Resin, resin production method, curable resin material, prepreg, resin film, metal-clad laminate, printed wiring board, and semiconductor package

WO2026126848A1PCT designated stage Publication Date: 2026-06-18RESONAC CORP
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Patent Information

Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
RESONAC CORP
Filing Date
2025-12-01
Publication Date
2026-06-18

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Abstract

This resin comprises, as reaction raw materials, an indene compound (A), a styrene compound (B) having an X-CH2-group (X is a leaving group), and an aromatic compound (C) (excluding the styrene compound (B)) having an X-CH2-group (X is a leaving group), wherein the area ratio of a component having a molecular weight of at least 1,000 in the GPC chart of the resin is at most 1.5%.
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