Radiation image capturing device, radiation image capturing system, and partition wall fluorescent member

Abstract

The present invention comprises a plurality of partition wall fluorescent members each comprising a plurality of light emitting portions provided with a partition wall comprising an open region and a fluorescent material positioned in the open region, and a photoelectric conversion member comprising a plurality of light receiving portions each provided with a photoelectric conversion element, wherein: the plurality of partition wall fluorescent members are disposed facing the photoelectric conversion member and in parallel with each other; and each partition wall fluorescent member has, in at least one direction of the parallel arrangement direction of the light emitting portion adjacent to the parallel arrangement portion with another partition wall fluorescent member, a width smaller than the width of another light emitting portion.

Description

Radiation Imaging Device, Radiation Imaging System, and Partition Phosphor Member

[0001] The present invention relates to a radiation imaging device for detecting radiation and a radiation imaging system, and particularly to a radiation imaging device used in medical imaging diagnostic devices, analyzers, and the like.

[0002] As an imaging device used for medical imaging diagnosis and non-destructive inspection by radiation (such as X-rays), a radiation imaging device using a flat panel detector (FPD) formed of a semiconductor material is known. Such a radiation imaging device can be used as a digital imaging device for still images, moving images, etc. in medical imaging diagnosis, for example.

[0003] A digital radiation imaging device obtains image data by converting radiation that has passed through a patient into visible light using a phosphor and then converting the visible light into an electrical signal by a conversion element such as a photoelectric conversion element disposed on a sensor substrate. In such a radiation imaging device, it is desirable to have high sharpness in order to more accurately detect the physical information of the patient. Therefore, Patent Document 1 discloses a technique of reducing light scattering in a phosphor by partitioning the phosphor with a partition member formed by silicon etching technology.

[0004] By the way, the maximum size of a silicon wafer is 30 cm in diameter. Therefore, when a partition member made of a silicon wafer is adopted for a large radiation imaging device having a size of about 40 cm × 40 cm at maximum, a plurality of partition members are cut out from the silicon wafer and bonded to the sensor substrate in a tiling manner.

[0005] When tiling a plurality of partition members, if there is a gap between the partition members, X-rays cannot be converted into light in that region, which causes data loss.

[0006] U.S. Patent No. 6,744,052

[0007] In view of the above circumstances, an object of the present invention is to suppress data loss in a radiation imaging device having a structure in which a plurality of partition members are bonded to a sensor substrate in a tiling manner.

[0008] The present invention, which solves the above problems, is a radiation imaging apparatus comprising: a plurality of partition phosphor members, each having a plurality of light-emitting parts comprising a partition wall having an opening region and a phosphor located in the opening region; and a photoelectric conversion member, each having a plurality of light-receiving parts comprising a photoelectric conversion element that converts light into an electrical signal, wherein the plurality of partition phosphor members are arranged facing the photoelectric conversion member and side by side, and each partition phosphor member is characterized in that the width of the light-emitting part adjacent to the side by side portion in at least one direction in the side-by-side arrangement direction is smaller than the width of the other light-emitting parts.

[0009] By the above means, a large-area radiation imaging device can be provided while suppressing data loss.

[0010] Plan view of the radiation imaging device according to the first embodiment of the present invention Cross-sectional view of the radiation imaging device according to the first embodiment of the present invention (Cross-sectional view of A-A' in Figure 1 and cross-sectional view of A-A' in Figure 4) Cross-sectional view of the radiation imaging device according to a modified example of the first embodiment of the present invention (Cross-sectional view of A-A' in Figure 1 and cross-sectional view of A-A' in Figure 4) Plan view of the radiation imaging device according to a modified example of the first embodiment of the present invention Plan view of the radiation imaging device according to the second embodiment of the present invention Cross-sectional view of the radiation imaging device according to the second embodiment of the present invention (Cross-sectional view of A-A' in Figure 5) Cross-sectional view of the radiation imaging device according to a modified example of the second embodiment of the present invention Plan view of the radiation imaging device according to the third embodiment of the present invention Cross-sectional view of the radiation imaging device according to the third embodiment of the present invention (Cross-sectional view of A-A' in Figure 8) Cross-sectional view of the radiation imaging device according to a modified example of the third embodiment of the present invention Schematic diagram illustrating an example of application of the radiation detection device of the present invention to an X-ray diagnostic system

[0011] Embodiments of the present invention will be described below with reference to the attached drawings. Similar elements throughout the various embodiments will be given the same reference numerals, and redundant descriptions will be omitted. Hereinafter, each embodiment of the present invention will be described using examples of radiation imaging devices used in medical imaging diagnostic equipment, analytical equipment, etc. In the present invention, light includes visible light and infrared light, and radiation includes X-rays, alpha rays, beta rays, and gamma rays.

[0012] A schematic configuration example of a radiation imaging device 100 according to the first embodiment of the present invention will be described with reference to Figures 1, 2, 3, and 4. Figures 1 and 4 are plan views of the radiation imaging device 100, and Figures 2 and 3 are cross-sectional views. In Figures 1 and 4, the phosphor 210, adhesive member 240, and substrate 340 are omitted for the sake of explanation. Also, in Figures 1, 2, 3, and 4, contours are provided for the sake of explanation, but in reality, there are countless light-receiving units 310 in the radiation imaging device 100, and the phosphor 210 is arranged accordingly.

[0013] As shown in Figure 2, the radiation imaging device 100 comprises a phosphor section 200 and a photoelectric conversion section 300, which are arranged facing each other. X-ray photons 400 are incident on the phosphor section 200 and converted and multiplied into visible light photons 500. The visible light photons 500 are incident on the photoelectric conversion section 300 and detected as an electrical signal.

[0014] As shown in Figures 1 and 2, the phosphor section 200 is composed of a plurality of partition phosphor members 201, 202, 203, and 204, which are arranged side by side. The partition phosphor members 201, 202, 203, and 204 are composed of a phosphor 210 and partition members 220, with the phosphor 210 being separated and partitioned by the partition members 220. Specifically, the partition members 220 have an opening region, and the phosphor 210 is positioned within this opening region. Thus, one light-emitting section 230 is formed by the partition members 220 surrounding the phosphor 210 in a way that separates it, and the phosphor 210 that is surrounded and separated by the partition members. As a result, the spread of visible light photons generated by the phosphor 210 within one light-emitting section 230 is suppressed by the surrounding partition members 220. Please note that the opening region is filled with phosphor 210 and cannot be shown in the diagram; therefore, please understand that the region where phosphor 210 is present is equivalent to the opening region.

[0015] As the phosphor 210, known materials such as CsI:Tl or Gd2O2S (GOS) can be used. The partition member 220 is manufactured by forming multiple sections divided at a predetermined pitch on a silicon wafer by etching, and then cutting it into smaller sizes by dicing. The material for the partition member 220 can be a semiconductor material such as silicon. However, any material that is highly reflective and light-shielding and can be etched at a high aspect ratio can be used as appropriate. For example, in addition to semiconductors, metallic materials can also be used. The width of the partition member 220 is approximately 10 μm.

[0016] Multiple partition phosphor members 201, 202, 203, and 204 are tiled (arranged side by side) on the photoelectric conversion unit 300 via an adhesive member 240. At this time, distance P' is smaller than distance P. By using this configuration, the loss of X-ray photons at the tiling boundary 600 can be suppressed. The tiling boundary 600 is the portion between adjacent partition phosphor members, and may hereafter be referred to as the side-by-side portion. In other words, the side-by-side portion is the portion between partition phosphor members that are arranged side by side. The tiling boundary 600 is, for example, a void, but it can also be filled with a highly reflective and light-shielding material. Distances P and P' are the distances between the ends of the partition members 220 that separate the phosphor 210 in question. More specifically, distance P' means the width in the side-by-side direction of the light-emitting portion adjacent to the side-by-side portion with the adjacent partition phosphor member. Similarly, distance P means the width in the side-by-side direction of the light-emitting portions other than the light-emitting portions adjacent to the side-by-side portion (sometimes simply referred to as other light-emitting portions). Furthermore, distance Q is the distance between the ends of adjacent light-receiving units 310.

[0017] As shown in Figure 2, the phosphor section 200 and the photoelectric conversion section 300 are arranged in overlapping positions (facing each other) via an adhesive member 240. The adhesive member 240 can be an adhesive member that has the property of melting or softening when heated. For example, it can be a sheet-like or liquid adhesive material containing thermoplastic elastomers such as styrene-based, olefin-based, PVC-based, urethane-based, or amide-based materials, also known as a hot-melt resin. Alternatively, adhesive sheets such as acrylic-based or silicone-based adhesive sheets that have adhesive properties at room temperature can also be used.

[0018] The semiconductor component 330 has multiple light-receiving units 310, which have sensor functions, arranged in a matrix. Therefore, the semiconductor component 330 may also be called a sensor component, sensor substrate, or sensor chip. Glass or heat-resistant plastic are preferably used as the material for the semiconductor component 330. In Figures 1 and 2, the area of ​​the photoelectric conversion unit 300 is larger than the area of ​​the phosphor unit 200, but there is no requirement for the relative size of the areas; even if the areas are the same, the area of ​​the photoelectric conversion unit 300 may be smaller. The same applies to the areas of the phosphor 210 and the light-receiving unit 310. In Figures 1 and 2, the outline of the light-receiving unit 310 is shown with a dotted line for illustrative purposes, but in reality, such a dotted line does not exist. Also, a pixel 410 is formed by the light-emitting unit 230 and the light-receiving unit 310 (see Figure 2). The pixel 410 is also shown with a dotted line, but similarly, such a dotted line does not exist.

[0019] The distance between adjacent light-receiving units 310 is maintained at distance Q. Maintaining distance Q reduces distortion and other issues in the resulting image.

[0020] Each light-receiving unit 310 is equipped with one or more photoelectric conversion elements. For example, PIN-type sensors, MIS-type sensors, or avalanche photodiodes made of amorphous silicon can be used as photoelectric conversion elements.

[0021] As described above, in this embodiment, the phosphor section 200 has a smaller volume of phosphor 210 compared to a phosphor section without a partition member 220 because the phosphor 210 is separated by a partition member 220. As a result, the amount of light emitted from the phosphor 210 is reduced, so an avalanche photodiode, which has the function of amplifying the signal, is suitable as the photoelectric conversion element.

[0022] X-ray photons 400 irradiated onto the radiation imaging device 100 are absorbed by the phosphor section 200 and converted into visible light photons 500. The converted visible light photons 500 are incident on the photoelectric conversion section 300 and converted into electrical signals. An image signal is generated based on the converted electrical signal, and a radiation image is generated by processing this image signal.

[0023] Therefore, in regions within the phosphor section 200 where the light-emitting section 230 (specifically the phosphor 210) is absent, conversion to visible light photons 500 does not occur, resulting in data loss. On the other hand, consider the case where a silicon wafer partition member 220 is used in a large radiation imaging device 100 with a maximum size of approximately 40 cm x 40 cm. In this case, multiple partition phosphor members 201, 202, 203, and 204 need to be tiled (arranged side by side) on the sensor substrate, and the tiling boundary 600 is a region where the light-emitting section 230 is absent, thus causing data loss.

[0024] If the tiling boundary 600 is reduced, the light-emitting unit 230 and the light-receiving unit 310 will be shifted in the direction perpendicular to the X-ray incidence, resulting in data loss.

[0025] In this embodiment, at least a portion of the end of each partition phosphor member 201, 202, 203, and 204 on the side where adjacent partition phosphor members exist (the light-emitting section adjacent to the parallel arrangement), the distance P' is made smaller than the distance P. Specifically, the partition member 220 is designed such that the distance P' between the ends of the partition member 220 separating the phosphor 210 (the width of the light-emitting section adjacent to the parallel arrangement in the parallel arrangement direction) is smaller than the distance P at other points. The magnification of distance P' at distance P is variable and is determined so that the phosphor 210 and the pixel 310 do not shift in the direction perpendicular to the X-ray incidence. Also, in Figures 1 and 2, the width of the phosphor 210 and the width of the light-receiving section 310 may or may not be the same. Furthermore, the size of the tiling boundary 600 (the distance between light-emitting sections adjacent to the parallel arrangement) is different from the width of the light-receiving section, but is not limited to this and may be the same.

[0026] In other words, taking into account the size of the tiling boundary, the size of the light-emitting portion adjacent to the boundary (the portion where the partition phosphor members are arranged side by side) is reduced in order to minimize image data loss due to the presence of the boundary region. This makes it possible to place light-emitting portions right up to the edge of the boundary (the portion where the members are arranged side by side), thereby minimizing the non-light-emitting area. In this embodiment, as shown in Figure 1, the width of the light-emitting portion adjacent to the arranged portion is reduced in each adjacent direction, but the direction in which the width is reduced may be at least one of the directions of arrangement. In other words, in the light-emitting portion at a corner where the arranged portion exists in two directions, the effect is achieved if the width is reduced in at least one direction. Furthermore, there are no particular restrictions on the relationship between the arrangement pitch of the light-emitting portion and the arrangement pitch of the light-receiving portion, but it is preferable that both pitches are the same, and it is especially preferable that both pitches are the same even at the tiling boundary.

[0027] Figure 3 is a cross-sectional view of the radiation imaging device 100, and is a modified version of Figure 2. Therefore, explanations of configurations similar to those in Figure 2 are omitted. Also, to avoid making the diagrams too complex, some parts of some similar configurations (light-emitting unit 230, pixels 410) are omitted from the illustration. This omission is also the case in Figures 6, 7, 9, and 10 described later. In Figure 3, multiple photoelectric conversion elements are arranged within the light-receiving unit, and one light-receiving unit 310 is composed of multiple photoelectric conversion elements 320. Thus, the number of photoelectric conversion elements 320 within a single light-receiving unit may be one or multiple. This is also the case in the second and third embodiments.

[0028] Figure 4 is a plan view of the radiation imaging device 100, and is a modified version of Figure 1. Therefore, explanations of configurations similar to those in Figure 1 will be omitted. Figure 4 shows a modified arrangement of the partition phosphor members 201, 202, 203, and 204. As shown, the ends of the partition phosphor members 201, 202, 203, and 204 do not need to be aligned. And, as in Figure 1, each partition phosphor member has multiple light-emitting parts arranged in a matrix, and the width of the light-emitting part located on the outermost edge of the matrix is ​​smaller than the width of the other light-emitting parts. This improves the ease of layout of the partition phosphor members, as in Figure 1.

[0029] As described above, the radiation imaging apparatus 100 of the present invention makes the distance P' smaller than the distance P at least a portion of the end of the partition phosphor members 201, 202, 203, and 204 on the side where adjacent partition phosphor members exist (light-emitting section adjacent to the parallel arrangement). Specifically, the partition members 220 are designed such that the distance P' between the ends of the partition members 220 that separate the phosphor 210 is smaller than the distance P at other points. By adopting this configuration, the tiling boundary 600 can be reduced when tiling the multiple partition phosphor members 201, 202, 203, and 204 onto the sensor substrate. As a result, the light-emitting section 230 (specifically the phosphor 210) and the light-receiving section 310 do not shift in a direction perpendicular to the radiation incidence direction, thus suppressing data loss. In other words, it becomes possible to provide a high-quality radiation imaging apparatus.

[0030] A schematic configuration example of a radiation imaging device 100 according to a second embodiment of the present invention will be described with reference to Figures 5, 6, and 7. Figure 5 is a plan view of the radiation imaging device 100, and Figures 6 and 7 are cross-sectional views. In Figure 5, for the sake of explanation, the phosphor 210, the adhesive member 240, and the substrate 340 are omitted.

[0031] The operating principle of the radiation imaging device 100 is the same as in the first embodiment, so a description will be omitted. The differences from the first embodiment will be described in detail below.

[0032] In the second embodiment, the photoelectric conversion unit 300 is composed of multiple photoelectric conversion members 301, 302, 303, and 304. In other words, in the first embodiment, there was only one photoelectric conversion member, and the photoelectric conversion unit 300 was composed of one photoelectric conversion member. On the other hand, in the second embodiment, there are multiple photoelectric conversion members, and the photoelectric conversion unit 300 is composed of these multiple photoelectric conversion members 301, 302, 303, and 304. Each of the photoelectric conversion members 301, 302, 303, and 304 has multiple light-receiving units 310 with sensor functions arranged in a matrix. Therefore, the photoelectric conversion members 301, 302, 303, and 304 may also be called sensor members, sensor substrates, sensor chips, etc. Glass and heat-resistant plastics are preferably used as materials for the photoelectric conversion members 301, 302, 303, and 304.

[0033] These photoelectric conversion members 301, 302, 303, and 304 are tiled (arranged side by side) on the substrate 340 via adhesive members 240. Furthermore, multiple partition phosphor members 201, 202, 203, and 204 are tiled (arranged side by side) on the photoelectric conversion section 300 via adhesive members 240. Therefore, in this embodiment, as shown in Figure 6, the tiling boundary 600 is the portion between adjacent partition phosphor members and the portion between adjacent photoelectric conversion members, and, as in the first embodiment, may be referred to as the side-by-side portion below. The materials of the upper and lower adhesive members 240 may or may not be the same. In this case, distance P' is smaller than distance P, and distance Q' is smaller than distance Q. This configuration suppresses the loss of X-ray photons at the tiling boundary 600. The tiling boundary 600 is, for example, a void, but it can also be filled with a highly reflective and light-shielding material. Distances P and P' are the distances between the ends of the partition members 220 that separate the phosphor 210, and distance Q is the distance between the ends of adjacent light-receiving units 310. Distance Q' is the distance between the left end of the outermost light-receiving unit 310 and the end of the photoelectric conversion member to which the light-receiving unit 310 belongs. More specifically, distance Q' means the width in the parallel-installation direction of the light-receiving unit adjacent to the parallel-installation section with the adjacent photoelectric conversion member. Similarly, distance Q means the width in the parallel-installation direction of light-receiving units other than the light-receiving unit adjacent to the parallel-installation section (sometimes simply referred to as other light-receiving units).

[0034] In this embodiment, at least a portion of the end of each photoelectric conversion member 301, 302, 303, and 304 on the side where adjacent photoelectric conversion members are located, the distance Q' is designed to be smaller than the distance Q. Also, similar to the first embodiment, at least a portion of the parallel arrangement of partition phosphor members 201, 202, 203, and 204, the distance P' is smaller than the distance P. The magnification of distance Q' at distance Q is variable and is determined so that the phosphor 210 and the light receiving unit 310 do not shift in the direction perpendicular to the X-ray incidence.

[0035] Figure 7 is a cross-sectional view of a radiation imaging device 100 that supplements this embodiment. As shown, there may be multiple light-receiving units 310 corresponding to the width of the light-emitting section (specifically, the phosphor 210) partitioned by the partition member 220. In this case, distance Q is the distance between the ends of multiple (two in Figure 7) light-receiving units 310 corresponding to the width of the phosphor 210 partitioned by the partition member 220 when they are grouped together. Distance Q' is the distance between the left end of the pixel 310 corresponding to the width of the outermost phosphor 210 and the end of the photoelectric conversion member to which the pixel 310 belongs.

[0036] Furthermore, as shown in Figure 3, the number of photoelectric conversion elements 320 in the pixel 310 may be one or multiple.

[0037] This configuration makes it possible to reduce the size of the tiling boundary 600 and ensure that the light-emitting unit and the light-receiving unit 310 are not misaligned in the direction perpendicular to the X-ray incidence, thereby suppressing data loss. In other words, it becomes possible to provide a high-quality radiation imaging device.

[0038] A schematic configuration example of a radiation imaging device 100 according to a third embodiment of the present invention will be described with reference to Figures 8, 9, and 10. Figure 8 is a plan view of the radiation imaging device 100, and Figures 9 and 10 are cross-sectional views. In Figure 8, for the sake of explanation, the phosphor 210, the adhesive member 240, and the substrate 340 are omitted.

[0039] The operating principle of the radiation imaging device 100 is the same as in the first and second embodiments, so a description will be omitted. The differences from the first and second embodiments will be described in detail below.

[0040] In the third embodiment, the tiling boundaries 600 of the photoelectric conversion members 301, 302, 303, and 304 are offset from the tiling boundaries 600 of the partition phosphor members 201, 202, 203, and 204. In other words, their tiling boundaries do not overlap in the direction of radiation incidence. On the other hand, in the second embodiment, their tiling boundaries overlap in the direction of radiation incidence.

[0041] In this embodiment, it is possible to suppress a region where both the light-emitting portion adjacent to the tiling boundary of the partition phosphor member and the light-receiving portion adjacent to the tiling boundary of the photoelectric conversion member become small. On the other hand, the region where the light-emitting portion or the light-receiving portion becomes small increases. Therefore, when there are a plurality of tiling boundaries of the partition phosphor member and the photoelectric conversion member, the second embodiment and the third embodiment may be selectively used as necessary.

[0042] FIG. 10 is a cross-sectional view of the radiation imaging apparatus 100 that supplements this embodiment. As described above, a plurality of light-receiving portions 310 corresponding to the width of the light-emitting portion (specifically, the phosphor 210) partitioned by the partition member 220 may be provided. In that case, the distance Q is the distance between the ends when a plurality (two in FIG. 10) of light-receiving portions 310 corresponding to the width of the phosphor 210 partitioned by the partition member 220 are grouped together. Further, the distance Q' is the distance between the left end of the pixel 310 corresponding to the width of the outermost phosphor 210 and the end of the photoelectric conversion member to which the pixel 310 belongs.

[0043] Also, as shown in FIG. 3, the number of photoelectric conversion elements 320 in the pixel 310 may be single or plural.

[0044] With such a configuration, it is possible to both reduce the tiling boundary 600 and prevent the light-emitting portion and the light-receiving portion from shifting in the direction perpendicular to the X-ray incidence, thereby suppressing data loss. That is, it becomes possible to provide a high-quality radiation imaging apparatus.

[0045] FIG. 11 is a conceptual diagram of an X-ray diagnostic system (radiation imaging system) using the radiation detection device according to the present invention. X-rays 711 as radiation generated by an X-ray tube 710 (radiation source) pass through the chest 721 of a patient or subject 720 and enter the radiation imaging device 100 of the present invention including a phosphor portion 200. This incident X-ray contains information on the internal body of the patient 720. The phosphor portion 200 emits light in response to the incidence of the X-ray, and this is photoelectrically converted to obtain electrical information. This information is converted into a digital signal and image-processed by an image processor 730, which is a control device, and can be observed on a display 740, which is a display means in a control room. Note that the radiation imaging system has at least a radiation detection device and signal processing means for processing signals from the radiation detection device.

[0046] Further, this information can be transferred to a remote location by transmission processing means such as a telephone line 750, and can be displayed on a display 741, which is a display means such as a doctor's room in another location, or stored in a recording means such as an optical disk, and it is also possible for a doctor in a remote location to make a diagnosis. It can also be recorded on a film 761, which is a recording medium, by a film processor 760, which is a recording means.

[0047] The present invention is not limited to the above-described embodiments, and various changes and modifications are possible without departing from the spirit and scope of the present invention. Therefore, in order to publicize the scope of the present invention, the following claims are attached.

[0048] This application claims priority based on Japanese Patent Application No. 2024-205451 filed on November 26, 2024, and incorporates all of the description thereof herein.

[0049] 100 Radiation imaging device 201, 202, 203, 204 Partition phosphor member 210 Phosphor 220 Partition member 230 Light-emitting portion 301, 302, 303, 304 Photoelectric conversion member 310 Light-receiving portion 320 Photoelectric conversion element 600 Tiling boundary 730 Image processor (signal processing means)

Claims

1. A radiation imaging apparatus comprising: a plurality of partition phosphor members, each having a plurality of light-emitting parts comprising a partition wall having an opening region and a phosphor located in the opening region; and a photoelectric conversion member, each having a plurality of light-receiving parts comprising a photoelectric conversion element that converts light into an electrical signal, wherein the plurality of partition phosphor members are arranged facing the photoelectric conversion member and side by side, and each partition phosphor member has a width in at least one direction in the side-by-side direction of the light-emitting part adjacent to the side-by-side part of the partition phosphor member that is smaller than the width of the other light-emitting parts.

2. The radiation imaging apparatus according to claim 1, characterized in that it has a plurality of photoelectric conversion members, the plurality of photoelectric conversion members facing the partition phosphor member and arranged side by side with each other.

3. The radiation imaging apparatus according to claim 2, characterized in that each photoelectric conversion member has a width in at least one direction in the direction of parallel installation of the light receiving portion adjacent to the portion of the photoelectric conversion member that is installed side by side with other photoelectric conversion members that is smaller than the width of the other light receiving portion.

4. The radiation imaging apparatus according to claim 3, characterized in that the arrangement pitch of the plurality of light-emitting units is equal to the arrangement pitch of the plurality of light-receiving units.

5. The radiation imaging apparatus according to claim 3, characterized in that a first partition phosphor member and a second partition phosphor member among a plurality of partition phosphor members are arranged side by side, and a first light-emitting unit located adjacent to the side-by-side portion of the first partition phosphor member and a second light-emitting unit located adjacent to the side-by-side portion of the second partition phosphor member are located separately.

6. The radiation imaging apparatus according to claim 5, characterized in that the distance between the first light-emitting unit and the second light-emitting unit is different from the width of the light-receiving unit.

7. The radiation imaging apparatus according to claim 1, characterized in that the photoelectric conversion element is an avalanche photodiode.

8. The radiation imaging apparatus according to claim 1, characterized in that the partition wall includes a metallic material or a semiconductor material.

9. The radiation imaging apparatus according to claim 5, characterized in that a first photoelectric conversion member and a second photoelectric conversion member among a plurality of photoelectric conversion members are arranged side by side, and a first light receiving unit located adjacent to the side-by-side portion of the first photoelectric conversion member and a second light receiving unit located adjacent to the side-by-side portion of the second photoelectric conversion member are located separately.

10. The radiation imaging apparatus according to claim 9, characterized in that the region between the first light-emitting unit and the second light-emitting unit and the region between the first light-receiving unit and the second light-receiving unit are located in an overlapping position in the direction of radiation incidence.

11. The radiation imaging apparatus according to claim 9, characterized in that the region between the first light-emitting unit and the second light-emitting unit and the region between the first light-receiving unit and the second light-receiving unit are located without overlapping in the direction of radiation incidence.

12. The radiation imaging apparatus according to claim 1, characterized in that a plurality of the photoelectric conversion elements are arranged within the light receiving section.

13. A radiation imaging apparatus comprising: a partition phosphor member having a plurality of partition walls having an opening region and a plurality of phosphors located in the opening region; and a plurality of photoelectric conversion members, each having a plurality of light-receiving sections equipped with a photoelectric conversion element that converts light into an electrical signal, wherein the plurality of photoelectric conversion members are arranged facing the partition phosphor member and side by side, and each photoelectric conversion member has a width in at least one direction in the side-by-side direction of the light-receiving section adjacent to the side-by-side section smaller than the width of the other light-receiving section, and a width of the light-emitting section facing the light-receiving section adjacent to the side-by-side section smaller than the width of the other light-emitting section.

14. A radiation imaging system comprising a radiation imaging device according to claim 1, and a control device that acquires an image signal from the radiation imaging device and processes the acquired image signal.

15. A partition phosphor member having a plurality of light-emitting parts, each comprising a partition wall having an opening region and a phosphor located in the opening region that generates light upon irradiation with radiation, wherein the plurality of light-emitting parts are arranged in a matrix, and the width of the light-emitting part located on the outermost edge of the matrix is ​​smaller than the width of the other light-emitting parts.

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