Pixel package structure and preparation method therefor, and LED display unit
By setting the drive control circuit and redistribution layer inside the carrier board, the problem of large area occupied by the coplanar packaging structure is solved, the miniaturization of the pixel packaging structure is realized, and the development potential of micro-pitch LED displays is enhanced.
WO2026137770A1PCT designated stage Publication Date: 2026-07-02UNILUMIN GRP
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- UNILUMIN GRP
- Filing Date
- 2025-06-28
- Publication Date
- 2026-07-02
Smart Images
Figure CN2025105145_02072026_PF_FP_ABST
Abstract
A pixel package structure and a preparation method therefor, and an LED display unit. The preparation method comprises: providing a carrier substrate, wherein a drive control circuit is provided in the carrier substrate; bonding a plurality of light-emitting components onto the carrier substrate via first bonding pads of the carrier substrate; and encapsulating the light-emitting components and cutting the carrier substrate to obtain a plurality of pixel package structures. The pixel package structure comprises: a carrier substrate, which is provided with a drive control circuit therein; and light-emitting components, which are arranged on a first surface of the carrier substrate and are electrically connected to the drive control circuit, wherein the drive control circuit is configured, on the basis of a drive signal, to control the light-emitting components to emit light. The LED display unit comprises: an integrated circuit board and a pixel package structure bonded onto the integrated circuit board.
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