Genotyping or sequencing platform with passivation layer
The use of an exposed passivation layer on genotyping and sequencing platforms addresses the issue of particle displacement by reducing electrostatic repulsion, enhancing retention and improving genotyping and sequencing performance.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- ILLUMINA INC
- Filing Date
- 2025-12-11
- Publication Date
- 2026-06-18
AI Technical Summary
Existing genotyping and sequencing platforms face challenges in retaining functionalized particles within depressions due to electrostatic repulsion between the particles and the negatively-charged substrate, leading to potential displacement during washing cycles, which affects genotyping and sequencing metrics.
Incorporation of an exposed passivation layer on the negatively-charged substrate to mitigate electrostatic repulsion between functionalized particles and the substrate, ensuring retention of particles within depressions through electrostatic attraction or suppression of negative charges, thereby improving genotyping and sequencing performance.
The passivation layer enhances the retention of functionalized particles, improving genotyping and sequencing metrics by preventing displacement during washing cycles and maintaining optimal reaction conditions.
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