The first optical inspection camera 12 is positioned near the cut product S1 located at the first inspection position Q1 and is positioned to image the area above it.
[0032] Referring to Figure 4, after imaging by the first optical inspection camera 12, the first transport mechanism 7 moves together with the cut piece S1 (arrow AR5) to a position opposite the second transport mechanism 11, and places the cut piece S1 on the main body 11a of the second transport mechanism 11.
[0033] The second conveying mechanism 11 has a main body 11a and a movable shaft 11b, and can convey the cut piece S1 along the movable shaft 11b while the main body 11a is holding the cut piece S1. The second conveying mechanism 11 shown in Figure 4 is located at the receiving position U1. The second conveying mechanism 11 receives and holds the cut piece S1 held by the first conveying mechanism 7 from the first conveying mechanism 7 while located at the receiving position U1. Figure 4 shows state SA3 in which the second conveying mechanism 11, located at the receiving position U1, receives and holds the cut piece S1 held by the first conveying mechanism 7 from the first conveying mechanism 7.
[0034] As shown in Figure 5, the main body 11a of the second transport mechanism 11 is inverted while holding the cut piece S1. The cut piece S1 is positioned by the second transport mechanism 11 at a position opposite the second inspection mechanism 9 (second inspection position Q2). Figure 5 shows SA4, where the cut piece S1 is positioned at the second inspection position Q2 by the second transport mechanism 11.
[0035] The second inspection mechanism 9 includes a second optical inspection camera 13 and a second illumination 17. The second illumination 17 is provided above the second optical inspection camera 13, and the second illumination 17 irradiates the cut product S1 with light during inspection by the second optical inspection camera 13. With the cut product S1 positioned at the second inspection position Q2 by the second transport mechanism 11, the second optical inspection camera 13 images the ball / lead surface F2 (second surface) of the cut product S1. The second optical inspection camera 13 is positioned to image the area above the cut product S1 located at the second inspection position Q2.
[0036] Referring to Figure 6, after imaging by the second optical inspection camera 13, the second transport mechanism 11 moves together with the cut piece S1 to a position opposite the placement table 14 and places the cut piece S1 on the placement table 14. The second transport mechanism 11 shown in Figure 6 is located at placement position U2. Figure 6 shows state SA5 in which the second transport mechanism 11 has placed the cut piece S1 on the placement table 14 at placement position U2.
[0037] In this embodiment, when a linearly extending reference direction (X direction) is defined, the positions in the reference direction are, from left to right on the page, in the order of pick-up position T1 (Figure 2), first inspection position Q1 (Figure 3), second inspection position Q2 (Figure 5), and placement position U2 (Figure 6).
[0038] Referring again to Figure 1, the inspected cut pieces S1 are placed on the loading table 14. The loading table 14 is movable along the Y-axis in the figure. The extraction unit 15 transfers the cut pieces S1 placed on the loading table 14 to trays. The cut pieces S1 are sorted into "good" or "defective" based on the inspection results using the first optical inspection camera 12 and the second optical inspection camera 13. Based on the sorting results, the extraction unit 15 transfers each cut piece S1 to either the good product tray 15a or the defective product tray 15b.
[0039] [Embodiment 2] In the above-described embodiment 1, when the cutting of the object to be cut P1 is completed, the cut piece S1 is positioned with the ball / lead surface F2 (Figure 2) facing upwards. On the other hand, even if the cut piece S1 is positioned with the mold surface F1 (Figure 2) facing upwards when the cutting of the object to be cut P1 is completed, that is, even if the object to be cut P1 is positioned with the mold surface F1 facing upwards when it is supplied from the magazine M1 (Figure 1) to the positioning unit 4, the cutting device 1 can still perform inspection efficiently.
[0040] As shown in Figure 7, with the first transport mechanism 7 positioned at the pick-up position T1, the first transport mechanism 7 picks up the cut piece S1 held on the processing table 5M from above. Figure 7 shows the state SB1 in which the first transport mechanism 7 is positioned at the pick-up position T1 and picking up the cut piece S1 held on the processing table 5M from above. After picking up the cut piece S1 from the processing table 5M, the first transport mechanism 7 transports the cut piece S1 toward the first inspection mechanism 8 and the second inspection mechanism 9 of the inspection and storage module B1.
[0041] As shown in Figure 8, the cut piece S1 is transported upward (arrow AR1), then positioned facing the washing nozzle 10a and drying nozzle 10b of the second cleaner 10, respectively (arrows AR2, AR3), and the lower surface (ball / lead surface F2) of the cut piece S1 is washed and dried.
[0042] Subsequently, the cut piece S1 is further transported by the first transport mechanism 7 and positioned at a location facing the second inspection mechanism 9 (second inspection position Q2) (arrow AR4). Figure 8 shows the state SB2 in which the cut piece S1 is positioned at the second inspection position Q2 by the first transport mechanism 7. With the cut piece S1 positioned at the second inspection position Q2 by the first transport mechanism 7, the second optical inspection camera 13 images the ball / lead surface F2 (second surface) of the cut piece S1.
[0043] Referring to Figure 9, after imaging by the second optical inspection camera 13, the first transport mechanism 7 moves together with the cut piece S1 (arrow AR5) to a position opposite the second transport mechanism 11, and places the cut piece S1 on the main body 11a of the second transport mechanism 11.
[0044] The second conveying mechanism 11 shown in Figure 9 is located at the receiving position U1. The second conveying mechanism 11 receives and holds the cut piece S1, which is being held by the first conveying mechanism 7, from the first conveying mechanism 7 while it is located at the receiving position U1. Figure 9 shows state SB3, in which the second conveying mechanism 11, located at the receiving position U1, receives and holds the cut piece S1, which is being held by the first conveying mechanism 7, from the first conveying mechanism 7.
[0045] As shown in Figure 10, the main body 11a of the second transport mechanism 11 is inverted while holding the cut piece S1. The cut piece S1 is positioned by the second transport mechanism 11 at a position facing the first inspection mechanism 8 (first inspection position Q1). Figure 10 shows the state SB4 in which the cut piece S1 is positioned at the first inspection position Q1 by the second transport mechanism 11. With the cut piece S1 positioned at the first inspection position Q1 by the second transport mechanism 11, the first optical inspection camera 12 images the molded surface F1 (first surface) of the cut piece S1.
[0046] Referring to Figure 11, after imaging by the first optical inspection camera 12, the second transport mechanism 11 moves together with the cut piece S1 to a position opposite the placement table 14 and places the cut piece S1 on the placement table 14. The second transport mechanism 11 shown in Figure 11 is located at placement position U2. Figure 11 shows the state SB5 in which the second transport mechanism 11 has placed the cut piece S1 on the placement table 14 at placement position U2.
[0047] Subsequently, similar to Embodiment 1, the cut pieces S1 are sorted into "good products" or "defective products" in the extraction unit 15 based on the results of inspection using the first optical inspection camera 12 and the second optical inspection camera 13.
[0048] (Mechanism of Action and Effects) As described in Embodiments 1 and 2 above, in the cutting device 1, the first transport mechanism 7 is configured to transport the cut product S1 to both the first inspection position Q1 (Figure 3) and the second inspection position Q2 (Figure 8), and the second transport mechanism 11 is also configured to transport the cut product S1 to both the first inspection position Q1 (Figure 10) and the second inspection position Q2 (Figure 5).
[0049] Therefore, when the cutting of the object P1 is completed, whether the cut piece S1 is positioned with the ball / lead surface F2 (Figure 2) facing upwards or with the mold surface F1 (Figure 7) facing upwards, inspection can be performed on the first inspection mechanism 8 and the second inspection mechanism 9 without having to change the lighting or make adjustments for inspection (optimization of inspection). Furthermore, a cutting device equipped with two inspection mechanisms can be made highly versatile as a cutting device, as it increases the number of inspection sequences. Thus, the cutting device 1 can be made highly versatile as a cutting device and can perform cutting and inspection with high productivity.
[0050] [Modified version of Embodiment 2] In the above-described embodiment 2, after the inspection by the first inspection mechanism 8, the cut product S1 is placed on the placement table 14 with the molded surface F1 facing downwards. As a variation thereof, as shown in Figure 12, after the inspection by the first inspection mechanism 8, the main body 11a of the second transport mechanism 11 may be inverted upside down while holding the cut product S1.
[0051] The first conveying mechanism 7 receives and holds the cut piece S1, which is being held by the second conveying mechanism 11. Figure 12 shows the state SC5 in which the first conveying mechanism 7 receives and holds the cut piece S1, which is being held by the second conveying mechanism 11.
[0052] The first conveying mechanism 7 moves together with the cut piece S1 and reaches a position opposite the placement table 14, where it places the cut piece S1 on the placement table 14. The first conveying mechanism 7 shown in Figure 13 is located at placement position U2. Figure 13 shows the state SC6 in which the first conveying mechanism 7 has placed the cut piece S1 on the placement table 14 at placement position U2.
[0053] Here, the first transport mechanism 7 is configured to be movable between a pick-up position T1 for picking up and holding multiple cut pieces S1 on the processing table 5M, and a placement position U2 for placing multiple cut pieces S1 on the placement table 14. With this configuration, it is possible to place the cut pieces S1 on the placement table 14 with the ball / lead surface F2 facing downwards.
[0054] [Note] The embodiments of this disclosure have been described above, but the contents of the embodiments of this disclosure can be summarized as shown in the following appendices.
[0055] [Note 1] A processing table that holds the object to be cut, A cutting mechanism that cuts the object to be cut held on the processing table to divide it into multiple cut pieces, A first conveying mechanism that holds and conveys multiple cut pieces, A second conveying mechanism that holds and conveys multiple cut pieces, A first inspection mechanism that inspects the first surface of multiple cut pieces while the multiple cut pieces are positioned at a first inspection location, The system includes a second inspection mechanism that inspects the second surface of multiple cut pieces while the multiple cut pieces are positioned at a second inspection location, The first transport mechanism is configured to transport a plurality of the cut pieces to both the first inspection position and the second inspection position. The second transport mechanism is also configured to transport a plurality of the cut pieces to both the first inspection position and the second inspection position. Cutting device.
[0056] According to the configuration described in Appendix 1 above, each of the first and second transport mechanisms is configured to transport multiple cut pieces to both the first and second inspection positions. Therefore, inspection of the cut pieces can be flexibly started even if, for example, the first surface of the cut piece is facing downwards (for example, the first surface is facing the inspection mechanism) or the second surface of the cut piece is facing downwards. For example, compared to a case where the first transport mechanism is configured to transport multiple cut pieces only to the first inspection position and the second transport mechanism is configured to transport multiple cut pieces only to the second inspection position, the configuration described in Appendix 1 above allows for relatively free setting of the inspection order, such as inspecting the first surface before the second surface or the second surface before the first surface, enabling cutting and inspection to be performed with high productivity.
[0057] [Note 2] The system further comprises a mounting table on which multiple cut pieces can be placed, The second transport mechanism is configured to be movable between a receiving position for receiving and holding a plurality of the cut pieces held by the first transport mechanism from the first transport mechanism, and a placement position for placing the plurality of cut pieces on the placement table described above. The cutting device described in Appendix 1.
[0058] According to the configuration described in Appendix 2 above, the second conveying mechanism receives and holds multiple cut pieces from the first conveying mechanism at the receiving position, and then the second conveying mechanism moves to the placement position and places the multiple cut pieces on the placement table.
[0059] [Note 3] The first transport mechanism is configured to be movable between a picking position for picking up and holding a plurality of the cut pieces on the processing table and a placement position for placing a plurality of the cut pieces on the placement table. The cutting device described in Appendix 2.
[0060] According to the configuration described in Appendix 3 above, for example, the first transport mechanism transports multiple cut pieces to one of the first and second inspection positions and performs inspection on the multiple cut pieces, then the second transport mechanism transports multiple cut pieces to the other of the first and second inspection positions and performs inspection on the multiple cut pieces, and then the first transport mechanism receives and holds the multiple cut pieces from the second transport mechanism, and then the first transport mechanism moves to the placement position and places the multiple cut pieces on the placement table. This makes it possible to select the state of the cut pieces (whether the first side is facing downwards or the second side is facing downwards) when placing them in the good product tray 15a or the defective product tray 15b.
[0061] [Note 4] The first transport mechanism receives and holds the multiple cut pieces held by the second transport mechanism, moves together with the multiple cut pieces to a position opposite the aforementioned placement table, and places the multiple cut pieces on the aforementioned placement table. The cutting device described in Appendix 3.
[0062] According to the configuration described in Appendix 4 above, for example, the first conveying mechanism can transport multiple cut pieces to one of the first and second inspection positions and perform inspection on the multiple cut pieces, then the second conveying mechanism can transport multiple cut pieces to the other of the first and second inspection positions and perform inspection on the multiple cut pieces, and then the first conveying mechanism can receive and hold the multiple cut pieces from the second conveying mechanism, and then the first conveying mechanism can move to the placement position and place the multiple cut pieces on the placement table.
[0063] [Note 5] The second transport mechanism is configured to be able to reverse the orientation of the multiple cut pieces while holding them. A cutting device as described in any one of the items 1 to 4 of the appendix.
[0064] According to the configuration described in Appendix 5 above, for example, when conducting an inspection, it becomes easier to switch between the first and second surfaces of the cut product to be inspected, and when placing the cut product, it becomes easier to set whether the first or second surface of the cut product should face upwards or downwards.
[0065] [Note 6] A method for manufacturing cut products using a cutting device described in any one of the items 1 to 5 of the appendix, A step of dividing the object to be cut, which is held on the processing table, into a plurality of cut pieces, With the first transport mechanism arranging the multiple cut pieces at the second inspection position, the second inspection mechanism inspects the second surface of the multiple cut pieces; A step of transferring a plurality of the cut pieces from the first conveying mechanism to the second conveying mechanism, The process includes the step of inspecting the first surface of the multiple cut pieces using the first inspection mechanism, with the multiple cut pieces positioned at the first inspection position by the second transport mechanism. A method for manufacturing cut products.
[0066] According to the configuration described in Appendix 6 above, since each of the first and second transport mechanisms is configured to transport multiple cut pieces to both the first and second inspection positions, it is possible to inspect the second surface before the first surface. For example, compared to a case where the first transport mechanism is configured to transport multiple cut pieces only to the first inspection position, and the second transport mechanism is configured to transport multiple cut pieces only to the second inspection position, it is possible to perform cutting and inspection with higher productivity.
[0067] [Note 7] A method for manufacturing cut products using a cutting device described in any one of the items 1 to 5 of the appendix, A step of dividing the object to be cut, which is held on the processing table, into a plurality of cut pieces, With the first transport mechanism arranging the multiple cut pieces at the first inspection position, the first inspection mechanism inspects the first surface of the multiple cut pieces; A step of transferring a plurality of the cut pieces from the first conveying mechanism to the second conveying mechanism, The process includes the step of inspecting the second surface of the multiple cut pieces using the second inspection mechanism, while the multiple cut pieces are positioned at the second inspection position by the second transport mechanism. A method for manufacturing cut products.
[0068] According to the configuration described in Appendix 7 above, each of the first and second transport mechanisms is configured to transport multiple cut pieces to both the first and second inspection positions, making it possible to inspect the first surface before the second surface. For example, compared to a case where the first transport mechanism is configured to transport multiple cut pieces only to the first inspection position, and the second transport mechanism is configured to transport multiple cut pieces only to the second inspection position, it is possible to perform cutting and inspection with higher productivity.
[0069] [Note 8] A method for manufacturing cut products using the cutting device described in Appendix 3 or 4, A step of dividing the object to be cut, which is held on the processing table, into a plurality of cut pieces, With the first transport mechanism arranging the multiple cut pieces at the second inspection position, the second inspection mechanism inspects the second surface of the multiple cut pieces; A step of transferring a plurality of the cut pieces from the first conveying mechanism to the second conveying mechanism, With the second transport mechanism arranging the multiple cut pieces at the first inspection position, the first inspection mechanism inspects the first surface of the multiple cut pieces; A step of transferring a plurality of the cut pieces from the second transport mechanism to the first transport mechanism, The first transport mechanism includes the step of placing a plurality of the cut pieces onto the aforementioned placement table, A method for manufacturing cut products.
[0070] According to the configuration described in Appendix 8 above, for example, regarding the orientation of the cut product, by transferring the cut product from the first conveying mechanism to the second conveying mechanism, it changes from an orientation for inspecting the second surface to an orientation for inspecting the first surface. Furthermore, by transferring the cut product from the second conveying mechanism to the first conveying mechanism, it becomes possible to change the orientation from one for inspecting the first surface to one suitable for the first conveying mechanism to place the cut product on the placement table. In addition, it becomes possible to select the state of the cut product (whether the first surface is facing downwards or the second surface is facing downwards) when placing the cut product in the good product tray 15a or the defective product tray 15b.
[0071] While embodiments of the present disclosure have been described above, the embodiments disclosed herein should be considered in all respects to be illustrative and not restrictive. The scope of the present disclosure is defined by the claims and is intended to include all modifications in the sense and scope equivalent to the claims. [Explanation of symbols]
[0072] 1 Cutting device, 3 Substrate supply unit, 4 Positioning unit, 4a Rail unit, 5M, 5N Processing table, 5a Holding member, 5b Rotation mechanism, 5c Moving mechanism, 5d First position confirmation camera, 5e First cleaner, 6 Cutting mechanism, 6a Blade, 6b Second position confirmation camera, 7 First transport mechanism, 7a, 11a Main unit, 7b, 11b Moving axis, 8 First inspection mechanism, 9 Second inspection mechanism, 10 Second cleaner, 10a Washing nozzle, 10b Drying nozzle, 11 Second transport mechanism, 12 First optical inspection camera, 13 Second optical inspection camera, 14 Placement table, 15 Extraction unit, 15a Tray for good products, 15b Tray for defective products, 16 First illumination, 17 Second illumination, 20 Monitor, 50 Computer, A1 Cutting module, B1 Inspection / Storage module, F1 Molding surface (first surface), F2 Lead surface (second surface), M1 Magazine, P1 Object to be cut, Q1 First inspection position, Q2 Second inspection position, S1 Cut item, T1 Pickup position, U1 Receiving position, U2 Placement position.
Claims
1. A processing table that holds the object to be cut, A cutting mechanism that cuts the object to be cut held on the processing table to divide it into multiple cut pieces, A first conveying mechanism that holds and conveys multiple cut pieces, A second conveying mechanism that holds and conveys multiple cut pieces, A first inspection mechanism that inspects the first surface of multiple cut pieces while the multiple cut pieces are positioned at a first inspection location, The system includes a second inspection mechanism that inspects the second surface of multiple cut pieces while the multiple cut pieces are positioned at a second inspection location, The first transport mechanism is configured to transport a plurality of the cut pieces to both the first inspection position and the second inspection position. The second transport mechanism is also configured to transport a plurality of the cut pieces to both the first inspection position and the second inspection position. The system further comprises a mounting table on which multiple cut pieces can be placed, The second transport mechanism is configured to be movable between a receiving position for receiving and holding a plurality of the cut pieces held by the first transport mechanism from the first transport mechanism, and a placement position for placing the plurality of cut pieces on the placement table described above. Cutting device.
2. The first transport mechanism is configured to be movable between a picking position for picking up and holding a plurality of the cut pieces on the processing table and a placement position for placing a plurality of the cut pieces on the placement table. The cutting device according to claim 1.
3. The cutting apparatus according to claim 2, wherein the first conveying mechanism receives and holds a plurality of the cut pieces held by the second conveying mechanism, the first conveying mechanism moves together with the plurality of cut pieces to a position opposite the aforementioned placement table, and places the plurality of cut pieces on the aforementioned placement table.
4. A processing table for holding the object to be cut, A cutting mechanism that cuts the object to be cut held on the processing table to divide it into multiple cut pieces, A first conveying mechanism that holds and conveys multiple cut pieces, A second conveying mechanism that holds and conveys multiple cut pieces, A first inspection mechanism that inspects the first surface of multiple cut pieces while the multiple cut pieces are positioned at a first inspection location, The system includes a second inspection mechanism that inspects the second surface of multiple cut pieces while the multiple cut pieces are positioned at a second inspection location, The first transport mechanism is configured to transport a plurality of the cut pieces to both the first inspection position and the second inspection position. The second transport mechanism is also configured to transport a plurality of the cut pieces to both the first inspection position and the second inspection position. The second transport mechanism is configured to be able to reverse the orientation of the multiple cut pieces while holding them. Cutting device.
5. A method for manufacturing a cut product using a cutting device described in any one of claims 1 to 4, A step of dividing the object to be cut, which is held on the processing table, into a plurality of cut pieces, With the first transport mechanism arranging the multiple cut pieces at the second inspection position, the second inspection mechanism inspects the second surface of the multiple cut pieces; A step of transferring a plurality of the cut pieces from the first transport mechanism to the second transport mechanism, The process includes the step of inspecting the first surface of the multiple cut pieces using the first inspection mechanism, with the multiple cut pieces positioned at the first inspection position by the second transport mechanism. A method for manufacturing cut products.
6. A method for manufacturing a cut product using a cutting device described in any one of claims 1 to 4, A step of dividing the object to be cut, which is held on the processing table, into a plurality of cut pieces, With the first transport mechanism arranging the multiple cut pieces at the first inspection position, the first inspection mechanism inspects the first surface of the multiple cut pieces; A step of transferring a plurality of the cut pieces from the first transport mechanism to the second transport mechanism, The process includes: arranging a plurality of the cut pieces at the second inspection position using the second transport mechanism, and then inspecting the second surface of the plurality of cut pieces using the second inspection mechanism. A method for manufacturing cut products.
7. A method for manufacturing a cut product using the cutting device described in any one of claims 2 or 3, A step of dividing the object to be cut, which is held on the processing table, into a plurality of cut pieces, With the first transport mechanism arranging the multiple cut pieces at the second inspection position, the second inspection mechanism inspects the second surface of the multiple cut pieces; A step of transferring a plurality of the cut pieces from the first transport mechanism to the second transport mechanism, With the second transport mechanism arranging the multiple cut pieces at the first inspection position, the first inspection mechanism inspects the first surface of the multiple cut pieces; A step of transferring a plurality of the cut pieces from the second transport mechanism to the first transport mechanism, The first transport mechanism includes the step of placing a plurality of the cut pieces onto the aforementioned placement table, A method for manufacturing cut products.