Lamp panel and display apparatus

Abstract

A lamp panel and a display apparatus, in which the cross-line costs of the lamp panel can be reduced. The lamp panel comprises a substrate (100), light-emitting units (200), a plurality of power supply leads (300), and a jumper structure (400). The light-emitting units (200) may each comprise a plurality of light-emitting elements (201). The power supply leads (300) are arranged at intervals and are used to connect power supply signals, voltages of the power supply signals connected to different power supply leads (300) are different, and the power supply leads (300) may comprise a first power supply lead (301). The jumper structure (400) may comprise an insulating material layer (440), a plurality of conductive structures (410), and a plurality of conductive leads (420), the insulating material layer (440) is located on the side of the first power supply lead (301) away from the substrate (100), the plurality of conductive structures (410) are located on the side of the first power supply lead (301) away from the substrate (100), the conductive structures (410) are spaced apart, the insulating material layer (440) is arranged between any two conductive structures (410), and the conductive structures (410) are electrically connected to the first power supply lead (301). The plurality of conductive leads (420) are arranged in the same layer as the power supply leads (300). Ends of the conductive leads (420) are electrically connected to the conductive structures (410), the other ends are electrically connected to the light-emitting elements (201), and at least some of the light-emitting elements (201) are electrically connected to the first power supply lead (301).

Description

Lamp panel and display device

[0001] Cross-references to related applications

[0002] This application claims priority to Chinese patent application No. 202423046363.7, filed on December 10, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This application relates to the field of display technology, and in particular to a lamp panel and display device. Background Technology

[0004] With the advancement and development of display technology, the application scenarios of LED panels are becoming increasingly widespread, and the requirements for the manufacturing cost and efficiency of LED panels are gradually increasing. Traditional LED panels include multiple light-emitting units. Different colored light-emitting elements within the same light-emitting unit are electrically connected to a power lead to supply power to the light-emitting elements, thereby illuminating the light-emitting unit.

[0005] However, in the lamp boards of related technologies, multiple power leads connected to the same light-emitting unit are usually arranged at intervals on one side of the light-emitting unit. This means that when some light-emitting elements in the light-emitting unit are electrically connected to the power leads, some power leads need to be bridging, which increases the cost of bridging the lamp board, makes bridging the lamp board more difficult, and reduces the manufacturing efficiency. Summary of the Invention

[0006] Based on this, the lamp board and display device provided in the embodiments of this application can reduce the cost of lamp board wiring, reduce the difficulty of lamp board wiring, and improve the manufacturing efficiency of lamp board.

[0007] In a first aspect, according to some embodiments of this application, a lamp board is provided, comprising: a substrate, a light-emitting unit, multiple power leads, and a bridging structure; the light-emitting unit may include multiple light-emitting elements, at least two of the light-emitting elements being connected to different voltages; the multiple power leads are spaced apart, each power lead being used to connect to a power signal, the voltage of the power signal connected to different power leads being different, and each power lead may include a first power lead; the bridging structure may include: an insulating material layer, multiple conductive structures, and multiple conductive leads; the insulating material layer is located on the side of the first power lead away from the substrate; the multiple conductive structures are located on the side of the first power lead away from the substrate, the conductive structures are spaced apart, the insulating material layer is between any two conductive structures, and the conductive structures are electrically connected to the first power leads; the multiple conductive leads are arranged in the same layer as the power leads; wherein, one end of each conductive lead may be electrically connected to the conductive structure, and the other end may be electrically connected to the corresponding light-emitting element, and at least some of the light-emitting elements are electrically connected to the first power lead.

[0008] In some embodiments, in the extension direction of the first power lead, the first power lead includes at least two spaced-apart power lead segments with a gap between adjacent power lead segments; the plurality of conductive structures may include a first conductive structure and a second conductive structure, wherein the first conductive structure is located on the side of the first power lead away from the substrate, the first conductive structure is electrically connected to the power lead segments, the second conductive structure is disposed in the same layer as the first power lead, and the second conductive structure is located within the gap, and any two conductive structures are spaced apart; the conductive lead is located within the gap, the conductive lead is spaced apart from the power lead segments, and the conductive lead is spaced apart from the conductive structure.

[0009] In some embodiments, the bridging structure may further include: a conductive connection layer located on the side of the conductive structure away from the substrate, wherein both the first conductive structure and the second conductive structure are electrically connected to the conductive connection layer; an insulating material layer located between the conductive connection layer and the first power lead, and the insulating material layer being located within the gap, wherein the insulating material layer is present between the second conductive structure and the power lead segment, between the second conductive structure and the conductive lead, and between the conductive lead and the power lead segment; wherein the second conductive structure is electrically connected to the first power lead through the first conductive structure and the conductive connection layer, one end of the conductive lead is electrically connected to the second conductive structure, and the other end is electrically connected to the corresponding light-emitting element.

[0010] In some embodiments, the lamp panel may further include: an optical structure layer located on the side of the conductive structure away from the substrate; wherein the conductive connection layer is located between the optical structure layer and the conductive structure; or, the conductive connection layer is located on the side of the optical structure layer away from the conductive structure, the optical structure layer includes through holes, and the conductive structure and the conductive connection layer are electrically connected through the through holes.

[0011] In some embodiments, the power lead may further include a second power lead; some of the light-emitting elements may be electrically connected to the first power lead through the conductive structure, and other parts of the light-emitting elements may be electrically connected to the second power lead.

[0012] In some embodiments, the second power lead is located on the side of the light-emitting element away from the first power lead.

[0013] In some embodiments, the second power lead is located on the side of the first power lead away from the light-emitting element.

[0014] In some embodiments, the bridging structure may further include: multiple metal traces, which may be disposed on the same layer as the power lead, and the metal traces may be located within the gap, the metal traces may be insulated from the conductive structure, and an insulating material layer is provided between the metal traces and the conductive lead; the light-emitting element may include a first light-emitting element and a second light-emitting element, the first light-emitting element and the first power lead may be electrically connected through the conductive structure, and the second light-emitting element and the second power lead may be electrically connected through the metal traces.

[0015] In some embodiments, the orthographic projection of the insulating material layer toward the substrate does not overlap with the orthographic projection of the second power lead toward the substrate.

[0016] In some embodiments, the light-emitting unit may include a first light-emitting unit and a second light-emitting unit, wherein the first light-emitting unit may be located on a first side of the second power lead and the second light-emitting unit may be located on a second side of the second power lead; the bridging structure may include two, wherein the two bridging structures may be located on the first side and the second side of the second power lead, respectively.

[0017] In some embodiments, the second power lead may include two leads, and the second light-emitting element in the first light-emitting unit and the second light-emitting element in the second light-emitting unit may be electrically connected to different second power leads.

[0018] In some embodiments, the second power lead may include one, and the second light-emitting element in the first light-emitting unit and the second light-emitting element in the second light-emitting unit may both be electrically connected to the same second power lead.

[0019] In some embodiments, the two bridging structures located on either side of the second power lead may be aligned.

[0020] In some embodiments, the two bridging structures located on either side of the second power lead may be staggered.

[0021] In some embodiments, there may be multiple light-emitting units, and each light-emitting unit may include multiple light-emitting elements of different colors. At least one of the second conductive structures may be electrically connected to the light-emitting elements of the same color in the multiple light-emitting units.

[0022] In some embodiments, the plurality of light-emitting units connected to the same second conductive structure may all be located on the same side of the first power lead.

[0023] In some embodiments, a portion of the light-emitting units connected to the same second conductive structure may be located on a first side of the first power lead, and another portion of the light-emitting units may be located on a second side of the first power lead.

[0024] In some embodiments, when light-emitting elements of the same color in light-emitting units located on different sides of the first power lead are all connected to the same second conductive structure, the number of the first power lead in the power lead can be equal to the number of light-emitting elements in the light-emitting unit.

[0025] In some embodiments, the bridging structure may include at least two conductive structure groups, wherein the conductive structures in different conductive structure groups may be electrically connected to different first power leads; the conductive structure groups may be arranged at intervals, and the conductive structures in the same conductive structure group may be arranged at intervals along the extension direction of the first power lead.

[0026] In some embodiments, the spacing between adjacent second conductive structures in the extension direction of the first power lead may be greater than the width of the second conductive structure.

[0027] In some embodiments, the lamp board may further include a driver chip, which may be disposed on the same layer as the light-emitting unit, and may be electrically connected to the light-emitting element, and may be used to drive the light-emitting element to emit light.

[0028] Secondly, according to some embodiments of this application, a display device is provided, which may include: a lamp panel as described in any of the first aspects above. Attached Figure Description

[0029] Figure 1 is a schematic structural diagram of a lamp panel according to some embodiments of this application;

[0030] Figure 2 is a schematic cross-sectional view of a lamp panel provided according to some embodiments of this application;

[0031] Figure 3 is a schematic cross-sectional view of another lamp panel provided according to some embodiments of this application;

[0032] Figure 4 is a schematic structural diagram of another light panel provided according to some embodiments of this application;

[0033] Figure 5 is a schematic structural diagram of another type of lamp panel provided according to some embodiments of this application;

[0034] Figure 6 is a schematic structural diagram of another type of lamp panel provided according to some embodiments of this application;

[0035] Figure 7 is a schematic structural diagram of a lamp panel provided according to some embodiments of this application;

[0036] Figure 8 is a schematic structural diagram of another lamp panel provided according to some embodiments of this application;

[0037] Figure 9 is a schematic structural diagram of another type of lamp panel provided according to some embodiments of this application;

[0038] Figure 10 is a schematic structural diagram of another type of lamp panel provided according to some embodiments of this application;

[0039] Figure 11 is a schematic structural diagram of a lamp panel provided according to some embodiments of this application;

[0040] Figure 12 is a schematic structural diagram of another lamp panel provided according to some embodiments of this application;

[0041] Figure 13 is a schematic structural diagram of another type of lamp panel provided according to some embodiments of this application;

[0042] Figure 14 is a schematic structural diagram of another type of lamp panel provided according to some embodiments of this application;

[0043] Figure 15 is a schematic structural diagram of a lamp panel provided according to some embodiments of this application;

[0044] Figure 16 is a schematic structural diagram of a display device provided according to some embodiments of this application.

[0045] Explanation of reference numerals in the attached drawings: 100, substrate; 200, light-emitting unit; 201, light-emitting element; 2011, first light-emitting element; 2012, second light-emitting element; 210, light-emitting unit; 211, first light-emitting unit; 212, second light-emitting unit; 300, power lead; 310, first power lead; 320, second power lead; 400, bridging structure; 410, conductive structure; 411, first conductive structure; 412, second conductive structure; 420, conductive lead; 430, conductive connection layer; 440, insulating material layer; 450, metal trace; 500, optical structure layer; 600, driver chip; 700, hub structure; 1000, lamp board. Detailed Implementation

[0046] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Some embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Obviously, the drawings described below are merely some embodiments of this application, and those skilled in the art can obtain other related drawings based on these drawings without creative effort. Rather, the purpose of providing these embodiments is to make the disclosure of this application more thorough and complete.

[0047] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0048] It should be understood that when an element or layer is referred to as "on," "adjacent to," "connected to," or "coupled to" other elements or layers, it may be directly on, adjacent to, connected to, or coupled to other elements or layers, or there may be intervening elements or layers. Conversely, when an element is referred to as "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" other elements or layers, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc., may be used to describe various elements, parts, regions, layers, doping types, and / or portions, these elements, parts, regions, layers, doping types, and / or portions should not be limited by these terms. These terms are only used to distinguish one element, part, region, layer, doping type, or portion from another element, part, region, layer, doping type, or portion. Therefore, without departing from the teachings of this application, the first element, component, region, layer, doping type, or portion discussed below may be represented as a second element, component, region, layer, or portion; for example, the first doping type may be referred to as the second doping type, and similarly, the second doping type may be referred to as the first doping type; the first doping type and the second doping type are different doping types, for example, the first doping type may be P-type and the second doping type may be N-type, or the first doping type may be N-type and the second doping type may be P-type.

[0049] Spatial relation terms such as "below," "under," "below," "below," "above," and "above" are used here to describe the relationship between one element or feature shown in the figure and other elements or features. It should be understood that, in addition to the orientation shown in the figure, spatial relation terms also include different orientations of the device in use and operation. For example, if the device in the figure is flipped, the element or feature described as "below" or "below" of the other element or feature will be oriented "above" the other element or feature. Therefore, the terms "below" and "below" can include both above and below orientations. Furthermore, the device may also include other orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptive terms used herein will be interpreted accordingly.

[0050] When used herein, the singular forms of “a,” “an,” and “ / the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising / including” or “having,” etc., specify the presence of the stated features, wholes, steps, operations, components, parts, or combinations thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof. Meanwhile, in this specification, the term “and / or” includes any and all combinations of the associated listed items.

[0051] It should be noted that a light panel typically comprises multiple light-emitting units, each containing at least two light-emitting elements of different colors, and these elements are connected to different power leads. Since the power leads are arranged sequentially on one side of the light-emitting elements, crossover treatment is required when connecting to different power leads. In related technology light panels, a crossover patch is typically placed at each crossover point to insulate the connecting wire from other power leads. However, related technology light panels require a large number of crossover patches, which need to be fabricated separately, leading to increased crossover costs, longer fabrication time, greater fabrication difficulty, and reduced fabrication efficiency.

[0052] Based on this, according to some embodiments of this application, a lamp board is provided that can reduce the cost of wiring in the lamp board, reduce the difficulty of wiring in the lamp board, and improve the manufacturing efficiency of the lamp board. The lamp board may include a substrate, light-emitting units, multiple power leads, and a bridging structure. The light-emitting units include multiple light-emitting elements, and at least two light-emitting elements are connected to different voltages. The power leads are spaced apart and are used to connect power signals. Different power leads are connected to different voltages of power signals. The power leads include a first power lead. The bridging structure may include an insulating material layer, multiple conductive structures, and multiple conductive leads. The insulating material layer is located on the side of the first power lead away from the substrate. The multiple conductive structures may be located on the side of the first power lead away from the substrate. The conductive structures are spaced apart, and an insulating material layer is provided between any two conductive structures. The conductive structures are electrically connected to the first power lead. The multiple conductive leads are arranged in the same layer as the power leads. One end of the conductive lead is electrically connected to the conductive structure, and the other end is electrically connected to the corresponding light-emitting element. At least some light-emitting elements are electrically connected to the first power lead.

[0053] The aforementioned light board, by setting a bridging structure and electrically connecting multiple conductive structures included in the bridging structure to the first power lead, and by setting multiple conductive leads and power leads in the same layer, with one end of the conductive lead electrically connected to the conductive structure and the other end electrically connected to the corresponding light-emitting element, achieves integrated bridging of multiple light-emitting elements. At the same time, by setting an insulating material layer, different conductive structures can be insulated from each other, so that the conductive leads connected to different power leads are insulated from each other, further avoiding short circuits between different power leads.

[0054] The following is a detailed description of each component in conjunction with the accompanying drawings.

[0055] As shown in Figures 1 and 2, a light panel is provided according to some embodiments of this application, which may include: a substrate 100.

[0056] In some feasible implementations, the light panel may include a light-emitting unit 200; wherein the light-emitting unit 200 may include a plurality of light-emitting elements 201, and at least two light-emitting elements 201 are connected to different voltages.

[0057] In some embodiments, the light-emitting elements 201 may emit different colors. For example, the light-emitting elements 201 may emit any one of red, green and blue.

[0058] In some embodiments, the light-emitting unit 200 is typically located on the light-emitting side of the substrate 100 and is used to provide a light source.

[0059] In some feasible implementations, the lamp board may include multiple power leads 300, which are spaced apart. The power leads 300 can be used to connect to power signals. The voltage of the power signals connected to different power leads 300 is different. Each power lead 300 includes a first power lead 310.

[0060] In some embodiments, multiple power leads 300 and light-emitting units 200 may be arranged on the same layer.

[0061] In some embodiments, the power lead 300 may include multiple first power leads 310. Light-emitting elements 201 electrically connected to the same first power lead 310 emit the same color. At least two light-emitting elements 201 electrically connected to different first power leads 310 may emit the same or different colors.

[0062] In some feasible implementations, in the extension direction of the first power lead 310, the first power lead 310 may include at least two spaced power lead segments, and there may be a gap between adjacent power lead segments.

[0063] In some feasible implementations, the lamp board may include a bridging structure 400, which may include a plurality of conductive structures 410 located on the side of the first power lead 310 away from the substrate 100. The plurality of conductive structures 400 are spaced apart and the conductive structures 410 are electrically connected to the first power lead 310.

[0064] In some feasible embodiments, the plurality of conductive structures 400 may include a first conductive structure 411 and a second conductive structure 412, wherein the first conductive structure 411 may be located on the side of the first power lead 310 away from the substrate 100, the first conductive structure 411 is electrically connected to the power lead segment, the second conductive structure 412 is disposed in the same layer as the first power lead 310 and is located in the gap, and any two conductive structures 410 are disposed at intervals.

[0065] In some embodiments, at least one second conductive structure 412 may be present between two adjacent first conductive structures 411.

[0066] In some embodiments, the size of the gap between adjacent power lead segments in the extension direction of the first power lead 310 may be positively correlated with the number of second conductive structures 412, and the size of the gap between adjacent power lead segments in the extension direction of the first power lead 310 may be positively correlated with the number of first power leads 310.

[0067] In some feasible implementations, the bridging structure 400 may also include multiple conductive leads 420, which may be arranged in the same layer as the power leads 310.

[0068] In some embodiments, the conductive lead 420 may be located within the gap, the conductive lead 420 may be spaced apart from the power lead segment, and the conductive lead 420 may be spaced apart from the conductive structure 410.

[0069] In some feasible embodiments, the bridging structure 400 may also include a conductive connection layer 430, which may be located on the side of the conductive structure 410 away from the substrate 100, and both the first conductive structure 411 and the second conductive structure 412 may be electrically connected to the conductive connection layer 430.

[0070] In some embodiments, the orthographic projection of the conductive connection layer 430 toward the substrate 100 may overlap with the orthographic projection of the first power lead 310 toward the substrate 100, or the orthographic projection of the conductive connection layer 430 toward the substrate 100 may not overlap with the orthographic projection of the first power lead 310 toward the substrate 100.

[0071] In some feasible implementations, the bridging structure 400 may also include an insulating material layer 440 located on the side of the first power lead away from the substrate 100.

[0072] In some feasible embodiments, an insulating material layer 440 is located between the conductive connection layer 430 and the first power lead 310, and the insulating material layer 440 may be located within the gap, wherein the second conductive structure 412 may have an insulating material layer 440 between it and the power lead segment, the second conductive structure 412 may have an insulating material layer 440 between it and the conductive lead 420, and the conductive lead 420 may have an insulating material layer 440 between it and the power lead segment.

[0073] In some feasible implementations, the second conductive structure 412 can be electrically connected to the first power lead 310 through the first conductive structure 411 and the conductive connection layer 430. One end of the conductive lead 420 can be electrically connected to the second conductive structure 412, and the other end can be electrically connected to the corresponding light-emitting element 200. At least some of the light-emitting elements 200 are electrically connected to the first power lead 310.

[0074] In some embodiments, as shown in FIG1, a conductive structure 410 may be electrically connected to a light-emitting element 201. Multiple conductive structures 410 electrically connected to different first power leads 310 may be arranged in a straight line. This linear arrangement of multiple conductive structures 410 can reduce the spacing between adjacent conductive structures 410 along the extension direction of the first power leads 310, facilitating a tighter arrangement of the conductive structures 410. This reduces the area of ​​the insulating material layer 440 and improves the integration capability of the bridging structure.

[0075] In other embodiments, as shown in FIG4, a conductive structure 410 can be electrically connected to a light-emitting element 201. The multiple conductive structures 410 electrically connected to different first power leads 310 can be arranged in a stepped manner. By arranging the conductive structures 410 in a stepped manner, the spacing between adjacent conductive structures 410 electrically connected to the same first power lead 310 can be increased, facilitating the passage of electrical connection lines between the conductive structures 410 and the light-emitting element 201. This reduces the difficulty of wiring the electrical connection lines and further reduces the risk of short circuits in the lamp board.

[0076] In some embodiments, the insulating layer 440 may be made of a composite material of epoxy resin and glass fiber, wherein the flame retardancy rating of the composite material may be FR-4. The conductive structure 410 may be made of tin.

[0077] According to some embodiments of the lamp board provided in this application, by dividing the first power lead 310 into at least two power lead segments, conductive leads 420 can be arranged using the gap between the power lead segments, so that the conductive leads 420 and the power leads 300 are arranged in the same layer. By disposing the conductive connection layer 430 on the side of the conductive structure 410 away from the substrate 100, the second conductive structure 412 located in the gap can form an electrical connection with the first conductive structure 411 electrically connected to the first power lead 310, which facilitates the integration and bridging of multiple light-emitting elements by setting multiple second conductive structures 412. Thus, the light-emitting element 201 can be electrically connected to the first power lead 310 by electrically connecting the light-emitting element 201 to the second conductive structure. At the same time, by setting the insulating material layer 440, the conductive leads 420 connected to different power leads 300 can be insulated from the conductive connection layer 430, further avoiding short circuits between different power leads. Therefore, by setting the bridging structure 400, the power signal transmission quality within the lamp board can be improved, the safety of the lamp board can be enhanced, the bridging cost of the lamp board can be saved, the bridging difficulty of the lamp board can be reduced, and the manufacturing efficiency of the lamp board can be improved.

[0078] As shown in Figure 2, in some feasible embodiments, the lamp panel may further include an optical structure layer 500, which may be located on the side of the conductive structure 410 away from the substrate.

[0079] In some embodiments, the optical structure layer 500 may include a glass substrate, or a light guide plate and a light diffusion layer, etc.

[0080] In some feasible implementations, the conductive connection layer 430 is located between the optical structure layer 500 and the conductive structure 410.

[0081] In some embodiments, the conductive structure 410 can be a pad, which can be directly electrically connected to the conductive connection layer 430 by soldering.

[0082] As shown in Figure 3, in some feasible embodiments, the conductive connection layer 430 may be located on the side of the optical structure layer 500 away from the conductive structure 410. The optical structure layer 500 may include through holes, and the conductive structure 410 and the conductive connection layer 430 may be electrically connected through the through holes.

[0083] In some embodiments, an electrical connection between the conductive structure 410 and the conductive connection layer 430 can be formed through a metal interconnect process.

[0084] According to some embodiments of the present application, the light emitted by the light-emitting unit 200 can be adjusted by setting the optical structure layer 500, thereby further improving the light emission effect and light emission quality of the light panel. The relative positions of the optical structure layer 500 and the conductive connection layer 430 can be set according to the light emission requirements.

[0085] As shown in Figure 5, in some feasible embodiments, the power lead 300 may further include a second power lead 320.

[0086] In some feasible implementations, some of the light-emitting elements 201 are electrically connected to the first power lead 310 through the conductive structure 410, and another part of the light-emitting elements 201 is electrically connected to the second power lead 320.

[0087] In some embodiments, the color of the light-emitting element 201 electrically connected to the first power lead 310 may be different from the color of the light-emitting element 201 electrically connected to the second power lead 320. The power signal on the first power lead 310 may be different from the power signal on the second power lead 320.

[0088] According to some embodiments of the present application, by setting the power lead 300 to include the second power lead 320, the first power lead 310 and the second power lead 320 can supply power to different light-emitting elements respectively, thereby improving the brightness uniformity of the light-emitting unit 200 and further improving the display effect of the lamp board.

[0089] As shown in Figure 6, in some feasible embodiments, the second power lead 320 is located on the side of the light-emitting element 201 away from the first power lead 310.

[0090] According to some embodiments of the present application, by disposing the first power lead 310 and the second power lead 320 on both sides of the light-emitting element 201, the length of the connection line between the second power lead 320 and the light-emitting element 201 can be shortened, the complexity of the wiring on the surface of the insulating material layer 440 can be reduced, and the risk of short circuits between different power leads can be further reduced. This reduces the surface area of ​​the insulating material layer 440, lowers the bridging cost of the lamp board, reduces the manufacturing difficulty of the lamp board, and improves the manufacturing efficiency of the lamp board.

[0091] As shown in Figure 5, in some feasible embodiments, the second power lead 320 is located on the side of the first power lead 310 away from the light-emitting element 201.

[0092] According to some embodiments of the present application, by placing all the power leads 300 electrically connected to the light-emitting element 201 on one side of the light-emitting element 201, the spacing between different power leads 300 can be reduced, and the arrangement space of the light-emitting element 201 can be increased, thereby increasing the number of light-emitting elements in the light-emitting unit 200, improving the resolution of the light board, and further improving the display effect of the light board.

[0093] As shown in Figures 5 and 6, in some feasible embodiments, the bridging structure 400 may further include: multiple metal traces 450, which may be arranged on the same layer as the power lead 300, and the metal traces 450 may be located in the gap, the metal traces 450 are insulated from the conductive structure 410, and there may be an insulating material layer 440 between the metal traces 450 and the conductive lead 420.

[0094] In some embodiments, the first power lead 310 may include multiple leads, and the second power lead 320 may have only one lead.

[0095] In some feasible implementations, the light-emitting element 201 may include a first light-emitting element 2011 and a second light-emitting element 2012. The first light-emitting element 2011 and the first power lead 310 may be electrically connected through a conductive structure 410, and the second light-emitting element 2012 and the second power lead 320 may be electrically connected through a metal trace 450.

[0096] According to some embodiments of the present application, a lamp board is provided by setting a metal trace 450 within the bridging structure 400. One end of the metal trace 450 is electrically connected to a second power lead 320 located on the side of the first power lead 310 away from the light-emitting element 201, and the other end of the metal trace 450 is electrically connected to the second light-emitting element 2012. This allows for a gap between the metal traces 450. This prevents short circuits between the first power lead 310 and the second power lead 320, achieving a direct connection between the second power lead 320 and the second light-emitting element 2012. This improves the integration quality of the bridging structure 400, enhances the power signal transmission quality within the lamp board, improves the safety of the lamp board, further reduces the bridging cost of the lamp board, lowers the bridging difficulty of the lamp board, and improves the manufacturing efficiency of the lamp board.

[0097] In some feasible implementations, the orthographic projection of the insulating material layer 440 toward the substrate 100 and the orthographic projection of the second power lead 320 toward the substrate 100 may not overlap.

[0098] According to some embodiments of the present application, the surface of the second power lead 320 can be exposed relative to the surface of the first power lead 310, which facilitates the direct electrical connection of the metal trace 450 in the bridging structure 400 to the second power lead 320. This can further save the bridging cost of the lamp board, reduce the difficulty of bridging the lamp board, and thus improve the manufacturing efficiency of the lamp board.

[0099] As shown in Figure 7, in some feasible embodiments, the light-emitting unit 200 may include a first light-emitting unit 211 and a second light-emitting unit 212. The first light-emitting unit 211 may be located on the first side of the second power lead 320, and the second light-emitting unit 212 may be located on the second side of the second power lead 320.

[0100] In some feasible implementations, the jumper structure 400 may include two jumper structures 400, which are located on the first side and the second side of the second power lead 320, respectively.

[0101] According to some embodiments of the present application, by placing the second power lead 320 between two bridging structures 400, the first light-emitting unit 211 and the second light-emitting unit 212 are symmetrically arranged on both sides of the power lead 300, which can reduce the space occupied by the power lead 300 in the lamp board and further increase the number of light-emitting elements 201 in the light-emitting unit 200, thereby improving the resolution of the lamp board and improving the display effect of the lamp board.

[0102] As shown in Figure 7, in some feasible embodiments, the second power lead 320 may include two leads, and the second light-emitting element 2012 in the first light-emitting unit 211 and the second light-emitting element 2012 in the second light-emitting unit 212 may be electrically connected to different second power leads 320 respectively.

[0103] According to some embodiments of the present application, by placing the second power lead between two bridging structures, the first light-emitting unit and the second light-emitting unit are symmetrically arranged on both sides of the power lead, which can reduce the space occupied by the power lead in the lamp board and further increase the number of light-emitting elements in the light-emitting unit, thereby improving the resolution of the lamp board and improving the display effect of the lamp board.

[0104] As shown in Figure 8, in some feasible embodiments, the second power lead 320 may include one, and the second light-emitting element 2012 in the first light-emitting unit 211 and the second light-emitting element 2012 in the second light-emitting unit 212 may both be electrically connected to the same second power lead 320.

[0105] In some embodiments, multiple first power leads 310 may be provided on both sides of the second power lead 320, wherein the number of first power leads 310 located on different sides may be equal to the number of first light-emitting elements 2011 in the light-emitting unit 210 on that side. The light-emitting colors of the second light-emitting elements 2012 electrically connected to the same second power lead 320 may be the same.

[0106] According to some embodiments of the present application, by having the first light-emitting unit 211 and the second light-emitting unit 212 located on different sides of the second power lead 320 share a second power lead 320, one second power lead 320 can be saved, reducing the manufacturing cost of the lamp board. It can also further shorten the distance between the first light-emitting unit 211 and the second light-emitting unit 212, making it easier to increase the number of light-emitting elements 201 in the light-emitting unit 200, thereby improving the resolution of the lamp board and improving the display effect of the lamp board.

[0107] As shown in Figures 7 and 8, in some feasible embodiments, the two bridging structures 400 located on both sides of the second power lead 320 can be aligned.

[0108] According to some embodiments of the present application, by aligning two bridging structures 400 located on both sides of the second power lead 320, the bridging distance between different bridging structures 400 can be shortened when the conductive structures 410 within the two opposing bridging structures 400 need to be electrically connected, thereby further improving the integration level of the bridging structures 400.

[0109] As shown in Figures 9 and 10, in some feasible embodiments, the two bridging structures 400 located on both sides of the second power lead 320 can be staggered.

[0110] According to some embodiments of the present application, by staggering the two bridging structures 400 located on both sides of the second power lead 320, the space occupied by the second power lead 320 can be further reduced, the distance between the first light-emitting unit 211 and the second light-emitting unit 212 can be further shortened, and the number of light-emitting elements 201 in the light-emitting unit 200 can be increased, thereby improving the resolution of the lamp board and improving the display effect of the lamp board.

[0111] As shown in Figure 11, in some feasible implementations, there can be multiple light-emitting units 200.

[0112] In some feasible implementations, the light-emitting unit 210 may include a plurality of light-emitting elements 201 of different colors.

[0113] In some embodiments, a light-emitting unit 210 may include light-emitting elements 201 of at least two colors.

[0114] In some feasible implementations, at least one second conductive structure 412 may be electrically connected to light-emitting elements 201 of the same color in a plurality of light-emitting units 210.

[0115] It should be noted that the semiconductor materials included in the light-emitting elements 201 of different colors are different, which will result in different voltages required to light up the light-emitting elements 201 of different colors. Therefore, the light-emitting elements 201 of different colors need to be connected to different power supply leads to obtain different voltages to ensure the uniformity of the brightness of the light-emitting unit 200.

[0116] According to some embodiments of the present application, the number of second conductive structures 412 can be reduced by having multiple light-emitting elements 201 share the same second conductive structure 412, thereby saving the space occupied by the bridging structure 400, saving the manufacturing cost of the bridging structure, and further saving the bridging cost of the lamp board.

[0117] As shown in Figure 11, in some feasible embodiments, multiple light-emitting units 210 connected to the same second conductive structure 412 may all be located on the same side of the first power lead 310.

[0118] According to some embodiments of the present application, by connecting the light-emitting elements 201 with the same light-emitting color in multiple light-emitting units 210 to the same second conductive structure 412, the second conductive structure 412 can be shared, which can further reduce the number of second conductive structures 412, thereby saving the space occupied by the bridging structure 400, and at the same time saving the manufacturing cost of the bridging structure, and further saving the bridging cost of the light board.

[0119] As shown in Figure 12, in some feasible embodiments, some light-emitting units 210 connected to the same second conductive structure 412 may be located on the first side of the first power lead 310, and other light-emitting units 210 may be located on the second side of the first power lead 310.

[0120] According to some embodiments of the present application, the light-emitting units 210 located on different sides of the first power lead 310, with the same light-emitting elements 201 of the same color, are connected to the same second conductive structure 412. This allows the light-emitting units 210 located on different sides of the first power lead 310 to share a set of first power leads 310 and the second conductive structure 412 electrically connected to them. This further reduces the spacing between the light-emitting units 210 distributed on both sides of the first power lead 310, facilitating an increase in the density of the light-emitting elements 201 within the light-emitting unit 200, and further improving the resolution of the light panel. It also further reduces the manufacturing cost of the first power lead 310 and the second conductive structure 412, lowering the manufacturing cost of the light panel, accelerating the manufacturing speed of the light panel, and improving the manufacturing efficiency of the light panel.

[0121] As shown in Figure 12, in some feasible embodiments, when the light-emitting elements 201 of the same color in the light-emitting units 210 located on different sides of the first power lead 310 can all be connected to the same second conductive structure 412, the number of the first power lead 310 in the power lead 300 can be equal to the number of light-emitting elements 201 in the light-emitting unit 210.

[0122] In some embodiments, when the number of light-emitting elements 201 in the light-emitting units 210 distributed on different sides of the first power lead 310 is not equal, the number of the first power lead 310 between the light-emitting units 210 on opposite sides may be equal to the maximum number of light-emitting elements 201 in the light-emitting unit 210.

[0123] According to some embodiments of the present application, by setting the number of first power leads 310 to be equal to the number of light-emitting elements 201 in the light-emitting unit 210, light-emitting elements 201 with the same emitting color in different light-emitting units 210 can fully share a first power lead 310 and a set of second conductive structures 412, further improving the integration capability of the bridging structure 400, increasing the utilization rate of the first power lead 310 and the second conductive structure 412, facilitating the increase in the density of the light-emitting elements 201 in the light-emitting unit 200, further improving the resolution of the lamp board, further reducing the manufacturing cost of the first power lead 310 and the second conductive structure 412, reducing the manufacturing cost of the lamp board, accelerating the manufacturing speed of the lamp board, and improving the manufacturing efficiency of the lamp board.

[0124] As shown in Figure 13, in some feasible implementations, the bridging structure 400 may include at least two groups of conductive structures.

[0125] In some embodiments, the conductive structures 410 within different conductive structure groups can be aligned with each other or staggered. The number of conductive structures 410 within different conductive structure groups can be different. The number of conductive structure groups can be equal to the number of colors of the light-emitting element 201.

[0126] In some feasible implementations, the conductive structures 410 in different conductive structure groups can be electrically connected to different first power supply leads 310 respectively.

[0127] In some embodiments, different conductive structure groups may share a single insulating material layer 440, or different conductive structure groups may correspond to different insulating material layers 440.

[0128] In some feasible implementations, the conductive structure groups can be arranged at intervals, and the conductive structures 410 located in the same conductive structure group can be arranged at intervals along the extension direction of the first power lead 310.

[0129] According to some embodiments of the present application, the lamp board can be electrically connected to the first power lead 310 by setting multiple conductive structure groups, thereby improving the accuracy of the connection between the conductive structure 410 and the first power lead 310, reducing the manufacturing difficulty of the lamp board and improving the manufacturing efficiency of the lamp board.

[0130] As shown in Figure 2, in some feasible embodiments, in the extension direction of the first power lead 310, the spacing L1 between adjacent second conductive structures 412 can be greater than the width dimension L2 of the second conductive structure 412.

[0131] It should be noted that if the spacing of the second conductive structures 412 is too small in the extension direction of the first power lead 310, the space between the second conductive structures 412 will be insufficient, which may cause the second conductive structure 412 to be electrically connected to the metal wires around it, further increasing the risk of short circuit between different power leads, thereby affecting the reliability, stability and safety of the light-emitting unit 200.

[0132] According to some embodiments of the present application, by increasing the spacing of the second conductive structures 412 in the extension direction of the first power lead 310, the wire passage space between the second conductive structures 412 can be increased, reducing the risk of short circuit between different power leads, thereby improving the reliability, stability and safety of the light-emitting unit 200 and extending the service life of the lamp board.

[0133] As shown in Figures 1 and 3 to 6, in some feasible embodiments, the lamp board may further include a driver chip 600. The driver chip 600 and the light-emitting unit 200 may be disposed on the same layer, and the driver chip 600 may be electrically connected to the light-emitting element 201. The driver chip 600 can be used to drive the light-emitting element 201 to emit light.

[0134] In some embodiments, a driver chip 600 can be used to control the light emission of one light-emitting element 201, or to control the light emission of all light-emitting elements 201 in one light-emitting unit 210, or to control the light emission of all light-emitting elements 201 in multiple light-emitting units 210.

[0135] According to some embodiments of this application, by setting the driver chip 600 to drive the light-emitting element 201 to emit light, the accuracy of the light-emitting element 201 can be improved and the display quality can be enhanced.

[0136] As shown in Figure 14, in some feasible embodiments, the lamp panel may further include a hub structure 700, wherein the hub structure 700 and the light-emitting unit 200 may be arranged on the same layer. The material of the hub structure 700 may be a conductive material. At least two light-emitting elements 201 connected to the same first power lead 310 or the same second power lead 320 may be electrically connected to the second conductive structure 412 or the second power lead 320 through the hub structure 700.

[0137] According to some embodiments of the present application, the lamp board provides that multiple light-emitting elements 201 that need to be connected to the same power lead 300 are pre-connected by the hub structure 700, and then the hub structure 700 is electrically connected to the second conductive structure 412 or the second power lead 320 by the conductive lead 420. This can reduce the number of conductive structures 410 and metal traces 450, thereby reducing the size of the insulating material layer 440, further reducing the bridging cost of the lamp board, reducing the bridging difficulty, and improving the manufacturing efficiency of the lamp board.

[0138] As shown in Figure 15, in some feasible embodiments of this application, a light panel may also be provided, which may include a substrate 100.

[0139] In some feasible implementations, the lamp panel may include a light-emitting unit 200; wherein the light-emitting unit 200 may be located on the light-emitting side of the substrate 100, and the light-emitting unit 200 may include a first light-emitting element 2011 and a second light-emitting element 2012, and the voltages connected to at least the two light-emitting elements 201 may be different.

[0140] In some feasible embodiments, the lamp board may include multiple power leads 300; wherein, the multiple power leads 300 and the light-emitting unit 200 may be arranged on the same layer, and the power leads 300 may be arranged at intervals. The power leads 300 can be used to connect to power signals, and the voltage of the power signals connected to different power leads 300 may be different. The power leads 300 may include a first power lead 310 and a second power lead 320, and the second power lead 320 may be located on the side of the first power lead 310 away from the light-emitting element 201.

[0141] In some feasible implementations, in the extension direction of the first power lead 310, the first power lead 310 may include at least two spaced power lead segments, and there may be a gap between adjacent power lead segments.

[0142] In some feasible embodiments, the lamp board may include a bridging structure 400; wherein the bridging structure 400 may include: a plurality of conductive structures 410, including a first conductive structure 411 and a second conductive structure 412, wherein the first conductive structure 411 may be located on the side of the first power lead 310 away from the substrate 100, the first conductive structure 411 may be electrically connected to the power lead segment, the second conductive structure 412 may be disposed in the same layer as the first power lead 310, and the second conductive structure 412 may be located in the gap, and any two conductive structures 410 may be disposed at intervals.

[0143] In some feasible embodiments, the bridging structure 400 may also include multiple conductive leads 420, which may be arranged in the same layer as the power leads 310. The conductive leads 420 may be located in the gaps, and the conductive leads 420 and the power lead segments may be arranged at intervals. The conductive leads 420 and the conductive structure 410 may also be arranged at intervals.

[0144] In some feasible embodiments, the bridging structure 400 may further include a conductive connection layer 430 located on the side of the conductive structure 410 away from the substrate 100, and the first conductive structure 411 and the second conductive structure 412 may both be electrically connected to the conductive connection layer 430.

[0145] In some feasible embodiments, the bridging structure 400 may further include an insulating material layer 440 located between the conductive connection layer 430 and the first power lead 310, and the insulating material layer 440 may be located within the gap, wherein the second conductive structure 412 and the power lead segment may have an insulating material layer 440, the second conductive structure 412 and the conductive lead 420 may have an insulating material layer 440, and the conductive lead 420 and the power lead segment may have an insulating material layer 440.

[0146] In some feasible embodiments, the bridging structure 400 may also include multiple metal traces 450, which may be arranged on the same layer as the power lead 300, and the metal traces 450 may be located in the gap. The metal traces 450 may be insulated from the conductive structure 410, and there may be an insulating material layer 440 between the metal traces 450 and the conductive lead 420.

[0147] In some feasible implementations, the second conductive structure 412 can be electrically connected to the first power lead 310 through the first conductive structure 411 and the conductive connection layer 430. One end of the conductive lead 420 can be electrically connected to the second conductive structure 412, and the other end can be electrically connected to the corresponding first light-emitting element 2011. The second light-emitting element 2012 can be electrically connected to the second power lead 230 through the metal trace 450.

[0148] According to the above-described lamp board provided in some embodiments of this application, by dividing the first power lead 310 into at least two power lead segments, conductive leads 420 can be disposed using the gap between the power lead segments, so that the conductive leads 420 and the power leads 300 are disposed in the same layer. By disposing the conductive connection layer 430 on the side of the conductive structure 410 away from the substrate 100, the second conductive structure 412 located in the gap can form an electrical connection with the first conductive structure 411 electrically connected to the first power lead 310, which facilitates the integration and bridging of multiple light-emitting elements by disposing of multiple second conductive structures 412. Thus, the light-emitting element 201 can be electrically connected to the first power lead 310 by electrically connecting the light-emitting element 201 to the second conductive structure. At the same time, by disposing of the insulating material layer 440, the conductive leads 420 connected to different power leads 300 can be insulated from the conductive connection layer 430, further preventing short circuits between different power leads.

[0149] Furthermore, by providing a metal trace 450 within the bridging structure 400, electrically connecting one end of the metal trace 450 to a second power lead 320 located on the side of the first power lead 310 away from the light-emitting element 201, and electrically connecting the other end of the metal trace 450 to the second light-emitting element 2012, the gaps between the metal traces 450 can be minimized. This prevents short circuits between the first power lead 310 and the second power lead 320, achieving a direct connection between the second power lead 320 and the second light-emitting element 2012. This improves the integration quality of the bridging structure 400, enhances the power signal transmission quality within the lamp board, improves the lamp board's safety, further reduces bridging costs, lowers bridging difficulty, and increases lamp board fabrication efficiency. Therefore, by providing the bridging structure 400, the power signal transmission quality within the lamp board can be improved, the lamp board's safety enhanced, bridging costs reduced, bridging difficulty lowered, and lamp board fabrication efficiency increased.

[0150] As shown in Figure 16, according to some embodiments of this application, a display device is also provided, which may include: a lamp board 1000 as described in any of the above embodiments. The display device provided according to some embodiments of this application, by providing a bridging structure 400 in the lamp board 1000, and electrically connecting multiple conductive structures 410 included in the bridging structure 400 to a first power lead 310, and by providing multiple conductive leads 420 in the same layer as the power lead 300, with one end of the conductive lead 420 electrically connected to the conductive structure 410 and the other end electrically connected to the corresponding light-emitting element 201, integrated bridging of multiple light-emitting elements is achieved. Simultaneously, by providing an insulating material layer 440, different conductive structures can be insulated from each other, making the conductive leads connected to different power leads insulated from each other, further avoiding short circuits between different power leads. This improves the power signal transmission quality within the lamp board 1000, enhances the safety of the lamp board 1000, saves bridging costs for the lamp board 1000, reduces the bridging difficulty of the lamp board 1000, and improves the manufacturing efficiency of the lamp board 1000.

[0151] In the description of this specification, the references to terms such as "some embodiments," "other embodiments," "ideal embodiments," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example that are included in at least one embodiment or example of this application. In this specification, the illustrative descriptions of the above terms do not necessarily refer to the same embodiments or examples.

[0152] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features of the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0153] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A light panel, comprising: Base; A light-emitting unit, comprising a plurality of light-emitting elements, wherein at least two of the light-emitting elements are connected to different voltages; Multiple power leads are provided, the power leads are spaced apart, the power leads are used to connect to power signals, the voltage of the power signals connected to different power leads is different, and the power leads include a first power lead. The bridging structure includes: An insulating material layer is located on the side of the first power lead away from the substrate; Multiple conductive structures are located on the side of the first power lead away from the substrate. The conductive structures are spaced apart, and the insulating material layer is between any two conductive structures. The conductive structures are electrically connected to the first power lead. Multiple conductive leads are arranged in the same layer as the power leads; Wherein, one end of the conductive lead is electrically connected to the conductive structure, and the other end is electrically connected to the corresponding light-emitting element, and at least a portion of the light-emitting elements are electrically connected to the first power supply lead.

2. The lamp board according to claim 1, wherein in the extending direction of the first power lead, the first power lead includes at least two spaced power lead segments, and there is a gap between adjacent power lead segments; The plurality of conductive structures includes a first conductive structure and a second conductive structure, wherein... The first conductive structure is located on the side of the first power lead away from the substrate. The first conductive structure is electrically connected to the power lead segment. The second conductive structure is disposed in the same layer as the first power lead and is located within the gap. Any two conductive structures are disposed at intervals. The conductive lead is located within the gap, and the conductive lead is spaced apart from the power supply lead segment and spaced apart from the conductive structure.

3. The lamp panel according to claim 2, wherein the bridging structure further comprises: A conductive connection layer is located on the side of the conductive structure away from the substrate, and both the first conductive structure and the second conductive structure are electrically connected to the conductive connection layer; The insulating material layer is located between the conductive connection layer and the first power lead, and the insulating material layer is located within the gap, wherein the insulating material layer is present between the second conductive structure and the power lead segment, between the second conductive structure and the conductive lead, and between the conductive lead and the power lead segment; The second conductive structure is electrically connected to the first power lead through the first conductive structure and the conductive connection layer. One end of the conductive lead is electrically connected to the second conductive structure, and the other end is electrically connected to the corresponding light-emitting element.

4. The lamp panel according to claim 3 further includes: An optical structure layer is located on the side of the conductive structure away from the substrate; Wherein, the conductive connection layer is located between the optical structure layer and the conductive structure; or, The conductive connection layer is located on the side of the optical structure layer away from the conductive structure. The optical structure layer includes a through hole, and the conductive structure is electrically connected to the conductive connection layer through the through hole.

5. The lamp board according to claim 4, wherein the power supply lead further includes a second power supply lead; A portion of the light-emitting elements is electrically connected to the first power lead through the conductive structure, and another portion of the light-emitting elements is electrically connected to the second power lead.

6. The lamp panel according to claim 5, wherein the second power lead is located on the side of the light-emitting element away from the first power lead.

7. The lamp panel according to claim 6, wherein the second power lead is located on the side of the first power lead away from the light-emitting element.

8. The lamp panel according to claim 7, wherein the bridging structure further comprises: Multiple metal traces are arranged in the same layer as the power leads, and the metal traces are located within the gaps. The metal traces are insulated from the conductive structure, and there is an insulating material layer between the metal traces and the conductive leads. The light-emitting element includes a first light-emitting element and a second light-emitting element. The first light-emitting element is electrically connected to the first power lead through the conductive structure, and the second light-emitting element is electrically connected to the second power lead through the metal trace.

9. The lamp panel according to claim 8, wherein the orthographic projection of the insulating material layer toward the substrate does not overlap with the orthographic projection of the second power lead toward the substrate.

10. The lamp panel according to claim 8, wherein the light-emitting unit comprises a first light-emitting unit and a second light-emitting unit, the first light-emitting unit being located on a first side of the second power lead, and the second light-emitting unit being located on a second side of the second power lead; The jumper structure includes two jumpers, which are located on the first side and the second side of the second power lead, respectively.

11. The lamp panel according to claim 10, wherein the second power lead comprises two lines, and the second light-emitting element in the first light-emitting unit and the second light-emitting element in the second light-emitting unit are respectively electrically connected to different second power leads; or, The second power lead includes one, and the second light-emitting element in the first light-emitting unit and the second light-emitting element in the second light-emitting unit are both electrically connected to the same second power lead.

12. The lamp board according to claim 10, wherein the two bridging structures located on both sides of the second power lead are aligned; or, The two bridging structures located on both sides of the second power lead are staggered.

13. The lamp panel according to claim 3, wherein there are multiple light-emitting units, each light-emitting unit comprising multiple light-emitting elements of different colors, and at least one of the second conductive structures is electrically connected to light-emitting elements of the same color in the multiple light-emitting units.

14. The lamp panel according to claim 13, wherein the plurality of light-emitting units connected to the same second conductive structure are all located on the same side of the first power lead.

15. The lamp panel according to claim 13, wherein a portion of the light-emitting units connected to the same second conductive structure is located on a first side of the first power lead, and another portion of the light-emitting units is located on a second side of the first power lead.

16. The lamp panel according to claim 15, wherein when light-emitting elements of the same color in light-emitting units located on different sides of the first power lead are all connected to the same second conductive structure, the number of the first power lead is equal to the number of light-emitting elements in the light-emitting unit.

17. The lamp board according to claim 3, wherein the bridging structure comprises at least two conductive structure groups, and the conductive structures in different conductive structure groups are respectively electrically connected to different first power supply leads; Each conductive structure group is arranged at intervals, and each conductive structure within the same conductive structure group is arranged at intervals along the extension direction of the first power lead.

18. The lamp board according to claim 3, wherein in the extension direction of the first power lead, the spacing between adjacent second conductive structures is greater than the width dimension of the second conductive structure.

19. The lamp panel according to claim 3, further comprising: A driving chip is disposed on the same layer as the light-emitting unit and electrically connected to the light-emitting element. The driving chip is used to drive the light-emitting element to emit light.

20. A display device, comprising: The lamp panel as described in any one of claims 1 to 19.

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