Dual frequency pulsed plasma processing treatments

The dual RF frequency CCP processing method addresses the challenges of high resistance and copper diffusion in metal interconnects by treating barrier layers with minimal damage, enhancing the electrical and mechanical properties of deposited layers in integrated circuits.

WO2026128060A1 Publication Date: 2026-06-18APPLIED MATERIALS INC

Patent Information

Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
APPLIED MATERIALS INC
Filing Date
2025-10-03
Publication Date
2026-06-18

AI Technical Summary

Technical Problem

The formation of metal interconnect structures in integrated circuit devices faces challenges due to high electrical resistance and copper diffusion, which can lead to reduced reliability and device failure, necessitating improved barrier layers with minimal contamination and resistance.

Method used

A dual RF frequency capacitively coupled plasma (CCP) processing method is employed, utilizing a first RF frequency greater than a second RF frequency, to treat and deposit barrier layers, minimizing damage to fragile dielectric layers and enhancing the properties of deposited layers.

🎯Benefits of technology

The dual RF frequency CCP process effectively reduces electrical resistance and minimizes damage to dielectric layers, improving the reliability and quality of metal interconnect structures in integrated circuits.

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Abstract

A processing method includes depositing a first layer on a field region and sidewalls of a via of an interconnect structure, and treating the first layer by establishing a pulsed dual RF frequency CCP, where (i) the dual RF frequency CCP is formed using the first RF generator and a second RF generator coupled to a first electrode, (ii) the pulsed dual RF frequency CCP is formed by simultaneously delivering pulses of the first RF signal and the second RF signal at a pulsing frequency and a duty cycle to the first electrode, and (iii) the first RF frequency is greater than the second RF frequency.
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