Apparatus, method, and recording medium for controlling substrate processing process

Abstract

A technology for controlling a device related to surface mount technology is provided. A device according to one embodiment of the present disclosure comprises a communication circuit configured to communicate with a measuring device, one or more processors, and one or more memories stored in a command that causes the one or more processors to perform an operation when executed by the one or more processors. The one or more processors can obtain first mounting result information from the measuring device, wherein the component mounting device measures the state in which a target component is mounted on a target substrate, wherein the component mounting device is composed of a plurality of components having a hierarchical relationship, wherein, based on the first mounting result information and the hierarchical relationship, at least one of the plurality of components is determined to be in an abnormal state, wherein the abnormal state indicates a determination that at least one of the plurality of components does not satisfy a predetermined criterion, and, when at least one of the plurality of components is determined to be in an abnormal state, the measuring device can be controlled to stop the feedback provided by the measuring device to the component mounting device.

Description

Technology Field

[0001] The present disclosure relates to a technology for controlling a substrate processing process. Background Technology

[0002] A substrate processing process according to Surface Mount Technology (SMT) can be performed on a substrate. Such substrate processing may include a process of printing solder on a substrate, a process of mounting a component on the solder printed on the substrate, and / or a process of hardening the printed solder to bond the component to the substrate.

[0003] The state (e.g., position, orientation, etc.) of a component finally bonded to a substrate can be affected by various devices performing individual processes included in the substrate processing process. For example, the state of the component can be affected by a device that prints solder on the substrate, a device that mounts the component onto the solder printed on the substrate, and a device that hardens the solder. If the component finally bonded does not make smooth contact with the substrate's pads (e.g., electrodes) due to the influence of the aforementioned devices, it may cause defects in the substrate. The problem to be solved

[0004] The present disclosure provides a technology for controlling a substrate processing process. means of solving the problem

[0005] An apparatus according to one embodiment of the present disclosure comprises a communication circuit configured to communicate with a measuring device, one or more processors, and one or more memories stored in a command that causes the one or more processors to perform an operation when executed by the one or more processors, wherein the one or more processors obtain first mounting result information from the measuring device, wherein the component mounting device measures the state in which a component mounting device mounts a target component on a target substrate, wherein the component mounting device is composed of a plurality of components having a hierarchical relationship, wherein, based on the first mounting result information and the hierarchical relationship, at least one of the plurality of components determines that the state abnormality indicates that at least one of the plurality of components does not satisfy a predetermined criterion, and wherein, when at least one of the plurality of components is determined to be in a state abnormality, the measuring device may control the measuring device to stop the feedback provided by the measuring device to the component mounting device.

[0006] In one embodiment, the one or more processors may control the measuring device to resume the feedback in response to a signal that a part determined to be in an abnormal state has been repaired.

[0007] In one embodiment, the one or more processors may transmit display information to the user terminal so that a dashboard visualizing the status of the plurality of components is displayed on the user terminal.

[0008] In one embodiment, the display information may include information regarding a part among the plurality of parts that is determined to be in an abnormal state.

[0009] In one embodiment, the one or more processors determine an offset between the mounting state of the target component mounted on the target substrate and a predetermined mounting standard based on the first mounting result information, and determine that at least one of the plurality of components is in an abnormal state based on the offset and the hierarchical relationship.

[0010] In one embodiment, the offset may include at least one of a position offset between the mounting position of the target component and the mounting position indicated by the mounting reference, and an angle offset between the mounting angle of the target component and the mounting angle indicated by the mounting reference.

[0011] In one embodiment, the one or more processors obtain second mounting result information for measuring the state in which a component of the same type as the target component is mounted on each of a plurality of substrates having the same layout as the target substrate, and based on the second mounting result information, determine an offset for each of the same type of component mounted on each of the plurality of substrates, and based on the average of the offset of the target component and the offset of each of the same type of component, determine that at least one of the plurality of components is in an abnormal state.

[0012] In one embodiment, the one or more processors obtain second mounting result information for measuring the state in which a component of the same type as the target component is mounted on each of a plurality of substrates having the same layout as the target substrate, and based on the second mounting result information, determine an offset for each of the components of the same type mounted on each of the plurality of substrates, and based on the offset of the target component and the offset of each of the components of the same type, determine that at least one of the plurality of components is in an abnormal state.

[0013] In one embodiment, the one or more processors obtain third mounting result information for measuring a state in which a first component and a second component distinct from the first component are mounted on the target substrate, wherein the first component and the second component are components mounted by a target part of the component mounting device, and determine the offset of the first component and the offset of the second component based on the third mounting result information, and determine that the target part is in an abnormal state based on the determination that the offset of the first component and the offset of the second component correspond.

[0014] In one embodiment, the one or more memories further store a machine learning model that has learned the correlation between mounting result information and the state abnormality of a component, and the one or more processors can determine that at least one of the plurality of components is in a state abnormality based on the machine learning model.

[0015] A method according to one embodiment of the present disclosure may include, in a method performed by a device, the step of obtaining first mounting result information from a measuring device, wherein the component mounting device measures the state in which a target component is mounted on a target substrate, wherein the component mounting device is composed of a plurality of components having a hierarchical relationship; the step of determining, based on the first mounting result information and the hierarchical relationship, that at least one of the plurality of components is in an abnormal state, wherein the abnormal state indicates a determination that at least one of the plurality of components does not satisfy a predetermined criterion; and the step of controlling the measuring device to stop the feedback provided by the measuring device to the component mounting device when at least one of the plurality of components is determined to be in an abnormal state.

[0016] In one embodiment, the method may further include the step of controlling the measuring device to resume the feedback in response to a signal that a part determined to be in an abnormal state has been repaired.

[0017] In one embodiment, the method may further include the step of transmitting display information to a user terminal so that a dashboard visualizing the status of the plurality of parts is displayed on the user terminal.

[0018] In one embodiment, the display information may include information regarding a part among the plurality of parts that is determined to be in an abnormal state.

[0019] In one embodiment, the step of determining that at least one of the plurality of components is in an abnormal state may include the step of determining an offset between the mounting state of the target component mounted on the target substrate and a predetermined mounting standard based on the first mounting result information, and the step of determining that at least one of the plurality of components is in an abnormal state based on the offset and the hierarchical relationship.

[0020] In one embodiment, the step of obtaining the first mounting result information includes the step of obtaining second mounting result information, which measures the state of mounting a component of the same type as the target component on each of a plurality of substrates having the same layout as the target substrate; the step of determining the offset of the target component based on the first mounting result information includes the step of determining the offset for each of the same type components mounted on each of the plurality of substrates based on the second mounting result information; and the step of determining that at least one of the plurality of components is in an abnormal state based on the offset of the target component and the hierarchical relationship may include the step of determining that at least one of the plurality of components is in an abnormal state based on the average of the offset of the target component and the offset of each of the same type components.

[0021] In one embodiment, the step of obtaining the first mounting result information includes the step of obtaining second mounting result information, which measures the state of mounting a component of the same type as the target component on each of a plurality of substrates having the same layout as the target substrate; the step of determining the offset of the target component based on the first mounting result information includes the step of determining the offset for each of the same type components mounted on each of the plurality of substrates based on the second mounting result information; and the step of determining that at least one of the plurality of components is in an abnormal state based on the offset of the target component and the hierarchical relationship may include the step of determining that at least one of the plurality of components is in an abnormal state based on the offset of the target component and the variance of the offset of each of the same type components.

[0022] In one embodiment, the step of obtaining the first mounting result information includes the step of obtaining the third mounting result information for measuring the state in which a first component and a second component distinguished from the first component are mounted on the target substrate, wherein the first component and the second component are components mounted by a target part of the component mounting device, and the step of determining the offset of the target component based on the first mounting result information includes the step of determining the offset of the first component and the offset of the second component based on the third mounting result information, and the step of determining that at least one of the plurality of components is in an abnormal state based on the offset of the target component and the hierarchical relationship may include the step of determining that the target part is in an abnormal state based on the determination that the offset of the first component and the offset of the second component correspond.

[0023] In one embodiment, the step of determining that at least one of the plurality of parts is in an abnormal state may include determining that at least one of the plurality of parts is in an abnormal state based on a machine learning model that has learned the correlation between the mounting result information and the abnormal state of the part.

[0024] A non-transient computer-readable recording medium according to one embodiment of the present disclosure is a non-transient computer-readable recording medium having a computer program to be executed by a processor, wherein the computer program may be configured to cause the processor to perform any one of the aforementioned methods when executed by the processor. Effects of the invention

[0025] According to the present disclosure, a component can be made to smoothly contact a pad of a substrate.

[0026] According to the present disclosure, the state of a component constituting an apparatus for mounting a component related to surface mount technology (e.g., a component mounting apparatus) can be determined.

[0027] According to the present disclosure, a measuring device for measuring the mounting status of a component can control the feedback provided to a device for mounting the component.

[0028] According to the present disclosure, the state of a component constituting a device for mounting a component can be visualized.

[0029] The effects according to the technical concept of the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by a person skilled in the art of the present disclosure from the description in the specification. Brief explanation of the drawing

[0030] FIG. 1 illustrates an environment in which devices according to one embodiment of the present disclosure may be applied. FIG. 2 illustrates a mounting process of a component mounting device that may be referenced in various embodiments of the present disclosure. FIG. 3 illustrates a reference table that enables the implementation process described with reference to FIG. 2. FIG. 4 illustrates the hierarchical relationship of parts of a component mounting device that may be referenced in various embodiments of the present disclosure. FIG. 5 illustrates a computing device capable of implementing devices according to one embodiment of the present disclosure. FIG. 6 illustrates a flowchart showing a method according to one embodiment of the present disclosure. FIGS. 7 and 8 illustrate flowcharts showing an abnormal state determination operation according to one embodiment of the present disclosure. FIGS. 9 to 18 illustrate a type of abnormal state of a component mounting device and a mounting result according to the type of abnormal state that can be referenced in various embodiments of the present disclosure. FIG. 19 illustrates a machine learning model that may be referenced in various embodiments of the present disclosure. FIG. 20 illustrates a flowchart showing a method according to one embodiment of the present disclosure. FIGS. 21 and FIGS. 22 illustrate a dashboard that may be referenced in various embodiments of the present disclosure. Specific details for implementing the invention

[0031] The various embodiments described in this disclosure are illustrative for the purpose of clearly explaining the technical concept of this disclosure and are not intended to limit it to specific embodiments. The technical concept of this disclosure includes various modifications, equivalents, alternatives, and embodiments selectively combined from all or part of each embodiment described in this disclosure. Furthermore, the scope of the technical concept of this disclosure is not limited to the various embodiments presented below or the specific descriptions thereof.

[0032] Terms used in this disclosure, including technical or scientific terms, may have the meaning generally understood by those skilled in the art to which this disclosure pertains, unless otherwise defined.

[0033] Expressions used in this disclosure, such as “comprising,” “may compose,” “possessing,” “possessing,” “having,” and “possessing,” mean that the subject feature (e.g., function, operation, or component, etc.) exists and do not exclude the existence of other additional features. That is, such expressions should be understood as open-ended terms implying the possibility of including other embodiments.

[0034] Singular expressions used in this disclosure may include a plural meaning unless the context otherwise indicates, and this applies likewise to singular expressions described in the claims.

[0035] Expressions such as "first," "second," or "first," "second," etc., used in this disclosure are used to distinguish one object from another when referring to a plurality of objects of the same kind, unless otherwise indicated in the context, and do not limit the order or importance of the objects.

[0036] Expressions used in the present disclosure, such as “A, B and C,” “A, B or C,” “at least one of A, B and C,” or “at least one of A, B or C,” may mean each of the listed items or all possible combinations of the listed items. For example, “at least one of A or B” may refer to (1) at least one A, (2) at least one B, and (3) at least one A and at least one B.

[0037] The expression “based on” as used in this disclosure is used to describe one or more factors affecting an act or action of a decision or judgment described in the phrase or sentence containing this expression, and this expression does not exclude additional factors affecting said act or action of a decision or judgment.

[0038] As used in the present disclosure, the expression that a certain component (e.g., a first component) is "connected" or "connected" to another component (e.g., a second component) may mean that the said certain component is not only directly connected or connected to the said other component, but is also connected or connected through a new other component (e.g., a third component).

[0039] As used in this disclosure, the expression "configured to" may have meanings such as "set to," "capable of," "modified to," "made to," or "capable of." This expression is not limited to the meaning of "specifically designed in hardware." For example, a processor configured to perform a specific operation may mean a generic-purpose processor capable of performing that specific operation by executing software, or a special-purpose computer structured through programming to perform that specific operation.

[0040] As used in this disclosure, the term "substrate" refers to a plate or container for mounting devices such as semiconductor chips, formed from a material such as silicon, and capable of serving as a pathway for electrical signals between devices. The substrate may be used for the fabrication of integrated circuits, etc. For example, the substrate may be a printed circuit board (PCB) or a wafer, etc.

[0041] The term "component" as used in this disclosure may refer to a device mounted on a substrate. Such a component may be referred to interchangeably, for example, as a part or a package.

[0042] As used in this disclosure, the term "User Interface (UI)" may refer to a physical or virtual medium created to enable communication between a user and an object, system, machine, or computer program, etc. According to this disclosure, a user may check and / or select various information regarding a substrate processing process through a user interface provided to a user terminal by a control device that manages and controls a substrate processing process according to surface mount technology, for example.

[0043] The term "Machine Learning (ML)" as used in this disclosure may refer to a technique for training a machine learning model to classify, analyze, and / or predict the features of input data. That is, machine learning may refer to a process of training a machine learning model through experience in processing input data as training data. Machine learning may include techniques that enable a machine learning model to mimic human learning ability, reasoning ability, and / or perceptual ability, such as artificial intelligence or symbolic logic. Such machine learning may be applied to technical fields such as linguistic understanding, visual understanding, reasoning, prediction, knowledge representation, or motion control.

[0044] The term "machine learning model" as used in this disclosure may be the result of generation based on machine learning. Specifically, a machine learning model may be constructed by modeling the correlation between input data, and the correlation may be expressed by at least one parameter. Here, the machine learning model may derive the correlation between input data by extracting and analyzing at least one feature from the input data according to the method intended by machine learning, and may optimize the parameter by repeating this process. For example, regarding data given as input-output pairs, the machine learning model may learn the mapping (e.g., correlation) between the input and output (e.g., supervised learning). As another example, even when only input data is given, the machine learning model may derive regularities between the given data and learn the relationship (e.g., unsupervised learning). As a result of the optimization / construction of the parameter, the machine learning model may output output data by classifying, analyzing, and / or predicting the features of the input data as intended in machine learning. Such a machine learning model may be referred to as an artificial intelligence model or a neural network model, etc.

[0045] Regarding the structure of machine learning models, the machine learning model can be designed to implement the structure of the human brain on a computer. That is, the machine learning model may include multiple network nodes that simulate neurons of a human neural network. Each of the multiple network nodes simulates the synaptic activity of neurons exchanging signals through synapses and may have a connection relationship with other nodes. Specifically, in the machine learning model, multiple network nodes may be located in layers of different depths and may exchange data according to, for example, convolutional connections.

[0046] Hereinafter, various embodiments described in this disclosure will be explained with reference to the attached drawings. In the attached drawings and the description thereof, identical or substantially equivalent components may be given the same reference numerals. Furthermore, in the description of the various embodiments below, the description of identical or corresponding components may be omitted, but this does not mean that such components are not included in the embodiments.

[0047] FIG. 1 illustrates an environment (100) to which devices (120, 130, 140, 150, 160, 170, 180, 190) according to one embodiment of the present disclosure may be applied. The environment (100) to be described through FIG. 1 relates to an environment in which a control device (180) generally manages and controls devices (120, 130, 140, 150, 160, 170) related to surface mount technology or a substrate processing process performed by such devices (120, 130, 140, 150, 160, 170). Additionally, the environment (100) illustrated in FIG. 1 relates to an environment in which a control device (180) transmits various information regarding the substrate processing process to a user terminal (190) through a user interface or obtains a response to such various information from the user terminal (190).

[0048] Meanwhile, FIG. 1 illustrates an environment (100) in which a pair of devices (120, 130, 140, 150, 160, 170) related to surface mount technology and one user terminal (190) are each connected to a control device (180) via a network. Depending on the number of lines in the substrate processing process or the number of users, the number of devices (120, 130, 140, 150, 160, 170) related to surface mount technology and the user terminal (190) may vary. Additionally, FIG. 1 merely illustrates a preferred embodiment for achieving the purpose of the present disclosure, and as necessary, some components may be merged with other components, some components may be deleted, or some components may be added.

[0049] Referring to FIG. 1, a substrate processing process may be performed on a substrate (110) by devices (120, 130, 140, 150, 160, 170) related to surface mount technology. Here, for a substrate of the same type as the substrate (110), a substrate processing process identical to the substrate processing process performed on the substrate (110) may be performed in sequence. When such a substrate processing process is performed on the substrate (110), at least some of the devices (120, 130, 140, 150, 160, 170) related to surface mount technology may transmit various information regarding the substrate processing process to a control device (180) or receive various information or control signals regarding the substrate processing process from the control device (180).

[0050] The device related to surface mount technology may be a solder printing device (120), a first measuring device (130), a component mounting device (140), a second measuring device (150), an oven (160), or a third measuring device (170), etc.

[0051] Regarding the solder printing process included in the substrate processing process, a solder printing device (120) or a first measuring device (130) may be involved in the solder printing process. The solder printing device (120) may print solder on the substrate (110). Specifically, the solder printing device (120) may print solder on pads included in the substrate (110) (e.g., a pair of electrodes provided at a location where a component on the substrate is to be bonded). Such a solder printing device (120) may be referred to as a screen printer. Additionally, the first measuring device (130) may measure the printing state of the solder. The printing state of the solder may include the position, direction, volume, height, or area of ​​the printed solder. Here, the first measuring device (130) may provide feedback to the solder printing device (120) according to the printing state of the solder. Based on the feedback provided in this way, the solder printing device (120) can perform a printing process as a result reflecting the feedback on a subsequent substrate of the same type as the substrate (110). This first measuring device (130) may be referred to as a Solder Paste Inspection (SPI) device.

[0052] Regarding the component mounting process included in the substrate processing process, a component mounting device (140) or a second measuring device (150) may be involved in the component mounting process.

[0053] Regarding the component mounting process included in the substrate processing process, the component mounting device (140) can mount a component on a substrate (110) on which solder is printed. Additionally, the component mounting device (140) can calculate the number of components picked up (or the number of attempts to pick up) and transmit the value to a second measuring device (150) or a control device (180). Such a component mounting device (140) may be referred to as a mounter.

[0054] Referring to FIGS. 2 and 3 for a specific description of the mounting operation performed by the component mounting device (140), the component mounting device (140) may include a header (210) or a nozzle (220a, 220b), etc., as a component constituting the device. In the mounting operation, the component mounting device (140) can mount the component (230a, 230b) on the substrate (240) by temporarily coupling the component (230a, 230b) through the nozzle (220a, 220b) connected to the header (210), positioning the component (230a, 230b) in a part of the mounting reference area (250a, 250b, 250c, 250d) on the substrate (240) through the movement of the header (210), and releasing the temporary coupling between the nozzle (220a, 220b) and the component (230a, 230b). The mounting standard, which serves as the basis for mounting the components (230a, 230b), can be determined in advance, for example, by two-dimensional coordinate values ​​(X, Y) and a rotation angle value (θ), in the same manner as the reference table (300) illustrated in FIG. 3. As a result of mounting, each of the plurality of components (CRD1, CRD2, CRD3, CRD4) can be mounted on the substrate (240) so as to correspond to the areas (250a, 250b, 250c, 250d) according to the mounting standard. Here, some components (CRD1, CRD3) can be mounted without an offset (e.g., position offset, angle offset) from the areas (250a, 250c) according to the mounting standard, and other components (CRD2, CRD4) can be mounted with an offset from the areas (250b, 250d) according to the mounting standard. This offset may be due to various noises accompanying the mounting operation of the component mounting device (140) or due to a failure (e.g., abnormal condition) of a component constituting the component mounting device (140).Subsequently, through the description in the specification, specific methods such as determining the type of offset occurring during the mounting operation and the cause thereof, which is due to a failure of a component constituting the component mounting device (140), are explained.

[0055] Regarding the component mounting process included in the substrate processing process, the second measuring device (150) can measure the mounting status of the component. Here, the mounting status may refer to the state in which the component mounting device (140) has mounted the component. The second measuring device (150) can generate mounting result information by measuring the mounting status. This mounting result information may include primary information such as, for example, the mounting position of the component (e.g., 2D and 3D coordinate values ​​where the position where the component is mounted is measured) or the mounting angle (e.g., angle values ​​where the angle where the component is mounted is measured). Additionally, the mounting status may include secondary information processed from the primary information, such as, for example, position offset, angle offset, average of the position offset, variance of the position offset, average of the angle offset, variance of the angle offset, or the number of missing components. The second measuring device (150) can transmit the aforementioned mounting result information to the control device (180). Additionally, the second measuring device (150) can provide feedback to the component mounting device (140) according to the mounting status of the component. Based on the feedback provided in this way, the component mounting device (140) can perform a component mounting process as a result reflecting the feedback on a subsequent substrate of the same type as the substrate (110). This second measuring device (150) may be referred to as a Pre-AOI (Automated Optical Inspection) device.

[0056] Regarding the reflow process included in the substrate processing process, an oven (160) or a third measuring device (170) may be involved in the reflow process. The oven (160) can bond components to the substrate (110) by melting and then hardening the solder printed on the substrate (110). Additionally, the third measuring device (170) can measure the bonding state of the components after the reflow process (e.g., bonding position, bonding angle of the components). Here, the third measuring device (170) can provide feedback to the oven (160) according to the bonding state of the components. Based on the feedback provided in this way, the oven (160) can perform a reflow process on a subsequent substrate of the same type as the substrate (110) as a result reflecting the feedback. Such a third measuring device (170) may be referred to as a Post-AOI (Automated Optical Inspection) device.

[0057] Devices (120, 130, 140, 150, 160, 170) related to surface mount technology can perform all known operations for performing surface mount technology in addition to the aforementioned operations.

[0058] Hereinafter, in order to clarify the gist of the present disclosure, the component mounting process among the substrate processing processes described so far and the operation of the devices related to the process are described in detail. Hereinafter, the second measuring device (150) for measuring the mounting state of the component may be briefly referred to as the measuring device (150).

[0059] The control device (180) can obtain mounting result information (e.g., first mounting result information) from the measuring device (150). The mounting result information may be information obtained by measuring the mounting status of a component (e.g., target component) mounted on a substrate (110, e.g., target substrate) by the component mounting device (140). For example, the mounting result information may include at least one selected from a measurement value of the component mounting position represented by two-dimensional and / or three-dimensional coordinates and a measurement value of the component mounting angle. As another example, the mounting result information may include the number of missing components. In one embodiment, the number of missing components may be generated in conjunction with the number of components picked up (or attempted to pick up) by the component mounting device (140). For example, the number of missing components may be the difference between the number of picked-up components and the number of components actually mounted. As another example, the mounting result information may include at least one value among a position offset, an angle offset, an average of the position offsets, a variance of the position offsets, an average of the angle offsets, and a variance of the angle offsets. As another example, the mounting result information may include an image capturing the state in which a component is mounted on a substrate (110).

[0060] The control device (180) can obtain a hierarchical relationship of a plurality of parts (e.g., head, nozzle, etc.) constituting the component mounting device (140). As shown in FIG. 4, the hierarchical relationship (400) can be determined by the physical connection relationship of a plurality of parts constituting the component mounting device (140). Referring to the hierarchical relationship (400) of FIG. 4, for example, "Head" may have a physical connection relationship with "NOZZLE 1" and "NOZZLE 2". Additionally, according to the hierarchical relationship (400), "NOZZLE 1", "CRD1", and "CRD2" each may have a physical connection relationship in which "CRD1" and "CRD2" are implemented by "NOZZLE 1", and "NOZZLE 2", "CRD3", and "CRD4" each may have a physical connection relationship in which "CRD3" and "CRD4" are implemented by "NOZZLE 2".

[0061] The control device (180) can determine the state of at least one of a plurality of components constituting the component mounting device (140) based on mounting result information and hierarchical relationships. If a first component among the plurality of components does not satisfy a predetermined criterion, the first component may be determined to be in an abnormal state. Additionally, if a second component among the plurality of components satisfies a predetermined criterion, the second component may be determined to be in a normal state. That is, an abnormal state of a component may indicate a determination that the component does not satisfy a predetermined criterion. Here, the predetermined criterion may be a criterion determined based on mounting result information and / or hierarchical relationships.

[0062] When the control device (180) determines that at least one of the plurality of components constituting the component mounting device (140) is in an abnormal state, it can control the measuring device (150) to stop the feedback provided by the measuring device (150) to the component mounting device (140). This feedback may be a means for adjusting the offset caused by various noises accompanying the mounting operation of the component mounting device (140). If an offset occurs due to an abnormal state of a component of the component mounting device (140), the degree of feedback increases excessively, which may result in the mounting operation of the component mounting device (140) becoming inaccurate, or the mounting operation of the component mounting device (140) becoming inaccurate after repairing the component. Therefore, the control device (180) can control the measuring device (150) to stop the feedback provided by the measuring device (150) to the component mounting device (140).

[0063] The control device (180) can control the measuring device (150) to resume feedback in response to a signal that a part determined to be in an abnormal state has been repaired. Since the part has returned to a normal state due to the repair of the part determined to be in an abnormal state, the control device (180) can control the measuring device (150) to resume the feedback provided by the measuring device (150) to the component mounting device (140) in order to adjust the offset caused by various noises accompanying the mounting operation of the component mounting device (140). In addition to the aforementioned operations, the control device (180) can perform various operations to manage and control the component mounting process.

[0064] Additionally, the control device (180) may perform operations linked to the user terminal (190) to visualize information (e.g., a dashboard) regarding the component mounting process to the user. Specifically, the control device (180) may transmit display information to the user terminal (190) so that a dashboard visualizing the status of a plurality of components constituting the component mounting device (140) is displayed on the user terminal (190). That is, the control device (180) may transmit display information to the user terminal (190) so that the user can check various information related to surface mounting technology through the user terminal (190). In one embodiment, the display information may include information regarding a component determined to be in an abnormal state among the plurality of components constituting the component mounting device (140). An explanation of operations regarding the dashboard, etc., visualized on the user terminal (190) will be explained later with reference to FIGS. 20 to 22.

[0065] The control device (180) described so far may be implemented with one or more computing devices. For example, all functions of the control device (180) may be implemented in a single computing device. As another example, the first function of the control device (180) may be implemented in a first computing device, and the second function may be implemented in a second computing device. Such computing devices may be, for example, a desktop computer, a laptop computer, an application server, a proxy server, or a cloud server, but are not limited thereto, and any type of device equipped with computing functions may be a computing device.

[0066] The user terminal (190) described so far is a terminal used by a user (e.g., a person who manages and controls the processing of surface mount technology, etc.) and can display various information obtained from the control device (180) on a display. Communication between such a control device (180) and the user terminal (190) can be performed via a user interface. The aforementioned user terminal (190) may be, for example, a desktop computer, a laptop computer, a tablet computer, a wearable device, or a smartphone, but is not limited thereto, and any type of device equipped with computing functions may be the user terminal (190). In addition, a web browser or an application may be installed on the user terminal (190) to receive the aforementioned user interface from the control device (180).

[0067] Each of the devices (120, 130, 140, 150, 160, 170, 180, 190) illustrated in FIG. 1 described so far can communicate through a network. Such a network can be implemented as any kind of wired or wireless network, such as, for example, a Local Area Network (LAN), a Wide Area Network (WAN), a Mobile Radio Communication Network (MRCN), or WiBro (Wireless Broadband).

[0068] FIG. 5 illustrates a computing device (500) capable of implementing all or part of the devices (120, 130, 140, 150, 160, 170, 180, 190) according to one embodiment of the present disclosure. That is, all or part of the solder printing device (120), the first measuring device (130), the component mounting device (140), the second measuring device (150), the oven (160), the third measuring device (170), the control device (180), or the user terminal (190) illustrated in FIG. 1 may be implemented by the computing device (500) illustrated in FIG. 5. For reference, in the present disclosure, the computing device (500) may be referred to interchangeably with the device or electronic device.

[0069] Referring to FIG. 5, the computing device (500) may include one or more processors (510), one or more memories (520), or communication circuits (530). In one embodiment, some components (e.g., communication circuits) may be removed from the computing device (500), or other components (e.g., a display or input device, etc.) may be added to the computing device (500). Additionally, some components may be implemented by being integrated or by being implemented as a single or multiple entities. In the present disclosure, one or more processors (510) may be referred to as processors (510). Unless the context clearly indicates otherwise, the term processors (510) may mean a set of one or more processors. Also, in the present disclosure, one or more memories (520) may be referred to as memories (520). Unless the context clearly indicates otherwise, the term memory (520) may mean a set of one or more memories.

[0070] The processor (510) can perform operations or information processing regarding the control or communication of each component of the computing device (500). Specifically, the processor (510) can control at least one component of the computing device (500) connected to the processor (510) by running software (or computer program) received from another component. As an example, the processor (510) can load instructions (e.g., instructions, code, or code segments) or information into memory (520), process the instructions or information stored in memory (520), and store result information resulting from the processing in memory (520). Additionally, the processor (510) can be operatively connected to the components of the computing device (500) to perform various operations such as operations, processing, generation, or processing related to the present disclosure.

[0071] The memory (520) may store various information. The information stored in the memory (520) may include software, which is information acquired, processed, or used by at least one component of the computing device (500). The software may include one or more instructions that cause the processor (510) to perform operations according to various embodiments of the present disclosure when loaded into the memory (520). That is, the processor (510) may perform operations according to various embodiments of the present disclosure by executing the one or more instructions described above. The memory (520) may include, for example, volatile or non-volatile memory. In one embodiment, the program may be software stored in the memory (520) and may include an operating system for controlling the resources of the computing device (500), an application, or middleware that provides various functions to the application so that the application can utilize the resources of the computing device (500).

[0072] A communication circuit (530) can establish a wired or wireless communication channel with another device and transmit and receive various information with that other device. In one embodiment, the communication circuit (530) may include at least one port for connecting to another device via a wired cable in order to communicate with another device via a wire. In this case, the communication circuit (530) can perform communication with another device that is wired through at least one port. In one embodiment, the communication circuit (530) may include a cellular communication module and be configured to be connected to a cellular network (e.g., 3G, LTE, 5G, Wibro, or Wimax). In one embodiment, the communication circuit (530) may include a short-range communication module and transmit and receive information with another device using short-range communication (e.g., Wi-Fi, Bluetooth, Bluetooth Low Energy (BLE), UWB). In one embodiment, the communication circuit (530) may include a contactless communication module for contactless communication. Contactless communication may include at least one contactless proximity communication technology, such as, for example, NFC (Near Field Communication) communication, RFID (Radio Frequency Identification) communication, or MST (Magnetic Secure Transmission) communication. In addition to the various examples described above, the computing device (500) may be implemented in various known ways for communicating with other devices, and the scope of the present disclosure is not limited by the examples described above.

[0073] In one embodiment, the communication circuit (530) may be omitted from the computing device (500).

[0074] In one embodiment, the computing device (500) may include a display. The display may display various screens (e.g., one or more pages) based on the control of the processor (510). For example, a web browser or a dedicated application may be installed on the computing device (500) to display screens with various interfaces applied to them. Additionally, the display may be configured to interact with a user and may receive user input from the user. Such a display may be implemented in the form of a touch sensor panel (TSP) capable of recognizing contact or proximity of various external objects (e.g., a user's finger or stylus).

[0075] In one embodiment, the computing device (500) may include an input device (e.g., a mouse or a keyboard). The input device may receive information to be used in a component of the computing device (500) from outside the computing device (500) (e.g., a user).

[0076] The processor (510), memory (520) and / or communication circuit (530) may be connected to each other via a bus, GPIO (General Purpose Input / Output), SPI (Serial Peripheral Interface) or MIPI (Mobile Industry Processor Interface), etc., to give or receive information or signals.

[0077] Hereinafter, methods according to various embodiments of the present disclosure will be described in detail. It should be noted that although operations are illustrated in a specific order in the drawings below, the operations must not necessarily be executed in the specific order illustrated or in a sequential order, or all illustrated operations must be executed to obtain the desired result.

[0078] Additionally, the operation of the method described below with reference to the drawings may be performed by a computing device. In other words, the operation of the method may be implemented by one or more instructions executed by a processor of the computing device. All operations included in this method may be performed by a single physical computing device, but, for example, the first operation of the method may be performed by a first computing device and the second operation of the method may be performed by a second computing device. That is, the operations included in the method may be performed by being distributed among multiple computing devices.

[0079] In the following, the explanation will continue assuming that the operation of the above-described method is performed by the control device (180) shown in FIG. 1. Also, for the convenience of explanation, the subject of the operation included in the method may be omitted, but unless otherwise indicated in the context, it can be interpreted that the operation is performed by the control device (180).

[0080] FIG. 6 illustrates a flowchart illustrating a method according to one embodiment of the present disclosure. The flowchart illustrated in FIG. 6 includes a series of operations of a control device (180) that determines an abnormal state (e.g., failure) of a component constituting a component mounting device (140) and controls a measuring device (150) according to the determination.

[0081] Mounting result information can be obtained from a measuring device (150) (S610). Mounting result information may be a general term for information measuring the state of mounting a component on a substrate (e.g., mounting state). For example, the mounting result information may include first mounting result information measuring the state of mounting a target component on a target substrate. Here, the target substrate may be a substrate on which a substrate processing process is performed, and the target component may be a component mounted on the target substrate. Additionally, the mounting result information may include second mounting result information measuring the state of mounting a component of the same type as the target component on each of a plurality of substrates having the same layout as the target substrate. Here, the plurality of substrates may be substrates on which a substrate processing process is performed following the target substrate, and on each of the plurality of substrates, a component of the same type as the target component mounted on the target substrate may be mounted. Although the target component and the component of the same type are mounted on different substrates, they are mounted by one part (e.g., the target component) of the component mounting device (140). Therefore, the mounting state of multiple components mounted by that one part can be obtained through the operation of obtaining mounting result information (S610). Additionally, the mounting result information may include third mounting result information that measures the state of mounting the first component and the second component on the target substrate. Here, the first component and the second component may be components mounted by one part (e.g., a header, a nozzle, etc.) of the component mounting device (140). That is, although the first component and the second component are different components mounted on the target substrate, they are mounted by one part (e.g., the target component) of the component mounting device (140). Therefore, the mounting state of multiple components mounted by that one part can be obtained through the operation of obtaining mounting result information (S610).

[0082] In one embodiment, the mounting result information may include at least one value among two-dimensional and three-dimensional coordinate values ​​where the position where the component is mounted on the substrate (e.g., mounting position) is measured, and an angle value where the angle at which the component is mounted (e.g., mounting angle) is measured. That is, at least one value among two-dimensional and three-dimensional coordinate values ​​and an angle value may be obtained from the measuring device (150). The coordinate value may be a value determined from the relationship between a first point uniquely determined with respect to the substrate and a second point occupied by the component mounted on the substrate (e.g., the center of gravity of the component). Additionally, the angle value may be a value determined from the relationship between a first line uniquely determined with respect to the substrate and a second line occupied by the component mounted on the substrate.

[0083] In another embodiment, the mounting result information may include an image capturing the state in which a component is mounted on a substrate. That is, an image may be obtained from a measuring device (150).

[0084] Based on the installation result information and the hierarchical relationship of a plurality of parts constituting the component installation device (140), it can be determined that at least one of the plurality of parts is in an abnormal state (S620).

[0085] The operation (S620) may include an operation to determine an offset for one or more components based on mounting result information. This operation to determine the offset may be an operation to determine the difference between the mounting state of the component and a predetermined mounting reference. Specifically, the operation to determine the offset may include an operation to determine a position offset between the mounting position of the component and the mounting position indicated by the mounting reference for that component. Additionally, the operation to determine the offset may include an operation to determine an angle offset between the mounting angle of the component and the mounting angle indicated by the mounting reference for that component. Thus, the offset may include at least one of a position offset and an angle offset. For example, if the mounting position of "CRD1" is {30, 20} and the mounting position indicated by the mounting reference of "CRD1" is {25, 20} as shown in FIG. 3, the position offset of "CRD1" may be determined as {5, 0}. In addition, if the mounting angle of "CRD1" is {10} and the mounting angle indicated by the mounting reference of "CRD1" as shown in FIG. 3 is {0}, the angle offset of "CRD1" can be determined as {10}.

[0086] The operation of determining the offset may be performed, for example, for a target component mounted on a target substrate based on first mounting result information, for each of a homogeneous component mounted on each of a plurality of substrates based on second mounting result information, or for each of the first component and the second component based on third mounting result information.

[0087] According to the offset determination operation, the difference between the mounting state of the component and a predetermined mounting standard can be clearly determined as a numerical value. This numerical value can be used to determine an abnormal state according to the operation (S620).

[0088] If the installation result information includes an offset (e.g., position offset, angle offset) or a statistical value of the offset, the aforementioned offset determination operation may be omitted. In this case, for example, a measuring device (150) may perform the aforementioned offset determination operation.

[0089] Additionally, the operation (S620) may include an operation to determine a statistical value (e.g., mean, variance) for the offset of one or more components mounted by one part of the component mounting device (140). The operation to determine such a statistical value may include, for example, an operation to determine a statistical value for the offset of one or more components (e.g., target component, homogeneous component, first component, second component) mounted by one part of the component mounting device (140) based on first mounting result information to third mounting result information. As a specific example, the operation to determine a statistical value may include an operation to determine a first statistical value for the offset of one or more components mounted by the first head of the component mounting device (140), an operation to determine a second statistical value for the offset of one or more components mounted by a first nozzle physically connected to the first head, or an operation to determine a third statistical value for the offset of one or more components mounted by a second nozzle physically connected to the first head.

[0090] According to the operation of determining such statistical values, statistical values ​​regarding the offset of one or more components affecting each individual part of the component mounting device (140) can be determined. If a trend is found in the statistical values ​​regarding the offset, at least one of the multiple parts constituting the component mounting device (140) may be determined to be in an abnormal state. For example, if the average regarding the position offset is separated from the mounting position according to the mounting standard, or the variance regarding the position offset is outside the range of the mounting position according to the mounting standard, or the average regarding the angle offset is separated from the mounting angle according to the mounting standard, or the variance regarding the angle offset is outside the range of the mounting angle according to the mounting standard, or the variance regarding the angle offset is missing, at least one of the multiple parts constituting the component mounting device (140) may be determined to be in an abnormal state.

[0091] If the implementation result information includes a statistical value of the offset, the operation to determine the aforementioned statistical value may be omitted. In this case, for example, a measuring device (150) may perform the operation to determine the aforementioned statistical value.

[0092] Additionally, the operation (S620) may include determining that at least one of the components of the component mounting device (140) is in an abnormal state based on the hierarchical relationship of the component mounting device (140). According to the operation of determining an abnormal state based on such a hierarchical relationship, the component of the component mounting device (140) that causes a trend in statistical figures can be more clearly identified.

[0093] For a specific example, it is assumed that "CRD1" and "CRD2" are mounted by the first nozzle of the component mounting device (140), "CRD3" and "CRD4" are mounted by the second nozzle of the component mounting device (140), and that the first nozzle and the second nozzle are physically connected to the first head of the component mounting device (140). If a certain trend is found in the statistical values ​​of the offset for "CRD1" to "CRD4", the component causing the trend in the statistical values ​​can be identified as the first head. Additionally, if no certain trend is found in the statistical values ​​of the offset for "CRD1" to "CRD4", but a certain trend is found in the statistical values ​​of the offset for "CRD1" and "CRD2", the component causing the trend in the statistical values ​​can be identified as the first nozzle. In addition, if no consistent trend is found in the statistical values ​​of the offset for "CRD1" to "CRD4" but a consistent trend is found in the statistical values ​​of the offset for "CRD3" and "CRD4", the part causing the trend in the statistical values ​​can be identified as the second nozzle.

[0094] In one embodiment, the operation (S620) may include determining that at least one of a plurality of parts is in a different state based on a machine learning model that has learned the correlation between the mounting result information and the state abnormality of the parts. Here, the machine learning model may be stored in the memory of the control device (180) after the learning is completed. A description of such a machine learning model will be explained in detail later with reference to FIG. 19.

[0095] If at least one of the multiple components is determined to be in an abnormal state, the measuring device (150) can be controlled to stop the feedback provided by the measuring device (150) to the component mounting device (140) (S630).

[0096] Feedback may be a means for adjusting offsets generated from various noises accompanying the mounting operation of the component mounting device (140). Such feedback may be applied to subsequent substrates based on the offset of the target substrate undergoing the substrate processing process so that the offset is adjusted. However, if an offset is generated due to a state abnormality of a component of the component mounting device (140), the degree of feedback may increase excessively, thereby causing the mounting operation of the component mounting device (140) to become inaccurate, or the mounting operation of the component mounting device (140) to become inaccurate after repairing the component. Therefore, according to this operation (S630), the measuring device (150) may be controlled to stop the feedback provided by the measuring device (150) to the component mounting device (140) based on the result of the state abnormality determination operation (S620).

[0097] In one embodiment, the cessation of feedback may be applied to some of the plurality of components included in the substrate.

[0098] Before the determination of an abnormal state according to the abnormal state determination operation (S620), feedback may be continuously applied to a plurality of substrates on which a substrate processing process is performed. Since a plurality of substrates may be required for the abnormal state determination operation (S620), feedback corresponding to the offset caused by the abnormal state of a component of the component mounting device (140) may be cumulatively applied to the component mounting device (140). Accordingly, when the abnormal state is determined according to the abnormal state determination operation (S620), at least some of the feedback cumulatively applied to the component mounting device (140) may be initialized.

[0099] In response to a signal that a part determined to be in an abnormal state has been repaired, the measuring device (150) can be controlled to resume feedback (S640).

[0100] A signal that a part determined to be in an abnormal state has been repaired can be obtained from an external device (e.g., user terminal (190)). Repair of a part can be understood as a broad concept including replacement of the part.

[0101] When a part is repaired, the offset caused by the abnormal condition of the part of the component mounting device (140) no longer occurs. Therefore, according to this operation (S640), the measuring device (150) can be controlled to resume the feedback provided by the measuring device (150) to the component mounting device (140) in order to adjust the offset caused by various noises accompanying the mounting operation of the component mounting device (140).

[0102] FIGS. 7 and FIGS. 8 illustrate flowcharts illustrating an abnormal state determination operation according to one embodiment of the present disclosure. Step S700 of FIG. 7 and step S800 of FIG. 8 each indicate an abnormal state determination operation (S620).

[0103] The control device (180) can determine an offset between the mounting state and a predetermined mounting standard (S710), and can determine that at least one of the plurality of components is in an abnormal state based on the offset and the hierarchical relationship (S720). Step S710 may correspond to the operation of determining the offset described with reference to step S620. Additionally, step S720 may correspond at least partially to the operation of determining a statistical value and / or the operation of determining an abnormal state based on the hierarchical relationship described with reference to step S620.

[0104] Referring to FIG. 8, it can be determined that at least one of a plurality of parts is in an abnormal state based on the average or variance of the offset (S810), and it can be determined that at least one of a plurality of parts is in an abnormal state based on whether the offset corresponds (S820).

[0105] Step S810 may at least partially correspond to the operation of determining a statistical value and / or the operation of determining an abnormal state based on a hierarchical relationship described with reference to Step S620. Such Step S810 may include, for example, an operation of determining that at least one of a plurality of components is abnormal in state based on the average or variance of the offset of a target component mounted on a target substrate and the offset of a component of the same type as the target component mounted on each of a plurality of substrates following the target substrate. Additionally, Step S820 may at least partially correspond to the operation of determining an abnormal state based on a hierarchical relationship described with reference to Step S620. Such Step S820 may include, for example, an operation of determining that a target component involved in mounting the first component and the second component is abnormal in state based on a determination that the offsets of the first component and the second component mounted on the target substrate correspond (e.g., have the same trend).

[0106] FIGS. 9 to 18 illustrate a type of abnormal state of a component mounting device (140) that may be referenced in various embodiments of the present disclosure and a mounting result according to the type of abnormal state.

[0107] The abnormal state type of the component mounting device (140) to be described with reference to FIGS. 9 and FIGS. 10 is a type in which the position of some of the parts of the component mounting device (140) is separated. Referring to FIG. 9, for example, when compared to the normal state (910), the abnormal state (920) is a type in which the position of "NOZZLE 2" is separated, and the abnormal state (930) is a type in which the position of "HEAD 1" is separated.

[0108] If the average of the position offsets of the components involved in mounting "NOZZLE 1" and the average of the position offsets of the components involved in mounting "NOZZLE 2" are both located at the mounting position according to the mounting standard, all parts of the component mounting device (140) can be determined to be in a normal state. Additionally, as shown in FIG. 10, if the average of the position offsets of the components involved in mounting "NOZZLE 1" is located at the mounting position according to the mounting standard, but the average of the position offsets of the components involved in mounting "NOZZLE 2" is separated from the mounting position according to the mounting standard, "NOZZLE 2" of the component mounting device (140) can be determined to be in an abnormal state. In addition, if the average of the position offsets of the components involved in mounting "NOZZLE 1" and the average of the position offsets of the components involved in mounting "NOZZLE 2" are both separated by the same amount as the mounting position according to the mounting standard, "HEAD 1" of the component mounting device (140) may be determined to be in an abnormal state.

[0109] The abnormal state type of the component mounting device (140) to be described with reference to FIGS. 11 and 12 is a type in which the position of some of the parts of the component mounting device (140) vibrates. Referring to FIG. 11, for example, when compared to a normal state (1110), an abnormal state (1120) is in which the position of "NOZZLE 2" vibrates, and an abnormal state (1130) is in which the position of "HEAD 1" vibrates.

[0110] If the variance regarding the position offset of the component involved in mounting "NOZZLE 1" and the variance regarding the position offset of the component involved in mounting "NOZZLE 2" are both included within the range of the mounting position according to the mounting standard, all parts of the component mounting device (140) can be determined to be in a normal state. Additionally, as shown in FIG. 12, if the variance regarding the position offset of the component involved in mounting "NOZZLE 1" is included within the range of the mounting position according to the mounting standard, but the variance regarding the position offset of the component involved in mounting "NOZZLE 2" is outside the range of the mounting position according to the mounting standard, "NOZZLE 2" of the component mounting device (140) can be determined to be in an abnormal state. In addition, if the variance regarding the position offset of the component involved in mounting “NOZZLE 1” and the variance regarding the position offset of the component involved in mounting “NOZZLE 2” both deviate from the range of the mounting position according to the mounting standard by the same amount, “HEAD 1” of the component mounting device (140) may be determined to be in an abnormal state.

[0111] The abnormal state type of the component mounting device (140) to be described with reference to FIGS. 13 and 14 is a type in which the angle of some of the parts of the component mounting device (140) is separated. Referring to FIG. 13, for example, when compared to the normal state (1310), the abnormal state (1320) is a type in which the angle of "NOZZLE 2" is separated, and the abnormal state (1330) is a type in which the angle of "HEAD 1" is separated.

[0112] If the average of the angle offsets of the components involved in mounting "NOZZLE 1" and the average of the angle offsets of the components involved in mounting "NOZZLE 2" are both located at the mounting angle according to the mounting standard, all parts of the component mounting device (140) can be determined to be in a normal state. Additionally, as shown in FIG. 14, if the average of the angle offsets of the components involved in mounting "NOZZLE 1" is located at the mounting angle according to the mounting standard, but the average of the angle offsets of the components involved in mounting "NOZZLE 2" is separated from the mounting angle according to the mounting standard, "NOZZLE 2" of the component mounting device (140) can be determined to be in an abnormal state. In addition, if the average of the angle offsets of the components involved in mounting with "NOZZLE 1" and the average of the angle offsets of the components involved in mounting with "NOZZLE 2" are separated by the same amount as the mounting angle according to the mounting standard, "HEAD 1" of the component mounting device (140) may be determined to be in an abnormal state.

[0113] The abnormal state type of the component mounting device (140) to be described with reference to FIGS. 15 and 16 is a type in which the angle of some of the parts of the component mounting device (140) vibrates. Referring to FIG. 15, for example, when compared to a normal state (1510), the abnormal state (1520) is that the angle of "NOZZLE 2" vibrates, and the abnormal state (1530) is that the angle of "HEAD 1" vibrates.

[0114] If the variance regarding the angle offset of the component involved in mounting "NOZZLE 1" and the variance regarding the angle offset of the component involved in mounting "NOZZLE 2" are both included within the range of mounting angles according to the mounting standard, all parts of the component mounting device (140) can be determined to be in a normal state. Additionally, as shown in FIG. 16, if the variance regarding the angle offset of the component involved in mounting "NOZZLE 1" is included within the range of mounting angles according to the mounting standard, but the variance regarding the angle offset of the component involved in mounting "NOZZLE 2" is outside the range of mounting angles according to the mounting standard, "NOZZLE 2" of the component mounting device (140) can be determined to be in an abnormal state. In addition, if the variance regarding the angle offset of the component involved in mounting “NOZZLE 1” and the variance regarding the angle offset of the component involved in mounting “NOZZLE 2” both deviate from the range of mounting angles according to the mounting standard by the same amount, “HEAD 1” of the component mounting device (140) may be determined to be in an abnormal state.

[0115] The type of abnormal state of the component mounting device (140) to be described with reference to FIGS. 17 and 18 is a type in which some of the parts of the component mounting device (140) fail to pick up a component. For example, one can assume an abnormal state in which the nozzle of the component mounting device (140) fails to pick up a component. Referring to FIG. 17, for example, compared to a normal state (1710), an abnormal state (1720) is that "NOZZLE 2" fails to pick up a component.

[0116] If the variance regarding the angle offset of the component involved in mounting "NOZZLE 1" and the variance regarding the angle offset of the component involved in mounting "NOZZLE 2" are both included within the range of mounting angles according to the mounting criteria, all parts of the component mounting device (140) can be determined to be in a normal state. Additionally, as shown in FIG. 18, if the variance regarding the angle offset of the component involved in mounting "NOZZLE 1" is included within the range of mounting angles according to the mounting criteria, but the variance regarding the angle offset of the component involved in mounting "NOZZLE 2" is missing, "NOZZLE 2" of the component mounting device (140) can be determined to be in an abnormal state. In addition, if both the variance regarding the angle offset of the component involved in mounting "NOZZLE 1" and the variance regarding the angle offset of the component involved in mounting "NOZZLE 2" are missing, both "NOZZLE 1" and "NOZZLE 2" of the component mounting device (140) may be determined to be in an abnormal state.

[0117] The type of abnormal state of the component mounting device (180) illustrated in FIGS. 17 and 18 may be determined by the number of missing components included in the mounting result information. For example, if there are no missing components of the component involved in mounting "NOZZLE 1" and there are missing components of the component involved in mounting "NOZZLE 2", then "NOZZLE 2" of the component mounting device (140) may be determined to be abnormal state.

[0118] FIG. 19 illustrates a machine learning model (1920) that may be referenced in various embodiments of the present disclosure. The machine learning model (1920) may be learned in a control device (180) in accordance with the manner shown in FIG. 19 and stored in the memory of the control device (180). Additionally, the machine learning model (1920) may be learned outside the control device (180) in accordance with the manner shown in FIG. 19 and then stored in the memory of the control device (180). That is, the location of learning of the machine learning model (1920) is not a factor that limits the scope of the present disclosure.

[0119] A machine learning model (1920) can use the installation result information (1910) and the component state abnormality (1930) as a single training data pair for learning. By securing multiple training data pairs and using them for learning the machine learning model (1920), the derivation of the correlation between the installation result information (1910) and the component state abnormality (1930) can be refined. For learning such a machine learning model (1920), a technique for supervised learning in which an input (e.g., installation result information (1910)) and a corresponding output (e.g., component state abnormality (1930)) are included in the training data may be referenced.

[0120] The machine learning model (1920) can be constructed to dynamically perform the operation of the control device (180). Additionally, the machine learning model (1920) can be constructed to determine the type of abnormal state of the part.

[0121] As described above, the control device (180) can determine an abnormal state of a component constituting the component mounting device (140) based on the statistical trend of the mounting result information measured in the mounting state of the component and the hierarchical relationship of the component mounting device (140). Since such abnormal state of a component can cause a mounting error in the component mounting device (140) or an excessive amount of feedback applied to the component mounting device (140), optimal processing of the component (e.g., stopping feedback to the component involving the component, replacement of the component) can be performed according to the determination of the abnormal state of the component.

[0122] FIG. 20 illustrates a flowchart illustrating a method according to one embodiment of the present disclosure. The flowchart illustrated in FIG. 20 includes an operation to display a dashboard visualizing the status of a plurality of components constituting a component mounting device (140) on a user terminal (190).

[0123] Display information that allows a dashboard visualizing the status of multiple parts to be displayed on the user terminal (190) may be transmitted to the user terminal (190) (S2010). The display information may include, for example, information about a part among the multiple parts that has been determined to be in an abnormal state. Such display information may be information that highlights an indicator of a part determined to be in an abnormal state (e.g., "Nozzle"), for example, as in the summary area (2110) of the dashboard (2100) shown in FIG. 21. As another example, the display information may be information that visualizes detailed information (e.g., offset distribution) of a part determined to be in an abnormal state (e.g., "NOZZLE 1"), for example, as in the part detail area (2120) of the dashboard (2100) in FIG. 21. As another example, the display information may include a hierarchical relationship of a plurality of parts constituting a component mounting device (140), such as the part hierarchy diagram (2210) of the dashboard (2200) of FIG. 22, and may be information that highlights an indicator of a part (e.g., "K14017977") that has been determined to be in an abnormal state.

[0124] According to an embodiment of the present disclosure described with reference to FIGS. 20 to 22, a user can visually check various information regarding a substrate processing process related to surface mount technology. In particular, through a dashboard, the user can visually check various information regarding a component of the component mounting device (140) that has been determined to have a mounting error of the component mounting device (140) or an abnormal state causing excessive feedback applied to the component mounting device (140). By doing so, the user can immediately identify the component of the component mounting device (140) that has been determined to have an abnormal state and quickly proceed with repairing the component.

[0125] For the purposes of the flowcharts of the present disclosure, the operations of the method or algorithm have been described in a sequential order; however, in addition to being performed sequentially, they may be performed in any combination thereof. The description of the flowcharts of the present disclosure does not exclude changes or modifications to the method or algorithm, and does not imply that any operation is essential or desirable. In one embodiment, at least some operations may be performed in parallel, iteratively, or heuristically. In another embodiment, at least some operations may be omitted, or other operations may be added.

[0126] Various embodiments of the present disclosure may be implemented as software on a machine-readable storage medium (MRSM). The software may be software for implementing various embodiments of the present disclosure. Software may be inferred from various embodiments of the present disclosure by programmers skilled in the art to which the present disclosure pertains. For example, the software may be a computer program containing instructions that can be read by a computing device. A computing device is a device capable of operating according to instructions called from a storage medium, and may be referred to interchangeably, for example, as a device or an electronic device. In one embodiment, a processor of a computing device may execute a called instruction to cause components of the computing device to perform functions corresponding to the instruction. A storage medium may refer to any type of recording medium in which information is stored that can be read by a device. A storage medium may include, for example, ROM, RAM, CD-ROM, magnetic tape, floppy disk, or optical information storage device. In one embodiment, the storage medium may be implemented in a distributed form in a networked computer system, etc. In this case, the software may be stored and executed in a distributed manner in a computer system, etc. In another embodiment, the storage medium may be a non-transitory storage medium. A non-transitory storage medium refers to a medium that exists regardless of whether information is stored semi-permanently or temporarily, and does not include signals that are transmitted transitorily.

[0127] Although the technical concept according to the present disclosure has been described by various embodiments above, the technical concept according to the present disclosure includes various substitutions, modifications, and changes that can be made within the scope of understanding of a person skilled in the art to which the present disclosure pertains. Furthermore, it should be understood that such substitutions, modifications, and changes may be included within the scope of the appended claims.

Claims

Claim 1 A device comprising: a communication circuit configured to communicate with a measuring device; one or more processors; and one or more memories storing instructions that cause the one or more processors to perform operations when executed by the one or more processors, wherein the one or more processors obtain first mounting result information from the measuring device, wherein the component mounting device measures the state in which a target component is mounted on a target substrate, and the component mounting device includes a plurality of components having a hierarchical relationship, and the hierarchical relationship is determined by the physical connection relationship between the plurality of components of the component mounting device; wherein, based on the first mounting result information and the hierarchical relationship, at least one of the plurality of components is determined to be in an abnormal state, and the abnormal state indicates a determination that at least one of the plurality of components does not satisfy a predetermined criterion; and wherein, when at least one of the plurality of components is determined to be in an abnormal state, the measuring device controls the measuring device to stop the feedback provided by the measuring device to the component mounting device. Claim 2 In claim 1, the device wherein one or more processors control the measuring device to resume the feedback in response to a signal that a part determined to be in an abnormal state has been repaired. Claim 3 In claim 1, the device wherein one or more processors transmit display information to a user terminal such that a dashboard visualizing the status of the plurality of components is displayed on the user terminal. Claim 4 In paragraph 3, the device, wherein the display information includes information regarding a part determined to be in an abnormal state among the plurality of parts. Claim 5 A device according to claim 1, wherein the one or more processors determine, based on the first mounting result information, an offset between the mounting state of the target component mounted on the target substrate and a predetermined mounting standard, and determine that at least one of the plurality of components is in an abnormal state based on the offset and the hierarchical relationship. Claim 6 A device according to claim 5, wherein the offset comprises at least one of a position offset between the mounting position of the target component and the mounting position indicated by the mounting reference, and an angle offset between the mounting angle of the target component and the mounting angle indicated by the mounting reference. Claim 7 In claim 5, the device comprises one or more processors obtaining second mounting result information for measuring a state in which a component of the same type as the target component is mounted on each of a plurality of substrates having the same layout as the target substrate, determining an offset for each of the same type of component mounted on each of the plurality of substrates based on the second mounting result information, and determining that at least one of the plurality of components is in an abnormal state based on the average of the offset of the target component and the offset of each of the same type of component. Claim 8 In claim 5, the device comprises one or more processors obtaining second mounting result information for measuring a state in which a component of the same type as the target component is mounted on each of a plurality of substrates having the same layout as the target substrate, determining an offset for each of the same type of component mounted on each of the plurality of substrates based on the second mounting result information, and determining that at least one of the plurality of components is in an abnormal state based on the offset of the target component and the offset of each of the same type of component. Claim 9 In claim 5, the device comprises one or more processors obtaining third mounting result information for measuring a state in which a first component and a second component distinct from the first component are mounted on the target substrate, wherein the first component and the second component are components mounted by a target part of the component mounting device, determining an offset of the first component and an offset of the second component based on the third mounting result information, and determining that the target part is in an abnormal state based on the determination that the offset of the first component and the offset of the second component correspond. Claim 10 A device according to claim 1, wherein the one or more memories further store a machine learning model that learns the correlation between the mounting result information and the state abnormality of the component, and the one or more processors determine that at least one of the plurality of components is in a state abnormality based on the machine learning model. Claim 11 A method performed by a device comprising: obtaining first mounting result information from a measuring device, wherein the component mounting device measures the state in which a target component is mounted on a target substrate, wherein the component mounting device includes a plurality of components having a hierarchical relationship, and the hierarchical relationship is determined by the physical connection relationship between the plurality of components of the component mounting device; determining, based on the first mounting result information and the hierarchical relationship, that at least one of the plurality of components is in an abnormal state, wherein the abnormal state indicates a determination that at least one of the plurality of components does not satisfy a predetermined criterion; and controlling the measuring device to stop the feedback provided by the measuring device to the component mounting device when at least one of the plurality of components is determined to be in an abnormal state. Claim 12 A method according to claim 11, further comprising the step of controlling the measuring device to resume the feedback in response to a signal that a part determined to be in an abnormal state has been repaired. Claim 13 A method according to claim 11, further comprising the step of transmitting display information to a user terminal such that a dashboard visualizing the status of the plurality of parts is displayed on the user terminal. Claim 14 In paragraph 13, the above-mentioned display information includes information regarding a part determined to be in an abnormal state among the plurality of parts. Claim 15 A method according to claim 11, wherein the step of determining that at least one of the plurality of components is in an abnormal state comprises: a step of determining, based on the first mounting result information, an offset between the mounting state of the target component mounted on the target substrate and a predetermined mounting standard; and a step of determining that at least one of the plurality of components is in an abnormal state based on the offset and the hierarchical relationship. Claim 16 In claim 15, the step of obtaining the first mounting result information includes the step of obtaining second mounting result information, which measures the state of mounting a component of the same type as the target component on each of a plurality of substrates having the same layout as the target substrate; the step of determining the offset of the target component based on the first mounting result information includes the step of determining the offset for each of the same type components mounted on each of the plurality of substrates based on the second mounting result information; and the step of determining that at least one of the plurality of components is in an abnormal state based on the offset of the target component and the hierarchical relationship includes the step of determining that at least one of the plurality of components is in an abnormal state based on the average of the offset of the target component and the offset of each of the same type components. Claim 17 In claim 15, the step of obtaining the first mounting result information includes the step of obtaining second mounting result information for measuring the state in which a component of the same type as the target component is mounted on each of a plurality of substrates having the same layout as the target substrate; the step of determining the offset of the target component based on the first mounting result information includes the step of determining the offset for each of the same type components mounted on each of the plurality of substrates based on the second mounting result information; and the step of determining that at least one of the plurality of components is in an abnormal state based on the offset of the target component and the hierarchical relationship includes the step of determining that at least one of the plurality of components is in an abnormal state based on the offset of the target component and the variance of the offset of each of the same type components. Claim 18 In claim 15, the step of obtaining the first mounting result information comprises the step of obtaining the third mounting result information for measuring the state in which a first component and a second component distinguished from the first component are mounted on the target substrate - wherein the first component and the second component are components mounted by a target part of the component mounting device - and the step of determining the offset of the target component based on the first mounting result information comprises the step of determining the offset of the first component and the offset of the second component based on the third mounting result information, and the step of determining that at least one of the plurality of components is in an abnormal state based on the offset of the target component and the hierarchical relationship comprises the step of determining that the target part is in an abnormal state based on the determination that the offset of the first component and the offset of the second component correspond. Claim 19 A method according to claim 11, wherein the step of determining that at least one of the plurality of parts is in an abnormal state comprises determining that at least one of the plurality of parts is in an abnormal state based on a machine learning model that has learned the correlation between the mounting result information and the abnormal state of the part. Claim 20 A non-transient computer-readable recording medium having a computer program to be executed by a processor, wherein the computer program is configured to cause the processor to perform a method according to any one of claims 11 to 19 when executed by the processor.

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