Electrical component socket

Abstract

The purpose of the present invention is to provide an electrical component socket that can hold a contact pin with good precision and ensure proper contact with both a mounting substrate and a semiconductor package. The present invention provides an electrical component socket characterized by comprising: a base member; a plurality of contact pins; a movable pedestal that has a plurality of first through holes in which the plurality of contact pins can slide; and a first holding substrate that has a plurality of second through holes holding the plurality of contact pins in a slidable manner, and is provided to be movable in the axial direction of the contact pins with respect to the base member, wherein the base member houses the plurality of contact pins, the movable pedestal, and the first holding substrate, in the state in which the electrical component socket is placed on an external substrate, the plurality of contact pins are held by the first holding substrate so as to be at positions not in contact with the external substrate, and when the electrical component socket is to be fixed to the external substrate after being placed on the external substrate, the first holding substrate is lowered, and the plurality of contact pins come into contact with the electrodes of the external substrate.

Description

Socket for Electrical Components 【0001】 The present invention relates to a socket for electrical components. 【0002】 When testing a semiconductor package or the like, a socket for electrical components is used to removably hold the semiconductor package and electrically connect it to an external measuring instrument. The socket for electrical components houses a plurality of contact pins at predetermined positions corresponding to the external connection electrodes of the semiconductor package to be inspected. There is known a socket for electrical components having a holding substrate that holds the contact pins so that the contact pins are aligned at predetermined positions and accommodated along an appropriate direction (see, for example, Patent Document 1, etc.). 【0003】 The socket for electrical components includes a movable pedestal on which the semiconductor package is placed. During inspection of the semiconductor package, the semiconductor package is pressed downward by a pressing member and moves downward together with the movable pedestal. As a result, the external connection electrodes arranged on the lower surface of the semiconductor package contact the upper contacts of the contact pins, and the lower contacts of the contact pins contact the electrical contact portions of the mounting substrate. At that time, the spring of the contact pin is further contracted by the pressing force of the pressing member, and the upper contact and the lower contact abut against the electrical contact portions of the semiconductor package and the mounting substrate, respectively, with a predetermined contact pressure, and the semiconductor package is electrically connected to the mounting substrate via the contact pins. 【0004】 Patent No. 5518391 【0005】 When the semiconductor package is pressed during inspection, the upper contact (first contact) of the contact pin passes through a through hole penetrating the holding substrate and the movable pedestal and contacts the external connection electrode of the semiconductor package. However, if the contact pin is not appropriately arranged to pass through such a through hole, it will lead to a decrease in the contact performance and durability of the contact pin. 【0006】 Also, in the lower contact (second contact) of the contact pin, appropriately contacting the electrical contact portion of the mounting substrate can enhance the certainty of the performance test and further improve the durability of the socket for electrical components. 【0007】In view of these considerations, the present invention aims to provide an electrical component socket that accurately holds contact pins in a predetermined position and makes appropriate contact with both the mounting substrate and the semiconductor package. 【0008】 To solve the above problems, an electrical component socket according to one embodiment of the present invention is an electrical component socket connectable to an external substrate, comprising: a base member; a plurality of contact pins; a movable base having a plurality of first through holes through which the plurality of contact pins can slide; and a first holding substrate having a plurality of second through holes for slidably holding the plurality of contact pins, and provided on the base member so as to be movable in the axial direction of the contact pins, wherein the base member houses the plurality of contact pins, the movable base, and the first holding substrate, and when the electrical component socket is placed on the external substrate, the plurality of contact pins are held by the first holding substrate so as not to contact the external substrate, and when the socket is fixed to the external substrate after being placed on the external substrate, the first holding substrate descends and the plurality of contact pins come into contact with the electrodes of the external substrate. 【0009】 The present invention can provide an electrical component socket that accurately holds contact pins in a predetermined position and makes appropriate contact with both the mounting substrate and the semiconductor package. 【0010】This is an external view of the electrical component socket of the present invention. This is an exploded view of the socket 1000 according to the first embodiment of the present invention. (a) This is a cross-sectional view of the socket 1000 according to the first embodiment of the present invention before mounting. (b) This is an enlarged view of part IIIb of (a). This is a cross-sectional view of the socket 1000 of Figure 3(a) in the mounted state. (b) This is an enlarged view of part IVb of (a). This is a cross-sectional view of the socket 1000 of Figure 4(a) during semiconductor package inspection. (a) This is an enlarged cross-sectional view of the socket 1000 according to the first embodiment of the present invention, in which the second contact 220 is a straight-shaped contact pin 200, the second contact 220 of the contact pin 200 passes through the through hole of the first holding substrate 30, the barrel 240 is slidably held in the through hole of the first holding substrate 30 and the second holding substrate 20, and the state before the first holding substrate 30 is connected to the pressing plate 40. (b) An enlarged cross-sectional view of the socket 1000 according to the first embodiment of the present invention, before being mounted on the mounting substrate 110, in which the first retaining substrate 30 is connected to the pressing plate 40 by the connecting member 32, the first retaining substrate 30 rises toward the second retaining substrate 20, and the first contactor 210 of the contact pin 200 is slidably held in the through hole of the movable base 10 (state as shown in Figure 3(a)). (c) An enlarged cross-sectional view of the socket 1000 of (b) when mounted on the mounting substrate 110 (state as shown in Figure 4(a)). (d) An enlarged cross-sectional view of the semiconductor package 300 placed on the socket 1000 of (c). (e) An enlarged cross-sectional view of the semiconductor package 300 being pressed on the socket 1000 of (d) and inspected (state as shown in Figure 5). (a) A cross-sectional view of the second modified example 1100 before mounting. (b) A cross-sectional view of the socket 1100 of Figure 7(a) in the mounted state. (c) This is a cross-sectional view of the socket 1100 in Figure 7(a) during semiconductor package inspection. 【0011】 The embodiments of the present invention will be described in detail below, but the present invention is not limited to these embodiments. 【0012】(First Embodiment) Figure 1 is an external view of an electrical component socket (hereinafter simply referred to as "socket") 1000 according to the first embodiment of the present invention. Figure 2 shows an exploded view of the socket 1000. The socket 1000 consists of a movable base 10 and a second holding substrate 20 and a first holding substrate 30 stacked from top to bottom, which house the contact pins 200. The contact pins, which are slidably held by the second holding substrate 20 and the first holding substrate 30, are housed between a base member 100 and a mounting substrate 110. Through holes are formed in the movable base 10, the second holding substrate 20 and the first holding substrate 30, respectively, allowing the contact pins 200 to slide and be supported. The base member 100 is mounted on the mounting substrate 110 by mounting connecting screws 112 so as to be sandwiched between a pressing plate 40 and the mounting substrate 110. Details of each component will be explained using the cross-sectional views in Figures 3 and 4. In this specification, the direction from the mounting substrate 110 of the socket 1000 toward the base member 100 along the axial direction of the contact pin 200 is defined as upward, and the direction from the base member 100 toward the mounting substrate 110 is defined as downward. In this embodiment, a single-sliding type contact pin 200 in which the first contact element 210 is fixed to the barrel 240 is used for explanation, but as will be described later, a double-sliding type contact pin may also be used. 【0013】 Figure 3(a) is a cross-sectional view of the socket 1000 according to the first embodiment of the present invention before substrate mounting, and Figure 3(b) is an enlarged view of part IIIb of Figure 3(a). 【0014】 As shown in Figure 3(a), the first retaining substrate 30 is connected to the pressing plate 40 by a connecting member 32 so as to be vertically movable. In addition, within the base member 100, the movable base 10 and the second retaining substrate 20 are held above the first retaining substrate 30 so as to be vertically movable. The movable base 10, the second retaining substrate 20 and the first retaining substrate 30 are positioned by positioning pins 34. 【0015】A first elastic member 50 is provided between the pressing plate 40 and the base member 100 so as to apply an elastic force in the axial direction of the contact pin 200. The first elastic member 50 can be any means that provides an elastic force, such as a biasing means like a spring. 【0016】 The connecting member 32 has a flange portion 33 at the end opposite to the end fixed to the pressing plate 40. The first retaining substrate 30 has a through hole through which the connecting member 32 passes. By passing the connecting member 32 through the through hole with the flange portion 33 facing the mounting substrate 110, the connecting member 32 can support the first retaining substrate 30 with the flange portion 33. Therefore, when the pressing plate 40 is pushed up by the elastic force of the first elastic member 50, the first retaining substrate 30 is also pushed up toward the movable base 10 and the second retaining substrate 20 together with the connecting member 32. In this embodiment, a stepped screw is used for the connecting member 32, but a straight screw may also be used as long as it has a flange portion 33 that supports the first retaining substrate 30. The connecting member 32 is fixed to the pressing plate 40 and connects the first retaining substrate 30 and the pressing plate 40. In this embodiment, the connecting member 32 is fixed to the pressing plate 40 by a screw structure, but it may be fixed by other means. For example, the connecting member 32 may be fixed to the pressing plate 40 by means of spot welding, soldering, conductive resin, etc. 【0017】 Furthermore, when the first retaining substrate 30 is pushed upward toward the second retaining substrate 20, the contact pin 200 is also pushed upward toward the second retaining substrate 20, that is, toward the movable base 10, together with the first retaining substrate. As a result, as shown in Figure 3(b), the first contact element 210 of the contact pin 200 can be inserted into the first through-hole of the movable base 10. 【0018】 A second elastic member 60 is provided between the movable base 10 and the second holding substrate 20 so as to apply an elastic force in the axial direction of the contact pin 200, allowing the movable base 10 to move up and down. 【0019】Figure 3(b) is an enlarged view showing the state in which the first retaining substrate 30 is pushed up toward the second retaining substrate 20 and the first contactor 210 of the contact pin 200 is inserted into the first through-hole of the movable base 10. In a preferred embodiment, the end of the second contactor 220 of the contact pin 200 extending from the first retaining substrate 30 is located toward the movable base 10 rather than the surface 105 (hereinafter referred to as "joint surface 105") of the base member 100 that contacts the mounting substrate 110. Specifically, in Figure 3(b), the joint surface 105 is located at a distance D1 from the lower end of the first retaining substrate 30. On the other hand, in this embodiment, the second contactor 220 of the contact pin 200 is located at a distance d1 toward the movable base 10 from the joint surface 105. Therefore, in the pre-mounting state, the second contactor 220 does not protrude from the base member 100, and unnecessary contact with the outside can be avoided, thus avoiding damage such as breakage or bending of the contact pin 200, which is preferable. 【0020】 Figure 4(a) shows a cross-sectional view of the socket 1000 after it has been mounted on the circuit board. The mounting connecting screw 112, along with a flat washer 114, a spring washer 116, and a nut 118, secures the socket 1000 to the mounting circuit board 110 by sandwiching the base member 100 between the pressing plate 40 and the mounting circuit board 110. 【0021】 First, the base member 100 is placed on the mounting substrate 110. Next, the base member 100 is fixed to the mounting substrate 110 together with the pressure plate 40 using mounting connecting screws 112. The pressure plate 40 has through holes through which the mounting connecting screws 112 pass, and when the heads of the mounting connecting screws 112 push the pressure plate 40 down toward the mounting substrate 110, the connecting member 32 fixed to the pressure plate 40 also moves toward the mounting substrate 110. Because there is clearance between the first retaining substrate 30 and the connecting member 32, the first retaining substrate 30 moves toward the mounting substrate 110 due to its own weight, and the first retaining substrate 30 and the mounting substrate 110 come into contact. 【0022】In this embodiment, the mounting connecting screws 112 press down on the separate pressing plates 40 at each of the four corners of the base member 100. Therefore, if the first retaining substrate 30 is fixed to the pressing plate 40 by the connecting member 32, when one mounting connecting screw 112 presses down on the pressing plate 40, only the portion of the first retaining substrate 30 connected to that pressing plate 40 will descend, while the other portions will not descend, potentially causing the first retaining substrate 30 to twist and break. For this reason, it is preferable that the connecting member 32 is fixed to the pressing plate 40 while being held vertically movable through holes in the first retaining substrate 30 and the second retaining substrate 20. 【0023】 In other embodiments, the pressing plates 40 may be a structure in which multiple pressing plates 40 are integrated, as long as they are capable of pressing the four corners of the base member 100. However, as in this embodiment, when multiple pressing plates are provided such that one pressing plate corresponds to one connecting member, the other pressing plates do not interfere with each other when connecting the connecting member to the mounting substrate 110. Therefore, the first holding substrate 30 does not lower until all the pressing plates have lowered, which has the effect of preventing problems such as the first holding substrate 30 tilting when it lowers due to its own weight, compared to a structure in which multiple pressing plates 40 are integrated. 【0024】 When the first retaining substrate 30 moves toward the mounting substrate 110, the contact pins 200, which were lifted toward the movable base 10 by the first retaining substrate 30, also move toward the mounting substrate 110, and the second contacts 220 of the contact pins 200 come into contact with the mounting substrate 110. 【0025】 If the second contact element 220 of the contact pin 200 is located at a distance d1 from the bonding surface 105 toward the movable base 10 before mounting, the bonding surface 105 of the base member 100 can come into contact with the mounting substrate 110 before the contact pin 200 comes into contact with the mounting substrate 110. This prevents the second contact element 220 from breaking or bending before mounting, and after mounting, the second contact element 220 can maintain contact with the mounting substrate 110, thereby minimizing damage to the mounting substrate electrodes. Furthermore, it is preferable that the length of the first contact element of the contact pin 200 inserted into the movable base 10 before mounting is longer than d1, as this prevents the contact pin 200 from falling out of the through hole in the movable base 10. 【0026】 Furthermore, the second retaining substrate 20 may have a protrusion that faces the pressing plate 40, at least a portion of which. In the embodiment shown in Figure 4, the second retaining substrate 20 is provided with a protrusion of length d2 toward the pressing plate 40. When the base member 100 is connected to the mounting substrate 110, the pressing plate 40 presses the protrusion of the second retaining substrate 20 toward the mounting substrate 110 along the axial direction of the contact pin 200, pushing at least a portion of the second contact element 220 of the contact pin 200 into the barrel 240. As a result, a preload load is applied to the contact pin 200. 【0027】 On the other hand, if the second contact element 220 of the contact pin 200 is located at a distance d1 from the bonding surface 105 toward the movable base 10 before mounting, the contact pin 200 requires a movement of d1 to contact the mounting substrate 110. As a result, the preload applied to the contact pin 200 is expressed as d2 - d1. 【0028】 In this way, by applying a preload load to the contact pin 200, the contact pin 200 can make contact with the electrodes of the semiconductor package 300 while under an appropriate axial load, that is, while maintaining stable contact between the electrodes of the mounting substrate and the contact element 220 of the contact pin. 【0029】 Figure 5 shows a cross-sectional view of the socket 1000 during semiconductor package inspection. When the semiconductor package 300 is placed on the movable base 10 and pressed down from above, the movable base 10 moves downward and comes into contact with the second holding substrate 20. As a result, as will be described later, the first contact element 210 of the contact pin 200 comes into contact with the external connection electrode of the semiconductor package 300, and the third elastic member inside the contact pin 200 is compressed, allowing inspection to be performed under biasing force. 【0030】 Figures 6(a) to 6(e) show enlarged cross-sectional views of the socket 1000, including the movable base 10, the second retaining substrate 20, the first retaining substrate 30, and the contact pins 200. 【0031】The contact pin 200 includes a first contact 210 that contacts the semiconductor package, a second contact 220 that contacts the mounting substrate 110 on the side opposite to the side that contacts the semiconductor package, a third elastic member 230 that connects the first contact 210 and the second contact 220, and a barrel 240 that houses the third elastic member 230. The contact pin 200 may be a double-sliding contact pin in which both contacts slide against the barrel 240, or a single-sliding contact pin in which only one contact slides against one barrel 240. For example, a single-sliding contact pin can be used in which the first contact 210 is fixed to the barrel 240 and the second contact 220 is arranged to move back and forth within the barrel 240. 【0032】 Furthermore, the second contact element 220 of the contact pin 200 can have any shape, for example, a stepped shape, a shape with a large diameter portion for preventing slippage (hereinafter referred to as a big head shape), or a shape without steps in the sliding part of the second contact element 220 (hereinafter referred to as a straight shape). When the second contact element 220 has a straight shape, the machining of the plunger becomes easier, which can lead to a reduction in machining time and costs. 【0033】 Figure 6(a) is an enlarged cross-sectional view of a socket 1000 according to a first embodiment of the present invention, in which the second contact 220 is a straight-shaped contact pin 200, the second contact 220 of the contact pin 200 passes through a through hole in the first retaining substrate 30, and the barrel 240 is slidably held in the through holes of the first retaining substrate 30 and the second retaining substrate 20. The second retaining substrate 20 and the first retaining substrate 30 have through holes in which the contact pin 200 is slidably held. Each through hole has a portion having a first diameter in which the barrel 240 can slide, and a second diameter that is narrower than the first diameter in which the first contact 210 or the second contact 220 can slide. The contact pin 200 is slidably held through the through holes provided in the second retaining substrate 20 and the first retaining substrate 30, thereby being accurately positioned in a predetermined location corresponding to the external connection electrodes of the semiconductor package to be inspected. 【0034】Figure 6(b) is an enlarged cross-sectional view of the socket 1000 according to the first embodiment of the present invention, in which, before being mounted on the mounting substrate 110, the first retaining substrate 30 is connected to the pressing plate 40 by a connecting member 32, the first retaining substrate 30 rises toward the second retaining substrate 20, and the first contactor 210 of the contact pin 200 is slidably held in the through hole of the movable base 10 (the state shown in Figure 3(a)). In this embodiment, the joining surface 105 of the base member 100 is located at a distance D1 from the lower end of the first retaining substrate 30. On the other hand, in this embodiment, the second contactor 220 of the contact pin 200 is located at a distance d1 from the joining surface 105 toward the movable base 10. Therefore, the first retaining substrate 30 holds the contact pin 200 in a position where it does not come into contact with the mounting substrate 110, and in the pre-mounting state, the second contactor 220 does not protrude from the base member 100, avoiding unnecessary contact with the outside and preventing damage such as breakage or bending of the contact pin 200. 【0035】 Figure 6(c) is an enlarged cross-sectional view of the socket 1000 in Figure 6(b) when it is mounted on the mounting substrate 110 (the state shown in Figure 4(a)). When the head of the mounting connecting screw 112 pushes the pressure plate 40 down toward the mounting substrate 110, the connecting member 32 fixed to the pressure plate 40 also moves toward the mounting substrate 110. As a result, the first retaining substrate 30 also moves toward the mounting substrate 110 due to its own weight, and the first retaining substrate 30 and the mounting substrate 110 come into contact at the joint surface 105. At that time, the contact pin 200, which was being pushed up by the first retaining substrate 30, also moves toward the mounting substrate 110 as the first retaining substrate 30 moves, and the second contact element 220 comes into contact with the mounting substrate 110. 【0036】 If the second retaining substrate 20 has a protrusion of length d2, the pressing plate 40 pushes the second retaining substrate 20 toward the mounting substrate 110 by length d2. On the other hand, the contact pin 200 requires movement of d1 to contact the mounting substrate 110. Therefore, the second contact element 220 is pushed into the barrel 240 by a length of d2-d1, and a preload load is generated by the third elastic member 230 inside the contact pin 200. 【0037】In this way, when the contact pin 200 is mounted on the mounting substrate 110, the second contact 220 can apply a preload load to the mounting substrate 110, thereby providing proper contact of the second contact 220 to the mounting substrate 110. 【0038】 Figure 6(d) is an enlarged cross-sectional view when the semiconductor package 300 is placed on the socket 1000 of Figure 6(c). Figure 6(e) is an enlarged cross-sectional view during semiconductor package inspection (the state shown in Figure 5). During inspection, the semiconductor package 300 is pressed from above, and consequently, the movable base 10 moves toward the second holding substrate 20, causing the external connection terminals of the semiconductor package 300 to come into contact with the contact pins 210. Subsequently, the contact pins 210 further compress the third elastic member 230 inside the barrel 240. In this way, the contact pins 200 can be displaced appropriately and can come into contact with the electrodes of the semiconductor package with an appropriate axial load. 【0039】 (Second Embodiment) The second embodiment will be described using Figures 7(a) to 7(c). The basic configuration is the same as the first embodiment, but the second embodiment differs from the first embodiment in that the mounting connecting screw 122 is inserted from the mounting substrate 110 side toward the base member 120 side. 【0040】 Figure 7(a) is a cross-sectional view of the socket 1100 according to a second embodiment of the present invention before mounting. The mounting substrate 110 and the base member 120 have through holes extending in the axial direction of the contact pins 200, through which the mounting connecting screws 122 pass. The pressing plate 45 also has through holes extending in the axial direction of the contact pins 200 and has internal threads on its inner wall for fixing the mounting connecting screws 122. 【0041】 Figure 7(b) is a cross-sectional view of the socket 1100 in the mounted state shown in Figure 7(a). The mounting connecting screws 122 pass through the through holes in the mounting substrate 110 and the base member 120 in sequence, engage with the female threads of the pressing plate 45, and fix the mounting substrate 110 and the base member 120 together. 【0042】As the male screw portion of the pressing plate 45 advances with the mounting connecting screw 122, the pressing plate 45 moves toward the mounting substrate 110 side, and the connecting member 32 fixed to the pressing plate 45 also moves toward the mounting substrate 110 side. As a result, the first holding substrate 30 moves toward the mounting substrate 110 side due to its own weight, and the first holding substrate 30 and the mounting substrate 110 come into contact with each other. 【0043】 FIG. 7(c) is a cross-sectional view of the socket 1100 during inspection of the semiconductor package in FIG. 7(a). Similar to the first embodiment, after the first contact 210 of the contact pin 200 contacts the external connection electrode of the semiconductor package 300 and is pushed in, the third elastic member in the contact pin 200 is compressed, and the contact pin 200 during inspection can contact the electrode of the semiconductor package 300 in a state where an appropriate axial load is applied. 【0044】 In the above, various embodiments and modifications have been described, but the present invention is not limited to these contents. Other aspects conceivable within the scope of the technical idea of the present invention are also included in the scope of the present invention. 【0045】 Also, one or more of the above-described embodiments and modifications may be appropriately combined. 【0046】 10 Movable pedestal 20 Second holding substrate 30 First holding substrate 32 Connecting member 33 Flange portion 34 Positioning pin 40 Pressing plate 45 Pressing plate 50 First elastic member 60 Second elastic member 100 Base member 110 Mounting substrate 112 Mounting connecting screw 114 Flat washer 116 Spring washer 118 Nut 120 Base member 122 Mounting connecting screw 200 Contact pin 210 First contact 220 Second contact 230 Third elastic member 240 Barrel 300 Semiconductor package 1000 Socket of the first embodiment 1100 Socket of the second embodiment

Claims

1. An electrical component socket connectable to an external substrate, comprising: a base member; a plurality of contact pins; a movable base having a plurality of first through holes through which the plurality of contact pins can slide; and a first holding substrate having a plurality of second through holes for slidably holding the plurality of contact pins, and provided on the base member so as to be movable in the axial direction of the contact pins, wherein the base member houses the plurality of contact pins, the movable base, and the first holding substrate, and the electrical component socket is held by the first holding substrate so as not to contact the external substrate when placed on the external substrate, and when fixed to the external substrate after being placed on the external substrate, the first holding substrate descends so that the plurality of contact pins come into contact with the electrodes of the external substrate.

2. The electrical component socket according to claim 1, further comprising: a pressing plate attached to the first retaining substrate by a connecting member so as to be movable in the axial direction of the contact pin; and a first biasing means for biasing the pressing plate in the axial direction of the contact pin, wherein the first biasing means is sandwiched between the base member and the pressing plate, and in the state after being placed on the external substrate but before being fixed, the pressing plate is moved away from the base member by the first biasing means, and the connecting member has a support portion that movably supports the first retaining substrate in the axial direction of the contact pin and moves the first retaining substrate in the direction of movement of the pressing plate.

3. The electrical component socket according to claim 2, wherein, when the electrical component socket is connected to the external substrate, the pressing plate is connected to the external substrate by a mounting connecting member such that the first biasing means is retracted, and as a result the pressing plate moves toward the external substrate, the first holding substrate also moves toward the external substrate, and the ends of the contact pins come into contact with the electrodes of the external substrate.

4. The electrical component socket according to claim 1, characterized in that, after being placed on the external substrate but before being fixed, the ends of the contact pins extending from the first holding substrate toward the external substrate are located toward the movable base rather than the surface of the base member that contacts the external substrate.

5. The electrical component socket according to claim 1, further comprising a second retaining substrate between the movable base and the first retaining substrate, wherein the second retaining substrate, together with the first retaining substrate, comprises a plurality of third through holes for slidably holding the plurality of contact pins.

6. The electrical component socket according to claim 5, further comprising a second elastic member disposed between the movable base and the second holding substrate, wherein an elastic force is applied in the axial direction of the contact pin.

7. The socket for electrical components according to claim 2, further comprising a second retaining substrate between the movable base and the first retaining substrate, the second retaining substrate, together with the first retaining substrate, comprising a plurality of third through holes for slidably holding the plurality of contact pins, further comprising a second elastic member disposed between the movable base and the second retaining substrate, for which an elastic force is applied in the axial direction of the contact pins, the contact pins comprising a first contact that contacts the electrical component, a second contact on the side opposite to the side that contacts the electrical component, a third elastic member connecting the first contact and the second contact, and a barrel housing the third elastic member, the second contact being arranged to move back and forth within the barrel, the second retaining substrate having at least a portion of a protrusion facing the pressing plate, and when the pressing plate is connected to the external substrate, the pressing plate presses the protrusion in the axial direction of the contact pin, pushing at least a portion of the second contact of the contact pin into the barrel.

8. The socket for electrical components according to claim 3, wherein the pressing plate comprises a plurality of members having a fourth through hole extending in the axial direction of the contact pin, and when connected to the external substrate, the plurality of members are each connected to the external substrate via the fourth through hole by the mounting connecting member.

9. The mounting connecting member is connected to the external substrate so as to press toward the external substrate from the pressing plate side, as described in claim 8, for electrical component sockets.

10. The socket for electrical components according to claim 8, wherein the fourth through-hole has a fixing portion on its inner wall, and the mounting connecting member advances through the fourth through-hole from the external substrate side toward the pressing plate when connected to the external substrate.

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