Testing device

Abstract

A DUT 2 has N (where N ≥ 3) Z-coordinate detection device electrodes A1–A4 arranged such that a plane passing therethrough is uniquely determined. A handler 110 can control the position of the DUT 2 in a Z-axis direction, the rotation of the DUT 2 about an X-axis, and the rotation of the DUT 2 about a Y-axis. A Z-coordinate detection tester electrode pair a1 is formed on a tester chip 120 so as to be included in a range of the corresponding Z-coordinate detection device electrode A1 when viewed in the Z-axis direction. A Z-coordinate detection circuit 200_1 generates a Z-coordinate detection signal Z1 in accordance with the electrostatic capacitance obtained with the corresponding Z-coordinate detection tester electrode pair a1 at both ends thereof, respectively. A handler control unit 300 controls the handler 110 on the basis of Z-coordinate detection signals Z1–Z4, thereby adjusting the distance between the DUT 2 and the tester chip 120 and the parallelism between the surface of the DUT 2 and the surface of the tester chip 120.

Description

Test apparatus 【0001】 The present disclosure relates to a test apparatus. 【0002】 Devices having a non-contact interface without electrical contacts (hereinafter referred to as non-contact interface devices in this specification) are becoming more and more popular. Examples of non-contact interfaces include optical coupling, inductive coupling, capacitive coupling, and the like. 【0003】 The non-contact interface device is arranged to face the device of the communication partner with a predetermined gap d therebetween. The predetermined gap d is very small and can be, for example, about 1 μm. 【0004】 U.S. Patent Application Publication No. 2022 / 0285234 A1 【0005】 As a result of studying a test apparatus for testing a non-contact interface device as a DUT (device under test), the present inventor has come to recognize the following problems. 【0006】 Normally, the DUT is positioned with respect to the interface (tester-side interface chip) of the test apparatus by a handler. 【0007】 FIG. 1 is a diagram showing a DUT 2 and a tester chip 4. In a test apparatus using a non-contact interface device as the DUT 2, the distance between the circuit (referred to as a tester chip) 4 serving as the interface on the test apparatus side and the DUT 2 must be maintained at about a predetermined gap d (for example, 1 μm) over the entire chip surface, and contact between the DUT 2 and the tester chip 4 is not allowed. 【0008】 For example, assume that the length L of the DUT 2 is 15 mm. Now, consider that the DUT 2 rotates about a rotation axis in the direction perpendicular to the paper surface at the center of the DUT 2 in the left-right direction of the paper surface, and the DUT is inclined at an angle θ. In this case, when the following formula (1) is satisfied, the DUT 2 contacts the tester chip 4. L / 2 × tan θ = d ０ …(1) d ０ is the gap at the center in the left-right direction. 【0009】Transforming equation (1) yields equation (2): θ = arctan(2d ０ / L) ... (2) Now, d ０ If we set the thickness to 1 μm and L to 15 mm, then θ = 0.076°. In other words, if DUT2 is tilted even slightly by 0.1°, DUT2 and the tester tip 4 will come into contact, making testing impossible. 【0010】 In order to position the DUT2 with high precision relative to the tester chip 4, it is necessary to detect the positional relationship between the DUT2 and the tester chip 4 with high precision, specifically with an accuracy of a few micrometers to about 10 micrometers. 【0011】 This disclosure is made in the present circumstances, and one exemplary purpose is to provide a test apparatus capable of precisely positioning the DUT relative to a tester chip. 【0012】 A test apparatus according to one aspect of the present disclosure tests a device under test (DUT) having a non-contact interface. The DUT has a plurality of N (N≧3) Z-coordinate detection device electrodes arranged such that the plane through which they pass is uniquely determined. The X-axis is taken in a first in-plane direction of the DUT, the Y-axis is taken in a second in-plane direction of the DUT, and the Z-axis is taken perpendicular to the DUT. The test apparatus comprises a handler capable of controlling the position of the DUT in the Z-axis direction and the rotation of the DUT around the X-axis and Y-axis, a tester chip, a plurality of N pairs of Z-coordinate detection tester electrodes corresponding to the N Z-coordinate detection device electrodes, a plurality of N Z-coordinate detection circuits corresponding to the plurality of N pairs of Z-coordinate detection tester electrodes, and a handler control unit. Each Z-coordinate detection circuit generates a Z-coordinate detection signal corresponding to the capacitance with the corresponding Z-coordinate detection tester electrode pair at both ends. Each Z-coordinate detection tester electrode pair is formed on the tester chip at a position facing the corresponding Z-coordinate detection device electrode. The handler control unit controls the handler based on the Z-coordinate detection signal, thereby adjusting the distance between the DUT and the tester tip, as well as the parallelism between the surface of the DUT and the surface of the tester tip. 【0013】A test apparatus in another aspect of the present disclosure tests a device under test (DUT) having a non-contact interface. The DUT has K (K≧1) X-coordinate detection device electrodes and L (L≧1) Y-coordinate detection device electrodes. The X-axis is taken in a first in-plane direction of the DUT, the Y-axis is taken in a second in-plane direction of the DUT, and the Z-axis is taken perpendicular to the DUT. The test apparatus comprises a handler configured to control the position of the DUT in the X-axis and Y-axis directions, a tester chip, K pairs of X-coordinate detection tester electrodes corresponding to the K X-coordinate detection device electrodes, L pairs of Y-coordinate detection tester electrodes corresponding to the L Y-coordinate detection device electrodes, K X-coordinate detection circuits corresponding to the K pairs of X-coordinate detection tester electrodes, L Y-coordinate detection circuits corresponding to the L pairs of Y-coordinate detection tester electrodes, and a handler control unit. Each pair of X-coordinate detection tester electrodes is formed on the tester chip at a position opposite to the corresponding X-coordinate detection device electrode, and each pair of X-coordinate detection tester electrodes includes two electrodes that extend in the X-axis direction and are spaced apart in the Y-axis direction. Each pair of Y-coordinate detection tester electrodes is formed on the tester chip at a position opposite to the corresponding Y-coordinate detection device electrode, and each pair of Y-coordinate detection tester electrodes includes two electrodes that extend in the Y-axis direction and are spaced apart in the X-axis direction. Each X-coordinate detection circuit generates an X-coordinate detection signal corresponding to the capacitance with the corresponding X-coordinate detection tester electrode pair at both ends. Each Y-coordinate detection circuit generates a Y-coordinate detection signal corresponding to the capacitance with the corresponding Y-coordinate detection tester electrode pair at both ends. The handler control unit controls the position of the DUT in the X-axis direction by controlling the handler based on the X-coordinate detection signal, and controls the position of the DUT in the Y-axis direction by controlling the handler based on the Y-coordinate detection signal. 【0014】 Furthermore, any combination of the above components, or in which components or expressions are mutually substituted between methods, apparatus, etc., are also valid embodiments of the present invention. 【0015】 According to certain aspects of this disclosure, high-speed devices can be mass-produced and tested. 【0016】This figure shows the DUT and the tester chip. This figure shows the test apparatus according to the embodiment. This is a block diagram relating to the position control of the DUT in the test apparatus according to the embodiment. This figure illustrates the capacitance Czi formed between the tester electrode pair for Z-coordinate detection. This figure shows an example of the configuration of the Z-coordinate detection circuit. This is a block diagram relating to the position control of the DUT in the test apparatus according to the embodiment. This figure illustrates the capacitance Cxi formed between the tester electrode pair bi for X-coordinate detection. This is a plan view showing an example of the layout of the device electrode and the tester electrode. This is a plan view showing another example of the layout of the device electrode and the tester electrode. 【0017】 (Outline of Embodiments) An outline of some exemplary embodiments of this disclosure is provided below. This outline is intended to provide a basic understanding of the embodiments and to simplify some concepts of one or more embodiments, serving as a prelude to the more detailed descriptions to be given later, and is not intended to limit the scope of the invention or disclosure. This outline is not a comprehensive overview of all possible embodiments, nor is it intended to identify the essential elements of all embodiments or to delineate the scope of some or all aspects. For convenience, “one embodiment” may be used to refer to one embodiment (example or variation) or more embodiments (example or variation) disclosed herein. 【0018】A test apparatus according to one embodiment tests a device under test (DUT) having a non-contact interface. The DUT has a plurality of N (N≧3) Z-coordinate detection device electrodes arranged such that the plane through which they pass is uniquely determined. The X-axis is taken in the first in-plane direction of the DUT, the Y-axis is taken in the second in-plane direction of the DUT, and the Z-axis is taken perpendicular to the DUT. The test apparatus comprises a handler capable of controlling the position of the DUT in the Z-axis direction and the rotation of the DUT around the X-axis and Y-axis, a tester chip, a plurality of N pairs of Z-coordinate detection tester electrodes corresponding to the N Z-coordinate detection device electrodes, a plurality of N Z-coordinate detection circuits corresponding to the plurality of N pairs of Z-coordinate detection tester electrodes, and a handler control unit. Each pair of Z-coordinate detection tester electrodes is formed on the tester chip at a position facing the corresponding Z-coordinate detection device electrode. Each Z-coordinate detection circuit generates a Z-coordinate detection signal corresponding to the capacitance with the corresponding pair of Z-coordinate detection tester electrodes at both ends. The handler control unit includes a handler control unit that controls the handler based on the Z coordinate detection signal to adjust the distance between the DUT and the tester chip and the parallelism between the surface of the DUT and the surface of the tester chip. 【0019】 The capacitance formed between each pair of tester electrodes for Z-coordinate detection increases as the distance between the tester tip and the DUT decreases at that point, and decreases as the distance increases. Since capacitance is inversely proportional to distance, the sensitivity of capacitance to distance is very high in the range of very small distances. Therefore, the Z-coordinate detection circuit can measure the Z-coordinate of the DUT with very high precision. Furthermore, by controlling the handler so that the Z-coordinates measured at N points approach a predetermined target value, the distance between the tester tip and the DUT can be kept constant across the entire surface of the DUT. 【0020】In one embodiment, each pair of Z-coordinate detection tester electrodes may be formed on the tester chip such that, when viewed in the Z-axis direction, they are included within the range of the corresponding Z-coordinate detection device electrode. This reduces the effect of the displacement on capacitance, even if the DUT is misaligned in the X-axis and Y-axis directions. Therefore, the DUT can be positioned in the Z-axis direction with high precision before precisely positioning it in the X-axis and Y-axis directions. 【0021】 In one embodiment, N=4, and the four Z-coordinate detection device electrodes may be arranged at the four corners of the DUT. This increases the distance between the Z-coordinate detection device electrodes, thereby improving the parallelism between the DUT and the tester tip. 【0022】 In one embodiment, each Z-coordinate detection circuit may include an oscillator whose oscillation frequency changes according to the corresponding capacitance, and a frequency measuring instrument for measuring the oscillation frequency of the oscillator. 【0023】 In one embodiment, the oscillator is a ring oscillator formed by connecting a plurality of inverters in a ring shape, and the Z-coordinate detection tester electrode pair may be connected to one input node and one output node of the plurality of inverters. 【0024】In one embodiment, the DUT may further include K (K≧1) X-coordinate detection device electrodes and L (L≧1) Y-coordinate detection device electrodes. The handler may be configured to control the position of the DUT in the X-axis and Y-axis directions. The test apparatus may further include K X-coordinate detection device electrodes and K X-coordinate detection tester electrode pairs corresponding to them, L Y-coordinate detection device electrodes and L Y-coordinate detection tester electrode pairs corresponding to them, K X-coordinate detection circuits corresponding to the K X-coordinate detection tester electrode pairs, and L Y-coordinate detection circuits corresponding to the L Y-coordinate detection tester electrode pairs. Each X-coordinate detection tester electrode pair is formed on the tester chip at a position opposite to the corresponding X-coordinate detection device electrode, and each X-coordinate detection tester electrode pair may include two electrodes extending in the X-axis direction and spaced apart in the Y-axis direction. Each Y-coordinate detection tester electrode pair is formed on the tester chip at a position opposite to the corresponding Y-coordinate detection device electrode, and each Y-coordinate detection tester electrode pair may include two electrodes that extend in the Y-axis direction and are spaced apart in the X-axis direction. Each X-coordinate detection circuit may generate an X-coordinate detection signal corresponding to the capacitance with the corresponding X-coordinate detection tester electrode pair at both ends. Each Y-coordinate detection circuit may generate L Y-coordinate detection circuits that generate a Y-coordinate detection signal corresponding to the capacitance with the corresponding Y-coordinate detection tester electrode pair at both ends. The handler control unit may control the position of the DUT in the X-axis direction by controlling the handler based on the X-coordinate detection signal, and may control the position of the DUT in the Y-axis direction by controlling the handler based on the Y-coordinate detection signal. 【0025】 Regarding the X-axis direction, as the DUT moves in the X-axis direction, the overlap area between the X-coordinate detection device electrodes and the X-coordinate detection tester electrode pair increases or decreases, and the capacitance formed between the X-coordinate detection tester electrode pair increases or decreases. Therefore, the X-axis coordinate of the DUT can be measured with very high precision, and its position can be controlled with high precision in the X-axis direction. The same applies to the Y-axis direction. 【0026】In one embodiment, K = 2 and L = 2, and the two pairs of X-coordinate detection tester electrodes may be arranged on a straight line extending in the X-axis direction, while the two pairs of Y-coordinate detection tester electrodes may be arranged on a straight line extending in the Y-axis direction. This further improves the position control accuracy in the X-axis and Y-axis directions. 【0027】 In one embodiment, the handler control unit may control the handler so that the two X-coordinate detection signals and the two Y-coordinate detection signals are equal. In this case, since only the relative accuracy of each coordinate detection signal needs to be high, rather than the absolute accuracy, the difficulty of circuit design can be reduced. 【0028】 In one embodiment, the handler may be configured to allow the DUT to rotate around the Z-axis. The DUT may further have M (M≧1) rotation angle detection device electrodes. The test apparatus may further include M rotation angle detection tester electrode pairs corresponding to the M rotation angle detection device electrodes, and M rotation angle detection circuits corresponding to the M rotation angle detection tester electrode pairs. Each rotation angle detection tester electrode pair is formed on the tester chip at a position facing the corresponding rotation angle detection device electrode, and each rotation angle detection tester electrode pair may include two electrodes extending in an arbitrary third direction and spaced apart in a direction perpendicular to the third direction. Each rotation angle detection circuit may generate a rotation angle detection signal corresponding to the capacitance with the corresponding rotation angle detection tester electrode pair at both ends. The handler control unit may control the rotation of the DUT around the Z-axis by controlling the handler based on the rotation angle detection signal. 【0029】A test apparatus according to one embodiment tests a device under test (DUT) having a non-contact interface. The DUT has K (K≧1) X-coordinate detection device electrodes and L (L≧1) Y-coordinate detection device electrodes. The X-axis is taken in a first in-plane direction of the DUT, the Y-axis is taken in a second in-plane direction of the DUT, and the Z-axis is taken in a direction perpendicular to the DUT. The test apparatus comprises a handler configured to control the position of the DUT in the X-axis and Y-axis directions, a tester chip, K pairs of X-coordinate detection tester electrodes corresponding to the K X-coordinate detection device electrodes, L pairs of Y-coordinate detection tester electrodes corresponding to the L Y-coordinate detection device electrodes, K X-coordinate detection circuits corresponding to the K pairs of X-coordinate detection tester electrodes, L Y-coordinate detection circuits corresponding to the L pairs of Y-coordinate detection tester electrodes, and a handler control unit. Each pair of X-coordinate detection tester electrodes is formed on the tester chip at a position opposite to the corresponding X-coordinate detection device electrode, and each pair of X-coordinate detection tester electrodes includes two electrodes that extend in the X-axis direction and are spaced apart in the Y-axis direction. Each pair of Y-coordinate detection tester electrodes is formed on the tester chip at a position opposite to the corresponding Y-coordinate detection device electrode, and each pair of Y-coordinate detection tester electrodes includes two electrodes that extend in the Y-axis direction and are spaced apart in the X-axis direction. Each X-coordinate detection circuit generates an X-coordinate detection signal corresponding to the capacitance with the corresponding X-coordinate detection tester electrode pair at both ends. Each Y-coordinate detection circuit generates a Y-coordinate detection signal corresponding to the capacitance with the corresponding Y-coordinate detection tester electrode pair at both ends. The handler control unit controls the position of the DUT in the X-axis direction by controlling the handler based on the X-coordinate detection signal, and controls the position of the DUT in the Y-axis direction by controlling the handler based on the Y-coordinate detection signal. 【0030】 (Embodiments) Preferred embodiments will be described below with reference to the drawings. The same or equivalent components, members, and processes shown in each drawing will be denoted by the same reference numerals, and redundant descriptions will be omitted as appropriate. Furthermore, the embodiments are illustrative and not limiting to the disclosure and invention, and not all features or combinations thereof described in the embodiments are necessarily essential to the disclosure and invention. 【0031】 Furthermore, the dimensions (thickness, length, width, etc.) of each component shown in the drawing may be enlarged or reduced as appropriate for ease of understanding. Moreover, the dimensions of multiple components do not necessarily represent their relative sizes; even if component A is depicted as thicker than component B in the drawing, component A may actually be thinner than component B. 【0032】 In this specification, "a state in which member A is connected to member B" includes not only cases in which member A and member B are directly connected physically, but also cases in which member A and member B are indirectly connected via other members that do not substantially affect their electrical connection state or impair the functions or effects produced by their connection. 【0033】 Similarly, "the state in which member C is connected (provided) between member A and member B" includes not only cases where member A and member C, or member B and member C, are directly connected, but also cases where they are indirectly connected via other members that do not substantially affect their electrical connection state or impair the function or effect produced by their combination. 【0034】 Figure 2 shows a test apparatus 100 according to an embodiment. The test apparatus 100 comprises a handler 110, a tester-side interface chip (hereinafter referred to as a tester chip) 120, a socket 130, a socket board 140, a test head 150, and a connection means 160. 【0035】 DUT2 incorporates a non-contact interface 3. The tester chip 120 has a non-contact interface 122 that conforms to the same communication method as the non-contact interface 3 of DUT2. The type of non-contact interface provided by the tester chip 120 and DUT2 is not particularly limited, but examples include optical coupling, inductive coupling, and capacitive coupling. The test apparatus 100 communicates between the non-contact interface 122 and the non-contact interface 3 to determine whether the DUT2 is good or bad. 【0036】Handler 110 transports DUT 2 and positions it with respect to tester chip 120. Handler 110 has six degrees of freedom. Here, the X-axis is in the right direction of the paper surface, the Z-axis is in the upward direction of the paper surface, and the Y-axis is in the direction perpendicular to the paper surface. Handler 110 positions DUT 2 with respect to the X-axis direction, Y-axis direction, Z-axis direction, and the rotational directions φ, θ, ψ about each of the three axes. 【0037】 Tester chip 120 is supported and fixed by socket 130. An interposer 132 may be provided between socket 130 and tester chip 120. 【0038】 Socket 130 is provided on socket board 140. The connection between test head 150 and tester chip 120 is made via wirings and via holes formed in connection means 160, socket board 140, socket 130, and interposer 132, respectively. 【0039】 Power circuits, a timing generator, a pattern generator, and I / O circuits (pin electronics circuits) etc. are mounted on test head 150. Test head 150 is connected to a tester main body not shown and operates under the control of the tester main body. 【0040】 The above is the overall configuration of test apparatus 100. 【0041】 As described above, during the test, DUT 2 and tester chip 120 must be positioned in a non-contact state with a predetermined gap d therebetween. Therefore, an extremely high parallelism is required between DUT 2 and tester chip 120. 【0042】 Hereinafter, the technology regarding the high-precision positioning of DUT 2 will be described. 【0043】 FIG. 3 is a block diagram regarding the position control of DUT in test apparatus 100 according to the embodiment. Here, the position control of the three axes of the Z-axis direction, rotation in the φ direction, and rotation in the θ direction will be described. The position control of these three axes means the adjustment of the gap and parallelism between DUT 2 and tester chip 120. 【0044】DUT2 has a plurality of N (N ≥ 3) device electrodes A1 to AN for Z - coordinate detection, where N is 3 or more. The plurality of device electrodes A1 to AN for Z - coordinate detection are arranged such that a single plane passing through them is uniquely determined. In other words, the plurality of device electrodes A1 to AN for Z - coordinate detection only need to include three device electrodes for Z - coordinate detection that are not on the same straight line. 【0045】 In this embodiment, N = 4, and the four device electrodes A1 to A4 for Z - coordinate detection are arranged at the four corners of DUT2. 【0046】 In this embodiment, the shapes of the device electrodes A1 to A4 for Z - coordinate detection are circular, but their shapes are not limited and may be rectangular or other shapes. 【0047】 The test apparatus 100 includes a plurality of N tester electrode pairs a1, a2, a3, a4 for Z - coordinate detection, a plurality of N Z - coordinate detection circuits 200_1 to 200_4, a handler control unit 300, and a handler 110 for position control of DUT2 in the Z - axis direction. The two electrodes included in each electrode pair are distinguished by the subscripts p and n. 【0048】 The tester electrode pairs a1, a2, a3, a4 for Z - coordinate detection are formed on the tester chip 120. The i - th (i = 1, 2,..., n) tester electrode pair ai for Z - coordinate detection is provided at a position facing the corresponding device electrode Ai for Z - coordinate detection. 【0049】 Each tester electrode pair ai for Z - coordinate detection is formed so as to be included in the range of the corresponding device electrode Ai for Z - coordinate detection when viewed in the Z - axis direction. 【0050】 The plurality of N Z - coordinate detection circuits 200_1 to 200_N correspond to the plurality of N tester electrode pairs a1 to aN for Z - coordinate detection. The i - th Z - coordinate detection circuit 200_i generates a Z - coordinate detection signal Zi corresponding to the capacitance Czi with the corresponding tester electrode pair ai for Z - coordinate detection at both ends. 【0051】Figure 4 illustrates the capacitance Czi formed between the Z-coordinate detection tester electrode pair. A capacitance Czi is formed between one electrode aip of the Z-coordinate detection tester electrode pair ai and the Z-coordinate detection device electrode Ai, and a capacitance Czin is formed between the other electrode ain of the Z-coordinate detection tester electrode pair ai and the Z-coordinate detection device electrode Ai. Therefore, the capacitance Czi formed between the Z-coordinate detection tester electrode pair ai is the combined capacitance of the two capacitances Czip and Czin connected in series. In reality, a capacitance is also formed between the Z-coordinate detection tester electrodes aip and ain, but this is ignored here. 【0052】 The capacitance Czip formed between electrode aip and electrode Ai, and the capacitance Czin formed between electrode ain and electrode Ai, respectively, increase as the distance between the tester tip 120 and DUT2 decreases, and decrease as the distance increases. Here, since capacitance is inversely proportional to the distance between electrodes, the sensitivity of capacitance to distance is very high in the narrow range. Therefore, the Z-coordinate detection circuit 200 can measure the Z-coordinates at N points on DUT2 with very high precision. 【0053】 Returning to Figure 3, the handler control unit 300 controls the handler 110 based on the Z-coordinate detection signals Z1 to Z4 generated by the multiple Z-coordinate detection circuits 200_1 to 200_4, thereby adjusting the distance between the DUT2 and the tester chip 120 and the parallelism between the surface of the DUT2 and the surface of the tester chip 120. Specifically, the handler control unit 300 controls the handler 110 so that the Z-coordinates Z1 to Z4 measured at N points approach a predetermined target value, thereby making the distance between the tester chip 120 and the DUT2 constant across the entire surface of the DUT2. The handler control unit 300 may be implemented as part of the tester body. 【0054】Figure 5 shows an example configuration of the Z-coordinate detection circuit 200. The Z-coordinate detection circuit 200_i includes an oscillator 202 and a frequency measuring instrument 204. The oscillator 202 generates a clock signal CK. The oscillation frequency f of the oscillator 202 changes according to the capacitance Czi formed between the corresponding coordinate detection tester electrode pair ai. 【0055】 The frequency measuring instrument 204 measures the oscillation frequency f (frequency of the clock signal CK) of the oscillator 202. The oscillator 202 can be formed on the tester chip 120. The frequency measuring instrument 204 may be formed on the tester chip 120 or may be provided outside the tester chip 120. If multiple Z-coordinate detection circuits 200 are provided, the frequency measuring instrument 204 can be shared among the multiple Z-coordinate detection circuits 200. 【0056】 For example, oscillator 202 is a ring oscillator including a plurality of inverters INV1 to INV3 connected in a ring shape. Inverter INV4 is provided as an output buffer. The number of inverters INV1 to INV3 forming the ring can be odd, but is not particularly limited. One electrode aip forming the Z-coordinate detection tester electrode pair ai is connected to the input node of one of the plurality of inverters, INV2, and the other electrode ain forming the Z-coordinate detection tester electrode pair ai is connected to the output node of inverter INV2. When the capacitance Czi increases, the oscillation frequency f of oscillator 202 decreases, and when the capacitance Czi decreases, the oscillation frequency f of oscillator 202 increases. Therefore, the oscillation frequency f of oscillator 202 correlates with the capacitance Czi, and consequently with the distance between DUT2 and the tester chip 120, and thus indicates the Z coordinate of DUT2 at the measurement point. 【0057】 The distance and parallelism between DUT2 and the tester tip 120 are adjusted by adjusting the three axes Z, θ, and φ as described above. Next, the position detection and position control of the remaining three axes, the X-axis, Y-axis, and ψ rotational directions of DUT2, will be explained. 【0058】Figure 6 is a block diagram relating to the position control of the DUT in the test apparatus 100 according to the embodiment. Figure 6 shows elements relating to rotation in the X-axis direction, Y-axis direction, and ψ direction. 【0059】 DUT2 has at least one (K: K≧1) X-coordinate detection device electrodes B1 to BK. In this example, K=2, and the two X-coordinate detection device electrodes B1 and B2 are arranged on the same straight line extending in the X-axis direction. 【0060】 Furthermore, DUT2 has at least one (L: L≧1) Y-coordinate detection device electrodes C1 to CL. In this example, L=2, and the two Y-coordinate detection device electrodes C1 and C2 are arranged on the same straight line extending in the Y-axis direction. 【0061】 Furthermore, DUT2 has at least one (M: M≧1) rotation detection device electrodes D1 to DM. In this example, M=2, and two rotation detection device electrodes D1 and D2 are arranged diagonally across DUT2. 【0062】 The test apparatus 100 includes K pairs of X-coordinate detection tester electrodes b1 to bK and K X-coordinate detection circuits 210_1 to 210_K for position control of the DUT2 in the X-axis direction. The two electrodes included in each electrode pair are distinguished by the subscripts p and n. 【0063】 The X-coordinate detection tester electrode pairs b1 to bK are formed on the tester chip 120. The i-th (i = 1, 2, ..., K) X-coordinate detection tester electrode pair bi is positioned opposite the corresponding X-coordinate detection device electrode Bi. 【0064】The two electrodes bip and bin included in the X-coordinate detection tester electrode pair bi extend in the X-axis direction and are spaced apart in the Y-axis direction. The two electrodes bip and bin have a shape and size such that when the opposing X-coordinate detection device electrode Bi moves in the X-axis direction, the overlapping area Sxp of bip and Bi and the overlapping area Sxn of bin and Bi change. On the other hand, the two electrodes bip and bin have a shape and size such that when the opposing X-coordinate detection device electrode Bi moves in the Y-axis direction, the overlapping area Sxp of bip and Bi and the overlapping area Sxn of bin and Bi do not change. In other words, with respect to the Y-axis direction, the range in which the X-coordinate detection tester electrode pair bi is formed is narrower than the range in which the X-coordinate detection device electrode B1 is formed. 【0065】 K X-coordinate detection circuits 210_1 to 210_K correspond to K pairs of X-coordinate detection tester electrodes b1 to bK. The i-th X-coordinate detection circuit 210_i generates an X-coordinate detection signal Xi corresponding to the capacitance Cxi with the corresponding X-coordinate detection tester electrode pair bi at both ends. 【0066】 The X-coordinate detection circuit 210 can be configured in the same way as the Z-coordinate detection circuit 200. For example, if the Z-coordinate detection circuit 200 and the X-coordinate detection circuit 210 are configured as shown in Figure 5, the frequency measuring instrument 204 can be shared between the Z-coordinate detection circuit 200 and the X-coordinate detection circuit 210. 【0067】 Figure 7 illustrates the capacitance Cxi formed between the X-coordinate detection tester electrode pair bi. A capacitance Cxi is formed between one of the X-coordinate detection tester electrode pairs bi, bip, and the X-coordinate detection device electrode Bi, and a capacitance Cxi is formed between the other of the X-coordinate detection tester electrode pair bi, bin, and the X-coordinate detection device electrode Bi. Therefore, the capacitance Cxi formed between the X-coordinate detection tester electrode pair bi is the combined capacitance of the two capacitances Cxi and Cxi connected in series. In reality, a capacitance is also formed between the X-coordinate detection tester electrodes bip and bin, but this is ignored here. 【0068】The capacitance Cxip formed between electrode bip and electrode Bi varies depending on the overlapping area Sxp between the two opposing electrodes Bi and bip, and the area Sxp depends on the X coordinate of DUT2. Similarly, the capacitance Cxin formed between electrode bin and electrode Bi varies depending on the overlapping area Sxn between the two opposing electrodes Bi and bin, and the area Sxn depends on the X coordinate of DUT2. 【0069】 Therefore, the X-coordinate detection circuit 210 can measure the X-coordinate of the DUT2 with very high accuracy based on the capacitance Cxi. 【0070】 Return to Figure 6. The test apparatus 100 includes L pairs of Y-coordinate detection tester electrodes c1 to cL and L Y-coordinate detection circuits 220_1 to 220_K for controlling the Y-axis position of the DUT2. The two electrodes included in each electrode pair are distinguished by the subscripts p and n. 【0071】 The Y-coordinate detection tester electrode pairs c1 to cL are formed on the tester chip 120. The i-th (i = 1, 2, ..., L) Y-coordinate detection tester electrode pair ci is positioned opposite the corresponding Y-coordinate detection device electrode Ci. 【0072】 The two electrodes cip and cin, included in the Y-coordinate detection tester electrode pair ci, extend in the Y-axis direction and are spaced apart in the X-axis direction. The two electrodes cip and cin have a shape and size such that when the opposing Y-coordinate detection device electrode Ci moves in the Y-axis direction, the overlapping area Symp between cip and Ci and the overlapping area Syn between cin and Ci change. On the other hand, the two electrodes cip and cin have a shape and size such that when the opposing Y-coordinate detection device electrode Ci moves in the X-axis direction, the overlapping area Symp between cip and Ci and the overlapping area Syn between cin and Ci do not change. In other words, with respect to the X-axis direction, the range in which the Y-coordinate detection tester electrode pair ci is formed is narrower than the range in which the Y-coordinate detection device electrode C1 is formed. 【0073】L Y-coordinate detection circuits 220_1 to 220_L correspond to L Y-coordinate detection tester electrode pairs c1 to cL. The i-th Y-coordinate detection circuit 220_i generates a Y-coordinate detection signal Yi corresponding to the capacitance Cyi with the corresponding Y-coordinate detection tester electrode pair ci at both ends. 【0074】 The Y-coordinate detection circuit 220 can be configured in the same way as the Z-coordinate detection circuit 200. For example, if the Z-coordinate detection circuit 200 and the Y-coordinate detection circuit 220 are configured as shown in Figure 5, the frequency measuring instrument 204 may be shared between the Z-coordinate detection circuit 200 and the Y-coordinate detection circuit 220. 【0075】 The principle of Y-coordinate detection is the same as the principle of X-coordinate detection. 【0076】 The test apparatus 100 includes M pairs of rotation detection tester electrodes d1 to dM and M rotation detection circuits 230_1 to 230_M for controlling the rotation of DUT2 in the ψ direction. The two electrodes included in each electrode pair are distinguished by the subscripts p and n. 【0077】 The rotation detection tester electrode pairs d1 to dM are formed on the tester tip 120. The i-th (i = 1, 2, ... M) rotation detection tester electrode pair di is positioned opposite the corresponding rotation detection device electrode Di. 【0078】 The two electrodes dip and din included in the rotation detection tester electrode pair di extend in an arbitrary third direction and are spaced apart in a direction perpendicular to the third direction. In this embodiment, the third direction is a direction nonparallel to the X and Y axes, specifically parallel to the diagonal. The two electrodes dip and din have a shape and size such that when the opposing rotation detection device electrode Di moves in the ψ direction, the overlapping area Sψp of dip and Di and the overlapping area Sψn ​​of din and Di change. 【0079】 The M rotation detection circuits 230_1 to 230_M correspond to M pairs of rotation detection tester electrodes d1 to dM. The i-th rotation detection circuit 230_i generates a rotation detection signal ψi corresponding to the capacitance Cψi with the corresponding rotation detection tester electrode pair di at both ends. 【0080】The rotation detection circuit 230 can be configured in the same way as the Z-coordinate detection circuit 200. For example, if the Z-coordinate detection circuit 200 and the rotation detection circuit 230 are configured as shown in Figure 5, the frequency measuring instrument 204 may be shared between the Z-coordinate detection circuit 200 and the rotation detection circuit 230. 【0081】 The principle for detecting rotation in the ψ direction is the same as the principle for detecting the X coordinate. 【0082】 The handler control unit 300 controls the position of the DUT2 in the X-axis direction by controlling the handler 110 based on the X-coordinate detection signals X1 to XK. The handler control unit 300 also controls the position of the DUT2 in the Y-axis direction by controlling the handler 110 based on the Y-coordinate detection signals Y1 to YL. The handler control unit 300 also controls the rotation of the DUT2 in the rotation direction ψ around the Z-axis by controlling the handler 110 based on the rotation detection signals ψ1 to ψM. 【0083】 Figure 8 is a plan view showing an example of the layout of the device electrode and tester electrode. Figure 8 shows a state where the electrodes are perfectly aligned in the X-axis direction, Y-axis direction, and ψ direction. 【0084】 As described above, DUT2 is provided with four Z-coordinate detection device electrodes A1 to A4, two X-coordinate detection device electrodes B1 to B2, two Y-coordinate detection device electrodes C1 to C2, and two rotation detection device electrodes D1 to D2. 【0085】 Device electrodes A1 to A4 are provided at the four corners of the DUT2. Z-coordinate detection tester electrode pairs a1 to a4 are provided overlapping with device electrodes A1 to A4. Even if the DUT shifts in the X-axis direction, Y-axis direction, and φ-rotation direction from a perfectly aligned state, the Z-coordinate detection tester electrode pairs a1 to a4 will overlap with device electrodes A1 to A4. This allows the height of the DUT2 to be adjusted before alignment in the X-axis direction, Y-axis direction, and φ-rotation direction is completed. The handler control unit 300 only needs to control the four Z-coordinate detection signals Z1 to Z4 so that they all approach the target value equally. 【0086】By providing device electrodes A1 to A4 at the four corners of the DUT2, the spacing between the Z-coordinate detection device electrodes is increased. Therefore, compared to the case where the spacing between the Z-coordinate detection device electrodes is narrow, the parallelism between the DUT and the tester tip is higher when there is an error in height at each point. 【0087】 Two X-coordinate detection device electrodes B1 and B2 are provided near both sides of the chip in the X-axis direction of device 2, and near the center of the chip length in the Y-axis direction. Two X-coordinate detection tester electrode pairs b1 and b2 are provided so as to partially overlap with the two X-coordinate detection device electrodes B1 and B2. The set of electrodes B1 and b1 is symmetrical with respect to the Y-axis with respect to the set of electrodes B2 and b2, and in a state of complete alignment in the X-axis direction, the overlap amount of B1 and b1 is equal to the overlap amount of B2 and b2. Therefore, the handler control unit 300 can align the DUT2 to the correct position in terms of the X coordinate by controlling the handler 110 so that the two X-coordinate detection signals X1 and X2 are equal. In other words, alignment in the X-axis direction is possible based on the relative relationship of the two X-coordinate detection signals X1 and X2. 【0088】 Two Y-coordinate detection device electrodes C1 and C2 are provided near both sides of the chip in the Y-axis direction of device 2, and near the center of the chip length in the X-axis direction. Two Y-coordinate detection tester electrode pairs c1 and c2 are provided so as to partially overlap with the two Y-coordinate detection device electrodes C1 and C2. The set of electrodes C1 and c1 is symmetrical with respect to the X-axis with respect to the set of electrodes C2 and c2, and in a state of complete alignment in the Y-axis direction, the amount of overlap between C1 and c1 is equal to the amount of overlap between C2 and c2. The handler control unit 300 can align the DUT2 to the correct position in terms of the Y coordinate by controlling the handler 110 so that the two Y-coordinate detection signals Y1 and Y2 are equal. In other words, alignment in the Y-axis direction is possible based on the relative relationship of the two Y-coordinate detection signals Y1 and Y2. 【0089】The two rotation detection device electrodes D1 and D2 are arranged, for example, diagonally across the chip. The two rotation detection tester electrode pairs d1 and d2 are provided so as to partially overlap with the two rotation detection device electrodes D1 and D2. The set of electrodes D1 and d1 and the set of electrodes D2 and d2 are symmetrical to each other, and in a state of perfect alignment with respect to the ψ direction, the amount of overlap between D1 and d1 is equal to the amount of overlap between D2 and d2. The handler control unit 300 can align the DUT2 to the correct position with respect to the ψ direction by controlling the handler 110 so that the two rotation detection signals ψ1 and ψ2 are equal. In other words, alignment in the ψ direction is possible based on the relative relationship of the two rotation detection signals ψ1 and ψ2. 【0090】 DUT alignment can be performed using the following procedure. 【0091】 First, the height of DUT2 and the inclination φ and θ (i.e., parallelism) of DUT2 are adjusted based on the output of the Z-coordinate detection circuit 200. 【0092】 Next, the X-coordinate of DUT2 is adjusted based on the output of the X-coordinate detection circuit 210. 【0093】 Next, the Y coordinate of DUT2 is adjusted based on the output of the Y coordinate detection circuit 220. 【0094】 Next, the rotation angle ψ of the DUT2 is adjusted based on the output of the rotation detection circuit 230. 【0095】 Note that the order of alignment is not limited to that shown here. For example, the order of adjusting the X and Y coordinates may be changed. 【0096】 The embodiments described above are illustrative, and it will be understood by those skilled in the art that various modifications are possible in combinations of their components and processing steps. Such modifications will be described below. 【0097】(Modification 1) The number K of the X-coordinate detection device electrodes B1 to BK may be 1 or 3 or more. When K = 1, the handler control unit 300 only needs to control the handler 110 so that the X-coordinate detection signal X1 approaches the target value. However, in this case, very high absolute accuracy is required for the X-coordinate detection signal X1, which raises the hurdle for circuit design. In contrast, when the two X-coordinate detection device electrodes B1 to B2 are arranged symmetrically as explained with reference to Figure 8, the position control is based on the relative values ​​of the two X-coordinate detection signals X1 and X2, so absolute accuracy of the X-coordinate detection signals X1 and X2 is not required. Therefore, circuit design becomes easier. 【0098】 Similarly, the number L of the Y-coordinate detection device electrodes C1 to CL may be 1 or 3 or more. When L = 1, the handler control unit 300 should control the handler 110 so that the Y-coordinate detection signal Y1 approaches the target value. The same applies to the rotation detection device electrodes D1 to DM. 【0099】 (Modification 2) Figure 9 is a plan view showing another example of the layout of the device electrode and the tester electrode. 【0100】 The layout of the two rotation detection device electrodes D1-D2 and their corresponding rotation detection tester electrode pairs d1-d2 differs from that in Figure 8. The two rotation detection device electrodes D1 and D2 are positioned near the center of the DUT2 in the Y direction, aligned with a straight line extending in the X direction. The two electrodes dip and din included in the rotation detection tester electrode pair di (i=1,2) extend in the Y direction and are spaced apart in the X direction. When the opposing rotation detection device electrode Di moves in the ψ direction, the overlapping area Sψp of dip and Di and the overlapping area Sψn ​​of din and Di change. 【0101】 (Modification 3) The Z-coordinate detection circuit 200 in Figure 5 is configured using an oscillator 202, but the disclosure is not limited thereto. In the Z-coordinate detection circuit 200, X-coordinate detection circuit 210, Y-coordinate detection circuit 220, and rotation detection circuit 230, the method for measuring capacitance can be the publicly known or future available technology. 【0102】 (Modification 4) The configuration shown in Figure 3 and the configuration shown in Figure 6 may be used in combination or individually. 【0103】 For example, when adopting the configuration shown in Figure 3, the X coordinate, Y coordinate, and rotation angle ψ of DUT2 may be aligned using a different configuration. 【0104】 When adopting the configuration shown in Figure 6, the height and inclination of DUT2 may be aligned using a different configuration. 【0105】 (Modification 5) In the embodiment, a pair of tester electrodes consisting of two tester electrodes is provided on the tester chip side corresponding to one device electrode, but the disclosure is not limited thereto. A configuration in which the device electrode is grounded and one tester electrode is provided on the tester chip side is also conceivable. 【0106】 While the embodiments described herein have been explained using specific terminology, this explanation is merely illustrative to aid understanding and does not limit the scope of this disclosure or the claims. The scope of the present invention is defined by the claims, and therefore embodiments, examples, and modifications not described herein are also included within the scope of the present invention. 【0107】 This disclosure relates to an automated testing apparatus. 【0108】2 DUT 3 Non-contact interface 100 Test device 110 Handler 120 Tester chip 122 Non-contact interface 130 Socket 132 Interposer 140 Socket board 150 Test head 160 Connection means A1, A2, A3, A4 Device electrodes for Z coordinate detection a1, a2, a3, a4 Tester electrode pairs for Z coordinate detection B1, B2, B3, B4 Device electrodes for X coordinate detection b1, b2, b3, b4 Tester electrode pairs for X coordinate detection C1, C2, C3, C4 Device electrodes for Y coordinate detection c1, c2, c3, c4 Tester electrode pairs for Y coordinate detection D1, D2, D3, D4 Device electrodes for rotation detection d1, d2, d3, d4 Tester electrode pairs for rotation detection 200 Z coordinate detection circuit 202 Oscillator 204 Frequency measuring instrument 210 X-coordinate detection circuit 220 Y-coordinate detection circuit 230 Rotation detection circuit 300 Handler control unit

Claims

1. A test apparatus for testing a device under test (DUT) having a non-contact interface, wherein the DUT has a plurality of N (N≧3) Z-coordinate detection device electrodes arranged such that the plane through which they pass is uniquely determined, and when the X-axis is taken in a first in-plane direction of the DUT, the Y-axis is taken in a second in-plane direction of the DUT, and the Z-axis is taken in a direction perpendicular to the DUT, the test apparatus comprises: a handler capable of controlling the position of the DUT in the Z-axis direction and the rotation of the DUT about the X-axis and rotation about the Y-axis; a tester chip; and a plurality of N pairs of Z-coordinate detection tester electrodes corresponding to the N Z-coordinate detection device electrodes, wherein each pair of Z-coordinate detection tester electrodes is formed on the tester chip at a position facing the corresponding Z-coordinate detection device electrode, A test apparatus comprising: a plurality of N Z-coordinate detection circuits corresponding to a plurality of N Z-coordinate detection tester electrode pairs, each Z-coordinate detection circuit comprising: a plurality of N Z-coordinate detection circuits that generate a Z-coordinate detection signal corresponding to the capacitance with the corresponding Z-coordinate detection tester electrode pair at both ends; and a handler control unit that controls the handler based on the Z-coordinate detection signal to adjust the distance between the DUT and the tester tip and the parallelism between the surface of the DUT and the surface of the tester tip.

2. The test apparatus according to claim 1, characterized in that each pair of Z-coordinate detection tester electrodes is formed on the tester chip such that, when viewed in the Z-axis direction, it is included within the range of the corresponding Z-coordinate detection device electrode.

3. The test apparatus according to claim 1 or 2, characterized in that N = 4, and the four Z-coordinate detection device electrodes are arranged at the four corners of the DUT.

4. The test apparatus according to claim 1 or 2, characterized in that each Z-coordinate detection circuit includes an oscillator whose oscillation frequency changes according to the corresponding capacitance, and a frequency measuring instrument for measuring the oscillation frequency of the oscillator.

5. The test apparatus according to claim 4, wherein the oscillator is a ring oscillator formed by connecting a plurality of inverters in a ring shape, and the Z-coordinate detection tester electrode pair is connected to one input node and output node of the plurality of inverters.

6. The DUT further comprises K (K≧1) X-coordinate detection device electrodes and L (L≧1) Y-coordinate detection device electrodes, the handler is configured to control the position of the DUT in the X-axis direction and the Y-axis direction, the test apparatus comprises K pairs of X-coordinate detection tester electrodes corresponding to the K X-coordinate detection device electrodes, each pair of X-coordinate detection tester electrodes is formed on the tester chip at a position facing the corresponding X-coordinate detection device electrode, and each pair of X-coordinate detection tester electrodes includes two electrodes extending in the X-axis direction and spaced apart in the Y-axis direction, L pairs of Y-coordinate detection tester electrodes corresponding to the L Y-coordinate detection device electrodes, each pair of Y-coordinate detection tester electrodes is formed on the tester chip at a position facing the corresponding Y-coordinate detection device electrode, and each pair of Y-coordinate detection tester electrodes includes two electrodes extending in the Y-axis direction and spaced apart in the X-axis direction; K pairs of X-coordinate detection circuits corresponding to the K pairs of X-coordinate detection tester electrodes, each X-coordinate detection circuit generates an X-coordinate detection signal corresponding to the capacitance with the corresponding pair of X-coordinate detection tester electrodes at both ends; L pairs of Y-coordinate detection circuits corresponding to the L pairs of Y-coordinate detection tester electrodes, each Y-coordinate detection circuit generates a Y-coordinate detection signal corresponding to the capacitance with the corresponding pair of Y-coordinate detection tester electrodes at both ends; The test apparatus according to claim 1 or 2, characterized in that the handler control unit controls the position of the DUT in the X-axis direction by controlling the handler based on the X-coordinate detection signal, and controls the position of the DUT in the Y-axis direction by controlling the handler based on the Y-coordinate detection signal.

7. The test apparatus according to claim 6, characterized in that K = 2 and L = 2, the two pairs of X-coordinate detection tester electrodes are arranged on a straight line extending in the X-axis direction, and the two pairs of Y-coordinate detection tester electrodes are arranged on a straight line extending in the Y-axis direction.

8. The test apparatus according to claim 7, characterized in that the handler control unit controls the handler such that the two X-coordinate detection signals are equal and the two Y-coordinate detection signals are equal.

9. The handler is configured to make the DUT rotatable around the Z-axis, and the DUT further has M (M≧1) rotation angle detection device electrodes, and the test apparatus further comprises M rotation angle detection tester electrode pairs corresponding to the M rotation angle detection device electrodes, each rotation angle detection tester electrode pair being formed on the tester chip at a position facing the corresponding rotation angle detection device electrode, and each rotation angle detection tester electrode pair including two electrodes extending in an arbitrary third direction and spaced apart in a direction perpendicular to the third direction, and M rotation angle detection circuits corresponding to the M rotation angle detection tester electrode pairs, each rotation angle detection circuit generating a rotation angle detection signal corresponding to the capacitance with the corresponding rotation angle detection tester electrode pair at both ends, The test apparatus according to claim 1 or 2, characterized in that the handler control unit controls the rotation of the DUT around the Z axis by controlling the handler based on the rotation angle detection signal.

10. A test apparatus for testing a device under test (DUT) having a non-contact interface, wherein the DUT comprises K (K≧1) X-coordinate detection device electrodes and L (L≧1) Y-coordinate detection device electrodes, and when the X-axis is taken in a first in-plane direction of the DUT, the Y-axis is taken in a second in-plane direction of the DUT, and the Z-axis is taken in a direction perpendicular to the DUT, the test apparatus comprises a handler configured to control the position of the DUT in the X-axis direction and the Y-axis direction, a tester chip, and K pairs of X-coordinate detection tester electrodes corresponding to the K X-coordinate detection device electrodes, wherein each pair of X-coordinate detection tester electrodes is formed on the tester chip at a position facing the corresponding X-coordinate detection device electrode, and each pair of X-coordinate detection tester electrodes includes two electrodes extending in the X-axis direction and spaced apart in the Y-axis direction, L pairs of Y-coordinate detection tester electrodes corresponding to the L Y-coordinate detection device electrodes, each pair of Y-coordinate detection tester electrodes is formed on the tester chip at a position facing the corresponding Y-coordinate detection device electrode, and each pair of Y-coordinate detection tester electrodes includes two electrodes extending in the Y-axis direction and spaced apart in the X-axis direction; K pairs of X-coordinate detection tester electrodes corresponding to the K pairs of X-coordinate detection tester electrodes, each X-coordinate detection circuit generates an X-coordinate detection signal corresponding to the capacitance with the corresponding pair of X-coordinate detection tester electrodes at both ends; L pairs of Y-coordinate detection circuits corresponding to the L pairs of Y-coordinate detection tester electrodes, each Y-coordinate detection circuit generates a Y-coordinate detection signal corresponding to the capacitance with the corresponding pair of Y-coordinate detection tester electrodes at both ends; A test apparatus comprising: a handler control unit that controls the position of the DUT in the X-axis direction by controlling the handler based on the X-coordinate detection signal, and controls the position of the DUT in the Y-axis direction by controlling the handler based on the Y-coordinate detection signal.

11. The test apparatus according to claim 10, characterized in that K = 2, L = 2, two pairs of X-coordinate detection tester electrodes are arranged on a straight line extending in the X-axis direction, and two pairs of Y-coordinate detection tester electrodes are arranged on a straight line extending in the Y-axis direction.

12. The test apparatus according to claim 11, characterized in that the handler control unit controls the handler such that the two X-coordinate detection signals and the two Y-coordinate detection signals are equal.

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