Speaker comprising support structure and electronic device comprising same

Abstract

An electronic device according to an embodiment may comprise: a housing comprising a fastening portion; and a speaker assembly which is arranged inside the housing and which outputs audio. The speaker assembly may comprise a support structure that forms a magnetic field. The speaker assembly may comprise: a coil configured to vibrate due to the magnetic field; and a diaphragm attached to the coil. The support structure may be fastened to the fastening portion to couple the speaker assembly to the housing.

Description

Speaker including a support structure and electronic device including the same

[0001] The various embodiments described below relate to a speaker including a support structure and an electronic device including the same.

[0002] Small electronic devices, such as smartphones, tablet PCs, or smart watches, may include speakers for audio output. To be incorporated into electronic devices, the speakers may be miniaturized. To reduce the risk of speaker deterioration (e.g., poor sound quality) due to external impacts on the electronic device, a supporting structure may be required to support the speakers.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0004] In one embodiment, an electronic device may include a housing including a fastening portion. The electronic device may include a speaker assembly disposed within the housing and configured to output audio. The speaker assembly may include a support structure that forms a magnetic field and includes a first plate, a magnet attached to the first plate, and a second plate coupled to the first plate and at least partially disposed on the magnet. The speaker assembly may include a coil configured to vibrate by the magnetic field, and a diaphragm attached to the coil. The support structure may be fastened to the fastening portion to couple the speaker assembly to the housing.

[0005] In one embodiment, an electronic device may include a housing including a fastening portion. The electronic device may include a speaker assembly disposed within the housing and configured to output audio. The speaker assembly may include a support structure that forms a magnetic field and includes a first plate, a magnet attached to the first plate, a second plate coupled to the first plate and at least partially disposed on the magnet, and a fastening structure supported by the fastening portion and configured to fasten the speaker assembly to the fastening portion. The speaker assembly may include a diaphragm configured to vibrate by the magnetic field. The fastening structure may be at least partially formed by at least one of the first plate and the second plate.

[0006] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0007] FIG. 2A is a perspective view of the front of an electronic device according to one embodiment.

[0008] Figure 2b is a perspective view of the rear surface of the electronic device of Figure 2a.

[0009] Figure 3 is an exploded perspective view of the electronic device of Figure 2a.

[0010] Figure 4a illustrates a portion of an exemplary electronic device.

[0011] FIG. 4b is a partial cross-sectional view of an exemplary electronic device taken along line A-A' of FIG. 4a.

[0012] FIG. 5A is an exploded perspective view of a speaker assembly of an exemplary electronic device.

[0013] FIG. 5b is a partially exploded perspective view of a speaker assembly of an exemplary electronic device.

[0014] FIG. 5c is a perspective view of a speaker assembly of an exemplary electronic device.

[0015] FIG. 6A is a partially exploded perspective view of a speaker assembly of an exemplary electronic device.

[0016] FIG. 6b is a perspective view of a speaker assembly of an exemplary electronic device.

[0017] FIGS. 7A, 7B, 7C, 7D, and 7E are perspective views of a speaker assembly of an exemplary electronic device.

[0018] Figure 8a illustrates a portion of an exemplary electronic device.

[0019] FIG. 8b is a partial cross-sectional view of an exemplary electronic device taken along line B-B' of FIG. 8a.

[0020] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0021] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0022] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0023] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0024] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0025] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0026] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0027] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0028] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0029] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0030] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0031] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0032] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0033] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0034] The camera module (180) can capture still images and moving images. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0035] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0036] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0037] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0038] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0039] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the at least one selected antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0040] According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a front surface (e.g., a bottom surface) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent to a rear surface (e.g., a top surface or a side surface) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0041] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0042] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0043] FIG. 2A is a perspective view of the front of an electronic device according to one embodiment. FIG. 2B is a perspective view of the rear of the electronic device of FIG. 2A.

[0044] Referring to FIGS. 2A and 2B , an electronic device (200) according to one embodiment may include a housing (210) including a front surface (210A), a back surface (210B), and a side surface (210C) surrounding a space between the front surface (210A) and the back surface (210B), and a fastening member (250, 260) connected to at least a portion of the housing (210) and configured to releasably fasten the electronic device (200) to a part of a user's body (e.g., a wrist or ankle). In another embodiment (not shown), the housing may refer to a structure forming a portion of the front surface (210A), the back surface (210B), and the side surface (210C) of FIG. 1 . In one embodiment, the front surface (210A) may be formed by a front plate (201) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The back (210B) may be formed by a substantially opaque back plate (207). The back plate (207) may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side (210C) may be formed by a side bezel structure (206) that is coupled to the front plate (201) and the back plate (207) and includes a metal and / or a polymer. In some embodiments, the back plate (207) and the side bezel structure (206) may be formed integrally and include the same material (e.g., a metal material such as aluminum). The fastening members (250, 260) may be formed of various materials and shapes. The integral and multiple unit links may be formed to be movable with each other by woven fabric, leather, rubber, urethane, metal, ceramic, or a combination of at least two of the foregoing materials.

[0045] According to one embodiment, the electronic device (200) may include at least one of a display (220, see FIG. 3), an audio module (205, 208), a sensor module (211), a key input device (202, 203, 204), and a connector hole (209). In some embodiments, the electronic device (200) may omit at least one of the components (e.g., the key input device (202, 203, 204), the connector hole (209), or the sensor module (211)) or may additionally include other components.

[0046] The display (220) may be visually exposed, for example, through a significant portion of the front plate (201). The shape of the display (220) may correspond to the shape of the front plate (201), and may have various shapes including a circle, an oval, or a polygon. The display (220) may be coupled to or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a fingerprint sensor.

[0047] The audio module (205, 208) may include a microphone hole (205) and a speaker hole (208). The microphone hole (205) may have a microphone positioned therein for acquiring external sounds, and in some embodiments, multiple microphones may be positioned therein to detect the direction of sounds. The speaker hole (208) may be used as an external speaker and a receiver for calls. In some embodiments, the speaker hole (208) and the microphone hole (205) may be implemented as a single hole, or a speaker may be included without the speaker hole (208) (e.g., a piezo speaker).

[0048] The sensor module (211) can generate an electric signal or data value corresponding to the internal operating state of the electronic device (200) or the external environmental state. The sensor module (211) can include, for example, a biometric sensor module (211) (e.g., HRM sensor) arranged on the rear surface (210B) of the housing (210). The electronic device (200) can further include at least one of a sensor module not shown, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0049] The key input devices (202, 203, 204) may include a wheel key (202) disposed on the front surface (210A) of the housing (210) and rotatable in at least one direction, and / or a key button (203, 204) disposed on the side surface (210C) of the housing (210). The wheel key may have a shape corresponding to the shape of the front plate (201). In other embodiments, the electronic device (200) may not include some or all of the above-mentioned key input devices (202, 203, 204), and the key input devices (202, 203, 204) that are not included may be implemented in another form, such as a soft key, on the display (220).

[0050] The connector hole (209) may include another connector hole (not shown) that may accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and may accommodate a connector for transmitting and receiving audio signals with the external electronic device. The electronic device (200) may further include, for example, a connector cover (not shown) that covers at least a portion of the connector hole (209) and blocks the inflow of external foreign substances into the connector hole.

[0051] The fastening member (250, 260) can be detachably fastened to at least a portion of the housing (210) using a locking member (251, 261). The fastening member (250, 260) can include one or more of a fixing member (252), a fixing member fastening hole (253), a band guide member (254), and a band fastening ring (255).

[0052] The fixing member (252) can be configured to fix the housing (210) and the fastening members (250, 260) to a part of the user's body (e.g., wrist or ankle). The fastening member fastening hole (253) can fix the housing (210) and the fastening members (250, 260) to a part of the user's body in response to the fastening member (252). The band guide member (254) can be configured to limit the range of movement of the fastening member (252) when the fastening member (252) is fastened to the fastening member fastening hole (253), thereby allowing the fastening members (250, 260) to be fastened in close contact with a part of the user's body. The band fixing ring (255) can limit the range of movement of the fastening members (250, 260) when the fastening member (252) and the fastening member fastening hole (253) are fastened.

[0053] Figure 3 is an exploded perspective view of the electronic device of Figure 2a.

[0054] Referring to FIG. 3, the electronic device (200) may include a side bezel structure (206), a wheel key (202), a front plate (201), a display (220), a first antenna (350), a second antenna (355), a support member (360) (e.g., a bracket), a battery (370), a printed circuit board (380), a sealing member (390), a rear plate (207), and / or a fastening member (250, 260). At least one of the components of the electronic device (200) may be identical to or similar to at least one of the components of the electronic device (101) of FIG. 1 or the electronic device (200) of FIG. 2A, and a redundant description thereof will be omitted below. The support member (360) may be disposed inside the electronic device (200) and connected to the side bezel structure (206), or may be formed integrally with the side bezel structure (206). The support member (360) may be formed of, for example, a metallic material and / or a non-metallic (e.g., polymer) material. The support member (360) may have a display (220) coupled to one surface and a printed circuit board (380) coupled to the other surface. A processor, memory, and / or an interface may be mounted on the printed circuit board (380). The processor may include, for example, one or more of a central processing unit, an application processor, a graphic processing unit (GPU), an application processor, a sensor processor, or a communication processor.

[0055] The memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (200) to an external electronic device, for example, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0056] The battery (370) is a device for supplying power to at least one component of the electronic device (200), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (370) may be disposed substantially on the same plane as, for example, the printed circuit board (380). The battery (370) may be disposed integrally within the electronic device (200), or may be disposed detachably from the electronic device (200).

[0057] The first antenna (350) may be positioned between the display (220) and the support member (360). The first antenna (350) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The first antenna (350) may, for example, perform short-range communication with an external device, wirelessly transmit and receive power required for charging, and transmit a magnetic-based signal including a short-range communication signal or payment data. In another embodiment, the antenna structure may be formed by the side bezel structure (206) and / or a portion or combination of the support member (360).

[0058] The second antenna (355) may be positioned between the circuit board (380) and the back plate (207). The second antenna (355) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The second antenna (355) may, for example, perform short-range communication with an external device, wirelessly transmit and receive power required for charging, and transmit a magnetic-based signal including a short-range communication signal or payment data. In another embodiment, the antenna structure may be formed by a portion or a combination of the side bezel structure (206) and / or the back plate (207).

[0059] A sealing member (390) may be positioned between the side bezel structure (206) and the rear plate (207). The sealing member (390) may be configured to block moisture and foreign substances from entering the space surrounded by the side bezel structure (206) and the rear plate (207) from the outside.

[0060] Fig. 4a illustrates a portion of an exemplary electronic device. Fig. 4b is a partial cross-sectional view of the exemplary electronic device taken along line A-A' of Fig. 4a.

[0061] Referring to FIGS. 4A and 4B, an electronic device (200) may include a housing (210) and a speaker assembly (400). The speaker assembly (400) may include a support structure (450), a coil (460), and a diaphragm (470).

[0062] According to one embodiment, the electronic device (200) may be referred to as a wearable device that can be worn on a part of a user's body (e.g., a wrist). For example, a front side (e.g., a front side (200A) of FIG. 2A) of a housing (210) of the electronic device (200) may provide visual information to a user through a display (e.g., a display (220) of FIG. 3) of the electronic device (200). A rear side (200B) of the housing (210) opposite to the front side (200A) may face a part of the user's body while the electronic device (200) is worn by the user. The electronic device (200) may detect biometric information of the user through a sensor module (e.g., a sensor module (211) of FIG. 2B) disposed on the rear side (200B). For example, the electronic device (200) may be connected to an external electronic device (e.g., the electronic device (101) of FIG. 1). The electronic device (200) may provide information related to the user through the external electronic device (101). The electronic device (200) may be referred to as the electronic device (102) or the electronic device (104) of FIG. 1 in that it is connected to the external electronic device (101), but is not limited thereto.

[0063] According to one embodiment, the housing (210) may include a front plate (201), a back plate (207), and / or a side bezel structure (206). For example, the front plate (201) may be disposed on a display (e.g., the display (220) of FIG. 3) for providing visual information to a user. For example, the back plate (207) may face a part of a user's body (e.g., a wrist) when the electronic device (200) is worn by the user. The back plate (207) may include, for example, a speaker hole (208) for sound output from a speaker assembly (400). For example, the side bezel structure (206) may surround a space between the front plate (201) and the back plate (207). The side bezel structure (206) may, for example, surround at least a portion of the front plate (201) and / or at least a portion of the back plate (207).

[0064] According to one embodiment, the housing (210) may include a fastening portion (401). The fastening portion (401) may be a portion for fastening the speaker assembly (400) to the housing (210). For example, the fastening portion (401) may be fastened to the speaker assembly (400) to fix the speaker assembly (400) inside the housing (210). For example, the fastening portion (401) may be coupled to the speaker assembly (400) to fix the position of the speaker assembly (400) with respect to the housing (210). For example, the fastening portion (401) to which the speaker assembly (400) is fastened may be formed on the rear plate (207) of the housing (210) of FIG. 2B, but is not limited thereto.

[0065] According to one embodiment, the speaker assembly (400) may be disposed within the housing (210). The speaker assembly (400) may be configured to output audio. For example, the speaker assembly (400) may be coupled to a coupling portion (401) of the housing (210). For example, the speaker assembly (400) may be disposed between a front surface (210A) of the housing (210) and a rear surface (210B) opposite to the front surface (210A). For example, the speaker assembly (400) may be coupled to a rear plate (207) of the housing (210), but is not limited thereto. For example, the speaker assembly (400) may be disposed within the housing (210) so as to face a speaker hole (208) of the housing (210) to transmit audio output from the speaker assembly (400) to the outside of the electronic device (200). The above speaker assembly (400) is configured to output audio to the outside of the housing (210), thereby providing sound to the user.

[0066] According to one embodiment, the support structure (450) can form a magnetic field. The support structure (450) can include a first plate (410), a second plate (420), and a magnet (430). For example, the support structure (450) can be configured to vibrate a diaphragm (470) of the speaker assembly (400) by forming a magnetic field. The support structure (450) can provide a space for a coil (460) attached to the diaphragm (470) to vibrate the diaphragm (470). By vibrating the diaphragm (470) by the magnetic field formed within the support structure (450), audio can be output from the speaker assembly (400). For example, the support structure (450) can be supported by at least a portion of the housing (210) (e.g., the fastening portion (401)). For example, the support structure (450) may form at least a portion of the exterior of the speaker assembly (400).

[0067] In one embodiment, the first plate (410) may support at least some components included in the speaker assembly (400). For example, the first plate (410) may form a magnetic circuit within the speaker assembly (400) together with the magnet (430). For example, the first plate (410) may face the interior of the housing (210) while the speaker assembly (400) is fastened to the housing (210). The first plate (410) may be referred to as a yoke of the speaker assembly (400), but is not limited thereto.

[0068] In one embodiment, the second plate (420) may be coupled to the first plate (410). The second plate (420) may be at least partially disposed on the magnet (430). For example, the second plate (420) may be supported by the magnet (430). The second plate (420) may be configured to be attached to the magnet (430) such that the magnetic flux of the magnetic field formed by the magnet (430) is concentrated within the support structure (450). The second plate (420) may be referred to as, but is not limited to, a top plate of the speaker assembly (400).

[0069] According to one embodiment, the magnet (430) can be attached to the first plate (410). The magnet (430) can be at least partially disposed between the first plate (410) and the second plate (420). For example, the magnet (430) can be coupled to the first plate (410) and the second plate (420). The magnet (430) can be at least partially interposed between the first plate (410) and the second plate (420). The magnet (430) can form a magnetic field together with the first plate (410) and the second plate (420).

[0070] For example, the second plate (420) may be in partial contact with the first plate (410). For example, the second plate (420) may be coupled with the first plate (410). For example, since the second plate (420) and the first plate (410) are coupled, at least a portion of the first plate (410) and / or the second plate (420) may at least partially surround the magnet (430). The support structure (450) is configured to fasten the first plate (410) and the second plate (420), thereby reducing the magnet (430) between the first plate (410) and the second plate (420) from contacting the coil (460) due to external impact. The above support structure (450) is configured to combine the first plate (410) and the second plate (420), thereby improving the sound quality of audio output from the speaker assembly (400). The structure for combining the first plate (410) and the second plate (420) is described below in FIG. 5a.

[0071] For example, the magnet (430) may include a first magnet (431), a second magnet (432) spaced apart from the first magnet (431), and / or a third magnet (433) between the first magnet (431) and the second magnet (432). For example, the support structure (450) may form a magnetic field by the first plate (410), the first magnet (431), the second plate (420), and the third magnet (433). For example, the support structure (450) may form a magnetic field by the first plate (410), the second magnet (432), the second plate (420), and the third magnet (433). The support structure (450) may vibrate the coil (460) by forming the magnetic field.

[0072] In one embodiment, the coil (460) may be configured to vibrate by a magnetic field formed by the support structure (450). For example, the coil (460) may penetrate the second plate (420). The coil (460) may be at least partially surrounded by the magnet (430). For example, the coil (460) may be at least partially disposed within the support structure (450). For example, the magnet (430) may include a first magnet (431), a second magnet (432), and a third magnet (433). The coil (460) may be configured to form a sound wave through the diaphragm (470) by interacting with the magnet (430) through a current within the coil (460). For example, the coil (460) may include a conductive material. When an alternating current (AC) flows through the coil (460), the coil (460) can vibrate due to a magnetic field formed within the support structure (450).

[0073] In one embodiment, the diaphragm (470) may be attached to the coil (460). For example, the diaphragm (470) may be configured to vibrate based on the vibration of the coil (460) by a magnetic field formed in the support structure (450). For example, the diaphragm (470) may change the pressure of air around the diaphragm (470) by being vibrated by the coil (460). The diaphragm (470) may be configured to output audio by changing the pressure of the air.

[0074] According to one embodiment, the housing (210) may include a speaker hole (208), and an acoustic duct (403) for audio output from the speaker assembly (400) that extends from the speaker hole (208) to a diaphragm (470) of the speaker assembly (400) that is fastened to the fastening portion (401). For example, the speaker hole (208) may be formed on a side surface of the housing (210) (e.g., side surface (210C) of FIG. 2A). For example, the speaker hole (208) may be positioned adjacent to the fastening portion (401) to which the speaker assembly (400) is fastened in order to transmit audio output from the speaker assembly (400) to the outside of the electronic device (200). For example, the acoustic duct (403) may be a path for audio output from the speaker assembly (400) to be transmitted to the outside of the electronic device (200). For example, the sound duct (403) may be connected from the speaker hole (208) to the internal space of the housing (210). For example, one end of the sound duct (403) may be connected to the speaker hole (208). The other end of the sound duct (403), opposite to the one end, may be connected to the diaphragm (470) of the speaker assembly (400) connected to the connecting portion (401). The housing (210) may provide a path for audio output from the speaker assembly (400) by including the speaker hole (208) and the sound duct (403).

[0075] According to one embodiment, the housing (210) may include a support portion (402) for supporting the speaker assembly (400). The diaphragm (470) may include a first elastic member (471) attached on the coil (460), and a second elastic member (472) extending from the first elastic member (471) and being at least partially pressed by the support portion (402) to reduce the inflow of foreign substances from the outside of the electronic device (200) into the magnet (430). For example, the first elastic member (471) may be a portion of the diaphragm (470) that can be deformed by the vibration of the coil (460). The first elastic member (471) may be a portion that outputs audio by the vibration of the coil (460). For example, the support portion (402) of the housing (210) may be a portion that comes into contact with the diaphragm (470) of the speaker assembly (400) that is fastened to the fastening portion (401). The support portion (402) may be a portion in which an acoustic duct (403) for audio output from the speaker assembly (400) is formed.

[0076] For example, the second elastic member (472) can support the first elastic member (471) by being coupled with the first elastic member (471). The second elastic member (472) can at least partially contact the support portion (402) of the housing (210). For example, the second elastic member (472) can reduce foreign substances from entering the internal space of the housing (210) from the outside of the electronic device (200) through the speaker hole (208) and the sound duct (403) by pressing the support portion (402). The second elastic member (472) can improve the sound quality of the speaker assembly (400) by reducing the inflow of foreign substances from the outside into the support structure (450) where the magnetic field of the speaker assembly (400) is formed. The second elastic member (472) may be referred to as a waterproof structure in that it reduces the inflow of foreign substances from the outside of the electronic device (200) into the inside of the electronic device (200), but is not limited thereto.

[0077] According to one embodiment, the electronic device (200) may include a support member (480) that supports a first plate (410) of the speaker assembly (400) and is fastened to the fastening portion (401). For example, the support member (480) may surround at least a portion of the speaker assembly (400) fastened to the fastening portion (401). For example, the support member (480) may be fastened to the fastening portion (401) together with the speaker assembly (400). For example, a portion of the support member (480) may be in contact with the speaker assembly (400). For example, a portion of the support member (480) may face the first plate (410) of the speaker assembly (400). For example, the housing (210) may include a protruding structure (405) spaced apart from the fastening portion (401). A part of the support member (480) for supporting the speaker assembly (400) can support the speaker assembly (400) by being combined with the protruding structure (405). The electronic device (200) can reduce the speaker assembly (400) from being separated from the housing (210) due to external impact by including the support member (480).

[0078] According to one embodiment, the speaker assembly (400) may include a fastening structure (440) fastened to a fastening portion (401) of the housing (210). For example, the fastening structure (440) may protrude from the speaker assembly (400). For example, the fastening structure (440) may extend from a component of the speaker assembly (400). For example, the fastening structure (440) may be supported by the fastening portion (401). By including the fastening structure (440) fastened to the fastening portion (401) of the housing (210), the speaker assembly (400) may reduce detachment from the housing (210).

[0079] According to one embodiment, the speaker assembly (400) may be pressurized by foreign substances entering from the outside of the electronic device (200). For example, the diaphragm (470) of the speaker assembly (400) may be pressurized toward the internal space of the housing (210) by foreign substances entering from the outside of the electronic device (200) through the speaker hole (208) and the sound duct (403). The fastening structure (440) of the speaker assembly (400) may be deformed along the speaker assembly (400) being pressed by the foreign substances. The fastening structure (440) may be required to have a structure that reduces deterioration of the sound quality of the speaker assembly (400) due to deformation of the fastening structure (440) and reduces the foreign substances entering into the internal space of the housing (210). The structure of the above fastening structure (440) that improves the fastening property of the speaker assembly (400) to the housing (210) is described below in FIG. 5a.

[0080] According to one embodiment, the electronic device (200) may include a fastening member (490) for fastening the speaker assembly (400) to the housing (210). For example, the fastening member (490) may fasten the fastening structure (440) of the speaker assembly (400) to the fastening portion (401). For example, the fastening member (490) may be coupled with at least a portion of the fastening structure (440) and the fastening portion (401). The fastening member (490) may penetrate at least a portion of the fastening structure (440) and the fastening portion (401). For example, the electronic device (200) may include a support member (480) fastened to the fastening portion (401) and for supporting the speaker assembly (400). The fastening member (490) can fasten the speaker assembly (400) and the support member (480) to the fastening member (401) by being combined with the fastening portion (401), the fastening structure (440) of the speaker assembly (400), and the support member (480).

[0081] According to the above-described embodiment, the electronic device (200) can provide sound to a user of the electronic device (200) by including a speaker assembly (400). The speaker assembly (400) can output audio by including a support structure (450) and a vibration plate (470) configured to vibrate by the support structure (450). The first plate (410) of the support structure (450) can improve the sound quality of audio output from the speaker assembly (400) by being coupled with the second plate (420).

[0082] Figure 5a is an exploded perspective view of a speaker assembly of an exemplary electronic device. Figure 5b is a partially exploded perspective view of a speaker assembly of an exemplary electronic device. Figure 5c is a perspective view of a speaker assembly of an exemplary electronic device.

[0083] Referring to FIGS. 5A, 5B, and 5C, an electronic device (e.g., electronic device (200) of FIG. 2A) may include a housing (e.g., housing (210) of FIG. 2A) including a fastening portion (e.g., fastening portion 401) of FIG. 4A), a speaker assembly (400) disposed within the housing (210) and configured to output audio. The speaker assembly (400) may include a support structure (450) that forms a magnetic field and includes a first plate (410), a magnet (430) attached to the first plate (410), and a second plate (420) coupled to the first plate (410) and at least partially disposed on the magnet (430). The speaker assembly (400) may include a coil (460) configured to vibrate by the magnetic field, and a vibration plate (470) attached to the coil (460).

[0084] Hereinafter, redundant descriptions of configurations having the same reference numerals as those described above in FIGS. 4a and 4b are omitted.

[0085] According to one embodiment, the support structure (450) can be fastened to the fastening portion (401) of the housing (210) to couple the speaker assembly (400) to the housing (210). For example, the support structure (450) can be coupled to the housing (210). For example, at least a portion of the support structure (450) can be fastened to the fastening portion (401) to fix the position of the speaker assembly (400) with respect to the housing (210). For example, at least a portion of the first plate (410) and / or the second plate (420) of the support structure (450) can be fastened to the fastening portion (401) of the housing (210). The support structure (450) can be configured to be fastened to the fastening portion (401) of the housing (210), thereby improving the fastening property of the speaker assembly (400) with respect to the housing (210).

[0086] According to one embodiment, the support structure (450) may further include a fastening structure (440) supported by the fastening portion (401) and for fastening the speaker assembly (400) to the fastening portion (401). The fastening structure (440) may be at least partially formed by at least one of the first plate (410) and the second plate (420). For example, referring to FIGS. 5A and 5B , the fastening structure (440) may be formed on the second plate (420) of the support structure (450). Since the second plate (420) is coupled with the first plate (410) to which the magnet (430) is attached, the fastening structure (440) may be coupled with the first plate (410) and the magnet (430). The above-described fastening structure (440) is formed on the second plate (420), thereby improving the fastening property of the speaker assembly (400) to the housing (210) while the fastening structure (440) is fastened to the fastening portion (401) of the housing (210). For example, referring to FIG. 5c, unlike as shown in FIGS. 5a and 5b, the fastening structure (440) may be formed on the first plate (410) of the support structure (450). Since the first plate (410) to which the magnet (430) is attached is coupled with the second plate (420), the fastening structure (440) may be coupled with the second plate (420). The above fastening structure (440) is formed on the first plate (410), thereby improving the fastening property of the speaker assembly (400) to the housing (210) while the fastening structure (440) is fastened to the fastening portion (401) of the housing (210).

[0087] Although the first plate (410) or the second plate (420) has been described as including a fastening structure (440), it is not limited thereto. Although not illustrated, the fastening structure (440) may be formed by combining a portion of the first plate (410) and a portion of the second plate (420). The fastening structure (440) may be formed within the support structure (450) so that the support structure (450) is fastened to the housing (210), thereby simplifying the structure of the speaker assembly (400) and improving the fastening property of the speaker assembly (400) to the housing (210) while the speaker assembly (400) is fastened to the housing (210).

[0088] According to one embodiment, the first plate (410) and the second plate (420) may include metal. For example, the first plate (410) and the second plate (420) may each include metal, thereby forming a magnetic field within the support structure (450) together with the magnet (430). Since the first plate (410) and the second plate (420) each include metal, the support structure (450) that is fastened to the fastening portion (401) of the housing (210) may improve the fastening property of the speaker assembly (400) to the housing (210).

[0089] Referring to FIGS. 5a and 5b, the second plate (420) may include a first portion (421) positioned on a magnet (430) and including a hole (421a) for passing a coil (460), and a second portion (422) connected to the first portion (421) and for fastening a support structure (450) to a fastening portion (401).

[0090] For example, the first part (421) may be a part disposed on the magnet (430). The first part (421) may be a part that forms a magnetic field of the support structure (450) together with the magnet (430). For example, the first part (421) may allow the coil (460) to pass through a hole (421a) so that the coil (460) can at least partially face the magnet (430). For example, the magnet (430) may include a first magnet (431), a second magnet (432) spaced apart from the first magnet (431), and a third magnet between the first magnet (431) and the second magnet (432). For example, the first part (421) may be positioned on the first magnet (431) and the second magnet (432). The hole (421a) of the first part (421) may be positioned on the third magnet (433) such that the coil (460) passing through the hole (421a) is at least partially disposed within the gap between the first magnet (431) and the third magnet (433), and within the gap between the second magnet (432) and the third magnet (433). The coil (460) may partially surround the third magnet (433). By partially surrounding the third magnet (433), the coil (460) may be configured to vibrate by a magnetic field formed by the support structure (450).

[0091] For example, the second portion (422) may be referred to as a fastening structure (440) for fastening with the fastening portion (401) of the housing (210). For example, the second portion (422) may protrude from the speaker assembly (400) by extending from the first portion (421). For example, the second portion (422) may include a structure for fastening with the first plate (410).

[0092] According to one embodiment, the electronic device (200) may include a fastening member (e.g., fastening member (490) of FIG. 4A) for fastening the speaker assembly (400) to the housing (210). The second portion (422) may include a first fastening hole (441) for fastening the second plate (420) to the fastening portion (401) by passing the fastening member (490). For example, the fastening member (490) may couple the second portion (422) to the fastening portion (401) of the housing (210) by passing through the first fastening hole (441). Through the fastening member (490), the second portion (422) may be fastened to the fastening portion (401) of the housing (210). By fastening the second part (422) of the second plate (420) to the housing (210), the support structure (450) can improve the fastening property of the speaker assembly (400) to the housing (210).

[0093] Referring to FIG. 5c, the first plate (410) may include a first region (411) on which a magnet (430) is disposed, and a second region (412) extending from the first region (411) and for fastening a support structure (450) to a fastening portion (401).

[0094] For example, the first region (411) may be a region attached to the magnet (430). The first region (411) may be a region that supports the magnet (430). For example, the first region (411) may be a region facing the coil (460) that has passed through the hole (421a) of the second plate (420). For example, the second region (412) may be referred to as a fastening structure (440) for fastening with the fastening portion (401) of the housing (210). For example, the second region (412) may protrude from the speaker assembly (400). For example, the second region (412) may include a structure for fastening with the first plate (410).

[0095] According to one embodiment, the electronic device (200) may include a fastening member (490) for fastening the speaker assembly (400) to the housing (210). The housing (210) may include a protruding structure (e.g., a protruding structure (405) of FIG. 4A) spaced apart from the fastening portion (401). The second region (412) may be a region including a structure for coupling with the second plate (420). The second region (412) may include a second fastening hole (442) for fastening the first plate (410) to the fastening portion (401) by passing the fastening member (490), and a structure for fastening the first plate (410) to the second plate (420) (e.g., first coupling grooves (531, 532) of FIG. 5B). The first plate (410) may include a third region (413) that is spaced apart from the second region (412) that extends from the first region (411) and includes a coupling hole (443) for inserting the protruding structure (405). For example, a fastening member (490) may connect the second region (412) to the fastening portion (401) of the housing (210) by penetrating the second fastening hole (442). Through the fastening member (490), the second region (412) may be fastened to the fastening portion (401) of the housing (210).

[0096] For example, the third region (413) may extend in a direction different from the direction in which the second region (412) extends from the first region (411). The coupling hole (443) in the third region (413) may be coupled to the protruding structure (405) of the housing (210) while the second region (412) is coupled to the coupling portion (401) of the housing (210). The third region (413) may be coupled to the protruding structure (405) to couple the first plate (410) to the housing (210) together with the second region (412). By coupling the second region (412) and the third region (413) to the housing (210), the support structure (450) may improve the coupling property of the speaker assembly (400) to the housing (210).

[0097] Referring again to FIGS. 5A, 5B, and 5C, the first plate (410) may include a first coupling structure (530) including first coupling grooves (531, 532) for coupling with the second plate (420). The second plate (420) may include:

[0098] The second coupling structure (540) may include first protrusions (541, 542) that are respectively fastened to the first coupling grooves (531, 532). For example, the first plate (410) may include a first region (411) to which a magnet (430) is attached, and a second region (412) that extends from the first region (411). The second plate (420) may include a first portion (421) positioned on the magnet (430), and a second portion (422) that extends from the first portion (421). The first coupling structure (530) may be formed within the second region (412) to be coupled to the second coupling structure (540). For example, the second coupling structure (540) may be formed within the second portion (422).

[0099] For example, the first protrusions (541, 542) may be positioned at least partially within the first coupling grooves (531, 532), respectively, thereby fastening the second plate (420) and the first plate (410). For example, the first protrusions (541, 542) may have a shape corresponding to the first coupling grooves (531, 532). For example, the first protrusions (541, 542) may be coupled to the first coupling grooves (531, 532) through soldering. However, the present invention is not limited thereto.

[0100] The first coupling structure (530) and the second coupling structure (540) have been described as structures for coupling the first plate (410) and the second plate (420), but are not limited thereto. The first plate (410) and the second plate (420) may each include a plurality of coupling structures for coupling to each other. By coupling the first plate (410) and the second plate (420), the support structure (450) can improve the fastening property to the housing (210) of the speaker assembly (400) and improve the sound quality of audio output from the speaker assembly (400).

[0101] According to one embodiment, the speaker assembly (400) may include a frame (510) that supports a diaphragm (470) and is coupled on the second plate (420). The second plate (420) may include a third coupling structure (550) that includes second protrusions (551, 552, 553, 554) for coupling with the frame (510). The frame (510) may include a fourth coupling structure (560) that includes second coupling grooves (561, 562, 563, 564) that are respectively fastened to the second protrusions (551, 552, 553, 554).

[0102] For example, the frame (510) may be coupled to the diaphragm (470). The frame (510) may be disposed between the diaphragm (470) and the support structure (450). For example, the frame (510) may be configured to press the diaphragm (470) toward the support portion (e.g., the support portion (402) of FIG. 4A) of the housing (210) while the speaker assembly (400) is fastened to the fastening portion (401) of the housing (210). For example, the frame (510) may be disposed on the support structure (450). The frame (510) may be in contact with the second plate (420) and / or the magnet (430) of the support structure (450). The above frame (510) can form at least a part of the exterior of the speaker assembly (400) and support the diaphragm (470) by being combined with the support structure (450).

[0103] For example, the second plate (420) may include a first portion (421) positioned on the magnet (430), and a second portion (422) extending from the first portion (421). In one embodiment, the third coupling structure (550) may be formed within the first portion (421) to be coupled to the frame (510). The second portion (422) may be a portion for coupling the speaker assembly (400) to the coupling portion (401) of the housing (210). For example, the second protrusions (551, 552, 553, 554) may be accommodated within the second coupling grooves (561, 562, 563, 564), respectively, thereby coupling the second plate (420) and the frame (510). For example, the second protrusions (551, 552, 553, 554) may have a shape corresponding to the shape of the second coupling grooves (561, 562, 563, 564). For example, the second protrusions (551, 552, 553, 554) may be respectively joined to the second coupling grooves (561, 562, 563, 564) through soldering. However, the present invention is not limited thereto.

[0104] The third coupling structure (550) and the fourth coupling structure (560) have been described as structures for coupling the support structure (450) and the frame (510), but are not limited thereto. The support structure (450) and the frame (510) may each include a plurality of coupling structures for coupling to each other. By coupling the support structure (450) and the frame (510), the speaker assembly (400) can improve the fastening property of the speaker assembly (400) to the housing (210) and improve the sound quality of audio output from the speaker assembly (400).

[0105] According to the above-described embodiment, the speaker assembly (400) of the electronic device (200) is configured such that a support structure (450) forming a magnetic field is fastened to the housing (210), thereby improving the fastening property of the speaker assembly (400) to the housing (210). The support structure (450) includes a structure in which a first plate (410) and a second plate are coupled, thereby improving the sound quality of audio output from the speaker assembly (400).

[0106] Figure 6a is a partially exploded perspective view of a speaker assembly of an exemplary electronic device. Figure 6b is a perspective view of a speaker assembly of an exemplary electronic device.

[0107] Referring to FIGS. 6A and 6B, an electronic device (e.g., the electronic device (200) of FIG. 2A) may include a housing (e.g., the housing (210) of FIG. 2A) including a fastening portion (e.g., the fastening portion (401) of FIG. 4A), a speaker assembly (400) disposed within the housing (210) and configured to output audio. The speaker assembly (400) may include a support structure (450) that forms a magnetic field and includes a first plate (410), a magnet (430) attached to the first plate (410), and a second plate (420) coupled to the first plate (410) and at least partially disposed on the magnet (430). The speaker assembly (400) may include a coil configured to vibrate by the magnetic field (e.g., the coil (460) of FIG. 4B), and a diaphragm (470) attached to the coil (460). The support structure (450) may be fastened to the fastening portion (401) to fasten the speaker assembly (400) to the housing (210). According to one embodiment, the first plate (410) may include a first coupling structure (530) to be coupled with the second plate (420). The second plate (420) may include a second coupling structure (540) coupled with the first coupling structure (530). According to one embodiment, the speaker assembly (400) may include a frame (510) that supports the diaphragm (470) and is coupled on the second plate (420). The second plate (420) may include a third coupling structure (550) to be coupled with the frame (510). The frame (510) may include a fourth coupling structure (560) coupled with the third coupling structure (550).

[0108] According to one embodiment, the speaker assembly (400) may include a coupling member (610) that couples the support structure (450) to the frame (510), the first plate (410), and the second plate (420). For example, the coupling member (610) may contact the support structure (450) and the frame (510). For example, the coupling member (610) may couple the frame (510) to the second plate (420). The coupling member (610) may couple the second plate (420) to the first plate (410) to which the magnet (430) is attached. For example, the first plate (410) may include a first region (411) to which a magnet (430) is attached, and a second region (412) extending from the first region (411). The second plate (420) may include a first portion (421) positioned on the magnet (430), and a second portion (422) extending from the first portion (421). The coupling member (610) may fasten the second portion (422) to the second region (412). The coupling member (610) may fasten the second portion (422) to the frame (510). However, the present invention is not limited thereto. The speaker assembly (400) includes a joining member (610) that joins the frame (510), the first plate (410), and the second plate (420), thereby improving the joining force between the components of the speaker assembly (400) and improving the sound quality of audio output from the speaker assembly (400).

[0109] According to one embodiment, the joining member (610) may include, but is not limited to, at least one of plastic and metal to fasten the frame (510), the first plate (410), and / or the second plate (420) to each other. By including the joining member (610), the speaker assembly (400) can reduce the separation of each component of the speaker assembly (400) from the speaker assembly (400).

[0110] According to one embodiment, the support structure (450) may further include a fastening structure (440) supported by the fastening portion (401) and for fastening the speaker assembly (400) to the fastening portion (401). The fastening structure (440) may be at least partially formed by at least one of the first plate (410) and the second plate (420). The support structure (450) may include a shielding member (620) attached on the fastening structure (440) to electrically disconnect the housing (210) and the speaker assembly (400). For example, the shielding member (620) may include a non-conductive material. The shielding member (620) may be disposed on one surface of the fastening structure (440) facing the fastening portion (401) when the fastening structure (440) is fastened to the fastening portion (401) of the housing (210). For example, the shielding member (620) may be positioned so as to be interposed between the fastening structure (440) and the fastening portion (401) while the speaker assembly (400) is fastened to the fastening portion (401). The support structure (450) may electrically isolate the first plate (410) and / or the second plate (420) having conductivity from the housing (210) by including the shielding member (620). The shielding member (620) may improve the sound quality of audio output from the speaker assembly (400) by electrically isolating the first plate (410) and / or the second plate (420) from the housing (210).

[0111] According to the above-described embodiment, the speaker assembly (400) of the electronic device (200) includes a joining member (610) that joins the support structure (450) and the frame (510), thereby improving the joining force between the components of the speaker assembly (400) and improving the sound quality of audio output from the speaker assembly (400). The supporting structure (450) includes a shielding member (620) that is attached on a joining structure (440) for joining with the housing (210), thereby improving the sound quality of audio output from the speaker assembly (400).

[0112] FIGS. 7A, 7B, 7C, 7D, and 7E are perspective views of a speaker assembly of an exemplary electronic device.

[0113] Referring to FIGS. 7A, 7B, 7C, 7D, and 7E, an electronic device (e.g., the electronic device (200) of FIG. 2A) may include a housing (e.g., the housing (210) of FIG. 2A) including a fastening portion (e.g., the fastening portion (401) of FIG. 2A), a speaker assembly (400) disposed within the housing (210) and configured to output audio. The speaker assembly (400) may include a support structure (450) that forms a magnetic field and includes a first plate (410), a magnet (430) attached to the first plate (410), and a second plate (420) coupled to the first plate (410) and at least partially disposed on the magnet (430). The speaker assembly (400) may include a coil configured to vibrate by the magnetic field (e.g., the coil (460) of FIG. 4B), and a diaphragm (470) attached to the coil (460). The speaker assembly (400) may include a frame (510) that supports the diaphragm (470) and is coupled to the second plate (420). The support structure (450) may be coupled to the fastening portion (401) to couple the speaker assembly (400) to the housing (210). The support structure (450) may be supported by the fastening portion (401) and may include a fastening structure (440) for fastening the speaker assembly (400) to the fastening portion (401). The fastening structure (440) may be at least partially formed by at least one of the first plate (410) and the second plate (420). The speaker assembly (400) may include a joining member (610) that joins the support structure (450) to the frame (510) by being joined to the frame (510), the first plate (410), and the second plate (420).

[0114] Referring to FIGS. 7A, 7B, and 7C, the coupling member (610) may include an assembling structure (611) for supporting the fastening structure (440). For example, the assembling structure (611) may be coupled to the fastening structure (440) by protruding from the speaker assembly (400). For example, the assembling structure (611) may be in contact with the fastening structure (440). For example, the assembling structure (611) may be coupled to the fastening portion (401) of the housing (210) together with the fastening structure (440).

[0115] Referring to Fig. 7b, the fastening structure (440) may include a first fastening region (440a) and a second fastening region (440b) spaced apart from the first fastening region (440a). The assembly structure (611) of the joining member (610) may reinforce the fastening structure (440) by being interposed between the first fastening region (440a) and the second fastening region (440b).

[0116] Referring to Fig. 7c, the assembly structure (611) may include a first assembling portion (611a) and a second assembling portion (611b) spaced apart from the first assembling portion (611a). A fastening structure (440) may be arranged between the first assembling portion (611a) and the second assembling portion (611b). The first assembling portion (611a) and the second assembling portion (611b) may reinforce the fastening structure (440) by supporting the fastening structure (440).

[0117] Referring to FIG. 7d, a portion of the fastening structure (440) may be formed by an assembly structure (611). In this case, the remaining portion of the fastening structure (440) may be formed by the first plate (410) and / or the second plate (420) of the support structure (450). The assembly structure (611) may reinforce or replace the fastening structure (440) by forming at least a portion of the fastening structure (440).

[0118] Referring to FIG. 7e, the angle (a) of the fastening structure (440) with respect to the speaker assembly (400) can be adjusted. In one embodiment, the fastening structure (440) can increase the fastening property of the speaker assembly (400) with respect to the housing (210) by forming various angles (a) with respect to the speaker assembly (400).

[0119] According to one embodiment, the fastening structure (440) may be rotatable with respect to the speaker assembly (400). Since the fastening structure (440) is rotatable with respect to the speaker assembly (400), the fastening structure (440) may have various angles (a) with respect to the speaker assembly (400). For example, the speaker assembly (400) may include a bearing (not shown) or a wheel structure (not shown) that is coupled with the fastening structure (440) and configured to rotate the fastening structure (440) with respect to the speaker assembly (400). The structure configured to rotate the fastening structure (440) may be formed, for example, within the coupling member (610). Since the fastening structure (440) is configured such that the angle (a) is adjustable, the fastening property of the fastening structure (440) with respect to the housing (210) may be improved.

[0120] According to the above-described embodiment, the speaker assembly (400) of the electronic device (200) includes an assembly structure (611) that forms at least a part of a fastening structure (440) that is fastened to a fastening portion (401) of the housing (210) or supports the fastening structure (440), thereby reducing damage to the fastening structure (440) due to external impact and improving the fastening property of the fastening structure (440) to the housing (210).

[0121] Fig. 8a illustrates a portion of an exemplary electronic device. Fig. 8b is a partial cross-sectional view of the exemplary electronic device taken along line B-B' of Fig. 8a.

[0122] Referring to FIGS. 8A and 8B , an electronic device (101) may include a housing (810) including a fastening portion (811), and a speaker assembly (400) disposed within the housing (810) and configured to output audio. The speaker assembly (400) may include a support structure (450) that forms a magnetic field and includes a first plate (410), a magnet (430) attached to the first plate (410), and a second plate (420) coupled to the first plate (410) and at least partially disposed on the magnet (430). The speaker assembly (400) may include a coil (460) configured to vibrate by the magnetic field, and a diaphragm (470) attached to the coil (460). The above support structure (450) may be fastened to the fastening portion (811) to couple the speaker assembly (400) to the housing (810). According to one embodiment, the housing (810) may include a support portion (812). The support portion (812) may support the diaphragm (470) of the speaker assembly (400). According to one embodiment, the housing (810) may include a speaker hole (813) and an acoustic duct (814).

[0123] According to one embodiment, the electronic device (101) may be a different electronic device than the electronic device (200) illustrated in FIGS. 2A to 7B. For example, the electronic device (101) may be referred to as the electronic device (101) of FIG. 1, which is connectable to the electronic device (200) illustrated in FIGS. 2A to 7B.

[0124] According to one embodiment, the support structure (450) may include a fastening structure (440) for fastening to a fastening portion (811) of the housing (810). The fastening structure (440) may be formed, for example, on the first plate (410) or the second plate (420) of the support structure (450). The support structure (450) may be fastened to the housing (810) to improve the fastening property of the speaker assembly (400) to the housing (810).

[0125] For example, the speaker assembly (400) may be placed on an acoustic duct (814) connected to a speaker hole (813). The diaphragm (470) of the speaker assembly (400) may be placed toward the acoustic duct (814) to output sound through the speaker hole (813). The fastening structure (440) of the speaker assembly (400) may be fastened to a fastening portion (811) of the housing (810), thereby fixing the speaker assembly (400) to the housing (810) so that the diaphragm (470) faces the acoustic duct (814). For example, the fastening structure (440) may be configured to protrude from a second plate (420) of a support structure (450) so as to be coupled with the fastening portion (811) of the housing (810). For example, although not shown, the fastening structure (440) may be configured to be coupled with the fastening portion (811) of the housing (810) by protruding from the first plate (410) of the support structure (450). For example, the fastening structure (440) may be coupled with the fastening portion (811) of the housing (810) via a fastening member (e.g., the fastening member (490) of FIG. 4A). For example, a frame (510) coupled with the support structure (450) and for supporting the diaphragm (470) may be mounted on the support portion (812) of the housing (810). The speaker assembly (400) can improve the fastening property with the housing (810) by being coupled with the housing (810) such that the fastening structure (440) is fastened to the fastening portion (811) of the housing (810) and the frame (510) is supported on the support portion (812) of the housing (810). However, the present invention is not limited thereto.

[0126] The speaker assembly (400) can be placed in various electronic devices including an electronic device (101) and an electronic device (200). The support structure (450) that forms the magnetic field of the speaker assembly (400) is configured to be fastened to the housing of the various electronic devices, thereby improving the fastening property of the speaker assembly (400) in the various electronic devices.

[0127] According to the above-described embodiment, the speaker assembly (400) of the electronic device (101) includes a support structure (450) that is fastened to the fastening portion (811) of the housing (810) of the electronic device (101) and forms a magnetic field, thereby improving the fastening property of the speaker assembly (400) to the housing (810).

[0128] According to the above-described embodiment, an electronic device (e.g., electronic device (101) of FIG. 1, electronic device (200) of FIG. 2A) may include a housing (e.g., housing (210) of FIG. 2A, housing (810) of FIG. 8A) including a fastening portion (e.g., fastening portion (401) of FIG. 2A, fastening portion (811) of FIG. 8A). The electronic device may include a speaker assembly (e.g., speaker assembly (400) of FIG. 4A) disposed within the housing and configured to output audio. The speaker assembly may include a support structure (e.g., a support structure (450) of FIG. 4B) that forms a magnetic field and includes a first plate (e.g., a first plate (4100) of FIG. 4B), a magnet (e.g., a magnet (430) of FIG. 4B) attached to the first plate, and a second plate (e.g., a second plate (420) of FIG. 4B) coupled to the first plate and at least partially disposed on the magnet. The speaker assembly may include a coil (e.g., a coil (460) of FIG. 4B) configured to vibrate by the magnetic field, and a diaphragm (e.g., a diaphragm (470) of FIG. 4B) attached to the coil. The support structure may be fastened to the fastening portion to couple the speaker assembly to the housing. According to the above-mentioned embodiment, the speaker assembly is configured such that the support structure that forms the magnetic field is fastened to the housing, thereby forming the speaker. The fastening properties of the assembly to the housing can be improved and the sound quality of the audio output from the speaker assembly can be improved. The above-mentioned embodiment can have various effects including the above-mentioned effects.

[0129] According to one embodiment, the second plate may include a hole for passing the coil (e.g., hole (421a) of FIG. 5A) and a first portion (e.g., first portion (421) of FIG. 5A) attached to the magnet, and a second portion (e.g., second portion (422) of FIG. 5A) connected to the first portion and for fastening the support structure to the fastening portion. According to the above-mentioned embodiment, the speaker assembly may improve the fastening property of the speaker assembly to the housing and improve the sound quality of the audio output from the speaker assembly by being configured such that the second plate is fastened to the housing. The above-mentioned embodiment may have various effects including the above-mentioned effects.

[0130] According to one embodiment, the electronic device may further include a fastening member (e.g., a fastening member (490) of FIG. 4A) for fastening the speaker assembly to the housing. The second portion may include a fastening hole (e.g., a first fastening hole (441) of FIG. 5A) for fastening the second plate to the fastening portion by passing the fastening member therethrough. According to the above-mentioned embodiment, the speaker assembly is configured such that the second plate is fastened to the housing, thereby improving the fastening property of the speaker assembly to the housing and improving the sound quality of the audio output from the speaker assembly. The above-mentioned embodiment may have various effects including the above-mentioned effects.

[0131] According to one embodiment, the first plate may include a first region (e.g., the first region (411) of FIG. 5C) on which the magnet is disposed, and a second region (e.g., the second region (412) of FIG. 5C) extending from the first region and for fastening the support structure to the fastening portion. According to the above-mentioned embodiment, the speaker assembly may improve the fastening property of the speaker assembly to the housing by being configured such that the first plate is fastened to the housing, and may improve the sound quality of the audio output from the speaker assembly. The above-mentioned embodiment may have various effects including the above-mentioned effects.

[0132] According to one embodiment, the electronic device may further include a fastening member for fastening the speaker assembly to the housing. The housing may further include a protruding structure (e.g., the protruding structure (405) of FIG. 4A) spaced apart from the fastening portion. The first plate may further include a third region (e.g., the third region (414) of FIG. 5C) spaced apart from the second region, which extends from the first region and includes a coupling hole (e.g., the coupling hole (443) of FIG. 5C) into which the protruding structure is inserted. The second region may include a fastening hole (e.g., the second fastening hole (442) of FIG. 5C) for fastening the first plate to the fastening portion by passing the fastening member therethrough. According to the above-mentioned embodiment, the speaker assembly is configured such that the first plate is fastened to the housing, thereby improving the fastening property of the speaker assembly to the housing and improving the sound quality of the audio output from the speaker assembly. The above-mentioned embodiment may have various effects including the above-mentioned effects.

[0133] According to one embodiment, the first plate may include a first coupling structure (e.g., the first coupling structure (530) of FIG. 5B) including first coupling grooves (e.g., the first coupling grooves (531, 532) of FIG. 5B) for coupling with the second plate. The second plate may include a second coupling structure (e.g., the second coupling structure (540) of FIG. 5B) including first protrusions (e.g., the first protrusions (541, 542) of FIG. 5B) that are respectively fastened to the first coupling grooves. According to the above-mentioned embodiment, the speaker assembly may improve the fastening property of the speaker assembly to the housing and improve the sound quality of the audio output from the speaker assembly by including a structure in which the first plate is coupled with the second plate. The above-mentioned embodiment may have various effects including the above-mentioned effects.

[0134] According to one embodiment, the speaker assembly may further include a frame (e.g., frame (510) of FIG. 5A) that supports the diaphragm and is coupled on the second plate. The second plate may include a third coupling structure (e.g., third coupling structure (550) of FIG. 5A) that includes second protrusions (e.g., second protrusions (551, 552, 553, 554) of FIG. 5A) for coupling with the frame. The frame may include a fourth coupling structure (e.g., fourth coupling structure (560) of FIG. 5A) that includes second coupling grooves (e.g., second coupling grooves (561, 562, 563, 564) of FIG. 5A) that are respectively fastened to the second protrusions. According to the above-mentioned embodiment, the speaker assembly can improve the fastening property of the speaker assembly to the housing and improve the sound quality of the audio output from the speaker assembly by including a structure in which the support structure is coupled to the frame. The above-mentioned embodiment can have various effects including the above-mentioned effects.

[0135] According to one embodiment, the speaker assembly may further include a coupling member (e.g., coupling member (610) of FIG. 6A) that is coupled to the frame, the first plate, and the second plate to couple the support structure to the frame. According to the above-mentioned embodiment, the speaker assembly may improve the fastening property of the speaker assembly to the housing by including the coupling member. The above-mentioned embodiment may have various effects including the above-mentioned effects.

[0136] According to one embodiment, the housing may further include a support portion (e.g., a support portion (402) of FIG. 4B) for supporting the speaker assembly. The diaphragm may include a first elastic member (e.g., a first elastic member (471) of FIG. 4B) attached on the coil, and a second elastic member (e.g., a second elastic member (472) of FIG. 4B) extending from the first elastic member and being at least partially pressed by the support portion to reduce the inflow of foreign substances from the outside of the electronic device into the magnet. According to the above-mentioned embodiment, the diaphragm may provide sound to a user and reduce the inflow of foreign substances from the outside into the inside of the electronic device by including the first elastic member and the second elastic member. The above-mentioned embodiment may have various effects including the above-mentioned effects.

[0137] In one embodiment, the magnet may include a first magnet attached to the second plate (e.g., the first magnet (431) of FIG. 4B), a second magnet attached to the second plate and spaced apart from the first magnet (e.g., the second magnet (432) of FIG. 4B), and a third magnet between the first magnet and the second magnet (e.g., the third magnet (433) of FIG. 4B). The coil may partially surround the third magnet. In the above-mentioned embodiment, the coil may be configured to vibrate by a magnetic field formed by the coil by partially surrounding the third magnet. The above-mentioned embodiment may have various effects including the above-mentioned effects.

[0138] According to one embodiment, the support structure may further include a fastening structure (e.g., a fastening structure (440) of FIG. 4A) that is supported by the fastening portion and fastens the speaker assembly to the fastening portion. The fastening structure may be at least partially formed by at least one of the first plate and the second plate. According to the above-mentioned embodiment, the speaker assembly may be configured such that the support structure that forms the magnetic field is fastened to the housing, thereby improving the fastening property of the speaker assembly to the housing and improving the sound quality of the audio output from the speaker assembly. The above-mentioned embodiment may have various effects including the above-mentioned effects.

[0139] According to one embodiment, the support structure may further include a shielding member (e.g., the shielding member (620) of FIG. 6B) attached to the fastening structure to electrically disconnect the housing and the speaker assembly. According to the above-mentioned embodiment, the support structure may improve the sound quality of the audio output from the speaker assembly by including the shielding member. The above-mentioned embodiment may have various effects including the above-mentioned effects.

[0140] According to one embodiment, the housing may further include a speaker hole (e.g., a speaker hole (208) of FIG. 4A, a speaker hole (813) of FIG. 8A), and an acoustic duct for the audio (e.g., an acoustic duct (403) of FIG. 4B, an acoustic duct (814) of FIG. 8B) extending from the speaker hole to the diaphragm of the speaker assembly fastened to the fastening portion. According to the above-mentioned embodiment, the housing may provide a path for audio output from the speaker assembly by including the speaker hole and the acoustic duct. The above-mentioned embodiment may have various effects including the above-mentioned effects.

[0141] According to one embodiment, the electronic device may further include a support member (e.g., support member (480) of FIG. 4A) that supports the first plate of the speaker assembly fastened to the fastening portion and is fastened to the fastening portion. According to the above-mentioned embodiment, the electronic device may reduce the speaker assembly from being detached from the housing by including the support member. The above-mentioned embodiment may have various effects including the above-mentioned effects.

[0142] According to one embodiment, the first plate and the second plate may each include metal. According to the above-mentioned embodiment, the first plate and the second plate may each include metal, thereby forming a magnetic field together with the magnet and improving the fastening property of the speaker assembly to the housing. The above-mentioned embodiment may have various effects, including the effects mentioned above.

[0143] In one embodiment, an electronic device may include a housing including a fastening portion. The electronic device may include a speaker assembly disposed within the housing and configured to output audio. The speaker assembly may include a support structure that forms a magnetic field and includes a first plate, a magnet attached to the first plate, a second plate coupled to the first plate and at least partially disposed on the magnet, and a fastening structure supported by the fastening portion and configured to fasten the speaker assembly to the fastening portion. The speaker assembly may include a diaphragm configured to vibrate due to the magnetic field. The fastening structure may be at least partially formed by at least one of the first plate and the second plate. According to the above-mentioned embodiment, the speaker assembly may improve the fastening property of the speaker assembly to the housing and improve the sound quality of the audio output from the speaker assembly by being configured such that the support structure that forms the magnetic field is fastened to the housing. The above-mentioned embodiment may have various effects including the effects mentioned above.

[0144] According to one embodiment, the first plate may include a first coupling structure including first coupling grooves for coupling with the second plate. The second plate may include a second coupling structure including first protrusions that are respectively coupled to the first coupling grooves. According to the above-mentioned embodiment, the speaker assembly may include a structure in which the first plate is coupled with the second plate, thereby improving the coupling property of the speaker assembly to the housing and improving the sound quality of the audio output from the speaker assembly. The above-mentioned embodiment may have various effects including the above-mentioned effects.

[0145] According to one embodiment, the speaker assembly may further include a frame that supports the diaphragm and is coupled on the second plate. The second plate may include a third coupling structure that includes second protrusions for coupling with the frame. The frame may include a fourth coupling structure that includes second coupling grooves that are respectively fastened to the second protrusions. According to the above-mentioned embodiment, the speaker assembly may improve the fastening property of the speaker assembly to the housing and improve the sound quality of the audio output from the speaker assembly by including a structure in which the support structure is coupled with the frame. The above-mentioned embodiment may have various effects including the above-mentioned effects.

[0146] According to one embodiment, the electronic device may further include a coil attached to the diaphragm and configured to vibrate the diaphragm by interacting with the magnetic field. The housing may further include a support portion for supporting the speaker assembly. The diaphragm may include a first elastic member attached on the coil, and a second elastic member extending from the first elastic member and being at least partially pressed by the support portion to reduce the inflow of foreign substances from the outside of the electronic device into the magnet. According to the above-mentioned embodiment, the diaphragm may provide sound to a user and reduce the inflow of foreign substances from the outside into the inside of the electronic device by including the first elastic member and the second elastic member. The above-mentioned embodiment may have various effects including the above-mentioned effects.

[0147] According to one embodiment, the support structure may further include a shielding member attached to the fastening structure to electrically isolate the housing and the speaker assembly. According to the above-mentioned embodiment, the support structure may improve the sound quality of the audio output from the speaker assembly by including the shielding member. The above-mentioned embodiment may have various effects, including the above-mentioned effects.

[0148] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, electronic devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0149] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0150] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0151] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0152] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as included in a computer program product. The computer program product may be traded as a commodity between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0153] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In an electronic device (101; 200), a housing (210; 810) including a fastening portion (401; 811); and A speaker assembly (400) disposed within the housing (210; 810) and configured to output audio; The above speaker assembly (400) is A support structure (450) forming a magnetic field, comprising a first plate (410), a magnet (430) attached to the first plate (410), and a second plate (420) coupled with the first plate (410) and at least partially disposed on the magnet (430); A coil (460) configured to vibrate by the above magnetic field; and It includes a diaphragm (470) attached to the above coil (460); The above support structure (450) is To attach the speaker assembly (400) to the housing (210; 810), the speaker assembly (400) is attached to the attachment part (401; 811). Electronic devices (101; 200).

2. In paragraph 1, The above second plate (420) is, A first part (421) including a hole (421a) for passing the coil (460) through and attached to the magnet (430); and A second part (422) connected to the first part (421) and for fastening the support structure (450) to the fastening part (401; 811); Electronic devices (101; 200).

3. In paragraph 1 or 2, Further comprising a fastening member (490) for fastening the speaker assembly (400) to the housing (210; 810); The above second part (422) is, A fastening hole (441) for fastening the second plate (420) to the fastening portion (401; 811) by passing through the fastening member (490); Electronic devices (101; 200).

4. In any one of paragraphs 1 to 3, The above first plate (410) is, A first region (411) in which the magnet (430) is disposed; and A second region (412) extending from the first region (411) and for fastening the support structure (450) to the fastening portion (401; 811); Electronic devices (101; 200).

5. In paragraph 4, Further comprising a fastening member (490) for fastening the speaker assembly (400) to the housing (210; 810); The above housing (210; 810) is Further comprising a protruding structure (405) spaced apart from the above-mentioned fastening portion (401; 811); The above first plate (410) is, Further comprising a third region (413) extending from the first region (411) and spaced apart from the second region (412) including a coupling hole (443) for inserting the protruding structure (405); The above second area (412) is, A fastening hole (442) for fastening the first plate (410) to the fastening portion (401; 811) by passing through the fastening member (490); Electronic devices (101; 200).

6. In any one of paragraphs 1 to 5, The above first plate (410) is, A first coupling structure (530) including first coupling grooves (531; 532) for coupling with the second plate (420); The above second plate (420) is, A second coupling structure (540) including first protrusions (541; 542) respectively fastened to the first coupling grooves (531; 532); Electronic devices (101; 200).

7. In any one of paragraphs 1 to 6, The above speaker assembly (400) is It further includes a frame (510) that supports the above vibration plate (470) and is coupled on the second plate (420); The above second plate (420) is, A third coupling structure (550) including second protrusions (551; 552; 553; 554) for coupling with the above frame (510); The above frame (510) is A fourth coupling structure (560) including second coupling grooves (561; 562; 563; 564) respectively fastened to the second protrusions (551; 552; 553; 554); Electronic devices (101; 200).

8. In paragraph 7, The above speaker assembly (400) is A coupling member (610) that is coupled to the frame (510), the first plate (410), and the second plate (420) to couple the support structure (450) to the frame (510) is further included. Electronic devices (101; 200).

9. In any one of paragraphs 1 to 8, The above housing (210; 810) is Further comprising a support part (402; 812) for supporting the above speaker assembly (400); The above vibration plate (470) is A first elastic member (471) attached to the above coil (460); and A second elastic member (472) extending from the first elastic member (471) and at least partially pressurized by the support portion (402; 812) to reduce the inflow of foreign substances from the outside of the electronic device into the magnet (430); Electronic devices (101; 200).

10. In any one of paragraphs 1 to 9, The above magnet (430) is A first magnet (431) attached to the second plate (420); A second magnet (432) attached to the second plate (420) and spaced apart from the first magnet (431); and Including a third magnet (433) between the first magnet (431) and the second magnet (432); The above coil (460) is Partially surrounding the above third magnet (433), Electronic devices (101; 200).

11. In any one of paragraphs 1 to 10, The above support structure (450) is It further includes a fastening structure (440) supported by the fastening portion (401; 811) and for fastening the speaker assembly (400) to the fastening portion (401; 811); The above-mentioned fastening structure (440) is At least partially formed by at least one of the first plate (410) and the second plate (420), Electronic devices (101; 200).

12. In paragraph 11, The above support structure (450) is In order to electrically disconnect the housing (210; 810) and the speaker assembly (400), a shielding member (620) attached to the fastening structure (440) is further included. Electronic devices (101; 200).

13. In any one of paragraphs 1 to 12, The above housing (210; 810) is Speaker Hall (208; 813); and Further comprising an acoustic duct (403; 814) for the audio extending from the speaker hole (208; 813) to the diaphragm (470) of the speaker assembly (400) fastened to the fastening portion (401; 811); Electronic devices (101; 200).

14. In any one of paragraphs 1 to 13, Supporting the first plate (410) of the speaker assembly (400) fastened to the fastening portion (401; 811), and further including a supporting member (480) fastened to the fastening portion (401; 811); Electronic devices (101; 200).

15. In any one of paragraphs 1 to 14, The above first plate (410) and the above second plate (420), Each containing a metal, Electronic devices (101; 200).

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