Heat dissipation module, electronic device, and heat dissipation method

Abstract

The present application relates to the technical field of electronic devices, and provides a heat dissipation module, an electronic device, and a heat dissipation method. The electronic device can have both a light and thin design and a heat dissipation performance. The heat dissipation module comprises a heat conducting plate, a heat spreader, and a first flow channel. The heat conducting plate is configured for thermally conductive connection to a heat generating element. The heat spreader is located on the side of the heat conducting plate away from the heat generating element and is in thermally conductive connection with the heat conducting plate. The first flow channel is located between the heat conducting plate and the heat spreader, part of an inner wall of the first flow channel is formed by the heat conducting plate, and a cooling medium is provided in the first flow channel.

Description

Heat dissipation module, electronic equipment and heat dissipation method

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office on September 21, 2023, with application number 202311229147.3 and invention name “Heat dissipation module, electronic device and heat dissipation method”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the technical field of electronic products, and in particular to a heat dissipation module, an electronic device, and a heat dissipation method. Background Art

[0003] With the advancement of electronic device technology, users are demanding higher performance from devices like laptops. The heat dissipation capacity of a heat dissipation module directly determines the maximum power consumption of an electronic device, and therefore its performance. To improve heat dissipation performance, the module's size must also increase. This, in turn, occupies a significant amount of space, hindering the slimming and lightweight design of electronic devices.

[0004] Summary of the Invention

[0005] The present application provides a heat dissipation module, an electronic device, and a heat dissipation method. The heat dissipation module can take into account both lightweight design and heat dissipation performance, which is beneficial to improving the performance of the electronic device.

[0006] In a first aspect, the present application provides a heat dissipation module, which includes a heat conducting plate, a heat spreader, and a first flow channel, wherein the heat conducting plate is used for thermally conducting connection with a heating element. The heat spreader is located on a side of the heat conducting plate away from the heating element and is thermally conducting connected with the heat conducting plate. The first flow channel is located between the heat conducting plate and the heat spreader, wherein the heat conducting plate has a first surface facing the heat spreader, the first flow channel extends on the first surface, a portion of the inner wall of the first flow channel is formed by the first surface, and a cooling medium is provided in the first flow channel.

[0007] Compared to separately providing a pipeline to form the first flow channel, the heat conduction path in this embodiment does not need to pass through the pipeline used to form the first flow channel. Part of the heat conducting plate forms the inner wall of the first flow channel, facilitating direct heat conduction between the heat conducting plate and the cooling medium. As a result, the cooling medium can directly absorb heat from the heat conducting plate, reducing thermal resistance and improving heat dissipation efficiency. Furthermore, since part of the inner wall of the first flow channel is formed by the heat conducting plate, only part of the inner wall of the pipeline needs to be separately provided to connect with the heat conducting plate to form the first flow channel. This saves space occupied by the heat dissipation module, facilitates the thinning and miniaturization of the heat dissipation module, and thus facilitates the thinning and miniaturization of electronic devices.

[0008] In a possible implementation of the first aspect, part of the inner wall of the first flow channel is formed by a heat spreader. In this way, the cooling medium in the first flow channel can also be in direct contact with the heat spreader, and the heat of the cooling medium can be directly transferred to the heat spreader, the thermal resistance is also smaller, and the heat dissipation efficiency is improved. Compared with the direct heat conduction connection between the heat conducting plate and the heat spreader, the first flow channel is added between the heat conducting plate and the heat spreader in this embodiment. Under the premise of maintaining the original heat conduction path, the cooling medium in the first flow channel can further absorb heat, thereby improving the heat dissipation effect of the heat dissipation module.

[0009] Compared to separately providing a pipeline to form the first flow channel, the heat conduction path of this embodiment does not need to pass through the pipeline used to form the first flow channel. Part of the heat conducting plate and part of the heat spreader form the inner wall of the first flow channel, allowing direct heat conduction between the cooling medium and the heat conducting plate and heat spreader, thereby reducing thermal resistance. Furthermore, part of the inner wall of the first flow channel is formed by the heat spreader, and only part of the inner wall of the pipeline needs to be separately provided to connect with the heat conducting plate and heat spreader to form the first flow channel. This saves space occupied by the heat dissipation module, facilitates the thinning and miniaturization of the heat dissipation module, and thus facilitates the thinning and miniaturization of electronic devices.

[0010] In one possible implementation of the first aspect, a portion of the inner wall of the first flow channel is formed by a heat spreader. This allows the cooling medium in the first flow channel to directly contact the heat spreader, allowing heat from the cooling medium to be directly transferred to the heat spreader, resulting in lower thermal resistance and improved heat dissipation efficiency.

[0011] In a possible implementation of the first aspect, the heat conducting plate has a first surface facing the heat spreader, the first surface is provided with a first groove, and the opening of the first groove faces the heat spreader. The heat spreader has a second surface facing the heat conducting plate, the second surface covers the opening of the first groove, and forms a first flow channel with the first groove. On the premise that the heat dissipation module is located in the electronic device and occupies the same space, the setting of the first groove can increase the volume of the first flow channel, and thus the volume of the cooling medium in the first flow channel is also larger. During the use of the electronic device, the cooling medium can absorb more heat, which is beneficial to improving the heat dissipation efficiency of the heat dissipation module, and thus improving the performance of the electronic device. On the premise that the volume of the first flow channel is certain, the setting of the first groove can further reduce the space occupied by the heat dissipation module in the electronic device, which is beneficial to the thinning and miniaturization of the heat dissipation module, and thus is beneficial to the thinning and miniaturization of the electronic device.

[0012] In a possible implementation of the first aspect, a second groove is provided on the second surface, and the orthographic projection of the second groove on the first surface overlaps with the first groove, and the first groove and the second groove form a first flow channel. On the premise that the heat dissipation module is located in the electronic device and occupies the same space, the provision of the second groove can increase the volume of the first flow channel, and thus the volume of the cooling medium in the first flow channel is also larger. During the use of the electronic device, the cooling medium can absorb more heat, which is beneficial to improving the heat dissipation efficiency of the heat dissipation module, and thus improving the performance of the electronic device. On the premise that the volume of the first flow channel is certain, the provision of the second groove can further reduce the space occupied by the heat dissipation module in the electronic device, which is beneficial to the thinning and miniaturization of the heat dissipation module, and thus is beneficial to the thinning and miniaturization of the electronic device.

[0013] In one possible implementation of the first aspect, the heat conducting plate has a first surface facing the heat spreader. The heat spreader has a second surface facing the heat conducting plate, the second surface being provided with a second groove, the opening of the second groove facing the heat conducting plate, the first surface covering the opening of the second groove and forming a closed cavity with the second groove, the closed cavity forming the first flow channel.

[0014] In one possible implementation of the first aspect, a second flow channel is formed within the heat conducting plate, and the entire inner wall of the second flow channel is formed by the heat conducting plate. The second flow channel is connected to the first flow channel. In this way, the heat dissipation module absorbs heat by providing multiple sets of flow channels, that is, the first flow channel and the second flow channel absorb heat together, thereby improving the heat dissipation efficiency of the heat dissipation module and thereby improving the performance of the electronic device.

[0015] In one possible implementation of the first aspect, at least a portion of the second flow channel is spaced apart from the first flow channel in the thickness direction of the heat conducting plate. In this way, the heat dissipation module absorbs heat by providing multiple flow channels, that is, the first flow channel and the second flow channel absorb heat together, thereby improving the heat dissipation efficiency of the heat dissipation module and thereby improving the performance of the electronic device.

[0016] In a possible implementation of the first aspect, the heat conducting plate includes a first part and a second part that are stacked, the first part is located on the side of the second part that is away from the heat spreader, the thickness of the first part is greater than or equal to 0.5 microns, and the first flow channel is located on the second part. The heat of the heating element is first conducted to the first part, and the first part conducts the heat to the entire heat conducting plate, that is, the heat is conducted to the second part through the first part, and the second part is used to form the first flow channel and the second flow channel, and the cooling medium in the first flow channel and the second flow channel absorbs heat to achieve heat dissipation. In this way, it is beneficial to improve the efficiency of heat conduction of the heating element, thereby improving the heat dissipation efficiency of the heat dissipation module, and further improving the performance of the electronic device.

[0017] In a possible implementation manner of the first aspect, a thickness of the first portion in the first direction is greater than or equal to 0.5 micrometers.

[0018] In one possible implementation of the first aspect, a third flow channel is formed within the heat spreader, and the third flow channel is connected to the first flow channel. Thus, the heat dissipation module absorbs heat by providing multiple flow channels, that is, the first, second, and third flow channels absorb heat together, thereby improving the heat dissipation efficiency of the heat dissipation module and thereby improving the performance of the electronic device.

[0019] In one possible implementation of the first aspect, the first flow channel is serpentine or spiral. Thus, within a limited volume, the serpentine or spiral flow channel can further increase the volume of the first, second, and third flow channels, further increasing the volume of the cooling medium. Consequently, the heat dissipation efficiency of the heat dissipation module is further improved, which is beneficial for enhancing the performance of the electronic device.

[0020] In one possible implementation of the first aspect, the first flow channel includes a plurality of interconnected sub-segments, each of which extends along an extension path of the heat spreader. Thus, compared to extending the first flow channel in other directions along the heat spreader, extending the first flow channel along the extension path of the heat spreader can increase the length of each sub-segment of the first flow channel, thereby reducing process complexity.

[0021] In a possible implementation of the first aspect, the heat conduction plate further includes a liquid inlet channel and a liquid outlet channel, the liquid inlet channel and the liquid outlet channel are respectively connected to the first flow channel, the liquid inlet channel runs through the first surface and the third surface, and the liquid outlet channel runs through the first surface and the third surface.

[0022] In one possible implementation of the first aspect, the heat dissipation module further includes a drive device configured to drive the circulation of the cooling medium. In this manner, the cooling medium absorbs heat, reducing the heat of the heat conducting plate. Furthermore, the drive device drives the cooling medium to circulate within the first, second, and third flow channels, thereby accelerating heat transfer.

[0023] In one possible implementation of the first aspect, the heat dissipation module further includes a first connecting pipe, there are at least two heat conducting plates, and the first flow channels of adjacent heat conducting plates are connected via the first connecting pipe. In this way, first flow channels are provided on multiple heat conducting plates, and the multiple first flow channels collectively absorb heat from the heat conducting plates, further increasing the total volume of the first flow channels. This also increases the volume of the cooling medium within the first flow channels. The first flow channels collectively absorb more heat, thereby improving the heat dissipation efficiency of the heat dissipation module and, in turn, enhancing the performance of the electronic device.

[0024] In one possible implementation of the first aspect, the heat dissipation module further includes a heat sink, and the heat spreader includes an evaporation section and a condensation section. The evaporation section is thermally connected to the heat conduction plate, and the condensation section is thermally connected to the heat sink. In this way, the first flow channel extends to the heat sink, and the heat sink dissipates heat from the cooling medium in the first flow channel, further improving the heat dissipation efficiency of the heat dissipation module and, thereby, enhancing the performance of the electronic device.

[0025] In a possible implementation of the first aspect, the heat dissipation module further includes a second connecting pipeline, the second connecting pipeline is located between the condensing section and the radiator, and the second connecting pipeline is connected to the first flow channel.

[0026] In a possible implementation of the first aspect, the radiator includes a plurality of radiating fins, which are arranged at intervals, thereby increasing the heat dissipation area of ​​the radiator and further improving the heat dissipation performance of the heat dissipation module, thereby improving the performance of the electronic device.

[0027] In one possible implementation of the first aspect, the heat dissipation module further includes a fan, and the heat sink is located at the fan outlet. This allows the airflow from the fan outlet to directly flow toward the heat dissipation holes after exchanging heat with the heat sink, thereby reducing flow resistance and facilitating noise reduction in the heat dissipation module. This also improves the heat exchange efficiency between the airflow and the heat sink, further enhancing the heat dissipation performance of the heat dissipation module.

[0028] In a second aspect, the present application further provides a heat dissipation module, which includes a heat conducting plate, a heat spreader, and a first flow channel. The heat conducting plate is used for thermally conducting connection with the heating element. The heat spreader is located on the side of the heat conducting plate away from the heating element and is thermally conducting connection with the heat conducting plate. The first flow channel is located between the heat conducting plate and the heat spreader, and a portion of the inner wall of the first flow channel is formed by the heat spreader. A cooling medium is provided in the first flow channel.

[0029] In a third aspect, the present application further provides an electronic device comprising a housing, a heating element, and the aforementioned heat dissipation module, wherein the housing has a storage space. The heating element is disposed within the storage space. A heat conduction plate of the heat dissipation module is thermally connected to the heating element.

[0030] In a possible implementation of the third aspect, the electronic device further includes a circuit board, the heating element is disposed on the circuit board, and the heating device includes a CPU and a GPU.

[0031] In a fourth aspect, the present application further provides a heat dissipation method, which is applied to the above-mentioned electronic device, and includes:

[0032] When the electronic device enters the overclocking mode, the driving device is controlled to be turned on, and the driving device drives the cooling medium to flow in the first flow channel;

[0033] Obtaining a first temperature, where the first temperature is a temperature of one of the accommodation space, the heating element, the heat conducting plate, and the heat spreader;

[0034] determining whether the first temperature reaches a threshold temperature;

[0035] If the first temperature is lower than the threshold temperature, the driving device stops working; if the first temperature is higher than the threshold temperature, the driving device continues working.

[0036] In a possible implementation of the fourth aspect, the threshold temperature is greater than or equal to 50 degrees and less than or equal to 80 degrees. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] FIG1 is a schematic diagram of the structure of an electronic device provided in some embodiments of the present application;

[0038] FIG2 is a perspective view of a keyboard host of the electronic device shown in FIG1 ;

[0039] FIG3 is a cross-sectional view taken along line AA of the perspective view shown in FIG2 ;

[0040] FIG4 is a schematic structural diagram of the heat dissipation module when the keyboard host 2 shown in FIG3 is viewed from the F1 direction;

[0041] FIG5 a is a schematic structural diagram of the heat conduction structure in the heat dissipation module shown in FIG4 ;

[0042] FIG5 b is a schematic structural diagram of a heat conducting plate in the heat conducting structure shown in FIG5 a ;

[0043] FIG5c is a schematic structural diagram of some further heat-conducting structures provided by some embodiments of the present application;

[0044] FIG6 is a cross-sectional view taken along line BB in FIG5a;

[0045] FIG7 is a schematic structural diagram of a heat dissipation module provided in some embodiments of the present application;

[0046] FIG8 is a schematic structural diagram of the liquid cooling device shown in FIG7 taken along line CC;

[0047] FIG9 is a schematic structural diagram of another heat conducting plate of the heat dissipation module shown in FIG5a;

[0048] FIG10 is a schematic structural diagram of another heat conducting plate of the heat dissipation module shown in FIG5a;

[0049] FIG11 is a schematic structural diagram of another heat spreader of the heat dissipation module shown in FIG5a;

[0050] FIG12 is a schematic structural diagram of another heat conducting plate of the heat dissipation module shown in FIG5a;

[0051] FIG13 is a front view of the heat conducting plate of the heat dissipation module shown in FIG5a;

[0052] FIG14 is a schematic structural diagram of another heat spreader of the heat dissipation module shown in FIG5a;

[0053] FIG15a is a schematic structural diagram of another heat conducting plate of the heat dissipation module shown in FIG5a;

[0054] FIG15b is a schematic structural diagram of another heat conducting plate of the heat dissipation module shown in FIG5a;

[0055] FIG15c is a schematic structural diagram of another heat conducting plate of the heat dissipation module shown in FIG5a;

[0056] FIG15d is a schematic structural diagram of a heat dissipation module provided in yet other embodiments of the present application;

[0057] FIG16a is a schematic structural diagram of another heat conducting plate of the heat dissipation module shown in FIG5a;

[0058] FIG16 b is a schematic structural diagram of the back side of one of the heat conducting plates shown in FIG16 a ;

[0059] FIG16c is a schematic diagram of the structure of the connection between the heat conducting plate and the driving device in some embodiments of the present application;

[0060] FIG16d is a schematic structural diagram of another heat conducting plate of the heat dissipation module shown in FIG5a;

[0061] FIG17 is a schematic structural diagram of the heat sink in the heat dissipation module shown in FIG4 ;

[0062] FIG18 is a schematic structural diagram of the fan in the heat dissipation module shown in FIG4 ;

[0063] FIG19 is a comparison diagram of the temperature rise time for the CPU to reach the limit temperature when the electronic device of the present application has the above-mentioned heat dissipation module and when it does not.

[0064] BRIEF DESCRIPTION OF THE DRAWINGS 100. Electronic device; 1. Display; 2. Keyboard host; 21. Housing; 21a. Accommodating space; 211. Housing C; 212. Housing D; 22. Middle plate; 23. Keyboard; 231. Fixing plate; 232. Keys; 24. Mainboard; 25. Heat dissipation module; 251. Heat conduction structure; 2511. Heat conduction plate; 2511a. First surface; A1. First area; A2. Second area; a. First portion; b. Second portion; 2511b. Third surface; 2511c. First groove; 2511c. First heat conduction plate; 2511d. Second heat conduction plate; 2511e. First connecting pipe; 2511f. Third area; 2511g. Fourth area; 2511h. Step; 2512, heat spreader; 2512a, tube shell; 2512b, wick; 2512c, end cap; 2512d, evaporation section; 2512e, condensation section; 2512f, condensation section; 2512g, working liquid; 2512h, second surface; 2512i, second groove; C, third region; D, fourth region; 252, radiator; 252a, heat dissipation substrate; 252b, heat dissipation fins; 252c, heat dissipation channel; 253, fan; 2531, fan outlet; 26, first flow channel; 26a, liquid inlet; 26b, liquid outlet; 26c, subsection; 261, second flow channel; 263, third flow channel; 27, liquid cooling device; 271, pipeline; 272, flow channel; 273, Cooling medium; 28. Driving device; 281. Inlet; 282. Outlet; 283. Liquid inlet pipeline; 284. Liquid outlet pipeline; 3. Heating element. DETAILED DESCRIPTION

[0065] In the embodiments of this application, the terms "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature specified as "first," "second," "third," or "fourth" may explicitly or implicitly include one or more of the features.

[0066] In the embodiments of the present application, the terms "comprises," "comprising," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, method, article, or apparatus comprising a series of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not preclude the presence of other identical elements in the process, method, article, or apparatus comprising the element.

[0067] In the embodiments of this application, "and / or" is simply a description of the association relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three situations: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this document generally indicates that the related objects are in an "or" relationship.

[0068] The present application provides an electronic device, which is a type of electronic device having a heat dissipation module. Specifically, the electronic device includes, but is not limited to, mobile phones, tablet personal computers, laptop computers, personal digital assistants (PDAs), personal computers, notebook computers, vehicle-mounted devices, and wearable devices.

[0069] Please refer to FIG1 , which is a schematic diagram of the structure of an electronic device 100 provided in some embodiments of the present application. In this embodiment, the electronic device 100 is a laptop computer. Specifically, the electronic device 100 includes a display 1 and a keyboard host 2 .

[0070] Display 1 is used to display images and videos. Keyboard host 2 is rotatably connected to display 1. Keyboard host 2 is used to input commands and data and, based on the input commands and data, controls display 1 to display images and videos. Keyboard host 2 is also used to play voice or music.

[0071] The electronic device 100 can be switched between an open state and a closed state. When the electronic device 100 is in the open state, the display 1 and the keyboard host 2 form an angle greater than 0° and less than 180°. When the electronic device 100 is in the closed state, the display 1 covers the keyboard host 2, and the display surface of the display 1 faces the keyboard surface of the keyboard host 2.

[0072] To facilitate the description of the following embodiments, an XYZ coordinate system is established for the keyboard host 2. Specifically, the direction extending from the axis of rotation between the keyboard host 2 and the display 1 is defined as the X-axis direction, the thickness direction of the keyboard host 2 is defined as the Z-axis direction, and the direction perpendicular to both the X-axis and the Z-axis is defined as the Y-axis direction. It is understood that the coordinate system of the keyboard host 2 can be flexibly configured according to actual needs and is not specifically limited here.

[0073] Please refer to Figure 2, which is a perspective view of the keyboard host 2 of the electronic device 100 shown in Figure 1. Figure 3 is a cross-sectional view taken along line AA of the perspective view shown in Figure 2. It should be noted that "line AA" refers to the plane on which line AA lies. The following descriptions of similar figures should be understood in the same way and will not be repeated here. In this embodiment, the keyboard host 2 includes a housing 21, a mid-plate 22, a keyboard 23, a mainboard 24, and a heat dissipation module 25.

[0074] It should be noted that FIG. 2 and FIG. 3 only schematically illustrate some components included in the keyboard host 2 , and the actual shape, actual size, actual position and actual structure of these components are not limited by FIG. 2 and FIG. 3 and the following figures.

[0075] The housing 21 is used to protect the internal structure of the keyboard host 2. The housing 21 can be a single, integral structure or assembled from multiple parts. In some embodiments, referring to Figures 2-3, the housing 21 includes a C-shell (palm rest cover) 211 and a D-shell (bottom cover) 212. The C-shell 211 and the D-shell 212 mate to form an internal accommodating space 21a of the housing 21. The C-shell 211 and the D-shell 212 can be secured together by snapping, gluing, or threading, without further limitation.

[0076] The middle plate 22 is located within the internal accommodation space 21a of the housing 21. It is secured to the inner surface of the C-shell 211 by gluing, snapping, threading, riveting, or other methods. In other embodiments, the middle plate 22 can also be secured to the inner surface of the D-shell 212. The materials of the middle plate 22 include, but are not limited to, plastic and metal. The middle plate 22 serves as a supporting "frame" for the electronic components within the keyboard host 2. The keyboard 23 and heat dissipation module 25 are secured to the middle plate 22 directly or indirectly.

[0077] The keyboard 23 is used to input commands and data. The keyboard 23 includes a fixing plate 231 and a plurality of keys 232 connected to the fixing plate 231. Referring to FIG. 3 , the fixing plate 231 is fixed to the middle plate 22.

[0078] The motherboard 24 is used to integrate control chips. The control chips may include a central processing unit (CPU), a graphics processing unit (GPU), an application processor (AP), double data rate synchronous dynamic random access memory (DDR), and universal flash storage (UFS).

[0079] The heat dissipation module 25 is disposed within the accommodation space 21a. It is used to dissipate heat from the heating elements 3 within the electronic device 100 to ensure normal operation of the electronic device 100. For example, the heating elements 3 may include, but are not limited to, the CPU and GPU on the motherboard 24, and various chips within the electronic device 100. In other words, the heat dissipation module 25 can be used to cool at least one of the CPU, GPU, and various chips within the electronic device 100. Referring to Figure 3, the heat dissipation module 25 is fixed to the motherboard 24 and is thermally conductively connected to the CPU, GPU, and various chips.

[0080] The heat dissipation module 25 is described in detail below.

[0081] Please refer to Figure 4, which is a structural diagram of the heat dissipation module 25 when the keyboard host 2 shown in Figure 3 is viewed from the F1 direction. The heat dissipation module 25 includes a heat-conducting structure 251 and a radiator 252. The heat-conducting structure 251 is connected to the heating element 3 by thermal conduction. Specifically, the heat-conducting structure 251 and the heating element 3 can be connected by welding, bonding, screw connection, rivet connection, etc. The heat-conducting structure 251 and the heating element 3 can be connected by thermal conduction by direct contact. A heat transfer structure can also be provided between the heat-conducting structure 251 and the heating element 3 to achieve heat conduction connection, wherein the heat transfer structure can be thermal grease, thermal adhesive, etc. This embodiment and the following embodiments are described by taking the example that the heat-conducting structure 251 and the heating element 3 can be connected by thermal conduction by direct contact. The heat-conducting structure 251 is used to conduct the heat of the heating element 3 to the radiator 252. In this way, when the electronic device 100 is running, the heat generated by the heating element 3 can be transferred to the radiator 252 through the heat-conducting structure 251 , and then the heat is discharged to the outside of the electronic device 100 through the radiator 252 .

[0082] Please refer to Figure 4 and Figure 5a together. Figure 5a is a structural diagram of the heat-conducting structure 251 in the heat dissipation module 25 shown in Figure 4. The heat-conducting structure 251 includes a heat-conducting plate 2511 and a heat-splitting member 2512. The heat-conducting plate 2511 is thermally connected to the heating element 3, and the heat-conducting plate 2511 is thermally connected to the heat-splitting member 2512. Optionally, the material of the heat-conducting plate 2511 can be metal. Specifically, the material of the heat-conducting plate 2511 can be silver, copper, aluminum, zinc, etc., and the above materials all have good thermal conductivity. In this embodiment, the material of the heat-conducting plate 2511 is copper for illustration, but this is not a special limitation of the present application. Metal copper has good thermal conductivity and high ductility. Using metal copper material to prepare the heat conducting plate 2511 can ensure the thermal conductivity of the heat conducting plate 2511 while making the heat conducting plate 2511 thinner, reducing the space occupied by the heat conducting plate 2511, and taking into account both the heat dissipation efficiency and the lightweight design of the electronic device 100.

[0083] Please continue to refer to Figure 5a. The heat conducting plate 2511 can be formed into a sheet structure. The heat conducting plate 2511 can be a square, oval, circular, runway-shaped, special-shaped structure. The present application does not limit the specific shape of the heat conducting plate 2511. The heating element 3 includes a fourth surface, and the fourth surface faces the heat conducting plate 2511. The fourth surface is in direct contact with the heat conducting plate 2511 to achieve a heat conduction connection between the heating element 3 and the heat conducting plate 2511. The orthographic projection of the heating element 3 on the plane where the heat conducting plate 2511 is located can be located within the heat conducting plate 2511 to ensure that all fourth surfaces can be in direct contact with the heat conducting plate 2511. In this way, it can be ensured that there is sufficient contact area between the heating element 3 and the heat conducting plate 2511, so that the heat on the heating element 3 can be quickly transferred to the radiator 252 through the heat conducting structure 251, which is conducive to improving the heat dissipation efficiency.

[0084] The heat conducting plate 2511 can be fixed on the mainboard 24 and thermally connected to the CPU, GPU, etc. on the mainboard 24. Please continue to refer to Figure 5a. The heat conducting plate 2511 includes a first surface 2511a and a third surface 2511b facing each other. The heat conducting plate 2511 is located between the heating element 3 and the heat spreader 2512, with the first surface 2511a facing the heat spreader and the third surface 2511b facing the heating element 3. The heat conducting plate 2511 is thermally connected to the heat spreader 2512 and the heating element 3 respectively. Exemplarily, the heat conducting plate 2511 can be fixed to the mainboard 24 by gluing, clamping, threading, etc.

[0085] Multiple heat conducting plates 2511 may be provided, and the number of heat conducting plates 2511 is determined by the number and positions of the heating elements 3. The heat dissipation module 25 shown in FIG5a has two heat conducting plates 2511, which are spaced apart within the accommodation space and positioned according to the positions of the heating elements 3. However, this is not a specific limitation of the present application; in other embodiments, the number of heat conducting plates 2511 may also be three, four, five, or the like.

[0086] Please refer to Figure 5b, which is a schematic diagram of the structure of the heat conducting plate 2511 in the heat conducting structure 251 shown in Figure 5a. Taking one of the heat conducting plates 2511 as an example, as described above, in order to improve the thermal conductivity efficiency between the heating element 3 and the heat conducting plate 2511, the heating element 3 and the heat conducting plate 2511 are connected by direct contact to achieve thermal conduction. Due to the different thicknesses of different heating elements 3, after the heat conducting plate 2511 contacts the fourth surface of the heating element 3, the various parts of the heat conducting plate 2511 are in different planes. In other words, the various parts of the heat conducting plate 2511 have different heights on the Z axis. Therefore, the heat conducting plate 2511 is not an absolutely flat plate-like structure.

[0087] Specifically, after the heat conducting plate 2511 contacts the heating element 3, the heat conducting plate 2511 may include a third region 2511f and a fourth region 2511g, depending on the height of the heat conducting plate 2511 in the Z-axis direction. The third region 2511f contacts the thinner heating element 3, while the fourth region 2511g contacts the thicker heating element 3, forming a height difference between the third region 2511f and the fourth region 2511g. The heat conducting plate 2511 also includes a step portion 2511h, which is provided between the third region 2511f and the fourth region 2511g to connect the regions of the heat conducting plate 2511 at different heights into one.

[0088] Referring to Figures 4 and 5a , the heat spreader 2512 includes an evaporation section 2512d and a condensation section 2512f. The condensation sections 2512f are located at opposite ends of the evaporation section 2512d in the direction in which the evaporation section 2512d extends. The evaporation section 2512d is thermally connected to the heat conducting plate 2511, while the condensation section 2512f is thermally connected to the heat sink 252. Specifically, the orthographic projection of the evaporation section 2512d in the Z-axis direction overlaps with the heat conducting plate 2511, while the orthographic projection of the condensation section 2512f in the Z-axis overlaps with the heat sink 252. This allows heat from the heating element 3 to be transferred to the heat conducting plate 2511, heat from the heat conducting plate 2511 to the evaporation section 2512d of the heat spreader 2512, heat from the evaporation section 2512d to the condensation section 2512f, and finally to the heat sink 252 via the condensation section 2512f, thereby improving heat dissipation efficiency.

[0089] Figure 5a illustrates an example where two heat conducting plates 2511 and two heat spreaders 2512 are provided. Please refer to Figure 5c for a schematic diagram of another heat conducting structure 251 provided in some embodiments of the present application. The heat conducting structure 251 in Figure 5c includes only one heat spreader 2512 and one heat conducting plate 2511. This prevents the heat dissipation module 25 from occupying too much space, contributing to a slimmer and lighter electronic device 100.

[0090] The heat spreader 2512 can be a heat pipe or a heat spreader. In some embodiments, please refer to Figure 6, which is a cross-sectional view along line BB in Figure 5a. In this embodiment, the heat spreader is a heat pipe. The heat pipe includes a tube shell 2512a, a wick 2512b, and an end cap 2512c. The tube shell 2512a is formed into a hollow structure, and the wick 2512b covers the inner wall of the tube shell 2512a. After the tube is evacuated to a negative pressure, it is filled with an appropriate amount of working liquid. After the capillary porous material of the wick close to the inner wall of the tube is filled with liquid, it is sealed by the end cap 2512c. When one end of the heat pipe (i.e., the evaporation section) is heated, the liquid in the wick evaporates and vaporizes. The vapor flows to the other end (i.e., the condensation section) under a slight pressure difference, releases heat, and condenses into liquid. The liquid then flows back to the evaporation section along the porous material under the action of capillary force. This cyclic operation achieves a rapid heat transfer effect and evenly distributes the heat to the heat sink 252 , and then dissipates the heat through the air, thereby improving the heat dissipation efficiency of the electronic device 100 to a certain extent.

[0091] In some embodiments, referring to FIG6 , the heat pipe is formed as a flat tube. "Flat tube" refers to a sheet or plate-shaped heat pipe. That is, the heat pipe is thin in the thickness direction, i.e., the Z-axis direction in FIG6 . This reduces the space occupied by the heat pipe in the Z-axis direction, facilitating the thinner and lighter design of electronic devices.

[0092] In other embodiments, the heat spreader 2512 can also be a heat spreader plate. The heat spreader 2512 is a vacuum cavity with a microstructure on the inner wall. The heat spreader 2512 is made of copper, and the vacuum cavity is filled with coolant. When heat is conducted from the heat source to the evaporation section, the coolant in the vacuum cavity begins to vaporize after being heated in a low vacuum environment. At this time, it absorbs heat energy and expands rapidly in volume. The gaseous cooling medium quickly fills the entire vacuum cavity. When the gaseous working medium contacts a relatively cold area, condensation will occur. The heat accumulated during evaporation is released through the condensation phenomenon. The condensed coolant will return to the evaporation heat source through the capillary channels of the microstructure. This operation will be repeated in the cavity to achieve a rapid heat transfer effect and evenly distribute it to the radiator 252. The heat energy is then dissipated through the air, thereby improving the heat dissipation efficiency of the electronic device to a certain extent.

[0093] To further improve the heat dissipation effect of the electronic device 100, the heat dissipation module 25 may further include a liquid cooling device 27. The heat dissipation effect of the heat dissipation module 25 is improved by adding the liquid cooling device 27. Specifically, the liquid cooling device 27 can be thermally connected to the heating element 3 and can also be thermally connected to the heat conducting plate 2511, directly or indirectly absorbing heat from the heating element 3, thereby improving the heat dissipation effect of the heat dissipation module 25 and further improving the performance of the electronic device 100.

[0094] The liquid cooling device 27 is further introduced below. Please refer to Figures 7 and 8. Figure 7 is a structural schematic diagram of the heat dissipation module 25 provided in some embodiments of the present application. Figure 8 is a structural schematic diagram of the liquid cooling device 27 shown in Figure 7 cut along the CC line. For example, the liquid cooling device 27 can be thermally connected to the heat conducting plate 2511. Specifically, the liquid cooling device 27 can be in contact with the first surface 2511a of the heat conducting plate 2511 and fixed to the heat conducting plate 2511. The liquid cooling device 27 can be fixed to the heat conducting plate 2511 by welding, bonding, or detachable connection. The liquid cooling device 27 may include a pipeline 271 and a flow channel 272 arranged in the pipeline 271. The flow channel 272 is provided with a cooling medium 273, and the heat of the heating element 3 is directly or indirectly absorbed through the cooling medium 273.

[0095] The liquid cooling device 27 can be used continuously when the electronic device 100 is in normal working state, or it can be used only in high-power working mode. It should be noted that the "high-power working mode" here means that in this working mode, the electronic device 100 instantly increases the power consumption of the CPU in order to improve the computing power of the CPU, thereby improving the performance of the electronic device 100. The instantaneous increase in the power consumption of the CPU by the electronic device 100 will cause the temperature of the chip to rise rapidly. When the temperature of the electronic device 100 reaches the limit temperature, the electronic device 100 stops the high-power working mode. Under the temperature limit, the high-power working mode of the electronic device 100 is short, which affects the performance of the electronic device 100. For example, the high-power working mode can be the overclocking mode of the electronic device 100. The "overclocking mode" means that the electronic device 100 increases the operating frequency of the CPU and the graphics card and operates at a higher frequency state to increase the working speed of the computer.

[0096] In the high power consumption working mode, the liquid cooling device 27 can delay the time taken for the temperature of the electronic device 100 to rise to the limit temperature, thereby extending the time the electronic device 100 is in the high power consumption working mode and improving the performance of the electronic device 100.

[0097] It is worth noting that the above examples only illustrate the operating effects of the liquid cooling device 27 when the electronic device 100 is in a high-power operating mode, but this does not constitute a specific limitation on this application. In other words, the liquid cooling device 27 can also be used in other operating modes of the electronic device 100. The liquid cooling device 27 can further improve the heat dissipation effect of the electronic device 100, thereby improving the operating performance of the electronic device 100.

[0098] However, the liquid cooling device 27 disposed on the heat conducting plate 2511 will occupy a portion of the storage space 21a of the electronic device 100, that is, the portion of the liquid cooling device 27 protruding from the first surface 2511a. As electronic devices 100 become thinner and smaller, the storage space 21a of the electronic device 100 is also becoming smaller and smaller, making it more difficult to install the liquid cooling device 27 in a smaller storage space 21a. If the storage space 21a is increased to reduce the installation difficulty of the liquid cooling device 27, the thinning and miniaturization requirements of the electronic device 100 cannot be met. In addition, the heat conduction path of the heat from the heating element 3 to the liquid cooling device 27 is as follows: the heat from the heating element 3 is first conducted to the heat conducting plate 2511, and the heat from the heat conducting plate 2511 is then conducted to the pipe 271 of the liquid cooling device 27. After passing through the inner wall of the pipe 271, the heat is conducted to the cooling medium 273 inside the pipe 271, and the cooling medium 273 absorbs the heat from the heating element 3. During the heat conduction process described above, heat must pass through multiple components, increasing the thermal resistance involved. Thermal resistance refers to the resistance encountered when heat is transferred through an object through conduction, also known as thermal resistance. The greater the thermal resistance, the less efficient the heat transfer.

[0099] In order to solve the above problems, please refer to Figure 9, which is a structural schematic diagram of another heat conducting plate 2511 of the heat dissipation module 25 shown in Figure 5a. The present application also provides a heat dissipation module 25. The difference between the heat dissipation module 25 in this embodiment and the above-mentioned heat dissipation module 25 is that the heat dissipation module 25 in this embodiment also includes a first flow channel 26. Specifically, the heat dissipation module 25 includes a heat conducting plate 2511, a heat equalizing member 2512 and a first flow channel 26, and the heat conducting plate 2511 is used for thermal conduction connection with the heating element 3. The heat equalizing member 2512 is located on the side of the heat conducting plate 2511 away from the heating element 3, and is thermally connected to the heat conducting plate 2511. The position, shape and structural construction of the heat equalizing member 2512 and the heat conducting plate 2511 are consistent with the above-mentioned heat equalizing member 2512 and the heat conducting plate 2511, and will not be repeated here.

[0100] The first flow channel 26 is located between the heat conducting plate 2511 and the heat spreader 2512, with a portion of the inner wall of the first flow channel 26 formed by the heat conducting plate 2511. The first flow channel 26 extends above the first surface 2511a, and a cooling medium 273 is disposed within the first flow channel 26. Compared to a method in which a separate pipe 271 is provided to form the first flow channel 26, the heat conduction path of this embodiment does not need to pass through the pipe 271 used to form the first flow channel 26. Instead, a portion of the heat conducting plate 2511 forms the inner wall of the first flow channel 26, facilitating direct heat conduction between the heat conducting plate 2511 and the cooling medium 273. Consequently, the cooling medium 273 can directly absorb heat from the heat conducting plate 2511, resulting in lower thermal resistance and improved heat dissipation efficiency. Furthermore, part of the inner wall of the first flow channel 26 is formed by the heat conducting plate 2511, and only part of the inner wall of the pipeline 271 needs to be separately set to connect with the heat conducting plate 2511 to form the first flow channel 26, thereby saving the space occupied by the heat dissipation module 25, which is beneficial to the thinning and miniaturization of the heat dissipation module 25, and further beneficial to the thinning and miniaturization of the electronic device 100.

[0101] The cross-section of the first flow channel 26 can be circular, elliptical, square, triangular, or a special shape, etc. This application uses a circular cross-section of the first flow channel 26 as an example for description, but this does not constitute a special limitation on this application. The cooling medium 273 can be pure water, deionized water, an ethylene (propylene) glycol aqueous solution, etc. This application uses pure water as an example for description, but this does not constitute a special limitation on this application.

[0102] In some embodiments, based on the above embodiments, part of the inner wall of the first flow channel 26 is also formed by the heat equalizer 2512. In this way, the cooling medium 273 in the first flow channel 26 can also be in direct contact with the heat equalizer 2512, and the heat of the cooling medium 273 can be directly transferred to the heat equalizer 2512, so the thermal resistance is also smaller, and the heat dissipation efficiency is improved. Compared with the heat conduction plate 2511 being directly connected to the heat equalizer 2512 by thermal conduction, the first flow channel 26 is added in this embodiment and is arranged between the heat conduction plate 2511 and the heat equalizer 2512. Under the premise of maintaining the original heat conduction path, the cooling medium 273 in the first flow channel 26 can further absorb heat, thereby improving the heat dissipation effect of the heat dissipation module 25.

[0103] Compared to separately providing the pipe 271 to form the first flow channel 26, the heat conduction path of this embodiment does not need to pass through the pipe 271 used to form the first flow channel 26. Part of the heat conducting plate 2511 and part of the heat spreader 2512 form the inner wall of the first flow channel 26, so that the cooling medium 273 can directly conduct heat with the heat conducting plate 2511 and the heat spreader 2512. As a result, the thermal resistance is lower. Furthermore, part of the inner wall of the first flow channel 26 is formed by the heat spreader 2512, and only part of the inner wall of the pipe 271 needs to be separately provided to connect with the heat conducting plate 2511 and the heat spreader 2512 to form the first flow channel 26. This saves space occupied by the heat dissipation module 25, facilitates the thinning and miniaturization of the heat dissipation module 25, and further facilitates the thinning and miniaturization of the electronic device 100.

[0104] The specific structure and arrangement of the first flow channel 26 are described in detail below.

[0105] In some embodiments, referring to FIG. 9 , the heat conducting plate 2511 has a first surface 2511a facing the heat spreader 2512, and a third surface 2511b opposite the first surface 2511a. The first surface 2511a is provided with a first groove 2511c. The first groove 2511c is formed by a depression of the first surface 2511a in a direction proximate to the third surface 2511b. The opening of the first groove 2511c is located on the first surface 2511a and faces the heat spreader 2512. The opening of the first groove 2511c is sealed to form a first flow channel 26. The first groove 2511c can be formed by etching, machining, or the like.

[0106] Please refer to Figure 10, which is a structural schematic diagram of another heat spreader 2512 of the heat dissipation module 25 shown in Figure 5a. The heat spreader 2512 has a second surface 2512h facing the heat conducting plate 2511, and the second surface 2512h covers the opening of the first groove 2511c and forms a closed cavity with the first groove 2511c, and the closed cavity forms the first flow channel 26. The heat spreader 2512 can be welded to the first surface 2511a to form the first flow channel 26 by closing the opening of the first groove 2511c. The welding method can adopt welding methods such as laser welding, resistance welding, and brazing. In this embodiment, the brazing welding method can be adopted. The brazing technology is to use a material with a lower melting point than the base material as a brazing material, heat the weldment and the brazing material to a temperature higher than the melting point of the brazing material but lower than the melting temperature of the base material (so that the base material remains in a solid state), and use the wetting effect of the liquid brazing material to fill the joint gap. In this way, the problem of deformation of the heat conducting plate 2511 caused by high temperature during the welding process can be avoided.

[0107] Under the premise that the heat dissipation module 25 occupies the same space within the electronic device 100, the provision of the first groove 2511c can increase the volume of the first flow channel 26, thereby increasing the volume of the cooling medium 273 within the first flow channel 26. During use of the electronic device 100, the cooling medium 273 can absorb more heat, which helps improve the heat dissipation efficiency of the heat dissipation module 25 and thus improve the performance of the electronic device 100. Under the premise that the volume of the first flow channel 26 is constant, the provision of the first groove 2511c can further reduce the space occupied by the heat dissipation module 25 within the electronic device 100, which helps to reduce the thickness and miniaturization of the heat dissipation module 25, and thus the thinness and miniaturization of the electronic device 100.

[0108] Please refer to Figure 11, which is a schematic diagram of the structure of another heat spreader 2512 of the heat dissipation module 25 shown in Figure 5a. In some embodiments, the heat spreader 2512 includes a second surface 2512h facing the first surface 2511a. The second surface 2512h is provided with a second groove 2512i. The orthographic projection of the second groove 2512i on the first surface 2511a overlaps with the first groove 2511c. The first groove 2511c and the second groove 2512i form a closed cavity, which forms the first flow channel 26. The "overlap" here includes the following four situations: first, a part of the orthographic projection of the second groove 2512i on the first surface 2511a overlaps with a part of the first groove 2511c; second, a part of the orthographic projection of the second groove 2512i on the first surface 2511a overlaps with the entire first groove 2511c; third, the entire orthographic projection of the second groove 2512i on the first surface 2511a overlaps with a part of the first groove 2511c; fourth, the orthographic projection of the second groove 2512i on the first surface 2511a completely overlaps with the first groove 2511c.

[0109] The cross-section of the first groove 2511c can be square, semicircular, trapezoidal, etc., and the cross-section of the second groove 2512i can be square, semicircular, trapezoidal, etc. The cross-section of the first groove 2511c and the cross-section of the second groove 2512i can be the same or different. In this embodiment, the cross-section of the first groove 2511c is consistent with the cross-section of the second groove 2512i as an example for explanation. The cross-section of the first groove 2511c is semicircular, and the diameter of the cross-section of the first groove 2511c is equal to the diameter of the cross-section of the second groove 2512i. This is only an exemplary description and is not a special limitation of this application. The first surface 2511a is welded to the second surface 2512h to seal the first groove 2511c and the second groove 2512i to prevent the cooling medium 273 in the first groove 2511c and the second groove 2512i from leaking out.

[0110] Under the premise that the heat dissipation module 25 occupies the same space within the electronic device 100, the provision of the second groove 2512i can increase the volume of the first flow channel 26, thereby increasing the volume of the cooling medium 273 within the first flow channel 26. During use of the electronic device 100, the cooling medium 273 can absorb more heat, which helps improve the heat dissipation efficiency of the heat dissipation module 25 and thus improve the performance of the electronic device 100. Under the premise that the volume of the first flow channel 26 is constant, the provision of the second groove 2512i can further reduce the space occupied by the heat dissipation module 25 within the electronic device 100, which helps to reduce the thickness and miniaturization of the heat dissipation module 25, and thus the thinness and miniaturization of the electronic device 100.

[0111] It is worth noting that the second groove 2512i of this embodiment can be a further improvement on the above embodiment and can also be used as a separate embodiment. When used as a separate embodiment, the heat conducting plate 2511 can be provided with no first groove 2511c, and the heat conducting plate 2511 can directly cover the second groove 2512i of the heat spreader 2512 to form the first flow channel 26.

[0112] Please refer to Figure 12, which is a schematic diagram of the structure of another heat conducting plate 2511 of the heat dissipation module 25 shown in Figure 5a. In some embodiments, a second flow channel 261 is formed in the heat conducting plate 2511, and the second flow channel 261 is connected to the first flow channel 26. The first surface 2511a includes a first area A1 and a second area A2 connected to the first area A1. The first area A1 is the area opposite the first surface 2511a and the second surface 2512h. In other words, the orthographic projection of the first area A1 on the second surface 2512h is located within the second surface 2512h. Specifically, the first area A1 can be the area of ​​the first surface 2511a that is in contact with the second surface 2512h. The first flow channel 26 is disposed in the first area A1. In some embodiments, the second flow channel 261 is disposed in the heat conducting plate 2511 opposite the second area A2. In other words, the orthographic projection of the second flow channel 261 on the second surface 2512h is located within the second area A2. In this way, the heat dissipation module 25 absorbs heat by setting up multiple groups of flow channels 272, that is, the first flow channel 26 and the second flow channel 261 absorb heat together, thereby improving the heat dissipation efficiency of the heat dissipation module 25 and further improving the performance of the electronic device 100.

[0113] Please refer to Figure 13, which is a front view of the heat conducting plate 2511 of the heat dissipation module 25 shown in Figure 5a. In some other embodiments, in the thickness direction of the heat conducting plate 2511, that is, the Z-axis direction in Figure 13, at least a portion of the second flow channel 261 is spaced apart from the first flow channel 26. A multi-layer three-dimensional flow channel 272 is formed inside the heat conducting plate 2511. This further increases the total volume of the first flow channel 26 and the second flow channel 261, and the volume of the cooling medium 273 in the first flow channel 26 and the second flow channel 261 is also larger. The first flow channel 26 and the second flow channel 261 together absorb more heat, thereby improving the heat dissipation efficiency of the heat dissipation module 25 and further improving the performance of the electronic device 100.

[0114] In some embodiments, the arrangement direction of the heat conducting plate 2511 and the heat spreader 2512 is a first direction, that is, the thickness direction of the heat conducting plate 2511, i.e., the Z-axis direction in FIG13 . The heat conducting plate 2511 includes a first portion a and a second portion b stacked along the first direction. The first portion a is adjacent to the heating element 3 and is thermally connected to the heating element 3, and the second portion b is adjacent to the heat spreader 2512. The thickness d1 of the first portion a is greater than or equal to 0.5 microns.

[0115] The first portion a is a solid structure without an internal hollow structure. The heat conducting plate 2511 is thermally connected to the heating element 3 through the first portion a. The first portion a conducts heat from the heating element 3 more evenly to the entire heat conducting plate 2511. If the heat conducting plate 2511 is thermally connected to the heating element 3 through a hollow structure or the first flow channel 26 is positioned on a side close to the heating element 3, uneven heat conduction between the heat conducting plate 2511 and the heating element 3 may result. Furthermore, the thermal resistance of the first portion a is smaller than that of the cooling medium 273. The thermal conduction connection between the first portion a and the heating element 3 can also improve the efficiency of heat conduction between the heat conducting plate 2511 and the heating element 3, thereby facilitating improved heat dissipation efficiency of the heat dissipation module 25.

[0116] The second part b is located on the side of the first part a away from the heating element 3, and the first part a and the second part b can be an integral structural member. The first flow channel 26 and the second flow channel 261 are arranged on the second part b, and part of the inner wall of the second part b forms the inner wall of the first flow channel 26. The heat of the heating element 3 is first thermally conducted to the first part a, and the first part a conducts the heat to the entirety of the heat conducting plate 2511, that is, the heat is thermally conducted to the second part b through the first part a, and the second part b is used to form the first flow channel 26 and the second flow channel 261, and the cooling medium 273 in the first flow channel 26 and the second flow channel 261 absorbs heat to achieve heat dissipation. In this way, it is beneficial to improve the efficiency of the heat conduction of the heat of the heating element 3, thereby improving the heat dissipation efficiency of the heat dissipation module 25, and further improving the performance of the electronic device 100.

[0117] In some embodiments, please refer to Figure 14, which is a structural schematic diagram of another heat spreader 2512 of the heat dissipation module 25 shown in Figure 5a. A third flow channel 263 is also formed in the heat spreader 2512, and the third flow channel 263 is connected to the first flow channel 26. Specifically, the heat spreader 2512 may include a third area C and a fourth area D connected to the third area C, wherein the third area C is the area of ​​the heat spreader 2512 opposite to the heat conducting plate 2511, that is, the orthographic projection of the third area C on the heat conducting plate 2511 overlaps with the first surface 2511a, or the orthographic projection of the third area C on the heat conducting plate 2511 overlaps with the first area A1. The portion of the heat spreader 2512 for forming the first flow channel 26 is located in the third area C. The third flow channel 263 can be arranged in the fourth area D to expand the cooling area of ​​the cooling medium 273. In this way, the heat dissipation module 25 absorbs heat by setting up multiple groups of flow channels 272, that is, the first flow channel 26, the second flow channel 261 and the third flow channel 263 absorb heat together, thereby improving the heat dissipation efficiency of the heat dissipation module 25 and further improving the performance of the electronic device 100.

[0118] In some embodiments, please refer to Figures 15a, 15b and 15c. Figure 15a is a structural schematic diagram of another heat conducting plate 2511 of the heat dissipation module 25 shown in Figure 5a; Figure 15b is a structural schematic diagram of another heat conducting plate 2511 of the heat dissipation module 25 shown in Figure 5a; Figure 15c is a structural schematic diagram of another heat conducting plate 2511 of the heat dissipation module 25 shown in Figure 5a. The first flow channel 26, the second flow channel 261 and the third flow channel 263 can extend along a straight line or a curve. Specifically, the first flow channel 26 is S-shaped or spiral, the second flow channel 261 is S-shaped or spiral, and the third flow channel 263 is S-shaped or spiral. The extension paths of the first flow channel 26, the second flow channel 261 and the third flow channel 263 can be the same or different. In this way, within a limited volume, the serpentine or spiral flow channel 272 can further increase the volume of the first flow channel 26, the second flow channel 261 and the third flow channel 263, and further increase the volume of the cooling medium 273. Therefore, the heat dissipation efficiency of the heat dissipation module 25 is further improved, which is also beneficial to improving the performance of the electronic device 100.

[0119] Please refer to Figure 15d and Figure 16a together. Figure 16a is a structural schematic diagram of another heat conducting plate 2511 of the heat dissipation module 25 shown in Figure 5a. The first flow channel 26 includes a plurality of interconnected sub-segments 26c, and the sub-segments 26c extend along the extension path of the heat equalizer 2512. The extension path of the heat equalizer 2512 refers to the path from the evaporation section 2512d to the condensation section 2512f. Specifically, the extension path of the heat equalizer 2512 can be the upper edge or lower edge of the heat equalizer 2512 in the Y-axis direction. In other words, the extension path of the sub-segment 26c can be consistent with the extension path of the upper edge or the lower edge. The length of the extended path of the heat spreader 2512 is greater than its width. Thus, compared to the first flow channel 26 extending in other directions along the heat spreader, the first flow channel 26 extends along the extended path of the heat spreader 2512. This increases the length of each subsegment 26c of the first flow channel 26, reducing manufacturing complexity. Due to the small width of the heat spreader 2512 in the Y-axis direction, the first flow channel 26 can only be processed into multiple curved small segments, which is more difficult to process and also increases the flow resistance of the cooling medium within the first flow channel 26. The first flow channel 26 may also include multiple connecting segments, with adjacent subsegments 26c connected by a connecting segment.

[0120] In some embodiments, please refer to Figures 15d, 16a and 16b. Figure 15d is a structural schematic diagram of the heat dissipation module 25 provided in some other embodiments of the present application; Figure 16b is a structural schematic diagram of the back side of one of the heat conducting plates 2511 shown in Figure 16a. The heat conducting plate 2511 also includes a liquid inlet channel and a liquid outlet channel, and the liquid inlet channel and the liquid outlet channel are respectively connected to the first flow channel 26. The heat conducting plate 2511 also includes a third surface 2511b opposite to the first surface 2511a. The liquid inlet channel passes through the first surface 2511a and the third surface 2511b, and the liquid outlet channel passes through the first surface 2511a and the third surface 2511b. The liquid inlet channel extends to the third surface 2511b to form a liquid inlet 26a, and the liquid outlet channel extends to the third surface 2511b to form a liquid outlet 26b. The cooling medium 273 in the first flow channel 26 can realize the exchange of the cooling medium 273 through the liquid inlet 26a and the liquid outlet 26b. In one embodiment, the liquid inlet 26a and the liquid outlet 26b can be set on the third surface 2511b. The first surface 2511a is used to form the first flow channel 26. Compared with the first surface 2511a, the third surface 2511b has a larger area for setting the liquid inlet 26a and the liquid outlet 26b. The liquid inlet 26a and the liquid outlet 26b are set on the third surface to avoid interference with the heat spreader 2512 during installation, further facilitating the layout of electronic components inside the electronic device 100.

[0121] However, this is not a special limitation of the present application, that is, the liquid inlet 26a and the liquid outlet 26b can also be set on the first surface 2511a and the side of the heat conducting plate 2511, where the side refers to the surface of the heat conducting plate 2511 connecting the first surface 2511a and the third surface 2511b.

[0122] Further, please refer back to Figure 4, and please refer to Figure 16c, which is a structural schematic diagram of the connection between the heat conducting plate 2511 and the drive device 28 in some embodiments of the present application. Among them, Figure a in Figure 16c is a front view of the heat conducting plate 2511, and Figure b is a rear view of the heat conducting plate 2511. The heat dissipation module 25 also includes a drive device 28, which is used to drive the cooling medium 273 to circulate. Please continue to refer to Figure 15d. The drive device 28 includes an inlet 281 and an outlet 282. The inlet 281 is connected to the liquid outlet 26b, and the outlet 282 is connected to the liquid inlet 26a. The drive device 28 can be a circulating pump, a booster pump, etc. In this way, the cooling medium 273 absorbs heat, so that the heat of the heat conducting plate 2511 is reduced, and the drive device 28 drives the cooling medium 273 to circulate in the first flow channel 26, the second flow channel 261 and the third flow channel 263, achieving the effect of accelerating heat transfer.

[0123] Continuing with Figure 16c, the heat dissipation module 25 also includes an inlet pipe 283 and an outlet pipe 284. The drive unit 28 includes an inlet 281 and an outlet 282. The inlet pipe 283 connects between the outlet 282 and the inlet channel, while the outlet pipe 284 connects between the inlet 281 and the outlet channel. The cooling medium flows out of the outlet of the drive unit 28 and enters the inlet pipe 283. The cooling medium then connects to the first flow channel 26 through the inlet pipe 283. After flowing through the first flow channel 26 and out through the outlet channel, the cooling medium returns to the drive unit 28 through the outlet pipe 284, repeating the above process to absorb heat.

[0124] In some embodiments, please refer back to Figure 16a. The heat dissipation module 25 also includes a first connecting pipe 2511e. The number of heat conducting plates 2511 is at least two. The first flow channels 26 of adjacent heat conducting plates 2511 are connected through the first connecting pipe 2511e. Specifically, the heat conducting plates 2511 may include a first heat conducting plate 2511c and a second heat conducting plate 2511d. The first flow channels 26 are provided in both the first heat conducting plate 2511c and the second heat conducting plate 2511d. The first flow channel 26 of the first heat conducting plate 2511c is connected to the first flow channel 26 of the second heat conducting plate 2511d through the first connecting pipe 2511e. The first connecting pipe 2511e may be a hose, a copper pipe, etc. In this application, the first connecting pipe 2511e is described as a hose, but this does not represent a special limitation of this application. The number of the heat conducting plates 2511 is N, and adjacent heat conducting plates 2511 are connected via first connecting pipes 2511 e. The number of the first connecting pipes 2511 e is N-1.

[0125] In this way, the first flow channels 26 are set on multiple heat conducting plates 2511, and the heat on the heat conducting plates 2511 is absorbed by the multiple first flow channels 26, thereby further increasing the total volume of the first flow channels 26. The volume of the cooling medium 273 in the first flow channels 26 is also larger. The first flow channels 26 absorb more heat together, thereby improving the heat dissipation efficiency of the heat dissipation module 25, and thereby improving the performance of the electronic device 100.

[0126] In some other embodiments, the liquid outlet pipeline 284 is connected between the outlet 282 and the liquid inlet channel, and the liquid inlet pipeline 283 can also be connected to the inlet 281 and the end of the first connecting pipeline 2511e away from the first flow channel 26.

[0127] The heat sink 252 in the heat dissipation module 25 is described in detail below.

[0128] 4 , the heat dissipation module 25 further includes a heat sink 252. The heat spreader 2512 includes a condensing section 2512e, which is thermally conductively connected to the heat sink 252. The condensing section 2512f of the heat spreader 2512 forms the condensing section 2512e.

[0129] Please refer to Figure 17, which is a schematic diagram of the structure of the heat sink 252 in the heat dissipation module 25 shown in Figure 4. The heat sink 252 may include a heat dissipation substrate 252a and a plurality of heat dissipation fins 252b. The heat dissipation substrate 252a is thermally connected to the condensing section 2512f of the heat spreader 2512. Each heat dissipation fin 252b is fixed to the heat dissipation substrate 252a, and the plurality of heat dissipation fins 252b are spaced apart on the heat dissipation substrate 252a. For example, the heat dissipation substrate 252a is formed into a rectangular plate-like structure. The length direction of the heat dissipation substrate 252a is parallel to the X-axis direction, the width direction of the heat dissipation substrate 252a is parallel to the Y-axis direction, and the width direction of the heat dissipation substrate 252a is parallel to the Z-axis direction.

[0130] A plurality of heat dissipation fins 252b can be spaced apart along the length of the heat dissipation substrate 252a. A heat dissipation channel 252c is defined between two adjacent heat dissipation fins 252b. When air flows through the heat dissipation channel 252c, it can exchange heat with the heat dissipation fins 252b, thereby transferring the heat from the heat dissipation fins 252b to the outside of the electronic device 100 through the air.

[0131] Optionally, each heat dissipation fin 252b is arranged perpendicular to the heat dissipation substrate 252a. In this way, the structure of the radiator 252 can be made more compact, which is conducive to increasing the heat dissipation area of ​​the radiator 252, thereby improving the heat dissipation performance of the heat dissipation module 25, thereby improving the performance of the electronic device 100. It is understandable that the heat dissipation substrate 252a and the heat dissipation fin 252b can be an integrated structure or a split structure. In addition, the radiator 252 is used to dissipate heat from the heating element 3. When this requirement is met, the radiator 252 can also have other structures and is not limited to this embodiment.

[0132] Please refer back to Figure 16d, which is a structural schematic diagram of another heat conducting plate 2511 of the heat dissipation module 25 shown in Figure 5a. In some embodiments, the heat dissipation module 25 may further include a second connecting pipe 271, which is located between the condensing section 2512e and the radiator 252, and the second connecting pipe 271 is connected to the first flow channel 26. When the cooling medium 273 flows to the heat conducting plate 2511 and the heat equalizing member 2512, it absorbs the heat on the heat conducting plate 2511 and the heat equalizing member 2512. Driven by the driving device 28, the cooling medium 273 circulates in the first flow channel 26. After absorbing part of the heat, the cooling medium 273 flows to the radiator 252. The temperature of the cooling medium 273 is higher than the temperature of the radiator 252. Heat is exchanged between the cooling medium 273 and the radiator 252. During the heat exchange process, the temperature of the cooling medium 273 decreases. Driven by the driving device 28 , the cooling medium 273 continues to flow back to the heat conducting plate 2511 and the heat equalizing member 2512 , and continues the above-mentioned heat absorption process.

[0133] In this way, the first flow channel 26 extends to the radiator 252 , and the radiator 252 dissipates heat from the cooling medium 273 in the first flow channel 26 , further improving the heat dissipation efficiency of the heat dissipation module 25 and thereby improving the performance of the electronic device 100 .

[0134] In some embodiments, the liquid inlet pipe 283 can also be connected to the outlet 282 and the second connecting pipe 271, and the liquid outlet pipe 284 can also be connected to the inlet 281 and one end of the first flow channel 26. The driving device 28 drives the cooling medium to flow in the first flow channel 26. In this way, the cooling medium 273 absorbs heat, thereby reducing the heat of the heat conducting plate 2511. The driving device 28 drives the cooling medium 273 to circulate in the first flow channel 26, the second flow channel 261, and the third flow channel 263, thereby achieving the effect of accelerating heat transfer.

[0135] In some other embodiments, the liquid inlet pipeline 283 and the liquid outlet pipeline 284 can be set on any section of the pipeline connected to the first flow channel 26 to ensure that the driving device 28 drives the cooling medium to flow in the first flow channel 26.

[0136] In some embodiments, referring back to FIG4 , to further improve the heat dissipation performance of the heat dissipation module 25, the heat dissipation module 25 further includes a fan 253. Referring to FIG18 , FIG18 is a schematic diagram of the structure of the fan 253 in the heat dissipation module 25 shown in FIG4 . The fan 253 has a fan inlet 2531 and a fan outlet 2531 . The heat sink 252 is located at the fan outlet 2531 of the fan 253 .

[0137] The fan 253 is disposed within the storage space 21a. The housing 21 of the electronic device 100 further includes a heat dissipation hole and an air inlet. The fan 253 inlet 281 is connected to the air inlet, and the fan outlet 2531 is connected to the heat dissipation hole. The radiator 252 is located between the fan outlet 2531 and the heat dissipation hole. The fan 253 is used to drive airflow from the air inlet to the heat dissipation hole. Thus, driven by the fan 253, airflow enters the storage space 21a from the air inlet and flows to the fan outlet 2531 through the fan 253 inlet 281 of the fan 253. The airflow blown out from the fan outlet 2531 exchanges heat with the radiator 252, flows to the heat dissipation hole, and is discharged to the outside of the electronic device 100 through the heat dissipation hole. Therefore, by providing the fan 253, the airflow rate within the storage space 21a can be increased, thereby improving the heat dissipation performance of the heat dissipation module 25.

[0138] Optionally, the fan outlet 2531 is positioned opposite the heat dissipation holes. That is, the orthographic projection of the fan outlet 2531 on the plane where the heat dissipation holes are located overlaps with the fan outlet 2531. This allows the airflow from the fan outlet 2531 to exchange heat with the radiator 252 before being blown directly toward the heat dissipation holes. This reduces the flow resistance of the airflow and helps reduce the noise of the heat dissipation module 25. This also improves the heat exchange efficiency between the airflow and the radiator 252, further enhancing the heat dissipation performance of the heat dissipation module 25.

[0139] In some embodiments, referring back to FIG. 5 a , there are two heat spreaders 2512 and two heat sinks 252. For ease of description, the two heat spreaders 2512 are referred to as the "first heat spreader" and the "second heat spreader," and the two heat sinks 252 are referred to as the "first heat sink" and the "second heat sink," respectively. The evaporation section 2512d of the first heat spreader 2512 and the evaporation section 2512d of the second heat spreader 2512 are both connected to the heat conducting plate 2511, and the evaporation section 2512d of the first heat spreader 2512 and the evaporation section 2512d of the second heat spreader 2512 are spaced apart from each other. The condensation section 2512f of the first heat spreader 2512 and the condensation section 2512f of the second heat spreader 2512 extend away from each other. The first heat sink is connected to the condensation section 2512f of the first heat spreader 2512, and the second heat sink is connected to the condensation section 2512f of the second heat spreader 2512. Therefore, by providing two heat spreaders 2512 (i.e., a first heat spreader 2512 and a second heat spreader 2512) and two heat sinks 252 (i.e., a first heat sink and a second heat sink), the heat dissipation performance of the heat dissipation module 25 can be improved, thereby improving the performance of the electronic device 100.

[0140] When the heat dissipation module 25 is in use, the heat dissipation method of the heat dissipation module 25 includes the following steps:

[0141] The central processing unit detects the overclocking mode of the electronic device 100 and controls the driving device 28 to start, and the driving device 28 drives the cooling medium 273 to flow in the first flow channel 26 .

[0142] The central processing unit obtains a first temperature, which is the temperature of the heating element. The first temperature can be detected by setting a temperature sensor, and the temperature sensor measures the first temperature in real time.

[0143] If the first temperature is less than the threshold temperature, the drive device 28 is controlled to stop operating; if the first temperature is greater than the threshold temperature, the drive device 28 continues to operate. This can include two specific scenarios: first, if the first temperature is less than or equal to the threshold temperature, the drive device 28 is controlled to stop operating; if the first temperature is greater than the threshold temperature, the drive device 28 continues to operate. Second, if the first temperature is less than the threshold temperature, the drive device 28 is controlled to stop operating; if the first temperature is greater than or equal to the threshold temperature, the drive device 28 continues to operate. Either of these two scenarios can be selected. The threshold temperature can be greater than or equal to 50 degrees Celsius and less than or equal to 80 degrees Celsius.

[0144] The temperature rise time for the CPU to reach the limit temperature when the electronic device 100 is equipped with or without the above-mentioned heat dissipation module 25 is tested. Please refer to Figure 19 and Table 1. Figure 19 is a comparison chart of the temperature rise time for the CPU to reach the limit temperature when the electronic device 100 of this application is equipped with or without the above-mentioned heat dissipation module 25. Table 1 is a comparison of the temperature rise time of the existing heat dissipation module 25 and the above-mentioned heat dissipation module 25. The curve No. 1 in Figure 19 refers to the temperature rise time curve for the CPU to reach the limit temperature when the above-mentioned heat dissipation module 25 is provided. The curve No. 2 in Figure 19 refers to the temperature rise time curve for the CPU to reach the limit temperature when the existing heat dissipation module 25 is provided. The basic power consumption of the electronic device 100 is 10W, and the power consumption of the overclocking mode is set to 15W. First, operate under the basic power consumption conditions to make the CPU chip reach a basic temperature of about 90°C, and then operate the CPU chip under the power consumption of the overclocking mode. 98.2°C is set as the limit temperature of the CPU. The time it takes to reach a temperature of 98.2°C with the heat dissipation module 25 installed was observed. The heat dissipation module 25 began operating after the electronic device 100 was in overclocking mode, dissipating heat from the electronic device 100. The time it took for the electronic device 100 to reach 98.2°C, thanks to the heat dissipation module 25, was 337 seconds, extending the high-power operation time by 100 seconds compared to a system without liquid cooling.

[0145] Therefore, the heat dissipation efficiency of the heat dissipation module 25 is higher, which helps improve the performance of the electronic device 100. After the electronic device 100 reaches the limit temperature of 98.2°C, it enters the basic power consumption operating state. At this time, the temperature of the electronic device 100 is still relatively high, and the heat dissipation module 25 continues to operate until the temperature of the electronic device 100 drops to the threshold temperature, at which point the heat dissipation module 25 stops operating. When the electronic device 100 enters the next round of overclocking mode, the heat dissipation module 25 repeats the above operation process.

[0146] Table 1 Comparison of heating time between existing heat dissipation module and the above heat dissipation module

[0147] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0148] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A heat dissipation module, characterized in that: include: Heat conducting plate; A heat spreader, the heat spreader is located on one side of the heat conducting plate and is thermally connected to the heat conducting plate; A first flow channel, wherein the first flow channel is located between the heat conducting plate and the heat equalizing member; The heat conducting plate has a first surface facing the heat equalizing member, the first flow channel extends on the first surface, a portion of the inner wall of the first flow channel is formed by the first surface, and a cooling medium is arranged in the first flow channel.

2. The heat dissipation module according to claim 1, characterized in that: Part of the inner wall of the first flow channel is formed by the heat equalizing member.

3. The heat dissipation module according to claim 1 or 2, characterized in that: The first surface is provided with a first groove, the opening of the first groove faces the heat equalizing member, and the opening of the first groove is closed to form the first flow channel.

4. The heat dissipation module according to claim 3, characterized in that: The heat spreader has a second surface facing the heat conducting plate, the second surface covers the opening of the first groove and forms the first flow channel with the first groove.

5. The heat dissipation module according to claim 4, characterized in that: The second surface is provided with a second groove, the orthographic projection of the second groove on the first surface overlaps with the first groove, and the first groove and the second groove enclose the first flow channel.

6. The heat dissipation module according to claim 2, characterized in that: The heat conducting plate has a first surface facing the heat spreader; The heat spreader has a second surface facing the heat conducting plate, the second surface is provided with a second groove, the opening of the second groove faces the heat conducting plate, and the first surface covers the opening of the second groove and forms the first flow channel with the second groove.

7. The heat dissipation module according to any one of claims 1 to 6, characterized in that: A second flow channel is formed in the heat conducting plate, the entire inner wall of the second flow channel is formed by the heat conducting plate, and the second flow channel is connected to the first flow channel.

8. The heat dissipation module according to claim 7, characterized in that: In the thickness direction of the heat conducting plate, at least a portion of the second flow channel is spaced apart from the first flow channel.

9. The heat dissipation module according to any one of claims 1 to 8, characterized in that: The heat conducting plate comprises a first part and a second part which are stacked, the first part is located on a side of the second part away from the heat spreader, the thickness of the first part is greater than or equal to 0.5 microns, and the first flow channel is located on the second part.

10. The heat dissipation module according to any one of claims 1 to 9, characterized in that: A third flow channel is formed in the heat equalizing member, and the third flow channel is connected to the first flow channel.

11. The heat dissipation module according to any one of claims 1 to 10, characterized in that: The first flow channel includes a plurality of sub-segments that are interconnected, and the sub-segments extend along an extension path of the heat equalizing member.

12. The heat dissipation module according to any one of claims 1 to 11, characterized in that: The heat conducting plate further comprises a liquid inlet channel and a liquid outlet channel, and the liquid inlet channel and the liquid outlet channel are respectively connected to the first flow channel.

13. The heat dissipation module according to claim 12, characterized in that: The heat conducting plate further includes a third surface disposed opposite to the first surface, the liquid inlet channel runs through the first surface and the third surface, and the liquid outlet channel runs through the first surface and the third surface.

14. The heat dissipation module according to claim 12, characterized in that: The heat conducting plate further includes a third surface disposed opposite to the first surface, and a side surface connected between the first surface and the third surface, and the liquid inlet channel and the liquid outlet channel are disposed on the side surface.

15. The heat dissipation module according to any one of claims 12 to 14, characterized in that: The heat dissipation module also includes a driving device, which is connected to the first flow channel and is used to drive the cooling medium to circulate.

16. The heat dissipation module according to claim 15, characterized in that: The heat dissipation module also includes a liquid inlet pipeline and a liquid outlet pipeline, the driving device includes an inlet and an outlet, the liquid inlet pipeline is connected between the outlet and the liquid inlet channel, and the liquid outlet pipeline is connected between the inlet and the liquid outlet channel.

17. The heat dissipation module according to any one of claims 1 to 16, characterized in that: The heat dissipation module further includes a first connecting pipeline. The number of the heat conducting plates is at least two, and the first flow channels of adjacent heat conducting plates are connected through the first connecting pipeline.

18. The heat dissipation module according to any one of claims 1 to 17, characterized in that: The heat dissipation module also includes a radiator, and the heat equalizing element includes an evaporation section and a condensation section. The evaporation section is thermally connected to the heat conduction plate, and the condensation section is thermally connected to the radiator.

19. The heat dissipation module according to claim 18, characterized in that: The heat dissipation module further includes a second connecting pipeline, which is located between the condensing section and the radiator, and is communicated with the first flow channel.

20. The heat dissipation module according to claim 19, characterized in that: The heat dissipation module also includes a driving device, which is connected to the second connecting pipeline and is used to drive the cooling medium to circulate.

21. A heat dissipation module, characterized in that: include: A heat conducting plate, the heat conducting plate being used for heat conduction connection with the heating element; A heat spreader, the heat spreader is located on a side of the heat conducting plate away from the heating element and is thermally connected to the heat conducting plate; The first flow channel is located between the heat conducting plate and the heat equalizing member, and a portion of the inner wall of the first flow channel is formed by the heat equalizing member. A cooling medium is arranged in the first flow channel.

22. An electronic device, characterized in that: include: A housing having a receiving space; The heat dissipation module according to any one of claims 1 to 21; A heating element is disposed in the accommodating space, the heating element is located on a side of the heat conducting plate away from the heat spreading member, and is thermally connected to the heat conducting plate.

23. A heat dissipation method, characterized in that: Applied to electronic equipment, the electronic equipment comprises a housing, a heating element and a heat dissipation module, the housing has a containing space; the heating element and the heat dissipation module are arranged in the containing space; the heat dissipation module comprises a heat conducting plate, a heat spreader, a first flow channel and a driving device, the heat conducting plate is used to be connected to the heating element by thermal conduction; the heat spreader is located on a side of the heat conducting plate away from the heating element and is connected to the heat conducting plate by thermal conduction; the first flow channel is located between the heat conducting plate and the heat spreader, and a part of the inner wall of the first flow channel is formed by the heat conducting plate, and a cooling medium is arranged in the first flow channel; The driving device is used to drive the cooling medium to circulate; The method comprises: When the electronic device enters the overclocking mode, controlling the driving device to start, the driving device drives the cooling medium to flow in the first flow channel; Acquire a first temperature, where the first temperature is the temperature of the heating element; If the first temperature is lower than the threshold temperature, the driving device is controlled to stop working; if the first temperature is higher than the threshold temperature, the driving device continues to work.

24. The method according to claim 23, characterized in that The threshold temperature is greater than or equal to 50 degrees and less than or equal to 80 degrees.

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