Panel metal deposition and thinning device

Abstract

Provided in the present application is a panel metal deposition and thinning device. The device comprises: a panel loading port, a front-end module and a processing module, wherein the processing module comprises a plurality of process chambers; the plurality of process chambers comprise pre-wetting chambers, electroplating chambers, cleaning chambers and electropolishing chambers; and the number of electropolishing chambers is greater than the number of electroplating chambers. The present application integrates an electroplating process and an electrochemical polishing process into one device. Subsequent to the electroplating process and a cleaning process, the electrochemical polishing process is used to thin a metal layer on a surface of a panel, so as to reduce the stress of the panel; and in a subsequent chemical mechanical polishing process, the thickness of the metal layer that needs to be removed from the surface of the panel is reduced, thereby shortening the process time of chemical mechanical polishing, reducing the consumption of process chemicals and consumables, and thus improving the productivity of a chemical mechanical polishing device while reducing the process cost.

Description

Panel metal deposition and thinning equipment Technical Field

[0001] This application relates to the field of semiconductor manufacturing equipment, and in particular to a panel metal deposition and thinning apparatus. Background Technology

[0002] With the increasing prevalence of advanced fan-out packaging technology and changes in substrate materials, panel-level packaging is becoming more and more common. Compared to wafers, panels offer higher utilization, can accommodate more chips, and save costs. In through-glass via (TGV) applications with a continuous metal layer plated on one side, the current practice typically involves depositing a copper seed layer using physical vapor deposition (PVD) on a panel where deep holes have already been patterned and etched, followed by electroplating (ECP) to deposit a copper layer, annealing, and finally chemical mechanical polishing (CMP) to remove the copper outside the patterned structure (i.e., the deep holes).

[0003] Typically, the thickness of the copper layer on the panel surface, i.e., the surface copper, is directly proportional to the depth and aspect ratio of the deep holes. Thicker surface copper increases panel warping and, in subsequent chemical mechanical polishing (CMP) processes, affects the removal rate and uniformity control of the surface metal layer, as well as increasing the risk of panel cracking. Furthermore, thicker surface copper also increases the time required for CMP processes and the consumption of chemicals and consumables, thus increasing process costs. Summary of the Invention

[0004] The purpose of this application is to provide a panel metal deposition and thinning device to solve the problem in the prior art that a thick metal layer on the panel surface increases panel warping and affects the metal layer removal rate and uniformity control in the subsequent chemical mechanical polishing process.

[0005] To achieve the above and other related objectives, this application provides a panel metal deposition and thinning apparatus, comprising: a panel loading port, a front-end module, and a processing module, wherein the processing module includes multiple process chambers; the multiple process chambers include a pre-wetting chamber, an electroplating chamber, a cleaning chamber, and an electropolishing chamber; wherein the number of electropolishing chambers is greater than the number of electroplating chambers.

[0006] Furthermore, it also includes a process robot, which is disposed in the processing module and is used to transfer the panel in the order of pre-wetting chamber, electroplating chamber, cleaning chamber, electropolishing chamber and cleaning chamber.

[0007] Furthermore, it also includes a front-end robotic arm disposed on the front-end module, the front-end robotic arm being used to transfer the panel between the panel loading port and the processing module.

[0008] Furthermore, the plurality of process cavities are symmetrically arranged on both sides of the process robot or on the outer periphery of the process robot.

[0009] Furthermore, the ratio of the number of electroplating chambers to the number of electropolishing chambers is 1:2.

[0010] Furthermore, it also includes a cache module located between the front-end module and the processing module for placing the panel.

[0011] Furthermore, the front-end robot is also used to transfer the panel between the panel loading port and the cache module, and the process robot is also used to transfer the panel between the cache module and the processing module.

[0012] Furthermore, the pre-wetting chamber, electroplating chamber, cleaning chamber, and electropolishing chamber are sequentially arranged on both sides of the process robot.

[0013] Furthermore, the pre-wetting chamber and the cleaning chamber are respectively located on both sides of the process robot.

[0014] Furthermore, the pre-wetting chamber, electroplating chamber, and cleaning chamber are located on one side of the process robot, and the electropolishing chamber is located on the other side of the process robot.

[0015] Furthermore, the multiple process cavities in the processing module are arranged in a double layer, wherein the upper and lower process cavities have the same layout.

[0016] Furthermore, some of the multiple process cavities are configured with two layers, while the other part of the process cavities are configured with a single layer.

[0017] Furthermore, the electroplating chamber is a single-layer structure, while the pre-wetting chamber, cleaning chamber, and electropolishing chamber are all double-layer structures.

[0018] This application also proposes a panel metal deposition and thinning method, applied to the aforementioned panel metal deposition and thinning equipment, the method comprising the following steps:

[0019] Step S11: Perform a pre-wetting process on the panel surface;

[0020] Step S12: Deposit a metal layer on the panel surface using an electroplating process;

[0021] Step S13: Clean the panel surface;

[0022] Step S14: The metal layer on the panel surface is thinned using an electrochemical polishing process;

[0023] Step S15: Clean the panel surface.

[0024] As described above, this application provides a panel metal deposition and thinning apparatus that integrates electroplating and electrochemical polishing processes into a single device. After electroplating and cleaning processes, electrochemical polishing is used to thin the metal layer on the panel surface, reducing panel stress. In subsequent chemical mechanical polishing (CMP) processes, the thickness of the metal layer to be removed from the panel surface is reduced, shortening the CMP process time, reducing the consumption of process chemicals and consumables, lowering process costs, and increasing the production capacity of the CMP equipment.

[0025] Overview of the attached figures

[0026] The features and performance of this application are further described by the following embodiments and accompanying drawings.

[0027] Figure 1 shows a schematic diagram of a panel metal deposition and thinning apparatus according to an embodiment of this application;

[0028] Figure 2 shows a schematic diagram of a panel metal deposition and thinning apparatus in another embodiment of this application;

[0029] Figure 3 shows a schematic diagram of a panel metal deposition and thinning apparatus in another embodiment of this application;

[0030] Figure 4 shows a schematic diagram of a panel metal deposition and thinning apparatus according to another embodiment of this application;

[0031] Figure 5 shows a schematic diagram of a panel metal deposition and thinning apparatus in another embodiment of this application;

[0032] Figure 6 shows a schematic diagram of a panel metal deposition and thinning apparatus according to another embodiment of this application;

[0033] Figure 7 shows a flowchart of a panel metal deposition and thinning method in one embodiment of this application.

[0034] Preferred embodiments of this application

[0035] The following specific examples illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. This application can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this application.

[0036] It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of this application. Although the illustrations only show components relevant to this application and are not drawn according to the actual number, shape, and size of components in implementation, the shape, quantity, and proportion of each component in actual implementation can be arbitrarily changed, and the layout of the components may also be more complex. In addition, the same reference numerals in multiple figures represent the same or equivalent parts or components.

[0037] As shown in Figure 1, this application proposes a panel metal deposition and thinning device, including a panel loading port 1, a front-end module 2, a processing module 3, a front-end robot 20 located in the front-end module 2, and a process robot 30 located in the processing module 3.

[0038] The panel loading port 1 includes at least two chambers, which are used to hold the panel to be processed and the processed panel, respectively.

[0039] Processing module 3 includes multiple process chambers. Specifically, processing module 3 includes a pre-wetting chamber 31, an electroplating chamber 32, a cleaning chamber 33, and an electropolishing chamber 34, with at least one of each type of process chamber. These multiple process chambers are symmetrically arranged on both sides of the process robot 30 or sequentially arranged around the outer periphery of the process robot 30. The transfer order of the panel to be processed through the four process chambers is: pre-wetting chamber 31, electroplating chamber 32, cleaning chamber 33, electropolishing chamber 34, and cleaning chamber 33. Before electroplating, a pre-wetting process is performed, in which deionized water (DIW) is filled into the graphic structure on the panel under vacuum, thereby improving contact and fusion with the electroplating solution and facilitating the entry of the electroplating solution into the graphic structure on the panel. After the first cleaning of the panel, an electrochemical polishing process is performed to thin the metal layer on the panel surface and reduce panel stress.

[0040] The electroplating chamber 32 employs a horizontal electroplating method, where a panel is loaded onto an electroplating chuck and immersed downwards into the electroplating solution, depositing a metal layer on the panel surface. The electropolishing chamber 34 uses an electrochemical polishing process. The panel is fixed to a fixture, which moves horizontally and rotates simultaneously. Polishing solution is sprayed onto the panel through a nozzle, reacting with the metal layer on the panel surface. During continuous polishing, the metal layer on the panel surface is removed. The electropolishing chamber 34 uses a localized polishing method, while the electroplating chamber 32 directly electroplats the entire panel. Therefore, the electropolishing process typically takes longer than the electroplating process, and the number of electropolishing chambers 34 in this equipment is greater than the number of electroplating chambers 32. In some embodiments, the number of electroplating chambers 32 and electropolishing chambers 34 is configured according to the product's through-hole depth and aspect ratio, as well as the required electroplating and electropolishing process times. Specifically, the cavity configuration of the electroplating chamber 32 and the electropolishing chamber 34 is inversely proportional to the production capacity configuration. For example, if the production capacity ratio of the electroplating chamber 32 and the electropolishing chamber 34 is 2:1, then the quantity ratio of the electroplating chamber 32 and the electropolishing chamber 34 is 1:2. In some embodiments, as shown in FIG2, four electroplating chambers 32 and eight electropolishing chambers 34 can be configured.

[0041] A front-end robot 20 is disposed in the front-end module 2 and is used to pick up, place, and transfer panels between the panel loading port 1 and the processing module 3. A process robot 30 is disposed in the processing module 3 and is used to pick up, place, and transfer substrates between multiple process cavities in the processing module 3. Both the front-end robot 20 and the process robot 30 can perform translational, lifting, and rotational movements to transfer substrates between different modules or process cavities. The structures of the front-end robot 20 and the process robot 30 can be the same or different; any transfer robot commonly known to those skilled in the art can be used, for example, a telescopic rotary arm.

[0042] During the transfer process, the front-end robot 20 removes the panel from the panel loading port 1 and places the panel in the pre-wetting chamber 31. After the panel undergoes the pre-wetting process, the process robot 30 removes the panel from the pre-wetting chamber 31 and transfers it to the electroplating chamber 32. After the panel undergoes the electroplating process, the process robot 30 removes the panel from the electroplating chamber 32 and transfers it to the cleaning chamber 33. After the panel undergoes the first cleaning process, the process robot 30 removes the panel from the cleaning chamber 33 and transfers it to the electropolishing chamber 34. After the panel undergoes the electropolishing process, the process robot 30 removes the panel from the electropolishing chamber 34 and transfers it to the cleaning chamber 33 again. After the panel undergoes the second cleaning process, the process robot 30 removes the panel from the cleaning chamber 33 and transfers it to the panel loading port 1.

[0043] In some embodiments, the device further includes a cache module 4, as shown in FIG. 1, disposed between the front-end module 2 and the processing module 3, for placing the panel. The front-end robot 20 is also used to transfer the panel between the panel loading port 1 and the cache module 4, and the process robot 30 is also used to transfer the panel between the cache module 4 and the processing module 3.

[0044] In the embodiments shown in Figures 1 and 2, the electroplating chamber 32 and the electropolishing chamber 34 have the same layout, differing only in number. The electroplating chamber 32 is positioned between the pre-wetting chamber 31 and the cleaning chamber 33, while the cleaning chamber 33 is positioned between the electroplating chamber 32 and the electropolishing chamber 34. The process robot 30 is positioned within the central channel of the processing module 3. In this embodiment, the chambers are configured according to the process sequence of each chamber, simplifying the transmission path of the process robot 30. As shown in Figure 2, by setting more electroplating chambers 32 and electropolishing chambers 34, the number of process robots 30 also increases accordingly, enabling simultaneous processing of multiple panels and significantly improving the equipment's capacity.

[0045] In another embodiment, the pre-wetting chamber 31 and the cleaning chamber 33 can be respectively arranged on both sides of the process robot 30, as shown in FIG3, with an electroplating chamber 32 and two electropolishing chambers 34 arranged on both sides of the process robot 30.

[0046] In the embodiment shown in Figure 4, the pre-wetting chamber 31, the electroplating chamber 32, and the cleaning chamber 33 are located on one side of the process robot 30, multiple electroplating chambers 32 are located between the pre-wetting chamber 31 and the cleaning chamber 33, and multiple electropolishing chambers 34 are located on the other side of the process robot 30. By placing the electroplating chambers 32 and electropolishing chambers 34 on both sides of the process robot 30, the travel distance of the process robot 30 can be shortened, the transmission efficiency improved, the overall process time shortened, and high production capacity achieved.

[0047] To reduce the equipment's footprint while ensuring high productivity, in some embodiments, the processing module 3 can be configured as a double-layer structure, with multiple process cavities on each layer. Correspondingly, the number of process robots 30 is also increased. Referring to Figure 5, all process cavities in the embodiment shown in Figure 4 are configured in upper and lower layers, with the same number, type, and arrangement of cavities in both layers. In Figure 5, solid-lined rounded squares and dashed-lined rounded squares represent the upper and lower process cavities, respectively. For example, the equipment includes two process robots 30, used to transfer panels between the upper and lower process cavities.

[0048] In other embodiments, due to the large cavity space of the electroplating chamber 32, it is configured as a single layer, as shown in Figure 6, while the other chambers, such as the pre-wetting chamber 31, cleaning chamber 33, and electropolishing chamber 34, are configured as upper and lower layers. This layout ensures high production capacity while reducing the equipment's footprint and volume.

[0049] This application also proposes a method for panel metal deposition and thinning, as shown in Figure 7, which includes the following steps:

[0050] Step S11: Perform a pre-wetting process on the panel surface in the pre-wetting chamber 31;

[0051] Step S12: Deposit a metal layer on the panel surface using an electroplating process in the electroplating chamber 32;

[0052] Step S13: Clean the panel surface in the cleaning chamber 33;

[0053] Step S14: The metal layer on the panel surface is thinned by electrochemical polishing process in the electropolishing chamber 34.

[0054] Step S15: Clean the panel surface in cleaning chamber 33.

[0055] In some embodiments, the following steps are further included after step S15:

[0056] Step S16: Perform an annealing process on the panel;

[0057] Step S17: Remove the metal layer on the panel surface using a chemical mechanical polishing process.

[0058] Steps S11 to S15 are all performed in the aforementioned panel metal deposition and thinning equipment.

[0059] The panel metal deposition and thinning equipment proposed in this application integrates electroplating and electrochemical polishing processes into a single unit. After electroplating and cleaning, electrochemical polishing is used to thin the metal layer on the panel surface, reducing panel stress. In the subsequent chemical mechanical polishing (CMP) process, the thickness of the metal layer to be removed from the panel surface is reduced, shortening the CMP process time, reducing the consumption of process chemicals and consumables, lowering process costs, and increasing the production capacity of the CMP equipment.

[0060] The above embodiments are merely illustrative of the principles and effects of this application and are not intended to limit this application. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this application. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this application should still be covered by the claims of this application.

Claims

1. A panel metal deposition and thinning apparatus, characterized in that, include: The panel is equipped with a port, a front-end module, and a processing module, wherein the processing module includes multiple process chambers; The plurality of process chambers include a pre-wetting chamber, an electroplating chamber, a cleaning chamber, and an electropolishing chamber; wherein the number of electropolishing chambers is greater than the number of electroplating chambers.

2. The panel metal deposition and thinning equipment according to claim 1, characterized in that, It also includes a process robot, which is disposed in the processing module and is used to transfer the panel in the order of pre-wetting chamber, electroplating chamber, cleaning chamber, electropolishing chamber and cleaning chamber.

3. The panel metal deposition and thinning equipment according to claim 1, characterized in that, It also includes a front-end robotic arm, which is disposed in the front-end module and is used to transfer the panel between the panel loading port and the processing module.

4. The panel metal deposition and thinning equipment according to claim 2, characterized in that, The multiple process cavities are symmetrically arranged on both sides of the process robot or on the outer periphery of the process robot.

5. The panel metal deposition and thinning apparatus according to claim 1, characterized in that, The ratio of the number of electroplating chambers to the number of electropolishing chambers is 1:

2.

6. The panel metal deposition and thinning apparatus according to claim 3, characterized in that, It also includes a cache module located between the front-end module and the processing module for placing the panel.

7. The panel metal deposition and thinning apparatus according to claim 6, characterized in that, The front-end robot is also used to transfer the panel between the panel loading port and the cache module, and the process robot is also used to transfer the panel between the cache module and the processing module.

8. The panel metal deposition and thinning apparatus according to claim 2, characterized in that, The pre-wetting chamber, electroplating chamber, cleaning chamber, and electropolishing chamber are sequentially arranged on both sides of the process robot.

9. The panel metal deposition and thinning apparatus according to claim 2, characterized in that, The pre-wetting chamber and the cleaning chamber are respectively located on both sides of the process robot.

10. The panel metal deposition and thinning apparatus according to claim 2, characterized in that, The pre-wetting chamber, electroplating chamber, and cleaning chamber are located on one side of the process robot, and the electropolishing chamber is located on the other side of the process robot.

11. The panel metal deposition and thinning apparatus according to claim 1, characterized in that, The multiple process cavities in the processing module are arranged in a double layer, wherein the upper and lower process cavities have the same layout.

12. The panel metal deposition and thinning apparatus according to claim 1, characterized in that, Some of the multiple process cavities are double-layered, while others are single-layered.

13. The panel metal deposition and thinning apparatus according to claim 12, characterized in that, The electroplating chamber is a single-layer structure, while the pre-wetting chamber, cleaning chamber, and electropolishing chamber are all double-layer structures.

14. A method for metal deposition and thinning of a panel, applied to the panel metal deposition and thinning apparatus according to any one of claims 1-13, characterized in that, The method includes the following steps: Step S11: Perform a pre-wetting process on the panel surface; Step S12: Deposit a metal layer on the panel surface using an electroplating process; Step S13: Clean the panel surface; Step S14: The metal layer on the panel surface is thinned using an electrochemical polishing process; Step S15: Clean the panel surface.

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