Probe card for inspecting imaging element

Abstract

This probe card (100) for inspecting an imaging element comprises: a plurality of probes (12); a main substrate (20) electrically connected to the plurality of probes (12); and a plurality of pupil lenses (L) that each irradiate each imaging element (1) of a plurality of imaging elements (1) formed on a wafer (W) with diffused light. The pupil lenses (L) are configured from a lower lens (11) and an upper lens (41). The pupil lenses (L) have an optical axis (Q) that runs through the main substrate (20) and is perpendicular to the plate surface of the main substrate (20). The lower lens (11) and the upper lens (41) are each independently positioned relative to the main substrate (20).

Description

Probe Card for Image Sensor Inspection 【0001】 The present disclosure relates to a probe card for image sensor inspection. 【0002】 Conventionally, image sensors such as CMOS (Complementary Metal Oxide Semiconductor) and CCD (Charge Coupled Device) have been used as image sensors for cameras and the like. A CMOS image sensor (hereinafter simply referred to as CMOS) is an image sensor with a complementary metal oxide semiconductor structure that consumes little power. The image sensor reads information on a subject and converts it into an electrical signal. CMOS uses a method of converting signal charges into voltage signals and transferring them, and uses a CMOS process, which is a general semiconductor process. Therefore, an image sensor and a peripheral circuit can be integrated on one chip, enabling high integration and contributing to the miniaturization of devices such as smart devices that utilize this. 【0003】 As an inspection apparatus for such an image sensor, an optical inspection unit that is disposed opposite to the light receiving unit of the image sensor and emits test light through a plurality of openings of a probe card, holding means for simultaneously positioning and holding a plurality of optical inspection units, and individual adjustment means for individually performing conversion adjustment on each optical inspection unit so as to match the specifications of the image sensor for the light from a light irradiation device corresponding to the image sensor have been proposed (see, for example, Patent Document 1). 【0004】 Japanese Patent Application Laid-Open No. 2007-311515 【0005】 A semiconductor wafer on which a large number of image sensors are formed is inspected for the electrical characteristics of each image sensor in its original state. This inspection is to confirm that each image sensor has the same optical characteristics as the final product. Therefore, the probe card for inspecting the image sensor is equipped with a pupil lens assembly having the same performance as the lens mounted on a smart device or the like on which the image sensor is mounted as a component, and it is necessary to perform the inspection under the same conditions as when using the smart device. 【0006】Conventionally, probe cards and pupil lens assemblies are manufactured separately, and the customer docks the probe card and pupil lens assembly together. In Patent Document 1, each pupil lens for each DUT (Device Under Test) is fixed only to the upper flange portion of the lens barrel on a plate called a base holder. Therefore, when assembling the base holder and the upper flange portion of the lens barrel, there is a problem that the optical axis of the pupil lens is misaligned due to assembly tolerances that occur at the docking surface and the long distance between the docking surface and the tip of the lens barrel. Furthermore, the size of the lens barrel is large, which also affects chip skipping (movement of the wafer or probe card during inspection due to the inability to characterize adjacent image sensors simultaneously), hindering the reduction of skipping. 【0007】 This disclosure provides a technology to solve the above-mentioned problems, and aims to provide a probe card for image sensor inspection that can maintain the optical axis of each pupil lens perpendicular to the object under inspection with high precision, and that has high inspection efficiency by reducing skipping. 【0008】 The probe card for inspecting image sensors according to this disclosure is a probe card having a plurality of probes, a main substrate electrically connected to the plurality of probes, and a plurality of pupil lenses that irradiate each of the image sensors of a plurality of image sensors formed on a wafer with diffused light, wherein the pupil lens is composed of a lower lens and an upper lens, the pupil lens has an optical axis that penetrates the main substrate and is perpendicular to the surface of the main substrate, and the lower lens and the upper lens are positioned separately with respect to the main substrate. 【0009】 The probe card for image sensor inspection according to this disclosure can provide a highly efficient probe card for image sensor inspection that can maintain the optical axis of each pupil lens perpendicular to the object under inspection with high precision and has a skip reduction effect. 【0010】This is a cross-sectional perspective view of the main part of the probe card according to Embodiment 1. This is an exploded perspective view of the main part of the probe card according to Embodiment 1. This is a schematic cross-sectional view of the probe card according to Embodiment 1. This is an enlarged view of the main part of Figure 3. This is a schematic cross-sectional view of the probe card in a state for inspecting an image sensor formed on a semiconductor wafer. This is a diagram showing an assembly of image sensors formed on a wafer according to Embodiment 1 and an enlarged view of a part of it. This is a diagram showing nine adjacent image sensors on a wafer according to Embodiment 1. This is a diagram showing another example of the lower lens according to Embodiment 1. This is a diagram showing the relationship between the image sensor to be inspected (DUT) and the image sensor to be skipped simultaneously. This is a schematic cross-sectional view showing the configuration of a probe card of a comparative example. This is a diagram showing another example of probe connection according to Embodiment 1. This is a schematic cross-sectional view of the probe card according to Embodiment 2. This is a schematic cross-sectional view of the probe card according to Embodiment 3. This is a schematic cross-sectional view of the probe card according to Embodiment 4. This is a schematic cross-sectional view of the main part of the probe card according to Embodiment 5. This is a schematic cross-sectional view of the probe card according to Embodiment 6. 【0011】 Embodiment 1. Hereinafter, a probe card according to Embodiment 1 will be described with reference to the figures. Figure 1 is a cross-sectional perspective view of the main part of the probe card 100 for image sensor inspection (hereinafter referred to as the probe card). Figure 2 is an exploded perspective view of the main part of the probe card 100 (probe 12 is omitted). Figure 3 is a schematic cross-sectional view of the probe card 100. Due to space limitations, only two sets of pupil lenses are shown, and the others are omitted. Figure 4 is an enlarged view of the main part of Figure 3. Figure 5 is a schematic cross-sectional view of the probe card 100 in a state for inspecting a solid-state image sensor 1 (hereinafter referred to as the image sensor 1) formed on a semiconductor wafer W. In this specification, when referring to "up" and "down", the upper part of the probe card 100 shown in Figure 3, that is, the light source device 60 side when inspecting the characteristics of the image sensor 1, is referred to as "up", and the wafer W side is referred to as "down". 【0012】As shown in Figures 1 to 3, the probe card 100 includes a probe assembly 10, a main substrate 20, a reinforcing plate 30, and an upper lens assembly 40. The probe assembly 10 includes a plurality of lower lenses 11, a plurality of probes 12, a guide plate 13 that holds the plurality of lower lenses 11 and the plurality of probes 12, and a spacer 14 that positions and fixes the guide plate 13 to the lower surface of the main substrate 20. The guide plate 13 is arranged in a matrix and has a plurality of holes 13H (first holes) that penetrate vertically. The guide plate 13 is made of ceramic. 【0013】 As shown in Figure 4, the hole 13H has a stepped portion 13H1 in the middle in the vertical direction. The cross-sectional area of ​​the hole 13H is smaller below the stepped portion 13H1 than above it. The lower lenses 11 are fitted into these holes 13H. The lower lens 11 has its lower lens body 11M held within the lower lens frame 11W. Therefore, when the lower lenses 11 are fitted into the holes 13H of the guide plate 13 from above, the lower surface 11WD of the lower lens frame 11W comes into contact with the stepped portion 13H1, allowing each lower lens 11 to be mounted on the guide plate 13 so that its optical axis QD is perpendicular to the guide plate 13. 【0014】 The spacer 14 of the probe assembly 10 is a member that holds the guide plate 13 and positions the guide plate 13 relative to the lower surface of the main substrate 20. That is, the spacer 14 is inserted between the main substrate 20 and the guide plate 13. The spacer 14 has an opening 14K that surrounds the guide plate 13 which is arranged in a matrix, and the guide plate 13 is positioned on a stepped portion 14KD provided in this opening 14K. The spacer 14 is then positioned and fixed to the lower surface of the main substrate 20. As a result, the lower lens 11 is positioned relative to the lower surface of the main substrate 20 via the guide plate 13 and the spacer 14. 【0015】The upper lens assembly 40 includes a plurality of upper lenses 41 and an upper lens guide plate 43 that holds the plurality of upper lenses 41. The upper lens guide plate 43 is arranged in the same matrix as the plurality of holes 13H provided in the guide plate 13 and has a plurality of holes 43H (second holes) that penetrate vertically. 【0016】 The hole 43H has a stepped portion 43H1 in the middle in the vertical direction. The cross-sectional area of ​​the hole 43H is smaller below the stepped portion 43H1 than above it. The upper lenses 41 are fitted into these holes 43H. The upper lens 41 has its upper lens body 41M held within the upper lens frame 41W. Therefore, when the upper lenses 41 are fitted into the holes 43H of the upper lens guide plate 43 from above, the lower surface 41WD of the upper lens frame 41W comes into contact with the stepped portion 43H1, allowing each upper lens 41 to be mounted on the upper lens guide plate 43 so that its optical axis QU is perpendicular to the upper lens guide plate 43. 【0017】 The main substrate 20 is arranged in the same matrix as the multiple holes 13H provided in the guide plate 13 of the probe assembly 10 and the multiple holes 43H provided in the upper lens guide plate 43 of the upper lens assembly 40, and has multiple holes 20H (fourth hole) that penetrate vertically. 【0018】 Similarly, the reinforcing plate 30 is arranged in the same matrix as the multiple holes 13H provided in the guide plate 13 of the probe assembly 10 and the multiple holes 43H provided in the upper lens guide plate 43 of the upper lens assembly 40, and has multiple holes 30H (third holes) that penetrate vertically. The reinforcing plate 30 is positioned at a predetermined position on the upper surface of the main substrate 20, and the upper lens guide plate 43 is positioned so as to fit into the reinforcing plate 30. That is, the reinforcing plate 30 is placed between the main substrate 20 and the upper lens guide plate 43. The upper lens assembly 40, including the upper lens 41, is positioned relative to the upper surface of the main substrate 20 via the reinforcing plate 30. 【0019】As shown in Figures 1 to 3, the probe assembly 10 is positioned and mounted on the lower surface of the main substrate 20, and the upper lens assembly 40 is positioned and mounted on the upper surface of the main substrate 20 via the reinforcing plate 30. The upper lens guide plate 43 is positioned relative to the reinforcing plate 30 by positioning pins 43P, and the reinforcing plate 30 is positioned and fixed at a predetermined position on the upper surface of the main substrate 20 by screws or the like. The guide plate 13 of the probe assembly 10 is fitted into the opening 14K of the spacer 14 and positioned relative to the spacer 14, and the spacer 14 is positioned and fixed at a predetermined position on the lower surface of the main substrate 20 by screws or the like. 【0020】 When the probe card is assembled in this way, the centers of the upper lens 41, holes 43H, 30H, 20H, 13H, and lower lens 11 are arranged coaxially in the vertical direction. As a result, multiple pupil lenses L are formed as shown in Figure 1, in which the optical axis QU of the upper lens 41 and the optical axis QD of the lower lens 11 are aligned with the coaxial optical axis Q. 【0021】 Furthermore, since all lower lenses 11 are positioned relative to each other by the holes 13H of the guide plate 13, and all upper lenses 41 are positioned relative to each other by the upper lens guide plate 43, the alignment of the optical axes Q of all pupil lenses L can be confirmed by simply inspecting the optical axes Q of two diagonally opposite pupil lenses L (the coaxiality of optical axis QU and optical axis QD) among all pupil lenses L arranged in a matrix. 【0022】 The upper lens 41 is composed of a light-adjusting filter (not shown) and multiple condensing lenses, and is a lens that is independent of the outer shape of the lower lens 11 and is limited to the role of adjusting the light intensity. The condensing lenses connect the light rays incident from the light source to the lower lens 11 and increase the light intensity. 【0023】Furthermore, the lower lens 11 is a miniaturized lens composed of a diffuser plate (not shown) and multiple ray angle adjustment lenses, and its role is limited to adjusting the angle of light. The diffuser plate has the role of diffusing the light rays incident from the upper lens 41 before they enter the angle adjustment lenses, and reducing the effect of misalignment of the optical axis with the upper lens 41. The ray angle adjustment lenses then adjust the light rays that have passed through the diffuser plate to the ray angle required by the image sensor 1. 【0024】 Thus, the probe card 100 has multiple pupil lenses L. Furthermore, the light source device 60 shown in Figure 5 is an LED or similar, which emits parallel light and generates little heat. By using pupil lenses L, it is possible to reproduce the incident light that tilts as it moves away from the center to the periphery of the optical system, which is mounted on an imaging camera or the like. This makes it possible to inspect multiple image sensors 1 formed on a wafer W under the same conditions as when the image sensor 1 is actually used. 【0025】 As shown in Figure 4, the probe 12 is inserted into a probe insertion hole (not shown) provided in the guide plate 13, with its middle portion fixed thereto, and the tip portion 12T protrudes laterally from this probe insertion hole. The tip portion 12T bends downward at a point slightly protruding from the guide plate 13 and extends downward along the edge of the hole 13H in the guide plate 13. The tip portion 12T of the probe 12 has a cantilever shape, with a needle tip 12P at its tip. 【0026】 The tip 12T of the probe 12 is positioned so as to be hidden by the lower lens frame 11W. This makes it possible to eliminate the problem of reflected light from the probe 12. 【0027】 Furthermore, the upper end of the probe 12 is inserted into a through-hole (not shown) provided in the main board 20, and is fixed to the main board 20 by solder at the upper end of the through-hole. In addition, the probe 12 is electrically connected to the wiring of the main board 20 within the through-hole. 【0028】Figure 11 shows another example of how the probe 12 can be connected. The upper end of the probe 12 can be connected to the guide plate 13, and the upper end of the probe 12 can be connected to the main board 20 by a separate conductor, such as a pin 13P. In this case, the maintainability of the probe 12 can be improved. 【0029】 Next, a method for inspecting the image sensor 1 using the probe card 100 will be described. Figure 6 is a diagram showing an assembly of image sensors 1 formed on a wafer W and a magnified view of a part of it. Figure 7 is a diagram showing nine adjacent image sensors 1 on the wafer W. The area inside the circle R shown in Figure 7 is the area illuminated by light from one pupil lens L during characteristic inspection. In this embodiment, characteristic inspection of the image sensor 1 is performed. As shown in Figure 5, the light emitted from the light source device 60 (thick solid arrow) is first diffused through the upper lens 41 of the pupil lens L (thick dashed arrow), and then diffused further through the lower lens 11 before being irradiated onto the image sensor 1 of the object to be measured (thin dashed arrow). 【0030】 At this time, the light that passes through the upper lens 41 is diffused and passes through the holes 20H in the main substrate 20, but a portion of the light is blocked by the guide plate 13 and the lower lens frame 11W of the lower lens 11, so the light illumination area is limited to the portion that passes through the lower lens 11, which is approximately the same area as the sensor area of ​​the image sensor 1, and there is almost no effect on the adjacent image sensors 1. 【0031】 In this way, with light irradiated onto the sensor area 1S of the image sensor 1 shown in Figure 7, the probe 12 is brought into contact with the electrode pad 1P of the image sensor 1, and the main substrate 20 measures the electrical signal extracted from the electrode pad 1P to perform a characteristic inspection of the image sensor 1. 【0032】 Figure 8 shows another example of the lower lens 11. A female screw groove NF is cut into the hole 13H, and a male screw thread NM is formed on the lower lens frame 11W, so that the lower lens 11 is screwed into the guide plate 13. By making it possible to change the vertical position of the lower lens 11, the distance between the lower lens 11 and the upper lens 41 can be adjusted, thereby fine-tuning the light illumination range. The screw structure may be provided on the upper lens, or on both. 【0033】 Figure 9 shows the relationship between image sensors 1 (DUTs) to be inspected simultaneously and image sensors to be skipped. Figure 9 shows an example of inspecting 25 image sensors 1 simultaneously. In the process of inspecting the characteristics of the image sensors 1, there are image sensors that are skipped from inspection to avoid overlapping of the irradiated light. After inspecting the 25 DUTs shown by the diagonal lines in Figure 9, the group of 25 in the next row is inspected. After inspecting the next row further down, the inspection of the column to the left is repeated in the same manner. In this embodiment, by reducing the aperture size of the main substrate 20, the spacing between the pupil lenses is also reduced, so the skip spacing can be reduced, and the inspection efficiency of multiple image sensors 1 formed on the wafer W is improved. 【0034】 Figure 10 is a schematic cross-sectional view showing the configuration of a comparative example probe card 100B for image sensor inspection. The pupil lens LB has a single cylindrical housing 11K. The pupil lens LB is located above the main substrate 20B, and only the upper end of the housing 11K is fixed to the upper surface of the lens guide frame 40B. In this case, if the characteristics of a large number of image sensors 1 are repeatedly inspected, the optical axis QB of each pupil lens LB may shift. 【0035】 On the other hand, according to the probe card for inspecting image sensors of Embodiment 1, the probe card has a plurality of probes, a main substrate electrically connected to the plurality of probes, and a plurality of pupil lenses that irradiate each of the plurality of image sensors formed on a wafer with diffused light, wherein the pupil lenses are composed of a lower lens and an upper lens, the pupil lenses have an optical axis that penetrates the main substrate and is perpendicular to the surface of the main substrate, and the lower lens and the upper lens are positioned separately with respect to the main substrate. As a result, the optical axis Q of each pupil lens L that penetrates the main substrate 20 can be maintained perpendicular to the main substrate 20, that is, perpendicular to the image sensor 1 to be inspected, with high accuracy. This makes it possible to accurately perform characteristic inspection on a large number of image sensors 1 under the same conditions. 【0036】Furthermore, since there is no housing between the upper lens 41 and the lower lens 11 of the pupil lens L, the probe card 100 can be made lighter, preventing displacement of the pupil lens and optical axis misalignment caused by weight. In addition, chip skipping can be reduced, enabling high-precision and high-efficiency characteristic testing of the image sensor 1. 【0037】 Furthermore, since the lower lens is positioned relative to the main substrate, and the upper lens is positioned above the lower lens, spaced apart from it, it produces an effect equivalent to the above-mentioned effect. 【0038】 Furthermore, the probe assembly 10 can be easily and accurately positioned and assembled relative to the main substrate 20, as it is characterized by having a guide plate to which each of the lower lenses is fixed and which has a plurality of first holes arranged that penetrate vertically, and the plurality of probes being fixed to the main substrate and also to the guide plate. 【0039】Furthermore, since the upper lens guide plate is provided, which has a plurality of second holes arranged vertically through the main lens guide plate in the same arrangement as the first holes, and to which each upper lens is fixed, the positions of the plurality of upper lenses can be precisely aligned. Furthermore, since a spacer is inserted between the main substrate and the guide plate, the guide plate can be precisely positioned relative to the lower surface of the main substrate via the spacer. Furthermore, since the reinforcing plate is provided, which has a plurality of third holes arranged vertically through the main lens guide plate in the same arrangement as the plurality of first holes and the plurality of second holes, and the reinforcing plate is positioned between the main substrate and the upper lens guide plate, the upper lens assembly 40 having the upper lens guide plate 43 can be precisely positioned and assembled relative to the upper surface of the main substrate 20. 【0040】 Furthermore, since each of the aforementioned lower lenses is characterized in that the lower lens body is held within the lower lens frame, and each of the aforementioned upper lenses is characterized in that the upper lens body is held within the upper lens frame, the lower lens body 11M and the upper lens body 41M can be positioned horizontally with respect to the main circuit board 20 by utilizing the lower lens frame 11W and the upper lens frame 41W. 【0041】 Furthermore, since the plurality of first holes, plurality of second holes, and plurality of third holes are arranged in a matrix, the characteristics of a large number of image sensors 1 formed on a wafer W can be efficiently inspected. 【0042】 Furthermore, since at least one of the lower lens and the upper lens is adjustable in the vertical direction and the distance between the lower lens and the upper lens is adjustable, even if there is a pupil lens L that has a problem with the light illumination range, it can be easily fine-tuned. 【0043】 Furthermore, since the guide plate is made of ceramic, it is possible to perform accurate characteristic testing of the image sensor 1 without affecting the current flowing through the probe. 【0044】Embodiment 2. Hereinafter, the probe card according to Embodiment 2 will be described focusing on the parts different from Embodiment 1. FIG. 12 is a schematic cross-sectional view of the probe card 200. In this Embodiment 2, the lens diameter 241ML (diameter, the same applies hereinafter) of the upper lens body 241M is set to be equal to or smaller than the lens diameter 11ML of the lower lens body 11M. 【0045】 According to the probe card for inspecting an image pickup device according to Embodiment 2, since the lens diameter of the upper lens body is equal to or smaller than the lens diameter of the lower lens body, the interval between adjacent pupil lenses L can be made narrower. As a result, the Skip interval and the number of image pickup devices 1 that can be measured simultaneously can be increased, and the inspection efficiency of the solid-state image pickup device 1 formed on the semiconductor wafer W can be further improved. 【0046】 Embodiment 3. Hereinafter, the probe card according to Embodiment 3 will be described focusing on the parts different from Embodiment 1. FIG. 13 is a schematic cross-sectional view of the probe card 300. Compared with FIG. 3 of Embodiment 1, the relationship between the size of the upper lens body 41M and the hole 320H (fourth hole) provided in the main substrate 320 is limited. That is, in this Embodiment 3, the diameter 320HL of the hole 320H is equal to or smaller than the lens diameter 41ML of the upper lens body 41M. 【0047】 According to the probe card for inspecting an image pickup device according to Embodiment 3, since the diameter of the fourth hole provided in the main substrate and through which the optical axis passes is equal to or smaller than the lens diameter of the upper lens body, the area available for use on the main substrate 320 increases, and the electrical performance and the like of the probe card 300 can be improved. Note that the hole 320H has a size within a range that does not obstruct the light beam B in order not to degrade the optical performance of the light source. 【0048】Embodiment 4. Hereinafter, the probe card according to Embodiment 4 will be described focusing on the parts different from Embodiment 1. FIG. 14 is a schematic cross-sectional view of the probe card 400. Comparing with FIG. 3, the structure of the inner surface 420HIN of the hole 420H provided in the main substrate 420 is different. The hole 420H has an antireflection structure on the inner surface 420HIN. When unnecessary light from the upper lens 41 and the periphery enters the hole 420H, reflects inside the hole 420H, and then enters the lower lens 11, the optical performance of the pupil lens L deteriorates, and an error occurs in the inspection result. 【0049】 Therefore, by providing the antireflection structure on the inner surface 420HIN of the hole 420H, unnecessary stray light and reflected light can be removed, the optical performance of the pupil lens L is improved, and the inspection accuracy is also improved. 【0050】 As the antireflection structure, black paint, roughening (such as sandblasting treatment), a general antireflection film, etc. are used. The material of the main substrate 420 itself may be composed of a black material. 【0051】 According to the probe card for pixel element inspection according to Embodiment 4, since the inner surface of the fourth hole has an antireflection structure, unnecessary stray light and reflected light can be removed, the optical performance of the pupil lens L is improved, and the inspection accuracy can also be improved. 【0052】 Embodiment 5. Hereinafter, the probe card according to Embodiment 5 will be described focusing on the parts different from Embodiment 1. FIG. 15 is a schematic cross-sectional view of the main part of the probe card. It corresponds to FIG. 4 of Embodiment 1. Comparing with FIG. 4, the fixing direction of the lower lens 11 to the guide plate 513 has a structure where the up and down are reversed. By changing the shape of the stepped portion 513H1 of the guide plate 513, the lower lens 11 is fitted and attached into the hole 513H of the guide plate 513 from below. Thereby, the upper surface 11WU of the lower lens frame 11W abuts against the stepped portion 513H1, and the lower lens 11 can be attached to the guide plate 513 so that the optical axis QD of each lower lens 11 is perpendicular to the guide plate 513. 【0053】According to the probe card for image sensor inspection of Embodiment 5, the pupil lens can be made smaller, reducing the skipping effect and making the opening of the guide plate 513 smaller, thereby improving component placement and wiring efficiency. 【0054】 Embodiment 6. Hereinafter, the probe card according to Embodiment 6 will be described, focusing on the parts that differ from those of Embodiment 1. Figure 16 is a schematic cross-sectional view of the probe card 600. In Figure 16, the upper lens body 41M is held within the upper lens frame 41W and is also directly fixed to the stepped portion 43H1 provided in the middle of the upper lens guide plate 43. 【0055】 The probe card for image sensor inspection according to Embodiment 6 can be maintained perpendicular to the object under inspection with high accuracy and has a skip reduction effect. 【0056】 While this disclosure describes exemplary embodiments, the various features, aspects, and functions described in the embodiments are not limited to the application of any particular embodiment, but can be applied individually or in various combinations to the embodiments. Accordingly, countless variations not illustrated are conceivable within the scope of the art disclosed in this specification. These include, for example, modifications, additions, or omissions of at least one component. 【0057】100, 100B, 200, 300, 400, 600 Probe card for image sensor inspection, 1 Solid-state image sensor, 1P Electrode pad, 1S Sensor area, 10 Probe assembly, 11 Lower lens, 11K Housing, 11M Lower lens body, 11W Lower lens frame, 11WD Bottom surface, 11WU Top surface, 12 Probe, 12P Needle tip, 12T Tip, 13, 513 Guide plate, 13H, 513H Hole, 13H1, 513H1 Stepped section, 14 Spacer, 14K Opening, 14KD Stepped section, 20, 20B, 320, 420 Main board, 20H, 320H, 420H Hole, 320HL Diameter, 420HIN Inner surface, 30 Reinforcement plate, 30H Hole, 40 Upper lens assembly, 40B; Lens guide frame, 41; Upper lens, 41M, 241M; Upper lens body, 41W; Upper lens frame, 41WD; Bottom surface, 11ML, 41ML, 241ML; Lens diameter, 43; Upper lens guide plate, 43H; Hole, 43H1; Stepped section, 43P; Positioning pin, 60; Light source device, L, LB; Pupil lens, NF; Female screw groove, NM; Male screw thread, R; Circle mark, W; Semiconductor wafer.

Claims

1. A probe card for inspecting image sensors, comprising a plurality of probes, a main substrate electrically connected to the plurality of probes, and a plurality of pupil lenses that illuminate each of the image sensors of a plurality of image sensors formed on a wafer with diffused light, wherein the pupil lenses are composed of a lower lens and an upper lens, the pupil lenses have an optical axis that penetrates the main substrate and is perpendicular to the surface of the main substrate, and the lower lens and the upper lens are positioned separately with respect to the main substrate.

2. The probe card for inspecting an image sensor according to claim 1, characterized in that the lower lens is positioned relative to the main substrate, and the upper lens is positioned above the lower lens, spaced apart from the lower lens.

3. The probe card for inspecting an image sensor according to claim 2, characterized in that it comprises a guide plate to which each of the lower lenses is fixed, and which has a plurality of first holes arranged that penetrate vertically, and the plurality of probes are fixed to the main substrate and also to the guide plate.

4. The probe card for inspecting an image sensor according to claim 2, comprising a guide plate having a plurality of first holes arranged vertically through which each of the lower lenses is fixed, wherein the plurality of probes are fixed to the guide plate, and the probes and the main substrate are connected by a conductor separate from the probes.

5. The probe card for inspecting an image sensor according to claim 3, characterized in that it comprises an upper lens guide plate to which each of the upper lenses is fixed, and which has a plurality of second holes arranged vertically through the upper lens in the same arrangement as the first holes.

6. The probe card for inspecting an image sensor according to claim 3, characterized in that a spacer is inserted between the main board and the guide plate.

7. The probe card for inspecting an image sensor according to claim 5, comprising a reinforcing plate having a plurality of first holes and a plurality of third holes that penetrate vertically and vertically in the same arrangement as the plurality of second holes, wherein the reinforcing plate is disposed between the main substrate and the upper lens guide plate.

8. The probe card for inspecting an image sensor according to any one of claims 1 to 7, characterized in that each of the aforementioned lower lenses has its lower lens body held within a lower lens frame, and each of the aforementioned upper lenses has its upper lens body held within an upper lens frame.

9. The probe card for inspecting an image sensor according to claim 7, characterized in that the plurality of first holes, plurality of second holes, and plurality of third holes are arranged in a matrix.

10. The probe card for inspecting an image sensor according to claim 8, characterized in that at least one of the lower lens and the upper lens is adjustable in the vertical direction, and the distance between the lower lens and the upper lens is adjustable.

11. The probe card for inspecting an image sensor according to claim 6 or 7, characterized in that the guide plate is made of ceramic.

12. The probe card for inspecting an image sensor according to claim 8, characterized in that the lens diameter of the upper lens body is less than or equal to the lens diameter of the lower lens body.

13. The probe card for inspecting an image sensor according to claim 8, characterized in that the diameter of the fourth hole provided in the main substrate and through which the optical axis passes is less than or equal to the lens diameter of the upper lens body.

14. The probe card for inspecting an image sensor according to claim 13, characterized in that the inner surface of the fourth hole has an anti-reflective structure.

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