Printed circuit board with inlay for mounting same on a carrier, in particular a heat sink

Abstract

The present invention relates to a printed circuit board comprising an inlay in order to allow simplified, robust and cost-efficient mounting of a printed circuit board (PCB) on a carrier, in particular a heat sink. Furthermore, a lighting module, in particular a replaceable lighting module, for a motor vehicle and comprising such a printed circuit board mounted on a carrier is provided.

Description

[0001] 2024 PF01093

[0002] 1

[0003] Conductor plate with inlay for mounting the same on a carrier, especially heat sinks

[0004] The present application claims priority from the German Pa¬

[0005] 5 tent application No. 10 2024 135 857 . 2 dated December 3, 2024, the disclosure content of which is hereby incorporated into the present application by reference.

[0006] The present invention relates to a printed circuit board comprising an inlay to enable simplified, robust and cost-effective mounting of a printed circuit board (PCB) on a substrate, in particular a heat sink. Furthermore, a lighting module, in particular an interchangeable lighting module, for a motor vehicle is provided, which comprises such a printed circuit board mounted on a substrate.

[0007] BACKGROUND

[0008] The need to securely and permanently mount printed circuit boards to, for example, a heat sink, is of central importance in heat-intensive applications such as power electronics. High thermal loads arise here, requiring efficient heat dissipation to ensure the lifespan and functional stability of the electronic components. An optimal connection must therefore guarantee excellent heat transfer while simultaneously withstanding mechanical stresses – requirements that are particularly important in the automotive industry.

[0009] Conventional joining methods, such as screwing, riveting, or gluing, of a printed circuit board (PCB) to a substrate / heat sink usually have significant disadvantages. Screw connections require additional materials and precise alignment, which increases assembly effort and production costs. Screws and rivets also put mechanical stress on PCBs and can lead to potential damage. Adhesive bonding, especially in the automotive sector, has particularly high requirements. The adhesive bonds must meet high fatigue strength requirements without the adhesive outgassing and without any change in the electrical properties. 2024 PF01093

[0010] Two fresh or thermal properties of the bond come into play. To meet these requirements, high-quality adhesives are needed, which often only achieve their permanent strength in conjunction with a baking process.

[0011] 5

[0012] However, this curing process leads to further challenges: the high temperatures can damage sensitive components on the circuit board, and additional process steps such as heating, tempering, and cooling are not only time-consuming and energy-intensive but also significantly increase production costs. Overall, bonding generally requires a complex process chain with upstream steps, which is particularly costly in mass production.

[0013] There is therefore a need to provide a printed circuit board, especially for a lighting module for a motor vehicle, that counteracts at least one of the aforementioned problems.

[0014] SUMMARY OF THE INVENTION

[0015] This need is addressed by the subject matter of the independent patent claims. Further developments and embodiments of the proposed principle are specified in the dependent claims.

[0016] The core idea of ​​the present invention is to integrate an inlay into a printed circuit board (PCB), in particular by bonding or encapsulating it, to enable simplified, robust, and cost-effective mounting of the PCB by means of a clamping connection onto a dome protruding from a support, in particular a heat sink of an LED lighting module. Thanks to the clamping connection, the use of adhesives or additional fasteners (e.g., screws, rivets, etc.) can be dispensed with, making the connection simple yet reliable. Five advantages that can result from the present invention are:

[0017] - Easy assembly process; 2024 PF01093

[0018] 3

[0019] - No additional adjustment of the circuit board relative to the substrate is necessary;

[0020] - Form-fit connection between circuit board and substrate;

[0021] - Permanently strong connection between circuit board and substrate;

[0022] 5 - No baking processes are necessary to create the connection between the circuit board and the substrate;

[0023] - No outgassing of adhesives;

[0024] - Integration of components into printed circuit boards (PCB or leadframe) is enabled;

[0025] - An electrical connection between the circuit board and the substrate can be made via the inlay (grounding);

[0026] - No upstream processes are necessary for an adhesive bonding process;

[0027] - No detachment of the printed circuit board from the substrate as a result of a CTE mismatch between the printed circuit board and the substrate;

[0028] - Insertion forces are reliably absorbed;

[0029] - Very low board heights are achievable;

[0030] Forces can be absorbed in all directions (X, Y, Z);

[0031] Good heat dissipation can be achieved, especially through the use of additional thermally conductive materials.

[0032] According to a first aspect, a printed circuit board (PCB) is proposed. The PCB comprises at least one electrically conductive layer, at least one insulating layer arranged on the at least one electrically conductive layer, and a plurality of contact pads on the at least one insulating layer. The contact pads are formed by regions of the at least one electrically conductive layer and / or electrically coupled to regions of the at least one electrically conductive layer. Furthermore, the PCB comprises at least one inlay that is at least partially embedded in the PCB and extends through the at least one electrically conductive layer and the at least one insulating layer.The at least one inlay has at least one mechanical connecting element configured to form a direct and, in particular, releasable clamping connection with a dome extending from an external base body. 2024 PF01093.

[0033] 4

[0034] The printed circuit board (PCB) can serve as a carrier for electronic and / or optoelectronic components (e.g., a semiconductor light source or an LED module) and / or a driver circuit and / or at least a connector element. The PCB can

[0035] 5. In particular, they serve for the mechanical fastening and electrical connection of the aforementioned elements. According to some aspects, the printed circuit board therefore comprises a multitude of electronic and / or optoelectronic components arranged on the circuit board, each of which is in electrically conductive contact with at least one of the multitude of contact surfaces.

[0036] The printed circuit board (PCB) can be, for example, a classic FR4 PCB or a metal PCB. The PCB can be, for example, a single-sided or double-sided PCB, or a multilayer PCB with several layers. Furthermore, all other conventional types of PCBs are also conceivable.

[0037] According to certain aspects, at least one mechanical connecting element is designed to form a clamping connection with a cylindrical dome. The dome, which extends from an external base body, e.g., the heat sink of an LED lighting module, and on which the circuit board is to be arranged by means of a clamping connection, can in particular be cylindrical. The at least one mechanical connecting element can be shaped and / or arranged or designed accordingly to form a clamping connection with such a dome.

[0038] According to some aspects, the at least one mechanical connecting element is designed to form a clamping connection with a dome extending from an external base body with a polygonal cross-section. The dome, extending from an external base body, e.g., the heat sink of an LED lighting module, and on which the circuit board is to be arranged by means of a clamping connection, can in particular have a polygonal cross-section. The at least one mechanical connecting element can be designed accordingly. 2024 PF01093

[0039] 5. shaped and / or arranged or designed to form a clamping connection with such a dome.

[0040] According to some aspects, at least one inlay exhibits a multitude of features.

[0041] 5 of mechanical connecting elements. The mechanical connecting elements can, for example, be arranged rotationally symmetrically about a central axis of the at least one inlay; however, the mechanical connecting elements can also be arranged axially symmetrically or asymmetrically to each other. For example, the mechanical connecting elements can be formed by adjacent segments of a segmented ring, similar to a clamping washer. In particular, the at least one inlay can be designed in a manner comparable to a clamping washer embedded in the printed circuit board.

[0042] According to some aspects, at least one mechanical connecting element has a clamping surface designed to engage in the clamping connection, wherein the clamping surface at least partially replicates an outer surface of the dome, or wherein the clamping surface is formed by a flat surface. Alternatively, it is also conceivable that the clamping surface is designed differently, for example by two or more converging surfaces or by a differently curved surface, in order to achieve a clamping effect with the dome.

[0043] According to some aspects, the at least one mechanical connecting element leaves a through-hole open through the at least one inlay, wherein the through-hole has, at least in some areas, a distance between opposing inner surfaces of the through-hole that is less than or equal to a diameter or a distance between opposing outer surfaces of the dome for the clamping connection. In particular, a through-hole can run through the at least one inlay that is less than or equal to the outer dimensions of the dome, so that joining or fitting together the inlay and the dome is possible, but separating the inlay from the dome is not easily possible. For this purpose, it can be provided, for example, that the at least one mechanical connecting element is designed to be flexible or deformable in order to allow slight deformation of the at least one mechanical connecting element during joining or fitting together. 2024 PF01093

[0044] 6. To allow the inlay and the dome to fit together, thereby creating a clamping effect and / or a tilting between the inlay and the dome.

[0045] According to some aspects, at least one inlay has an exterior.

[0046] 5. The outer circumference includes at least one step, wherein at least the inwardly offset portion of the step is embedded in the printed circuit board. The step can, in particular, be designed to provide a stop for pressing and / or gluing the at least one inlay into the printed circuit board. Furthermore, the step can provide improved retention of the at least one inlay in the printed circuit board, for example, to better withstand insertion forces.

[0047] According to some aspects, at least one inlay is essentially flush with a top and / or bottom surface of the printed circuit board. However, at least one inlay can also extend beyond the top and / or bottom surface of the printed circuit board.

[0048] According to certain aspects, at least the outer circumference of the at least one inlay is rotationally symmetrical about a central axis of the at least one inlay, in particular cylindrical or with a polygonal cross-section. Especially in the latter case, namely a polygonal cross-section of the outer circumference of the at least one inlay, larger rotational forces can be absorbed by the inlay on the printed circuit board or vice versa. This can be particularly advantageous if the printed circuit board is attached to a dome solely by means of an inlay and the dome or the inlay is designed in such a way that rotation of the printed circuit board about the dome is prevented in the mounted state.

[0049] According to some aspects, at least one inlay is glued or embedded in the printed circuit board. However, the inlay may also be pressed into the printed circuit board, or at least one inlay may be integrated into the printed circuit board in some other way. 5

[0050] According to some aspects, at least one inlay is formed from a thermally conductive material. This makes it possible to achieve a result in 2024 PF01093.

[0051] 7. Heat generated on the circuit board is transferred via the inlay to the dome and thus to the substrate or heat sink. Additionally, other thermally conductive materials such as pastes can be used to further improve the thermal conductivity between the circuit board and the substrate.

[0052] 5 increase. For example, at least one inlay can be formed from a thermally conductive material that has a thermal conductivity of at least 15W / m*K.

[0053] According to some aspects, at least one inlay is formed by an electrically conductive material, and at least one inlay is in electrically conductive contact with at least one area of ​​the at least one electrically conductive layer. For example, a ground potential can be provided for the printed circuit board via the at least one inlay.

[0054] According to certain aspects, the printed circuit board comprises at least two inlays, which are at least partially embedded in the board and extend through the at least one electrically conductive layer and the at least one insulating layer. Each of the at least two inlays has at least one mechanical connecting element configured to form a direct and, in particular, releasable clamping connection with a dome extending from an external base body. In particular, the inlays may be inlays according to some of the aspects already mentioned. The at least two inlays may be arranged to facilitate easy mounting of the printed circuit board on a substrate and / or to enable the best possible fixation of the printed circuit board on a substrate, especially with regard to preventing tilting and / or rotation of the printed circuit board relative to the substrate.

[0055] Furthermore, an LED lighting module, in particular an interchangeable LED lighting module, for a motor vehicle is proposed. The LED lighting module comprises a base body, in particular a heat sink, from which at least one dome extends. The LED lighting module also comprises a printed circuit board according to some of the aforementioned aspects, wherein the printed circuit board is arranged on the at least one dome such that 2024 PF01093

[0056] 8. The at least one mechanical connecting element forms a direct and, in particular, releasable clamping connection with the at least one dome. In particular, at least one LED light source is arranged on the circuit board and / or the base body, which is designed for this purpose.

[0057] 5 is to emit light of one or more desired wavelengths.

[0058] The LED light module can be, in particular, an LED light source for, for example, a vehicle headlight, which, in the event of a defect, can be replaced by a layperson without much effort and without having to visit a workshop. The LED light module and a corresponding holding device are designed in such a way that the holding device securely holds the LED light module in a designated position during normal use, but that the LED light module can be easily detached from the holding device in the event of a defect.The mounting device and the LED light module include, for example, support surfaces, contact areas, and fastening elements that are arranged and designed in such a way that the LED light module cannot slip or tilt relative to the mounting device when installed, but can be easily and repeatedly removed from the mounting device by actuating one of the fastening elements. Furthermore, the support surfaces, contact areas, and fastening elements can be arranged and designed in such a way that simple and precise mounting and fastening of the LED light module is possible.

[0059] The minimum LED light source can, for example, comprise one or more light-emitting diodes (LEDs). However, multiple light-emitting diodes or semiconductor light sources can also be arranged on the circuit board and / or the base body. The LED light sources can, in particular, be LED-based light sources.

[0060] BRIEF DESCRIPTION OF THE DRAWINGS 5

[0061] Further aspects and embodiments according to the proposed principle will be discussed in relation to the various embodiments and details of 2024 PF01093

[0062] Nine games are revealed, which are described in detail in conjunction with the accompanying drawings.

[0063] Fig. 1 shows an isometric view of an LED lighting module according to the proposed principle;

[0064] 5

[0065] Fig. 2 shows a sectional view of an LED lighting module according to the proposed principle; and

[0066] Figures 3A and 3B each show a detailed view of an LED-

[0067] Lighting module according to the proposed principle.

[0068] DETAILED DESCRIPTION

[0069] The following embodiments and examples illustrate various aspects and their combinations according to the proposed principle. The embodiments and examples are not always to scale. Likewise, various elements may be enlarged or reduced to highlight individual aspects. It is understood that the individual aspects and features of the embodiments and examples shown in the figures can readily be combined without affecting the principle of the invention. Some aspects have a regular structure or shape. It should be noted that in practice, minor deviations from the ideal shape may occur without contradicting the inventive idea.

[0070] Furthermore, the individual figures, features, and aspects are not necessarily depicted at the correct size, and the proportions between the individual elements may not be entirely accurate. Some aspects and features are emphasized by being shown enlarged. However, terms such as "above," "above," "below," "below," "larger," "smaller," and the like are correctly represented in relation to the elements in the figures. Thus, it is possible to deduce such relationships between the elements from Figure 5. 2024 PF01093

[0071] 10

[0072] Figure 1 shows an isometric view of an LED light module 20 according to the proposed principle, while Figure 2 shows a sectional view of the light module 20. Figures 3A and 3B also show a detailed view of a clamping connection between a circuit board 1 and a

[0073] Figure 5 shows the dome 7 projecting from a base body 8, once as an isometric sectional view and once as a top view of this clamping connection. The lighting module 20 can, in particular, be a light source for a headlight, a taillight, or a turn signal for a motor vehicle, and comprises a circuit board 1 and a base body 8, which are directly and, in particular, releasably connected to each other by means of a clamping connection. The circuit board 1 and the base body 8 are connected to each other or interact in such a way that the circuit board 1 is essentially fixed in position relative to the base body 8 without the need for adhesives or other fastening means beyond the clamping connection.

[0074] The printed circuit board 1 comprises at least one electrically conductive layer 2 and at least one insulating layer 3, which is arranged on the at least one electrically conductive layer 2. Furthermore, a plurality of contact surfaces 4 are arranged or formed on the at least one insulating layer 3, which are formed by regions of the at least one electrically conductive layer 2 and / or are electrically coupled to regions of the at least one electrically conductive layer 2. The printed circuit board 1 serves as a carrier for electronic and / or optoelectronic components 9a, 9b, for example, to provide a light source 9b and an associated driver circuit for the lighting module 20. The printed circuit board serves for the mechanical mounting and electrical connection of the electronic and / or optoelectronic components 9a, 9b.The arrangement, shape, and number of contact surfaces 4 and components 9a, 9b shown in the figures are merely exemplary and can be adapted and modified according to requirements. 5 The circuit board 1 can, for example, be a conventional FR4 circuit board or a metal circuit board. The circuit board can, for example, be a single-sided or a double-sided circuit board. 2024 PF01093.

[0075] 11. The circuit board may be formed by a single-sided board or by a multilayer printed circuit board with several layers. In the case shown, the circuit board is designed as a single-sided FR4 printed circuit board comprising an electrically conductive layer 2 and an insulating layer 3, which is mounted on the electrically conductive

[0076] 5 capable layer 2 is arranged .

[0077] The printed circuit board also includes two inlays 5, which are embedded in the printed circuit board 1 and extend through the electrically conductive layer 2 and the insulating layer 3. Each inlay has a plurality of mechanical connecting elements 6, which are arranged rotationally symmetrically around a central axis 10 of the inlays 5. In particular, the mechanical connecting elements 6 are formed by adjacent segments of a segmented ring, similar to a clamping washer. However, the number of inlays 5 shown here is also to be considered exemplary, and it is also possible to provide a corresponding clamping connection using only one inlay 5 or using more than two inlays 5.

[0078] The mechanical connecting elements 6 of an inlay 5 are designed and arranged to form a direct clamping connection with a dome 7 extending from the base body 8. For this purpose, the mechanical connecting elements 6 of an inlay 5 are designed and arranged such that they leave a through-hole 13 through the at least one inlay 5, into which the dome 7 can be inserted. After the circuit board is pressed onto the domes 7, the clamping surfaces 11 of the mechanical connecting elements 6 interlock with the outer surfaces 12 of the domes 7, creating a clamping connection between the inlays 5 and the domes 7. The through-holes 13 can be smaller than or equal to the outer dimensions of the corresponding dome 7, so that while it is possible to join or connect the inlays 5 and the domes 7, it is not easily possible to detach the inlays 5 from the domes 7.For example, it may be provided that the mechanical connecting elements 6 are designed to be flexible or deformable in order to allow slight deformation when the inlays 5 and the domes 7 are brought together or fitted together, thereby creating a clamping effect and / or a tilting action between the inlays 5 and the domes 7. 2024 PF01093.

[0079] 12

[0080] In the case shown, the domes 7 are cylindrical; however, it is also possible that they have a polygonal cross-section in a direction perpendicular to the central axis 10, e.g., hexagonal.

[0081] 5 This allows, for example, rotational forces acting on the circuit board 1 to be transferred more effectively to the domes 7 or to the base body 8. Furthermore, in the illustrated case, the clamping surfaces 11 of the mechanical connecting elements 6 are designed as flat surfaces; however, it is also possible that the clamping surfaces 11 or parts thereof are designed according to the outer surface 12 of the domes or are at least adapted to or approximated by their shape. The invention is not to be understood as restrictive in this respect, and any conceivable combination of clamping surface shape and outer contour of the domes that provides a corresponding clamping effect between the circuit board and the base body is also conceivable.

[0082] For example, it is conceivable that the inlays 5, or one of the inlays 5, has only a single mechanical connecting element 6, which is ring-shaped and thus fully or partially engages in a clamping action with the dome 7. Likewise, it is conceivable that only two opposing mechanical connecting elements 6 of an inlay engage in a clamping action with the dome 7, whereby, for better centering of the dome 7 relative to the inlay 5, at least one of the mechanical connecting elements 6 can at least partially conform to the outer contour of the dome 7. Similarly, other combinations of domes 7 and inlays 5 are also conceivable, which on the one hand provide a clamping action between the circuit board and the base body and on the other hand center the inlays 5 relative to the domes 7.

[0083] The inlays 5 have a step 14 on their outer circumference, wherein the inwardly offset area 15 of the step 14 is integrated into the electrically conductive layer 2 in the illustrated case, and the outwardly offset area of ​​the step is embedded in the electrically insulating layer 3. Accordingly, the inlays 5 rest on the electrically conductive layer 2 and are embedded in the electrically insulating layer 3. Furthermore, in the illustrated case, the inlays 5 are integrated into the printed circuit board 1 such that they are essentially flush with 2024 PF01093.

[0084] The inlays 13 terminate in a top surface 16 and a bottom surface 17 of the printed circuit board 1. This specific embodiment is, however, to be understood as exemplary, and the step can also be designed differently; for example, the inlays can be integrated into the printed circuit board only with the recessed area 15 of the step 14, and correspondingly, an outwardly offset area of ​​the step 14 can rest on the printed circuit board 1. Furthermore, it is also only to be understood as exemplary that the inlays are essentially flush with the top surface 16 and the bottom surface 17, and it is also possible that they terminate only with the top surface 16 or the bottom surface 17, or with neither the top surface 16 nor the bottom surface 17. The inlays 5 can, for example, be pressed, cast, or glued into the printed circuit board 1.

[0085] Furthermore, it is merely an example that the inlays 5 have an outer circumference that is rotationally symmetrical, in particular cylindrical, around the central axis 10 of the inlays. It is also conceivable that the inlays have an outer circumference with a polygonal cross-section or another asymmetrical shape. A polygonal cross-section of the outer circumference of the inlays 5 allows larger rotational forces to be absorbed from the inlay 5 to the circuit board 1, or vice versa. This can be particularly advantageous if the circuit board 1 is attached to a dome 7 by means of only one inlay 5, and the dome 7 or the inlay 5 is designed in such a way as to prevent rotation of the circuit board 1 around the dome 7 when mounted.

[0086] 2024 PF01093

[0087] - 14 -

[0088] REFERENCE MARK LIST

[0089] 1 circuit board

[0090] 2 electrically conductive layers

[0091] 3 insulating layers

[0092] 4 Contact area

[0093] 5 Inlay

[0094] 6 mechanical connecting element

[0095] 7 Cathedral

[0096] 8 basic shapes

[0097] 9a, 9b electronic / optoelectronic component

[0098] 10 Central axis

[0099] 11 clamping surface

[0100] 12 outdoor area

[0101] 13 Through hole

[0102] Level 14

[0103] 15 area

[0104] 16 Top

[0105] 17 Underside

[0106] 20 LED light modules

Claims

2024PF01093 - 15 - PATENT CLAIMS 1. Printed circuit board (1) comprising: at least one electrically conductive layer (2) ; 5 at least one insulating layer (3) arranged on the at least one electrically conductive layer (2); a plurality of contact surfaces (4) on the at least one insulating layer (3), wherein the contact surfaces (4) are formed by regions of the at least one electrically conductive layer (2) and / or are electrically coupled to regions of the at least one electrically conductive layer (2); and at least one inlay (5) which is at least partially embedded in the printed circuit board (1) and extends through the at least one electrically conductive layer (2) and the at least one insulating layer (3), wherein the at least one inlay (5) has at least one mechanical connecting element (6) configured to form a direct and, in particular, releasable clamping connection with a dome (7) extending from an external base body (8).

2. Printed circuit board according to claim 1, further comprising a plurality of electronic and / or optoelectronic components (9a, 9b) arranged on printed circuit board (1) and each in electrically conductive contact with at least one of the plurality of contact surfaces (4).

3. Printed circuit board according to claim 1 or 2, wherein the at least one mechanical connecting element (6) is designed to form a clamping connection with a cylindrical dome (7).

4. Printed circuit board according to claim 1 or 2, wherein the at least one mechanical connecting element (6) is designed to form a clamping connection with a dome (7) which extends from an external base body (8) with a polygonal cross-section. 2024PF01093 16 5. Printed circuit board according to one of the preceding claims, wherein the at least one inlay (5) has a plurality of mechanical connecting elements (6). 5 6. Printed circuit board according to claim 5, wherein the mechanical connecting elements (6) are arranged rotationally symmetric about a central axis (10) of the at least one inlay (5).

7. Printed circuit board according to claim 5 or 6, wherein the mechanical connecting elements (6) are formed by adjacent segments of a segmented ring.

8. Printed circuit board according to one of the preceding claims, wherein the at least one mechanical connecting element (6) has a clamping surface (11) which is designed to enter the clamping connection, wherein the clamping surface (11) at least partially replicates an outer surface (12) of the dome (7), or wherein the clamping surface (11) is formed by a flat surface.

9. Printed circuit board according to one of the preceding claims, wherein the at least one mechanical connecting element (6) leaves a through hole (13) through the at least one inlay (5), and wherein the through hole (13) has at least in some areas a distance between opposing inner surfaces of the through hole (13) which is less than or equal to a diameter or distance between opposing outer surfaces of a dome (7) for entering the clamping connection.

10. Printed circuit board according to one of the preceding claims, wherein the at least one inlay (5) has a step (14) on its outer circumference, and wherein at least the inwardly offset region of the step (15) is embedded in the printed circuit board (1).

11. Printed circuit board according to one of the preceding claims, 2024PF01093 17 wherein at least one inlay (5) is substantially flush with a top surface (16) and / or a bottom surface (17) of the printed circuit board (1). 5 12. Printed circuit board according to one of the preceding claims, wherein at least the outer circumference of the at least one inlay (5) is rotationally symmetrical about a central axis (10) of the at least one inlay (5), in particular cylindrical or with a polygonal cross-section.

13. Printed circuit board according to one of the preceding claims, wherein the at least one inlay (5) is glued or cast into the printed circuit board (1).

14. Printed circuit board according to one of the preceding claims, wherein the at least one inlay (5) is formed by a thermally conductive material.

15. Printed circuit board according to one of the preceding claims, wherein the at least one inlay (5) is formed by an electrically conductive material, and wherein the at least one inlay (5) is in electrically conductive contact with at least one region of the at least one electrically conductive layer (2).

16. Printed circuit board according to one of the preceding claims, comprising at least two inlays (5) which are at least partially embedded in the printed circuit board (1) and extend through the at least one electrically conductive layer (2) and the at least one insulating layer (3), wherein the at least two inlays (5) each have at least one mechanical connecting element (6) which is configured to form a direct and, in particular, releasable clamping connection with a dome (7) extending from an external base body (8).

17. LED lighting module (20), in particular a replaceable LED lighting module, for a motor vehicle comprising: 2024PF01093 - 18 - a base body (8), in particular a heat sink, from which at least one dome (7) extends; and a printed circuit board (1) according to one of the preceding claims; wherein the printed circuit board (1) is mounted on the at least one dome (7) such that 5 is arranged such that the at least one mechanical connecting element (6) forms a direct and, in particular, releasable clamping connection with the at least one dome (7); and wherein at least one LED light source (9b) is arranged on the circuit board (1) and / or the base body (8). 0

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