Electronic component test handler

Abstract

The present invention relates to an electronic component test handler. The electronic component test handler, according to the present invention, has a repair device, for repairing a test pin of a test board, loaded on a test table so as to repair the test pin. When the present invention is applied, test reliability may be guaranteed, and the time required for test pin repair may be minimized.

Description

electronic component test handler

[0001] The present invention relates to a handler for supporting the testing of an electronic component by electrically connecting the electronic component and a tester.

[0002] An electronic component test handler is equipment that handles electronic components to electrically connect them to a tester.

[0003] As the integration density of electronic components, such as semiconductor devices, continues to increase, the line width of circuits is becoming increasingly narrow. Consequently, greater precision is required when connecting electronic components to testers.

[0004] For example, previously, it was possible to make a proper electrical connection between electronic components and testers with an error range of 20㎛, but now, the reality is that an error range of 10㎛ or less, or even a few㎛, is required.

[0005] Meanwhile, among electronic components, there are dies that are separated into individual units from the wafer state.

[0006] The die can be completed as a final product by undergoing a packaging process or by stacking it for HBM (High Bandwidth Memory) production and then undergoing a packaging process.

[0007] To perform post-die operations, testing of the die is required.

[0008] Electronic components in die form can be tested by electrically connecting contact pads to a tester.

[0009] Since the gaps between the contact pads on the die are fine and the die is very thin, it can easily break or shatter, so automated testing capable of adequately supporting testing of electronic components in the die or HBM state has not been proposed until now. Accordingly, the applicant has proposed Korean Published Patent No. 10-2021-0088373 (hereinafter referred to as the 'prior art').

[0010] The prior art proposes a technique for aligning the positions of electronic components by repositioning them before connecting them to a tester.

[0011] The prior art scans an electronic component on a test table (named a 'chuck' in the prior art) with a camera to determine its current position and readjusts the position of the electronic component to reduce the error range.

[0012] According to the prior art, the precise positioning of electronic components enables automated testing of electronic components at the die level.

[0013] According to the prior art, electronic components loaded on a test table are electrically connected to a tester through a test board.

[0014] The electronic component is electrically connected to the tester by making electrical contact between the terminal (including the contact pad) of the electronic component and the test pin.

[0015] Test boards can vary mechanically, and depending on the mechanical shape of the test pins, scratching may occur when the test pins come into contact with the terminals of electronic components. This scratching phenomenon causes scratch damage to both the electronic component terminals and the test pins.

[0016] Scratch damage is damage caused by foreign matter adhering to the test pin and wear due to frequent use of the test pin.

[0017] Since test pins are made of a more durable material than the terminals of electronic components, foreign matter may be generated as the terminals of the electronic components are scratched, and this foreign matter may adhere to the test pins, causing damage.

[0018] Even if the test pin is made of a robust material with better wear resistance than the terminals of electronic components, damage such as wear may occur to the test pin due to frequent scratching between metal materials.

[0019] If scratch damage occurs on the test pins, it may cause electrical connection failures between the tester and electronic components, or reduce the response speed of the electronic components to test signals, thereby lowering the reliability of the test.

[0020] In particular, in high-speed tests to verify the response speed of electronic components, scratch damage on test pins needs to be continuously removed.

[0021] If the handler is stopped or the test operation is halted to repair the test pin, the handler's operating rate decreases accordingly.

[0022] [Prior Art Literature]

[0023] [Patent Literature]

[0024] (Patent Document 1) Republic of Korea Published Patent No. 10-2021-0088373

[0025] There is a need to repair scratch damage on the test pins even during the normal operation of the electronic component test handler.

[0026] A handler for testing electronic components according to the present invention comprises: a transport shuttle having a transport table capable of transporting electronic components by moving while the electronic components are loaded; a first hand that loads electronic components to be tested onto the transport table in a first area by the operation of the transport shuttle, or unloads electronic components that have completed testing and have arrived at the first area by loading them onto the transport table; a second hand that unloads electronic components from the transport table that has moved from the first area to a second area separated from the first area by the operation of the transport shuttle; and a test table on which electronic components to be tested and repair components unloaded from the transport table by the second hand are loaded. A moving mechanism capable of moving the test table by the second hand between a loading space where electronic components are loaded on the test table and a test space having a test board for electrically connecting the electronic components to a tester, electrically connecting or disconnecting the terminals of the electronic components loaded on the test table and the test pins of the test board, and operating a repair component to repair the test pins; and a controller controlling the transport shuttle, the first hand, the second hand, and the moving mechanism.

[0027] The above controller can control the second hand and the moving mechanism so that electronic components and repair elements are loaded together on the test table.

[0028] The combined number of electronic components and repair elements that can be loaded onto the above test table is greater than the number of electronic components that can be electrically connected to the tester by the above test board.

[0029] The number of electronic components that can be loaded onto the test table and the number of electronic components electrically connected to the tester by the test board are the same, and the number of repair components that can be loaded onto the test table and the number of electronic components electrically connected to the tester by the test board are the same.

[0030] The controller can control the second hand and the moving mechanism so that the electronic components and the repair elements are arranged alternately, so that the repair elements are arranged between the electronic components.

[0031] The above controller can control the second hand and the moving mechanism so that the loading rows in which electronic components are loaded and the loading rows in which repair components are loaded are arranged alternately.

[0032] The above controller can control the moving mechanism to repair the test pins of the test board using repair components loaded on the test table while the test table remains in the test space after the electronic components loaded on the test table have been tested.

[0033] The above controller can control the moving mechanism to electrically connect the electronic components loaded on the test table to the test board while the test table remains in the test space after the test pins of the test board are repaired by the repair components loaded on the test table.

[0034] The controller controls the second hand and the moving mechanism to remove the repair element from the test table when the repair element is used a predetermined number of times while the repair elements are maintained on the test table.

[0035] It further includes a camera for photographing the repair element; and the controller analyzes the image captured by the camera to determine the replacement time of the repair element.

[0036] It further includes a relocation mechanism that operates to relocate the position of the loaded electronic components when the electronic components to be tested on the test table are loaded by the second hand.

[0037] The above transport table can be used to transport a repair element, and the controller can control the second hand and the moving mechanism to move the repair element from the transport table to the test table or to move the repair element from the test table to the transport table.

[0038] It further includes a foreign matter remover for removing foreign matter generated as a result of repairing the above test pin.

[0039] The second hand, the test table, and the moving mechanism are each provided in two quantities, and the controller controls the second hand, the test table, and the moving mechanism to load a repair element onto at least one of the two test tables.

[0040] It further includes a cleaning device for cleaning the upper surface of the above test table.

[0041] According to the present invention, the following effects are achieved.

[0042] First, the reliability of the test is ensured by repairing the test pins with repair components using a test table for the electrical connection between the electronic components and the tester.

[0043] Second, since electronic components and repair parts are loaded together on the test table, the time required to repair test pins can be minimized.

[0044] FIG. 1 is a conceptual plan view of a handler for testing electronic components according to the present invention.

[0045] FIGS. 2 to 13 are reference diagrams for explaining the electronic component test handler of FIG. 1.

[0046] FIGS. 14 to 16 are conceptual plan views of a test handler according to other examples of the present invention.

[0047] Preferred embodiments according to the present invention are described by example with reference to the attached drawings, provided that for the sake of brevity, descriptions of well-known or redundant components are omitted or compressed as much as possible.

[0048] Explanation from the Logistics Perspective of Electronic Components

[0049] FIG. 1 is a conceptual plan view of an electronic component test handler (TH, hereinafter abbreviated as 'handler') according to the present invention.

[0050] The handler (TH) according to the present invention may be divided into a moving part (MP), a loading / unloading part (LU), a relocation part (RP), and a connecting part (CP), and includes a transport shuttle (100), a first hand (210), a second hand (220), a test table (300), a vacuum device (400), a relocation mechanism (500), a moving mechanism (600), a foreign matter remover (700), a cleaning mechanism (730), and a controller (800).

[0051] In the moving section (MF), electronic components can be moved to exchange electronic components between the unloading section (LU) and the relocation section (RP). To this end, a transport shuttle (100) for carrying electronic components is installed in the moving section (MP).

[0052] A transport shuttle (100) is provided to transport electronic components between the unloading section (LU) and the relocation section (RP).

[0053] The transport shuttle (100) has a movable transport table (110).

[0054] The transport shuttle (100) may have at least one transport table (110).

[0055] The transport table (110) can move back and forth in one direction.

[0056] The transport table (110) can move back and forth in the X-axis direction.

[0057] In the case where there are multiple transport tables (100), the multiple transport tables (110) may be provided in parallel in the Y-axis direction. In this case, the multiple transport tables (110) need to be implemented to move back and forth in the X-axis direction independently of each other.

[0058] The transport table (110) can move between the first area (A1) on the unloading side (LU) and the second area (A2) on the relocation side (RP).

[0059] Electronic components can be loaded on the transport table (110).

[0060] The transport table (110) is not a pocket structure having a mounting groove on which an electronic component can be mounted, but a vacuum structure that fixes an electronic component mounted on a flat surface by vacuum pressure.

[0061] As shown in the schematic plan view of FIG. 2, the transport table (110) has vacuum holes (VH) and vacuum grooves (VG) formed therein for vacuum-adsorbing electronic components.

[0062] One vacuum hole (VH) and one vacuum groove (VG) form a pair.

[0063] The vacuum pressure coming through the vacuum hole (VH) acts on the electronic component as it is evenly distributed through the vacuum groove (VG).

[0064] Since the electronic component can be fixed to the transport table (110) by vacuum pressure, no movement of the electronic component occurs during the process of moving in the X-axis direction while being carried on the transport table (110). Therefore, as long as the electronic component is placed precisely on the transport table (110), the tolerance for misalignment of the electronic component, which has been a problem, can be minimized.

[0065] The vacuum holes (VH) and vacuum grooves (VG) can be arranged in a 2x8 matrix form.

[0066] Since the loading capacity of the transport table (110) can be increased or decreased, the number of vacuum holes (VH) and vacuum grooves (VG) can also be increased or decreased.

[0067] In the unloading section (LU), electronic components are supplied to the handler (TH) or recovered from the handler (TH).

[0068] Electronic components to be tested are supplied to the handler (TH) through the unloading section (LU), and electronic components that have completed testing are recovered from the handler (TH) through the unloading section.

[0069] Electronic components can be loaded onto a Jetec Tray, Ring Frame, or other types of customer tray and supplied to or retrieved from the handler (TH).

[0070] Electronic components to be tested in the unloading section (LU) are loaded onto a transport table (110) in the first area (A1), and electronic components that have completed testing and are loaded onto the transport table (110) in the first area (A1) are unloaded from the transport table (110). To this end, a first hand (210) is provided in the unloading section (LU).

[0071] The first hand (210) is provided to load electronic components onto the transport table (110) or to take them from the transport table (110).

[0072] For unloading operations by the first hand (210), the transport table (110) must be moved toward the unloading section (LU) and be in the first area (A1).

[0073] The first hand (210) loads electronic components to be tested onto a transport table (110) in the first area (A1) or unloads electronic components that have been tested from a transport table (110) in the first area (A1).

[0074] The first hand (210) may have one or more pickers capable of gripping or releasing electronic components. The pickers may grip electronic components by vacuum pressure.

[0075] Preferably, four pickers can be installed in pairs on the first hand (210) to improve processing capacity.

[0076] For example, as shown in the schematic diagram of FIG. 3, the first hand (210) may have four pickers (P) arranged in a 2x2 matrix. Of course, depending on the implementation, the number of pickers (P) provided in the first hand (210) may be increased or decreased.

[0077] The first hand (210) may further include a camera (C).

[0078] The first hand (210) is controlled by the controller (800) to grasp an electronic component whose position is accurately calculated from an image captured by the camera (C) before grasping the electronic component from the customer tray.

[0079] The first hand (210) is controlled by the controller (800) so that the center of the electronic component is aligned with the vacuum hole (VH), the position of which is accurately calculated from an image captured by the camera (C) before the electronic component is placed on the transport tray (110).

[0080] The first hand (210) is controlled to load electronic components at a position accurately calculated from an image captured by a camera (C) when moving electronic components from a transport table (110) to a customer tray.

[0081] Therefore, the picker (P) can grasp or load electronic components at a more precise position, and thus enables precise positioning of the electronic components.

[0082] In the relocation section (RP), electronic components (ED) to be tested are unloaded from the transport table (110) and loaded onto the test table (300), and the electronic components loaded onto the test table (300) are relocated. To this end, a relocation space (RS) is formed in the relocation section (RP) for the relocation of electronic components.

[0083] According to the present embodiment, the relocation portion (RP) is positioned on one side of the connection portion (CP) in the X-axis direction.

[0084] The repositioning part (RP) is equipped with a second hand (220).

[0085] The second hand (220) takes an electronic component (ED) to be tested from the transport table (110) or loads an electronic component (ED) that has been tested onto the transport table (110).

[0086] For unloading operations by the second hand (220), the transport table (110) must be moved toward the relocation section (RP) and be in the second area (A2).

[0087] The second hand (220) takes electronic components to be tested from the transport table (110) in the second area (A2) or loads electronic components that have been tested from the transport table (110) in the second area (A2).

[0088] The second hand (220) may be configured in the same way as the first hand (210). Of course, the number of pickers (P) provided in the first hand (210) and the number of pickers (P) provided in the second hand (220) may be different.

[0089] The second hand (220) loads the electronic components to be tested from the transport table (110) in the second area (A2) onto the test table (300) that has been moved to the relocation section (RP).

[0090] In order for electronic components to be tested by the second hand (220) to be loaded onto the test table (300), the test table (300) must be located in the relocation space (RP). Therefore, the relocation space (RP) can be renamed as a loading space.

[0091] The second hand (220) loads the electronic components that have been tested and are loaded on the test table (300) onto the transport table (110) in the second area (A2).

[0092] The test table (300) is provided to load electronic components (ED) that are unloaded from the transport table (110) by the second hand (220).

[0093] As shown in the schematic excerpt of FIG. 4, the test table (300) is rectangular in shape and has a flat top surface.

[0094] The test table (300) may be in the shape of a disc when viewed from a flat surface, and in this case, the top surface is also flat.

[0095] The electronic components are loaded onto the test table (300) in a manner such that they are placed on the flat upper surface of the test table (300).

[0096] The test table (300) can be moved in the X-axis, Y-axis, and Z-axis directions.

[0097] The test table (300) can be rotated in the Θ-axis direction with the vertical line (V) passing through the center of the test table (300) in the Z-axis direction as the axis of rotation.

[0098] Generally, during the process of moving electronic components (ED) to the test table (300), shock or inertia accompanying the movement occurs. Shock or inertia, etc., can disrupt the position of the electronic components loaded on the test table (300). To prevent this, vacuum holes (h) are formed in the area where the electronic components are loaded on the test table (300).

[0099] The vacuum structure of the test table (300) for fixing electronic components may be the same as the vacuum structure of the transport table (110).

[0100] When an electronic component is placed on the test table (300) by the second hand (220), the electronic component can be settled in the position where it was placed by vacuum pressure. In that state, when the second hand (220) releases the grip on the electronic component, the electronic component is fixed in the position where it was settled without shifting.

[0101] The vacuum device (400) provides vacuum pressure to the vacuum holes (h) in the test table (300) through a vacuum circuit (not shown).

[0102] The vacuum pressure provided by the vacuum device (400) is transmitted to the electronic components (ED) through the vacuum hole (h), and the electronic components loaded on the test table (300) are fixed in position by the vacuum pressure.

[0103] The vacuum holes (h) can be implemented to be selectively opened or closed depending on the control of the vacuum circuit. The electronic components (ED) can be selectively fixed to the test table (300) or detached from the test table (300).

[0104] The electronic components are electrically connected to the tester while loaded on the test table (300).

[0105] The electrical connection between the electronic components loaded on the test table (300) and the tester is made via a test board (20).

[0106] The test board (20) has test pins that are electrically in contact with electronic components.

[0107] The test board (20) is connected to the handler (TH) at the connection part (CP).

[0108] The electronic components loaded on the test table (300) that has been moved to the connection part (CP) and the test pins of the test board (20) are electrically contacted.

[0109] The test board (20) may have any structure as long as it has a configuration that can be electrically connected to electronic components.

[0110] The test board (20) may be a widely known probe card. In this case, it is preferable that the test table (300) be provided in the form of a disc.

[0111] The test board (20) may have a structure having socket modules. Test pins are provided in the socket modules, and the socket modules are installed in the socket body. In this case, it is preferable that the test table (300) be provided in the shape of a square plate.

[0112] As shown in the bottom view of FIG. 5, test boards (20) have test zones (TZ) arranged therein, each corresponding to one electronic component.

[0113] The test zones (TZ) correspond one-to-one with the electronic components loaded on the test table (300).

[0114] One test zone (TZ) is equipped with test pins (t) for electrically connecting to one electronic component.

[0115] The test pins (t) in one test zone (TZ) form a set of clusters that form the test zone (TZ) and are electrically connected to the electronic component (ED).

[0116] If the test board (20) is a probe card, a set of test pins is densely arranged in the test area (TZ). Here, the set of test pins corresponds to terminals on an electronic component.

[0117] In the case where the test board (20) has a structure with a socket module, a set of test pins is installed in one socket module (22), and one socket module (22) forms one test zone (TZ). Therefore, replacing one socket module (22) replaces one test zone (TZ).

[0118] The test area (TZ) and the electronic component (ED) must be aligned. If the coordinates of the electronic component (ED) on the test table (300) on the XY plane do not match the coordinates of the test area (TZ), a failure occurs in the electrical connection between the electronic component (ED) and the tester.

[0119] As shown in the conceptual example of FIG. 6, if an electronic component (ED) on the test table (300) is at an angular position having a rotation angle (Θ1) twisted in the Θ-axis direction with respect to the test zone (TZ), a failure occurs in the electrical connection between the electronic component (ED) and the tester. Therefore, all test zones (TZ) of the test board (20) and all electronic components (ED) on the test table (300) must be aligned.

[0120] A relocation mechanism (500) is provided to realize alignment between the test zone (TZ) and the electronic component (ED).

[0121] According to the present embodiment, the electronic component (ED) is moved from the transport table (110) to the test table (300) by the second hand (220). During this process, an error in the position of the electronic component (ED) may occur due to an operating error or operating shock of the second hand (220).

[0122] The positions of the electronic components (ED) loaded onto the test table (300) by the second hand (220) on the XY plane or each position may be different, and the electronic components (ED) loaded onto the test table (300) and the test zones (TZ) of the test board (20) may not coincide with each other.

[0123] It does not matter if the error tolerance between the electronic component (ED) and the test zone (TZ) is wide. However, the reality is that the packaged semiconductor device requires a precision of within 30㎛, and in the case of the die or HBM, a precision of within 5㎛ is required.

[0124] In the present invention, when the second hand (220) moves electronic components (ED) from the transport table (110) to the test table (300), the electronic components (ED) are loaded into temporary zones and then relocated from the temporary zones to the fixed zones.

[0125] The temporary area is not a set location, but an arbitrary location where the electronic component (ED) is placed on the test table (300) by the second hand (220).

[0126] The temporary zone is a location that is not set or fixed by the controller (800) but is arbitrarily determined by the second hand (220). For example, when the second hand (220) places an electronic component (ED) on the test table (300), the area where the electronic component (ED) is placed becomes the temporary zone.

[0127] Exaggerated Figure 7 shows an example of a temporary zone (BZ) on a test table (300).

[0128] The fixed position zone refers to the location where the electronic component and the test zone (TZ) coincide. An exaggerated figure 8 shows the relationship between the temporary zone (BZ) and the fixed position zone (RZ) on the test table (300).

[0129] The position zone (RZ) may be pre-set, but it may also be set to match the position and arrangement of the test zones (TZ) on the test board (20) after the electronic components (ED) to be tested are loaded onto the test table (300).

[0130] In Fig. 8, the temporary zone (BZ) has errors in the X-axis, Y-axis, and Θ-axis directions with respect to the fixed zone (RZ).

[0131] A relocation mechanism (500) is provided to precisely relocate the position of an electronic component (ED) loaded on a test table (300) in a relocation space (RS).

[0132] The relocation mechanism (500) is provided to relocate the position of an electronic component (ED) loaded on a test table (300) by the second hand (220) from a temporary zone (BZ) to a fixed zone (RZ).

[0133] According to the present embodiment, the second hand (220) loads the electronic components (ED) to be tested, which are unloaded from the transport table (110), into a temporary zone (BZ). Then, a relocation mechanism (500) is utilized to move the electronic components (ED) in the temporary zone (BZ) to the designated zone (RZ).

[0134] As shown in the schematic diagram of FIG. 9, the relocation mechanism (500) includes a relocation picker (510) and a relocation camera (520).

[0135] The relocation mechanism (500) has its position fixed.

[0136] The relocation mechanism (500) can be fixedly mounted on the frame forming the skeleton of the handler (TH).

[0137] The repositioning picker (510) can grasp or release the electronic component (ED). The repositioning picker (510) can grasp the electronic component (ED) by vacuum pressure.

[0138] The repositioning picker (510) is fixed in a horizontal position in the X-axis and Y-axis directions.

[0139] The relocation camera (520) is positioned apart from the relocation picker (510).

[0140] A repositioning camera (520) is provided to photograph electronic components (ED).

[0141] As in the example of FIG. 10, the repositioning camera (520) photographs identification marks (M: M1, M2) on the electronic component (ED). The identification marks (M) may be arranged diagonally opposite each other.

[0142] However, the object photographed by the relocation camera (520) to relocate the electronic component (ED) does not need to be limited to the identification mark (M). The object photographed by the relocation camera (520) may be replaced with the corner of the electronic component (ED), the identification pad or identification pattern of the electronic component (ED), etc.

[0143] The relocation picker (510) and the relocation camera (520) are combined into a single module. Therefore, the relative placement positions of the relocation picker (510) and the relocation camera (520) are fixed.

[0144] The moving mechanism (600) can move the test table (300) in the horizontal direction, which is the X-axis and Y-axis direction.

[0145] The moving mechanism (600) can rotate the test table (300) in the Θ-axis direction.

[0146] The moving mechanism (600) can move the test table (300) up and down in the Z-axis direction.

[0147] As shown in the schematic excerpt of FIG. 11, the moving mechanism (600) includes a rotating mechanism (610), an elevator (620), a first moving mechanism (640), and a second moving mechanism (660).

[0148] The rotator (610) rotates the test table (300) in the Θ-axis direction.

[0149] The angular position of the electronic component (ED) can be adjusted by rotating the test table (300) by means of the rotating device (610).

[0150] The elevator (620) raises the test table (300).

[0151] The test table (300) is connected to the elevator (620) via a rotating mechanism (610).

[0152] When the test table (300) is raised by the elevator (620), the electronic components (ED) of the test table (300) come into contact with the test pins (t), thereby electrically connecting the electronic components (ED) to the tester. When the test table (300) is lowered by the elevator (620), the contact between the electronic components (ED) and the test pins (t) is released, and the test table (300) becomes capable of moving in a horizontal direction.

[0153] The first moving device (640) moves the test table (300) in the X-axis direction.

[0154] By moving the test table (300) in the X-axis direction by the first moving device (640), the test table (300) can be selectively positioned in the relocation space (RS) and the test space (TS). Here, the test space (TS) is a space formed in the test section (TP), and when the test table (300) is in the test space (TS), an electrical connection is made between the electronic component (ED) and the tester by raising the test table (300).

[0155] The second mover (660) moves the test table (300) in the Y-axis direction.

[0156] The above-mentioned moving mechanism (600) has three functions.

[0157] The first function is to move the test table (300) between the relocation space (RS) and the test space (TS).

[0158] The second function is to electrically connect or disconnect electronic components (ED) to the tester.

[0159] The third function is for the relocation of electronic components (ED) in the relocation space (RS).

[0160] Since the repositioning picker (510) is fixed, the test table (300) moves in the horizontal X-axis and Y-axis directions or rotates in the Θ-axis direction to adjust the position of the electronic component (ED) on the horizontal plane.

[0161] Depending on the implementation, the test table (300) is raised and lowered during the relocation process of the electronic component (ED), thereby enabling the relocation picker (510) to grasp or release the electronic component (ED).

[0162] Here, the operation during the relocation of electronic components (ED) is explained.

[0163] As shown in Fig. 8, the temporary zone (BZ) of the electronic component (ED) may differ from the fixed zone (RZ) in the X-axis, Y-axis, and Θ-axis directions.

[0164] The relocation camera (520) photographs the electronic component (ED) on the test table (300) and identifies the temporary zone (BZ) through the location of the identification mark (M).

[0165] When the temporary zone (BZ) is identified, the first mover (640) and the second mover (660) operate to position the center of the temporary zone (BZ) below the relocation picker (510), and the elevator (620) operates to raise the test table (300).

[0166] When the repositioning picker (510) adsorbs and grips the electronic component (ED) of the raised test table (300) by vacuum pressure, the elevator (620) operates to lower the test table (300). Afterward, the first moving device (640) and the second moving device (660) operate to align the center of the positioning zone (RZ) with the center of the electronic component (ED) gripped by the repositioning picker (510), and the rotating device (610) operates to align the electronic component (ED) with the positioning zone (RZ). In this state, the elevator (620) operates to raise the test table (300), thereby allowing the electronic component (ED) held by the repositioning picker (510) to settle in the positioning zone (RZ).

[0167] When the electronic component (ED) is secured to the test table (300) by vacuum pressure applied through the vacuum hole (h) while the electronic component (ED) is seated in the positioning zone (RZ), the repositioning picker (510) releases the grip of the electronic component (ED). Then, the test table (300) lowers and begins repositioning the next electronic component (ED).

[0168] For reference, if precise control of the operation of the second hand (220) is possible, the second hand (220) may be equipped with a camera, and the relocation mechanism (500) may be omitted. In this case, the relocation of the electronic component (ED) can be achieved by utilizing the second hand (220).

[0169] Furthermore, the second hand (220) may be implemented to move the electronic component (ED) directly to the positioning zone (RZ) when moving it from the transport table (110) to the test table (300).

[0170] The foreign substance remover (700) removes foreign substances in at least one of the relocation space (RS) or the test space (TS).

[0171] The foreign matter remover (700) may be equipped with a blower and a suction device in pairs.

[0172] The foreign substance remover (700) may be controlled to operate when foreign substances occur.

[0173] A cleaning device (730) is provided to clean the upper surface of the test table (300).

[0174] The cleaning device (730) includes a cleaning nozzle (731).

[0175] The cleaning nozzle (730) cleans foreign matter on the upper surface of the test table (300).

[0176] It is preferable that the cleaning nozzle (731) be a vacuum nozzle that sucks up foreign matter by vacuum pressure rather than blowing air.

[0177] In the method of blowing air, foreign substances on the upper surface of the test table (300) are removed from the test table (300) by the air, but may remain in the space. There is a possibility that the foreign substances in the space may contaminate the upper surface of the test table (300) again.

[0178] The cleaning nozzle (731) can be installed on the second hand (220) to move together with the picker (P) of the second hand (220).

[0179] At least one cleaning nozzle (731) may be installed on the second hand (220).

[0180] The cleaning device (730) may include a vacuum device that provides vacuum pressure to the cleaning nozzle (731). However, it may be implemented to use the vacuum pressure of a vacuum line provided in the factory, and in this case, the cleaning device (730) of the handler (TH) is sufficient to have an opening / closing valve that opens and closes the vacuum line and the cleaning nozzle (731) instead of a vacuum device.

[0181] The controller (800) controls the components necessary for the proper operation of the handler (TH), such as the transport shuttle (100), the first hand (210), the second hand (220), the vacuum device (400), the relocation mechanism (500), the moving mechanism (600), the foreign matter remover (700), and the cleaning mechanism (730).

[0182] Next, the operation method of the handler (TH) according to the present invention is explained from the perspective of testing electronic components (ED) and from the perspective of logistics of electronic components (ED).

[0183] In the unloading section (LU), the first hand (210) loads electronic components (ED) to be tested onto a transport table (110) in the first area (A1).

[0184] When all the electronic components (ED) are loaded onto the transport table (110), the transport shuttle (100) operates and moves the transport table (110) to the second area (A2).

[0185] The second hand (220) unloads electronic components (ED) from the transport table (110) in the second area (A2) and moves them to the test table (300) in the relocation area (RS). At this time, the locations of the electronic components (ED) loaded onto the test table (300) by the second hand (220) are temporary zones (BZ).

[0186] When all the electronic components (ED) to be tested are loaded onto the test table (300), the controller (800) operates the relocation mechanism (500) and the moving mechanism (600) to relocate the electronic components (ED) from the temporary zones (BZ) to the fixed zones (RZ).

[0187] When the rearrangement of electronic components (ED) on the test table (300) is completed, the moving mechanism (600) operates to move the test table (300) to the test space (TS). Afterwards, the connector (700) operates to raise the test table (300) toward the test board (20) so that the electronic components (ED) are electrically connected to the tester.

[0188] When the testing of the electronic components (ED) is finished, the test table (300) is moved to the relocation section (RP) by the moving mechanism (600). Then, the second hand (220) moves the electronic components (ED) that have completed testing to the transport tray (110) in the second area (A2), and the transport tray (110) filled with the electronic components (ED) that have completed testing moves to the first area (A1). Subsequently, the first hand (210) unloads the electronic components (ED) that have completed testing from the transport table (110) and loads them onto an empty customer tray.

[0189] Based on the basic operation method described above, the electronic component (ED) is supplied to the tester for testing, and is retrieved after the test is completed.

[0190] <Explanation of the Application of Repair Devices>

[0191] 1. Specifications and Functions of Repair Components

[0192] The repair component is used to repair the test pin (t) on the test board (20).

[0193] It is desirable that the planar area of ​​the repair element be nearly identical to the planar area of ​​the electronic component (ED).

[0194] The repair element may be in the form of a flat surface with an adhesive applied. The adhesive can remove foreign matter adhering to the test pin (t).

[0195] The repair element may be in the form of a flat surface with an abrasive. The abrasive can grind the test pin (t) to sharpen the contact point or grind away scratches to smooth the surface.

[0196] The repair element can be fixed to the test table (300) by vacuum pressure applied from a vacuum hole (h) formed in the test table (300).

[0197] The vacuum holes (h) formed in the test table (300) are used to fix not only electronic components (ED) but also repair components. Therefore, the number of vacuum holes (h) in the test table (300) is greater than the number of test zones (TZ) in the test board (20), preferably twice as much.

[0198] 2. Arrangement of repair components

[0199] The repair element can be placed on the test table (300) by the second hand (220).

[0200] Electronic components (ED) and repair elements are placed together on the test table (300).

[0201] The controller (800) can control the second hand (220) and the moving mechanism (600) so that electronic components (ED) and repair components are loaded together on the test table (300).

[0202] The total number of electronic components (ED) and repair elements (RE) that can be loaded onto the test table (300) is greater than the number of electronic components (ED) that can be electrically connected to the tester by the test board (20).

[0203] Preferably, the number of electronic components (ED) that can be loaded onto the test table (300) and the number of electronic components (ED) that are electrically connected to the tester by the test board (20) are the same. That is, the number of electronic components (ED) that can be loaded onto the test table (300) and the number of test zones (TZ) on the test board (20) are the same.

[0204] The number of repair elements (RE) that can be loaded onto the test table (300) and the number of electronic components (ED) electrically connected to the tester by the test board (20) are the same.

[0205] FIGS. 12 and FIGS. 13 show preferred examples regarding the arrangement of repair elements (RE).

[0206] Figure 12 shows an example in which repair elements (REs) are placed between electronic components (EDs).

[0207] According to the example of FIG. 12, the controller (800) controls the second hand (220) and the moving mechanism (600) so that the electronic components (ED) and the repair elements (RE) are arranged alternately.

[0208] In FIG. 13, the stacking rows (rows a, c, and e) where electronic components (ED) are loaded and the stacking rows (rows b, d, and f) where repair components (RE) are loaded are arranged alternately.

[0209] According to the example of FIG. 13, the controller (800) controls the second hand (220) and the moving mechanism (600) so that the loading rows (rows a, c, and e) where electronic components (ED) are loaded and the loading rows (rows b, d, and f) where repair elements (RE) are loaded are arranged alternately.

[0210] When the repair element (ED) is placed in an ideal position, the spacing (G) between adjacent electronic components (ED) and repair elements (RE) in the X-axis direction in FIG. 12 and FIG. 13 is the same. Here, the spacing (G) refers to the distance between the center of the electronic component (ED) and the repair element (RE).

[0211] 3. Repair of test pins

[0212] According to the present invention, repairs to the test pin (t) are possible as many times as the number of contacts between the electronic component (ED) and the test board (20).

[0213] According to a preferred first example, after testing of the electronic component (ED) is performed, repair of the test pin (t) is performed.

[0214] When the test table (300) in the test space (TS) is raised by the moving mechanism (600) and the test is finished after the electronic component (ED) and the tester are electrically connected, the moving mechanism (600) lowers the test table (300) and moves it by the X-axis direction by the placement interval (G). Then, the moving mechanism (600) raises the test table (300) at least once to allow the test pin (t) to be repaired.

[0215] That is, the controller (800) controls the moving mechanism (600) to repair the test pins (t) while the test table (300) remains in the test space (TS) after the test of the electronic component (ED) loaded on the test table (300) is performed.

[0216] According to a preferred second example, after the test pins (t) of the test board (300) are repaired, a test of the electronic component (ED) is performed.

[0217] When the test table (300) in the test space (TS) is raised at least once by the moving mechanism (600) to perform a repair on the test pin (t), the moving mechanism (600) moves the test table (300) in the X-axis direction by a spacing (G). Then, the test table (300) is raised so that the electronic component (ED) and the tester are electrically connected and the test is performed.

[0218] That is, the controller (800) controls the moving mechanism (600) to electrically connect the electronic components (ED) loaded on the test table (300) to the test board (20) while the test table (300) remains in the test space (TS) after the test pins (t) have been repaired.

[0219] Foreign matter may occur depending on the repair work of the test pin (t).

[0220] When the repair work on the test pin (t) is completed, the controller (800) operates the foreign matter remover (700) to remove the generated foreign matter.

[0221] 4. Removal of repair components

[0222] The repair element (RE) can be removed from the test table (300) by the second hand (220).

[0223] The repair element (RE) can be used repeatedly. Therefore, even if the electronic components (ED) are replaced on the test table (300), the repair element (RE) can be maintained on the test table (300).

[0224] However, it needs to be replaced with a new repair element (RE) before the function of the repair element (RE) is lost due to repeated use.

[0225] There are various examples of when the repair component (RE) should be replaced.

[0226] For example, when a repair element (RE) is maintained in the test table (300) and the repair element (RE) is used a predetermined number of times, the controller (800) controls the second hand (220) and the moving mechanism (600) to remove the repair element (RE) from the test table (300) and load a new repair element (RE) onto the test table (300).

[0227] For example, the controller (800) can determine the replacement time of the repair element (RE) by analyzing an image of the repair element (RE) captured by the camera and checking the condition of the repair element (RE). Here, the condition of the repair element (RE) analyzed by the controller (800) may be the height of the repair element (RE), the distribution area of ​​foreign substances attached to the repair element (RE), the surface shape of the repair element (RE), etc.

[0228] 5. Logistics of repair parts

[0229] The repair element (RE) is supplied to the test table (300) by the second hand (220), but the supply path may have various examples.

[0230] First, the repair component may be loaded onto a customer tray in the unloading section (LU). In this case, the repair component (RE) moves along the same path as the electronic component (ED), and the transport table (110) is also used to transport the repair component (RE).

[0231] Second, as shown in FIG. 14, a separate loading tray (LT) capable of loading repair elements (RE) may be provided in the unloading section (LU). In this case as well, the transport table (110) is also used to transport repair elements (RE).

[0232] In the first and second cases above, the controller (800) controls the second hand (220) and the moving mechanism (600) to move the repair element (RE) from the transport table (110) to the test table (300) or to move the repair element (RE) from the test table (300) to the transport table (110).

[0233] Third, as shown in Fig. 15, the loading tray (LT) can be placed in the relocation space (RS).

[0234] According to the example of FIG. 15, the controller (800) controls the second hand (220) and the moving mechanism (600) to move the repair element (RE) from the loading tray (LT) to the test table (300) or to move the repair element (RE) from the test table (300) to the loading table (LT).

[0235] 6. 2 test tables

[0236] As shown in Fig. 16, there may be two test tables (300).

[0237] According to the example of FIG. 16, a pair of repositioning parts (RP) are provided with the connecting part (CP) in between, and two second hands (220) and moving mechanisms (600) are also provided.

[0238] In the example of FIG. 16, the repair element (RE) may be implemented to be loaded into both test tables (300) or only into one test table (300).

[0239] The embodiments described above are merely preferred examples of the present invention and may have various applications. Therefore, the present invention should not be understood as being limited only to the contents described above. Instead, the scope of the present invention should be understood as the separately described claims and their equivalents.

Claims

1. A transport shuttle having a transport table capable of transporting electronic components by moving while the electronic components are loaded; A first hand that loads electronic components to be tested onto the transport table in the first area by the operation of the above transport shuttle, or unloads electronic components that have completed testing and have arrived at the first area by being loaded onto the said transport table; A second hand that retrieves electronic components from a transport table moved from the first area to a second area separated from the first area by the operation of the above transport shuttle; A test table on which electronic components to be tested and repair components, which are unloaded from the transport table by the second hand, are loaded; A moving mechanism capable of moving the above test table by the second hand between a loading space where electronic components are loaded on the test table and a test space having a test board for electrically connecting the electronic components to a tester, electrically connecting or disconnecting the terminals of the electronic components loaded on the test table and the test pins of the test board, and operating a repair component to repair the test pins; and A controller controlling the above transport shuttle, the above first hand, the above second hand, and the above moving mechanism; comprising Handler for testing electronic components.

2. In Paragraph 1, The above controller is capable of controlling the second hand and the moving mechanism so that electronic components and repair components are loaded together on the test table. Handler for testing electronic components.

3. In Paragraph 2, The total number of electronic components and repair elements that can be loaded onto the above test table is greater than the number of electronic components that can be electrically connected to the tester by the above test board. Handler for testing electronic components.

4. In Paragraph 3, The number of electronic components that can be loaded onto the test table and the number of electronic components electrically connected to the tester by the test board are the same, and The number of repair components that can be loaded onto the above test table and the number of electronic components electrically connected to the tester by the above test board are the same. Handler for testing electronic components.

5. In Paragraph 2, The controller can control the second hand and the moving mechanism so that the electronic components and the repair elements are alternately arranged so that the repair elements are placed between the electronic components. Handler for testing electronic components.

6. In Paragraph 2, The above controller can control the second hand and the moving mechanism so that the loading rows on which electronic components are loaded and the loading rows on which repair components are loaded are arranged alternately. Handler for testing electronic components.

7. In Paragraph 2, The above controller can control the moving mechanism to repair the test pins of the test board using repair components loaded on the test table while the test table remains in the test space after the electronic components loaded on the test table have been tested. Handler for testing electronic components.

8. In Paragraph 2, The above controller can control the moving mechanism to electrically connect the electronic components loaded on the test table to the test board while the test table remains in the test space after the test pins of the test board are repaired by the repair components loaded on the test table. Handler for testing electronic components.

9. In Paragraph 2, The controller controls the second hand and the moving mechanism to remove the repair elements from the test table when the repair elements are used a predetermined number of times while the repair elements are maintained on the test table. Handler for testing electronic components.

10. In Paragraph 1, A camera for photographing the above repair element; further comprising, The above controller analyzes the image captured by the camera to determine the replacement time of the repair component. Handler for testing electronic components.

11. In Paragraph 1, A relocation mechanism that operates to relocate the positions of loaded electronic components when electronic components to be tested are loaded onto the test table by the second hand; further comprising Handler for testing electronic components.

12. In Paragraph 1, The above transport table can be used to transport repair components, and The controller can control the second hand and the moving mechanism to move a repair element from the transport table to the test table or to move a repair element from the test table to the transport table. Handler for testing electronic components.

13. In Paragraph 1, A foreign matter remover for removing foreign matter generated as a result of repairing the above test pin; further comprising Handler for testing electronic components.

14. In Paragraph 1, The above-mentioned second hand, the above-mentioned test table, and the above-mentioned moving mechanism are each provided in two units, and The controller controls the second hand, the test table, and the moving mechanism to load a repair element onto at least one of the two test tables. Handler for testing electronic components.

15. In Paragraph 1, A cleaning device for cleaning the upper surface of the above test table; further comprising Handler for testing electronic components.

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