Backscatter imaging device based on dual detectors
By combining a backscatter imaging detector and a linear array imaging detector in a dual-detector design, the problem of insufficient image clarity and resolution in backscatter imaging systems is solved, enabling efficient differentiation of matter and high-definition identification of fine structures.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- SUZHOU POWERSITE ELECTRIC CO LTD
- Filing Date
- 2025-06-30
- Publication Date
- 2026-06-18
Smart Images
Figure CN2025105921_18062026_PF_FP_ABST
Abstract
Description
A backscatter imaging device based on dual detectors
[0001] Cross-references to related applications
[0002] This application claims priority to Chinese Patent Application No. 202411810921.4, filed on December 10, 2024, entitled "A Backscatter Imaging Device Based on Dual Detectors", the entire contents of which are incorporated herein by reference. Technical Field
[0003] This application relates to the field of detector technology, and more specifically to a backscatter imaging device based on dual detectors. Background Technology
[0004] X-ray backscatter imaging technology has been widely used in the field of security inspection of people, goods and vehicles due to its advantages such as low radiation dose, good safety and sensitivity to lightweight materials.
[0005] X-ray backscattering imaging technology obtains images of materials within a certain depth on the surface of an object by detecting the intensity of X-ray scattering by different materials.
[0006] The backscattering inspection system includes an X-ray source and a detector. The X-rays emitted by the X-ray source are formed into a beam by a beamforming device and scan the surface of the object to be inspected point by point. The detector receives the scattered signals from the object and forms a depth image of the object's surface.
[0007] Existing backscatter inspection systems are mostly used in fixed security inspection equipment for containers, vehicles, personnel, and parcels. With advancements in X-ray source and detector technology, backscatter inspection systems have become miniaturized. Portable backscatter inspection systems can be placed close to the object being inspected, scanning and imaging it from multiple angles and in all directions. Furthermore, portable backscatter inspection systems are lightweight and easy to carry, significantly expanding their application scenarios.
[0008] Based on existing backscatter imaging systems, the Compton effect is more pronounced for organics with lower atomic numbers, which can effectively distinguish organics; however, the reflected dose is very weak, and the image clarity, penetration, and resolution are much inferior to those of penetrating imaging. Summary of the Invention
[0009] In view of this, this application provides a backscatter imaging device based on dual detectors to solve the problem that the clarity, penetration and resolution of the image are much inferior to those of penetrating imaging in existing backscatter imaging systems because the reflected dose is very weak.
[0010] In a first aspect, this application provides a backscattering imaging device based on a dual-detector array, comprising:
[0011] A backscatter imaging detector includes an X-ray source, a collimator disposed at the exit of the X-ray source, and a first scintillator disposed at the exit of the X-ray source.
[0012] A robotic arm, the fixed end of which is connected to the backscatter imaging detector;
[0013] A linear array imaging detector is connected to the drive end of the robotic arm. The linear array imaging detector is located on the output side of the backscatter imaging detector, and a placement space is formed between the backscatter imaging detector and the linear array imaging detector.
[0014] The second scintillator inside the linear array imaging detector is aligned with the outlet of the backscatter imaging detector.
[0015] By combining a backscatter imaging detector and a linear array imaging detector using a robotic arm, and aligning the second scintillator inside the linear array imaging detector with the output port of the backscatter imaging detector, this design allows for the placement of the X-ray source and collimator only inside the backscatter imaging detector. When detecting an object, the object is placed within the space formed between the backscatter imaging detector and the linear array imaging detector. The X-ray source inside the backscatter imaging detector emits X-rays, which, after passing through the collimator, are projected onto the object. Part of the X-rays are reflected by the object and absorbed by the first scintillator inside the backscatter imaging detector, while the remaining part passes through the object and is absorbed by the second scintillator inside the linear array imaging detector. The data from both detectors are then integrated. This dual-detector backscatter imaging device can simultaneously detect foreign objects and, combined with the image from the linear array imaging detector, can more clearly identify the fine microstructure of objects. It overcomes the limitation of backscatter imaging detectors in distinguishing between different matter levels; by combining it with the linear array imaging detector, a single scan can achieve imaging of different energy levels, allowing for the complete separation of two objects with similar atomic numbers placed together.
[0016] In one alternative embodiment, the back of the first scintillator inside the backscatter imaging detector is protected against X-rays by a lead-based composite polymer shielding material.
[0017] To prevent X-rays from other directions from being absorbed by the first scintillator, which would affect the backscattering imaging effect of the backscattering imaging detector, a lead-based composite polymer shielding material is provided on the back of the first scintillator in this embodiment to protect against X-rays. This ensures that the first scintillator can only absorb X-rays from its front (i.e., the direction in which the aforementioned object is placed), thus guaranteeing the backscattering imaging effect.
[0018] In one alternative embodiment, the front of the first scintillator inside the backscatter imaging detector is sealed with carbon fiber for light shielding.
[0019] In one alternative embodiment, a carbon fiber panel is fixed to the outlet side of the backscatter imaging detector.
[0020] A carbon fiber panel is fixed to the exit side of the backscatter imaging detector. By fixing the carbon fiber panel to the exit side of the backscatter imaging detector, the distance to the object being measured is shortened, allowing the backscatter imaging detector to be closer to the surface of the object and receive more reflected dose.
[0021] In one alternative implementation, the collimator is horn-shaped.
[0022] In one alternative embodiment, the collimator is fixed to the housing of the backscatter imaging detector, and the collimator and the housing of the backscatter imaging detector are joined in a staggered manner.
[0023] In one optional embodiment, the outer casing of the backscatter imaging detector has a stepped surface around the outlet, and the collimator is configured such that after being inserted into the outlet, the protrusion on the periphery of the collimator abuts against the stepped surface.
[0024] The backscatter imaging detector's housing has a stepped surface around the outlet. The collimator is configured such that, after being inserted into the outlet, a protrusion on its periphery abuts against the stepped surface. By abutting the protrusion on the collimator's periphery against the stepped surface around the outlet, the gap between the outlet and the collimator can be sealed.
[0025] In one optional embodiment, the periphery of the second scintillator inside the linear array imaging detector is protected against radiation by a lead-based composite polymer shielding material, and one side of the detection area of the second scintillator is exposed.
[0026] In one alternative implementation, the robotic arm includes a plurality of interlocking sub-robotic arms.
[0027] The linear array imaging detector is connected to the backscatter imaging detector via a robotic arm, and the object to be measured is placed inside the placement space formed between the backscatter imaging detector and the linear array imaging detector. Since the size of the objects to be measured is not uniform, as shown in Figure 1, the robotic arm is composed of several interlocking sub-robotic arms to facilitate adjustment of the distance between the backscatter imaging detector and the linear array imaging detector to accommodate objects of different sizes.
[0028] The backscattering imaging device based on dual detectors provided in this application has the following advantages:
[0029] 1. The backscatter imaging device based on dual detectors provided in this application includes a backscatter imaging detector, a robotic arm, and a linear array imaging detector. The backscatter imaging detector includes a radiation source, a collimator disposed at the radiation source outlet, and a first scintillator disposed at the radiation source outlet. The fixed end of the robotic arm is connected to the backscatter imaging detector. The linear array imaging detector is connected to the drive end of the robotic arm. The linear array imaging detector is disposed on the outlet side of the backscatter imaging detector, and a placement space is formed between the backscatter imaging detector and the linear array imaging detector. The second scintillator inside the linear array imaging detector is aligned with the outlet of the backscatter imaging detector.
[0030] This dual-detector backscatter imaging device combines a backscatter imaging detector and a linear array imaging detector via a robotic arm. The second scintillator inside the linear array imaging detector is aligned with the output port of the backscatter imaging detector. This design allows for the placement of the X-ray source and collimator only within the backscatter imaging detector. When detecting an object, the object is placed within the space formed between the backscatter and linear array imaging detectors. The X-ray source inside the backscatter imaging detector emits X-rays, which, after passing through the collimator, are projected onto the object. Part of the X-rays are reflected by the object and absorbed by the first scintillator inside the backscatter imaging detector, while the remaining portion passes through the object and is absorbed by the second scintillator inside the linear array imaging detector. The data from both detectors are then integrated. This dual-detector backscatter imaging device can simultaneously detect foreign objects and, combined with the image from the linear array imaging detector, can more clearly identify the fine microstructure of objects. It overcomes the limitation of backscatter imaging detectors in distinguishing between different matter levels. By combining with the linear array imaging detector, a single scan can achieve imaging of different energy levels, allowing for the complete separation of two objects with similar atomic numbers placed together.
[0031] 2. The backscatter imaging device based on dual detectors provided in this application has X-ray protection on the back side of the first scintillator inside the backscatter imaging detector by a lead-based composite polymer shielding material.
[0032] In this dual-detector backscatter imaging device, to prevent X-rays from other directions from being absorbed by the first scintillator, which would affect the backscatter imaging effect of the backscatter imaging detector, a lead-based composite polymer shielding material is provided on the back of the first scintillator to protect it from X-rays. This ensures that the first scintillator can only absorb X-rays from its front (i.e., the direction in which the aforementioned object is placed), thus guaranteeing the backscatter imaging effect.
[0033] 3. The backscatter imaging device based on dual detectors provided in this application has a light-shielding and sealing treatment on the front of the first scintillator inside the backscatter imaging detector by carbon fiber.
[0034] This structure is based on a dual-detector backscatter imaging device, with a carbon fiber panel fixed to the output side of the backscatter imaging detector. By fixing the carbon fiber panel to the output side of the backscatter imaging detector, the distance to the object under test is shortened, allowing the backscatter imaging detector to be closer to the surface of the object under test, thus receiving more reflected dose.
[0035] 4. The backscatter imaging device based on dual detectors provided in this application has a collimator and a backscatter imaging detector housing fixed together, and the collimator and the backscatter imaging detector housing are connected by a staggered connection.
[0036] This dual-detector backscatter imaging device features a staggered design: the outer shell of the backscatter imaging detector has a stepped surface around the outlet; the collimator is configured such that, after being inserted into the outlet, a protrusion on the collimator's periphery abuts against the stepped surface. By abutting the protrusion on the collimator's periphery against the stepped surface around the outlet, the gap between the outlet and the collimator can be sealed.
[0037] 5. The backscatter imaging device based on dual detectors provided in this application includes a robotic arm comprising several articulated sub-robotic arms. The linear array imaging detector is connected to the backscatter imaging detector via the robotic arm, and the object to be measured is placed within the placement space formed between the backscatter imaging detector and the linear array imaging detector. Since the sizes of the objects to be measured vary, the robotic arm is composed of several articulated sub-robotic arms to facilitate adjustment of the distance between the backscatter imaging detector and the linear array imaging detector, adapting to objects of different sizes. Attached Figure Description
[0038] To more clearly illustrate the technical solutions in the specific embodiments of this application or the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.
[0039] Figure 1 is a schematic structural view of the backscatter imaging device based on dual detectors provided in an embodiment of this application;
[0040] Figure 2 is a schematic structural view of the X-ray source and collimator provided in the embodiments of this application;
[0041] Figure 3 is a schematic diagram of the installation of the collimator provided in the embodiments of this application.
[0042] Explanation of reference numerals in the attached figures: 1-Backscatter imaging detector; 2-Robotic arm; 3-Linear array imaging detector; 4-X-ray source; 5-Collimator; 6-Carbon fiber panel. Detailed Implementation
[0043] The technical solutions of this application will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0044] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. In addition, the technical features involved in the different embodiments of this application described below can be combined with each other as long as they do not conflict with each other.
[0045] Example
[0046] X-ray backscatter imaging technology has been widely used in the field of security inspection of people, goods and vehicles due to its advantages such as low radiation dose, good safety and sensitivity to lightweight materials.
[0047] X-ray backscattering imaging technology obtains images of materials within a certain depth on the surface of an object by detecting the intensity of X-ray scattering by different materials.
[0048] The backscattering inspection system includes an X-ray source and a detector. The X-rays emitted by the X-ray source are formed into a beam by a beamforming device and scan the surface of the object to be inspected point by point. The detector receives the scattered signals from the object and forms a depth image of the object's surface.
[0049] Existing backscatter inspection systems are mostly used in fixed security inspection equipment for containers, vehicles, personnel, and parcels. With advancements in X-ray source and detector technology, backscatter inspection systems have become miniaturized. Portable backscatter inspection systems can be placed close to the object being inspected, scanning and imaging it from multiple angles and in all directions. Furthermore, portable backscatter inspection systems are lightweight and easy to carry, significantly expanding their application scenarios.
[0050] Based on existing backscatter imaging systems, the Compton effect is more pronounced for organics with lower atomic numbers, which can effectively distinguish organics; however, the reflected dose is very weak, and the image clarity, penetration, and resolution are much inferior to those of penetrating imaging.
[0051] Therefore, this embodiment provides a backscatter imaging device based on dual detectors to solve the problem that the clarity, penetration and resolution of the image are much inferior to those of penetrating imaging in existing backscatter imaging systems because the reflected dose is very weak.
[0052] Figure 1 is a schematic structural view of the backscatter imaging device based on dual detectors provided in this embodiment. As shown in Figure 1, the backscatter imaging device based on dual detectors in this embodiment includes a backscatter imaging detector 1, a robotic arm 2, and a linear array imaging detector 3. The backscatter imaging detector 1 includes a radiation source 4, a collimator 5 disposed at the exit port of the radiation source 4, and a first scintillator disposed at the exit port of the radiation source 4. The fixed end of the robotic arm 2 is connected to the backscatter imaging detector 1. The linear array imaging detector 3 is connected to the driving end of the robotic arm 2. The linear array imaging detector 3 is disposed on the exit port side of the backscatter imaging detector 1, and a placement space is formed between the backscatter imaging detector 1 and the linear array imaging detector 3. The second scintillator inside the linear array imaging detector 3 is aligned with the exit port of the backscatter imaging detector 1.
[0053] As described above, traditional backscatter imaging systems use X-rays emitted from an X-ray source to form a beam through a beamforming device, which then scans the surface of the object being inspected point by point. The detector receives the scattered signals from the object, forming a depth image of the object's surface. However, the dose reflected back from the object is extremely weak, and the image clarity, penetration, and resolution are much inferior to those of penetrating imaging, making it impossible to effectively distinguish objects with similar densities. In this embodiment, a robotic arm 2 is used to combine a backscatter imaging detector 1 and a linear array imaging detector 3. The second scintillator inside the linear array imaging detector 3 is aligned with the output port of the backscatter imaging detector 1. This design allows for the installation of only an X-ray source 4 and a collimator 5 inside the backscatter imaging detector 1. When detecting an object, the object is placed in the space formed between the backscatter imaging detector 1 and the linear array imaging detector 3. The X-ray source 4 inside the backscatter imaging detector 1 emits X-rays, which are then collimated by the collimator 5 and projected onto the object. Some of the X-rays are reflected by the object and absorbed by the first scintillator inside the backscatter imaging detector 1, while some are absorbed by the second scintillator inside the linear array imaging detector 3 after passing through the object. The data from the backscatter imaging detector 1 and the linear array imaging detector 3 are then integrated. Based on the dual-detector backscatter imaging device, foreign objects can be detected simultaneously, and combined with the image from the linear array imaging detector 3, the fine microstructure of the object can be identified with higher resolution. To address the limitation of backscatter imaging detector 1 in distinguishing between different substances, a linear array imaging detector 3 is used. A single scan can achieve imaging of different energy levels, allowing for complete separation of two objects with similar atomic numbers placed together. The detection and imaging principles of both backscatter imaging detector 1 and linear array imaging detector 3 utilize existing technologies, which are directly used in this embodiment and will not be elaborated upon further.
[0054] In this embodiment, as described above, a standalone backscatter imaging detector 1 cannot distinguish between different substances. Therefore, this embodiment combines a multi-level linear array detector, enabling imaging of different energy levels in a single scan. Even objects with similar atomic numbers can be completely distinguished when placed together. Furthermore, other current penetration imaging techniques, such as flat-panel imaging, cannot achieve multi-energy spectrum imaging. Therefore, this embodiment selects a linear array imaging detector 3, which can achieve multi-energy spectrum imaging, allowing for a clearer view of the internal structure of objects.
[0055] In this embodiment, the back of the first scintillator inside the backscatter imaging detector 1 is protected against X-rays by a lead-based composite polymer shielding material.
[0056] To prevent X-rays from other directions from being absorbed by the first scintillator, which would affect the backscattering imaging effect of the backscattering imaging detector 1, a lead-based composite polymer shielding material is provided on the back of the first scintillator in this embodiment to protect against X-rays, so that the first scintillator can only absorb X-rays from its front (i.e., the direction in which the above-mentioned object is placed) to ensure the backscattering imaging effect.
[0057] Specifically, a partition made of lead-based composite polymer shielding material can be directly installed on the back of the second scintillator, or the outer shell of the backscatter imaging detector 1 located on the back of the second scintillator can be made of lead-based composite polymer shielding material.
[0058] In this embodiment, the front of the first scintillator inside the backscatter imaging detector 1 is sealed with carbon fiber for light shielding.
[0059] Specifically, a carbon fiber panel 6 is fixed to the outlet side of the backscatter imaging detector 1. By fixing the carbon fiber panel 6 to the outlet side of the backscatter imaging detector 1, the distance to the object under test is shortened, allowing the backscatter imaging detector 1 to be closer to the surface of the object under test, so as to receive more reflected dose.
[0060] In this embodiment, as shown in Figures 2 and 3, the collimator 5 is horn-shaped. The collimator 5 is fixed to the housing of the backscatter imaging detector 1, and the collimator 5 and the housing of the backscatter imaging detector 1 are connected in a staggered manner.
[0061] In this embodiment, the misalignment is specifically as follows: the outer shell of the backscatter imaging detector 1 has a stepped surface around the outlet, and the collimator 5 is configured such that after being inserted into the outlet, the protrusion on the periphery of the collimator 5 abuts against the stepped surface. By abutting the protrusion on the periphery of the collimator 5 against the stepped surface around the outlet, the gap between the outlet and the collimator 5 can be sealed.
[0062] In this embodiment, the second scintillator inside the linear array imaging detector 3 is protected against radiation by a lead-based composite polymer shielding material, and one side of the detection area of the second scintillator is exposed.
[0063] Similarly, to prevent external radiation from affecting the second scintillator, lead-based composite polymer shielding material is used around the second scintillator inside the linear array imaging detector 3 for radiation protection, thereby improving the imaging effect of the linear array imaging detector 3. Meanwhile, to ensure that the X-rays emitted from the radiation source 4 in the backscatter imaging detector 1 can be effectively absorbed by the second scintillator in the linear array imaging detector 3, one side of the second scintillator detection area is exposed. The aforementioned detection area refers to the direction in which the second scintillator is closest to the object being measured.
[0064] In this embodiment, the robotic arm 2 includes several interlocking sub-robotic arms 2. The linear array imaging detector 3 is connected to the backscatter imaging detector 1 via the robotic arm 2, and the object to be measured is placed inside the placement space formed between the backscatter imaging detector 1 and the linear array imaging detector 3. Since the size of the objects to be measured varies, as shown in Figure 1, the robotic arm 2 is composed of several interlocking sub-robotic arms 2 to facilitate adjustment of the distance between the backscatter imaging detector 1 and the linear array imaging detector 3, adapting to objects of different sizes.
[0065] The backscatter imaging device based on dual detectors provided in this embodiment is used as follows:
[0066] First, the object is placed within the space formed between the backscatter imaging detector 1 and the linear array imaging detector 3. Then, the X-ray source 4 inside the backscatter imaging detector 1 emits X-rays, which are then collimated by the collimator 5 and projected onto the object. Part of the X-rays are reflected by the object and absorbed by the first scintillator inside the backscatter imaging detector 1, while the rest are absorbed by the second scintillator inside the linear array imaging detector 3. The data from the backscatter imaging detector 1 and the linear array imaging detector 3 are then integrated. Based on the dual-detector backscatter imaging device, foreign objects can be detected simultaneously, and combined with the image from the linear array imaging detector 3, the fine microstructure of the object can be identified with higher resolution. This addresses the limitation of the backscatter imaging detector 1 in distinguishing between different substances. Combined with the linear array imaging detector 3, a single scan can achieve imaging of different energy levels, allowing for complete separation of two objects with similar atomic numbers placed together.
[0067] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the scope of protection of this application.
Claims
1. A backscattering imaging device based on dual detectors, characterized in that, include: The backscatter imaging detector (1) includes an X-ray source (4), a collimator (5) disposed at the exit of the X-ray source (4), and a first scintillator disposed at the exit of the X-ray source (4). A robotic arm (2), the fixed end of which is connected to the backscatter imaging detector (1); A linear array imaging detector (3) is connected to the drive end of the robotic arm (2). The linear array imaging detector (3) is located on the outlet side of the backscatter imaging detector (1), and a placement space is formed between the backscatter imaging detector (1) and the linear array imaging detector (3). The second scintillator inside the linear array imaging detector (3) is aligned with the outlet of the backscatter imaging detector (1).
2. The backscattering imaging device based on dual detectors according to claim 1, characterized in that, The back of the first scintillator inside the backscatter imaging detector (1) is protected against X-rays by a lead-based composite polymer shielding material.
3. The backscattering imaging device based on dual detectors according to claim 2, characterized in that, The front of the first scintillator inside the backscatter imaging detector (1) is sealed with carbon fiber to block light.
4. The backscattering imaging device based on dual detectors according to claim 3, characterized in that, A carbon fiber panel is fixed to the outlet side of the backscatter imaging detector (1).
5. The backscattering imaging device based on dual detectors according to any one of claims 1-4, characterized in that, The collimator (5) is horn-shaped.
6. The backscattering imaging device based on dual detectors according to claim 5, characterized in that, The collimator (5) is fixed to the housing of the backscatter imaging detector (1), and the collimator (5) and the housing of the backscatter imaging detector (1) are connected by a misalignment.
7. The backscattering imaging device based on dual detectors according to claim 6, characterized in that, The backscatter imaging detector (1) has a stepped surface around the outlet on its housing. The collimator (5) is configured such that after being inserted into the outlet, the protrusion on the periphery of the collimator (5) abuts against the stepped surface.
8. The backscattering imaging device based on dual detectors according to claim 1, characterized in that, The second scintillator inside the linear array imaging detector (3) is protected against radiation by a lead-based composite polymer shielding material, and one side of the detection area of the second scintillator is exposed.
9. The backscattering imaging device based on dual detectors according to claim 1, characterized in that, The robotic arm (2) includes several interlocking sub-robotic arms.