Sensor packaging structure, sensor and electronic device

Abstract

Disclosed in the present application are a sensor packaging structure, a sensor and an electronic device. The sensor packaging structure comprises a shell, a substrate, a sensing assembly and a waterproof film, wherein the shell is open at one end thereof; the substrate covers an opening and encloses together with the shell to form a packaging cavity, and a first sound hole in communication with the packaging cavity is formed in the substrate; the sensing assembly is accommodated in the packaging cavity, and the sensing assembly comprises a mounting plate, and a sensor chip and a signal processing chip which are mounted on the mounting plate side by side, the sensor chip being provided with a vibration cavity, a second sound hole, by means of which the vibration cavity is in communication with the packaging cavity, being formed in the mounting plate, and the second sound hole and the first sound hole being distributed in a staggered manner; and the waterproof film is accommodated in the packaging cavity and is located between the substrate and the sensing assembly, the waterproof film shields the first sound hole, and the first sound hole inclines towards a direction of the second sound hole in the direction close to the waterproof film, so as to compensate a dislocation difference between the first sound hole and the second sound hole.

Description

Sensor packaging structure, sensor and electronic equipment

[0001] This application claims priority to Chinese patent application No. 202311253567.5 filed on September 26, 2023, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of sensor technology, and in particular to a sensor packaging structure, a sensor, and an electronic device. Background Art

[0003] Currently, microphones, acting as sensors, have become standard equipment in electronic devices such as mobile phones, bracelets, watches, smart glasses, and headphones. Sensor performance directly impacts the performance of these devices. Signal-to-interference plus noise ratio (SNR) performance is a key metric affecting sensor performance. To reduce noise, existing sensor packaging structures typically maintain the same overall height while lengthening the structure. For example, increasing the sensor package length by 100 μm reduces misalignment between the inner and outer acoustic holes, stabilizing the internal sound flow and reducing turbulent kinetic energy, thereby lowering noise. Alternatively, maintaining the same overall length while increasing the overall structure height, for example, by 10 or 20 μm, increases the internal cavity, reducing turbulent kinetic energy, thereby reducing noise and improving SNR performance.

[0004] However, whether lengthening or heightening the encapsulator packaging structure, the size of the sensor packaging structure needs to be enlarged, which undoubtedly increases its occupied volume and is not conducive to the design requirements of miniaturization and thinness of the product. Technical issues

[0005] The main purpose of this application is to provide a sensor packaging structure, a sensor and an electronic device, aiming to solve the technical problem that the existing sensor packaging structure improves the SNR in a way that is not conducive to the design requirements of product miniaturization and lightweight. Technical Solutions

[0006] To achieve the above objectives, the sensor packaging structure provided in this application includes:

[0007] a housing, wherein one end of the housing is open;

[0008] A substrate, the substrate is covered at the opening and forms a packaging cavity with the housing, and a first sound hole communicating with the packaging cavity is opened on the substrate;

[0009] A sensor assembly is housed in the packaging cavity, comprising a mounting plate, a sensor chip and a signal processing chip mounted side by side on the mounting plate, the sensor chip being electrically connected to the signal processing chip, the sensor chip having a vibration cavity, a second acoustic hole connecting the vibration cavity and the packaging cavity being formed on the mounting plate, the second acoustic hole being staggered with the first acoustic hole;

[0010] A waterproof membrane is housed in the packaging cavity and is located between the substrate and the sensor component. The waterproof membrane blocks the first sound hole. The first sound hole is inclined toward the second sound hole along a direction close to the waterproof membrane to compensate for the misalignment difference between the first sound hole and the second sound hole.

[0011] In one embodiment, the first sound hole is arranged to expand gradually along a direction approaching the waterproof membrane.

[0012] In one embodiment, the hole wall of the first sound hole is a smooth and continuous hole wall.

[0013] In one embodiment, the first sound hole is a truncated cone-shaped hole.

[0014] In one embodiment, the angle between the hole wall of the first sound hole and the horizontal plane is 30° to 45°.

[0015] In one embodiment, an end of the first sound hole away from the waterproof membrane forms a straight hole.

[0016] In one embodiment, the substrate includes a first circuit board and a second circuit board that are stacked together, the first circuit board is adhered to the second circuit board by an adhesive layer, the end of the housing where the opening is located is connected to the first circuit board, the mounting plate is supported on the side of the first circuit board facing away from the second circuit board, the first circuit board forms an installation cavity for installing the waterproof membrane, the installation cavity is part of the packaging cavity, the first sound hole passes through the second circuit board, and the waterproof membrane is installed on the side of the second circuit board facing the first circuit board.

[0017] In one embodiment, a first copper layer is laid on a side of the second circuit board facing the first circuit board, and the first sound hole penetrates the first copper layer; the first circuit board is annular to enclose the installation cavity, the waterproof membrane is installed on the first copper layer, and a gap is formed between the waterproof membrane and the inner wall of the first circuit board.

[0018] In one embodiment, a first avoidance hole is formed on the first copper layer at a position corresponding to the first sound hole, and the first avoidance hole is arranged outside the first sound hole.

[0019] In one embodiment, a distance between a hole wall of the first avoidance hole and a hole wall of an end of the first sound hole facing the first circuit board is 0.08 mm to 0.1 mm.

[0020] In one embodiment, an annular support plate is provided between the waterproof membrane and the first copper layer, one end of the annular support plate is bonded to the first copper layer, and the end of the annular support plate facing away from the first copper layer supports and bonds the waterproof membrane.

[0021] In one embodiment, a second copper layer is laid on a side of the second circuit board facing away from the first copper layer, a second avoidance hole is formed on the second copper layer at a position corresponding to the first sound hole, and the second avoidance hole is arranged outside the first sound hole.

[0022] In one embodiment, the waterproof membrane is a waterproof and breathable membrane.

[0023] The present application also proposes a sensor, which includes the sensor packaging structure described above, and the sensor chip is a micro-electromechanical acoustic sensor chip.

[0024] The present application also provides an electronic device, which includes the sensor as described above. Beneficial effects

[0025] The first sound hole of the sensor packaging structure of the present application is tilted toward the second sound hole along the direction close to the waterproof membrane to compensate for the misalignment between the first and second sound holes, so that as much area of ​​the second sound hole as possible overlaps and intersects with the first sound hole area, reducing the alignment deviation between the first and second sound holes, so that the sound entering the packaging cavity from the first sound hole can stably enter the vibration cavity through the second sound hole, reducing turbulent kinetic energy, thereby reducing noise and improving SNR performance. Moreover, the sensor packaging structure of the present application only needs to tilt the first sound hole along the direction close to the waterproof membrane toward the second sound hole, without having to lengthen or heighten the sensor packaging structure, and thus without increasing its occupied volume, which is conducive to achieving miniaturization and lightweight design requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0027] FIG1 is a schematic cross-sectional view of a sensor packaging structure according to an embodiment of the present application;

[0028] FIG2 is a schematic cross-sectional view of a local structure of a sensor packaging structure according to an embodiment of the present application.

[0029] Description of Figure Numbers:

[0030] Reference numerals Reference numerals 100 sensor packaging structure 231 straight hole 10 housing 24 mounting cavity 11 packaging cavity 25 gap 20 substrate 30 sensor component 21 first circuit board 31 mounting plate 22 second circuit board 311 second sound hole 221 first copper layer 32 sensor chip 222 second copper layer 321 vibration cavity 223 first avoidance hole 33 signal processing chip 224 second avoidance hole 40 waterproof membrane 23 first sound hole 41 annular support plate

[0031] The realization of the objectives, functional features and advantages of this application will be further explained in conjunction with embodiments and with reference to the accompanying drawings. Modes for Carrying Out the Invention

[0032] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0033] It should be noted that all directional indications in the embodiments of the present application (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0034] In addition, the descriptions of "first", "second", etc. in this application are for descriptive purposes only and should not be understood as indicating or implying their relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of such features. In addition, the technical solutions between the various embodiments can be combined with each other, but this must be based on the fact that they can be implemented by ordinary technicians in this field. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0035] The present application proposes a sensor packaging structure 100 .

[0036] As shown in Figures 1 and 2, the sensor packaging structure 100 of this embodiment includes a housing 10, a substrate 20, a sensor component 30, and a waterproof membrane 40, wherein one end of the housing 10 is open; the substrate 20 is covered at the open end and forms a packaging cavity 11 with the housing 10, and a first sound hole 23 communicating with the packaging cavity 11 is opened on the substrate 20; the sensor component 30 is accommodated in the packaging cavity 11, and the sensor component 30 includes a mounting plate 31 and a sensor chip 32 and a signal processing chip 33 mounted side by side on the mounting plate 31. The sensor chip 32 Electrically connected to the signal processing chip 33, the sensor chip 32 has a vibration cavity 321, and a second sound hole 311 connecting the vibration cavity 321 and the packaging cavity 11 is opened on the mounting plate 31. The second sound hole 311 and the first sound hole 23 are staggered; the waterproof membrane 40 is accommodated in the packaging cavity 11 and is located between the substrate 20 and the sensor component 30. The waterproof membrane 40 blocks the first sound hole 23, and the first sound hole 23 is inclined toward the direction of the second sound hole 311 along the direction close to the waterproof membrane 40 to compensate for the misalignment difference between the first sound hole 23 and the second sound hole 311.

[0037] Specifically, the lower end of the housing 10 is open, and the substrate 20 is positioned below the housing 10 and covers the open end, thereby forming a packaging cavity 11 with the housing 10 to accommodate the sensor assembly 30 and the waterproof membrane 40, resulting in a compact structure. To achieve a waterproof function, a waterproof membrane 40 is disposed between the sensor assembly 30 and the substrate 20. The waterproof membrane 40 blocks the first sound hole 23, thereby providing a waterproof effect. The first sound hole 23 of the substrate 20 communicates with the packaging cavity 11, and further communicates with the second sound hole 311 and the vibration cavity 321. Given the positional relationship between the first sound hole 23 and the second sound hole 311 and the housing 10, the first sound hole 23 can serve as an external sound hole, and the second sound hole 311 can serve as an internal sound hole.

[0038] When the sensor package structure 100 is in use, external sound enters the package cavity 11 through the first acoustic hole 23, inputting a vibration signal or pressure signal into the package cavity 11. This vibration signal or pressure signal excites the waterproof membrane 40, causing it to vibrate. The sound energy is then transmitted through the second acoustic hole 311 to the vibration cavity 321 of the sensor chip 32, causing the diaphragm of the sensor chip 32 to vibrate. This converts the sound energy into mechanical energy. The vibration of the diaphragm changes the pressure difference between the diaphragm and the back electrode of the sensor chip 32, thereby outputting an AC signal to the signal processing chip 33, completing the process of converting the microphone sound energy into electrical energy. In one embodiment, the sensor chip 32 is a MEMS chip, and the signal processing chip 33 is an ASIC chip.

[0039] The sensor chip 32 and signal processing chip 33 of the sensor assembly are mounted side by side on the mounting plate 31, eliminating the need for additional height space within the package cavity 11 and facilitating a lightweight design. Because the sensor chip 32 and signal processing chip 33 are mounted side by side, the sensor chip 32 is offset from the center of the mounting plate 31. Therefore, the second acoustic hole 311 needs to be positioned directly opposite the sensor chip 32 on the mounting plate 31. This means that the second acoustic hole 311 is offset from the center of the mounting plate 31. Due to structural design requirements, the first acoustic hole 23 needs to be located at the center of the substrate 20. This results in a staggered arrangement of the first acoustic hole 23 and the second acoustic hole 311, improving the rationality of the overall structural design.

[0040] In the sensor package structure 100 of this embodiment, the first acoustic hole 23 is tilted toward the second acoustic hole 311 from the direction of proximity to the waterproof membrane 40 to compensate for the misalignment between the first and second acoustic holes 23, 311. Specifically, the first acoustic hole 23 is tilted from bottom to top toward the second acoustic hole 311, thereby compensating for the misalignment between the first and second acoustic holes 23, 311. This allows the second acoustic hole 311 to overlap and intersect with the first acoustic hole 23 as much as possible, reducing the misalignment between the first and second acoustic holes 23, 311. This allows sound entering the package cavity 11 from the first acoustic hole 23 to stably pass through the second acoustic hole 311 and enter the vibration cavity 321, reducing turbulent kinetic energy, thereby reducing noise and improving signal-to-noise ratio (SNR) performance. Furthermore, the sensor package structure 100 of this embodiment only needs to tilt the first acoustic hole 23 from the direction of proximity to the waterproof membrane 40 toward the second acoustic hole 311, eliminating the need to lengthen or heighten the sensor package structure 100, thereby eliminating the need to increase its footprint, thus facilitating a compact and lightweight design.

[0041] The sensor packaging structure 100 of this embodiment can be applied to electronic devices such as mobile phones, bracelets, watches, smart glasses, and headphones. Due to its advantages of miniaturization and thinness, it is particularly suitable for products such as watches, smart glasses, and headphones that have higher requirements for miniaturization and thinness.

[0042] In one embodiment, the first sound hole 23 is arranged to gradually expand in the direction close to the waterproof membrane 40, that is, the first sound hole 23 gradually expands from bottom to top, while compensating for the misalignment difference between the first sound hole 23 and the second sound hole 311, further improving the stability of the sound flow, reducing turbulent kinetic energy, and thus reducing noise and improving SNR performance.

[0043] In one embodiment, the hole wall of the first sound hole 23 is a smooth and continuous hole wall, and the sound can flow smoothly and steadily along the hole wall of the first sound hole 23, further reducing the turbulent kinetic energy.

[0044] As shown in Figures 1 and 2, in one embodiment, the first sound hole 23 is a truncated cone-shaped hole, which has a simple structure, is easy to process and form, reduces costs, and is more conducive to reducing turbulent kinetic energy. Furthermore, the angle between the hole wall of the first sound hole 23 and the horizontal plane is 30°~45°. As shown in Figure 1, the angle between the hole wall of the first sound hole 23 and the horizontal plane is α, α=30°~45°. While facilitating processing, it ensures that the hole wall of the first sound hole 23 is appropriately tilted, not excessively tilted or tilted inadequately, and ensures the stability of sound flow. In one embodiment, the angle between the hole wall of the first sound hole 23 and the horizontal plane is 30°.

[0045] It can be understood that the straight hole 231 is easier to process than the truncated cone hole. In this embodiment, a straight hole 231 is formed at one end of the first sound hole 23 away from the waterproof membrane 40, that is, a straight hole 231 is formed at the bottom end of the first sound hole 23 to reduce the difficulty of processing the first sound hole 23.

[0046] In one embodiment, the substrate 20 includes a first circuit board 21 and a second circuit board 22 that are stacked. The first circuit board 21 is adhered to the second circuit board 22 by an adhesive layer. The end of the housing 10 where the opening is located is connected to the first circuit board 21. The mounting plate 31 is supported on the side of the first circuit board 21 facing away from the second circuit board 22. The first circuit board 21 forms an installation cavity 24 for installing a waterproof membrane 40. The installation cavity 24 is part of the packaging cavity 11. The first sound hole 23 passes through the second circuit board 22. The waterproof membrane 40 is installed on the side of the second circuit board 22 facing the first circuit board 21.

[0047] As shown in Figure 2, the first circuit board 21 is laminated onto the second circuit board 22. The first circuit board 21 and the second current board are bonded together by an adhesive layer. This adhesive layer can be made of the non-flowing PP (polypropylene) material commonly used in the prior art to prevent the formation of glue bumps when the first and second circuit boards 21, 22 are laminated together. The open end of the housing 10, i.e., the bottom end, is connected to the first circuit board 21. The mounting plate 31 is supported on the top side of the first circuit board 21. The first circuit board 21 defines a mounting cavity 24, which is part of the enclosure 11 and facilitates installation of the waterproof membrane 40 within it. The first sound hole 23 extends through the second circuit board 22, communicating with the mounting cavity 24. The waterproof membrane 40 is mounted on the side of the second circuit board 22 facing the first circuit board 21, i.e., on the upper side of the first mounting plate 31, to shield the first sound hole 23. This design is well-designed.

[0048] In one embodiment, a first copper layer 221 is laid on the side of the second circuit board 22 facing the first circuit board 21, and the first sound hole 23 passes through the first copper layer 221; the first circuit board 21 is annular to form an installation cavity 24, and the waterproof membrane 40 is installed on the first copper layer 221, and a gap 25 is formed between the waterproof membrane 40 and the inner wall of the first circuit board 21.

[0049] As shown in Figure 2 , the upper side of the second circuit board 22 is laid on the first copper layer 221, and the first sound hole 23 is placed on the first copper layer 221. The inner cavity of the first circuit board 21 forms a mounting cavity 24. The first circuit board 21 is surrounded by the outer periphery of the waterproof membrane 40, which is mounted on the first copper layer 221. A gap 25 is formed between the waterproof membrane 40 and the inner wall of the first circuit board 21. When optical inspection of the waterproof membrane 40 is required to detect damage, foreign matter, or adhesive overflow around the connection to other structures, the first copper layer 221 exposed in the gap 25 can appear bright under an optical camera, while the waterproof membrane 40 appears dark. This allows for optical inspection of the waterproof membrane 40 by utilizing the contrast between the first copper layer 221 and the waterproof membrane 40.

[0050] In one embodiment, the waterproof membrane 40 is a waterproof and breathable membrane, which is both waterproof and breathable, facilitating sound transmission. In another embodiment, the waterproof membrane 40 is an airtight waterproof membrane to increase the driving force of the sound entering the packaging cavity 11 through the first sound hole 23 on the waterproof membrane 40.

[0051] In one embodiment, a first avoidance hole 223 is formed in the first copper layer 221 at a position corresponding to the first sound hole 23. The first avoidance hole 223 is disposed outside the first sound hole 23. During the machining of the first sound hole 23, wire drawing defects may be caused on the periphery of the first copper layer 221 corresponding to the first sound hole 23, thereby affecting the flow of sound. Therefore, after the first sound hole 23 is machined, the periphery of the first copper layer 221 corresponding to the first sound hole 23 is etched to form the first avoidance hole 223 surrounding the first sound hole 23, resulting in a reasonable structural design.

[0052] Furthermore, the distance between the wall of the first avoidance hole 223 and the wall of the first sound hole 23 at the end facing the first circuit board 21 is 0.08mm to 0.1mm. In one embodiment, the shape of the first avoidance hole 223 is consistent with the shape of the wall of the first sound hole 23 at the end facing the first circuit board 21, i.e., the upper end. Furthermore, the distance between the wall of the first avoidance hole 223 and the upper end wall of the first sound hole 23 is 0.08mm to 0.1mm, allowing for precise etching to eliminate wire drawing defects and ensure the stability of sound flow. In one embodiment, the distance between the wall of the first avoidance hole 223 and the upper end wall of the first sound hole 23 is 0.1mm, facilitating manufacturing.

[0053] In one embodiment, an annular support plate 41 is provided between the waterproof membrane 40 and the first copper layer 221 . One end of the annular support plate 41 is bonded to the first copper layer 221 , and the end of the annular support plate 41 facing away from the first copper layer 221 supports and bonds the waterproof membrane 40 .

[0054] As shown in Figures 1 and 2, the bottom of the waterproof membrane 40 is supported and bonded to the top of the annular support plate 41, and the bottom of the annular support plate 41 is bonded to the first copper layer 221. This secures the waterproof membrane 40 above the first sound hole 23, shielding the first sound hole 23. Furthermore, the provision of the annular support plate 41 elevates the waterproof membrane 40, increasing the distance between it and the first sound hole 23 and reducing turbulent kinetic energy.

[0055] In one embodiment, a second copper layer 222 is laid on a side of the second circuit board 22 away from the first copper layer 221 . A second avoidance hole 224 is formed on the second copper layer 222 at a position corresponding to the first sound hole 23 . The second avoidance hole 224 is arranged outside the first sound hole 23 .

[0056] As shown in Figure 2 , the second current plate is laid on the second copper layer 222 on the side facing away from the first copper layer 221, i.e., on the lower side. A second avoidance hole 224 is formed on the second copper layer 222 at a position corresponding to the first acoustic hole 23. The second avoidance hole 224 is arranged outside the first acoustic hole 23. The second avoidance hole 224 can be a avoidance hole reserved in advance before machining the first acoustic hole 23 to avoid interference with machining equipment during machining of the first acoustic hole 23.

[0057] This application also provides a sensor comprising the aforementioned sensor package structure 100. Because this sensor utilizes all of the technical solutions of all of the aforementioned embodiments, it possesses at least all of the beneficial effects provided by the technical solutions of these embodiments, and therefore will not be detailed here. In one embodiment, the sensor chip 32 is a micro-electromechanical acoustic sensor chip, which is particularly suitable for use in acoustic devices.

[0058] This application also provides an electronic device including the aforementioned sensor. The electronic device may be a mobile phone, a wristband, a watch, smart glasses, or headphones. Because this electronic device utilizes all of the technical solutions of all of the aforementioned embodiments, it at least has all of the effects provided by the technical solutions of the aforementioned embodiments, and therefore will not be described in detail here.

[0059] The above description is merely an optional embodiment of the present application and does not limit the patent scope of the present application. All equivalent structural transformations made based on the concept of the present application and the contents of the present application description and drawings, or direct / indirect application in other related technical fields are included in the patent protection scope of the present application.

Claims

1. A sensor packaging structure, wherein: The sensor packaging structure comprises: A housing, one end of which is open; A substrate, the substrate is covered at the opening and forms a packaging cavity with the shell, and a first sound hole communicating with the packaging cavity is opened on the substrate; A sensor component, the sensor component is accommodated in the packaging cavity, the sensor component includes a mounting plate and a sensor chip and a signal processing chip mounted side by side on the mounting plate, the sensor chip is electrically connected to the signal processing chip, the sensor chip has a vibration cavity, a second sound hole connecting the vibration cavity and the packaging cavity is opened on the mounting plate, and the second sound hole is staggered with the first sound hole; A waterproof membrane is housed in the packaging cavity and is located between the substrate and the sensor component. The waterproof membrane blocks the first sound hole. The first sound hole is inclined toward the second sound hole along a direction close to the waterproof membrane to compensate for the misalignment difference between the first sound hole and the second sound hole.

2. The sensor packaging structure according to claim 1, wherein: The first sound hole is arranged to expand gradually along a direction approaching the waterproof membrane.

3. The sensor packaging structure according to claim 2, wherein: The hole wall of the first sound hole is a smooth and continuous hole wall.

4. The sensor packaging structure according to claim 3, wherein: The first sound hole is a truncated cone-shaped hole.

5. The sensor packaging structure according to claim 4, wherein: The angle between the hole wall of the first sound hole and the horizontal plane is 30°-45°.

6. The sensor packaging structure according to claim 4, wherein: One end of the first sound hole away from the waterproof membrane forms a straight hole.

7. The sensor packaging structure according to any one of claims 1 to 6, wherein: The substrate includes a first circuit board and a second circuit board which are stacked, the first circuit board being bonded to the second circuit board, the end of the housing where the opening is located being connected to the first circuit board, the mounting plate being supported on a side of the first circuit board facing away from the second circuit board, the first circuit board forming an mounting cavity for mounting the waterproof membrane, the mounting cavity being a part of the packaging cavity, the first sound hole penetrating the second circuit board, and the waterproof membrane being mounted on a side of the second circuit board facing the first circuit board.

8. The sensor packaging structure according to claim 7, wherein: A first copper layer is laid on the side of the second circuit board facing the first circuit board, and the first sound hole penetrates the first copper layer; the first circuit board is ring-shaped to enclose the installation cavity, the waterproof membrane is installed on the first copper layer, and a gap is formed between the waterproof membrane and the inner wall of the first circuit board.

9. The sensor packaging structure according to claim 7, wherein: A first avoidance hole is formed on the first copper layer at a position corresponding to the first sound hole, and the first avoidance hole is arranged outside the first sound hole.

10. The sensor packaging structure according to claim 9, wherein: A distance between a hole wall of the first avoidance hole and a hole wall of an end of the first sound hole facing the first circuit board is 0.08 mm to 0.1 mm.

11. The sensor packaging structure according to claim 8, wherein: An annular support plate is arranged between the waterproof membrane and the first copper layer, one end of the annular support plate is bonded to the first copper layer, and one end of the annular support plate facing away from the first copper layer supports and bonds the waterproof membrane.

12. The sensor packaging structure according to claim 7, wherein: A second copper layer is laid on a side of the second circuit board facing away from the first copper layer. A second avoidance hole is formed on the second copper layer at a position corresponding to the first sound hole. The second avoidance hole is arranged outside the first sound hole.

13. The sensor packaging structure according to any one of claims 1 to 6, wherein: The waterproof membrane is a waterproof and breathable membrane.

14. A sensor, wherein: The sensor comprises the sensor packaging structure according to any one of claims 1 to 13, and the sensor chip is a micro-electromechanical acoustic sensor chip.

15. An electronic device, wherein: The electronic device comprises the sensor of claim 14.

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