Infrared light transmission structure, infrared control circuit, and infrared control method
By designing an infrared light transmission structure and control circuit, infrared signal compensation is achieved using an infrared module on a dielectric substrate, which solves the instability problem of infrared gesture recognition under different lighting conditions, improves recognition accuracy, and reduces costs.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- HUIZHOU DESAY SV AUTOMOTIVE
- Filing Date
- 2025-09-26
- Publication Date
- 2026-07-09
AI Technical Summary
Existing infrared gesture recognition technology has unstable gesture segmentation and tracking performance under different lighting conditions, and its reliance on optical components leads to high mechanical design costs and unstable reliability.
An infrared light transmission structure and control circuit are adopted. Infrared signal compensation is achieved through the first and second infrared modules on the dielectric board. The second infrared module emits a compensation signal to cancel the influence of ambient light, and the current magnitude of the compensation signal is adjusted in real time through the infrared control circuit.
It improves the accuracy and reliability of infrared gesture recognition, reduces production costs, and achieves efficient transmission and stable control of infrared signals.
Smart Images

Figure CN2025124222_09072026_PF_FP_ABST
Abstract
Description
Infrared light transmission structure, infrared control circuit and infrared control method
[0001] This application claims priority to Chinese patent application filed with the State Intellectual Property Office on December 30, 2024, application number 202411965435.X, entitled "Infrared Light Transmission Structure, Infrared Control Circuit and Infrared Control Method", the entire contents of which are incorporated herein by reference. Technical Field
[0002] This application relates to the field of infrared technology, specifically to an infrared light transmission structure, an infrared control circuit, and an infrared control method. Background Technology
[0003] Infrared gesture recognition is a human-computer interaction method based on infrared sensor technology. It captures and analyzes hand movement patterns in the infrared spectrum to recognize and control various gestures. Infrared gesture recognition technology primarily relies on the reflective properties of infrared light. When a hand or other object moves, it blocks or reflects the infrared beam emitted by the infrared sensor. The sensor captures these changes in reflected light, converts them into electrical signals, and processes them through complex algorithms to ultimately decipher the specific action and intention of the gesture.
[0004] Infrared gesture recognition is mainly used in terminals such as mobile phones and in-vehicle systems. However, the effectiveness of gesture segmentation and tracking is significantly affected under different lighting conditions. Changes in lighting can lead to significant differences in gesture segmentation results, unstable tracking performance, and even tracking failure. In existing technical solutions, infrared light is transmitted to optical sensors by adding dedicated optical components such as light guides or light-shielding caps to the structure. This requires consideration of thermomechanical stress, tolerance accuracy requirements, and the quality and cleanliness of the optical components. It also places high demands on the materials used in the mechanical design, resulting in high costs and unstable reliability. Summary of the Invention
[0005] In view of the above problems, this application provides an infrared light transmission structure, an infrared control circuit, and an infrared control method to solve the problems of high material requirements, high cost, and unstable reliability in the prior art of transmitting infrared light through optical devices.
[0006] According to one aspect of this application, an infrared light transmission structure is provided, comprising:
[0007] A dielectric substrate has a first light guide hole and a second light guide hole, wherein the first light guide hole is disposed through the dielectric substrate and the second light guide hole is disposed on a surface of the dielectric substrate;
[0008] A first infrared module is fixed on the dielectric substrate along the first light guide hole, and the first infrared module acquires infrared receiving signals through the first light guide hole.
[0009] And a second infrared module, which is fixed on the medium plate along the second light guide hole, and the second infrared module emits a compensation infrared signal to the first infrared module through the medium plate.
[0010] In some alternative embodiments, the dielectric substrate includes a first reflective layer, a light guide layer, and a second reflective layer disposed sequentially.
[0011] The first light guide hole is disposed through the first reflective layer, the light guide layer and the second reflective layer; the second light guide hole is formed by opening a hole in the first reflective layer or the second reflective layer and is connected to the light guide layer.
[0012] In some alternative embodiments, the first reflective layer and the second reflective layer are copper layers; the light guide layer is an FR4 dielectric layer.
[0013] In some alternative embodiments, the aperture of the first light guide hole gradually increases along the light source projection direction of the first infrared module.
[0014] In some alternative embodiments, at least one third infrared module is also included, which is disposed on the medium board and is used to emit infrared signals.
[0015] According to another aspect of the embodiments of this application, an infrared control circuit is provided, which, based on the above-described infrared light conduction structure, includes:
[0016] The power supply circuit has a first power interface and supplies power to the outside through the first power interface;
[0017] A first infrared driving circuit is connected to the first power interface and is used to connect to the second infrared module.
[0018] The system also includes a main control module, which is connected to the first power interface, the first infrared drive circuit, and the first infrared module. This module controls the second infrared module to emit a compensation infrared signal via the first infrared drive circuit and receives an infrared signal via the first infrared module.
[0019] In some alternative embodiments, the first infrared driving circuit includes transistors Q1, Q2, Q3, Q4, and Q5, and resistors R1, R2, and R3.
[0020] The bases of transistors Q1 and Q2 are connected to the first control terminal of the main control module; the emitter of transistor Q1 is connected to the first power interface, and the collector is connected to the base of transistor Q3; the collector of transistor Q3 is connected to the first terminal of the first compensation lamp of the second infrared module, and the emitter is grounded; the collector of transistor Q2 is connected to the first terminal of the second compensation lamp of the second infrared module, and the emitter is grounded.
[0021] The base and collector of transistor Q4 and the base of transistor Q5 are connected to the second control terminal of the main control module; the emitter of transistor Q4 is connected to the first power interface through resistor R1; the emitter of transistor Q5 is connected to the first power interface through resistor R2, and the collector is connected to the second terminal of the first compensation lamp, the second terminal of the second compensation lamp, and the first terminal of resistor R3; the second terminal of resistor R3 is connected to the first power interface.
[0022] In some optional embodiments, at least one second infrared driving circuit is also included. The second infrared driving circuit is connected to the third infrared module and the main control module. The second infrared driving circuit is used to receive control signals from the main control module and control the third infrared module to emit infrared emission signals.
[0023] In some alternative embodiments, the second infrared driving circuit includes transistors Q6, Q7, and Q8, resistors R4, R5, R6, and R7, and capacitors C1 and C2.
[0024] The base of transistor Q6 is connected to the first power interface through resistor R4 and to the power terminal through resistor R5. The emitter is connected to the third control terminal of the main control module. The collector is connected to the base and collector of transistor Q7 and the base of transistor Q8.
[0025] The emitter of transistor Q7 is connected to the second power interface of the power supply circuit, the first end of capacitor C1 and the first end of capacitor C2 through resistor R6, and the second end of capacitor C1 and the second end of capacitor C2 are grounded.
[0026] The emitter of the transistor Q8 is connected to the second power interface through resistor R8, and the collector is connected to the emitting lamp of the third infrared module.
[0027] In some alternative embodiments, the main control module is provided with at least one infrared receiver, and the infrared receiver is electrically connected to the receiving lamp of the first infrared module.
[0028] In some alternative embodiments, the power supply circuit includes a step-down chip, an inductor L1, at least one capacitor C3, and at least one capacitor C4;
[0029] The input terminal of the step-down chip is a second power interface, and the second power interface is connected to the first terminal of the inductor L1 and the first terminal of the capacitor C3. The second terminal of the inductor L1 is connected to an external power supply. The output terminal of the step-down chip is a first power interface. The first terminal of the capacitor C4 is connected to the first power interface, and the second terminal of the capacitor C4 is grounded.
[0030] According to another aspect of the embodiments of this application, an infrared control method is provided, based on the above-described infrared control circuit, the method comprising:
[0031] The infrared received signal from the first infrared module and the infrared emitted signal from the third infrared module are acquired in real time.
[0032] Real-time infrared parameters are obtained by calculating the ratio of the infrared received signal to the infrared emitted signal, and a compensation value is obtained based on the difference between the real-time detection parameters and the preset target infrared parameters.
[0033] Based on the compensation value, the current magnitude of the compensation infrared signal of the second infrared module is adjusted in real time.
[0034] In some alternative embodiments, the current phase of the second infrared module is opposite to the current phase of the third infrared module;
[0035] When the real-time detection parameter is greater than the target infrared parameter, the current of the second infrared module is reduced to lower the real-time infrared parameter to the target infrared parameter.
[0036] When the real-time detection parameter is less than the target infrared parameter, the current of the second infrared module is increased to bring the real-time infrared parameter up to the target infrared parameter.
[0037] This application provides an infrared light transmission structure, an infrared control circuit, and an infrared control method, the advantages of which are:
[0038] 1. The infrared light transmission structure of this application provides a compensating infrared signal to the first infrared module through a second infrared module, thereby offsetting the influence of ambient light in infrared gesture recognition and making the infrared gesture recognition more accurate. Furthermore, both the first and second infrared modules are mounted on a dielectric substrate. This substrate can be reused by redesigning the PCB board that originally housed the first infrared module, avoiding the problems of high cost and unstable reliability caused by adding additional optical components. Simultaneously, a third infrared module can be integrated on the dielectric substrate, which not only improves the transmission efficiency of the infrared received signal but also results in higher integration of the infrared light transmission structure, facilitating circuit component layout and manufacturing, and reducing production costs.
[0039] 2. The infrared control circuit of this application, by connecting to the first and second infrared modules, controls the second infrared module to output a compensation infrared signal to the first infrared module, thereby offsetting the influence of ambient light in infrared gesture recognition and making the infrared gesture recognition more accurate. Simultaneously, the infrared control circuit can also integrate a second infrared driving circuit to control the third infrared module, facilitating unified control of the transmitted, received, and compensation signals of the infrared light transmission structure, thus improving the stability and reliability of infrared control. Furthermore, the infrared control circuit can be deployed on the dielectric substrate of the infrared light transmission structure, enabling dielectric substrate reuse, which not only ensures the accuracy of infrared signal transmission but also reduces production costs.
[0040] 3. The infrared control method of this application obtains real-time infrared parameters by acquiring and calculating the ratio of the infrared received signal to the infrared emitted signal, and adjusts the current magnitude of the compensation infrared signal in real time based on the difference between the real-time detected parameters and the preset target infrared parameters. By adjusting the current magnitude of the compensation infrared signal, this application can offset the influence of ambient light, improve infrared reception efficiency, and make infrared gesture recognition more accurate.
[0041] The above description is merely an overview of the technical solution of this application. In order to better understand the technical means of the embodiments of this application, it can be implemented in accordance with the contents of the specification. In order to make the above and other objects, features and advantages of this application more obvious and understandable, specific implementation methods of this application are described below. Attached Figure Description
[0042] The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:
[0043] Figure 1 shows a first structural schematic diagram of the infrared light transmission structure provided in Embodiment 1 of this application;
[0044] Figure 2 shows a second structural schematic diagram of the infrared light transmission structure provided in Embodiment 1 of this application;
[0045] Figure 3 shows the circuit schematic of the main control module of Embodiment 2 provided in this application;
[0046] Figure 4 shows a circuit diagram of the first infrared driving circuit provided in Embodiment 2 of this application;
[0047] Figure 5 shows a circuit diagram of the second infrared driving circuit provided in Embodiment 2 of this application;
[0048] Figure 6 shows a circuit diagram of the power supply circuit of Embodiment 2 provided in this application;
[0049] Figure 7 shows a flowchart of the infrared control method of Embodiment 3 provided in this application.
[0050] Figure label:
[0051] 1. Dielectric substrate; 11. Light guide layer; 12. First reflective layer; 13. Second reflective layer;
[0052] 2. First infrared module;
[0053] 3. Second infrared module;
[0054] 4. Third infrared module;
[0055] 5. First light guide hole;
[0056] 6. Second light guide hole. Embodiments of the present invention
[0057] Exemplary embodiments of the present application will now be described in more detail with reference to the accompanying drawings. Although exemplary embodiments of the present application are shown in the drawings, it should be understood that the present application may be implemented in various forms and should not be limited to the embodiments set forth herein.
[0058] Example 1:
[0059] Figures 1 and 2 illustrate a first embodiment of an infrared light transmission structure according to this application. The infrared light transmission structure specifically includes a dielectric substrate 1, a first infrared module 2, and a second infrared module 3. Through the infrared light transmission structure of this application, a compensation infrared signal is added to the original infrared receiving signal to offset the influence of ambient light. The first infrared module 2 and the second infrared module 3 are both mounted on the dielectric substrate 1. The dielectric substrate 1 can be reused by redesigning the PCB board on which the first infrared module 2 is originally mounted.
[0060] Specifically, the dielectric substrate 1 has a first light guide hole 5 and a second light guide hole 6. The first light guide hole 5 is disposed through the dielectric substrate 1, and the second light guide hole 6 is disposed on one surface of the dielectric substrate 1. The dielectric substrate 1 is used to install a first infrared module 2 and a second infrared module 3. Specifically, the first infrared module 2 is disposed in the first light guide hole 5, and the second infrared module 3 is disposed in the second light guide hole 6 for installation. In some specific embodiments, the first light guide hole 5 is a through hole, and the second light guide hole 6 is a blind hole to match the characteristics of the first infrared module 2 and the second infrared module 3.
[0061] The first infrared module 2 is fixed on the dielectric substrate 1 along the first light guide hole 5. The first infrared module 2 obtains infrared receiving signals through the first light guide hole 5. The first infrared module 2 is fixed on the surface of the dielectric substrate 1, and the receiving lamp of the first infrared module 2 is connected to the first light guide hole 5 and receives external infrared light sources through the first light guide hole 5.
[0062] The second infrared module 3 is fixed to the dielectric substrate 1 along the second light guide hole 6, and the second infrared module 3 emits a compensation infrared signal to the first infrared module 2 through the dielectric substrate 1. The second infrared module 3 is fixed to the surface of the dielectric substrate 1, and the compensation lamp of the second infrared module 3 is connected to the second light guide hole 6, so that the compensation infrared signal of the second infrared module 3 is transmitted to the first light guide hole 5 through the transmission path inside the dielectric substrate 1, until it is received by the first infrared module 2.
[0063] The infrared light transmission structure of this application provides a compensating infrared signal for the infrared signal received by the first infrared module 2 through the second infrared module 3, so as to counteract the influence of ambient light in infrared gesture recognition and make infrared gesture recognition more accurate. Moreover, the first infrared module 2 and the second infrared module 3 of this application are both set on the dielectric board 1. The dielectric board 1 can be reused by redesigning the PCB board on which the first infrared module 2 is originally installed, so as to avoid the problems of high cost and unstable reliability caused by adding additional optical components.
[0064] In some optional embodiments, the dielectric substrate 1 includes a first reflective layer 12, a light guide layer 11, and a second reflective layer 13 arranged sequentially; wherein a first light guide hole 5 is disposed through the first reflective layer 12, the light guide layer 11, and the second reflective layer 13; a second light guide hole 6 is formed by opening in the first reflective layer 12 or the second reflective layer 13 and is connected to the light guide layer 11. In a specific example, the first reflective layer 12 and the second reflective layer 13 are copper layers; the light guide layer 11 is an FR4 dielectric layer, which is mainly composed of interwoven glass fiber and epoxy resin, and may also contain fillers. The light guide layer 11 is located between the first reflective layer 12 and the second reflective layer 13. After the compensated infrared signal of the second infrared module 3 is projected from the first light guide hole 5, it is conducted within the light guide layer 11 and, under the reflection of the first reflective layer 12 and the second reflective layer 13, the compensated infrared signal is transmitted to the first light guide hole 5 for reception by the first infrared module 2. The dielectric substrate 1 can be a copper-clad PCB. The first infrared module 2 and the second infrared module 3 can be fixed to the dielectric substrate 1 by soldering or gluing. The first light guide hole 5 is a through hole to prevent the dielectric substrate 1 from affecting the light from the first light guide hole 5. The second light guide hole 6 is a blind hole and is connected to the light guide layer 11 to prevent the copper or ink on the first reflective layer 12 or the second reflective layer 13 from affecting the second infrared module 3.
[0065] Furthermore, the first infrared module 2 and the second infrared module 3 can be disposed on the same surface as the dielectric layer or on a different surface, or the first infrared module 2 can be disposed on the upper or lower surface of the dielectric layer, and the second infrared module 3 can be disposed on the side of the dielectric. In the above manner, the compensation infrared signal of the second infrared module 3 can be transmitted to the first infrared module 2 through the dielectric layer.
[0066] In some alternative embodiments, the aperture of the first light guide hole 5 gradually increases along the light source projection direction of the first infrared module 2. In this embodiment, by setting the aperture of the first light guide hole 5 to gradually increase along the light source projection direction of the first infrared module 2, the first light guide hole 5 can exhibit a light-focusing effect; this not only improves the receiving efficiency of the first infrared module 2, but also, by designing the shape of the first light guide hole 5, the light source of the second infrared module 3 can be focused through the first light guide hole 5, ensuring the light transmission effect of the second infrared module 3.
[0067] In some optional embodiments, referring to FIG2, at least one third infrared module 4 is further included. The third infrared module 4 is disposed on the dielectric substrate 1 and is used to emit infrared emission signals. In this embodiment, the third infrared module 4 can also be integrated on the dielectric substrate 1, which not only improves the transmission efficiency of the infrared receiving signal but also has a higher integration density of the infrared light transmission structure, facilitating circuit device layout and manufacturing, thereby reducing production costs. The infrared emission signal emitted by the third infrared module is refracted or reflected when it encounters a target object, and the refracted or reflected infrared signal portion is output to the infrared receiving signal to achieve target object detection.
[0068] Furthermore, when the first infrared module 2 and the second infrared module 3 are fixed on the first reflective layer 12 of the dielectric substrate 1, the third infrared module 4 can be fixedly disposed on the second reflective layer 13 of the dielectric substrate 1, and the light source projection direction of the third infrared module 4 is consistent with the receiving direction of the first infrared module, so as to improve the infrared transmission efficiency.
[0069] Example 2:
[0070] Figures 3-6 illustrate a first embodiment of an infrared control circuit according to this application. Based on the infrared light conduction structure of Embodiment 1, this circuit includes a power supply circuit, a first infrared driving circuit, and a main control module; wherein...
[0071] The power supply circuit has a first power interface and supplies power to the outside through the first power interface; the first infrared driving circuit is connected to the first power interface and is used to connect to the second infrared module; the main control module is connected to the first power interface, the first infrared driving circuit and the first infrared module, and is used to control the second infrared module to emit compensated infrared signals through the first infrared driving circuit and to receive infrared reception signals through the first infrared module.
[0072] The infrared control circuit of this application connects to a first infrared module and a second infrared module to control the second infrared module to output a compensating infrared signal to the first infrared module. This compensates for the influence of ambient light in infrared gesture recognition, making the recognition more accurate. Furthermore, the infrared control circuit can be mounted on a dielectric substrate of the infrared light transmission structure, enabling substrate reuse. This not only ensures the accuracy of infrared signal transmission but also reduces production costs.
[0073] Specifically, the first infrared driving circuit includes transistors Q1, Q2, Q3, Q4, and Q5, resistors R1, R2, and R3; the bases of transistors Q1 and Q2 are connected to the first control terminal of the main control module; the emitter of transistor Q1 is connected to the first power interface, and its collector is connected to the base of transistor Q3; the collector of transistor Q3 is connected to the first terminal of the first compensation lamp of the second infrared module, and its emitter is grounded; the collector of transistor Q2 is connected to the first terminal of the second compensation lamp of the second infrared module, and its emitter is grounded; the base and collector of transistor Q4 and the base of transistor Q5 are connected to the second control terminal of the main control module; the emitter of transistor Q4 is connected to the first power interface through resistor R1; the emitter of transistor Q5 is connected to the first power interface through resistor R2, and its collector is connected to the second terminal of the first compensation lamp, the second terminal of the second compensation lamp, and the first terminal of resistor R3; the second terminal of resistor R3 is connected to the first power interface.
[0074] In some specific examples, the first and second compensation lamps of the second infrared module increase the magnitude of the compensation infrared signal; specifically, transistors Q1 and Q2 receive the first control terminal signal from the main control module, and transistors Q4 and Q5 receive the second control terminal signal from the main control module, thereby controlling the magnitude of the current flowing into the first and second compensation lamps.
[0075] In some alternative embodiments, at least one second infrared driving circuit is included. The second infrared driving circuit is connected to the third infrared module and the main control module. The second infrared driving circuit is used to receive control signals from the main control module and control the third infrared module to emit infrared emission signals.
[0076] Specifically, the second infrared driving circuit includes transistors Q6, Q7, and Q8, resistors R4, R5, R6, and R7, and capacitors C1 and C2. The base of transistor Q6 is connected to the first power interface through resistor R4 and to the power supply terminal through resistor R5. Its emitter is connected to the third control terminal of the main control module, and its collector is connected to the base and collector of transistor Q7 and the base of transistor Q8. The emitter of transistor Q7 is connected to the second power interface of the power supply circuit, the first terminal of capacitor C1, and the first terminal of capacitor C2 through resistor R6. The second terminals of capacitor C1 and C2 are grounded. The emitter of transistor Q8 is connected to the second power interface through resistor R8, and its collector is connected to the emitting lamp of the third infrared module.
[0077] In this embodiment, the application receives the signal from the third control terminal of the main control module through transistor Q6, and controls the on / off state of the transmitting lamp through transistors Q7 and Q8. A second infrared driving circuit is integrated into the infrared control circuit to control the third infrared module, facilitating unified control of the transmitted, received, and compensated signals of the infrared light transmission structure, thereby improving the stability and reliability of infrared control.
[0078] In some optional embodiments, the main control module is provided with at least one infrared receiver, and the infrared receiver is electrically connected to the receiving lamp of the first infrared module. In this embodiment, the receiving lamp of the first infrared module can be directly connected to the main control module to output the received infrared signal to the main control module for processing. The infrared receiver can have a positive terminal and a negative terminal, wherein the positive terminal is connected to the positive terminal of the receiving lamp, and the negative terminal is connected to the negative terminal of the receiving lamp. Furthermore, the main control module can be an STM32 series microcontroller to control the first infrared module, the second infrared module, and the third infrared module.
[0079] In some optional embodiments, the power supply circuit includes a step-down chip, an inductor L1, at least one capacitor C3, and at least one capacitor C4. The input terminal of the step-down chip is a second power interface, which is connected to the first terminal of inductor L1 and the first terminal of capacitor C3. The second terminal of inductor L1 is connected to an external power supply. The output terminal of the step-down chip is a first power interface. The first terminal of capacitor C4 is connected to the first power interface, and the second terminal of capacitor C4 is grounded. In this embodiment, the step-down chip may be a TLV70033QDDCRQ1, which can convert 5V from the external power supply to 3.3V. Inductor L1 is used to filter noise from the external power supply to generate a second power supply, which is output through the second power interface. The output terminal of the step-down chip is the first power interface, which outputs the first power supply. Capacitors C3 and C4 are used for filtering.
[0080] Example 3:
[0081] Figure 7 illustrates a first embodiment of an infrared control method, based on the infrared control circuit of Embodiment 2, the method comprising:
[0082] 710, real-time acquisition of the infrared receiving signal of the first infrared module and the infrared transmitting signal of the third infrared module; in step 710, the acquisition of the infrared receiving signal of the first infrared module and the infrared transmitting signal of the third infrared module can be implemented by the infrared control circuit in embodiment 2.
[0083] 720. Real-time infrared parameters are obtained by calculating the ratio of the received infrared signal to the emitted infrared signal, and a compensation value is obtained based on the difference between the real-time detection parameters and the preset target infrared parameters. In step 720, the preset target infrared parameters can be experimentally determined, and their values are stored in the main control module register of the infrared control circuit. In a specific example, the target infrared parameters can be 4uA / 10mA. By setting the target infrared parameters, the compensation infrared signal can be adjusted in real time, so that the real-time detection parameters approach or reach the preset target infrared parameters.
[0084] 730. Based on the compensation value, the current magnitude of the compensation infrared signal of the second infrared module is adjusted in real time. In step 730, after obtaining the compensation value, this application can control the current magnitude of the second infrared module through the first and second control terminals of the control circuit, thereby realizing the real-time adjustment of the compensation infrared signal.
[0085] More specifically, the current phase of the second infrared module is opposite to that of the third infrared module; when the real-time detection parameter is greater than the target infrared parameter, the current of the second infrared module is reduced to lower the real-time infrared parameter to the target infrared parameter; when the real-time detection parameter is less than the target infrared parameter, the current of the second infrared module is increased to increase the real-time infrared parameter to the target infrared parameter.
[0086] The infrared control method of this application obtains real-time infrared parameters by acquiring and calculating the ratio of the infrared received signal to the infrared emitted signal, and adjusts the current magnitude of the compensation infrared signal in real time based on the difference between the real-time detected parameters and the preset target infrared parameters. By adjusting the current magnitude of the compensation infrared signal, this application can offset the influence of ambient light, improve infrared reception efficiency, and make infrared gesture recognition more accurate.
[0087] The algorithms or displays provided herein are not inherently related to any particular computer, virtual system, or other device. Furthermore, the embodiments in this application are not directed to any particular programming language.
[0088] Numerous specific details are set forth in the specification provided herein. However, it will be understood that embodiments of this application may be practiced without these specific details. Similarly, for the purpose of simplification and aiding understanding of one or more aspects of the invention, in the above description of exemplary embodiments of this application, various features of the embodiments are sometimes grouped together in a single embodiment, figure, or description thereof. The claims, which follow the detailed description, are hereby expressly incorporated into that detailed description, wherein each claim itself is a separate embodiment of this application.
[0089] Those skilled in the art will understand that the modules in the device of the embodiment can be adaptively changed and placed in one or more devices different from that embodiment. Modules, units, or components in the embodiment can be combined into a single module, unit, or component, and further, they can be divided into multiple sub-modules, sub-units, or sub-components, except that at least some of such features and / or processes or units are mutually exclusive.
[0090] It should be noted that the above embodiments are illustrative of this application and not restrictive, and those skilled in the art can devise alternative embodiments without departing from the scope of the appended claims. In the claims, any reference signs placed between parentheses should not be construed as limiting the claims. The word "comprising" does not exclude the presence of elements or steps not listed in the claims. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. This application can be implemented by means of hardware comprising several different elements and by means of a suitably programmed computer. In the unit claims enumerating several means, several of these means may be embodied by the same item of hardware. The use of the words first, second, and third, etc., does not indicate any order. These words can be interpreted as names. The steps in the above embodiments, unless otherwise specified, should not be construed as limiting the order of execution.
Claims
1. An infrared light transmission structure, characterized in that, include: A dielectric substrate has a first light guide hole and a second light guide hole, wherein the first light guide hole is disposed through the dielectric substrate and the second light guide hole is disposed on a surface of the dielectric substrate; A first infrared module is fixed on the dielectric substrate along the first light guide hole, and the first infrared module acquires infrared receiving signals through the first light guide hole. And a second infrared module, which is fixed on the medium plate along the second light guide hole, and the second infrared module emits a compensation infrared signal to the first infrared module through the medium plate.
2. The infrared light transmission structure according to claim 1, characterized in that, The dielectric substrate includes a first reflective layer, a light guide layer, and a second reflective layer arranged sequentially. The first light guide hole is disposed through the first reflective layer, the light guide layer and the second reflective layer; the second light guide hole is formed by opening a hole in the first reflective layer or the second reflective layer and is connected to the light guide layer.
3. The infrared light transmission structure according to claim 2, characterized in that, The first and second reflective layers are copper layers; the light guide layer is an FR4 dielectric layer.
4. The infrared light transmission structure according to claim 2, characterized in that, The aperture of the first light guide hole gradually increases along the light source projection direction of the first infrared module.
5. The infrared light transmission structure according to claim 3, characterized in that, It also includes at least one third infrared module, which is disposed on the medium board and is used to emit infrared signals.
6. An infrared control circuit, characterized in that, Based on the infrared light transmission structure according to any one of claims 1-5, the circuit includes: The power supply circuit has a first power interface and supplies power to the outside through the first power interface; A first infrared driving circuit is connected to the first power interface and is used to connect to the second infrared module. The system also includes a main control module, which is connected to the first power interface, the first infrared drive circuit, and the first infrared module. This module controls the second infrared module to emit a compensation infrared signal via the first infrared drive circuit and receives an infrared signal via the first infrared module.
7. The infrared control circuit according to claim 6, characterized in that, The first infrared driving circuit includes transistors Q1, Q2, Q3, Q4, and Q5, and resistors R1, R2, and R3. The bases of transistors Q1 and Q2 are connected to the first control terminal of the main control module; the emitter of transistor Q1 is connected to the first power interface, and the collector is connected to the base of transistor Q3; the collector of transistor Q3 is connected to the first terminal of the first compensation lamp of the second infrared module, and the emitter is grounded; the collector of transistor Q2 is connected to the first terminal of the second compensation lamp of the second infrared module, and the emitter is grounded. The base and collector of transistor Q4 and the base of transistor Q5 are connected to the second control terminal of the main control module; the emitter of transistor Q4 is connected to the first power interface through resistor R1; the emitter of transistor Q5 is connected to the first power interface through resistor R2, and the collector is connected to the second terminal of the first compensation lamp, the second terminal of the second compensation lamp, and the first terminal of resistor R3; the second terminal of resistor R3 is connected to the first power interface.
8. The infrared control circuit according to claim 6, characterized in that, It also includes at least one second infrared driving circuit, which is connected to the third infrared module and the main control module. The second infrared driving circuit is used to receive control signals from the main control module and control the third infrared module to emit infrared signals.
9. The infrared control circuit according to claim 8, characterized in that, The second infrared driving circuit includes transistors Q6, Q7, and Q8, resistors R4, R5, R6, and R7, and capacitors C1 and C2. The base of transistor Q6 is connected to the first power interface through resistor R4 and to the power terminal through resistor R5. The emitter is connected to the third control terminal of the main control module. The collector is connected to the base and collector of transistor Q7 and the base of transistor Q8. The emitter of transistor Q7 is connected to the second power interface of the power supply circuit, the first end of capacitor C1 and the first end of capacitor C2 through resistor R6, and the second end of capacitor C1 and the second end of capacitor C2 are grounded. The emitter of the transistor Q8 is connected to the second power interface through resistor R8, and the collector is connected to the emitting lamp of the third infrared module.
10. The infrared control circuit according to claim 6, characterized in that, The main control module is equipped with at least one infrared receiver, and the infrared receiver is electrically connected to the receiving lamp of the first infrared module.
11. The infrared control circuit according to claim 6, characterized in that, The power supply circuit includes a step-down chip, an inductor L1, at least one capacitor C3, and at least one capacitor C4. The input terminal of the step-down chip is a second power interface, and the second power interface is connected to the first terminal of the inductor L1 and the first terminal of the capacitor C3. The second terminal of the inductor L1 is connected to an external power supply. The output terminal of the step-down chip is a first power interface. The first terminal of the capacitor C4 is connected to the first power interface, and the second terminal of the capacitor C4 is grounded.
12. An infrared control method, characterized in that, Based on the infrared control circuit according to claims 6-11, the method includes: The infrared received signal from the first infrared module and the infrared emitted signal from the third infrared module are acquired in real time. Real-time infrared parameters are obtained by calculating the ratio of the infrared received signal to the infrared emitted signal, and a compensation value is obtained based on the difference between the real-time detection parameters and the preset target infrared parameters. Based on the compensation value, the current magnitude of the compensation infrared signal of the second infrared module is adjusted in real time.
13. The infrared control method according to claim 12, characterized in that, The current phase of the second infrared module is opposite to the current phase of the third infrared module; When the real-time detection parameter is greater than the target infrared parameter, the current of the second infrared module is reduced to lower the real-time infrared parameter to the target infrared parameter. When the real-time detection parameter is less than the target infrared parameter, the current of the second infrared module is increased to bring the real-time infrared parameter up to the target infrared parameter.