Dual-chip card structure based on electrical shielding layer

Abstract

A dual-chip card structure based on an electrical shielding layer, comprising: an electrical shielding layer (101), printing layers (102) arranged on two sides of the electrical shielding layer (101), and chip antenna layers (103) each arranged between the electrical shielding layer (101) and the corresponding printing layer (102). Signal interference can be avoided, and the performance of the dual-chip card can be improved.

Description

A dual-core card structure based on an electrical shielding layer Technical Field

[0001] This utility model relates to the field of functional card structures, and in particular to a dual-core card structure based on an electrical shielding layer. Background Technology

[0002] Existing cards include traditional magnetic stripe cards, chip cards (such as contact and contactless IC cards), and smart cards with NFC functionality. Magnetic stripe cards are gradually being phased out due to their low security and ease of duplication. Chip cards, with their built-in microprocessors, enable encrypted transactions and identity authentication, significantly improving security and are widely used in financial payments, identity authentication, and transportation. Contactless IC cards and NFC cards support fast transactions and convenient communication, making them suitable for mobile payments and access control, but they face challenges such as signal interference and high costs. This prevents dual-chip cards from being commercialized and from meeting more complex market applications. Summary of the Invention

[0003] Therefore, a dual-core structure for a single card that can shield against signal interference is needed.

[0004] To achieve the above objectives, the inventors provide a dual-core card structure based on an electrical shielding layer, comprising: an electrical shielding layer, printed layers on both sides of the electrical shielding layer, and a chip antenna layer between the electrical shielding layer and the printed layers.

[0005] As a preferred structure of this utility model, the chip antenna layer is an NFC chip antenna layer, an IC chip antenna layer, an ID chip antenna layer, or an RFID chip antenna layer.

[0006] As a preferred structure of this utility model, a first intermediate layer is provided between the chip antenna layer and the printed layer.

[0007] As a preferred structure of this utility model, the chip antenna layer and the electrical shielding layer are each provided with a second intermediate layer.

[0008] As a preferred structure of this utility model, the material of the electrical shielding layer is aluminum, copper, nickel, silver, iron, nickel-iron alloy or silicon steel sheet.

[0009] As a preferred structure of this utility model, the material of the electrical shielding layer is a coating or film made of conductive or magnetic material.

[0010] As a preferred structure of this utility model, the material of the electrical shielding layer is a nanomaterial, a wave-absorbing material, or a flexible material woven from metal fibers.

[0011] Unlike existing technologies, the above technical solution achieves the following beneficial effects: This dual-card structure effectively solves the signal interference problem of dual-card, enabling the further commercialization of dual-card and providing hardware support for commercial applications based on dual-card, thus having broad market application prospects. Attached Figure Description

[0012] Figure 1 is an exploded view of the dual-core card structure described in the specific embodiment.

[0013] Explanation of reference numerals in the attached figures:

[0014] 101. Electrical shielding layer; 102. Printed layer; 103. Chip antenna layer; 104. First intermediate layer; 105. Second intermediate layer. Detailed Implementation

[0015] To explain in detail the technical content, structural features, objectives, and effects of the technical solution, the following description is provided in conjunction with specific embodiments and accompanying drawings.

[0016] As shown in Figure 1, this embodiment provides a dual-core card structure based on an electrical shielding layer, including: an electrical shielding layer 101, printed layers 102 on both sides of the electrical shielding layer 101, and a chip antenna layer 103 between the electrical shielding layer 101 and the printed layers 102.

[0017] In the above embodiments, the chip antenna layer 103 is an NFC chip antenna layer, an IC chip antenna layer, an ID chip antenna layer, or an RFID chip antenna layer, including an NFC chip antenna layer on one side and an IC chip antenna layer or other chip antenna layers on the other side. That is, the two sides of the electrical shielding layer can be the same type of chip antenna layer or different types of chip antenna layers.

[0018] In some embodiments, a first intermediate layer 104 is provided between the chip antenna layer 103 and the printed layer 102. In different embodiments, a second intermediate layer 105 is provided between the chip antenna layer 103 and the electrical shielding layer 101.

[0019] In the above embodiments, the material of the electrical shielding layer 101 is aluminum, copper, nickel, silver, iron, nickel-iron alloy, or silicon steel sheet. Aluminum is lightweight and low-cost, widely used in shielding bags or covers; copper offers excellent shielding performance and is commonly used for shielding high-precision equipment; nickel has good conductivity and high corrosion resistance; silver has the strongest conductivity but is more expensive, suitable for demanding shielding environments. Aluminum, copper, nickel, and silver are easily processed into thin films, meshes, or solid shielding layers, providing good shielding for signals at 13.56MHz, the NFC operating frequency. Iron is low-cost with moderate shielding performance; nickel-iron alloys, such as Permalloy, have high permeability and are particularly suitable for shielding low-frequency magnetic fields; silicon steel sheets are used to shield high-power electromagnetic fields or strong magnetic fields. Iron, nickel-iron alloys, or silicon steel sheets offer significant shielding effects for low-frequency electromagnetic waves and are suitable for near-field applications, such as NFC and magnetic signal shielding.

[0020] In some embodiments, the material of the electrical shielding layer 101 can also be a coating or film made of conductive or magnetic materials, suitable for flexible or space-constrained devices. Specifically, conductive coatings, such as coatings containing copper, silver, graphene, etc., can form a shielding layer on the surface. Shielding films: multi-layered structures of composite metals and plastics, such as aluminum foil composite films, are suitable for shielding portable devices and NFC tags. Coatings or films made of conductive or magnetic materials are thin and lightweight, suitable for mobile devices or small electronic products.

[0021] In some embodiments, the material of the electrical shielding layer 101 can also be nanomaterials, microwave absorbing materials, or flexible materials woven from metal fibers. In recent years, nanotechnology has provided thinner and more efficient shielding materials, such as graphene, which has extremely high conductivity and excellent shielding performance; and nanomaterial metal powder composites, such as copper or nickel nanoparticles. Nanomaterials offer lightweight design and higher shielding efficiency, making them suitable for high-end applications. Microwave absorbing materials reduce signal strength by absorbing electromagnetic wave energy, rather than reflecting it. Commonly used materials include ferrite materials, which absorb magnetic field energy and are suitable for shielding NFC signals; and carbon-based composite materials, such as carbon fibers and carbon nanotubes, which do not cause strong reflections, avoiding signal interference and are suitable for scenarios requiring high absorption performance. Flexible materials woven from metal fibers or woven with ordinary fibers, such as copper fibers, nickel fibers, or silver fibers, possess high flexibility and are suitable for manufacturing portable shielding products.

[0022] It should be noted that although the above embodiments have been described herein, this does not limit the scope of patent protection for this utility model. Therefore, any changes and modifications made to the embodiments described herein based on the innovative concept of this utility model, or equivalent structural or procedural transformations made using the content of this utility model's specification and drawings, directly or indirectly applying the above technical solutions to other related technical fields, are all included within the scope of patent protection for this utility model.

Claims

1. A dual-core card structure based on an electrical shielding layer, characterized in that, include: An electrical shielding layer is provided, with printed layers on both sides of the electrical shielding layer, and a chip antenna layer is provided between the electrical shielding layer and the printed layers.

2. The dual-core card structure based on an electrical shielding layer according to claim 1, characterized in that: The chip antenna layer is an NFC chip antenna layer, an IC chip antenna layer, an ID chip antenna layer, or an RFID chip antenna layer.

3. The dual-core card structure based on an electrical shielding layer according to claim 1 or 2, characterized in that: A first intermediate layer is provided between the chip antenna layer and the printed layer.

4. The dual-core card structure based on an electrical shielding layer according to claim 1 or 2, characterized in that: The chip antenna layer and the electrical shielding layer are each provided with a second intermediate layer.

5. The dual-core card structure based on an electrical shielding layer according to claim 1 or 2, characterized in that: The material of the electrical shielding layer is aluminum, copper, nickel, silver, iron, nickel-iron alloy, or silicon steel sheet.

6. The dual-core card structure based on an electrical shielding layer according to claim 1 or 2, characterized in that: The material of the electrical shielding layer is a coating or film made of conductive or magnetic material.

7. The dual-core card structure based on an electrical shielding layer according to claim 1 or 2, characterized in that: The material of the electrical shielding layer is nanomaterial, microwave absorbing material, or flexible material woven from metal fibers.

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