Electronic device including hinge and movable antenna cable

Abstract

The present disclosure relates to an electronic device. According to an embodiment of the present disclosure, there may be provided an electronic device including: a housing including a first housing and a second housing; a hinge module for rotatably coupling the first housing with respect to the second housing; a circuit board disposed in the first housing; an antenna module disposed in the inner space of the hinge module; a signal line connected to the antenna module; an electronic component disposed on the circuit board; and a first guide member configured to move a portion of the signal line away from the electronic component when the second housing rotates in a first rotation direction with respect to the first housing.

Description

Electronic device including a hinge and a movable antenna cable

[0001] Embodiments of the present disclosure relate to electronic devices, for example, electronic devices including a hinge and a movable antenna cable.

[0002] Thanks to remarkable advancements in information and communication technology and semiconductor technology, the proliferation and use of various electronic devices is rapidly increasing. In particular, recent electronic devices are being developed to enable portability and communication.

[0003] Electronic devices can refer to devices that perform specific functions based on the programs installed on them, such as home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, audio / video devices, desktop / laptop computers, and car navigation systems. For example, these electronic devices can output stored information as audio or video. As electronic device integration increases and ultra-high-speed, high-capacity wireless communications become more widespread, a single electronic device, such as a mobile communication terminal, can now be equipped with a variety of functions. For example, in addition to communication functions, entertainment functions such as games, multimedia functions such as music / video playback, communication and security functions such as mobile banking, and functions such as schedule management and electronic wallets are being integrated into a single electronic device. These electronic devices are becoming smaller and more portable for users.

[0004] As electronic devices become smaller, the need for optimal internal space increases.

[0005] Along with research to secure optimal internal space, efforts are being made to optimize component performance by protecting them from interference between components. For example, in an electronic device including a hinge, if an antenna is placed within the hinge's internal space, the signal lines connected to the antenna may be affected by other electronic components (e.g., noise reception), potentially degrading performance.

[0006] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art in connection with the present disclosure.

[0007] According to one embodiment of the present disclosure, an electronic device may be provided, comprising: a housing including a first housing and a second housing; a hinge module rotatably connecting the first housing with respect to the second housing; a circuit board disposed in the first housing; an antenna module disposed in an internal space of the hinge module; a signal line connected to the antenna module; an electronic component disposed on the circuit board; and a first guide member configured to move a portion of the signal line away from the electronic component when the second housing rotates in a first rotational direction with respect to the first housing.

[0008] According to one embodiment of the present disclosure, an electronic device may be provided, comprising: a housing including a first housing and a second housing coupled to the first housing; a circuit board disposed within the housing; a hinge module rotatably coupling the first housing and the second housing, the hinge module including: a hinge cover surrounding an internal space of the hinge module; and a hinge disposed at least partially within the internal space, the hinge module being disposed within the internal space or at a position adjacent to the internal space; an electronic component disposed within the housing; a coaxial cable connected from the antenna module; and a first guide member for guiding the coaxial cable. The electronic device may be configured such that when the first housing is open relative to the second housing, the coaxial cable is further away from the electronic component than when the first housing is closed relative to the second housing.

[0009] The above-described aspects or other aspects, configurations and / or advantages of one embodiment of the present disclosure may be further clarified by the following detailed description taken in conjunction with the accompanying drawings.

[0010] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment.

[0011] FIG. 2A is a perspective view of an electronic device in a folded state according to one embodiment of the present disclosure.

[0012] FIG. 2B is a perspective view of an electronic device in an unfolded state according to one embodiment of the present disclosure.

[0013] FIG. 3 is a plan view showing the interior of a first housing of an electronic device according to one embodiment of the present disclosure.

[0014] FIG. 4 is a perspective view showing a hinge cover according to one embodiment of the present disclosure.

[0015] FIG. 5 is a perspective view showing an antenna module according to one embodiment of the present disclosure.

[0016] FIG. 6 is a perspective view showing a second support member according to one embodiment of the present disclosure.

[0017] FIG. 7 is a perspective view showing a hinge according to one embodiment of the present disclosure.

[0018] FIG. 8 is a perspective view showing the relative arrangement relationship between a hinge and an antenna module according to one embodiment of the present disclosure.

[0019] FIG. 9 is a cross-sectional view of a hinge portion of an electronic device according to one embodiment of the present disclosure.

[0020] FIG. 10 is an enlarged view of the interior of an electronic device according to one embodiment of the present disclosure.

[0021] FIG. 11 is a perspective view showing a first guide member according to one embodiment of the present disclosure.

[0022] FIG. 12a is a drawing showing a first guide member (375) arranged on a circuit board (372) according to one embodiment of the present disclosure.

[0023] FIG. 12b is a drawing showing a first guide member arranged on a circuit board according to one embodiment of the present disclosure.

[0024] FIG. 12c is a drawing showing a first guide member arranged on a circuit board according to one embodiment of the present disclosure.

[0025] FIG. 13 is a drawing showing a fixing member according to one embodiment of the present disclosure.

[0026] FIG. 14 is an exploded perspective view showing a first plate, a second support member, and a conductive member according to one embodiment of the present disclosure.

[0027] FIG. 15 is a perspective view showing a second support member according to one embodiment of the present disclosure.

[0028] FIG. 16 is a drawing showing a cross-section of an electronic device according to one embodiment of the present disclosure.

[0029] FIG. 17 is a drawing showing a form in which a signal line is extended outside the hinge cover while being surrounded by the hinge cover, according to one embodiment of the present disclosure.

[0030] FIG. 18 is a drawing showing a form in which a signal line is extended outside the hinge cover while being surrounded by the hinge cover, according to one embodiment of the present disclosure.

[0031] FIG. 19 is a drawing showing the relative arrangement relationship between peripheral components and signal lines when the first housing is closed with respect to the second housing, according to one embodiment of the present disclosure.

[0032] FIG. 20 is a drawing showing the relative arrangement relationship between peripheral components and signal lines when the first housing is open with respect to the second housing, according to one embodiment of the present disclosure.

[0033] Throughout the attached drawings, similar reference numbers may be assigned to similar parts, components and / or structures.

[0034] The following description of the accompanying drawings may provide an understanding of various exemplary implementations of the present disclosure, including the claims and their equivalents. While the exemplary embodiments disclosed in the following description include numerous specific details to aid understanding, they are to be considered as one example of various exemplary embodiments. Accordingly, those skilled in the art will appreciate that various modifications and variations of the various implementations described in this disclosure may be made without departing from the scope and technical spirit of the disclosure. Furthermore, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0035] The terms and words used in the following description and claims are not limited to their reference meanings and can be used to clearly and consistently describe one embodiment of the present disclosure. Therefore, it will be apparent to those skilled in the art that the following description of various implementations of the disclosure is provided for illustrative purposes, not for the purpose of limiting the scope of the disclosure and its equivalents.

[0036] Unless the context clearly dictates otherwise, the singular forms of "a," "an," and "the" should be understood to include plural meanings. Thus, for example, "a component surface" could be understood to include one or more of the surfaces of the component.

[0037] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments.

[0038] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0039] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0040] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0041] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0042] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0043] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0044] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0045] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0046] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0047] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0048] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0049] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0050] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0051] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0052] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0053] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0054] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0055] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0056] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0057] According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0058] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0059] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0060] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0061] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0062] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0063] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0064] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0065] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0066] FIG. 2A is a perspective view of an electronic device in a folded state according to an embodiment of the present disclosure. FIG. 2B is a perspective view of an electronic device in an unfolded state according to an embodiment of the present disclosure.

[0067] In the detailed description below, the width direction of the electronic device (101) may be defined as the 'Y-axis direction', the length direction as the 'X-axis direction', and / or the height direction (thickness direction) as the 'Z-axis direction'. In the detailed description below, references to the length direction, width direction, and / or height direction (or thickness direction) may indicate the length direction, width direction, and / or height direction (or thickness direction) of the electronic device.

[0068] Referring to FIGS. 2A and 2B , the electronic device (101) may include a housing (202), a display (204), and a touchpad module (240). According to one embodiment, the electronic device (101) may be a laptop computer, a notebook computer, or a portable terminal. The configuration of the electronic device (101) of FIGS. 2A and 2B may be partially or entirely identical to the configuration of the electronic device (101) of FIG. 1 .

[0069] According to one embodiment, the housing (202) may form at least a portion of the exterior of the electronic device (101) or support a component of the electronic device (101), such as a touch pad module (240). For example, the housing (202) may accommodate at least one of a display (204), an input device (206), or a touch pad module (240).

[0070] In one embodiment, the electronic device (101) can be open (e.g., FIG. 2b) or closed (e.g., FIG. 2a). For example, the housing (202) can include a first housing (210) and a second housing (220) rotatably connected with respect to the first housing (210). In one embodiment, the electronic device (101) can include a hinge module (230) connected with the housing (202). For example, the hinge module (230) can be connected to the first housing (210) and the second housing (220). In one embodiment, the first housing (210) can be configured to rotate with respect to the second housing (220) at a specified angle (e.g., 0 to 180 degrees, or 0 to 360 degrees). According to one embodiment, the second housing (220) may be expressed, defined, and / or interpreted as rotating at a specified angle with respect to the first housing (210). For example, when the electronic device (101) is in a closed state (e.g., FIG. 2A), the first front surface (210a) of the first housing (210) may face the second front surface (220a) of the second housing (220).

[0071] According to one embodiment, the housing (202) may be formed of a metallic or non-metallic material having a selected amount of rigidity. According to one embodiment, at least a portion of the electronic device (101) formed of the metallic material may provide a ground plane and may be electrically connected to a ground line formed on a printed circuit board (e.g., the circuit board (370) of FIG. 3). For example, the housing (202) may be electrically connected to the printed circuit board through a capacitive component.

[0072] In one embodiment, at least a portion of the display (204) may be disposed within the second housing (220). For example, at least a portion of the display (204) may be visually exposed to the exterior of the electronic device (101) through the second housing (220). The display (204) may form at least a portion of the second front surface (220a) of the second housing (220). In one embodiment, the display (204) may be a flexible display in which at least a portion of the display (204) may be deformable into a flat surface and / or a curved surface. For example, the display (204) may be a foldable or rollable display. The configuration of the display (204) may be all or partly the same as the configuration of the display module (160) of FIG. 1.

[0073] According to one embodiment, the display (204) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer configured to detect a magnetic field-type stylus pen.

[0074] In one embodiment, the input device (206) can detect user input (e.g., pressure). In one embodiment, the input device (206) can be positioned or accommodated on the first housing (210). In one embodiment, when the electronic device (101) is closed, the input device (206) can face the display (204). The configuration of the input device (206) of FIG. 2 may be all or part of the same as the configuration of the input module (150) of FIG. 1. For example, the input device (206) may be a keyboard.

[0075] In one embodiment, the touch pad module (240) may be configured to detect or receive a user input. In one embodiment, the touch pad module (240) may include a capacitive touch sensor, a resistive touch sensor, an optical touch sensor, or a surface acoustic wave touch sensor. For example, the touch pad module (240) may detect current, pressure, light, and / or vibration caused by an input applied by a user to the touch pad module (240), and a processor (e.g., the processor (120) of FIG. 1) and / or the touch pad module (240) may determine the user input based on the detected change in current, pressure, light, and / or vibration. In one embodiment, the touch pad module (240) may be referred to as a touch pad, a touch pad device, or a touch pad structure.

[0076] According to one embodiment, the processor (e.g., the processor (120) of FIG. 1) and / or the touch pad module (240) can determine a user's input location (e.g., XY coordinates). According to one embodiment, the touch pad module (240) can detect pressure on the touch pad module (240). For example, the touch pad module (240) can detect force in a thickness direction (e.g., Z-axis direction) using a switch and at least one force sensor. According to one embodiment, the touch pad module (240) can detect an external object (e.g., a user's finger or stylus) when the external object directly contacts or is in proximity to a surface of the touch pad module (240).

[0077] According to one embodiment, the touch pad module (240) may be accommodated in the housing (202). For example, the touch pad module (240) may be connected to the first housing (210) and at least a portion thereof may be exposed to the outside of the first housing (210). According to one embodiment, the touch pad module (240) may be adjacent to the input device (206). According to one embodiment, when the electronic device (101) is closed, at least a portion of the touch pad module (240) may face the display (204). The configuration of the touch pad module (240) may be all or partly the same as the configuration of the input module (150) of FIG. 1.

[0078] FIG. 3 is a plan view showing the interior of a first housing of an electronic device according to one embodiment of the present disclosure.

[0079] Referring to FIG. 3, the electronic device (101) (e.g., the electronic device (101) of FIGS. 1 to 2B) may include a first housing (310) (e.g., the first housing (210) of FIGS. 2A and 2B), a second housing (the second housing (320) of FIG. 9, which will be described later) (e.g., the second housing (220) of FIGS. 2A and 2B), a hinge module (330) (e.g., the hinge module (230) of FIG. 2B), at least one fan module (360), a circuit board (370), and / or a heat dissipation member (380). According to one embodiment, the electronic device (101) may omit at least one of the components or additionally include other components (e.g., the support member (340), the conductive member (350)). At least one of the components of the electronic device (101) may be identical or similar to at least one of the components of the electronic device (101) of FIGS. 1 to 2b, and any overlapping description will be omitted below.

[0080] According to one embodiment, the electronic device (101) may include a first housing (310), or a second housing (320) configured to rotate relative to the first housing.

[0081] The first housing (310) may include a first plate (311) forming the overall appearance of the first housing (310). The first plate (311) may provide rigidity to the first housing (310) and serve to fix various components. According to one embodiment, a step (319) may be formed on at least a portion of an edge of the first plate (311) (e.g., at least a portion of an edge facing the +Y direction of FIG. 3) that is recessed further inward of the first plate (311) than other portions. A portion of a hinge module (330) of the electronic device (101) (e.g., the hinge module (230) of FIG. 2B) (e.g., the hinge cover (331) and an internal space surrounded by the hinge cover (331)) may be disposed on the step (319).

[0082] According to one embodiment, the hinge module (330) may include a hinge cover (331) and hinges (332, 333). According to one embodiment, the hinges (332, 333) may include a first hinge (332) and a second hinge (333) spaced apart from the first hinge (332). According to one embodiment, the electronic device (101) may include only one configuration of the first hinge (332) and the second hinge (333). However, in order to more stably perform an unfolding or folding behavior between the first housing (310) and the second housing (320) of the electronic device (101), the electronic device (101) may include two hinges (332, 333).

[0083] The hinge cover (331) can surround at least a portion of a hinge (332, 333) connecting the first housing (310) and the second housing (320) to each other. According to one embodiment, in the internal space (the internal space (S) described later in FIG. 5) surrounded by the hinge cover (331), not only at least a portion of the hinge but also an antenna module (the antenna module (335) of FIG. 6 described later) can be placed.

[0084] According to one embodiment, a portion of the hinge module (330) may be configured to be connected to the first housing (310) on a plane parallel to one surface of the first housing (310), and another portion of the hinge module (330) may be configured to be connected to the second housing (320) on a plane parallel to one surface of the second housing (320). According to one embodiment, an axis about which the hinge of the hinge module (330) rotates may be formed on the same plane as the first housing (310).

[0085] According to one embodiment, a circuit board (370) may be disposed inside the first housing (310). The circuit board (370) may include at least one of a printed circuit board (PCB), a flexible printed circuit board (flexible PCB), or a rigid-flexible printed circuit board (RF-PCB).

[0086] According to one embodiment, at least one electrical component (e.g., a processor (120), a memory (130), or a communication module (190) of FIG. 1) may be disposed on the circuit board (370). For example, an audio codec module may be disposed on the circuit board (370).

[0087] According to one embodiment, the circuit board (370) may include a plurality of circuit boards (371, 372, 373). For example, the circuit board (370) may include a first circuit board (371) disposed on one side of the electronic device (101) and a second circuit board (372) disposed on the other side of the electronic device (101). In order to achieve purposes such as efficient arrangement between components of the electronic device (101), arrangement optimizing heat dissipation performance, and / or arrangement to prevent electrical interference, the electronic device (101) may include a plurality of circuit boards (371, 372, 373), wherein some of the circuit boards (371, 372) may be disposed to be electrically spaced apart from each other. According to one embodiment, the electronic device (101) may include a third circuit board (373) for electrically connecting the first circuit board (371) and the second circuit board (372). For example, the third circuit board (373) may be a flexible circuit board. According to one embodiment, the third circuit board (373) may be replaced with various connecting members (e.g., a connector) other than the flexible circuit board. In the following embodiments, when referring to the circuit board, the second circuit board (372) may be used as an example, but it is not necessarily limited thereto, and it is to be noted that the first circuit board (371) may be applied. For convenience of description, the second circuit board (372) may be simply referred to as a 'circuit board (372)'. In addition, the description of the second circuit board (372) may also be applied to the first circuit board (371).

[0088] According to one embodiment, the heat dissipation member (380) may be disposed inside the first housing (310). According to one embodiment, the heat dissipation member (380) may be disposed on at least a portion of the circuit board (370). For example, the heat dissipation member (380) may be disposed on one surface of the circuit board (370) (e.g., the surface facing the -Z direction of FIGS. 2A to 3 ).

[0089] According to one embodiment, the heat dissipation member (380) may include a vapor chamber, a heat pipe, a heat spreader, or a heat sink.

[0090] According to one embodiment, the heat dissipation member (380) may form a heat transfer path for dissipating heat generated from the circuit board (370), heat generated from at least one electrical component disposed on the circuit board (370), or heat generated from an electrical component disposed inside the first housing (310) to the outside of the first housing (310).

[0091] According to one embodiment, at least a portion of the heat dissipation member (380) may be disposed between at least one fan module (360) and the step portion (319) of the first plate (311).

[0092] According to one embodiment, at least one fan module (360) may be disposed inside the first housing (310). According to one embodiment, at least one fan module (360) may include a fan that causes air flow.

[0093] According to one embodiment, at least one fan module (360) can provide airflow to at least a portion of the heat dissipation member (380). For example, the airflow provided from at least one fan module (360) can be discharged to the outside of the first housing (310) after passing through at least a portion of the heat dissipation member (380). The airflow provided from at least one fan module (360) can be discharged to the outside of the first housing (310) after exchanging heat with the heat dissipation member (380). For example, heat accumulated inside the first housing (310) can be discharged to the outside of the first housing (310) through the heat dissipation member (380) and the airflow.

[0094] According to one embodiment, at least one fan module (360) may include a first fan module (361) and a second fan module (362) spaced apart from the first fan module (361).

[0095] According to one embodiment, the first fan module (361) may face at least a portion of the heat dissipation member (380), and the second fan module (362) may face a portion other than the at least portion of the heat dissipation member (380).

[0096] According to one embodiment, the electronic device (101) may further include a first support member (340) coupled with the first plate (311). According to one embodiment, the support member (340) may be disposed at an edge of the first plate (311). According to one embodiment, the first support member (340) may be disposed at a position facing the hinge cover (331). The first support member (340) may serve to support the first plate (311) and / or other components (plates, brackets).

[0097] According to one embodiment, the electronic device (101) may include a conductive member (350). The conductive member (350) may be coupled to one surface of the first support member (340). According to one embodiment, the conductive member (350) may be disposed adjacent to the step portion (319). According to one embodiment, the first support member (340) may be disposed between the step portion (319) and the conductive member (350). According to one embodiment, the conductive member (350) may be disposed between the first support member (340) and the circuit board (370). According to one embodiment, the conductive member (350) may be provided to prevent and / or reduce electrical interference between an antenna module disposed in one area of ​​the electronic device (101) (e.g., the antenna module (335) of FIG. 5 described below) and components disposed in another area of ​​the electronic device (101).

[0098] Referring to FIGS. 4 to 15 below, each component included in the electronic device (101) will be described in more detail.

[0099] FIG. 4 is a perspective view illustrating a hinge cover according to an embodiment of the present disclosure. FIG. 5 is a perspective view illustrating an antenna module according to an embodiment of the present disclosure. FIG. 6 is a perspective view illustrating a second support member according to an embodiment of the present disclosure. FIG. 7 is a perspective view illustrating a hinge according to an embodiment of the present disclosure.

[0100] Referring to FIG. 4, the hinge cover (331) may serve to prevent parts such as the hinge from being visible from the outside when the first housing (310) rotates relative to the second housing (320), or to protect parts placed in the hinge interior space (S) from external impact.

[0101] According to one embodiment, the electronic device (101) may include an antenna module as a device used for wireless communication. According to one embodiment, the electronic device (101) may place the antenna module in a hinge internal space (S). When the antenna module is placed in the hinge internal space (S) of the hinge cover (331), the hinge cover (331) may prevent the antenna module from being seen from the outside or may serve to protect the antenna module.

[0102] Referring to FIG. 5, the antenna module (335) disposed in the internal space (S) of the hinge cover (331) may include an antenna module (3351). The antenna module (3351) may be fixedly disposed on the internal space (S) of the hinge cover (331). The antenna module (3351) is electrically connected to a communication module (e.g., a communication processor (CP)) of the electronic device (101), receives commands from the communication module (e.g., the communication processor (CP)), and transmits and / or receives signals with the external electronic device (101). The antenna module may be provided to perform various types of communication, such as, for example, wireless fidelity (WIFI) communication, Bluetooth communication, and 5G communication.

[0103] According to one embodiment, the antenna module (335) may include a signal line (3352) for connecting the antenna module (3351) with a communication module (e.g., a communication processor (CP)) of the electronic device (101). According to one embodiment, the antenna module (3351) and the communication module (e.g., the communication processor (CP)) may be arranged to be spaced apart from each other by a considerable distance to prevent and / or reduce electrical interference therebetween. Accordingly, the antenna module (3351) and the communication module (e.g., the communication processor (CP)) arranged inside the hinge cover (331) may be connected using a long signal line (3352).

[0104] According to one embodiment, the signal line (3352) may be configured such that at least a portion thereof is not positioned in one location and flows away from a component that causes noise (e.g., component (3721) of FIG. 10 described below). To this end, the signal line (3352) may include, for example, a signal line formed with a relatively greater tension than a conventionally used copper wire. For example, the signal line (3352) may include a coaxial cable.

[0105] According to one embodiment, a coaxial cable may be used as the signal line (3352) to effectively transmit the antenna signal while protecting it from external interference. For example, when a coaxial cable is used as the signal line (3352), the signal line (3352) may also be referred to as an antenna cable.

[0106] According to one embodiment, the signal line (3352) may include a plurality of signal lines. According to one embodiment, the signal line (3352) may include a plurality of signal lines that are separated to transmit signals separated by band. Referring to FIG. 5, the signal line (3352) may include a first signal line (3352a) for transmitting a transmit (Tx) signal and a second signal line (3352b) for transmitting a receive (Rx) signal. Alternatively, the signal line (3352) may be separated into a signal line for transmitting an RF signal and a signal line for transmitting a different signal. Alternatively, the signal line (3352) may include a greater number of signal lines than the embodiment illustrated in FIG. 5.

[0107] Referring to FIG. 6, the electronic device (101) may further include a second support member (337). The second support member (337) may have at least a portion positioned in the internal space (S) of the hinge cover (331) and may serve to support the antenna module (335). According to one embodiment, the antenna module (3351) and / or the signal line (3352) may be supported by the second support member (337).

[0108] The electronic device (101) may include a hinge that allows the first housing (310) and the second housing (320) to be opened and closed relative to each other. The hinge of FIG. 7 illustrates the first hinge (332) of FIG. 3 (hereinafter, simply referred to as “hinge (332)”), and the description of the second hinge (333) regarding the first hinge (332) may also be applied.

[0109] The hinge (332) is connected to a portion of the first housing (310) and a portion of the second housing (320), respectively, and may serve to couple the first housing (310) to the second housing (320) (or the second housing (320) to the first housing (310)) while allowing the first housing (310) to rotate with respect to the second housing (320) (or the second housing (320) to rotate with respect to the first housing (310). In one embodiment, the hinge (332) can be used to smoothly open and close the first housing (310) and the second housing (320). In one embodiment, the hinge (332) can be used to adjust the open and close angle between the first housing (310) and the second housing (320). The hinge (332) can be used to allow adjustments to suit the user's convenience and viewing angle.

[0110] Referring to FIG. 7, the hinge (332) may include a body portion (3321), a first hinge portion (3322) configured to extend from the body portion (3321) and be connected to the first housing (310), and a second hinge portion (3323) configured to extend from the body portion (3321) and be connected to the second housing (320).

[0111] In one embodiment, the first hinge portion (3322) can be positioned on a plane parallel to one surface of the first housing (310) or on a plane adjacent to and parallel to one surface of the first housing (310). The first hinge portion (3322) can include a first-first portion (3322a) providing an axis of rotation and a first-second portion (3322b) extending from the first-first portion (3322a) and fixed in position with respect to the first housing (310). In one embodiment, the first-second portion (3322b) can be fixed in position by being coupled to the first housing (310) using a fixing element (e.g., a bolt, a rivet, and / or a pin).

[0112] In one embodiment, the second hinge portion (3323) may be positioned on a plane parallel to one surface of the second housing (320) or on a plane adjacent to and parallel to one surface of the second housing (320). The second hinge portion (3323) may include a 2-1 portion (3323a) and a 2-2 portion (3323b) extending from the 2-1 portion (3323a) and fixed in position with respect to the second housing (320). In one embodiment, the 2-2 portion (3323b) may be fixed in position by being coupled to the second housing (320) using a fixing element (e.g., a bolt, a rivet, and / or a pin).

[0113] According to the embodiment illustrated in FIG. 7, it is illustrated that the 1-1 portion (3322a) is formed to provide a rotation axis only to the 1st hinge portion (3322). Alternatively, it is also possible that the rotation axis is provided only to the 2-1 portion (3323a) of the 2nd hinge portion (3323), or that the rotation axes are provided to both the 1-1 portion (3322a) and the 1-2 portion (3322b). Hereinafter, a description will be given focusing on an embodiment in which a rotation axis in a direction parallel to the X-axis is provided in the 1st hinge portion (3322).

[0114] According to one embodiment, the first hinge portion (3322) and the second hinge portion (3323) may be spaced apart by a predetermined distance (H1) in the height direction of the electronic device (101). Accordingly, the body portion (3321) of the hinge (332) may have a polyhedral shape, and the body portion (3321) may have a side surface (3321a) having a height corresponding to the predetermined height (H1).

[0115] According to one embodiment, a signal line (3352) (e.g., an antenna cable) connected from an antenna module is arranged on one side (e.g., an upper side) of the body portion (3321), and one side (e.g., an upper side) of the body portion (3321) that supports the signal line (3352) may have an inclined surface. For example, one side (e.g., an upper side) of the body portion (3321) may include a flat surface (3321b) and an inclined surface (3321c) inclined with respect to the flat surface (3321b).

[0116] FIG. 8 is a perspective view illustrating a relative arrangement relationship between a hinge and an antenna module according to an embodiment of the present disclosure. FIG. 9 is a cross-sectional view of a hinge portion of an electronic device according to an embodiment of the present disclosure. FIG. 10 is an enlarged view of the internal appearance of an electronic device according to an embodiment of the present disclosure. FIG. 9 may represent a cross-section taken along line AA' of FIG. 10 may be an enlarged view of portion C of FIG. 3.

[0117] Referring to FIGS. 8 and 9, a signal line (3352) may be arranged on one surface (e.g., the upper surface) of the body portion (3321) of the hinge (332). The signal line (3352) may be supported on one surface (e.g., the upper surface) of the body portion (3321) on the internal space (S) of the hinge cover (331) and may extend toward the internal space of the housing (310) of the electronic device (101).

[0118] Referring to FIG. 9, the second support member (337) disposed in the internal space of the hinge cover (331) may have an inclined surface. An antenna module (3351) is disposed on the inclined surface of the second support member (337), and the antenna module (3351) is controlled (e.g., receives a command) from a communication module (e.g., a communication processor (CP)) included in the electronic device (101) to transmit a signal of a designated frequency band toward an external electronic device (e.g., in the direction of D1) or receive a signal of a designated frequency band.

[0119] According to one embodiment, the antenna module (3351) may be configured to radiate a signal of a designated frequency band from a position (e.g., below) spaced apart by a predetermined height (e.g., H1) from the first hinge portion (3322) that provides the rotational axis of the hinge (332). As an antenna module disposed in an electronic device, an antenna module disposed at the edge of the second housing (320) may experience performance degradation due to interference with surrounding components (e.g., signal interference). In the present disclosure, an antenna module (3351) may be provided that is disposed within the hinge cover (331) while being supported by a second support member (337). Therefore, according to the present disclosure, it is possible to prevent or reduce performance degradation due to interference with surrounding components that may occur when the antenna module is disposed at the edge of the second housing (320). In addition, according to the present disclosure, since the antenna module (3351) is disposed on a hinge connecting the first housing (310) and the second housing (320), communication with an external electronic device can be performed more stably regardless of the relative behavior (e.g., folding motion or unfolding motion) of the first housing (310) and the second housing (320).

[0120] Referring to FIGS. 3 and 10, a signal line (3352) disposed on one side (e.g., the upper side) of the hinge (332) may extend from an antenna module (3351). The signal line (3352) disposed on one side (e.g., the upper side) of the hinge (332) may be disposed on the upper side of the circuit board (372) when the electronic device (101) is viewed from above. In addition, the signal line (3352) may be bent from a portion disposed on one side (e.g., the upper side) of the hinge (332) and extend toward the lower side of the circuit board (372). According to one embodiment, the signal line (3352) may be extended and connected to a communication module (e.g., a communication processor (CP)). At this time, the length of the signal line (3352) may be extended to cross a plurality of electronic components, but may have a bent 'ㄱ' shape at a position adjacent to the hinge (332). For example, the longer the length of the signal line (3352), the higher the possibility that the performance may be degraded due to the influence of other electronic components in the vicinity. For example, in the embodiment illustrated in FIG. 10, various components (3721, 3722, 3723) may be arranged on the circuit board (372). For example, referring to FIG. 10, an audio codec module (3721), a USB port (3722), and an audio port (3723) may be arranged on the circuit board (372). If any one of the various components (3721, 3722, 3723) arranged on the circuit board (372) is a component (e.g., audio codec module (3721)) that can exert strong noise on the signal line (3352), the antenna radiation performance of the electronic device (101) may be degraded.

[0121] According to one embodiment of the present disclosure, the electronic device (101) may provide various embodiments and combinations of embodiments to provide a structure for preventing and / or reducing performance degradation due to the influence (e.g., noise reception) of a signal line connected from an antenna by other electronic components. For example, the electronic device (101) may provide a hinge (332) including a first hinge portion (3322) and a second hinge portion (3323) having a predetermined height difference. Additionally or alternatively, the electronic device (101) may provide a structure in which the position of the signal line (3352) moves away from a component that causes noise (e.g., audio codec module (3721)). According to one embodiment, the electronic device (101) may provide a structure in which the position of the signal line (3352) is relatively far away from a noise-causing component (e.g., an audio codec module (3721)) at least when the first housing (310) of the electronic device (101) is open with respect to the second housing (320). For example, the signal line (3352) may be arranged to be relatively farther away from a noise-causing component (e.g., an audio codec module (3721)) when the first housing (310) of the electronic device (101) is rotated (e.g., opened) to have a large angle with respect to the second housing (320) (or the second housing (320) with respect to the first housing (310).

[0122] According to one embodiment, in order to provide a structure in which the signal line (3352) is positioned further away from an electronic component (e.g., an audio codec module (3721)) that causes noise when the first housing (310) rotates with respect to the second housing (320) (or when the second housing (320) rotates with respect to the first housing (310), the electronic device (101) may include a first guide member (375). According to one embodiment, when the first housing (310) operates from a closed state to an open state with respect to the second housing (320) or when the first housing (310) is completely open with respect to the second housing (320), the signal line (3352) may be guided by the first guide member (375) and positioned further away from an electronic component (e.g., an audio codec module (3721)) that causes noise.

[0123] According to one embodiment, the first guide member (375) may be disposed on a circuit board (e.g., a second circuit board (372)) at a position spaced apart from an electronic component (e.g., an audio codec module (3721)). For example, the first guide member (375) may be disposed on a circuit board (e.g., a second circuit board (372)) at a position spaced apart from an electronic component (e.g., an audio codec module (3721)) by a predetermined distance in the longitudinal direction (e.g., an X-axis direction) of the electronic device.

[0124] According to one embodiment, when the first housing (310) rotates with respect to the second housing (320), the first guide member (375) may guide the signal line (3352) to be positioned away from a component that causes noise (e.g., an audio codec module (3721)) while in a fixed state. At this time, an adhesive member for adhesion to a circuit board (e.g., a second circuit board (372)) may be disposed on the back surface of the first guide member (375). The first guide member (375) may further include an opening (3751 of FIG. 11, which will be described later) for inserting a signal line (3352), and the direction in which the opening (3751) faces may be a direction (hereinafter, referred to as a 'third direction (D1)') between the longitudinal direction (e.g., X-axis direction) of the electronic device (hereinafter, referred to as a 'first direction') and the width direction (e.g., Y-axis direction) of the electronic device (hereinafter, referred to as a 'second direction'), and may be installed at a designated position on a circuit board (e.g., a second circuit board (372)).

[0125] According to one embodiment, when the first housing (310) rotates with respect to the second housing (320), the first guide member (375) may have a structure that rotates in one direction. The direction in which the first guide member (375) rotates may be clockwise based on the embodiment illustrated in FIG. 10. However, the present invention is not necessarily limited thereto, and when a first guide member corresponding to a hinge other than the hinge (332) illustrated in FIG. 10 (e.g., the hinge (333) illustrated in FIG. 3) is additionally or alternatively included with respect to the first guide member (375), the direction in which the first guide member rotates may be set to be counterclockwise. According to one embodiment, the electronic device (101) may include a motor and / or a guide device (e.g., a rack and pinion structure) that drives the first guide member (375) so that the first guide member (375) can rotate. According to one embodiment, a processor (e.g., processor (120) of FIG. 1) may control the first guide member (375) to rotate in one direction in response to the first housing (310) rotating relative to the second housing (320). According to one embodiment, a memory (e.g., memory (130) of FIG. 1) may include instructions that enable the processor to control the rotation of the first guide member (375). According to one embodiment, the first guide member (375) may guide the signal line (3352) toward a direction (e.g., a X-axis direction) of the electronic device (e.g., a first direction) (e.g., a Y-axis direction) (e.g., a second direction) (e.g., a second direction) (e.g., a second direction) of the electronic device (e.g., a third direction (D1)) between the length direction of the electronic device (e.g., a first direction) and the width direction of the electronic device (e.g., a second direction) (e.g., a second direction)). According to one embodiment, the angle formed by the third direction with the first or second direction can be pre-specified.According to one embodiment, a processor (e.g., processor (120) of FIG. 1) can control the first guide member (375) to face the third direction (D1) in response to the first housing (310) rotating relative to the second housing (320).

[0126] According to one embodiment, when the first housing (310) rotates with respect to the second housing (320), the first guide member (375) may have a structure that allows it to slide in one direction. The direction in which the first guide member (375) slides may be the longitudinal direction (e.g., X-axis direction) of the electronic device (hereinafter referred to as the “first direction”) based on the embodiment illustrated in FIG. 10. According to one embodiment, a processor (e.g., the processor (120) of FIG. 1) may control the first guide member (375) to slide in one direction in response to the first housing (310) rotating with respect to the second housing (320). According to one embodiment, a memory (e.g., the memory (130) of FIG. 1) may include instructions that allow the processor to control the sliding movement of the first guide member (375).

[0127] The arrangement of the first guide member (375) on the circuit board (e.g., the second circuit board (372)) will be described later through examples of FIGS. 12a to 12c.

[0128] According to one embodiment, an opening (e.g., an opening (3751a) of FIG. 11 described below) through which a signal line (3352) can pass may be formed in the first guide member (375), and when the signal line (3352) is inserted into the opening, the relative position of the signal line (3352) with respect to the first guide member (375) may be fixed.

[0129] According to one embodiment, when the first housing (310) of the electronic device (101) is closed relative to the second housing (320), the position of the signal line (3352) may be located at a location indicated by reference numeral 3352', and when the first housing (310) is open relative to the second housing (320), the position of the signal line (3352) may be located at a location indicated by reference numeral 3352''.

[0130] According to one embodiment, the electronic device (101) may further include a fixing member (376) for fixing the position of the signal line (3352) passing through the first guide member (375).

[0131] According to one embodiment, to provide a structure in which the signal line (3352) is positioned away from a component that causes noise (e.g., an electronic component (3721)), the electronic device (101) may include a second guide member (342).

[0132] According to one embodiment, the second guide member (342) may be configured, for example, as a bulkhead structure, provided on one side of the first support member (340). The second guide member (342) may guide the signal line (3352) so that it does not bend toward a component that causes noise (e.g., an electronic component (3721)) when the signal line (3352) flows in an operation in which the first housing (310) is opened or closed with respect to the second housing (320). For example, the second guide member (342) may guide the signal line (3352) so that it is at least partially bent in a direction away from a component that causes noise (e.g., an electronic component (3721)) when the signal line (3352) flows in an operation in which the first housing (310) is opened or closed with respect to the second housing (320).

[0133] FIG. 11 is a perspective view showing a first guide member according to one embodiment of the present disclosure.

[0134] The first guide member (375) may include an opening (3751a) formed parallel to the longitudinal direction of the guide body (3751) in the guide body (3751). The first guide member (375) may be attached to the circuit board (370) using an adhesive member (3751b) (e.g., double-sided tape). Referring to FIGS. 10 and 11 together, the first guide member (375) may be provided with a plurality of guide bodies (e.g., two) having a shape similar to that of FIG. 11, to guide a plurality of signal lines (3352). In this case, the guide body (3751) may be referred to as a first body (3751), and the other guide body (3751) may be referred to as a second body (3752). At this time, the first body (3751) and the second body (3752) of the plurality of first guide members (375) may be combined. According to one embodiment, the first body (3751) and the second body (3752) of the plurality of first guide members (375) may be combined and arranged as one body. For example, when the first body (3751) and the second body (3752) of the plurality of first guide members (375) are combined, a plurality of signal lines (e.g., 3352a and 3352b of FIG. 5) may be arranged in the openings formed in each body.

[0135] According to one embodiment, the first guide member (375) may include a noise shielding material to absorb noise.

[0136] FIG. 12a is a drawing showing a first guide member (375) disposed on a circuit board (372) according to one embodiment of the present disclosure. FIG. 12b is a drawing showing a first guide member disposed on a circuit board according to one embodiment of the present disclosure. FIG. 12c is a drawing showing a first guide member disposed on a circuit board according to one embodiment of the present disclosure.

[0137] Referring to FIG. 12A, a first guide member (375) according to one embodiment may be fixed to a circuit board (372). According to one embodiment, the first guide member (375) may be configured to guide a signal line (3352) in a third direction (D2) while fixed to the circuit board (372) so that the signal line moves away from the electronic component.

[0138] Referring to FIG. 12B, a motor (377) may be included to drive the first guide member (375) so that the first guide member (375) can move. According to one embodiment, the motor (377) may be configured to rotate the first guide member (375) to guide the signal line (3352) in a third direction (D2) so that the signal line moves away from the electronic component.

[0139] Referring to FIG. 12C, the first guide member (375) may include a guide device that rotates or moves. In one embodiment, the guide device may be a mechanism such as a rack (378) and a pinion structure (379). The guide device may be configured to rotate or move the first guide member (375) when the first housing rotates relative to the second housing.

[0140] In the present disclosure, the configuration for moving the signal line (3352) away from the electronic component by using the first guide member (375) is not limited to the embodiments illustrated in the drawings of FIGS. 12A to 12C. For example, although not illustrated in the drawings, the guide device of the present disclosure may also include a mechanism for slidingly moving the first guide member (375) in a direction parallel to the longitudinal direction (e.g., the first direction) of the electronic device when the first housing rotates relative to the second housing. For example, the mechanism may include a plurality of arms and / or link members. Various other embodiments may be applied.

[0141] FIG. 13 is a drawing showing a fixing member according to one embodiment of the present disclosure.

[0142] According to one embodiment, the fixing member (376) may have a shape like a clip, but is not necessarily limited thereto, and its specific shape may vary as long as it can fix the signal line (3352). For example, the fixing member (376) may include a base portion (3761) fixedly arranged on a circuit board and a plurality of assembly pieces (3762) protruding from the base portion (3761). The electronic device (101) may fix the signal line (3352) so that the signal line (3352) does not move in a certain area by providing the fixing member (376) at a specific, predetermined position on the circuit board (372). For example, a signal line (3352) close to a hinge (332) based on a circuit board (372) may be configured to float, and a signal line (3352) far from the hinge (332) may be configured to be fixed by being coupled to a predetermined member (376).

[0143] Referring back to FIG. 11, the first guide member (375) may be designed to have a signal line (3352) arranged in the opening (3751a) so as to have a tolerance that allows the signal line (3352) to flexibly move. On the other hand, referring to FIG. 13, the fixing member (376) of FIG. 13 may be designed to have a signal line (3352) arranged in the opening (3751a) so as to be fixed by fitting so as not to move, so as to have a tolerance that converges to 0. Alternatively, the fixing member (376) of FIG. 13 may have a structure that presses the signal line (3352) when the assembly pieces (3762) are deformed by an external force.

[0144] FIG. 14 is an exploded perspective view illustrating a first plate, a first support member, and a conductive member according to one embodiment of the present disclosure. FIG. 15 is a perspective view illustrating a first support member according to one embodiment of the present disclosure.

[0145] The configuration of the first plate (311) of FIG. 14 may be partially or entirely identical to the configuration of the first plate (311) of FIG. 3.

[0146] According to one embodiment, the first plate (311) may include at least one keyboard hole (318), a step portion (319) (e.g., the step portion (319) of FIG. 3).

[0147] According to one embodiment, at least one keyboard hole (318) may be a hole for arranging keyboard buttons of an input device (e.g., an input device (206) of FIG. 2) of an electronic device (e.g., an electronic device (101) of FIG. 2).

[0148] Referring to FIG. 14, the first support member (340) may be coupled to an edge of the first plate (311). The first support member (340) may include a non-metallic material or a metallic material. According to one embodiment, the first support member (340) may be disposed adjacent to the step portion (319). According to one embodiment, the first support member (340) may include at least one first air vent (341). The at least one first air vent (341) may be a hole formed through the first support member (340). The at least one first air vent (341) may be provided as a plurality of first air vents (341). The plurality of first air vents (341) may be spaced apart from each other along a longitudinal direction (e.g., X-axis direction) of the first support member (340). According to one embodiment, the plurality of first air vents (341) may form a passage connecting the inside and the outside of the second housing (320).

[0149] According to one embodiment, the first conductive member (350) may be a plate made of a metal material. For example, the first conductive member (350) may be coupled to one surface (e.g., a surface facing the -Y direction) of the first support member (340). According to one embodiment, the first conductive member (350) may be disposed adjacent to the step portion (319). According to one embodiment, the first conductive member (350) may be disposed at a position corresponding to a position of an antenna module (3351) disposed inside a hinge cover (331) of a hinge module (300), thereby preventing or reducing interference of other components disposed inside the electronic device (101) by a signal radiated from the antenna module (3351).

[0150] According to one embodiment, the first conductive member (350) may include at least one second air vent (351). The at least one second air vent (351) may be a hole formed through the first conductive member (350). The at least one second air vent (351) may be provided as a plurality of second air vents. The plurality of second air vents may be spaced apart from each other along the longitudinal direction (e.g., X-axis direction) of the first conductive member (350). For example, the first conductive member (350) may include a mesh vent (mesh type air vent).

[0151] Referring to FIG. 15, the first support member (340) may include a second guide member (342). The signal line (3352) is bent from one surface (e.g., the upper surface) of the hinge (332) and extends toward the lower end of the circuit board (372), wherein at least a portion of the signal line (3352) may overlap one surface of the first support member (340). The second guide member (342) may limit the flow direction of the signal line (3352) overlapped on one surface of the first support member (340).

[0152] The second guide member (342) may have a structure that limits the flow direction of the signal line (3352) at the end of the first support member (340). According to one embodiment, the second guide member (342) may be formed in the shape of a guide wall having a 'ㄷ' shape, as illustrated in FIG. 15. For example, the second guide member (342) may include a guide plate (3421), a first guide wall (3422) protruding from the guide plate (3421) in the height direction of the electronic device, and a second guide wall (3423) extending from the first guide wall (3422). The second guide wall (3423) may extend from the first guide wall (3422) in the longitudinal direction of the first support member (340). For example, the flow in the longitudinal direction (e.g., X-axis direction) of the signal line (3352) may be restricted by the first guide wall (3422), and the flow in the height direction (e.g., Z-axis direction) of the signal line (3352) may be restricted by the second guide wall (3423).

[0153] Hereinafter, a mechanism by which the signal line (3352) moves away from the electronic component when the first housing (310) rotates with respect to the second housing (320) (or when the second housing (320) rotates with respect to the first housing (310)) will be described in detail through the embodiments of FIGS. 16 to 20.

[0154] FIG. 16 is a cross-sectional view of an electronic device according to an embodiment of the present disclosure. FIG. 17 is a view showing a form in which a signal line is extended outside the hinge cover while being surrounded by the hinge cover, according to an embodiment of the present disclosure. FIG. 18 is a view showing a form in which a signal line is extended outside the hinge cover while being surrounded by the hinge cover, according to an embodiment of the present disclosure. FIG. 16 may illustrate a cross-sectional view of an electronic device taken along the imaginary line A-A' illustrated in FIG. 2A. FIG. 17 may illustrate a portion of a cross-sectional view of an electronic device taken along the imaginary line B-B' illustrated in FIG. 2B.

[0155] Referring to FIG. 16, the electronic device (101) may include a first housing (310) and a second housing (320), and may include a hinge module (330) that rotatably couples the first housing (310) to the second housing. The hinge module may include a hinge cover (331) surrounding an internal space of the hinge module and a hinge (e.g., hinge (332) of FIG. 10) at least partially disposed in the internal space.

[0156] According to one embodiment, the first housing (310) may include a first plate (311) and a second plate (312) spaced apart from the first plate (311) in the height direction of the electronic device. The second plate (312) may form a space between the first plate (311) and the second plate (312) for accommodating components. A circuit board (370) and various components may be disposed in the space between the first plate (311) and the second plate (312). For example, a circuit board (370) and a heat dissipation member (380) may be disposed in the space between the first plate (311) and the second plate (312). According to one embodiment, the heat dissipation member (380) may be disposed on the circuit board (370) and connected to the second plate (312) via an adhesive member and / or a heat transfer member, etc. According to one embodiment, the circuit board (370) may be supported by a fixed support member (312) protruding from the first plate (311).

[0157] According to one embodiment, the signal line (3352) connected to the antenna module (3351 of FIG. 10) disposed inside the hinge cover (331) is a drawing showing a form in which the signal line (3352) extends outside the hinge cover while being surrounded by the hinge cover (331). According to one embodiment, the signal line (3352) may extend from the inner space (S) of the hinge cover toward the inner space of the first housing (310).

[0158] According to one embodiment, the signal line (3352) may be connected to a communication module (e.g., a communication processor (CP)) disposed inside the first housing (310). According to one embodiment, the signal line (3352) may be formed to be longer than the minimum length required to be connected to the communication module (e.g., a communication processor (CP)). For example, the signal line (3352) may further include a portion having a marginal length in addition to a portion corresponding to the minimum length required to be connected to the processor. According to one embodiment, the signal line (3352) may extend into the first housing (310) while further including the portion having the marginal length, and at this time, at least a portion of the signal line (3352) may not be fixed to the first housing (310).

[0159] Fig. 16 may represent a state before the first housing (310) of the electronic device (101) rotates relative to the second housing (320), i.e., a closed state. According to one embodiment, when the first housing (310) of the electronic device (101) rotates relative to the second housing (320), for example, when the hinge module (330) fixedly coupled to the second housing (320) moves in a direction in which it is tilted relative to the first housing (310), the signal line (3352) may be twisted and somewhat tightened compared to the closed state. That is, when the first housing (310) of the electronic device (101) rotates relative to the second housing (320), tension may be applied to the signal line (3352). When tension is applied to the signal line (3352), the signal line (3352) can move in any direction. In the present disclosure, when tension is applied to the signal line (3352), the direction of movement of the signal line (3352) can be guided. By guiding the direction of movement of the signal line (3352), the signal line (3352) can be moved away from electronic components that cause deterioration of performance (e.g., antenna radiation performance). According to one embodiment, the electronic device (101) may include a first guide member (375) as a means for guiding the direction of movement of the signal line (3352), and may additionally or alternatively include a second guide member (342).

[0160] FIG. 17 and FIG. 18 may illustrate a state in which a signal line (3352) flows in response to the movement of a hinge module when the first housing (310) of the electronic device (101) rotates relative to the second housing (320). FIG. 17 illustrates a cross-sectional view of a hinge cover, and FIG. 18 may illustrate a front view of the hinge cover (331).

[0161] In FIGS. 17 and 18, the first housing (310) of the electronic device may be shown as opening relative to the second housing (320) as it moves from the G direction to the F direction, and the first housing (310) of the electronic device may be shown as closing relative to the second housing (320) as it moves from the F direction to the G direction. For example, the upper drawing of FIG. 17 and the left drawing of FIG. 18 may show the behavior of the signal line when the first housing (310) is closed relative to the second housing (320). Referring to the upper drawing of FIG. 17, no tension may be applied to the signal line (3352) in the closed state. The middle drawing of FIG. 17 and the middle drawing of FIG. 18 may show the behavior of the signal line when the first housing (310) is in a half-open state (or a half-closed state) relative to the second housing (320). Referring to the middle drawing of Fig. 17, a predetermined tension (T1) may be applied to the signal line (3352). The lower drawing of Fig. 17 and the right drawing of Fig. 18 may show the behavior of the signal line when the first housing (310) is open with respect to the second housing (320). Referring to the lower drawing of Fig. 17, in the open state, a tension (T2) greater than that in the intermediately open state may be applied to the signal line (3352).

[0162] Referring to FIG. 18, when the first housing (310) is closed with respect to the second housing (320), the length L1a of the signal line (3352) in the width direction (e.g., Y-axis direction) of the electronic device may be relatively longer than the length L2a of the signal line (3352) in the width direction of the electronic device when the first housing (310) is partially open with respect to the second housing (320), and the length L3a of the signal line (3352) in the width direction of the electronic device when the first housing (310) is open with respect to the second housing (320). For example, the relationship L1a > L2a > L3a may be established. Here, the length of the signal line (3352) refers to a changed length of the signal line (3352) in an arbitrary area specified in the electronic device, and it should be noted that the length of the signal line (3352) itself does not become shorter or longer.

[0163] Referring to FIG. 18, the length L1b of the electronic device of the signal line (3352) in the longitudinal direction when the first housing (310) is closed with respect to the second housing (320) may be relatively shorter than the length L2b of the electronic device of the signal line (3352) in the longitudinal direction (e.g., X-axis direction) when the first housing (310) is halfway open with respect to the second housing (320), and the length L3b of the electronic device of the signal line (3352) in the longitudinal direction when the first housing (310) is closed with respect to the second housing (320). For example, the relationship L3b > L2b > L1b may be established. When the first housing (310) rotates with respect to the second housing (320), the signal line (3352) having a predetermined tension may have lengths L1a, L2a, L3a of the signal line (3352) in the width direction of the electronic device, and lengths L1b, L2b, L3b in the length direction of the electronic device, respectively, may change. For example, when the first housing (310) rotates with respect to the second housing (320) and changes from a closed state to an open state, the length in the width direction of the electronic device (e.g., Y-axis direction) becomes shorter, and the length in the length direction of the electronic device (e.g., X-axis direction) becomes longer, so that the signal line (3352) may have a behavior of flowing in the length direction of the electronic device.

[0164] When having the behavior as illustrated in FIGS. 17 and 18, the electronic device according to one embodiment of the present disclosure may provide a structure in which the position of the signal line (3352) flows in a direction away from a component that causes noise (e.g., an audio codec module (3721)). The electronic device (101) according to one embodiment may provide a structure in which, from the perspective of the position of the signal line (3352), at least a state in which the first housing (310) of the electronic device (101) is open with respect to the second housing (320) is relatively farther away from a component that causes noise (e.g., an audio codec module (3721)) than a state in which the first housing (310) is closed with respect to the second housing (320).

[0165] FIG. 19 is a drawing showing the relative arrangement relationship between peripheral components and signal lines when the first housing is closed relative to the second housing, according to one embodiment of the present disclosure. FIG. 20 is a drawing showing the relative arrangement relationship between peripheral components and signal lines when the first housing is open relative to the second housing, according to one embodiment of the present disclosure.

[0166] Figures 19 and 20 are schematic drawings showing the arrangement relationship between a signal line (3352) connected from an antenna module (3351) arranged around a hinge cover (331) and a hinge (332), and a component (e.g., a component with strong noise (3721)) arranged on a circuit board.

[0167] When the first housing (310) is in a closed state with respect to the second housing (320), the signal line (3352) may be arranged at a relatively close position from, for example, a noisy component (3721). Conversely, when the first housing (310) is in an open state with respect to the second housing (320), the signal line (3352) may be arranged at a relatively far position from, for example, a noisy component (3721). For example, when the first housing (310) is in a closed state with respect to the second housing (320), it may be considered that the user is not using the electronic device (101), and when the first housing (310) is in an open state with respect to the second housing (320), it may be considered that the user is using the electronic device (101). For example, when a user uses an electronic device (101), at least the signal line (3352) can be configured to be positioned relatively far from a component (3721) with strong noise, thereby preventing or reducing performance degradation due to electromagnetic interference between components.

[0168] According to one embodiment of the present disclosure, an electronic device may be provided, comprising: a housing (202) including a first housing (210; 310) and a second housing (220; 320); a hinge module (230; 330) rotatably connecting the first housing to the second housing; a circuit board (370) disposed in the first housing; an antenna module (3351) disposed in an internal space of the hinge module; a signal line (3352) connected to the antenna module; an electronic component (3721) disposed on the circuit board; and a first guide member (375) configured to move a portion of the signal line (3352) away from the electronic component when the second housing rotates in a first rotational direction with respect to the first housing.

[0169] According to one embodiment, the hinge module includes a hinge cover (331) having an internal space, and the antenna module can be placed in the internal space.

[0170] In one embodiment, the guide member may be configured to move a portion of the signal line (3352) toward the electronic component when the second housing rotates in a second rotational direction opposite to the first rotational direction with respect to the first housing.

[0171] In one embodiment, the hinge module rotates based on rotation of the first housing relative to the second housing, the antenna module rotates based on rotation of the hinge module, and the signal line can move according to rotation of the antenna module.

[0172] According to one embodiment, the first guide member may be configured to slide or rotate in one direction.

[0173] According to one embodiment, the first guide member (375) may include a motor that drives the first guide member (375) so that the first guide member (375) can move.

[0174] According to one embodiment, the first housing may include a guide device that rotates or moves the first guide member (375) when the first housing rotates relative to the second housing.

[0175] According to one embodiment, the hinge module may include a hinge (332) at least partially disposed in an interior space of the hinge module. The hinge (332) may include a body portion (3321). The hinge may include a first hinge portion (3322) configured to extend from the body portion (3321) and be connected to a first housing (310), and a second hinge portion (3322) configured to extend from the body portion (3321) and be connected to a second housing (320). The first hinge portion (3322) and the second hinge portion (3323) may be spaced apart from each other by a predetermined distance (H1) in the height direction of the electronic device (101).

[0176] In one embodiment, the signal line may be a coaxial cable.

[0177] According to one embodiment, a first portion of the signal line is disposed in an internal space of the hinge module, and a second portion of the signal line extends toward the first housing and can be electrically connected to a communication module disposed in the first housing.

[0178] According to one embodiment, the first guide member (375) may be configured to guide the signal line (3352) in a third direction (D2) so that the signal line moves away from the electronic component.

[0179] According to one embodiment, the first guide member (375) may include a noise blocking material.

[0180] According to one embodiment, the first housing (310) may include a first plate (311) disposed on the first housing; and a first support member (340) disposed at an end of the first plate (311) so as to face the hinge cover (331). The first support member (340) may include a second guide member (342) for guiding the signal line.

[0181] According to one embodiment, the second guide member may be configured to limit flow in a first direction parallel to the longitudinal direction of the electronic device and a second direction parallel to the height direction of the electronic device with respect to the signal line.

[0182] According to one embodiment, a fixing member (376) may be further included.

[0183] According to one embodiment of the present disclosure, an electronic device may be provided, comprising: a housing (202) including a first housing (210; 310) and a second housing (220; 320); a hinge module (230; 330) rotatably connecting the first housing to the second housing, the hinge module including a hinge cover (331) surrounding an internal space of the hinge module; and a hinge (332) at least partially disposed in the internal space; a circuit board (370) disposed within the first housing; an antenna module (3351) disposed in the internal space or at a position adjacent to the internal space; a signal line (3352) connected from the antenna module; an electronic component (3721) disposed on the circuit board; and a first guide member (375) disposed spaced apart from the electronic component on the circuit board to guide the coaxial cable. The electronic device may be configured such that the signal line is moved away from the electronic component by using the first guide member when the first housing is open relative to the second housing rather than when the first housing is closed relative to the second housing.

[0184] Although the detailed description of the present disclosure has described specific embodiments, it will be apparent to those skilled in the art that various modifications are possible without departing from the scope of the present disclosure.

[0185] While this disclosure has been described by way of example and example, it should be understood that the example is intended to be illustrative and not limiting. It will be apparent to those skilled in the art that various changes in form and detail may be made without departing from the overall scope of this disclosure, including the appended claims and their equivalents.

Claims

1. In electronic devices, A housing (202) comprising a first housing (210; 310) and a second housing (220; 320); A hinge module (230; 330) that rotatably connects the first housing to the second housing; A circuit board (370) disposed in the first housing; Antenna module (3351) arranged in the internal space of the above hinge module; A signal line (3352) connected to the above antenna module; Electronic components (3721) arranged on the above circuit board; and When the second housing rotates in the first rotational direction with respect to the first housing, An electronic device comprising a first guide member (375) configured to move a portion of the signal line (3352) away from the electronic component.

2. In paragraph 1, The above hinge module includes a hinge cover (331) having an internal space, and the antenna module is an electronic device arranged in the internal space.

3. In paragraph 1 or 2, An electronic device wherein the guide member is configured to move a portion of the signal line (3352) toward the electronic component when the second housing rotates in a second rotational direction opposite to the first rotational direction with respect to the first housing.

4. In any one of paragraphs 1 to 3, The hinge module rotates based on the rotation of the first housing relative to the second housing, An electronic device in which the antenna module rotates based on the rotation of the hinge module, and the signal line moves according to the rotation of the antenna module.

5. In any one of paragraphs 1 to 4, The first guide member is an electronic device configured to slide or rotate in one direction.

6. In any one of paragraphs 1 to 5, An electronic device including a motor for driving a first guide member (375) so that the first guide member (375) can move.

7. In any one of paragraphs 1 to 6, When the first housing is rotated relative to the second housing An electronic device including a guide device for rotating or moving a first guide member (375).

8. In any one of paragraphs 1 to 7, The above hinge module includes a hinge (332) at least partially disposed in the interior space of the hinge module, The above hinge (332) includes a body portion (3321), a first hinge portion (3322) configured to extend from the body portion (3321) and be connected to a first housing (310), and a second hinge portion (3322) configured to extend from the body portion (3321) and be connected to a second housing (320). An electronic device in which the first hinge portion (3322) and the second hinge portion (3323) are spaced apart from each other by a predetermined distance (H1) in the height direction of the electronic device (101).

9. In any one of paragraphs 1 to 8, The above signal line is an electronic device that is a coaxial cable.

10. In any one of paragraphs 1 to 9, An electronic device wherein a first portion of the signal line is arranged in an internal space of the hinge module, and a second portion of the signal line extends toward the first housing and is electrically connected to a communication module arranged in the first housing.

11. In any one of paragraphs 1 to 10, An electronic device in which the first guide member (375) is configured to guide a signal line (3352) in a third direction (D2) so that the signal line moves away from the electronic component.

12. In any one of paragraphs 1 to 11, The above first guide member (375) is an electronic device including a noise blocking material.

13. In any one of paragraphs 1 to 12, A first plate (311) placed in the first housing (310); and It includes a first support member (340) positioned at an end of the first plate (311) facing the hinge cover (331), An electronic device in which the first support member (340) includes a second guide member (342) for guiding the signal line.

14. In paragraph 13, An electronic device wherein the second guide member is configured to limit flow in a first direction parallel to the longitudinal direction of the electronic device and a second direction parallel to the height direction of the electronic device with respect to the signal line.

15. In any one of paragraphs 1 to 14, An electronic device further comprising a fixed member (376).

Images