Electronic device

By incorporating heat dissipation and heat conduction devices into foldable electronic devices and utilizing the overall space for heat dissipation, the overheating problem caused by the concentration of heat-generating components is solved, achieving rapid and efficient overall heat dissipation and improving device performance.

WO2026124543A1 Publication Date: 2026-06-18HUAWEI TECH CO LTD
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Patent Information

Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
HUAWEI TECH CO LTD
Filing Date
2025-12-10
Publication Date
2026-06-18

AI Technical Summary

⚠Technical Problem

The heat-generating components of existing foldable electronic devices are concentrated on one side, causing that side to overheat and affecting the overall performance of the device.

⚗Method used

By incorporating heat dissipation and heat conduction devices into foldable electronic devices, heat dissipation is achieved by utilizing the overall space of the device. The heat dissipation device quickly dissipates some of the heat, while the heat conduction device conducts the remaining heat to the casing where the heat dissipation capacity is not fully utilized, thus achieving rapid and efficient heat dissipation.

🎯Benefits of technology

It improves the overall heat dissipation efficiency of electronic devices, reduces the heat dissipation pressure of heat concentrated on one side, and enhances the overall performance of the device.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present application relates to an electronic device. The electronic device comprises a first housing, a second housing, a folding mechanism, a flexible display screen, a first heat generation member, a heat dissipation apparatus and a first heat conduction apparatus, wherein the folding mechanism connects the first housing to the second housing, and can unfold or fold the first housing relative to the second housing; the first housing, the second housing and the folding mechanism jointly support the flexible display screen; the first heat generation member is located in the first housing; the heat dissipation apparatus is located in the first housing, and the heat dissipation apparatus is configured to dissipate part of heat energy of the first heat generation member out of the electronic device; and a first end of the first heat conduction apparatus is located in the first housing, a second end of the first heat conduction apparatus is located in the second housing, and the first heat conduction apparatus is configured to conduct the other part of the heat energy of the first heat generation member into the second housing. The electronic device in the present application has a high level of heat dissipation efficiency and a good heat dissipation effect.
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