Splicing method for conductive porous substrate sheets

The splicing method with a thermosetting resin adhesive addresses misalignment and breakage issues in conductive porous substrate sheets, enhancing processing efficiency by ensuring secure bonding and alignment.

JP7881919B2Active Publication Date: 2026-06-30TORAY INDUSTRIES INC
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
TORAY INDUSTRIES INC
Filing Date
2022-02-10
Publication Date
2026-06-30

AI Technical Summary

Technical Problem

Existing methods for splicing conductive porous substrate sheets in fuel cells face issues such as misalignment, damage during processing, and peeling at high temperatures, leading to substrate loss and reduced processing efficiency.

Method used

A splicing method using a thermosetting resin adhesive sandwiched between the end regions of conductive porous substrate sheets, which is heated and pressed perpendicularly to bond them, ensuring alignment and preventing breakage.

Benefits of technology

Reduces substrate loss and improves processing efficiency by preventing breakage and misalignment during splicing and subsequent processes.

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Patent Text Reader

Abstract

To provide a splicing method capable of reducing the loss of a conductive porous base material sheet and also capable of increasing the processing efficiency of a gas diffusion electrode.SOLUTION: Provided is a splicing method for connecting two conductive porous base material sheets, in which a thermosetting resin-based adhesive is sandwiched from above and below with a longitudinal end area of a first conductive porous base material sheet and a longitudinal end area of a second conductive porous base material sheet and both end areas are adhered by pressing, in a direction perpendicular to a base material surface, a portion where the thermosetting resin-based adhesive is sandwiched, while heating the portion.SELECTED DRAWING: Figure 1
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