Terminal device and air duct assembly

Abstract

A terminal device and an air duct assembly, relating to the technical field of heat dissipation for terminal devices. The terminal device comprises a middle frame, an air duct assembly and a heating device. The middle frame is provided with an accommodating compartment. The air duct assembly comprises a partition portion and a thin-film fan. The partition portion is arranged in the accommodating compartment. The partition portion defines an air duct, a first air port and a second air port in an enclosing manner, the air duct communicating the first air port with the second air port. An air inlet of the thin-film fan is in communication with the first air port, and an air outlet of the thin-film fan is in communication with the second air port. There may be a plurality of thin-film fans and a plurality of heating devices, and the plurality of heating devices are arranged at intervals. Any heating device may be arranged adjacent to one, two or more thin-film fans. The number of thin-film fans arranged adjacent to different heating devices may be the same or may be different. The terminal device can reduce the space occupied by the air duct assembly, improves the heat dissipation effect, and can meet the heat dissipation requirements of different heating devices.

Description

Terminal equipment and duct components

[0001] This application claims priority to Chinese patent application No. 202411766232.8, filed with the State Intellectual Property Office of China on November 30, 2024, entitled “Terminal Equipment and Air Duct Assembly”, the entire contents of which are incorporated herein by reference. Technical Field

[0002] Embodiments of this application provide a terminal device and an air duct assembly, relating to the technical field of heat dissipation for terminal devices. Background Technology

[0003] Terminal devices include heat-generating components, which generate a large amount of heat during operation, causing the local temperature of the terminal device to rise and affecting its normal operation.

[0004] Typically, passive cooling is used to dissipate heat from heat-generating components. That is, the heat emitted by these components is conducted to parts such as the device's casing and display screen, from which it dissipates to the outside. However, passive cooling is less effective, limiting the amount of heat dissipated by the components and thus restricting the overall power consumption of the device. Summary of the Invention

[0005] Embodiments of this application provide a terminal device and an air duct assembly for heat dissipation of heat-generating components in the terminal device.

[0006] On one hand, embodiments of this application provide a terminal device. The terminal device includes a mid-frame, an air duct assembly, and a heating element. The mid-frame has a receiving compartment. The air duct assembly includes a partition and a thin-film fan. The partition is disposed within the receiving compartment and connected to the mid-frame. The partition encloses an air outlet, a first air vent, and a second air vent, and the air duct connects the first air vent and the second air vent. The thin-film fan is disposed within the air duct and connected to the partition. The air inlet of the thin-film fan communicates with the first air vent, and the air outlet of the thin-film fan communicates with the second air vent. The heating element is disposed outside the air duct and adjacent to the partition; or, the heating element is disposed within the air duct.

[0007] The embodiments of this application configure the terminal device to include a duct assembly. The thin-film fan of the duct assembly drives the gas to flow through the duct, thereby realizing active heat dissipation of the terminal device, improving the heat dissipation of the terminal device, and meeting the power consumption requirements of the terminal device.

[0008] The partition of the air duct assembly is located inside the receiving chamber, and the partition surrounds the air outlet duct. Compared with the middle frame directly surrounding the air outlet duct, the partition can isolate the functional components of the terminal equipment (such as the motherboard, sub-board, battery management board and battery, etc.) from the thin film fan, reducing the impact of impurities and water vapor in the gas on the functional components.

[0009] Furthermore, the production process of the middle frame is simplified as it does not require changes to the structure of the middle frame. The partitions can be placed in different positions within the storage compartment according to the arrangement of functional components, and the partitions forming air ducts of different shapes can be connected to the middle frame based on the arrangement of functional components within the storage compartment, thus improving the flexibility of air duct placement within the storage compartment.

[0010] The heating element is located outside the air duct and adjacent to the partition, or the heating element is located inside the air duct, so that the gas flowing inside the air duct can dissipate heat from the heating element, thereby achieving active heat dissipation of the heating element, increasing the heat dissipation of the heating element, and meeting the power consumption requirements of the terminal device.

[0011] Understandably, when the heating element is located outside the air duct, the separator can isolate the thin-film fan and the heating element, reducing the impact of impurities and water vapor in the gas on the heating element. When the heating element is located inside the air duct, the gas in the air duct can directly exchange heat with the heating element, improving the heat dissipation effect. Placing the heating element outside or inside the air duct increases the flexibility of its placement.

[0012] Compared to fans that rely on impeller rotation for airflow (i.e., impeller fans), thin-film fans are smaller, allowing them to be placed closer to heat-generating components for localized heat extraction and improved heat dissipation of the air duct assembly. Furthermore, the flexible placement of thin-film fans enables a more compact air duct assembly structure, facilitating the miniaturization of terminal devices.

[0013] Furthermore, the thin-film fan has a higher exhaust pressure, a higher exhaust head (exhaust pressure), and a higher air velocity, thus improving the heat dissipation performance of the air duct assembly. In other words, by incorporating a thin-film fan into the air duct assembly, the terminal device can achieve both aesthetic appeal and effective heat dissipation.

[0014] In some possible implementations, the length direction of the middle frame intersects with the width direction of the middle frame. The plane containing the length and width directions of the middle frame is called the first plane. There are multiple heat-generating devices and multiple thin-film fans. The orthographic projection of any heat-generating device on the first plane is adjacent to the orthographic projection of at least one thin-film fan on the first plane. This arrangement achieves a distributed arrangement of thin-film fans, enabling them to dissipate heat for each heat-generating device and reducing the distance between the thin-film fans and the heat-generating devices, i.e., reducing the distance between the thin-film fans and the heat source. This allows for closer heat extraction, improving the heat dissipation effect of the thin-film fans on the heat-generating devices, thereby enhancing the heat dissipation capacity of the air duct assembly.

[0015] In some possible implementations, the orthographic projection of any heat-generating device on the first plane is adjacent to the orthographic projections of at least two thin-film fans on the first plane. This arrangement achieves a distributed arrangement of the thin-film fans and allows at least two thin-film fans to be placed close to the same heat-generating device, thereby improving the heat dissipation of the heat-generating device.

[0016] In some possible implementations, the heat-generating device includes a first heat-generating device and a second heat-generating device. The orthographic projection of the first heat-generating device on the first plane is adjacent to the orthographic projections of n thin-film fans on the first plane. The orthographic projection of the second heat-generating device on the first plane is adjacent to the orthographic projections of m thin-film fans on the first plane. Here, m and n are both positive integers. m and n are equal, or m and n are not equal. Understandably, when m and n are equal, the flexibility of the distributed arrangement of the thin-film fans can be improved. Furthermore, the number of thin-film fans adjacent to the heat-generating device can be set according to the heat dissipation of the heat-generating device, meeting the heat dissipation requirements of different heat-generating devices. When m and n are equal, the regularity of the distributed arrangement of the thin-film fans can be improved.

[0017] In some possible implementations, at least two diaphragm fans drive the gas into the duct through the same first air inlet; and / or, at least two diaphragm fans drive the gas out of the duct through the same second air inlet. This arrangement reduces the number of first and / or second air inlets, simplifies the structure of the duct assembly, and improves the ease of manufacturing the duct assembly.

[0018] In some possible implementations, a diaphragm fan drives gas to flow into the duct via a first vent; and / or, a diaphragm fan drives gas to flow out of the duct via a second vent. This arrangement ensures that the number of at least one of the first and second vents is equal to the number of diaphragm fans, reducing the mutual interference between multiple diaphragm fans during air intake and / or exhaust.

[0019] In some possible implementations, a first air vent and a second air vent form an air vent group, with the orthographic projection of the air vent group on a first plane adjacent to the orthographic projection of a thin-film fan on the same first plane. The gas driven by the thin-film fan flows into the air duct through the first air vent in the air vent group adjacent to the thin-film fan, and flows out of the air duct through the second air vent in the same air vent group adjacent to the thin-film fan. Understandably, the thin-film fan's ability to drive gas into or out of the air duct through the air vent group adjacent to the thin-film fan reduces the distance between the air vent group and the thin-film fan, facilitating the flow of gas driven by the thin-film fan. Furthermore, it reduces the mutual interference between different thin-film fans, improving the heat dissipation performance of the air duct assembly.

[0020] In some possible implementations, the heating element is positioned outside the air duct. The heating element contacts the partition; alternatively, the air duct assembly further includes a first thermally conductive component disposed between and in contact with both the heating element and the partition. Understandably, positioning the heating element outside the air duct allows the partition to separate the thin-film fan and the heating element, reducing the impact of impurities and water vapor in the gas on the heating element. The contact between the heating element and the partition allows heat emitted by the heating element to be conducted to the partition and dissipated outwards via the gas flowing within the air duct. Alternatively, providing a first thermally conductive component between the heating element and the partition reduces the thermal resistance between them, improving the heat dissipation effect of the air duct assembly on the heating element.

[0021] In some possible implementations, the air duct assembly further includes heat dissipation fins disposed within the air duct and connected to a partition. The partition includes a base plate and sidewalls, with the base plate connected to the sidewalls. Along the height direction of the middle frame, the heat dissipation fins and the heat-generating device are located on opposite sides of the base plate. The height direction of the middle frame intersects with the plane containing the length and width directions of the middle frame. The length and width directions of the middle frame also intersect. This arrangement allows heat dissipated by the heat-generating device to be conducted to the heat dissipation fins through the base plate. The heat dissipation fins have a large contact area with the air within the air duct, thereby increasing heat dissipation, facilitating heat dissipation from the heat-generating device, and improving the heat dissipation performance of the air duct assembly.

[0022] In some possible implementations, the air duct assembly further includes a second heat-conducting component located between and in contact with the heat sink fins and the base plate. Understandably, the second heat-conducting component, positioned between the heat sink fins and the base plate, reduces the thermal resistance between them, thereby improving the heat dissipation effect of the air duct assembly on the heat-generating device.

[0023] In some possible implementations, the heat-generating device is located outside the air duct. The air duct assembly also includes heat dissipation fins, at least a portion of which is located within the air duct and connected to a partition. The partition includes a base plate and sidewalls, with the base plate connected to the sidewalls. A receiving hole is provided on the base plate. At least a portion of the heat-generating device and the heat dissipation fins is located within the receiving hole. The heat-generating device is in contact with the heat dissipation fins. Alternatively, the air duct assembly also includes a third heat-conducting component, which is located between the heat dissipation fins and the heat-generating device, and is in contact with both the heat dissipation fins and the heat-generating device. Understandably, the contact area between the heat dissipation fins and the gas within the air duct is relatively large. Heat exchange between the heat-generating device and the heat dissipation fins increases the heat dissipation of the heat-generating device, thus facilitating heat dissipation. Providing contact between the heat dissipation fins and the heat-generating device shortens the heat transfer path, increases the heat dissipation, and improves the heat dissipation performance of the air duct assembly. Alternatively, the third heat-conducting component is located between the heat dissipation fins and the heat-generating device, and is in contact with both the heat dissipation fins and the heat-generating device, reducing the thermal resistance between the heat-generating device and the heat dissipation fins, and improving the heat dissipation performance of the air duct assembly.

[0024] In some possible implementations, the heat-generating device includes a heat-generating area. The air duct assembly also includes a heat-collecting structure connected to a partition. At least a portion of the heat-collecting structure is disposed outside the air duct. The heat-collecting structure is in contact with the heat-generating area of ​​the heat-generating device; or, the air duct assembly further includes a fourth heat-conducting component disposed between the heat-collecting structure and the heat-generating area of ​​the heat-generating device, and in contact with both. Understandably, the heat dissipated by the heat-generating area of ​​the heat-generating device can be conducted to the heat-collecting structure and then to the partition. This reduces the thermal resistance between the heat-generating area and the partition, enabling targeted heat dissipation of the heat-generating area and improving the heat dissipation performance of the air duct assembly. When the heat-collecting structure is in contact with the heat-generating area of ​​the heat-generating device, the heat dissipated by the heat-generating area can be conducted to the heat-collecting structure, eliminating the need for other components and simplifying the structure of the air duct assembly. When a fourth heat-conducting component is disposed between the heat-collecting structure and the heat-generating area of ​​the heat-generating device, the thermal resistance between the heat-collecting structure and the heat-generating area can be reduced, further improving the heat dissipation performance of the air duct assembly.

[0025] In some possible implementations, the heat extraction structure includes a first part and a second part, which are connected together. The first part is located outside the air duct and in contact with the heating area of ​​the heat-generating device, while the second part is located inside the air duct. The outlet of the thin-film fan faces the first part. Understandably, the first part's location outside the air duct and contact with the heating area allows heat dissipated from the heating area to be conducted to the first part and then to the second part. By placing the first part in contact with the heating area, no heat-conducting components are needed, simplifying the structure of the air duct assembly. The second part is located inside the air duct, and the outlet of the thin-film fan faces the second part, enabling the thin-film fan to drive gas to exchange heat with the second part, thereby providing targeted heat dissipation to the heating area and improving the heat dissipation performance of the air duct assembly.

[0026] In some possible implementations, the heat-collecting structure is positioned on one side of the heating element and in contact with the heating area; or, the heat-collecting structure surrounds at least a portion of the heating element and is in contact with the heating area. This configuration improves the flexibility of the heat-collecting structure's placement and meets different needs.

[0027] In some possible implementations, the mid-frame includes a border and a mid-plate, with the border surrounding and connected to the mid-plate. The terminal device also includes a rear shell and a camera assembly. The rear shell is located on one side of the border along the height direction of the mid-frame and is connected to the border. The camera module is disposed within a receiving compartment. The camera module includes a camera housing. A first vent is provided on the border, and at least one of a first air vent and a second air vent communicates with the first vent; and / or, a second vent is provided on the rear shell, and at least one of the first air vent and the second air vent communicates with the second vent; and / or, a third vent is provided on the camera housing of the camera module, and at least one of the first air vent and the second air vent communicates with the third vent. Understandably, by opening vents (including a first vent, a second vent, and a third vent), the first air outlet and the second air outlet can be connected to the outside through the vents, thereby enabling the thin-film fan to drive the air outside the terminal device into the air duct through the vents and the first air outlet, and / or enabling the fan to drive the air in the air duct to be discharged outside the terminal device through the second vent and the third air outlet, which is beneficial for heat dissipation of heat-generating devices.

[0028] In some possible implementations, the air duct assembly also includes a baffle plate that divides the air duct. Along the extension direction of the air duct, the air inlet and outlet of the thin-film fan are located on either side of the baffle plate. This arrangement allows the baffle plate to block airflow, reducing the risk of gas exiting the thin-film fan's outlet flowing back into its inlet, and allowing the gas to flow along the extension direction of the air duct under the drive of the thin-film fan, thus improving the heat dissipation performance of the air duct assembly.

[0029] In some possible implementations, the plane containing the air inlet of the thin-film fan intersects the plane containing the air outlet. This arrangement allows the airflow direction at the air inlet and the airflow direction at the air outlet to intersect, thus enabling the thin-film fan to be used in spaces with different layouts and improving its versatility.

[0030] On the other hand, embodiments of this application provide an air duct assembly. The air duct assembly includes a partition and a thin-film fan. The partition is disposed within a receiving compartment of a middle frame and is connected to the middle frame. The partition encloses an air outlet, a first air vent, and a second air vent, and the air duct connects the first air vent and the second air vent. The thin-film fan is disposed within the air duct and is connected to the partition. The air inlet of the thin-film fan communicates with the first air vent, and the air outlet of the thin-film fan communicates with the second air vent.

[0031] Understandably, the partition of the air duct assembly is located inside the receiving chamber, and the partition surrounds the air outlet duct. Compared with the middle frame directly surrounding the air outlet duct, the partition can isolate the functional components of the terminal equipment (such as the motherboard, sub-board, battery management board and battery, etc.) from the thin film fan, reducing the impact of impurities and water vapor in the gas on the functional components.

[0032] Furthermore, the production process of the middle frame is simplified as it does not require changes to the structure of the middle frame. The partitions can be placed in different positions within the storage compartment according to the arrangement of functional components, and the partitions forming air ducts of different shapes can be connected to the middle frame based on the arrangement of functional components within the storage compartment, thus improving the flexibility of air duct placement within the storage compartment.

[0033] Thin-film fans are housed within the air duct. Compared to fans that rely on impeller rotation for airflow (i.e., impeller fans), thin-film fans are smaller, allowing them to be placed closer to heat-generating components for localized heat extraction and improved heat dissipation of the air duct assembly. Furthermore, the flexible placement of thin-film fans enables a more compact structure for the air duct assembly, facilitating the miniaturization of terminal devices.

[0034] Furthermore, the thin-film fan has a higher exhaust pressure, a higher exhaust head (exhaust pressure), and a higher air velocity, thus improving the heat dissipation performance of the air duct assembly. In other words, by incorporating a thin-film fan into the air duct assembly, the terminal device can achieve both aesthetic appeal and effective heat dissipation.

[0035] In some possible implementations, the length direction of the middle frame intersects with the width direction of the middle frame. The plane containing the length and width directions of the middle frame is called the first plane. There are multiple heat-generating devices and multiple thin-film fans. The orthographic projection of any heat-generating device on the first plane is adjacent to the orthographic projection of at least one thin-film fan on the first plane. This arrangement achieves a distributed arrangement of thin-film fans, enabling them to dissipate heat for each heat-generating device and reducing the distance between the thin-film fans and the heat-generating devices, i.e., reducing the distance between the thin-film fans and the heat source. This allows for closer heat extraction, improving the heat dissipation effect of the thin-film fans on the heat-generating devices, thereby enhancing the heat dissipation capacity of the air duct assembly. Attached Figure Description

[0036] Figure 1 is a schematic diagram of the structure of a terminal device provided in some embodiments of this application;

[0037] Figure 2 is a schematic diagram of the structure of a terminal device provided in some other embodiments of this application;

[0038] Figure 3 is a cross-sectional view of the terminal device in Figure 1 along the A1-A1 direction in some embodiments;

[0039] Figure 4 is a cross-sectional view of the terminal device in Figure 1 along the A1-A1 direction in some other embodiments;

[0040] Figure 5 is a schematic diagram showing the positional relationship between the impeller fan and the heating element provided in some embodiments of this application;

[0041] Figure 6 is a cross-sectional view of the terminal device in Figure 1 along the A1-A1 direction in some other embodiments;

[0042] Figure 7 is a cross-sectional view of the terminal device in Figure 1 along the A1-A1 direction in some other embodiments;

[0043] Figure 8 is a schematic diagram of the characteristic curves of a thin-film fan and an impeller rotary fan provided in some embodiments of this application;

[0044] Figure 9 is a cross-sectional view of the terminal device in Figure 1 along the A1-A1 direction in some other embodiments;

[0045] Figure 10 is a cross-sectional view of the terminal device in Figure 1 along the A1-A1 direction in some other embodiments;

[0046] Figure 11 is a cross-sectional view of the terminal device in Figure 1 along the A1-A1 direction in some other embodiments;

[0047] Figure 12 is a cross-sectional view of the terminal device in Figure 1 along the A1-A1 direction in some other embodiments;

[0048] Figure 13 is a cross-sectional view of the terminal device in Figure 1 along the A1-A1 direction in some other embodiments;

[0049] Figure 14 is a schematic diagram showing the positional relationship between the thin-film fan and the heating device provided in some embodiments of this application;

[0050] Figure 15 is a schematic diagram showing the positional relationship between the heating device and the thin-film fan provided in some embodiments of this application;

[0051] Figure 16 is a schematic diagram showing the positional relationship between the heating device and the thin-film fan provided in some other embodiments of this application;

[0052] Figure 17 is a schematic diagram showing the positional relationship between the heating device and the thin-film fan provided in some embodiments of this application;

[0053] Figure 18 is a schematic diagram showing the positional relationship between the thin-film fan and the heating device provided in some other embodiments of this application;

[0054] Figure 19 is a cross-sectional view of the terminal device in Figure 1 along the A1-A1 direction in some other embodiments;

[0055] Figure 20 is a schematic diagram showing the positional relationship between the heating device and the heat extraction structure provided in some embodiments of this application;

[0056] Figure 21 is a schematic diagram showing the positional relationship between the heating device and the heat extraction structure provided in some other embodiments of this application;

[0057] Figure 22 is a schematic diagram showing the positional relationship between the heating device, the heat extraction structure, and the thin-film fan provided in some embodiments of this application;

[0058] Figure 23 is a schematic diagram showing the positional relationship between the heating device, the heat extraction structure, and the thin-film fan provided in some other embodiments of this application;

[0059] Figure 24 is a schematic diagram showing the positional relationship between the heating device, the heat extraction structure and the thin-film fan provided in some embodiments of this application;

[0060] Figure 25 is a cross-sectional view of the terminal device in Figure 1 along the A1-A1 direction in some other embodiments;

[0061] Figure 26 is a cross-sectional view of the terminal device in Figure 2 along the A2-A2 direction in some embodiments. Detailed Implementation

[0062] The technical solutions in some embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. All other embodiments obtained by those skilled in the art based on the embodiments provided in this application are within the protection scope of this application.

[0063] Unless the context otherwise requires, throughout the specification and claims, the term "comprising" is interpreted as open-ended and encompassing, meaning "including, but not limited to." In the description of the specification, terms such as "one embodiment," "some embodiments," "exemplary embodiment," "example," "specific example," or "some examples" are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of this application. The illustrative representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific feature, structure, material, or characteristic may be included in any suitable manner in any one or more embodiments or examples.

[0064] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this application, unless otherwise stated, "a plurality of" means two or more.

[0065] "At least one of A, B and C" has the same meaning as "at least one of A, B or C", both including the following combinations of A, B and C: only A, only B, only C, combinations of A and B, combinations of A and C, combinations of B and C, and combinations of A, B and C.

[0066] As used herein, “about,” “approximately,” or “approximately” includes the stated value and the average value within an acceptable range of deviation from the given value, wherein the acceptable range of deviation is determined by a person skilled in the art taking into account the measurement under discussion and the error associated with the measurement of the given quantity (i.e., the limitations of the measurement system).

[0067] Figure 1 is a schematic diagram of the structure of a terminal device provided in some embodiments of this application. Figure 2 is a schematic diagram of the structure of a terminal device provided in other embodiments of this application. As shown in Figures 1 and 2, embodiments of this application provide a terminal device 200. For example, the terminal device 200 can be a mobile phone, tablet computer, personal computer (PC), smart wearable device (e.g., smartwatch, smart bracelet), virtual reality (VR) device, augmented reality (AR) device, etc. Embodiments of this application do not further limit the type of terminal device 200. The following example uses a mobile phone or tablet as the terminal device 200 for further illustration.

[0068] Figure 3 is a cross-sectional view of the terminal device in Figure 1 along the A1-A1 direction in some embodiments. Figure 4 is a cross-sectional view of the terminal device in Figure 1 along the A1-A1 direction in other embodiments. For example, as shown in Figures 1 and 2, the terminal device 200 may include a middle frame 210, as shown in Figures 3 and 4, the middle frame 210 having a receiving compartment 210a.

[0069] The middle frame 210 serves as the skeleton of the terminal device 200, providing load-bearing and support. The middle frame 210 can be made of metal to improve its mechanical strength. The receiving compartment 210a is used to house the functional components of the terminal device 200, such as the motherboard, sub-board, battery management board, and battery. Understandably, to simplify the accompanying drawings, the functional components housed within the receiving compartment 210a are not shown in Figures 3 and 4, which serve as examples.

[0070] The main board, sub-board, and battery management board can be at least one of a printed circuit board (PCB), a flexible printed circuit board (FPC), and a flexible printed circuit board (FPCB). The battery can be a lithium battery. The battery management board is electrically connected to the battery.

[0071] The number of receiving compartments 210a can be multiple. For example, there can be three receiving compartments 210a, with the main board, sub-board, and battery management board respectively housed in three different receiving compartments 210a, and the battery and battery management board housed in the same receiving compartment 210a. The embodiments of this application do not further limit the specific form, quantity, or placement of the functional devices within the receiving compartments 210a.

[0072] Referring again to Figures 3 and 4, the middle frame 210 includes a side frame 2101 and a middle plate 2102. The side frame 2101 surrounds and is connected to the middle plate 2102. The side frame 2101 and the middle plate 2102 can be integrally formed to improve the reliability of their connection. Understandably, the side frame 2101 and the middle plate 2102 can enclose the receiving compartment 210a.

[0073] The terminal device 200 may also include a rear cover 206 and a display screen 205. In some examples, the rear cover 206 and the mid-frame 210 may be collectively referred to as the housing of the terminal device 200.

[0074] The rear cover 206 is located on one side of the middle frame 210 along the height direction Z and is connected to the middle frame 210. The display screen 205 is located on the other side of the middle frame 210 along the height direction Z and is connected to the middle frame 210. That is, along the height direction Z of the middle frame 210, the rear cover 206 and the display screen 205 are located on both sides of the middle frame 210.

[0075] In this design, the length direction Y of the middle frame 210 intersects with the width direction X of the middle frame 210, and the height direction Z of the middle frame 210 intersects with the plane containing the length direction Y and the width direction X of the middle frame 210. For example, the length direction Y and the width direction X of the middle frame 210 are perpendicular or approximately perpendicular, and the height direction Z of the middle frame 210 is perpendicular or approximately perpendicular to the plane containing the length direction Y and the width direction X of the middle frame 210.

[0076] Understandably, the openings of the multiple receiving compartments 210a may face the same or different directions. For example, the openings of the multiple receiving compartments 210a may all face the rear shell 206, or the openings of the multiple receiving compartments 210a may all face the display screen 205, or, among the multiple receiving compartments 210a, some (one, two or more) of the receiving compartments 210a may have their openings facing the display screen 205, while the openings of other (one, two or more) of the receiving compartments 210a may face the rear shell 206.

[0077] For example, the back cover 206 can be connected to the middle frame 210 by snap-fit ​​or adhesive. With the opening of the receiving compartment 210a facing the back cover 206, as shown in Figures 3 and 4, the back cover 206 can be connected to the frame 2101 to close the opening of the receiving compartment 210a. With the opening of the receiving compartment 210a facing away from the back cover 206 (facing the display screen 205), the back cover 206 can be connected to at least one of the frame 2101 and the middle plate 2102.

[0078] The display screen 205 can be a liquid crystal display (LCD), an organic light-emitting diode (OLED) display, an active matrix organic light-emitting diode (AMOLED) display, a flexible light-emitting diode (FLED) display, a sub-millimeter light-emitting diode (Mini LED) display, a micro light-emitting diode (Micro LED) display, a quantum dot light-emitting diode (QLED) display, etc. The embodiments of this application do not further limit the specific form of the display screen 205.

[0079] For example, the display screen 205 can be connected to the mid-frame 210 by snap-fit ​​or adhesive. With the opening of the receiving compartment 210a facing the display screen 205, the display screen 205 can be connected to the frame 2101 to close the opening of the receiving compartment 210a. With the opening of the receiving compartment 210a facing away from the display screen 205 (towards the rear housing 206), as shown in Figures 3 and 4, the display screen 205 can be connected to at least one of the frame 2101 and the mid-frame 2102.

[0080] Understandably, the way the back cover 206 and the display screen 205 are connected to the mid-frame 210 can be the same or different.

[0081] In some examples, as shown in Figure 2, the terminal device 200 also includes a camera module 207, which is at least partially disposed within the receiving compartment 210a. The camera module 207 includes a camera housing (deco) 2071.

[0082] Understandably, the camera module 207 can perform functions such as taking photos, recording videos, and image information recognition. The camera housing 2071 is located within the first through-hole in the rear housing 206 and is connected to the rear housing 206. The camera module 207 may include a lens assembly and a motor (not shown in the figure), which are disposed within the camera housing 2071, thus protecting the lens assembly and motor. The motor can drive the lens assembly to move for focusing.

[0083] Referring again to Figures 3 and 4, in some examples, the terminal device 200 may further include a heat-generating device 208. The heat-generating device 208 may be at least one of a central processing unit (CPU), a graphics processing unit (GPU), a system-on-chip (SOC), a charge integrated circuit (charge IC), or a radio frequency (RF) chip; alternatively, the heat-generating device 208 may also be a capacitor, a resistor, or a switching transistor. The embodiments of this application do not further limit the specific form of the heat-generating device 208. The heat-generating device 208 may be disposed on the motherboard, a sub-board, or a battery management board.

[0084] In some examples, as shown in Figures 3 and 4, the opening of at least one receiving compartment 210a faces the rear housing 206. For example, a second through-hole is provided on the middle plate 2102, and the heating element 208 is embedded in the second through-hole. In this case, as shown in Figure 3, the heating element 208 can be exposed on the surface of the middle plate 2102 near the display screen 205. Alternatively, as shown in Figure 4, the middle plate 2102 may not have a through-hole, in which case the heating element 208 is disposed within the receiving compartment 210a.

[0085] A heat dissipation component 209 may be provided between the middle plate 2102 and the display screen 205. For example, the heat dissipation component 209 may be a vacuum chamber (VC) or other heat-conducting device. The heat dissipated by the heat-generating device 208 is conducted through the heat dissipation component 209 to the outer casing (including the middle frame 210 and the rear shell 206) and the display screen 205 of the terminal device 200, and is then dissipated to the outside through the outer casing and the display screen 205. In some examples, the above heat dissipation method may be referred to as passive heat dissipation.

[0086] Considering user touch comfort, the temperature of components such as the casing and display screen 205 of the terminal device 200 is typically limited. Furthermore, the size of the terminal device 200 is also usually limited. Due to these limitations, such as user touch comfort and the size of the terminal device 200, the heat dissipation of the heat-generating device 208 in a passively cooled terminal device 200 is limited to a certain range, thus limiting the overall power consumption of the terminal device 200 to a certain value.

[0087] In recent years, with the continuous development of terminal chip technology, large-scale games and 5G technology, the power consumption of terminal devices has been increasing, and passive heat dissipation can no longer meet the design requirements.

[0088] Figure 5 is a schematic diagram showing the positional relationship between the impeller fan and the heat-generating device provided in some embodiments of this application. In some possible cases, as shown in Figure 5, the terminal device 200 may include an impeller fan 301, which is disposed in the receiving chamber 210a and drives the gas flow in the receiving chamber 210a to achieve active heat dissipation for the heat-generating device 208.

[0089] However, the impeller fan 301 is relatively large, occupying a significant amount of space within the terminal device 200, which affects the structural compactness of the terminal device 200 and hinders its miniaturization. Furthermore, with multiple heat-generating devices 208, the large size of the impeller fan 301 limits the space between the various heat-generating devices 208, forcing the impeller fan 301 to be positioned close to only one of them, thus affecting the heat dissipation of the other devices. In addition, the impeller fan 301 has a relatively small airflow and low outlet pressure, further impacting its cooling performance.

[0090] Based on this, embodiments of this application provide a terminal device 200. The terminal device 200 can draw in gas (e.g., air or other mixed gas) from the environment, and after exchanging heat with the heat-generating device 208 within the terminal device 200, the gas can be discharged from the terminal device 200, thereby achieving active heat dissipation of the terminal device 200 and meeting the power consumption requirements of the terminal device 200.

[0091] Figure 6 is a cross-sectional view of the terminal device in Figure 1 along the A1-A1 direction in some embodiments. Figure 7 is a cross-sectional view of the terminal device in Figure 1 along the A1-A1 direction in some embodiments. In some embodiments of this application, as shown in Figures 6 and 7, the terminal device 200 includes a middle frame 210 and an air duct assembly 100. It is understood that the middle frame 210 has been described by example in the above embodiments of this application, and will not be repeated here. The air duct assembly 100 will be described by example below.

[0092] Referring again to Figures 6 and 7, the air duct assembly 100 includes a partition 101 and a thin-film fan 102. The partition 101 is disposed within the receiving chamber 210a and connected to the middle frame 210. For example, the partition 101 may be connected to at least one of the middle plate 2102 and the frame 2101. The partition 101 encloses an air duct 1013, a first air vent 1011, and a second air vent 1012, with the air duct 1013 connecting the first air vent 1011 and the second air vent 1012. This allows gas to flow into the air duct 1013 via one of the first air vent 1011 and the second air vent 1012, and out of the air duct 1013 via the other of the first air vent 1011 and the second air vent 1012.

[0093] Understandably, there can be one or more first air vents 1011. Each first air vent 1011 can be circular, rectangular, polygonal, or other shapes. When there are multiple first air vents 1011, their shapes can be the same or different. Similarly, there can be one or more second air vents 1012. Each second air vent 1012 can be circular, rectangular, polygonal, or other shapes. When there are multiple second air vents 1012, their shapes can be the same or different. The shape and number of the first air vents 1011 can be the same as or different from the shape and number of the second air vents 1012.

[0094] The thin-film fan 102 is disposed within the air duct 1013 and connected to the partition 101. For example, the thin-film fan 102 can be detachably connected to the partition 101 by means of bolts or snap-fit, thereby improving the positional flexibility of the thin-film fan 102.

[0095] The inlet 1021 of the thin-film fan 102 is connected to the first air outlet 1011, and the outlet 1022 of the thin-film fan 102 is connected to the second air outlet 1012. Thus, as shown by the dashed arrow in Figure 6, the thin-film fan 102 can drive gas (e.g., air from outside the terminal device 200 or other inert gas mixtures) into the air duct 1013 through the first air outlet 1011, and the thin-film fan 102 can drive gas out of the air duct 1013 through the second air outlet 1012.

[0096] Understandably, the thin-film fan 102 includes a thin film. When the thin-film fan 102 is energized, the thin film deforms, thereby vibrating to drive gas flow. In some examples, the thin film can deform under the inverse piezoelectric effect, in which case the thin-film fan 102 can be a piezoelectric fan. In other examples, the thin film can also deform under the effect of electromagnetic effects. The embodiments of this application do not further limit the specific structure and type of the thin-film fan 102.

[0097] For example, as shown in Figures 6 and 7, the air inlet 1021 of the thin film fan 102 can be set close to the first air outlet 1011, and the air outlet 1022 of the thin film fan 102 can be set close to the second air outlet 1012, so that the thin film fan 102 can drive the gas to flow into the air duct 1013 through the first air outlet 1011 and flow out of the air duct 1013 through the second air outlet 1012.

[0098] In some examples, as shown in Figures 6 and 7, the plane containing the air inlet 1021 of the thin-film fan 102 intersects the plane containing the air outlet 1022 of the thin-film fan 102. For example, the plane containing the air inlet 1021 of the thin-film fan 102 and the plane containing the air outlet 1022 of the thin-film fan 102 may be perpendicular or approximately perpendicular.

[0099] The plane where the air inlet 1021 of the thin film fan 102 is located intersects the plane where the air outlet 1022 of the thin film fan 102 is located. That is, the air flow direction of the air inlet 1021 of the thin film fan 102 intersects with the air flow direction of the air outlet 1022 of the thin film fan 102, so that the thin film fan 102 can be used in spaces with different layouts, thereby improving the applicability of the thin film fan 102.

[0100] In other examples, the plane containing the air inlet 1021 of the thin-film fan 102 is parallel or approximately parallel to the plane containing the air outlet 1022 of the thin-film fan 102.

[0101] As shown in Figure 6, the heating element 208 is disposed outside the air duct 1013 and adjacent to the partition 101. Alternatively, as shown in Figure 7, the heating element 208 is disposed inside the air duct 1013.

[0102] For example, as shown in FIG6, when the heating element 208 is embedded in the second through hole opened on the middle plate 2102, the heating element 208 can be located outside the air duct 1013 and adjacent to the partition 101. It is understood that in the embodiments of this application, the adjacent arrangement of one component (e.g., the heating element 208) and another component (e.g., the partition 101) should be understood as one component being close to another component.

[0103] When the heating element 208 is located outside the air duct 1013, the partition 101 may include a material with a high thermal conductivity. The heating element 208 is disposed adjacent to the partition 101, thereby enabling heat to be conducted to the partition 101. The thin-film fan 102 drives the gas into the air duct 1013 through the first air outlet 1011 and out of the air duct 1013 through the second air outlet 1012. The gas in the air duct 1013 can exchange heat with the partition 101, thereby enabling active heat dissipation of the heating element 208 disposed adjacent to the partition 101, increasing the heat dissipation of the heating element 208, and meeting the power consumption requirements of the terminal device 200.

[0104] As shown in Figure 7, for example, the heating element 208 is disposed within the air duct 1013, and the partition 101 is disposed within the receiving chamber 210a, allowing the heating element 208 to be located within the receiving chamber 210a. The thin-film fan 102 drives gas into the air duct 1013 via the first air outlet 1011 and out of the air duct 1013 via the second air outlet 1012. The gas within the air duct 1013 can exchange heat with the heating element 208 disposed within the air duct 1013, thereby actively dissipating heat from the heating element 208 within the air duct 1013, increasing the heat dissipation of the heating element 208, and meeting the power consumption requirements of the terminal device 200.

[0105] Understandably, placing the heating element 208 outside the air duct 1013 allows the partition 101 to isolate the heating element 208 from the thin-film fan 102, reducing the impact of impurities and water vapor in the gas on the heating element 208. Placing the heating element 208 outside the air duct 1013 improves the heat exchange effect with other components, thereby enhancing the heat dissipation performance of the air duct assembly 100. Whether the heating element 208 is located inside or outside the air duct 1013, the placement flexibility of the heating element 208 is improved.

[0106] Figure 8 is a schematic diagram of the characteristic curves of a thin-film fan and an impeller rotary fan provided in some embodiments of this application. Referring to Figure 8, the horizontal axis Q represents the airflow of the fan, and the vertical axis P represents the static pressure of the fan. Line 1 represents the PQ curve of the thin-film fan 102, and line 2 represents the PQ curve of the impeller rotary fan. Curve 1 represents the flow resistance of a small-space air duct, and curve 2 represents the flow resistance of a large-space air duct.

[0107] From the intersection points M1 and M2 of line 1 and curve 1, it can be seen that the airflow of the thin-film fan 102 in a small space and the airflow of the thin-film fan 102 in a large space change very little. From the intersection points N1 and N2 of line 2 and curve 1, it can be seen that the airflow of the impeller fan in a small space is much smaller than the airflow of the impeller fan in a large space.

[0108] As can be seen from the intersection point M1 of curve 1 and line 1 and the intersection point N1 of curve 1 and line 2, in the same small space, the static pressure of the thin film fan 102 is greater than that of the impeller fan, and the air volume of the thin film fan 102 is greater than that of the impeller fan.

[0109] In other words, compared to impeller fans, thin-film fans 102 have a larger air volume and higher static pressure in small spaces, making them more suitable for small spaces. In addition, the volume of thin-film fans 102 is generally smaller than that of impeller fans, making them suitable for small spaces and increasing the flexibility of the placement of thin-film fans 102. This allows for a more compact structure of the air duct assembly 100, which is beneficial for the miniaturization of the terminal equipment 200.

[0110] The embodiments of this application configure the terminal device 200 to include a duct assembly 100. The thin-film fan 102 of the duct assembly 100 drives gas to flow through the duct 1013, thereby realizing active heat dissipation of the terminal device 200, improving the heat dissipation of the terminal device 200, and meeting the power consumption requirements of the terminal device 200.

[0111] The partition 101 of the air duct assembly 100 is disposed within the receiving chamber 210a, and the partition 101 surrounds the air outlet 1013. Compared with the middle frame 210 directly surrounding the air outlet 1013, the partition 101 can isolate the functional components of the terminal device 200 (such as the motherboard, sub-board, battery management board and battery, etc.) from the thin film fan 102, reducing the impact of impurities and water vapor in the gas on the functional components.

[0112] Furthermore, the structure of the middle frame 210 does not need to be changed, simplifying the production process of the middle frame 210. Moreover, the partition 101 can be placed at different positions in the receiving chamber 210a according to the arrangement of functional components within the receiving chamber 210a. Additionally, the partition 101, which forms air ducts 1013 of different shapes, can be connected to the middle frame 210 according to the arrangement of functional components within the receiving chamber 210a, improving the flexibility of the air ducts 1013 within the receiving chamber 210a.

[0113] The heating element 208 is disposed outside the air duct 1013 and adjacent to the partition 101, or the heating element 208 is disposed inside the air duct 1013, so that the gas flowing inside the air duct 1013 can dissipate heat from the heating element 208, thereby realizing active heat dissipation of the heating element 208, increasing the heat dissipation of the heating element 208, and meeting the power consumption requirements of the terminal device 200.

[0114] Understandably, when the heating element 208 is located outside the air duct 1013, the partition 101 can isolate the thin-film fan 102 and the heating element 208, reducing the impact of impurities and water vapor in the gas on the heating element 208. When the heating element 208 is located inside the air duct 1013, the gas inside the air duct 1013 can directly exchange heat with the heating element 208, improving the heat dissipation effect. Placing the heating element 208 outside or inside the air duct 1013 increases the flexibility in its placement.

[0115] Compared to a fan that uses a rotating impeller to expel air (i.e., impeller fan 301), the thin-film fan 102 is smaller, allowing it to be positioned closer to the heat-generating device 208, thus achieving localized heat extraction and improving the heat dissipation effect of the air duct assembly 100. Furthermore, the flexible placement of the thin-film fan 102 allows for a more compact structure of the air duct assembly 100, facilitating the miniaturization of the terminal device 200.

[0116] Furthermore, the thin-film fan 102 has a higher exhaust pressure, a higher exhaust head (exhaust pressure), and a higher air velocity, which improves the heat dissipation performance of the air duct assembly 100. In other words, by including the thin-film fan 102 in the air duct assembly 100, the terminal device 200 can balance aesthetics and heat dissipation capabilities.

[0117] Figure 9 is a cross-sectional view of the terminal device in Figure 1 along the A1-A1 direction in some embodiments. In some examples, the heating element 208 is disposed outside the air duct 1013. As shown in Figure 6, the heating element 208 is in contact with the partition 101. Alternatively, as shown in Figure 9, the air duct assembly 100 further includes a first heat-conducting component 1001, which is disposed between the heating element 208 and the partition 101 and is in contact with both the heating element 208 and the partition 101.

[0118] Understandably, placing the heating element 208 outside the air duct 1013 allows the separator 101 to separate the thin-film fan 102 and the heating element 208, reducing the impact of impurities and water vapor in the gas on the heating element 208. The heating element 208 contacts the separator 101, allowing the heat emitted by the heating element 208 to be conducted to the separator 101 and dissipated outwards via the gas flowing within the air duct 1013. Alternatively, providing a first heat-conducting component 1001 between the heating element 208 and the separator 101 can reduce the thermal resistance between them, improving the heat dissipation effect of the air duct assembly 100 on the heating element 208.

[0119] For example, the first heat-conducting component 1001 can be a vacuum heat exchanger, or it can be other heat-conducting devices. As shown in FIG9, the first heat-conducting component 1001 can be embedded in the second through hole opened on the middle plate 2102, or the first heat-conducting component 1001 can be disposed between the middle plate 2102 and the partition 101.

[0120] Figure 10 is a cross-sectional view of the terminal device in Figure 1 along the A1-A1 direction in some other embodiments. Figure 11 is a cross-sectional view of the terminal device in Figure 1 along the A1-A1 direction in some other embodiments.

[0121] In some examples, as shown in Figures 10 and 11, the air duct assembly 100 further includes heat dissipation fins 103 disposed within the air duct 1013 and connected to the partition 101. The partition 101 includes a base plate 104 and a side wall 105, with the base plate 104 connected to the side wall 105. In the height direction Z of the middle frame 210, the heat dissipation fins 103 and the heat-generating device 208 are located on both sides of the base plate 104.

[0122] For example, the base plate 104 and side wall 105 of the partition 101 can be integrally formed to improve the reliability of their connection. The heat dissipation fins 103 can be connected to the base plate 104. In the height direction Z of the middle frame 210, the heat dissipation fins 103 and the heat-generating device 208 are located on both sides of the base plate 104, so that the heat dissipated by the heat-generating device 208 can be conducted to the heat dissipation fins 103 through the base plate 104. The heat dissipation fins 103 have a large contact area with the gas in the air duct 1013, thereby increasing the heat dissipation, which is beneficial to the heat dissipation of the heat-generating device 208 and improves the heat dissipation performance of the air duct assembly 100.

[0123] In some examples, as shown in FIG10, the heat dissipation fins 103 are in contact with the base plate 104, allowing heat from the heat-generating device 208 to be conducted to the heat dissipation fins 103 through the base plate 104. In other examples, as shown in FIG11, the air duct assembly 100 further includes a second heat-conducting component 1002, which is located between the heat dissipation fins 103 and the base plate 104 and is in contact with both the heat dissipation fins 103 and the base plate 104.

[0124] The second heat-conducting component 1002 is disposed between the heat dissipation fins 103 and the base plate 104, which can reduce the thermal resistance between the heat dissipation fins 103 and the base plate 104 and improve the heat dissipation effect of the air duct assembly 100 on the heat-generating device 208.

[0125] For example, the second heat-conducting component 1002 can be a vacuum heat spreader, or the second heat-conducting component 1002 can be other heat-conducting devices.

[0126] Figure 12 is a cross-sectional view of the terminal device in Figure 1 along the A1-A1 direction in some other embodiments. Figure 13 is a cross-sectional view of the terminal device in Figure 1 along the A1-A1 direction in some other embodiments.

[0127] As described above, in some examples, the heating element 208 is in contact with the partition 101 or the first heat-conducting component 1001. In other examples, as shown in Figures 12 and 13, at least a portion of the heat dissipation fins 103 is disposed within the air duct 1013 and connected to the partition 101. A receiving hole is provided on the base plate 104. At least a portion of the heating element 208 and the heat dissipation fins 103 is disposed within the receiving hole.

[0128] For example, the heat dissipation fins 103 can be partially disposed inside the receiving hole, while the heating element 208 can be disposed outside the receiving hole. Alternatively, the heat dissipation fins 103 can be disposed outside the receiving hole, while the heating element 208 can be partially disposed inside the receiving hole. Or, both the heat dissipation fins 103 and the heating element 208 can be partially disposed inside the receiving hole.

[0129] Understandably, when part of the heat dissipation fin 103 is disposed within the receiving hole, another part of the heat dissipation fin 103 is located within the air duct 1013. When the heat dissipation fin 103 is disposed outside the receiving hole, the entire heat dissipation fin 103 is disposed within the air duct 1013.

[0130] As shown in Figure 12, the heat-generating device 208 is in contact with the heat dissipation fins 103; or, as shown in Figure 13, the air duct assembly 100 further includes a third heat-conducting component 1003, which is disposed between the heat dissipation fins 103 and the heat-generating device 208 and is in contact with the heat dissipation fins 103 and the heat-generating device 208.

[0131] Understandably, the contact area between the heat sink fins 103 and the gas inside the air duct 1013 is relatively large. Heat exchange between the heat-generating device 208 and the heat sink fins 103 increases the heat dissipation of the heat-generating device 208, thus facilitating heat dissipation. Providing contact between the heat sink fins 103 and the heat-generating device 208 shortens the heat transfer path, increases heat dissipation, and improves the heat dissipation performance of the air duct assembly 100.

[0132] Alternatively, the third heat-conducting component 1003 is disposed between the heat dissipation fins 103 and the heat-generating device 208, and is in contact with the heat dissipation fins 103 and the heat-generating device 208, thereby reducing the thermal resistance between the heat-generating device 208 and the heat dissipation fins 103 and improving the heat dissipation performance of the air duct assembly 100.

[0133] For example, the third heat-conducting component 1003 can be a vacuum heat spreader, or the third heat-conducting component 1003 can be other heat-conducting devices.

[0134] In some examples, as shown in Figures 12 and 13, the air duct assembly 100 also includes a baffle plate 107 that divides the air duct 1013. Along the extension direction of the air duct 1013, the air inlet 1021 and the air outlet 1022 of the thin-film fan 102 are located on both sides of the baffle plate 107.

[0135] The baffle 107 can be connected to at least one of the thin-film fan 102 and the rear housing 206, so that the baffle 107 can separate the air duct 1013. Understandably, the baffle 107 can block the airflow, reduce the risk of gas flowing out of the outlet 1022 of the thin-film fan 102 flowing back to the inlet 1021 of the thin-film fan 102, and allow the gas to flow along the extension direction of the air duct 1013 under the drive of the thin-film fan 102, thereby improving the heat dissipation performance of the air duct assembly 100.

[0136] Figure 14 is a schematic diagram showing the positional relationship between the thin-film fan and the heating element provided in some embodiments of this application. In some examples, as shown in Figure 14, there are multiple heating elements 208, which can be spaced apart. For example, the multiple heating elements 208 can be arranged in an array along the length direction Y and the width direction X of the middle frame 210. Alternatively, the multiple heating elements 208 can also be arranged regularly or irregularly in other ways.

[0137] Multiple heating elements 208 can be disposed outside the air duct 1013, or they can all be disposed inside the air duct 1013. Alternatively, some (one, two, or more) of the multiple heating elements 208 can be disposed inside the air duct 1013, while others (one, two, or more) can be disposed outside the air duct 1013. The types of the multiple heating elements 208 can be the same or different. The embodiments of this application do not further limit the number, type, or placement of the heating elements 208.

[0138] Figure 15 is a schematic diagram showing the positional relationship between the heating element and the thin-film fan provided in some embodiments of this application. Figure 16 is a schematic diagram showing the positional relationship between the heating element and the thin-film fan provided in other embodiments of this application. Figure 17 is a schematic diagram showing the positional relationship between the heating element and the thin-film fan provided in yet another embodiment of this application.

[0139] In some examples, as shown in Figures 14, 15, 16, and 17, there are multiple thin-film fans 102. Understandably, the dimensions of the multiple thin-film fans 102 can be the same or different. As shown in Figures 14 and 15, the plane containing the length direction Y and width direction X of the middle frame 210 is a first plane, and the orthographic projection of any heating device 208 onto the first plane is adjacent to the orthographic projection of at least one thin-film fan 102 onto the first plane.

[0140] Understandably, the orthographic projection of any heating element 208 on the first plane is adjacent to the orthographic projection of at least one thin-film fan 102 on the first plane; that is, the orthographic projection of any heating element 208 on the first plane is close to the orthographic projection of at least one thin-film fan 102 on the first plane. The orthographic projections of any heating element 208 on the first plane and the orthographic projections of at least one thin-film fan 102 on the first plane can be spaced apart or partially overlap.

[0141] When the heating element 208 is located outside the air duct 1013, the thin-film fan 102 and the heating element 208 are offset from each other in the height direction Z of the middle frame 210. When the heating element 208 is located inside the air duct 1013, the thin-film fan 102 and the heating element 208 are at least partially opposite each other in the height direction Z of the middle frame 210.

[0142] For example, the number of thin-film fans 102 is greater than or equal to the number of heating devices 208, such that the orthographic projection of any heating device 208 on the first plane can be arranged adjacent to the orthographic projection of at least one thin-film fan 102 on the first plane.

[0143] Understandably, the orthographic projection of any heat-generating device 208 on the first plane is adjacent to the orthographic projection of at least one thin-film fan 102 on the first plane, thereby realizing the distributed arrangement of the thin-film fans 102. This allows the thin-film fans 102 to dissipate heat for each heat-generating device 208 and reduces the distance between the thin-film fans 102 and the heat-generating device 208, which also reduces the distance between the thin-film fans 102 and the heat source. This enables heat to be drawn from nearby sources, improves the heat dissipation effect of the thin-film fans 102 on the heat-generating device 208, and thus improves the heat dissipation capacity of the air duct assembly 100.

[0144] In some examples, as shown in Figures 16 and 17, the orthographic projection of any one heating device 208 on the first plane is arranged adjacent to the orthographic projections of at least two thin-film fans 102 on the first plane.

[0145] Understandably, the number of thin-film fans 102 is greater than the number of heating devices 208, such that the orthographic projection of any heating device 208 on the first plane can be arranged adjacent to the orthographic projections of at least two thin-film fans 102 on the first plane.

[0146] The orthographic projection of any heating element 208 on the first plane is adjacent to the orthographic projections of at least two thin-film fans 102 on the first plane; that is, the orthographic projection of any heating element 208 on the first plane is close to the orthographic projections of at least two thin-film fans 102 on the first plane. The orthographic projections of any heating element 208 on the first plane and the orthographic projections of at least two thin-film fans 102 on the first plane can be spaced apart or partially overlap.

[0147] For example, the orthographic projection of a heating element 208 on the first plane can be arranged adjacent to the orthographic projections of two, three, or more thin-film fans 102 on the first plane. Embodiments of this application do not further limit the number of thin-film fans 102 arranged adjacent to a heating element 208.

[0148] The orthographic projection of any heat-generating device 208 on the first plane is adjacent to the orthographic projection of at least two thin-film fans 102 on the first plane, thereby realizing the distributed arrangement of the thin-film fans 102 and enabling at least two thin-film fans 102 to be placed close to the same heat-generating device 208, thus improving the heat dissipation of the heat-generating device 208.

[0149] Understandably, at least two thin-film fans 102 arranged adjacent to the same heating device 208 may have the same size, volume, and shape, or they may be different. The embodiments of this application do not further limit the number or size of the thin-film fans 102 arranged adjacent to the same heating device 208.

[0150] For ease of description, the heating element 208 and the thin film fan 102 are arranged adjacent to each other on the first plane. This is described as the heating element 208 and the thin film fan 102 being arranged adjacent to each other.

[0151] Understandably, the number of thin-film fans 102 arranged adjacent to different heating devices 208 can be the same or different. For example, one of the multiple heating devices 208 can be arranged adjacent to one thin-film fan 102, and another heating device 208 can be arranged adjacent to two, three or more thin-film fans 102.

[0152] In some examples, the heating device 208 includes a first heating device and a second heating device. There can be one or more first heating devices, and there can also be one or more second heating devices. The number of first heating devices may be equal to or unequal to the number of second heating devices.

[0153] The orthographic projection of the first heating element on the first plane is adjacent to the orthographic projections of the n thin-film fans 102 on the first plane. The orthographic projection of the second heating element on the first plane is adjacent to the orthographic projections of the m thin-film fans 102 on the first plane. Here, m and n are both positive integers. m and n are not equal; or m and n are equal.

[0154] Understandably, m can take values ​​of 1, 2, 3, or 4, etc., and n can take values ​​of 1, 2, 3, or 4, etc. When m and n are not equal, the number of thin-film fans 102 adjacent to the first heat-generating device is not equal to the number of thin-film fans 102 adjacent to the second heat-generating device. In other words, the number of thin-film fans 102 dissipating heat for the first heat-generating device is not equal to the number of thin-film fans 102 dissipating heat for the second heat-generating device.

[0155] This arrangement improves the flexibility of the distributed arrangement of the thin-film fans 102. For example, the number of thin-film fans 102 arranged adjacent to the heat-generating device 208 can be set according to the heat dissipation of the heat-generating device 208 to meet the heat dissipation requirements of different heat-generating devices 208.

[0156] When m and n are equal, the number of thin-film fans 102 arranged adjacent to the first heat-generating device is equal to the number of thin-film fans 102 arranged adjacent to the second heat-generating device. In other words, the number of thin-film fans 102 for cooling the first heat-generating device is equal to the number of thin-film fans 102 for cooling the second heat-generating device.

[0157] This configuration improves the regularity of the distribution of the thin-film fan 102.

[0158] For example, the thin-film fan 102 can be disposed adjacent to the heating device 208 along the width direction X of the middle frame 210, or the thin-film fan 102 can be disposed adjacent to the heating device 208 along the length direction Y of the middle frame 210, or the thin-film fan 102 can be disposed adjacent to the heating device 208 along other directions on the first plane other than the length direction Y and the width direction X of the middle frame 210. The embodiments of this application do not further limit the placement of the thin-film fan 102 and the heating device 208.

[0159] When at least two thin-film fans 102 are arranged adjacent to the heating device 208, the at least two thin-film fans 102 can be located on the same side of the heating device 208, or the at least two thin-film fans 102 can be located on different sides of the heating device 208. For example, multiple thin-film fans 102 can be arranged around the heating device 208.

[0160] When at least two thin-film fans 102 are arranged adjacent to the heat-generating device 208, the at least two thin-film fans 102 can dissipate heat for the same heat-generating device 208, thereby increasing the heat dissipation of the heat-generating device 208. In addition, the number of thin-film fans 102 adjacent to the heat-generating device 208 can be set according to the heat output of the heat-generating device 208 to meet the heat dissipation requirements of different heat-generating devices 208.

[0161] In some examples, as shown in Figure 14, at least two thin-film fans 102 drive gas into the duct 1013 via the same first vent 1011; and / or, at least two thin-film fans 102 drive gas out of the duct 1013 via the same second vent 1012.

[0162] Understandably, the number of first air vents 1011 and the number of second air vents 1012 can be equal or unequal. When the number of first air vents 1011 is less than the number of thin-film fans 102, at least two thin-film fans 102 need to share one first air vent 1011, meaning that at least two thin-film fans 102 drive the gas into the air duct 1013 through one first air vent 1011. When the number of second air vents 1012 is less than the number of thin-film fans 102, at least two thin-film fans 102 need to share one second air vent 1012, meaning that at least two thin-film fans 102 drive the gas out of the air duct 1013 through one second air vent 1012.

[0163] Taking a case where there is one first air vent 1011 and one second air vent 1012, the number of both the first air vent 1011 and the second air vent 1012 is less than the number of thin-film fans 102. As shown by the dashed arrow in Figure 14, the gas driven by the multiple thin-film fans 102 flows into the air duct 1013 through one first air vent 1011, and the gas driven by the multiple thin-film fans 102 flows out of the air duct 1013 through one second air vent 1012.

[0164] When there is only one first air vent 1011 and one second air vent 1012, the first air vent 1011 and the second air vent 1012 can be arranged opposite each other along the width direction X (or the length direction Y) of the middle frame 210, or the first air vent 1011 and the second air vent 1012 can be staggered. Similarly, the first air vent 1011 and the second air vent 1012 can be arranged opposite each other along the height direction X of the middle frame 210, or the first air vent 1011 and the second air vent 1012 can be staggered.

[0165] Understandably, by setting at least two thin-film fans 102 to drive gas into the air duct 1013 through the same first air inlet 1011; and / or by setting at least two thin-film fans 102 to drive gas out of the air duct 1013 through the same second air inlet 1012, the number of first air inlets 1011 and / or second air inlets 1012 can be reduced, simplifying the structure of the air duct assembly 100 and improving the ease of production of the air duct assembly 100.

[0166] Figure 18 is a schematic diagram showing the positional relationship between a thin-film fan and a heating device provided in some other embodiments of this application. In some other examples, as shown in Figure 18, a thin-film fan 102 drives gas into the air duct 1013 via a first air outlet 1011; and / or, a thin-film fan 102 drives gas out of the air duct 1013 via a second air outlet 1012.

[0167] Understandably, the number of at least one of the first air vents 1011 and the second air vents 1012 is equal to the number of thin-film fans 102. When the number of first air vents 1011 is equal to the number of thin-film fans 102, the gas driven by one thin-film fan 102 flows into the air duct 1013 through one first air vent 1011, reducing the mutual interference of multiple thin-film fans 102 during air intake. When the number of second air vents 1012 is equal to the number of thin-film fans 102, the gas driven by one thin-film fan 102 flows out of the air duct 1013 through one second air vent 1012, reducing the mutual interference of multiple thin-film fans 102 during air exhaust.

[0168] In some examples, as shown in Figure 18, a first air vent 1011 and a second air vent 1012 constitute an air vent group 101a. The orthographic projection of the air vent group 101a on a first plane is adjacent to the orthographic projection of a thin-film fan 102 on the first plane. The gas driven by the thin-film fan 102 flows into the air duct 1013 through the first air vent 1011 in the air vent group 101a adjacent to the thin-film fan 102, and the gas driven by the thin-film fan 102 flows out of the air duct 1013 through the second air vent 1012 in the air vent group 101a adjacent to the thin-film fan 102.

[0169] Understandably, the orthographic projection of an air vent group 101a on the first plane and the orthographic projection of a thin-film fan 102 on the first plane are arranged adjacent to each other. This should be understood as the air vent group 101a being positioned close to a thin-film fan 102. There may be a gap between the orthographic projection of an air vent group 101a on the first plane and the orthographic projection of the thin-film fan 102 adjacent to it on the first plane, or the orthographic projections of an air vent group 101a on the first plane and the thin-film fan 102 adjacent to it on the first plane may partially overlap.

[0170] In the height direction Z of the middle frame 210, the first air vent 1011 and the second air vent 1012 in an air vent group 101a can be set adjacent to each other or staggered.

[0171] As shown by the dashed arrow in Figure 18, the thin-film fan 102 can drive gas into or out of the air duct 1013 through the air outlet group 101a adjacent to the thin-film fan 102, reducing the distance between the air outlet group 101a and the thin-film fan 102, which is beneficial for the thin-film fan 102 to drive the gas flow. Furthermore, it reduces the mutual influence between different thin-film fans 102, improving the heat dissipation performance of the air duct assembly 100.

[0172] Figure 19 is a cross-sectional view of the terminal device in Figure 1 along the A1-A1 direction in some other embodiments. Figure 20 is a schematic diagram showing the positional relationship between the heating element and the heat extraction structure provided in some embodiments of this application. Figure 21 is a schematic diagram showing the positional relationship between the heating element and the heat extraction structure provided in other embodiments of this application.

[0173] In some examples, as shown in FIG19, the heating device 208 includes a heating area P. The air duct assembly 100 also includes a heat-collecting structure 106 connected to the partition 101. At least a portion of the heat-collecting structure 106 is disposed outside the air duct 1013. As shown in FIG20, the heat-collecting structure 106 is in contact with the heating area P of the heating device 208. Alternatively, as shown in FIG21, the air duct assembly 100 further includes a fourth heat-conducting component 1004 disposed between the heat-collecting structure 106 and the heating area P of the heating device 208, and in contact with both the heat-collecting structure 106 and the heating area P of the heating device 208.

[0174] Understandably, the heating area P is the main region in the heating device 208 that dissipates heat outward. For example, the heating area P can be a relatively dense area such as switching transistors and logic operation devices. The heating device 208 may include one or more heating areas P. The embodiments of this application do not further limit the shape, number, or location of the heating areas P.

[0175] The heat-collecting structure 106 has a high thermal conductivity. The material of the heat-collecting structure 106 may include a metal, such as at least one of copper, aluminum, gold, and silver. Alternatively, the material of the heat-collecting structure 106 may also include other non-metallic materials with high thermal conductivity. The embodiments of this application do not further limit the material of the heat-collecting structure 106.

[0176] For example, the heat-collecting structure 106 and the partition 101 can be an integrally formed structure to improve the reliability of their connection. At least a portion of the heat-collecting structure 106 is disposed outside the air duct 1013, so that the heat-collecting structure 106 can contact the heating device 208, or so that the fourth heat-conducting component 1004 can be disposed between the heat-collecting structure 106 and the heating device 208.

[0177] Understandably, the heat emitted by the heating area P of the heating device 208 can be conducted to the heat extraction structure 106, and then to the partition 101 through the heat extraction structure 106. In this way, the thermal resistance between the heating area P and the partition 101 can be reduced, enabling targeted heat dissipation of the heating area P and improving the heat dissipation performance of the air duct assembly 100.

[0178] As shown in Figure 20, when the heat-collecting structure 106 is in contact with the heating area P of the heating device 208, the heat emitted by the heating area P can be conducted to the heat-collecting structure 106 without the need for other components, thus simplifying the structure of the air duct assembly 100. As shown in Figure 21, when a fourth heat-conducting component 1004 is provided between the heat-collecting structure 106 and the heating area P of the heating device 208, the thermal resistance between the heat-collecting structure 106 and the heating area P can be reduced, thereby improving the heat dissipation performance of the air duct assembly 100.

[0179] For example, the fourth heat-conducting component 1004 can be a vacuum heat spreader, or the fourth heat-conducting component 1004 can be other heat-conducting devices.

[0180] In some examples, as shown in Figure 20, the heat-collecting structure 106 is disposed on one side of the heating device 208 and in contact with the heating area P; or, as shown in Figure 21, the heat-collecting structure 106 surrounds at least a portion of the heating device 208 and is in contact with the heating area P. This arrangement improves the flexibility of the heat-collecting structure 106 and meets different needs.

[0181] In some examples, as shown in Figure 19, the heat extraction structure 106 includes a first portion 1061 and a second portion 1062, which are connected. The first portion 1061 is disposed outside the air duct 1013 and in contact with the heating area P of the heating device 208, while the second portion 1062 is disposed inside the air duct 1013. The air outlet 1022 of the thin-film fan 102 faces the second portion 1062.

[0182] For example, the first part 1061 and the second part 1062 can be an integrally formed structure to improve the reliability of their connection. In some examples, a third through hole can be provided on the base plate 104, through which the heat-collecting structure 106 passes, so that the first part 1016 can be located outside the air duct 1013 and the second part 1062 can be located inside the air duct 1013.

[0183] The first part 1061 is disposed outside the air duct 1013 and in contact with the heating area P of the heating device 208, so that the heat emitted by the heating area P can be conducted to the first part 1016, and can also be conducted to the second part 1062 through the first part 1061. Understandably, by setting the first part 1061 in contact with the heating area P, no heat-conducting components are required, which simplifies the structure of the air duct assembly 100.

[0184] The second part 1062 is disposed within the air duct 1013, and the air outlet 1022 of the thin film fan 102 faces the second part 1062, so that the thin film fan 102 can drive the gas to exchange heat with the second part 1062, thereby enabling targeted heat dissipation of the heat-generating area P.

[0185] That is, the heat extraction structure 106 includes a first part 1061 located outside the air duct 1013 and a second part 1062 located inside the air duct 1013, so that the heat from the heating area P can be conducted to the air duct 1013 through the heat extraction structure 106. The air outlet 1022 of the thin-film fan 102 faces the second part 1062, so that the thin-film fan 102 can specifically dissipate heat from the heating area P of the heating device 208, thereby improving the heat dissipation performance of the air duct assembly 100.

[0186] In some examples, the heat-collecting structure 106 can be bent, in which case the orthographic projection of the first part 1061 on the first plane is at least partially offset from the orthographic projection of the second part 1062 on the first plane. This allows the first part 1062 to collect heat from the heat-generating device 208 disposed in a smaller space and conduct the heat to the second part 1062, thereby enabling the thin-film fan 102 to dissipate heat from the heat-generating device 208 disposed in the smaller space, improving the heat dissipation performance of the air duct assembly 100.

[0187] In other examples, the heat extraction structure 106 can also be a straight plate, thereby shortening the heat transfer path and facilitating heat dissipation of the heat-generating device 208.

[0188] Figure 22 is a schematic diagram showing the positional relationship of the heating device, heat extraction structure, and thin-film fan provided in some embodiments of this application. Figure 23 is a schematic diagram showing the positional relationship of the heating device, heat extraction structure, and thin-film fan provided in other embodiments of this application. Figure 24 is a schematic diagram showing the positional relationship of the heating device, heat extraction structure, and thin-film fan provided in yet another embodiment of this application.

[0189] For example, as shown in Figures 22 and 23, on the first plane, the thin-film fan 102 is located on the side of the heat-collecting structure 106 away from the heat-generating device 208, and the air outlet 1022 of the thin-film fan 102 faces the second part 1062 of the heat-collecting structure 106, so as to achieve targeted heat dissipation for the heat-generating area P.

[0190] Alternatively, as shown in Figure 24, on the first plane, the thin-film fan 102 and the heat-generating device 208 are located on the same side of the heat-collecting structure 106. In this case, the second part 1062 can protrude from the heat-generating device 208, and the air outlet 1022 of the thin-film fan 102 faces the part of the second part 1062 that protrudes from the heat-generating device 208, thereby achieving targeted heat dissipation for the heat-generating area P.

[0191] By adopting the above configuration method, the flexibility of the film fan 102 in terms of its placement can be improved.

[0192] Figure 25 is a cross-sectional view of the terminal device in Figure 1 along the A1-A1 direction in some embodiments. Figure 26 is a cross-sectional view of the terminal device in Figure 2 along the A2-A2 direction in some embodiments. It is understood that, in order to simplify the structure of the drawings, only the camera housing 2071 of the camera module 207 is shown in Figure 26, and components such as the motor and lens assembly located inside the camera housing 2071 are not shown.

[0193] In some examples, as shown in Figure 19, a first vent Q1 is provided on the frame 2101, and at least one of the first air vent 1011 and the second air vent 1012 is connected to the first vent Q1; and / or, as shown in Figure 25, a second vent Q2 is provided on the rear shell 206, and at least one of the first air vent 1011 and the second air vent 1012 is connected to the second vent Q2; and / or, as shown in Figures 2 and 26, a third vent Q3 is provided on the camera housing 2071 of the camera module 207, and at least one of the first air vent 1011 and the second air vent 1012 is connected to the third vent Q3.

[0194] As shown in Figure 19, when the first air vent 1011 is connected to the first vent Q1, the first vent Q1 can be opened on the frame 2101 near the first air vent 1011. When the second air vent 1012 is connected to the first vent Q1, the first vent Q1 can be opened on the frame 2101 near the second air vent 1012.

[0195] Taking the example that the first air vent 1011 and the second air vent 1012 are respectively connected to the first vent Q1, the number of the first vent Q1 can be multiple, and the first air vent 1011 and the second air vent 1012 are respectively connected to different first vent Q1.

[0196] For example, there can be two first vents Q1, one of which connects to the first air vent 1011, and the other connects to the second air vent 1012. Alternatively, there can be multiple first vents Q1 connected to the first air vent 1011. It is understood that the number of first vents Q1 connected to the first air vent 1011 can be the same as or different from the number of air vents 1011. Similarly, there can be multiple first vents Q1 connected to the second air vent 1012. It is understood that the number of second vents Q2 connected to the second air vent 1012 can be the same as or different from the number of air vents 1012.

[0197] A first vent Q1 is opened on the frame 2101. At least one of the first air vent 1011 and the second air vent 1012 is connected to the first vent Q1, so that at least one of the first air vent 1011 and the second air vent 1012 can be connected to the outside through the first vent Q1. This allows the thin film fan 102 to drive the gas outside the terminal device 200 to flow into the air duct 1013 through the first vent Q1 and the first air vent 1011, and / or allows the thin film fan 102 to drive the gas in the air duct 1013 to be discharged outside the terminal device 200 through the first vent Q1 and the second air vent 1012.

[0198] As shown in Figure 25, when the first air vent 1011 is connected to the second vent Q2, the second vent Q2 can be opened on the rear shell 206 near the first air vent 1011. When the second air vent 1012 is connected to the second vent Q2, the second vent Q2 can be opened on the rear shell 206 near the second air vent 1012.

[0199] Taking the first air vent 1011 and the second air vent 1012 as examples, which are respectively connected to the second vent Q2, the number of second vent Q2 can be multiple, and the first air vent 1011 and the second air vent 1012 are respectively connected to different second vent Q2.

[0200] For example, there can be two second vents Q2, one connected to the first air vent 1011 and the other connected to the second air vent 1012. Alternatively, there can be multiple second vents Q2 connected to the first air vent 1011. It is understood that the number of second vents Q2 connected to the first air vent 1011 can be the same as or different from the number of air vents 1011. Similarly, there can be multiple second vents Q2 connected to the second air vent 1012. It is understood that the number of second vents Q2 connected to the second air vent 1012 can be the same as or different from the number of air vents 1012.

[0201] A second vent Q2 is provided on the rear shell 206. At least one of the first air vent 1011 and the second air vent 1012 is connected to the second vent Q2, so that at least one of the first air vent 1011 and the second air vent 1012 can be connected to the outside through the second vent Q2. This allows the thin film fan 102 to drive the gas outside the terminal device 200 to flow into the air duct 1013 through the second vent Q2 and the first air vent 1011, and / or allows the thin film fan 102 to drive the gas in the air duct 1013 to be discharged outside the terminal device 200 through the second vent Q2 and the second air vent 1012.

[0202] As shown in Figure 26, when the first air vent 1011 is connected to the third vent Q3, the third vent Q3 can be opened on the camera housing 2071 near the first air vent 1011. When the second air vent 1012 is connected to the third vent Q3, the third vent Q3 can be opened on the camera housing 2071 near the second air vent 1012.

[0203] Taking the first air vent 1011 and the second air vent 1012 as examples, which are respectively connected to the third air vent Q3, the number of third air vents Q3 can be multiple, and the first air vent 1011 and the second air vent 1012 are respectively connected to different third air vents Q3.

[0204] For example, there can be two third vents Q3, one connected to the first air vent 1011 and the other connected to the second air vent 1012. Alternatively, there can be multiple third vents Q3 connected to the first air vent 1011. It is understood that the number of third vents Q3 connected to the first air vent 1011 can be the same as or different from the number of air vents 1011. Similarly, there can be multiple third vents Q3 connected to the second air vent 1012. It is understood that the number of third vents Q3 connected to the second air vent 1012 can be the same as or different from the number of air vents 1012.

[0205] A third vent Q3 is provided on the camera housing 2071. At least one of the first air vent 1011 and the second air vent 1012 is connected to the third vent Q3, so that at least one of the first air vent 1011 and the second air vent 1012 can be connected to the outside through the third vent Q3. This allows the thin film fan 102 to drive the gas outside the terminal device 200 into the air duct 1013 through the third vent Q3 and the first air vent 1011, and / or allows the thin film fan 102 to drive the gas in the air duct 1013 to be discharged outside the terminal device 200 through the third vent Q3 and the second air vent 1012.

[0206] Understandably, the first air vent 1011 can be connected to one of the first vent Q1, the second vent Q2, and the third vent Q3, or the first air vent 1011 can be connected to at least two of the first vent Q1, the second vent Q2, and the third vent Q3. The second air vent 1012 can be connected to one of the first vent Q1, the second vent Q2, and the third vent Q3, or the second air vent 1012 can be connected to at least two of the first vent Q1, the second vent Q2, and the third vent Q3.

[0207] That is, by opening vents (including the first vent Q1, the second vent Q2 and the third vent Q3), the first air outlet 1011 and the second air outlet 1012 can be connected to the outside through the vents, thereby enabling the thin film fan 102 to drive the air outside the terminal device 200 into the air duct 1013 through the vents and the first air outlet 1011, and / or enabling the thin film fan 102 to drive the air in the air duct 1013 to be discharged outside the terminal device 200 through the first vent and the second air outlet 1012, which is beneficial for the heat dissipation of the heat-generating device 208.

[0208] In summary, the embodiments of this application have at least the following beneficial effects:

[0209] The embodiments of this application configure the terminal device 200 to include a duct assembly 100. The thin-film fan 102 of the duct assembly 100 drives gas to flow through the duct 1013, thereby realizing active heat dissipation of the terminal device 200, improving the heat dissipation of the terminal device 200, and meeting the power consumption requirements of the terminal device 200.

[0210] The partition 101 of the air duct assembly 100 is disposed within the receiving chamber 210a, and the partition 101 surrounds the air outlet 1013. Compared with the middle frame 210 directly surrounding the air outlet 1013, the partition 101 can isolate the functional components of the terminal device 200 (such as the motherboard, sub-board, battery management board and battery, etc.) from the thin film fan 102, reducing the impact of impurities and water vapor in the gas on the functional components.

[0211] Furthermore, the structure of the middle frame 210 does not need to be changed, simplifying the production process of the middle frame 210. Moreover, the partition 101 can be placed at different positions in the receiving chamber 210a according to the arrangement of functional components within the receiving chamber 210a. Additionally, the partition 101, which forms air ducts 1013 of different shapes, can be connected to the middle frame 210 according to the arrangement of functional components within the receiving chamber 210a, improving the flexibility of the air ducts 1013 within the receiving chamber 210a.

[0212] The heating element 208 is disposed outside the air duct 1013 and adjacent to the partition 101, or the heating element 208 is disposed inside the air duct 1013, so that the gas flowing inside the air duct 1013 can dissipate heat from the heating element 208, thereby realizing active heat dissipation of the heating element 208, increasing the heat dissipation of the heating element 208, and meeting the power consumption requirements of the terminal device 200.

[0213] Understandably, when the heating element 208 is located outside the air duct 1013, the partition 101 can isolate the thin-film fan 102 and the heating element 208, reducing the impact of impurities and water vapor in the gas on the heating element 208. When the heating element 208 is located inside the air duct 1013, the gas inside the air duct 1013 can directly exchange heat with the heating element 208, improving the heat dissipation effect. Placing the heating element 208 outside or inside the air duct 1013 increases the flexibility in its placement.

[0214] Compared to a fan that uses a rotating impeller to expel air (i.e., impeller fan 301), the thin-film fan 102 is smaller, allowing it to be positioned closer to the heat-generating device 208, thus achieving localized heat extraction and improving the heat dissipation effect of the air duct assembly 100. Furthermore, the flexible placement of the thin-film fan 102 allows for a more compact structure of the air duct assembly 100, facilitating the miniaturization of the terminal device 200.

[0215] Furthermore, the thin-film fan 102 has a higher exhaust pressure, a higher exhaust head (exhaust pressure), and a higher air velocity, which improves the heat dissipation performance of the air duct assembly 100. In other words, by including the thin-film fan 102 in the air duct assembly 100, the terminal device 200 can balance aesthetics and heat dissipation capabilities.

[0216] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A terminal device (200), characterized by, include: The middle frame (210) has an opening for a receiving compartment (210a); A duct assembly (100) includes a partition (101) and a thin-film fan (102); the partition (101) is disposed within the receiving chamber (210a) and connected to the middle frame (210); the partition (101) encloses an air outlet duct (1013), a first air outlet (1011), and a second air outlet (1012), the air outlet (1013) connecting the first air outlet (1011) and the second air outlet (1012); the thin-film fan (102) is disposed within the air outlet (1013) and connected to the partition (101); the air inlet (1021) of the thin-film fan (102) is connected to the first air outlet (1011), and the air outlet (1022) of the thin-film fan (102) is connected to the second air outlet (1012); and, A heating element (208) is disposed outside the air duct (1013) and adjacent to the partition (101); or, the heating element (208) is disposed inside the air duct (1013).

2. The terminal device (200) according to claim 1, characterized by The length direction (Y) of the middle frame (210) intersects the width direction (X) of the middle frame (210); the plane containing the length direction (Y) and the width direction (X) of the middle frame (210) is the first plane; The number of heating devices (208) is multiple; the number of thin film fans (102) is multiple; the orthographic projection of any heating device (208) on the first plane is arranged adjacent to the orthographic projection of at least one thin film fan (102) on the first plane.

3. The terminal device (200) according to claim 2, characterized by The orthographic projection of any one of the heating devices (208) on the first plane is arranged adjacent to the orthographic projections of at least two of the thin-film fans (102) on the first plane.

4. The terminal device (200) according to claim 2 or 3, characterized by, The heating device (208) includes a first heating device and a second heating device; the orthographic projection of the first heating device on the first plane is adjacent to the orthographic projection of n thin-film fans (102) on the first plane; the orthographic projection of the second heating device on the first plane is adjacent to the orthographic projection of m thin-film fans (102) on the first plane. Where m and n are both positive integers; m and n are equal; or m and n are not equal.

5. The terminal device (200) according to any one of claims 2-4, characterized by, At least two of the thin-film fans (102) drive gas into the air duct (1013) via the same first air outlet (1011); and / or, at least two of the thin-film fans (102) drive gas out of the air duct (1013) via the same second air outlet (1012).

6. The terminal device (200) according to any one of claims 2 to 4, characterized in that One of the thin-film fans (102) drives gas into the air duct (1013) via a first air outlet (1011); and / or, one of the thin-film fans (102) drives gas out of the air duct (1013) via a second air outlet (1012).

7. The terminal device (200) according to claim 6, characterized by A first air vent (1011) and a second air vent (1012) constitute an air vent group (101a), and the orthographic projection of the air vent group (101a) on the first plane is arranged adjacent to the orthographic projection of the thin film fan (102) on the first plane; The gas driven by the thin-film fan (102) flows into the air duct (1013) through a first air outlet (1011) in the air outlet group (101a) adjacent to the thin-film fan (102), and the gas driven by the thin-film fan (102) flows out of the air duct (1013) through a second air outlet (1012) in the air outlet group (101a) adjacent to the thin-film fan (102).

8. The terminal device (200) according to any one of claims 1 to 7, characterized in that The heating element (208) is disposed outside the air duct (1013); the heating element (208) is in contact with the partition (101); or, the air duct assembly (100) further includes a first heat-conducting component (1001), which is disposed between the heating element (208) and the partition (101) and is in contact with the heating element (208) and the partition (101).

9. The terminal device (200) according to claim 8, characterized by The air duct assembly (100) further includes heat dissipation fins (103), which are disposed within the air duct (1013) and connected to the partition (101); the partition (101) includes a base plate (104) and a side wall (105), which are connected to the side wall (105); in the height direction (Z) of the middle frame (210), the heat dissipation fins (103) and the heat-generating device (208) are located on both sides of the base plate (104); Wherein, the height direction (Z) of the middle frame (210) intersects the plane containing the length direction (Y) and the width direction (X) of the middle frame (210); the length direction (Y) of the middle frame (210) intersects the width direction (X) of the middle frame (210).

10. The terminal device (200) according to claim 9, characterized by The air duct assembly (100) further includes a second heat-conducting component (1002), which is located between the heat dissipation fins (103) and the base plate (104) and is in contact with the heat dissipation fins (103) and the base plate (104).

11. The terminal device (200) according to any one of claims 1 to 7, characterized by The heating device (208) is disposed outside the air duct (1013); the air duct assembly (100) also includes heat dissipation fins (103), at least a portion of which is disposed inside the air duct (1013) and connected to the partition (101); The partition (101) includes a base plate (104) and a side wall (105), the base plate (104) being connected to the side wall (105); the base plate (104) is provided with a receiving hole; at least one part of the heating device (208) and the heat dissipation fins (103) is disposed in the receiving hole; The heating element (208) is in contact with the heat dissipation fins (103); or, the air duct assembly (100) further includes a third heat-conducting component (1003), which is disposed between the heat dissipation fins (103) and the heating element (208) and is in contact with the heat dissipation fins (103) and the heating element (208).

12. The terminal device (200) according to any one of claims 1 to 11, characterized in that The heating device (208) includes a heating area (P); the air duct assembly (100) further includes a heat-collecting structure (106), which is connected to the partition (101); at least a portion of the heat-collecting structure (106) is disposed outside the air duct (1013); The heat-collecting structure (106) is in contact with the heating area (P) of the heating device (208); or, the air duct assembly (100) further includes a fourth heat-conducting component (1004), which is disposed between the heat-collecting structure (106) and the heating area (P) of the heating device (208) and is in contact with the heating area (P) of the heat-collecting structure (106) and the heating device (208).

13. The terminal device (200) according to claim 12, characterized by The heat extraction structure (106) includes a first part (1061) and a second part (1062), the first part (1061) and the second part (1062) are connected; the first part (1061) is disposed outside the air duct (1013) and in contact with the heating area (P) of the heating device (208), and the second part (1062) is disposed inside the air duct (1013); the air outlet of the thin film fan (102) faces the second part (1062).

14. The terminal device (200) according to claim 12 or 13, characterized by, The heat-collecting structure (106) is disposed on one side of the heating device (208) and in contact with the heating area (P); or, the heat-collecting structure (106) surrounds at least a portion of the heating device (208) and is in contact with the heating area (P).

15. The terminal device (200) according to any one of claims 1 to 14, characterized by, The middle frame (210) includes a side frame (2101) and a middle plate (2102), wherein the side frame (2101) surrounds the middle plate (2102) and is connected to the middle plate (2102); The terminal device (200) also includes: The rear shell (206) is located on one side of the middle frame (210) along the height direction of the middle frame (210) and is connected to the middle frame (210); A camera module (207) is at least partially disposed within the receiving compartment; the camera module (207) includes a camera housing (2071); A first vent (Q1) is provided on the frame (2101), and at least one of the first air vent (1011) and the second air vent (1012) is connected to the first vent (Q1); and / or, a second vent (Q2) is provided on the rear shell (206), and at least one of the first air vent (1011) and the second air vent (1012) is connected to the second vent (Q2); and / or, a third vent (Q3) is provided on the camera housing (2071) of the camera module (207), and at least one of the first air vent (1011) and the second air vent (1012) is connected to the third vent (Q3).

16. The terminal device (200) according to any one of claims 1 to 15, characterized by The air duct assembly (100) further includes a baffle plate (107) that separates the air duct (1013); along the extending direction of the air duct (1013), the air inlet (1021) and the air outlet (1022) of the thin film fan (102) are located on both sides of the baffle plate (107).

17. The terminal device (200) according to any one of claims 1 to 16, characterized by, The plane containing the air inlet (1021) of the thin-film fan (102) intersects the plane containing the air outlet (1022) of the thin-film fan (102).

18. An air duct assembly (100) characterized by, It includes a partition (101) and a thin-film fan (102); the partition (101) is disposed in the receiving compartment of the middle frame (210) and connected to the middle frame (210); the partition (101) surrounds an air outlet duct (1013), a first air outlet (1011) and a second air outlet (1012), the air outlet (1013) connecting the first air outlet (1011) and the second air outlet (1012); the thin-film fan (102) is disposed in the air outlet (1013) and connected to the partition (101); the air inlet (1021) of the thin-film fan (102) is connected to the first air outlet (1011), and the air outlet (1022) of the thin-film fan (102) is connected to the second air outlet (1012).

19. The air duct assembly (100) of claim 18, wherein, The length direction (Y) of the middle frame (210) intersects the width direction (X) of the middle frame (210); the plane containing the length direction (Y) and the width direction (X) of the middle frame (210) is the first plane; The number of heating devices (208) is multiple; the number of thin film fans (102) is multiple; the orthographic projection of any heating device (208) on the first plane is arranged adjacent to the orthographic projection of at least one thin film fan (102) on the first plane.

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