Coupling assembly for composite flooring, and composite flooring

Abstract

The present utility model belongs to the technical field of flooring. Disclosed are a coupling assembly for composite flooring and a composite flooring. The coupling assembly comprises a foam substrate, the density of the foam substrate being 0.65-1.4 g / cm3; the foam substrate has two opposite target surfaces and side surfaces formed around the target surfaces, a coupling member that interlocks with an adjacent substrate being formed on at least one side surface; surface texture is formed on at least one of the target surfaces; the surface texture comprises a plurality of microscopic geometric shapes composed of small spaces and peaks and valleys, and the microscopic geometric shapes can provide a bonding surface for an adhesive that bonds a covering member. The surface texture effectively improves the roughness of the target surface, and can increase the contact area between the adhesive and the bonding surface, such that the adhesive can bond the covering member to the foam substrate with high strength, thereby less being prone to fall off.

Description

A connecting component for composite flooring and composite flooring Technical Field

[0001] This utility model belongs to the field of flooring technology, specifically relating to a connecting component for composite flooring and the composite flooring itself. Background Technology

[0002] In the field of building decoration materials, traditional ceramic tiles are widely used in home and commercial renovations due to their durability and aesthetic appeal. However, with the accelerating pace of modern life and increased environmental awareness, the complexity of installing traditional ceramic tiles and their environmental friendliness have become increasingly prominent issues. The installation process of traditional ceramic tiles is cumbersome and complex, usually requiring professional technicians, which not only increases construction costs but also extends the renovation period. Furthermore, the installation of traditional ceramic tiles relies heavily on materials such as cement mortar, which easily generates significant dust and noise, negatively impacting the construction site and surrounding environment, thus contradicting modern green and environmentally friendly construction concepts. Secondly, the relatively large weight of traditional ceramic tiles undoubtedly increases the load-bearing capacity of floor slabs in high-rise buildings or locations requiring lightweight decoration, increasing the difficulty and cost of structural design.

[0003] Furthermore, traditional tile installation requires a high-quality substrate, necessitating precise leveling and waterproofing, which increases construction difficulty and cost. The adhesion between tiles and the substrate is also relatively weak, leading to issues like tile detachment. Additionally, the weight of tiles not only increases the difficulty of transportation and installation but also limits their application in specific spaces (such as confined areas). Therefore, there is a need to develop a lightweight and quick-installation tile flooring. Summary of the Invention

[0004] 1. The problem to be solved

[0005] To address the aforementioned technical problems, the purpose of this utility model is to provide a connecting component for composite flooring and the composite flooring itself, which reduces the weight of the composite flooring and provides high bonding strength between the substrate and the cover, making it less prone to detachment.

[0006] 2. Technical Solution

[0007] To achieve the above objectives, the present invention adopts the following technical solution:

[0008] The first aspect of this utility model provides a connecting component for composite flooring, comprising a foamed substrate having a density of 0.65-1.4 g / cm³. 3The foamed substrate has two opposing target surfaces and side surfaces formed around the target surfaces, and a connecting component interlocking with an adjacent substrate is formed on at least one side surface; a surface texture is formed on at least one target surface, the surface texture including a plurality of micro-geometry composed of small spacing and peaks and valleys, the micro-geometry being able to provide an adhesive surface for the adhesive of the bonding cover.

[0009] The density of the aforementioned covering is 0.6-3.0 g / cm³. 3 It can be composed of materials selected from slicable natural stone, marble, granite, slate, glass, ceramics, leather, and wood, among which the density of natural stone, marble, granite, slate, glass, and ceramics is 2.0-3.0 g / cm³. 3 The density of leather is 0.6-0.8 g / cm³. 3 Approximately; the density of wood is 0.8-1.2 g / cm³. 3 Other materials that can be used have a density of 1.2-2.0 g / cm³. 3 between.

[0010] The connecting component serves as the connecting structure of the composite flooring. A cover is placed on top of the foam substrate to provide wear resistance and other functions. The cover and the foam substrate are generally bonded together with an adhesive to ensure the strength of the application. Therefore, this invention improves the roughness of the target surface by setting micro-geometric surface textures on the foam substrate (which has a relatively smooth surface). This increases the contact area between the adhesive and the bonding surface, allowing the adhesive to bond the cover and the foam substrate with high strength.

[0011] The density of the aforementioned foamed substrate is 0.65-1.4 g / cm³. 3 It can be any commercially available, known foamed substrate. The substrate material includes PVC, polystyrene (EPS), polyurethane (PU), polypropylene (PP), etc. The density after foaming is adjusted by adding fillers (powdered calcium carbonate, talc, silica powder, glass fiber, alumina, and wollastonite). For example, the density of a polystyrene (EPS) foamed substrate is 1.05 g / cm³. 3 The two target surfaces of the foamed substrate are in contact with the extrusion mold (also known as skin foaming), and the surface is relatively smooth, which is not conducive to the bonding of the adhesive to the cover material. When the density of the foamed substrate is lower than 0.65 g / cm³, 3 Subsequently, when the thickness of the foamed substrate was determined to be around 3mm, the strength could not meet the usage requirements; when the density of the foamed substrate was higher than 1.4g / cm³, the strength was insufficient. 3 Afterwards, the foamed substrate loses its elasticity, resulting in a poorer feel underfoot.

[0012] The foamed substrate 11 has a high porosity and a high elastic modulus, so the composite flooring is comfortable underfoot. At the same time, the matrix of the foamed substrate 11 can compensate for the gaps in the assembly when the environment changes (especially in high temperature and high humidity environments), making the composite flooring more stable and less prone to gaps.

[0013] The connecting component described above can be any known connecting component capable of connecting substrates together. Preferably, the connecting component includes at least one of two opposing substrate sides having a mortise and tenon, and the opposing substrate sides having a tenon designed to complement the mortise and tenon. The tenon and tenon cooperate with the mortise and tenon of the adjacent connecting component to achieve rapid assembly of the composite flooring.

[0014] According to any embodiment of the first aspect of the present invention, preferably, the micro-geometry includes pits that are regularly or irregularly distributed along the target surface. These pits can increase the contact area between the adhesive and the target surface in the longitudinal direction, thereby improving the bonding strength; their distribution in the transverse direction can enhance the consistency of the bonding strength.

[0015] The above-mentioned regular distribution means that the pits are distributed on the target surface in a certain pattern, such as an array distribution; irregular distribution means that they are randomly distributed on the target surface.

[0016] According to any embodiment of the first aspect of the present invention, in order to provide sufficient space for the adhesive to be contained in the pit, the pit has a maximum lateral extension dimension of 4 μm and a maximum longitudinal depth of 4 μm.

[0017] According to any embodiment of the first aspect of the present invention, the recess includes an inner surface with a curved profile, the edge of which extends toward the target surface and forms a corner. The recess is recessed downwards in the longitudinal direction, further increasing the contact area and increasing the wetting angle of the adhesive at the corner, thereby further enhancing the bonding strength.

[0018] According to any embodiment of the first aspect of the present invention, preferably, at least some of the curved contours have the same radius of curvature R. For pits with the same radius of curvature R, the adhesive can enter the pit. Within a certain range, the cross-sectional shape of the pit tends to be consistent, so that the bonding strength tends to be consistent, effectively improving the stability of the bond and avoiding cracking problems caused by uneven stress.

[0019] According to any embodiment of the first aspect of the present invention, it should be noted that the connecting component of the present invention can be assembled and placed on-site with the cover, and then assembled, or it can be transported after assembly. Therefore, by analyzing the bonding strength, the surface texture is designed. In order to ensure the most basic bonding strength, the surface texture covers 5% of the target surface area. If it is lower than this value, the bonding strength may not reach the ideal result, and the service life of the cover will be shorter. The best way is that the surface texture covers 100% of the target surface area. In actual manufacturing, due to some objective reasons, it is difficult to achieve 100%, but it can meet the needs of off-site assembly. Under the premise of ensuring strength, it can be transported stably, and the cover and the foam substrate will not crack or detach.

[0020] The surface texture covers 5%-100% of the target surface area. Specifically, it is 5%, 6%, 7%, 8%, 9%, 10%, 11%, 12%, 13%, 14%, 15%, 16%, 17%, 18%, 19%, 20%, 21%, 22%, 23%, 24%, 25%, 26%, 27%, 28%, 29%, 31%, 32%, 33%, 34%, 35%, 36%, 37%, 38%, 39%, 40%, 41%, 42%, 43%, 44%, 45%, 46%, 47%, and 48%. 49%, 50%, 51%, 52%, 53%, 54%, 55%, 56%, 57%, 58%, 59%, 60%, 71%, 72%, 73%, 74%, 75%, 76%, 77%, 78%, 79%, 80%, 81%, 82%, 83%, 84%, 85%, 86%, 87%, 88%, 89%, 90%, 91%, 92%, 93%, 94%, 95%, 96%, 97%, 98%, 99%, 100%.

[0021] According to any embodiment of the first aspect of the present invention, the surface texture covers at least the four edges and the center of the target surface, thus the surface texture covers 50%-100% of the area of ​​the target surface, specifically 50%, 51%, 52%, 53%, 54%, 55%, 56%, 57%, 58%, 59%, 60%, 71%, 72%, 73%, 74%, 75%, 76%, 77%, 78%, 79%, 80%, 81%, 82%, 83%, 84%, 85%, 86%, 87%, 88%, 89%, 90%, 91%, 92%, 93%, 94%, 95%, 96%, 97%, 98%, 99%, and 100%. The edge contact surface between the cover and the substrate can be filled with adhesive, and the bonding strength is high, which can prevent the edge warping problem of the cover.

[0022] According to any embodiment of the first aspect of the present invention, an insulating member is provided on another target surface opposite to the target surface where the covering member is located. Preferably, the insulating member is a 1-3 mm thick film containing an antifungal agent. The film containing the antifungal agent is one of IXPE (electronically cross-linked polyethylene foam or radiation-cross-linked polyethylene foam), EVA (ethylene-vinyl acetate copolymer), or cork film.

[0023] A second aspect of this invention provides a connecting component for composite flooring, comprising a foamed substrate having a density of 0.65-1.4 g / cm³. 3 The foamed substrate has two opposing target surfaces and a side surface formed around the target surfaces, and a connecting component that interlocks with an adjacent substrate is formed on at least one side surface.

[0024] At least one target surface has a surface texture comprising peaks and troughs, such that the surface tension coefficient of the target surface of the adhesive cover is not less than 18 dyn / cm and not more than 105 dyn / cm, and the density of the cover is 0.6-3.0 g / cm³. 3 .

[0025] Preferably, the surface tension coefficient of the target surface is 22-95 dyn / cm; further, the surface tension coefficient of the target surface is 30-80 dyn / cm; and even further, the surface tension coefficient of the target surface is 40-60 dyn / cm.

[0026] Extensive experimental analysis revealed that the contact area of ​​the adhesive after it is laid flat on the target surface directly affects the bonding strength. After treatment, the target surface of the foamed substrate of this invention can achieve a surface tension coefficient of no more than 105 dyn / cm and no less than 18 dyn / cm. Therefore, any known binder or adhesive that can bond the foamed substrate and the cover can be used, resulting in high bonding strength that meets the requirements of use.

[0027] In addition, when the surface tension coefficient of the target surface exceeds 60 dyn / cm, the peel strength will decrease. The reason is that the target layer molecules of the foam material are oxidized and degraded, which reduces its strength and may cause cracking between the cover and the foam substrate.

[0028] According to any embodiment of the second aspect of the present invention, an insulating member is provided on another target surface opposite to the target surface where the covering member is located. Preferably, the insulating member is a 1-3 mm thick film containing an antifungal agent. The film containing the antifungal agent is one of IXPE (electronically cross-linked polyethylene foam or radiation-cross-linked polyethylene foam), EVA (ethylene-vinyl acetate copolymer), or cork film.

[0029] A third aspect of this utility model provides a composite floor having the connecting component described in the first or second aspect, including the connecting component and a cover disposed on either of the target surfaces; the connecting component is the connecting component described in the first aspect or the connecting component described in the second aspect.

[0030] According to any embodiment of the third aspect of the present invention, the adhesive forms an adhesive layer on the target surface of the foamed substrate, and the cover is disposed on the foamed substrate through the adhesive layer.

[0031] 3. Beneficial effects

[0032] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0033] (1) The connecting component for composite flooring of this utility model has a cover on the foam substrate. The cover serves to resist wear and other functions. The cover and the foam substrate are generally bonded by an adhesive to ensure the strength of use. Therefore, this utility model effectively improves the roughness of the target surface by setting micro-geometric surface textures on the foam substrate (which has a relatively smooth surface). This increases the contact area between the adhesive and the bonding surface. The adhesive can bond the cover and the foam substrate with high strength and is not easy to fall off. After the cover and the foam substrate are bonded, they can achieve the result of being impossible to peel off.

[0034] (2) The bonding component for composite flooring of this utility model includes pits in its micro-geometry. The pits are distributed in a rectangular array or a ring array along the target surface. These pits can increase the contact area between the adhesive and the target surface in the longitudinal direction, thereby improving the bonding strength. In the transverse direction, they are evenly distributed, which can improve the consistency of the bonding strength. Attached Figure Description

[0035] The technical solution of this utility model will be further described in detail below with reference to the accompanying drawings and embodiments. However, it should be understood that these drawings are designed for illustrative purposes only and are not intended to limit the scope of this utility model. Furthermore, unless otherwise specified, these drawings are intended only to conceptually illustrate the structural construction described herein and are not necessarily drawn to scale.

[0036] Figure 1 is a structural schematic diagram of a connecting component of this utility model for composite flooring;

[0037] Figure 2 is a cross-sectional view along line AA in Figure 1;

[0038] Figure 3 is an enlarged view of part B in Figure 1;

[0039] Figure 4 is an enlarged view of part C in Figure 2;

[0040] Figure 5 is a schematic diagram of another structure of the connecting component of this utility model for composite flooring;

[0041] Figure 6 is a structural schematic diagram of the composite flooring of this utility model;

[0042] Figure 7 is a cross-sectional sectional view of the composite flooring of this utility model;

[0043] Explanation of reference numerals in the attached drawings: 10, connecting component; 11, foamed substrate; 111, target surface; 112, tongue; 113, tenon; 114, surface texture; 1141, pit; 1142, inner surface of curved profile; 1143, outer edge of pit profile; 1144, peak; 1145, trough; 20, cover; 30, adhesive layer; 40, insulating element. Detailed Implementation

[0044] This disclosure will be more readily understood by referring to the following description, taken in conjunction with the accompanying drawings and examples, all of which form part of this disclosure. It should be understood that this disclosure is not limited to the specific products, methods, conditions, or parameters described and / or illustrated herein. Furthermore, the terminology used herein is for the purpose of describing particular embodiments by way of example only and is not intended to be limiting, unless otherwise stated.

[0045] It should also be understood that, for clarity, certain features of this disclosure may be described herein in the context of individual embodiments, but may also be provided in combination with each other in individual embodiments. That is, unless obviously incompatible or specifically excluded, each individual embodiment is considered to be combinable with any other embodiment, and such combination is considered to represent another different embodiment. Conversely, for brevity, various features of this disclosure described in the context of individual embodiments may also be provided individually or in any sub-combination. Finally, while a particular embodiment may be described as part of a series of steps or part of a more general structure, each step or substructure may also be considered an independent embodiment in itself.

[0046] Unless otherwise stated, it should be understood that each individual element in the list and each combination of individual elements in the list will be interpreted as a different embodiment. For example, a list of embodiments denoted as "A, B, or C" should be interpreted as including embodiments "A", "B", "C", "A or B", "A or C", "B or C", or "A, B, or C".

[0047] In this disclosure, the singular forms of the articles “a,” “one,” and “the” also include the corresponding plural references, and references to a particular value include at least that particular value, unless the context clearly indicates otherwise. Thus, for example, a reference to “substance” is a reference to at least one of such substance and its equivalents.

[0048] Ordinal terms such as “first” and “second” may be used to describe various components or fluids, but these components and fluids are not limited by these terms. Therefore, without departing from the teachings of this disclosure, these terms are used only to distinguish one component / fluid from another.

[0049] When an item is described using the combined terms “...and / or ...", the description should be understood to include any one of the listed items and all combinations thereof.

[0050] Generally, the use of the term "about" indicates an approximation that can vary depending on the desired characteristics obtained from the disclosed subject matter and will be interpreted in a context-dependent manner based on function. Therefore, those skilled in the art will be able to interpret a degree of difference on a case-by-case basis. In some cases, the number of significant figures used when expressing a particular value can be a representative technique for determining the difference allowed by the term "about." In other cases, a gradient within a range of values ​​can be used to determine the range of differences allowed by the term "about." Furthermore, all ranges in this disclosure are inclusive and composable, and references to values ​​described within a range include every value within that range.

[0051] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains; the terms used herein and / or include any and all combinations of one or more of the associated listed items.

[0052] As shown in Figures 1 to 7, the connecting component 10 for composite flooring of this invention includes a foamed vinyl board 11, the foamed vinyl board 11 having a square, rectangular, or other similar outline shape; the density of the foamed vinyl board 11 is 0.85 g / cm³. 3The foamed vinyl board 11 has two opposing target surfaces 111; a tenon 112 is formed on any one side of the foamed substrate 11, and a mortise 113 is formed on the remaining side. The tenon 112 cooperates with the mortise 113 of the adjacent connecting component 10 to realize the assembly of the composite floor.

[0053] The aforementioned connecting components can be any known structure capable of connecting substrates together. Figures 1 and 2 illustrate one such connecting component structure, where the tongue 112 is elongated and the mortise 113 is also elongated. The lengths of the tongue 112 and mortise 113 can be the same, or the length of the tongue 112 can be slightly shorter than the length of the mortise 113, allowing for horizontal or near-horizontal displacement of the substrates towards each other. This design effectively ensures that the gaps between the connecting components 10 are minimized after assembly. The tongue 112 is part of the substrate, and its features are achieved by milling using a rotary milling tool.

[0054] Figure 5 shows a connecting component structure where the tongue 112 is trapezoidal and the mortise 113 is also trapezoidal. The shapes of the tongue 112 and the mortise 113 match, making the structure easy to assemble.

[0055] In some embodiments, surface textures 114 are formed on one target surface 111 and / or the other target surface 111 of the foamed substrate 11. These surface textures 114 are indistinguishable to the human eye. As can be seen from Figures 3 and 4, when magnified by a device (high-power microscope or scanning electron microscope), the surface textures 114 include several micro-geometric shapes composed of small spacing and peaks and valleys. These micro-geometric shapes can achieve a bonding density of 2.0 g / cm³. 3 The adhesive of the cover 20 provides an adhesive surface.

[0056] Preferably, the micro-geometry includes pits that are regularly or irregularly distributed (randomly distributed) along the target surface. These pits can increase the contact area between the adhesive and the target surface in the longitudinal direction, thereby improving the bonding strength; and their distribution in the transverse direction can improve the consistency of the bonding strength.

[0057] It should be noted that the connecting component of this utility model can be assembled and placed on-site with the cover, and then assembled, or it can be transported after assembly. Therefore, through the analysis of the bonding strength, the surface texture is designed. In order to ensure the most basic bonding strength, the surface texture covers 5% of the target surface area. If it is lower than this value, the bonding strength may not reach the ideal result, and the service life of the cover will be shorter. The optimal way is for the surface texture to cover 100% of the target surface area. In actual manufacturing, due to some objective reasons, it is difficult to achieve 100% coverage, but it can meet the needs of off-site assembly, ensuring strength while enabling stable transportation, and preventing the cover from separating from the foam substrate.

[0058] Therefore, the surface texture covers 5%-100% of the target surface area. Specifically, it is 5%, 6%, 7%, 8%, 9%, 10%, 11%, 12%, 13%, 14%, 15%, 16%, 17%, 18%, 19%, 20%, 21%, 22%, 23%, 24%, 25%, 26%, 27%, 28%, 29%, 31%, 32%, 33%, 34%, 35%, 36%, 37%, 38%, 39%, 40%, 41%, 42%, 43%, 44%, 45%, 46%, 47%, and 48%. 49%, 50%, 51%, 52%, 53%, 54%, 55%, 56%, 57%, 58%, 59%, 60%, 71%, 72%, 73%, 74%, 75%, 76%, 77%, 78%, 79%, 80%, 81%, 82%, 83%, 84%, 85%, 86%, 87%, 88%, 89%, 90%, 91%, 92%, 93%, 94%, 95%, 96%, 97%, 98%, 99%, 100%.

[0059] Furthermore, to prevent edge warping of the cover, the surface texture covers at least the four edges and center of the target surface. Therefore, the surface texture covers 50%-100% of the target surface area, specifically 50%, 51%, 52%, 53%, 54%, 55%, 56%, 57%, 58%, 59%, 60%, 71%, 72%, 73%, 74%, 75%, 76%, 77%, 78%, 79%, 80%, 81%, 82%, 83%, 84%, 85%, 86%, 87%, 88%, 89%, 90%, 91%, 92%, 93%, 94%, 95%, 96%, 97%, 98%, 99%, and 100%. This allows the edge contact surfaces between the cover and the substrate to be filled with adhesive, resulting in high bonding strength.

[0060] It should be noted that, in order to ensure sufficient space for the adhesive in the pit, the maximum lateral extension dimension of the pit is 4 μm, and the maximum longitudinal depth is 4 μm (based on SEM scanning electron microscopy test results). Based on this, as shown in Figures 3 and 4, the shape of the outer edge of the pit's contour is not specifically limited; it has an opening that allows the adhesive to enter and adhere to its inner surface. Preferably, at least a portion of the outer edge of the pit's contour is circular or elliptical. Specifically, the diameter D of the circle is 2-4 μm, specifically 2 μm, 2.1 μm, 2.2 μm, 2.3 μm, 2.4 μm, 2.5 μm, 2.6 μm, 2.7 μm, 2.8 μm, 2.9 μm, 3 μm, 3.1 μm, 3.2 μm, 3.3 μm, 3.4 μm, 3.5 μm, 3.6 μm, 3.7 μm, 3.8 μm, 3.9 μm, and 4 μm. The outer edge of the aforementioned pit is circular or elliptical, which allows the adhesive to flow into the pit as quickly as possible, thereby improving work efficiency.

[0061] Furthermore, referring to Figure 4, the recess includes an inner surface with a curved profile, the edge of which extends toward the target surface and forms a corner. The recess is recessed downwards in the longitudinal direction, further increasing the contact area and increasing the wetting angle of the adhesive at the corner, thereby further enhancing the bonding strength.

[0062] There is no specific limitation on the spacing between two adjacent pits in this invention. As long as the spacing between two adjacent pits is achievable under the conditions permitted by existing technology, it is acceptable. Preferably, the pits are distributed in a rectangular array along the target surface, and the spacing H between two adjacent pits is 1-2 μm, specifically 1 μm, 1.1 μm, 1.2 μm, 1.3 μm, 1.4 μm, 1.5 μm, 1.6 μm, 1.7 μm, 1.8 μm, 1.9 μm, and 2 μm.

[0063] As shown in Figure 4, the connecting component 10 for composite flooring in this embodiment includes a foamed substrate 11, the density of which is 0.95 g / cm³. 3 The foamed substrate 11 has two opposing target surfaces 111. A tenon 112 is formed on any one side of the foamed substrate 11, and a mortise 113 is formed on the remaining side. A surface texture 114 is formed on at least one target surface 111. The surface texture 114 includes peaks 1144 and valleys 1145. The peaks 1144 and valleys 1145 make the surface tension coefficient of the target surface of the adhesive cover 20 not higher than 105 dyn / cm and not lower than 18 dyn / cm.

[0064] Preferably, the surface tension coefficient of the target surface is 22-95 dyn / cm, further, the surface tension coefficient of the target surface is 30-80 dyn / cm, and even further, the surface tension coefficient of the target surface is 40-60 dyn / cm.

[0065] Extensive experimental analysis revealed that the contact area of ​​the adhesive after it is laid flat on the target surface directly affects the bonding strength. After treatment, the target surface 111 of the foam substrate 11 of this invention has a surface tension coefficient of no more than 105 dyn / cm. Any known binder or adhesive that can bond the foam substrate 11 and the cover 20 together can be used, such as polyurethane (PU), epoxy resin, polyacrylate, ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, etc., which will not be elaborated here. The bonding strength is high and meets the requirements of use.

[0066] The above-mentioned methods for forming the surface texture 114 of this utility model include the following:

[0067] 1) First method: The surface of the foamed substrate 11 is subjected to corona pulse treatment. The specific corona pulse parameters are: pulse frequency of 150-200pps, pulse voltage of 20-25kV, electrode spacing of 1-3mm, and treatment time of 2-5s. The surface texture formed by this method is relatively regular and has good consistency.

[0068] 2) The second method: laser irradiation treatment is performed on the surface of the foamed substrate 11. The laser irradiation can be performed using existing technology, which will not be described in detail here.

[0069] 3) The third method: chemically etch the surface of the foamed substrate 11. Electrochemical etching can be carried out using existing technology, which will not be elaborated here.

[0070] The second and third methods result in surface textures with poor consistency and lack controllability.

[0071] As shown in Figures 6 and 7, the composite floor of this embodiment includes the aforementioned connecting component 10 and a cover 20 disposed on any one of the target surfaces 111; the adhesive forms an adhesive layer 30 on the target surface 111 of the foam substrate 11, and the cover 20 is disposed on the foam substrate 11 through the adhesive layer 30.

[0072] The density of the aforementioned covering is 0.6-3.0 g / cm³. 3It can be composed of materials selected from slicable natural stone, marble, granite, slate, glass, ceramics, leather, and wood, among which the density of natural stone, marble, granite, slate, glass, and ceramics is 2.0-3.0 g / cm³. 3 The density of leather is 0.6-0.8 g / cm³. 3 Approximately; the density of wood is 0.8-1.2 g / cm³. 3 Other materials that can be used have a density of 1.2-2.0 g / cm³. 3 between.

[0073] As shown in Figures 6 and 7, an insulating member 40 is provided on another target surface 111 opposite to the target surface 111 where the covering member 20 is located. Preferably, the insulating member 40 is a 1-3 mm membrane containing an antifungal agent. The membrane containing the antifungal agent is one of IXPE, EVA or cork material, preferably an IXPE sound-absorbing membrane.

[0074] 1) The insulating component 40 is relatively soft, which not only isolates the ground moisture but also has an anti-mold effect;

[0075] 2) The insulating component 40 is relatively lightweight, which helps to reduce the overall weight of the composite flooring;

[0076] 3) The insulating component 40 prevents noise from being stepped on, giving the composite floor a certain shock absorption effect.

[0077] In this embodiment, the adhesive layer 30 can be any known binder or adhesive capable of bonding the foamed substrate 11 and the cover 20 together, such as polyurethane (PU), epoxy resin, polyacrylate, ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, etc., which will not be elaborated here.

[0078] 1. The target surface of the foamed substrate of this utility model was tested using a dyne pen:

[0079] By drawing a line on the surface to be tested with a test pen and observing whether the liquid trail is uniform and whether there is any breakage or shrinkage, the surface tension of the material can be measured. If some parts shrink and some do not, it indicates that the treatment is insufficient. Through comparison, it was found that the surface tension coefficient of the product after corona pulse treatment can reach 60 dyn / cm or higher, which has better wettability than the foamed substrate without corona pulse treatment.

[0080] II. Testing the bonding strength of the composite flooring of this utility model:

[0081] The test method for bonding strength of flexible substrate composite panels was adopted with reference to GB / T 29059-2012 Ultra-thin Stone Composite Panels.

[0082] 1) Composite flooring sample dimensions: length 100mm ± 1mm, width 100mm + 1mm, thickness is the actual thickness, 5 samples per group of composite flooring;

[0083] 2) Roughen the bonding surface of the mold and the top and bottom surfaces of the composite flooring sample, remove stains and keep the surface clean and dry. Use adhesive to bond the mold to the composite flooring sample, and cure the bonded composite flooring sample at room temperature for more than 24 hours.

[0084] The specific operating steps are as follows: Place the composite flooring specimen on the test platform, clamp the clamp, and at the same time, make the tension rod pass through the center point of the clamp and apply a load to the composite flooring specimen at a rate of 0.5 mm / min until the foam substrate or wood board body is destroyed. Record the result as "cannot be peeled".

[0085] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A bonding assembly for composite flooring, comprising a foamed substrate, characterized in that, The density of the foamed substrate is 0.65-1.4 g / cm³. 3 The foamed substrate has two opposing target surfaces and a side surface formed around the target surfaces, and a connecting component that interlocks with an adjacent substrate is formed on at least one side surface. At least one target surface is formed with a surface texture comprising a plurality of micro-geometry consisting of small spacing and peaks and valleys, the micro-geometry being capable of providing an adhesive surface for the adhesive of the bonding cover.

2. The connecting component according to claim 1, characterized in that, The micro-geometry includes pits that are regularly or irregularly distributed along the target surface.

3. The connecting component according to claim 1, characterized in that, The pit has a maximum lateral extension dimension of 4μm and a maximum longitudinal depth of 4μm.

4. The connecting component according to claim 1, characterized in that, The surface texture covers 5%-100% of the target surface area.

5. The connecting component according to claim 4, characterized in that, The surface texture covers at least the four edges and the center of the target surface.

6. The connecting component according to any one of claims 1-5, characterized in that, It also includes an insulating element, which is a diaphragm, disposed on another target surface opposite to the target surface where the cover is located.

7. A connecting component for composite flooring, characterized in that, Includes a foamed substrate, the density of which is 0.65-1.4 g / cm³. 3 The foamed substrate has two opposing target surfaces and a side surface formed around the target surfaces, and a connecting component that interlocks with an adjacent substrate is formed on at least one side surface. At least one target surface has a surface texture comprising peaks and troughs, such that the surface tension coefficient of the target surface of the adhesive cover is not less than 18 dyn / cm and not more than 105 dyn / cm, and the density of the cover is 0.6-3.0 g / cm³. 3 .

8. The connecting component according to claim 7, characterized in that, The surface tension coefficient of the target surface is 22-95 dyn / cm.

9. The connecting component according to claim 8, characterized in that, The surface tension coefficient of the target surface is 30-80 dyn / cm.

10. The connecting component according to claim 9, characterized in that, The surface tension coefficient of the target surface is 40-60 dyn / cm.

11. The connecting component according to any one of claims 7-10, characterized in that, It also includes an insulating element, which is a diaphragm, disposed on another target surface opposite to the target surface where the cover is located.

12. A composite flooring comprising a connecting assembly and a cover, wherein the cover is disposed on a target surface of the foamed substrate; characterized in that, The connecting component is the connecting component according to any one of claims 1-6 or the connecting component according to any one of claims 7-11.

13. The composite flooring according to claim 12, characterized in that, The adhesive forms an adhesive layer on the target surface of the foamed substrate, and the cover is disposed on the foamed substrate through the adhesive layer.

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