Resin, curable resin material, prepreg, resin film, metal-clad laminate, printed wiring board, and semiconductor package

A resin composition with indene compounds addresses the issue of high thermal expansion and poor dimensional stability in metal-clad laminates, resulting in semiconductor packages with improved performance for miniaturized and high-speed electronic devices.

WO2026126551A1PCT designated stage Publication Date: 2026-06-18RESONAC CORP
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Patent Information

Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
RESONAC CORP
Filing Date
2025-07-09
Publication Date
2026-06-18

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Abstract

This resin includes as reaction raw materials an indene compound (A), a compound (B) represented by general formula (1), and a compound (C) represented by general formula (2). The proportion of the total area of four peaks detected between 32 and 35 minutes on a chart of high-performance liquid chromatography (HPLC) analysis is 30 area% or more.
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