Method, apparatus and system for detecting appearance defects of circuit board, and device and medium

By employing a two-stage alignment process, the circuit board test pattern is precisely corrected to determine the area to be inspected, thus solving the problem of insufficient efficiency and accuracy in detecting appearance defects on circuit boards in existing technologies, and achieving more efficient and accurate defect detection.

WO2026123268A1 Publication Date: 2026-06-18GUANGZHOU SHIYUAN ELECTRONICS CO LTD +1
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Patent Information

Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
GUANGZHOU SHIYUAN ELECTRONICS CO LTD
Filing Date
2024-12-11
Publication Date
2026-06-18

AI Technical Summary

⚠Technical Problem

In existing technologies, the efficiency and accuracy of circuit board appearance defect detection are low. In particular, when the alignment process is not precise enough, non-defective areas are easily misjudged as defects, resulting in long detection time and inaccuracy.

⚗Method used

A two-stage alignment processing scheme is adopted. First, alignment is performed according to image blocks to reduce global errors. Then, precise alignment is performed according to the contour to correct the test image and determine the area to be detected. Defect detection is performed only in this area.

🎯Benefits of technology

It improves the accuracy and efficiency of defect detection, avoids wasting resources on areas that do not need to be inspected, saves inspection time, and improves the accuracy of overall inspection results.

✦ Generated by Eureka AI based on patent content.

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Abstract

Provided in the present application are a method, apparatus and system for detecting appearance defects of a circuit board, and a device and a medium. The method comprises: acquiring a test image of a circuit board and a corresponding template image; performing alignment processing on the test image and the template image according to image blocks, so as to obtain a first alignment result; on the basis of the first alignment result, and according to contours, performing alignment processing on test element objects in image blocks belonging to the test image and template element objects in image blocks belonging to the template image, so as to obtain a second alignment result; on the basis of the second alignment result, correcting the test image, so as to obtain a target test image; determining a region to be subjected to detection in the target test image, wherein the region to be subjected to detection is a region in the target test image excluding a mapped region, and the mapped region is a region obtained by means of mapping a pre-marked shielding region in the template image onto the target test image; and performing defect detection on the region to be subjected to detection, so as to obtain a defect detection result. The method can improve the accuracy and detection efficiency of appearance defect detection of circuit boards.
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