Camera module

Abstract

This camera module comprises: a holder; a lens disposed in the holder; a substrate coupled to the lower surface of the holder; an image sensor disposed on the substrate; a first pad disposed on the image sensor; a second pad disposed on the substrate; and a wire connecting the first pad and the second pad, wherein the wire and the first pad, and the wire and the second pad are wedge-bonded.

Description

Camera module

[0001] This embodiment relates to a camera module.

[0002]

[0003] Recently, ultra-small camera modules are being developed and are widely used in small electronic products such as smartphones, laptops, and game consoles.

[0004] With the popularization of automobiles, micro cameras are widely used not only in small electronic devices but also in vehicles. For example, they are equipped with dashcam cameras for vehicle protection or objective data regarding traffic accidents, rear-view cameras that allow the driver to monitor blind spots behind the vehicle via a screen to ensure safety when reversing, and surrounding detection cameras that monitor the vehicle's vicinity.

[0005] The camera includes a lens, a lens module that accommodates the lens, an image sensor that converts an image of a subject gathered by the lens into an electrical signal, and a printed circuit board on which the image sensor is mounted.

[0006] Reflecting the recent trend of camera module miniaturization, camera modules utilizing COB (Chip on Board) packages are being proposed. In the case of COB packages, electrical connections between the image sensor and the printed circuit board are established via wires due to the difficulty of embedding the image sensor within the printed circuit board. While these wires are typically made of gold (Au) for durability, the stringent bonding conditions lead to reduced production efficiency and increased manufacturing costs. Furthermore, the difficulty in controlling the shape of the wires within the module results in an increase in the size of the camera module to accommodate the wire placement space.

[0007]

[0008] The present invention provides a camera module that can lower manufacturing costs, improve assembly to enhance production efficiency, and enable miniaturization.

[0009]

[0010] A camera module according to the present embodiment comprises: a holder; a lens disposed within the holder; a substrate coupled to the lower surface of the holder; an image sensor disposed on the substrate; a first pad disposed on the image sensor; a second pad disposed on the substrate; and a wire connecting the first pad and the second pad, and the wire and the first pad, and the wire and the second pad are wedge bonded.

[0011] The lower surface of the substrate facing the image sensor may have a space formed for the placement of a jig or a reinforcing part.

[0012] The above wire can be connected to the first pad before the second pad.

[0013] The wire may include a bonding portion disposed on the first pad and a tail portion having a shape protruding from the outer surface of the bonding portion.

[0014] The above wire can be connected to the second pad before the first pad.

[0015] The above wire may include a bonding portion disposed on the second pad and a tail portion having a shape protruding from the outer surface of the bonding portion.

[0016] The angle a formed by the wire and one side of the image sensor that overlaps the wire in the vertical direction may be 0 to 30 degrees or less.

[0017] Based on a virtual line (l1) parallel to the direction in which the first pad and the second pad face each other, the angle (b) formed by the wire and the virtual line (l1) may be 80 degrees to 100 degrees or less.

[0018] The first pad or the second pad each has a rectangular cross-section having a major axis and a minor axis, and the length of the minor axis of the first pad or the second pad is 100 µm x Sin (maximum angle of the wire) + (width of the wire x 2) or more, and the length of the major axis of the first pad or the second pad may be 100 µm + (width of the wire x 2) or more.

[0019] The first pad or the second pad each has a rectangular cross-section having a major axis and a minor axis, and the length of the minor axis of the first pad or the second pad is at least 4 times the width of the wire, and the length of the major axis of the first pad or the second pad may be at least 100 µm + (width of the wire x 2).

[0020]

[0021] Through this embodiment, the wire connection structure using a wedge bonding method has the advantage of securing a wider placement space for the substrate, lowering manufacturing costs, and improving production efficiency.

[0022] In addition, it has the advantage of minimizing interference between multiple wires during the assembly or usage process.

[0023]

[0024] FIG. 1 is a cross-sectional view of a camera module according to an embodiment of the present invention.

[0025] FIG. 2 is a plan view showing the upper surface of a substrate according to an embodiment of the present invention.

[0026] FIGS. 3 and 4 are drawings for explaining the coupling structure of a jig or reinforcing part during the coupling process of an image sensor according to an embodiment of the present invention.

[0027] FIGS. 5 and 6 are plan views illustrating the combined structure of a first pad and a second pad according to the connection direction of the wire according to an embodiment of the present invention.

[0028] FIG. 7 is a plan view showing the upper surface of a substrate according to an embodiment of the present invention.

[0029] FIGS. 8 and 9 are drawings for explaining the spacing between an image sensor, a second pad, and an electronic component according to a wire bonding method according to an embodiment of the present invention.

[0030] FIG. 10 is a plan view showing a portion of the upper surface of a substrate according to an embodiment of the present invention.

[0031] FIG. 11 is a drawing illustrating the bonding part coupling shape on a pad according to an embodiment of the present invention.

[0032] FIG. 12 is a drawing illustrating the bonding part combination shape on a pad according to a comparative example.

[0033] FIG. 13 is a plan view illustrating the coupling structure of a first pad and a second pad through a wire according to an embodiment of the present invention.

[0034] FIGS. 14 and FIGS. 15 are drawings showing the bonding process of a wire according to an embodiment of the present invention.

[0035]

[0036] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings.

[0037] However, the technical concept of the present invention is not limited to some of the described embodiments but can be implemented in various different forms, and within the scope of the technical concept of the present invention, one or more of the components among the embodiments may be selectively combined or substituted.

[0038] In addition, terms used in the embodiments of the present invention (including technical and scientific terms) may be interpreted in a sense that is generally understood by those skilled in the art to which the present invention belongs, unless explicitly and specifically defined otherwise. Terms that are commonly used, such as terms defined in advance, may be interpreted in consideration of their meaning in the context of the relevant technology.

[0039] Furthermore, the terms used in the embodiments of the present invention are for the purpose of describing the embodiments and are not intended to limit the present invention.

[0040] In this specification, the singular form may include the plural form unless specifically stated otherwise in the text, and when described as "at least one of A and B and C (or more than one)," it may include one or more of all combinations that can be formed from A, B, and C.

[0041] In addition, terms such as first, second, A, B, (a), (b), etc., may be used when describing the components of the embodiments of the present invention. These terms are used merely to distinguish the components from other components and are not intended to limit the essence, order, or sequence of the components.

[0042] And, where it is stated that a component is 'connected', 'combined', or 'connected' to another component, this may include not only cases where the component is directly 'connected', 'combined', or 'connected' to the other component, but also cases where it is 'connected', 'combined', or 'connected' due to another component located between the component and the other component.

[0043] Furthermore, when described as being formed or placed "above" or "below" each component, "above" or "below" includes not only cases where two components are in direct contact with each other, but also cases where one or more other components are formed or placed between the two components. Additionally, when expressed as "above" or "below," it may include the meaning of a downward direction as well as an upward direction relative to a single component.

[0044] As used below, 'optical axis direction' is defined as the optical axis direction of the lens. Meanwhile, 'optical axis direction' may correspond to 'vertical direction', 'x-axis direction', etc.

[0045] The present invention will be described in more detail below with reference to the attached drawings.

[0046] FIG. 1 is a cross-sectional view of a camera module according to an embodiment of the present invention, FIG. 2 is a plan view showing the upper surface of a substrate according to an embodiment of the present invention, FIG. 3 and FIG. 4 are drawings for explaining the coupling structure of a jig or reinforcing part in the coupling process of an image sensor according to an embodiment of the present invention, and FIG. 5 and FIG. 6 are plan views showing the coupling structure of a first pad and a second pad according to the connection direction of a wire according to an embodiment of the present invention.

[0047] Referring to FIGS. 1 to 4, a camera module (10) according to an embodiment of the present invention may include a holder (100), a lens (110), a substrate (130), an image sensor (140), a wire (150), an infrared filter (170), an electronic component (180), and a connector (190).

[0048] The camera module (10) may include a holder (100). The holder (100) may be formed in a cylindrical shape with open upper and lower ends. The holder (100) may be named a lens holder in that it accommodates a lens (110). Alternatively, the holder (100) may be named a housing, a body, or a case in that it forms the outer shape of the camera module (10).

[0049] A space (104) may be formed on the inner side of the holder (100) to accommodate a lens (110). The space (104) may be opened to the outside through the upper and lower surfaces of the holder (100), respectively. For example, an opening (102) may be formed on the upper surface of the holder (100), and the space (104) may be exposed upward through the opening (102).

[0050] The holder (100) may include a filter coupling portion (106). The filter coupling portion (106) may have a shape that protrudes inward from the inner surface of the holder (100) more than other regions. An infrared filter (IR filter, Infrared Ray filter, 170) may be coupled to the inner side of the filter coupling portion (106). The infrared filter (170) may be placed between the lens (110) and the image sensor (140). The infrared filter (170) may be aligned with the optical axis of the lens (110) and the image sensor (140). Light incident through the lens (110) may pass through the infrared filter (170) and be transmitted to the image sensor (140).

[0051] The lower surface of the holder (100) can be coupled with the substrate (130). The holder (100) may include a side plate (108), and the lower end of the side plate (108) may be coupled to the upper surface of the substrate (130). The holder (100) may include an additional protrusion for coupling with the substrate (130), and the additional protrusion may have a shape that protrudes downward from the lower surface of the filter coupling part (106) so as to be coupled to the upper surface of the substrate (130).

[0052] The lens (110) can be placed in the space (104) within the holder (100). The lens (110) can be aligned with the optical axis of the image sensor (140). Multiple lenses (110) may be provided and arranged along the optical axis direction in the space (104) within the holder (100). Light incident through the aperture (102) can pass through the lens (110) and be directed toward the image sensor (140).

[0053] A substrate (130) can be coupled to the lower surface of a holder (100). The substrate (130) may be a printed circuit board. At least one electronic component (180) for driving a camera module (10) may be disposed on the surface of the substrate (130). For example, the electronic component (180) may be disposed on the lower surface of the substrate (130). As a variation, the electronic component (180) may be provided in multiple numbers and disposed on both the lower surface and the upper surface (see FIG. 2) of the substrate (130), respectively.

[0054] A connector (190) may be disposed on the lower surface of the substrate (130). The connector (190) is coupled with an external terminal (not shown), thereby allowing power to be supplied to the camera module (10) or electrical signals for driving the camera module (10) to be transmitted and received.

[0055] An image sensor (140) may be placed on the substrate (120). Light incident through the opening (102) of the holder (100) may be converted into an electrical signal through the image sensor (140). The image sensor (140) may be placed facing the lens (110) in the direction of the optical axis. The image sensor (140) may be aligned with the lens (110) in the direction of the optical axis. The image sensor (140) has a predetermined thickness in the direction of the optical axis, and the thickness of the image sensor (140) may be thinner than the thickness of the substrate (130). When viewed from the top of the substrate (120) in the direction of the optical axis, the cross-sectional shape of the image sensor (140) may be rectangular, but is not limited thereto.

[0056] A first pad (142, see FIG. 5) may be disposed on the image sensor (140). The image sensor (140) may be electrically connected to a substrate (130) through the first pad (142). The first pad (142) may be provided in multiple numbers and disposed along the edges of the image sensor (140). For example, when the cross-section of the image sensor (140) is rectangular, multiple first pads (142) may be disposed adjacent to a first side of the image sensor (140), a second side opposite to the first side, a third side adjacent to the first and second sides, and a fourth side adjacent to the first and second sides and opposite to the third side.

[0057] A second pad (132) may be disposed on the substrate (120). The substrate (120) may be electrically connected to the image sensor (140) through the second pad (132). The second pad (132) may be disposed on the upper surface of the substrate (130). The second pad (132) may be disposed on the outer side of the image sensor (140). The second pad (132) may be provided in multiple numbers and disposed along the perimeter of the image sensor (140). For example, multiple second pads (132) may be disposed along the first side to the fourth side of the image sensor (140). The second pad (132) may include multiple second-1 pads (132a, see FIG. 2) forming a first line along a first direction, and multiple second-2 pads (132b) forming a second line along the first direction. Multiple second-1 pads (132a) may be spaced apart from multiple second-2 pads (132b) in a second direction perpendicular to the first direction. Multiple second-1 pads (132a) may be positioned closer to the image sensor (140) than multiple second-2 pads (132b).

[0058] The camera module (10) may include a wire (150). The wire (150) may electrically connect the image sensor (140) and the substrate (130). Both ends of the wire (150) may be connected to the first pad (142) and the second pad (132), respectively. The wire (130) may be provided in multiple numbers to electrically connect multiple first pads (142) and multiple second pads (132), respectively.

[0059] As illustrated in FIG. 5, a first bonding portion (152) coupled with a first pad (142) may be disposed at one end of the wire (150). A second bonding portion (154) coupled with a second pad (132) may be disposed at the other end of the wire (150). The first bonding portion (152) and the second bonding portion (154) may each have a shape in which at least a portion is wider in the horizontal direction than the wire (150). For example, the first bonding portion (152) and the second bonding portion (154) may include both ends and a central portion disposed between the two ends, wherein the horizontal width of the central portion is greater than the horizontal width of the wire (150), and the horizontal width of both ends is smaller than the horizontal width of the wire (150). Here, the horizontal direction is a direction perpendicular to the optical axis direction of the camera module (10), and may be a direction parallel to one side of the first pad (142) or the second pad (132), or a direction parallel to the diagonal direction of the first pad (142) or the second pad (132).

[0060] The material of the wire (130) may be aluminum (Al). Both ends of the wire (130) may be wedge bonded to the first pad (142) and the second pad (132), respectively. In the case of the wedge bonding method, the wire is compressed into the bonding area by the heat of the jig itself to which it is bonded. Compared to the ball bonding method, this method offers ease of productivity in that it does not require a separate heating means. Additionally, compared to the ball bonding method, it does not require space for the placement of a heating means within the substrate (120), so there is an advantage in securing a larger space for component placement within the substrate (120). Furthermore, compared to a wire made of gold (Au), the wedge bonding method using an aluminum (Al) wire (130) has the advantage of lowering the manufacturing cost.

[0061] As illustrated in FIGS. 3 and 4, the camera module (10) according to the present embodiment does not require a space for a heating means within the substrate (130) for the bonding process of the wire (150), so a space may be secured on the lower surface of the substrate (130) for a jig (500) or a reinforcing part (510) to be attached to stably support the substrate (130) during the bonding process of the wire (150). In this case, an electronic component (180) may not be placed on the lower surface of the substrate (130) that overlaps with the image sensor (130) in the direction of the optical axis.

[0062] For example, as shown in FIG. 3, a jig (500) can be attached to the lower surface of a substrate (130), and the jig (500) can provide a vacuum environment around the substrate (130) during the bonding process of the wire (150). As another example, as shown in FIG. 4, a plurality of reinforcing members (510) can be disposed on the lower surface of the substrate (130), and some of the plurality of reinforcing members (510) are disposed in an area that overlaps with the sensor (140) or the second pad (132) in the optical axis direction to minimize vibration of the substrate (130) that may occur during the crimping process of the wire (150).

[0063] Meanwhile, based on the electronic component (180) placed on the lower surface of the substrate (130), the coupling area of ​​the jig (500) or the reinforcing part (510) may be spaced at least 0.5 mm apart in a direction perpendicular to the optical axis direction with respect to the electronic component (180). That is, based on the direction perpendicular to the optical axis direction, the spacing distance (b) between the jig (500) and the electronic component (180) may be at least 0.5 mm. In addition, for stable support of the substrate (130), the cross-sectional area of ​​the jig (500) or the reinforcing part (510) may be at least 16 mm². Here, the cross-sectional area of ​​the jig (500) or the reinforcing part (510) may be the cross-sectional area formed by the cross-section perpendicular to the optical axis direction.

[0064] As illustrated in FIGS. 5 and 6, the wire (150) can be joined by a forward bonding method or a reverse bonding method. The forward bonding method may be a method in which, as illustrated in FIG. 5, one end of the wire (150) is first bonded to the first pad (142) of the image sensor (140) and then the other end is bonded to the second pad (132) of the substrate (130). The reverse bonding method may be a method in which, as illustrated in FIG. 6, one end of the wire (150) is first bonded to the second pad (132) of the substrate (130) and then the other end is bonded to the first pad (142) of the image sensor (140).

[0065] In the case of a forward bonding method, the wire (150) may include a tail portion (153) protruding outward from a first bonding portion (152) coupled to a first pad (142).

[0066] In the case of a reverse bonding method, the wire (150) may include a tail portion (155) protruding outward from a second bonding portion (154) connected to a second pad (132).

[0067] That is, the tail region within the wire (150) can be formed in either the first bonding part (152) or the second bonding part (154), depending on whether it is first bonded to the first pad (142) or the second pad (132).

[0068] To increase the bonding force with multiple pads (132, 142), the angle a (see FIG. 2) formed by one side of the wire (140) and the image sensor (140) superimposed in the optical axis direction may be 0 to 30 degrees or less. If the angle a exceeds 30 degrees, the bonding force with the multiple pads (132, 142) decreases due to the tension of the wire (140), and the wire (140) may be separated from the multiple pads (132, 142).

[0069] In other words, as illustrated in FIG. 5, the angle (b) formed by the wire (150) with respect to a virtual line (l1) parallel to one side of the first pad (142) or the second pad (132) may be 60 degrees to 120 degrees or less. Here, the virtual line (l1) may be a line parallel to the longer side of the first pad (142) or the second pad (132). Also, in the case of a reverse bonding method, since the wire (150) extends from the substrate (130) toward the image sensor (140), the angle (b) formed by the virtual line (l1) and the wire (150) may be limited to 80 degrees to 100 degrees or less.

[0070] FIG. 7 is a plan view illustrating the upper surface of a substrate according to an embodiment of the present invention, and FIG. 8 and FIG. 9 are drawings for explaining the spacing between an image sensor, a second pad, and an electronic component according to a wire bonding method according to an embodiment of the present invention.

[0071] Referring to FIG. 7, the image sensor (140) and the second pad (132) may have a first separation distance (d) in a direction perpendicular to the optical axis direction. The first separation distance (d) may be the shortest distance between the image sensor (140) and the second pad (132) in a direction perpendicular to the optical axis direction.

[0072] As described above, the camera module (10) includes an electronic component (180) disposed on a substrate (130), and the electronic component (180) may have a second separation distance (e) in a direction perpendicular to the optical axis direction with respect to the second pad (132). Since the wire (150) is joined to the camera module (10) according to the present embodiment through a wedge bonding method, space for the movement of the jig (600) must be secured on the substrate (130). That is, if interference occurs between the jig (600) and the image sensor (140) or between the jig (600) and the electronic component (180), damage may occur to the image sensor (140) or the electronic component (180). In addition, interference between the wire (150) and the image sensor (140) or between the wire (150) and the electronic component (180) must also be prevented during the bonding process of the wire (150).

[0073] In consideration of this, in the forward bonding method, as shown in FIG. 8, the first separation distance (d) may be 0.58 mm or more. The second separation distance (e) may be 0.33 mm or more longer than the height (H1) of the electronic component (180).

[0074] In the reverse bonding method, as shown in FIG. 9, the first separation distance (d) may be at least 0.33 mm longer than the height (H1) of the electronic component (180). The second separation distance (e) may be at least 0.3 mm.

[0075] According to the above-described range, interference between the jig (600), the image sensor (140), and the electronic component (180), and between the wire (150) and the image sensor (140) and the electronic component (180) can be efficiently prevented.

[0076] FIG. 10 is a plan view showing a portion of the upper surface of a substrate according to an embodiment of the present invention, FIG. 11 is a drawing showing a bonding part connection shape on a pad according to an embodiment of the present invention, and FIG. 12 is a drawing showing a bonding part connection shape on a pad according to a comparative example.

[0077] Referring to FIGS. 10 to 12, the cross-sectional area of ​​the first pad (142) or the second pad (132) can be formed by taking into account the cross-sectional area of ​​the bonding portion (152, 154, see FIG. 5). As in the comparative example shown in FIG. 12, if the cross-sectional area of ​​the pad is small enough to form the bonding portion, the electrical and physical bonding force may be reduced due to the protrusion of the bonding portion (24) to the outside of the pad (22).

[0078] Considering this, in the case of a forward bonding method, as shown in FIG. 10 and FIG. 11, the length h of the short axis of the first pad (142) or the second pad (132) may be greater than or equal to 100 μm x Sin (maximum angle of the wire) + (width of the wire x 2). Here, the maximum angle of the wire may be the angle formed by a virtual line (l3) connecting both ends of the bonding portion (154) based on a virtual line (l2) parallel to the long side of the second pad (132). The virtual line (l3) connecting both ends of the bonding portion (154) may be the area forming the maximum length among the lengths connecting mutually opposing areas of the bonding portion (154) based on a direction perpendicular to the optical axis direction.

[0079] The length g of the major axis of the first pad (142) or the second pad (132) may be 100 µm + (width of the wire x 2) or more. Here, the width of the wire may be the diameter of the wire (150).

[0080] In the case of a reverse bonding method, the length h of the short axis of the first pad (142) or the second pad (132) may be greater than or equal to the wire width x 4. The length g of the long axis of the first pad (142) or the second pad (132) may be greater than or equal to 100 µm + (wire width x 2).

[0081] Meanwhile, the minimum length of the long or short axis of the pad is determined based on twice the width of the wire (150), taking into account that the maximum width of the bonding portion (152, 154) is more than twice the width of the wire (150).

[0082] FIG. 13 is a plan view illustrating the coupling structure of a first pad and a second pad through a wire according to an embodiment of the present invention, and FIG. 14 and FIG. 15 are drawings showing the bonding process of a wire according to an embodiment of the present invention.

[0083] Referring to FIGS. 13 to 15, as described above, the camera module (10) includes a plurality of first pads (142) and a plurality of second pads (132). In this case, a plurality of wires (150) are also provided to connect the plurality of first pads (142) and the plurality of second pads (132). The plurality of first pads (142) and the plurality of second pads (132) can be connected in a 1:1 manner through a single wire (150), but as shown in FIG. 13, a plurality of wires (150) can be connected to a single first pad (142) or a single second pad (132). In this case, the plurality of wires (150) connected to the single second pad (132) can form a gap k on the upper surface of the second pad (132). Here, the spacing k may be a spacing formed based on a first direction (X) in which a plurality of first pads (142) are arranged. Additionally, the spacing between adjacent plurality of first pads (142) based on the first direction (X) may be defined as i. Additionally, based on a direction perpendicular to the optical axis direction, the minimum securing distance between a plurality of wires (150) connecting different first pads (142) and second pads (132) may be defined as j. Here, the minimum securing distance j between the plurality of wires (150) is a distance required to prevent contact between two adjacent wires (150) depending on the arrangement of the plurality of wires (150). Meanwhile, during the bonding process of a plurality of wires (150) that are bonded to a single first pad (142) or second pad (132), interference with adjacent wires (150) may occur due to a bonding tool, such as a jig (600). To prevent this, the spacing k between the multiple wires (150) on the upper surface of the second pad (132) and the spacing i between adjacent multiple first pads (142) can be determined by the specifications of the jig (600).

[0084] For convenience of explanation, the following describes an interference prevention structure between the jig (600) and the wire (150) based on a structure in which a plurality of wires (150) are combined on a single second pad (132) as shown in FIG. 13.

[0085] In addition, the direction in which multiple wires (150) are adjacent to a single pad is defined as the first direction (X), and the direction perpendicular to the first direction is defined as the second direction (Y).

[0086] In the forward bonding method, the spacing k between multiple wires (150) based on a single second pad (132) may be greater than the first direction (X) length m of the jig (600) + the first direction (X) width of the wire. Additionally, the spacing i between multiple first pads (142) may be greater than 240 µm / ((wire length) x (distance in the optical axis direction between the wire and the substrate)) + first direction length (m) of the jig + first direction (X) width of the wire.

[0087] In the reverse bonding method, based on a single second pad (130), the spacing k between multiple wires (150) may be greater than or equal to 240 µm / ((wire length) x (distance in the optical axis direction between the wire and the substrate + thickness in the optical axis direction of the second pad)) + length (m) in the first direction (X) of the jig + width (X) of the wire. Additionally, the spacing i between multiple first pads (142) may be greater than or equal to the length (m) in the first direction (X) of the jig + width (X) of the wire.

[0088] Meanwhile, the shortest distance j in the optical axis direction between multiple wires (150) connecting the different first pad (142) and second pad (132) may be at least three times the diameter of the wire (150).

[0089] Accordingly, during the process of joining multiple wires (150), interference between the jig (600) and adjacent wires (150) can be prevented.

[0090] In the foregoing, although all components constituting an embodiment of the present invention have been described as being combined or operating in combination, the present invention is not necessarily limited to such embodiments. That is, within the scope of the purpose of the present invention, all components may be selectively combined in one or more ways to operate. Furthermore, terms such as "include," "constitute," or "have" described above, unless specifically stated otherwise, mean that the relevant component may be inherent; thus, they should be interpreted as allowing for the inclusion of additional components rather than excluding other components. All terms, including technical or scientific terms, have the same meaning as generally understood by those skilled in the art to which the present invention pertains, unless otherwise defined. Terms commonly used, such as those defined in advance, should be interpreted in accordance with their meaning in the context of the relevant technology and should not be interpreted in an ideal or overly formal sense unless explicitly defined in the present invention.

[0091] The foregoing description is merely an illustrative explanation of the technical concept of the present invention, and those skilled in the art to which the present invention pertains will be able to make various modifications and variations within the scope of the essential characteristics of the present invention. Accordingly, the embodiments disclosed in the present invention are intended to explain, not limit, the technical concept of the present invention, and the scope of the technical concept of the present invention is not limited by such embodiments. The scope of protection of the present invention shall be interpreted by the claims below, and all technical concepts within an equivalent scope shall be interpreted as being included within the scope of rights of the present invention.

Claims

1. Holder; A lens placed within the above holder; A substrate coupled to the lower surface of the above-mentioned holder; An image sensor disposed on the above substrate; A first pad disposed on the image sensor above; A second pad disposed on the substrate; and It includes a wire connecting the first pad and the second pad, The above wire and the first pad, and the above wire and the second pad are wedge-bonded to form a camera module.

2. In Paragraph 1, A camera module in which the lower surface of the substrate facing the image sensor has a space formed for the placement of a jig or a reinforcing part.

3. In Paragraph 1, The above wire is a camera module connected to the first pad before the second pad.

4. In Paragraph 3, The above wire is a camera module comprising a bonding portion disposed on the first pad and a tail portion having a shape protruding from the outer surface of the bonding portion.

5. In Paragraph 1, The above wire is a camera module connected to the second pad before the first pad.

6. In Paragraph 5, The above wire is a camera module comprising a bonding portion disposed on the second pad and a tail portion having a shape protruding from the outer surface of the bonding portion.

7. In Paragraph 1, A camera module in which the angle a formed by the wire and one side of the image sensor superimposed with the wire in the vertical direction is 0 to 30 degrees or less.

8. In Paragraph 1, A camera module in which the angle (b) formed by the wire and the virtual line (l1) is 80 degrees to 100 degrees or less, based on a virtual line (l1) parallel to the direction in which the first pad and the second pad face each other.

9. In Paragraph 3, The first pad or the second pad each has a rectangular cross-section having a major axis and a minor axis, The length of the short axis of the first pad or the second pad is 100 µm x Sin(maximum angle of the wire) + (width of the wire x 2) or greater, and A camera module in which the length of the major axis of the first pad or the second pad is 100 µm + (wire width x 2) or more.

10. In Paragraph 5, The first pad or the second pad each has a rectangular cross-section having a major axis and a minor axis, The length of the short section of the first pad or the second pad is at least the width of the wire x 4, and A camera module in which the length of the major axis of the first pad or the second pad is 100 µm + (wire width x 2) or more.

Images