Laser-welded Anti-theft electronic tag

By using laser welding technology to form multiple welding points with the same shape in the anti-theft electronic tag, the problem of precision and stability of mechanical connection methods is solved, and a more efficient and stable connection effect is achieved, which is suitable for different temperature environments.

WO2026124319A1PCT designated stage Publication Date: 2026-06-18CHECKPOINT SYSTEMS (JIANGSU) CO LTD

Patent Information

Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
CHECKPOINT SYSTEMS (JIANGSU) CO LTD
Filing Date
2025-12-03
Publication Date
2026-06-18

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  • Figure CN2025139647_18062026_PF_FP_ABST
    Figure CN2025139647_18062026_PF_FP_ABST
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Abstract

The present invention relates to a laser-welded anti-theft electronic tag, which comprises a thin film layer, and a first metal circuit layer and a second metal circuit layer arranged on two sides of the thin film layer. The first metal circuit layer comprises a first capacitor plate, a coil, and a first connecting line, and the second metal circuit layer comprises a second capacitor plate and a second connecting line. The first capacitor plate and the second capacitor plate, as well as the first connecting line and the second connecting line are disposed at positions corresponding to one another on two sides of the thin film layer. Said tag is characterized in that the first connecting line and the second connecting line form a welding point by means of laser welding. The present invention enables a connection point of an electronic tag to be processed with higher precision, higher quality, faster speed, and better appearance consistency, and also enables the firmness of the connection point to be better, thereby enabling the performance of the electronic tag to be more stable and reliable.
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Description

Laser-welded anti-theft electronic tag TECHNICAL FIELD

[0001] The present application relates to the technical field of anti-theft electronic tags (EAS tags), in particular to a laser-welded anti-theft electronic tag. BACKGROUND

[0002] The electronic tag is mainly composed of a coil surface, a film layer and a capacitor surface, and the three layers are compounded together by glue. The metal aluminum foil of the coil surface (i.e. a surface mainly containing a coil circuit and part of a capacitor circuit) and the capacitor surface (i.e. a surface mainly containing part of a capacitor circuit) are connected to form an LC oscillation loop, as shown in Fig. 1. In a spatial electromagnetic field environment, the LC oscillation loop can generate LC oscillation through electromagnetic induction, emit a specific frequency radio frequency signal, and the radio frequency signal is recognized by a corresponding antenna system and an alarm is triggered to realize the alarm anti-theft function. The electronic tag can be designed into different sizes, shapes and thicknesses of circuits to realize different tag performance and identification strength.

[0003] The existing technology mainly connects the metal aluminum foils of the coil surface and the capacitor surface separated by the film layer by mechanical perforation to realize physical connection of the two aluminum foils, i.e. a flat pressure file perforation connects the metal aluminum foils of the coil surface and the capacitor surface to play a conduction role, as shown in Fig. 2, the existing mechanical connection point. The processing method and the disadvantages of the processing method are low precision (easy to be off-center), low production efficiency, and the mechanical file is easy to wear out in frequent work, which leads to poor connection of the metal foils of the coil surface and the capacitor surface, affects the connection performance of the product and the production yield. From the appearance of the connection point, the mechanical connection point is irregular in shape and has a protrusion. The protrusion part has some thick points, some thin points, some perforated points and some unperforated points (not well connected). The finished tag is easy to be affected by the external environment due to the mechanical connection of the connection point, such as the thermal expansion and cold contraction of the connection point caused by the high and low temperature of the environment, which easily leads to failure, and the application range of the tag is easily limited. SUMMARY

[0004] The present application aims to provide a laser-welded anti-theft electronic tag, which mainly solves the problems existing in the prior art, and can make the processing precision of the connection point of the electronic tag higher, the quality better, the speed faster, the appearance consistency better, and the connection point more firm, so as to make the performance of the electronic tag more stable and reliable.

[0005] The specific technical scheme of the present application is as follows:

[0006] A laser-welded anti-theft electronic tag includes a thin film layer and a first metal circuit layer and a second metal circuit layer disposed on both sides of the thin film layer; the first metal circuit layer includes a first capacitor plate, a coil, and a first connecting line, and the second metal circuit layer includes a second capacitor plate and a second connecting line; the first and second capacitor plates, the first and second connecting lines are all correspondingly disposed on both sides of the thin film layer; the first and second connecting lines are characterized in that the first and second connecting lines form welding points by laser welding.

[0007] The laser-welded anti-theft electronic tag is characterized in that: the welding points are multiple and have the same shape.

[0008] The laser-welded anti-theft electronic tag is characterized in that: the welding points are multiple and arranged in an array.

[0009] The laser-welded anti-theft electronic tag is characterized in that: the welding points are multiple and form a grid shape.

[0010] The laser-welded anti-theft electronic tag is characterized in that the materials of the first metal circuit layer and the second metal circuit layer are aluminum foil.

[0011] Compared with the prior art, the present invention has the following advantages:

[0012] The electronic tag of the present invention forms welding points on its first and second connecting lines using laser welding. This structure enables higher processing precision, higher quality, faster processing speed, and better appearance consistency at the connection points of the electronic tag (eliminating problems such as irregular connection point shapes, protrusions, uneven thickness of protrusions, and inconsistent penetration). It also improves the strength of the connection points, making the electronic tag's performance more stable and reliable.

[0013] Because the welding points of this invention are formed by the high-temperature melting of metal, the welding points are relatively strong and are not affected by the external temperature. This eliminates the disadvantages of mechanical welding and makes the label's application range wider. It can be used on frozen products at lower temperatures as well as in environments with higher temperatures. Attached Figure Description

[0014] Figure 1 is a circuit diagram of an anti-theft electronic tag (i.e., a schematic diagram of an LC oscillation circuit).

[0015] Figure 2 is an appearance diagram of the mechanical connection point of an existing anti-theft electronic tag.

[0016] Figure 3 is a schematic diagram of the structure of the anti-theft electronic tag of the present invention.

[0017] Figure 4 is a schematic diagram of the processing method of the anti-theft electronic tag of the present invention.

[0018] Figure 5 is a schematic diagram of the second processing method of the anti-theft electronic tag of the present invention.

[0019] Figure 6 is an appearance view of the anti-theft electronic tag of the present invention with multiple welding points.

[0020] Figure 7 is an appearance diagram of the anti-theft electronic tag of the present invention with multiple welding points.

[0021] Figure 8 is an appearance diagram of the anti-theft electronic tag of the present invention with multiple welding points. Detailed Implementation

[0022] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0023] Please refer to Figures 3 and 4, which are schematic diagrams of a laser-welded anti-theft electronic tag. As shown, it includes a thin film layer 2 and a first metal circuit layer 1 and a second metal circuit layer 3 (e.g., the material of the first metal circuit layer 1 and the second metal circuit layer 3 is aluminum foil) disposed on both sides of the thin film layer 2. The first metal circuit layer 1 includes a first capacitor plate, a coil, and a first connecting line; the second metal circuit layer 3 includes a second capacitor plate and a second connecting line; the first and second capacitor plates, the first connecting line, and the second connecting line are all correspondingly positioned on both sides of the thin film layer 2. The first and second connecting lines form welding points 4 through laser welding.

[0024] The laser welding method forms the welding point 4 by irradiating the laser beam 5 onto the predetermined welding point position on the first or second connecting line of the electronic tag, causing the aluminum foil and film on both sides to melt at high temperature. The circuits on the first metal circuit layer 1 and the second metal circuit layer 3 are welded together after melting, making the entire circuit conductive and forming the LC circuit required by the electronic tag.

[0025] Figure 4 shows the laser beam 5 irradiating from the second metal circuit layer 3 towards the first metal circuit layer 1 during the processing, thus processing the laser welding point. Figure 5 shows the laser beam 5 irradiating from the first metal circuit layer 1 towards the second metal circuit layer 3 during the processing, thus processing the laser welding point. The effect of both is essentially the same.

[0026] In this invention, the connection points are processed using laser welding. Lasers possess advantages such as high monochromaticity, high coherence, high directionality, and high energy. Laser welding enables higher precision, faster processing, and better appearance consistency at the electronic tag welding points. Furthermore, the high-temperature laser welding melts the metal, resulting in stronger weld points. Laser welding overcomes the limitations of existing connection technologies, making the processing of electronic tag connection points more precise and efficient, while also ensuring more stable and reliable electronic tag performance.

[0027] In this invention, the processed welding point 4 can be one or more. When the welding point 4 is processed into multiple parts, it can take the following forms:

[0028] In the first form, as shown in Figure 6, there are multiple welding points 4 with the same shape.

[0029] The second form, as shown in Figure 7, has multiple welding points 4 arranged in an array.

[0030] The third form, as shown in Figure 8, has multiple welding points 4 that form a grid shape.

[0031] Regardless of the method used, the shapes of the connection points are relatively regular and neat, and the surfaces show traces of high-temperature welding, with some metal surfaces showing signs of charring and blackening. It is also very easy to distinguish between laser-welded and machined connection points by appearance.

[0032] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A laser-welded anti-theft electronic tag, comprising a thin film layer (2) and a first metal circuit layer (1) and a second metal circuit layer (3) disposed on both sides of the thin film layer (2); the first metal circuit layer (1) includes a first capacitor plate, a coil, and a first connecting line, and the second metal circuit layer (3) includes a second capacitor plate and a second connecting line; the first capacitor plate and the second capacitor plate, the first connecting line and the second connecting line are all disposed on both sides of the thin film layer (2); characterized in that: The first connecting line and the second connecting line form a welding point (4) by laser welding.

2. The anti-theft electronic tag welded by laser according to claim 1, characterized in that: The welding point (4) has multiple points and is of the same shape.

3. The anti-theft electronic tag welded by laser according to claim 1, characterized in that: The welding point (4) has multiple points and is distributed in an array.

4. The anti-theft electronic tag welded by laser according to claim 1, characterized in that: The welding point (4) has multiple points and forms a grid shape.

5. The laser-welded anti-theft electronic tag according to claim 1, 2, 3, or 4, characterized in that: The first metal circuit layer (1) and the second metal circuit layer (3) are made of aluminum foil.