Cooling system and electronic device

Abstract

Embodiments of the present application provide a cooling system and an electronic device. The cooling system includes a working chamber, a storage tank, and a supplying system and a recycling system, the working chamber includes N socket area(s) installed on a side of the working chamber, wherein the N socket area(s) is configured to install N heat-stressed electronic component(s) respectively, when the N heat-stressed electronic component(s) is installed on the N socket area(s), N is a positive integer greater than or equal to 1. The working chamber further includes N atomizer(s), wherein the N atomizer(s) is in one-to-one correspondence with the N socket area(s), each of the N atomizer(s) is mounted opposite to a corresponding socket area. The storage tank is configured to storing working liquid. The supplying system is configured to supply the working liquid to the N atomizer(s); and the recycling system is configured to extract the working liquid from the working chamber. The cooling system is simple yet efficient in reducing the temperature of the heat-stressed electronic component.

Description

COOLING SYSTEM AND ELECTRONIC DEVICETECHNICAL FIELD

[0001] The present application relates to the field of cooling technology for electronic equipment, and in particular relates to a cooling system and an electronic device.BACKGROUND

[0002] As the functionality of electronic components continues to increase, their power consumption also rises, leading to a phenomenon of high-power density. This high-power density results in rapid heat accumulation, which can cause overheating issues that adversely affect the performance, stability, and lifespan of electronic components. Overheating not only reduces operational efficiency but may also lead to system crashes or failures, increasing maintenance and replacement costs.

[0003] It is desirable to design an efficient passive heat dissipation method to ensure that the electronic components operate effectively while maintaining a suitable operating temperature. This not only enhances reliability of the electronic components but also extends its service life, meeting the high performance and reliability demands of modem electronic products.SUMMARY

[0004] Embodiments of the present application provide a cooling system and an electronic device. The cooling system is simple yet efficient in reducing the temperature of the heat- stressed electronic component.

[0005] According to a first aspect, an embodiment of the present application provides a cooling system. The cooling system includes a working chamber, a storage tank, and a supplying system and a recycling system, the working chamber includes N socket area(s) iinstalled on a side of the working chamber, wherein the N socket area(s) is configured to install N heat-stressed electronic component(s) respectively, when the N heat-stressed electronic component(s) is installed on the N socket area(s), N is a positive integer greater than or equal to 1. The working chamber further includes N atomizer(s), wherein the N atomizer(s) is in one- to-one correspondence with the N socket area(s), each of the N atomizer(s) is mounted opposite to a corresponding socket area. The storage tank is configured to storing working liquid. The supplying system is configured to supply the working liquid to the N atomizer(s); and the recycling system is configured to extract the working liquid from the working chamber.

[0006] The cooling system provided by the present application is easily scalable. The cooling system is applicable for one or more heat-stressed electronic components

[0007] In a possible design of the first aspect, each of the N atomizer(s) satisfies at least one of the followings: a distance from an exit section of each of the N atomizer(s) to a surface of a heat-stressed electronic component installing on the corresponding socket area is selected from a range of 4.5 to 27mm; a spray angle rang is 60° to 120°; a pressure variation range is 2 to 6 atmosphere(atm); a flow variation range is 50-123 g / s.

[0008] In a possible design of the first aspect, a nozzle of the atomizer is a full-cone singlephase nozzle with a swirler, whose spray pattern represents a cone with a circle-shape base or a square-shaped base.

[0009] According to this solution, the working liquid may be sprayed more evenly on the surface of the heat-stressed electronic component.

[0010] In a possible design of the first aspect, the swirler is made inside the nozzle of the atomizer in a form of at least two channels directed to an outlet of the nozzle in a form of a smooth spiral.

[0011] In a possible design of the first aspect, when the N heat-stressed electronic component(s) is installed on the N socket area(s), an axis of each of the N atomizer(s) is perpendicular to a surface plan of a heat-stressed electronic component installed on the corresponding socket area and intersects with a geometrical center of the heat-stressed electronic component installed on the corresponding socket area.

[0012] In a possible design of the first aspect, an accuracy of the axis of each of the N atomizer(s) in three axes of a rectangular coordinate system is less than or equal to 0.5mm.

[0013] In a possible design of the first aspect, the recycling system includes a first recycling sub-system and a second recycling sub-system, the first recycling sub-system is configured to recycle the working liquid from a bottom part of the working chamber, the second recycling sub-system is configured to recycle a vapor of the working liquid from an upper part of the working chamber.

[0014] In a possible design of the first aspect, the second recycling sub-system includes a first pipe, a second pipe, and a first cooling sub-system, a first end of the first pipe connects to a vapor outlet located on the upper part of the working chamber, while a second end of the first pipe connects to an inlet of the first cooling sub-system; a first end of the second pipe connects to an outlet of the first cooling sub-system, while a second end of the second pipe connects to a first inlet of the storage tank.

[0015] Using the second recycling sub-system, the working liquid vapor can be converted back into liquid and then collected in the storage tank.

[0016] In a possible design of the first aspect, the cooling system further includes a temperature regulation system connected to the storage tank, wherein the temperature regulation system is configured to control temperature of the working liquid in a preset temperature range, wherein an upper limit of the preset temperature range is equal to or less than a boiling point of the working liquid.

[0017] The temperature regulation system may regulate the working liquid temperature to an optimal level, ensuring the best cooling effect.

[0018] In a possible design of the first aspect, the temperature regulation system includes a heating sub-system, configured to heat the working liquid when the temperature of the working liquid is below the preset temperature range;

[0019] In a possible design of the first aspect, the temperature regulation system includes a second cooling sub-system, configured to cool the working liquid when the temperature of the working liquid is over the preset temperature range.

[0020] In a possible design of the first aspect, the cooling system further includes a sensor system, wherein the sensor system includes at least one of the followings: at least one temperature sensor; at least one pressure sensor; at least one flowmeter; or at least one working liquid level sensor.

[0021] The temperature sensor monitors the working liquid temperature, allowing the temperature regulation system to adjust it based on the detected reading. The pressure sensor is used to monitor pressure, preventing excessive pressure from damaging the cooling system. The flowmeter detects the water flow speed, allowing adjustments to be made to maintain an appropriate flow rate. The working liquid level sensor monitors the working liquid level, enabling adjustments to the flow rate and other parameters accordingly.

[0022] In a possible design of the first aspect, the at least one temperature sensor includes: a first temperature sensor, configured to measure a temperature of the working liquid in the supplying system; and / or a second temperature sensor, configured to measure a temperature of the working liquid in the storage tank.

[0023] In a possible design of the first aspect, the at least one pressure sensor includes: a first pressure sensor, configured to measure pressure in the working chamber; and / or a second pressure sensor, configured to measure pressure in the supplying system.

[0024] In a possible design of the first aspect, the at least one flowmeter includes: a first flowmeter, configured to measure a flow rate of the working liquid moving through the supplying system.

[0025] In a possible design of the first aspect, the at least one working liquid level sensor includes: a first level sensor, configured to measure a working liquid level in the storage tank.

[0026] In a possible design of the first aspect, the cooling system further includes a controller, wherein the controller is configured to control a controllable component in the cooling system according to a measuring result collected from the sensor system.

[0027] In a possible design of the first aspect, the cooling system further includes a filter system, wherein the filter system includes a first filter sub-system and / or a second filter subsystem, the first filter sub-system is configured to filter the working liquid recycled from the working chamber; the second filter sub-system is configured to filter the working liquid being supplied to the N atomizer(s).

[0028] The filter removes impurities from the working liquid to prevent them from damaging the heat-stressed electronic component.

[0029] According to a second aspect, an embodiment of the present application provides an electronic device. The electronic device includes N heat-stressed electronic component(s) andthe cooling system according to the first aspect or any one of possible design of the first aspect.DESCRIPTION OF DRAWINGS

[0030] FIG. 1 illustrates a cooling system provided by some embodiments of the present application.

[0031] FIG. 2 illustrates another cooling system provided by some embodiments of the present application.

[0032] FIG. 3 illustrates a cooling system provided by the present application.

[0033] FIG. 4 illustrates a cooling system according to some embodiments of the present application.

[0034] FIG. 5 illustrates a cooling system according to some embodiments of the present application.

[0035] FIG. 6 illustrates another second recycling sub-system including the first cooling sub-system.

[0036] FIG. 7 illustrates the cooling system with the temperature regulation.

[0037] FIG. 8 illustrates a cooling system with a filter.

[0038] FIG. 9 illustrates a cooling system with a sensor system.

[0039] FIG. 10 illustrates a schematic diagram of the controller and related components.DESCRIPTION OF EMBODIMENTS

[0040] The following describes the technical solutions in the present application with reference to the accompanying drawings.

[0041] The terms such as "first" and "second" below are merely for a descriptive purpose, and cannot be understood as indicating or implying relative importance, or implicitly indicating a quantity of indicated technical features. Therefore, the features defined by "first" and "second" can explicitly or implicitly include one or more features.

[0042] In addition, in this application, terms of direction such as "upper", "lower", "left", "right", "horizontal", and "vertical" are defined relative to an illustrated placement position of a component in an accompanying drawing. It should be understood that these directional termsare relative concepts and are used to describe and clarify relativity, and may be changed accordingly as a placement position of the component in the accompanying drawing changes.

[0043] As used herein, "at least one" means one or more, and "a plurality of means two or more, "and / or" describes an association relationship of associated objects, and indicates that there may be three relationships. For example, A and / or B may indicate cases includes “only A”, “both A and B”, and “only B”, where A and B may be singular or plural. The character " / " generally indicates that the associated objects are in an OR relationship. "At least one of the following items" or a similar expression thereof refers to any combination of these items, including any combination of a single item or a plurality of items. For example, “at least one of a, b, or c” may represent a, b, c, “a and b”, “a and c”, “b and c”, or “a, b and c”, where a, b, and c may be a single or multiple form.

[0044] FIG. 1 illustrates a cooling system provided by some embodiments of the present application. Referring to FIG. 1, a cooling system 100 includes a working chamber 110, a storage tank 120, a supplying system 130 and a recycling system 140.

[0045] The working chamber 110 includes a socket area. The socket area is on a side wall of the working chamber. A socket 111 is placed on the socket area.

[0046] In some embodiments, the cooling system 100 does not include the socket 111. For example, the socket area may be an opening. The opening is configured to accommodate the socket 111. The opening is surrounded by sealing elements. When the working chamber is mounted on the socket 111 via the opening, the sealing elements may prevent air or liquid from entering the working chamber and to contain air or liquid inside the working chamber.

[0047] In some other embodiments, the cooling system 100 includes the socket 111. In this case, the socket area may be a sealed area for placing the socket 111.

[0048] The socket 111 is configured to install a heat-stressed electronic component 113. The heat-stressed electronic component 113 may be a chip, a system on chip (SoC), or the like. For example, the heat-stressed electronic component 113 may be a central processing unit (CPU), a graphics processing unit (GPU), a neural processing unit (NPU) or the like.

[0049] When the heat-stressed electronic component 113 is installed on the socket 111, a surface of the heat-stressed electronic component 113 is oriented perpendicular to a bottom of the working chamber 110.

[0050] The working chamber 110 further includes an atomizer 112. The atomizer 112 is mounted opposite to the socket area for placing the socket 111. When the heat-stressed electronic component 113 is installed on the socket 111, the atomizer 112 is opposite to the heat-stressed electronic component 113. A distance between a surface of the heat-stressed electronic component 113 and an exit section of the atomizer 112 may be denoted d.

[0051] In some embodiments, d may be greater than or equal to a first preset distance. For example, the first preset distance may be 2.5mm, 3.0mm. 3.5mm. 3.8mm, 4.0mm. 4.3mm, 4.5mm, 4.8mm, 5.0mm, 5.5mm, or the like.

[0052] In some other embodiments, d may be less than or equal to a second preset distance. For example, the second present distance may be 20.0mm, 20.5mm, 21.0mm, 21.5mm, 22.0mm, 23.0mm, 25.8mm, 26.0mm, 27.0mm, 28.0mm, 29.0mm, 30.0mm, 32.0mm or the like.

[0053] In some embodiments, d may be greater than or equal to the first preset distance, and, less than or equal to the second preset distance. For example, in some embodiments, d may satisfy: 4.5 mm < d < 27 mm. In some other embodiments, d may satisfy: 3.0 mm < d < 30 mm. In some other embodiments, d may satisfy: 3.5 mm < d < 29.8 mm.

[0054] In some embodiments, a spray angle of the atomizer 112 may be greater than or equal to a first preset spray angle. For example, the first preset spray angle may be 50°, 52°, 55°, 58°, 60°, 63°, 65°, among others.

[0055] In some other embodiments, the spray angle of the atomizer 112 may be less than or equal to a second preset angle. For example, the second preset spray angle may be 110°, 115°, 120°, 124°, 130°, among others.

[0056] In some other embodiments, the spray angle of the atomizer 112 may be greater than or equal to the first preset spray angle, and, less than or equal to the second preset spray angle. For example, a spray angle range may be 60° to 120°. For another example, the spray angle range may be 50° to 130°.

[0057] In some embodiments, a pressure variation of working liquid sprayed from the atomizer 112 may be greater than or equal to a first preset pressure. For example, the first preset pressure may be 1.5 atmosphere(atm), 1.8 atm, 2.0 atm, 2.1 atm, among others.

[0058] In some other embodiments, the pressure variation of the working liquid sprayed from the atomizer 112 may be less than or equal to a second preset pressure. For example, thesecond preset pressure may be 5.5 atm, 5.8 atm, 6.0 atm, 6.1 atm, 6.3 atm, among others.

[0059] In some other embodiments, the pressure variation may be greater than or equal to the first preset pressure, and, less than or equal to the second preset pressure. For example, a pressure variation range may be 2 to 6 atm. For another example, the pressure variation range may be 1.8 to 5.5 atm.

[0060] In some embodiments, a flow variation of the working liquid sprayed from the atomizer 112 may be greater than or equal to a first flow rate. For example, the first flow rate may be 35 gram / second (g / s), 38 g / s, 40 g / s, 45 g / s, 50 g / s, 52 g / s among others.

[0061] In some other embodiments, the flow variation of the working liquid sprayed from the atomizer 112 may be less than or equal to a second flow rate. For example, the second flow rate may be 110 g / s, 115 g / s, 120 g / s, 123 g / s, 125 g / s, 130 g / s, among others.

[0062] In some other embodiments, the flow variation may be greater than or equal to the first flow rate, and, less than or equal to the second flow rate. For example, a flow variation range may be 50-123 g / s. For another example, the flow variation range may be 55 to 130 g / s.

[0063] In some embodiments, a nozzle of the atomizer 112 may be a full-cone single-phase nozzle with a swirler, whose spray pattern represents a cone with a circle-shape base or a squareshape base.

[0064] In some embodiments, the swirler is made inside the nozzle of the atomizer 112 in a form of at least two channels directed to an outlet of the nozzle in a form of a smooth spiral.

[0065] In some embodiments, when the heat-stressed electronic component is installed on the socket 111 , an axis of the atomizer 112 is perpendicular to a surface plan of the heat-stressed electronic component 113 and intersects with a geometrical center of the heat-stressed electronic component 113.

[0066] In some embodiments, an accuracy of the axis of the atomizer 112 in three axes of a rectangular coordinate system is less than or equal to a first preset value. For example, the first preset value may be 0.35mm, 0.4mm, 0.5mm, 0.55m, 0.58mm, among others.

[0067] The storage tank 120 is configured to store the working liquid. The working liquid may be dielectric liquid. For example, the working liquid may be 3M™ dielectric liquid.

[0068] The supplying system 130 is configured to supply the working liquid stored in the storage tank 120 to the atomizer 113. Referring to FIG. 1, the supplying system 130 includes apipe 131. An inlet of the pipe 131 is mounted to the storage tank 130, and an outlet of the pipe 131 is mounted to an inlet of the atomizer 113. For example, there is an outlet at a bottom or a lower side of the storage tank 120. The inlet of the pipe 131 may be mounted to the outlet of the storage tank 120. There is an opening at a top or an upper side of the working chamber 110, allowing the pipe 131 to connect to the inlet of the atomizer 113 through the opening. For another example, the storage tank 120 and the pipe 131 may be molded integrally rather than being manufactured separately and then assembled.

[0069] As the storage tank 120 is placed under the working chamber 110, the working liquid should be pump to the atomizer 113. In some embodiments, a pump 132 may be mounted near the outlet of the pipe 131 or the opening of the working chamber 110 for pumping the working liquid from the storage tank 120. In some other embodiments, a pump 133 may be mounted near the inlet of the pipe 131 for pumping the working liquid from storage tank 120. In some other embodiments, the supplying system 130 may include both the pump 132 and the pump 133. A flow rate of the working liquid may be controlled by the pump 132 and / or the pump 133.

[0070] In some embodiments, the supplying system 130 may further include a valve (not shown in FIG. 1). The valve is configured to control the flow rate of the working liquid. For example, in some embodiments, the valve may be mounted near the outlet of the pipe 131 or the opening of the working chamber 110. In some other embodiments, the valve may be mounted near the inlet of the pipe 131. In some other embodiments, the supplying system 130 may include two valves, one of the two valves may be mounted near the outlet of the pipe 131, while another one may be mounted near the inlet of the pipe 131.

[0071] The recycling system 140 may include a first recycling sub-system. The first recycling sub-system is configured to recycle the working liquid from a bottom of the working chamber 110. Referring to FIG. 1, the first recycling sub-system includes a pipe 141. An inlet of the pipe 141 may be connected to a drain outlet of the working chamber 110. The drain outlet may be located at a bottom of the working chamber 110 or a lower part of a side of the working chamber 110, while an outlet of the pipe 141 may be connected to a top of the storage tank 120 or an upper part of a side of the storage tank 120. In some embodiments, the pipe 141 and the working chamber 110 may be molded integrally rather than being manufactured separately and then assembled. In some other embodiments, the pipe 141 and the storage tank 120 may bemolded integrally.

[0072] In some embodiments, the recycling system 140 may further include a second recycling sub-system. The second recycling sub-system is configured to recycle a vapor of the working liquid from an upper part of the working chamber 110. The working liquid is sprayed on the surface of the heat-stressed electronic component 113 may evaporate into the vapor of the working liquid (hereinafter referred to as “working liquid vapor”). The second recycling sub-system may collect the working liquid vapor from the working chamber 110. Referring to FIG. 1, the second recycling sub-system includes a pipe 142. An inlet of the pipe 142 may be connected to the upper part or the top of the working chamber 110, and an outlet of the pipe is connected to the top or the upper part of the side wall of the storage tank 120. For example, there is a vapor hole at the upper part or the top of the working chamber 110. The inlet of the pipe 142 may connect to the vapor hole. Similarly, there is an inlet at the top or the upper side of the storage tank 120 which is configured to connect to the outlet of the pipe 142. In some embodiments, the pipe 142 and the working chamber 110 may be molded integrally. In some other embodiments, the pipe 142 and the storage tank 120 may be molded integrally.

[0073] FIG. 2 illustrates another cooling system provided by some embodiments of the present application. Referring FIG. 2, a cooling system 200 includes a working chamber 210, a storage tank 220, a supplying system 230 and a recycling system 240.

[0074] The working chamber 210 is similar to the working chamber 110. Details about the working chamber 210, components in / installed in the working chamber 210 (e.g. a socket 211, a heat-stressed electronic component 213, an atomizer 212) may be referred to as above- mentioned embodiments. For the sake of brevity, it will not be elaborated here.

[0075] The storage tank 220 is arranged above the working chamber 210. Therefore, in some embodiments, there is no need to equip a pump for the supplying system 230. By calculation, the appropriate height and diameter of a pipe 231 can be determined to ensure that a flow rate in the pipe 231 meets a specified criterion.

[0076] In some embodiments, the supplying system 230 may include one or more pumps for control the flow rate. For example, a pump may be mounted near an outlet of the storage tank 220 and / or an opening of the working chamber 210.

[0077] In some embodiments, the supplying system 230 may include one or more valvesfor control the flow rate. For example, a valve may be mounted near an outlet of the storage tank 220 and / or an opening of the working chamber 210.

[0078] Similar to the cooling system 100, in some embodiments, the recycling system 240 may only include a first recycling sub-system for recycling working liquid from the working chamber 210. In some other embodiments, the recycling 240 may include the first recycling sub-system and a second sub-system. The second sub-system is configured to recycle a vapor of the working liquid from the working chamber 210.

[0079] The first recycling sub-system includes a pipe 241 and at least one of a pump 243 and a pump 244. The pump 243 and the pump 244 are configured to pump the working liquid from the working chamber 210 to the storage tank 220.

[0080] Similar to the first recycling sub-system, the second recycling sub-system includes a pipe 242 and one or more air pumps / fans for recycling the vapor of the working liquid from the working chamber 210.

[0081] Both the working chamber 110 illustrated in FIG. 1 and the working chamber 210 illustrated in FIG. 2 include one atomizer and a corresponding socket area. In some embodiments, a working chamber may include more than one atomizer and corresponding socket area. In other words, the working chamber may include two or more atomizers and two or more socket areas. The two or more atomizers are in one-to-one correspondence with the two or more socket areas. Relations between the atomizer and the corresponding socket area may refer to aforementioned embodiments. In general, the cooling system provided by the present application may include a working chamber, and the working chamber may include N socket area(s) and N atomizer(s), the N socket area(s) is in one-to-one correspondence with the N atomizer(s), N is a positive integer.

[0082] It should be noted that the cooling system 100 and the cooling system 200 merely illustrate two possible positional relations between the working chamber and the storage tank. However, this present application is not limited thereto.

[0083] For example, FIG. 3 illustrates a cooling system provided by the present application, and the cooling system include three atomizers and three socket areas.

[0084] Referring to FIG. 3, a cooling system 300 includes a working chamber 310, a storage tank 320, a supplying system 330, and a recycling system 340. ii

[0085] The storage tank 320 and the recycling system 340 are similar to those of the cooling system 100. Details about the storage tank 320 and the recycling system 340 may refer to the aforementioned embodiments, and we will refrain from elaborating further for the sake of brevity.

[0086] Unlike the working chamber 100 and the working chamber 200, the working chamber 300 includes three atomizers, an atomizer 312, an atomizer 316, and an atomizer 319. Each of the three atomizers has a corresponding socket area, and a socket is placed on the corresponding socket area. For example, a socket 311 is placed on a socket area corresponding to the atomizer 312, a socket 314 is placed on a socket area corresponding to the atomizer 316, and a socket 317 is placed on a socket area corresponding to the atomizer 139. Furthermore, a heat- stressed electronic component may be installed on the socket area. For example, a heat- stressed electronic component 313 may be installed on the socket 311 , a heat-stressed electronic component 315 may be installed on the socket 314, and a heat-stressed electronic component 318 may be installed on the socket 317.

[0087] Details of each of the three atomizers may refer to aforementioned embodiments. For example, a distance d may be selected from a range of the first preset distance and the second preset distance. The first preset distance may be 2.5mm, 3.0mm. 3.5mm. 3.8mm, 4.0mm. 4.3mm, 4.5mm, 4.8mm, 5.0mm, 5.5mm, or the like. The second present distance may be 20.0mm, 20.5mm, 21.0mm, 21.5mm, 22.0mm, 23.0mm, 25.8mm, 26.0mm, 27.0mm, 28.0mm, 29.0mm, 30.0mm, 32.0mm or the like.

[0088] A pipe 331 may have three outlets. The three outlets corresponding to the three atomizers. Each of the three outlets is mounted to an inlet of a corresponding atomizer. Similar to the supplying system 130, the supplying system 330 may include a pump 332 and / or a pump 333 for pumping the working liquid.

[0089] In some embodiments, the second recycling sub-system may include a first cooling sub-system. As previously mentioned, the second recycling sub-system is configured to recycle the vapor of the working liquid from the working chamber. The first cooling sub-system is configured to convert the vapor of the working liquid into the working liquid. The working liquid is drained to the storage tank.

[0090] FIG. 4 illustrates a cooling system according to some embodiments of the presentapplication. Referring to FIG. 4, a cooling system 400 includes a working chamber 410, a storage tank 420, a supplying system 430 and a recycling system 440.

[0091] Details about the working chamber 410, the storage tank 420, the supplying system 430 and a first recycling sub-system of the recycling system 440 may refer to the aforementioned embodiments.

[0092] Unlike the aforementioned embodiments, a second recycling sub-system further includes the first cooling sub-system, and the first cooling sub-system is a condenser 444. The second recycling sub-system includes two pipes, a pipe 442 and a pipe 443. The pipe 443 is configured to get the vapor of the working liquid from the working chamber 410 and convey the vapor of the working liquid to the condenser 444. The vapor of the working liquid condenses into the working liquid in the condenser 444 and drains into the storage tank 420 by the pipe 442. In some embodiments, a valve may be configured to control a flow rate of cooling agent of the condenser 444.

[0093] FIG. 5 illustrates a cooling system according to some embodiments of the present application. Referring to FIG. 5, a cooling system 500 includes a working chamber 510, a storage tank 520, a supplying system 530 and a recycling system 540.

[0094] Details about the working chamber 510, the storage tank 520, the supplying system 530 and a first recycling sub-system of the recycling system 540 may refer to the aforementioned embodiments.

[0095] FIG. 5 illustrates another second recycling sub-system including the first cooling sub-system.

[0096] Referring to FIG. 5, a cooling system 500 includes a working chamber 510, a storage tank 520, a supplying system 530 and a recycling system 540.

[0097] Details about the working chamber 510, the storage tank 520, the supplying system 530 and a first recycling sub-system of the recycling system 540 may refer to the aforementioned embodiments.

[0098] A second recycling sub-system also includes the first cooling sub-system, and the first cooling sub-system is a serpentine part 543. After passing the serpentine part 543, the vapor of the working liquid may convert to the working liquid. In some embodiments, a driving component (e.g., an air pump, a fan or the like) may be mounded to a pipe 542. The drivingcomponent may be configured to force the vapor of the working liquid to pass the pipe 543 and the serpentine part 543.

[0099] FIG. 6 illustrates another second recycling sub-system including the first cooling sub-system.

[0100] Referring to FIG. 6, a cooling system 600 includes a working chamber 610, a storage tank 620, a supplying system 630 and a recycling system 640.

[0101] Details about the working chamber 610, the storage tank 620, the supplying system 630 and a first recycling sub-system of the recycling system 640 may refer to the aforementioned embodiments.

[0102] A second recycling sub-system also includes the first cooling sub-system, and the first cooling sub-system is a cooling tank 644. The second recycling sub-system includes two pipes, a pipe 642 and a pipe 643. The pipe 643 is configured to get the vapor of the working liquid from the working chamber 410 and convey the vapor of the working liquid to the cooling tank 644. The vapor of the working liquid condenses into the working liquid in the cooling tank 644 and drains into the storage tank 620 by the pipe 642. In some embodiments, a fan may be equipped in the cooling tank 644 to help the vapor of the working liquid condense into the working liquid.

[0103] In some embodiments, the cooling system provided by the present application may further include temperature regulation system. FIG. 7 illustrates the cooling system with the temperature regulation.

[0104] Referring to FIG. 7, the cooling system 700 includes a working chamber 710, a storage tank 720, a supplying system 730 and a recycling system 740.

[0105] Details about the working chamber 710, the supplying system 730 and the recycling system 740 may refer to the aforementioned embodiments.

[0106] The storage tank 720 includes the temperature regulation system. The temperature regulation system is control temperature of the working liquid in a preset temperature range. An upper limit of the preset temperature range is equal to or less than a boiling point of the working liquid.

[0107] In some embodiments, the temperature regulation system may include a heating subsystem. The heating sub-system is configuration to heat the working liquid when thetemperature of the working liquid is below the preset temperature range. Referring to FIG. 7, the heating sub-system includes a heater 721. In some embodiments, the heater 721 may heat the working liquid according to schedule. For example, the heating sub-system may include a repeating timer. The heater 721 may heat the working liquid when the repeating time reaches zero. The heater 721 stops heating the working liquid after a heating duration reaches a preset time.

[0108] In some embodiments, the temperature regulation system may include a second cooling sub-system. Referring to FIG. 7, the second cooling subsystem includes a heat exchanger 722-1 and a pump 722-2. The pump 722-2 is configured to pump a hot working liquid to the heat exchanger 722-1. The second cooling subsystem may further include a pump 722-3 and / or a pump 722-4. The pump 722-3 and the pump 722-4 are configured to pump a cooling liquid to the heat exchanger 722-1. Heat may be transferred from the hot working liquid to the cooling liquid in the heat exchanger 722-1. Cooled working liquid may be drain out from the heat exchanger 722-1.

[0109] The second cooling sub-system 722 is an example of the second cooling sub-system. The first cooling sub-system illustrated in FIGs. 4 to 6 may be used as the second cooling subsystem. Similarly, the second cooling sub-system 722 illustrated in FIG. 7 may be used as the first cooling sub-system.

[0110] In some embodiments, a cooling system provided by some embodiments of the present application may further includes one or more filters. The filters may be configured to eliminates a possibility of reducing heat fluxes removed from the heat-stressed electronic component.

[0111] FIG. 8 illustrates a cooling system with a filter.

[0112] In some embodiments, a filter 834 is mounted in a pipe 831.

[0113] In some embodiments, a filter 845 is mounted in a pipe 841.

[0114] In some embodiments, each pipe in the cooling system 800 may have a filter.

[0115] As the filters can trap fluxes and debris, a likelihood of the pipe for supplying the working liquid and the atomizer getting clogged is reduced.

[0116] In some embodiments, a cooling system provided by the present application may include a sensor system. The sensor system may include one or more sensors for measuringoperation parameters of the cooling system.

[0117] FIG. 9 illustrates a cooling system with a sensor system. Referring to FIG. 9, the sensor system includes at least one of the following sensors: a temperature sensor Tl, a temperature sensor T2, a level sensor LI, a pressure sensor Pl, a pressure sensor P2, and a flowmeter Fl.

[0118] The temperature sensor Tl is mounted in a supplying system 930. The temperature sensor Tl is configured to measure a temperature of the working liquid in the supplying system.

[0119] The temperature sensor T2 is mounted in a storage tank 920. The temperature sensor T2 is configured to measure a temperature of the working liquid in the storage tank 920.

[0120] The first pressure sensor Pl is mounted in the supplying system 930. The first pressure sensor Pl is configured to measure pressure in the supplying system 930.

[0121] The second pressure sensor P2 is mounted in a working chamber 910. The second pressure sensor P2 is configured measure pressure in the working chamber.

[0122] The flowmeter Fl is mounted in the supplying system 930. The flowmeter Fl is configured to measure a flow rate of the working liquid moving through the supplying system 930.

[0123] The level sensor LI is mounted in the storage tank 920. The level sensor LI is configured to measure a working liquid level in the storage tank.

[0124] The cooling system may include a part of or all of the aforementioned sensors. In some other embodiments, the cooling system may include one or more sensors that are not shown in FIG. 9. For example, there is a temperature sensor mounted in a second cooling subsystem 922, which is configured to measure a temperature of a cooled working liquid.

[0125] In some embodiments, when parameters measured by the sensors exceed a corresponding threshold, a warning message may be sent to alert a user of an electronic device including the cooling system. For example, a display of the electronic device may display the warning message, or, a speaker of the electronic device may emit warning sounds. The warning message or the warning sounds may include details of the parameters that exceed the threshold. The user may adjust a corresponding component according to the warning message or the warning sounds. For example, when the warning message indicates that the temperature measured by the temperature sensor Tl is greater than a first preset temperature, the user mayturn off the heater 921 and turn on the second cooling sub-system 922.

[0126] In some embodiments, the cooling system may further include a controller. FIG. 10 illustrates a schematic diagram of the controller and related components.

[0127] Referring to FIG. 10, a controller 1001 may be coupled to the sensors and controllable components in the cooling system. The controller 1001 may send a control signal to a controllable component based on parameters received from the sensor system.

[0128] For example, when the flowmeter Fl measures that the flow rate of the working liquid exceeds a first flow rate threshold, the controller 1001 may turn down a pump 932 of a supplying system 930. For another example, when the temperature sensor T2 measures that the temperature of the working liquid in the storage tank exceeds the first preset temperature, the controller 1001 may turn off the heater 921 and turn on the second cooling sub-system 922.

[0129] An embodiment of the present application provides an electronic device. The electronic device may include one or more of the cooling systems according to the aforementioned embodiments. The electronic device may also include one or more heat- stressed electronic components assembled in the cooling system. The electronic device may be a computer, a work station, a server, or the like.

[0130] The foregoing descriptions are merely specific implementations of this application, but are not intended to limit the protection scope of this application. Any variation or replacement readily figured out by a person skilled in the art within the technical scope disclosed in this application shall fall within the protection scope of this application. Therefore, the protection scope of this application shall be subject to the protection scope of the claims.

Claims

CLAIMSWhat is claimed is:

1. A cooling system, wherein the cooling system comprising a working chamber, a storage tank, and a supplying system and a recycling system, wherein the working chamber comprises N socket area(s) installed on a side of the working chamber, wherein the N socket area(s) is configured to install N heat-stressed electronic component(s) respectively, when the N heat-stressed electronic component(s) is installed on the N socket area(s), N is a positive integer greater than or equal to 1, the working chamber further comprises N atomizer(s), wherein the N atomizer(s) is in one- to-one correspondence with the N socket area(s), each of the N atomizer(s) is mounted opposite to a corresponding socket area; the storage tank is configured to storing working liquid; the supplying system is configured to supply the working liquid to the N atomizer(s); and the recycling system is configured to extract the working liquid from the working chamber.

2. The cooling system according to claim 1, wherein each of the N atomizer(s) satisfies at least one of the followings: a distance from an exit section of each of the N atomizer(s) to a surface of a heat-stressed electronic component installing on the corresponding socket area is selected from a range of 4.5 to 27mm; a spray angle rang is 60° to 120°; a pressure variation range is 2 to 6 atmosphere(atm); a flow variation range is 50-123 g / s.

3. The cooling system according to claim 1 or 2, wherein a nozzle of the atomizer is a fullcone single-phase nozzle with a swirler, whose spray pattern represents a cone with a circleshape base or a square-shaped base.

4. The cooling system according to claim 3, wherein the swirler is made inside the nozzle of the atomizer in a form of at least two channels directed to an outlet of the nozzle in a form of a smooth spiral.

5. The cooling system according to any one of claims 1 to 4, wherein when the N heat- stressed electronic component(s) is installed on the N socket area(s), an axis of each of the N atomizer(s) is perpendicular to a surface plan of a heat-stressed electronic component installed on the corresponding socket area and intersects with a geometrical center of the heat-stressed electronic component installed on the corresponding socket area.

6. The cooling system according to claim 5, wherein an accuracy of the axis of each of the N atomizer(s) in three axes of a rectangular coordinate system is less than or equal to 0.5mm.

7. The cooling system according to any one of claims 1 to 6, wherein the recycling system comprises a first recycling sub-system and a second recycling sub-system, the first recycling sub-system is configured to recycle the working liquid from a bottom part of the working chamber, the second recycling sub-system is configured to recycle a vapor of the working liquid from an upper part of the working chamber.

8. The cooling system according to claim 7, wherein the second recycling sub-system comprises a first pipe, a second pipe, and a first cooling sub-system, a first end of the first pipe connects to a vapor outlet located on the upper part of the working chamber, while a second end of the first pipe connects to an inlet of the first cooling sub-system; a first end of the second pipe connects to an outlet of the first cooling sub-system, while a second end of the second pipe connects to a first inlet of the storage tank.

9. The cooling system according to anyone of claims 1 to 8, wherein further comprises a temperature regulation system connected to the storage tank, wherein the temperature regulation system is configured to control temperature of the working liquid in a preset temperature range, wherein an upper limit of the preset temperature range is equal to or less than a boiling point of the working liquid.

10. The cooling system according to claim 9, wherein the temperature regulation system comprises a heating sub-system, configured to heat the working liquid when the temperature of the working liquid is below the preset temperature range;11. The cooling system according to claim 9 or 10, wherein the temperature regulation system comprises a second cooling sub-system, configured to cool the working liquid when thetemperature of the working liquid is over the preset temperature range.

12. The cooling system according to any one of claims 1 to 11, wherein the cooling system further comprises a sensor system, wherein the sensor system comprises at least one of the followings: at least one temperature sensor; at least one pressure sensor; at least one flowmeter; or at least one working liquid level sensor.

13. The cooling system according to claim 12, wherein the at least one temperature sensor comprises: a first temperature sensor, configured to measure a temperature of the working liquid in the supplying system; and / or a second temperature sensor, configured to measure a temperature of the working liquid in the storage tank.

14. The cooling system according to claim 12 or 13, wherein the at least one pressure sensor comprises: a first pressure sensor, configured to measure pressure in the working chamber; and / or a second pressure sensor, configured to measure pressure in the supplying system.

15. The cooling system according to any one of claims 11 to 14, wherein the at least one flowmeter comprises: a first flowmeter, configured to measure a flow rate of the working liquid moving through the supplying system.

16. The cooling system according to any one of claims 11 to 15, wherein the at least one working liquid level sensor comprises: a first level sensor, configured to measure a working liquid level in the storage tank.

17. The cooling system according to any one of claims 11 to 16, wherein the cooling system further comprises a controller, wherein the controller is configured to control a controllable component in the cooling system according to a measuring result collected from the sensor system.

18. The cooling system according to any one of claims 1 to 17, wherein the cooling systemfurther comprises a filter system, wherein the filter system comprises a first filter sub-system and / or a second filter sub-system, the first filter sub-system is configured to filter the working liquid recycled from the working chamber; the second filter sub-system is configured to filter the working liquid being supplied to the N atomizer(s).

19. An electronic device, wherein the electronic device comprises the cooling system according to any one of claims 1 to 18.

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