LED substrate and display device

Abstract

The present invention relates to the technical field of LED display and provides an LED substrate and a display device. The LED substrate of the present invention comprises a plurality of fitting protrusions and a plurality of fitting slots, wherein the plurality of fitting protrusions and the plurality of fitting slots are distributed along an edge of the LED substrate in the width direction; the fitting protrusions of any LED substrate are configured to be fitted with the fitting slots of the other LED substrate to be fitted; and the fitting slots of any LED substrate are configured to be fitted with the fitting protrusions of the other LED substrate to be fitted. The LED substrate comprises a substrate base layer and a thick copper layer; the thick copper layer is fixed on the substrate base layer; the fitting protrusions are formed by an edge of the substrate base layer in the width direction and / or an edge of the thick copper layer in the width direction; and the fitting slots are formed by the edge of the substrate base layer in the width direction and / or the edge of the thick copper layer in the width direction. The present invention can improve the stability of fitted LED substrates.

Description

An LED carrier board and display device Technical Field

[0001] This invention relates to the field of LED display technology, and more specifically, to an LED carrier and display device. Background Technology

[0002] LED carrier boards are the basic support structure for light-emitting diode chips. They are used to carry, support, and dissipate heat from LED light-emitting bodies (or LED light-emitting units, LED beads). The choice of LED carrier board affects the brightness, lifespan, and stability of LED products. Especially in the field of high-power LEDs, high-performance carrier board materials play an important role in improving heat dissipation and extending product lifespan.

[0003] Due to limitations in existing PCB manufacturing processes and equipment, the size of a single LED carrier board is limited. If a large display device is required that exceeds the length of a single LED carrier board, multiple LED carrier boards must be spliced ​​together. Technical issues

[0004] However, since LED carrier boards are usually designed to be large and thin, they are prone to bending or even breaking during splicing due to slight external force or their own weight. They are especially fragile at the splicing joints. This structural instability can affect the electrical connection between LED carrier boards, leading to unstable electrical performance and even problems such as signal interruption and uneven brightness, thus affecting the LED display effect. Technical solutions

[0005] The problem addressed by this invention is how to improve the stability of LED carrier board splicing.

[0006] To address the above problems, the present invention provides an LED carrier board and a display device.

[0007] In a first aspect, the present invention provides an LED carrier board, comprising a plurality of splicing joints and a plurality of splicing slots, wherein the plurality of splicing joints and the plurality of splicing slots are distributed along the width edge of the LED carrier board, wherein the splicing joint of any LED carrier board is used to splice with the splicing slot of another LED carrier board to be spliced, and the splicing slot of any LED carrier board is used to splice with the splicing joint of another LED carrier board to be spliced; the LED carrier board comprises a carrier board base layer and a thick copper layer, wherein the thick copper layer is fixed on the carrier board base layer, the splicing joints are formed by the width edge of the carrier board base layer and / or the width edge of the thick copper layer, and the splicing slots are formed by the width edge of the carrier board base layer and / or the width edge of the thick copper layer.

[0008] Optionally, the splicing joint includes a first splicing member formed by the width edge of the substrate and a second splicing member formed by the width edge of the thick copper layer, and the splicing groove includes a third splicing member formed by the width edge of the substrate and a fourth splicing member formed by the width edge of the thick copper layer. The first splicing member of any LED substrate is used to splice with the third splicing member of another LED substrate to be spliced, and the second splicing member of any LED substrate is used to splice with the fourth splicing member of another LED substrate to be spliced.

[0009] Optionally, the LED carrier board further includes a first connector, which is connected to the second splicing member of any of the LED carrier boards and the fourth splicing member of another LED carrier board to be spliced.

[0010] Optionally, the first connector is made of conductive material and includes a first connecting segment, a second connecting segment, and a third connecting segment that are fixedly connected in sequence. The first connecting segment is used to be embedded in a first groove provided by the second splicing component of any of the LED carrier boards, and the third connecting segment is used to be embedded in a second groove provided by the fourth splicing component of another LED carrier board to be spliced.

[0011] Optionally, the end of the second splicing component is stepped, and the end of the fourth splicing component is stepped to match the shape of the end of the second splicing component. The second splicing component of any LED carrier board and the fourth splicing component of another LED carrier board to be spliced ​​are spliced ​​together by matching each other through the steps.

[0012] Optionally, when the splicing joint of any of the LED carrier boards is spliced ​​with the splicing groove of another LED carrier board to be spliced, a gap for filling the weld is provided between the thick copper layer of the LED carrier board and the thick copper layer of the other LED carrier board to be spliced.

[0013] Optionally, the sum of the lengths of the first splicing piece and the third splicing piece is equal to the sum of the lengths of the second splicing piece, the fourth splicing piece, and the width of the gap.

[0014] Optionally, the solder includes flux and conductive solder for electrical connection between the thick copper layer of one of the LED carrier boards and the thick copper layer of the other LED carrier board to be spliced.

[0015] Optionally, the second splicing component includes a first island area, and the fourth splicing component includes a second island area. When the second splicing component of any LED carrier board is spliced ​​with the fourth splicing component of another LED carrier board to be spliced, the first island area and the second island area are spliced ​​to form an island-shaped area, and the gap is located within the island-shaped area.

[0016] Optionally, the LED carrier board further includes a second connector, which is disposed between the second splicing piece to be spliced ​​and the fourth splicing piece, and gaps for filling the weld are provided between the second connector, the second splicing piece, and the fourth splicing piece.

[0017] Optionally, the second connector includes an insulating layer and a signal conduction layer, wherein the signal conduction layer is connected to the data signal pins of an LED light-emitting element disposed on the substrate through a via.

[0018] Optionally, the carrier plate base layer is provided with through holes.

[0019] Optionally, the LED carrier board further includes data signal lines, which are disposed on the substrate of the carrier board, and the extension direction of the data signal lines is the same as the splicing direction of the splicing joint and the splicing groove.

[0020] Secondly, the present invention provides a display device including the aforementioned LED carrier plate. Beneficial effects

[0021] The beneficial effects of this invention are as follows: By setting splicing joints and splicing grooves on the LED carrier board, when splicing two LED carrier boards, the splicing joint of any LED carrier board can be spliced ​​with the splicing groove of the other LED carrier board to be spliced, and the splicing groove of any LED carrier board can be spliced ​​with the splicing joint of the other LED carrier board to be spliced. Two stress points can be formed at the splicing position of the two LED carrier boards, thereby achieving the effect of anti-bending and anti-breakage, improving the stability of LED carrier board splicing, and avoiding bending or breakage of the spliced ​​LED carrier board at the splicing point due to bending stress. By setting the splicing joint to be formed by the width edge of the carrier board base layer and / or the width edge of the thick copper layer, and the splicing groove to be formed by the width edge of the carrier board base layer and / or the width edge of the thick copper layer, the carrier board base layer and the thick copper layer of the two LED carrier boards can be aligned when any LED carrier board is spliced ​​with another LED carrier board, thereby achieving accurate splicing of the splicing joint and splicing groove. Attached Figure Description

[0022] Figure 1 is a schematic diagram of the splicing of the LED carrier board according to an embodiment of the present invention;

[0023] Figure 2 is a schematic diagram of the splicing of the LED carrier board according to an embodiment of the present invention;

[0024] Figure 3 is a schematic diagram of the forces acting on the LED carrier board during splicing according to an embodiment of the present invention;

[0025] Figure 4 is a schematic diagram of the splicing of the LED carrier board according to an embodiment of the present invention;

[0026] Figure 5 is a schematic diagram of the island-shaped region according to an embodiment of the present invention;

[0027] Figure 6 is a schematic diagram of the splicing of the LED carrier board according to an embodiment of the present invention;

[0028] Figure 7 is a schematic diagram of the splicing of the LED carrier board according to an embodiment of the present invention;

[0029] Figure 8 is a schematic diagram of the splicing of the LED carrier board according to an embodiment of the present invention;

[0030] Figure 9 is a schematic diagram of the stepped splicing of LED carrier boards according to an embodiment of the present invention;

[0031] Figure 10 is a schematic diagram of the splicing of the LED carrier board according to an embodiment of the present invention;

[0032] Figure 11 is a schematic diagram of the splicing of the LED carrier board according to an embodiment of the present invention;

[0033] Figure 12 is a schematic diagram of the splicing of the present invention through the second connector according to an embodiment of the present invention;

[0034] Figure 13 is a schematic diagram of the splicing of existing LED carrier boards.

[0035] Explanation of reference numerals in the attached figures:

[0036] 1-Splicing joint, 2-Splicing groove, 3-First connector, 4-Second connector, 11-First splicing component, 12-Second splicing component, 13-Third splicing component, 14-Fourth splicing component, 31-First connecting segment, 32-Second connecting segment, 33-Third connecting segment, 41-Insulating layer, 42-Signal conduction layer, 100-Carrier substrate, 121-First groove, 122-First island area, 141-Second groove, 142-Second island area, 200-Thick copper layer, 300-Gap, 310-First step, 320-Second step, 400-Island area, 500-Through hole, 600-Via, 700-LED light source. The best embodiment of the present invention

[0037] As shown in Figure 1, this embodiment of the invention provides an LED carrier board, including multiple splicing joints 1 and multiple splicing slots 2. The multiple splicing joints 1 and multiple splicing slots 2 are distributed along the width edge of the LED carrier board. The splicing joint 1 of any LED carrier board is used to splice with the splicing slot 2 of another LED carrier board to be spliced, and the splicing slot 2 of any LED carrier board is used to splice with the splicing joint 1 of another LED carrier board to be spliced.

[0038] Specifically, splice joint 1 refers to the protruding part of the LED carrier edge, and splicing groove 2 refers to the concave part or notched structure of the LED carrier edge. Any LED carrier edge has multiple splice joints 1 and multiple splicing grooves 2. Taking LED carrier A and LED carrier B as an example, when LED carrier A and LED carrier B are spliced, the splice joint 1 of LED carrier A can be spliced ​​with the splicing groove 2 of LED carrier B, and the splicing groove 2 of LED carrier A can be spliced ​​with the splice joint 1 of LED carrier B, thus forming the splicing result shown in Figure 2. Each splice joint 1 and its corresponding splicing groove 2 are spliced ​​together, thereby realizing the splicing of LED carrier A and LED carrier B. Combining Figures 2 and 3, through the above splicing structure (tenon structure), the point of application of bending stress can be dispersed, and the splicing position of LED carrier A and LED carrier B... The design can create two stress points: the splicing joint 1 of LED carrier A and the splicing groove 2 of LED carrier B, and the splicing joint 1 of LED carrier A and LED carrier B. Therefore, it can effectively resist both upward and downward bending stress, thereby achieving the effects of bending resistance and breakage resistance, and improving the stability of LED carrier splicing. In contrast, as shown in Figure 13, when splicing existing LED carriers, the spot welds of the thick copper lines can better bear the bending stress of the LED carrier, especially the downward bending stress at both ends of the splice. At this time, the data signal line connection is almost not stressed. However, once the spliced ​​LED carrier encounters upward bending stress, it can cause the data signal line to break, or even the entire spliced ​​LED carrier to bend or break at the splice (for example, the base layer of the carrier breaks at 100° and the thick copper layer bends at 200°).

[0039] In addition to the two LED carrier boards splicing scheme mentioned in this embodiment, a greater number of LED carrier boards can also be spliced ​​together.

[0040] As shown in Figures 2 and 3, the LED carrier board includes a carrier substrate 100 and a thick copper layer 200. The splicing joint 1 is formed by the width edge of the carrier substrate 100 and / or the width edge of the thick copper layer 200; that is, the splicing joint 1 is composed of the width edge portion of the carrier substrate 100 and / or the width edge portion of the thick copper layer 200. The splicing groove 2 is formed by the width edge of the carrier substrate 100 and / or the width edge of the thick copper layer 200; that is, the splicing groove 2 is composed of the width edge portion of the carrier substrate 100 and / or the width edge portion of the thick copper layer 200. For the splicing joint 1, it can be the width edge portion of the carrier substrate 100 relative to the width edge of the thick copper layer 200. The edge portion is more prominent, or the width edge portion of the thick copper layer 200 is more prominent than the width edge portion of the substrate 100; for the splicing groove 2, the width edge portion of the substrate 100 is more prominent than the width edge portion of the thick copper layer 200, or the width edge portion of the thick copper layer 200 is more prominent than the width edge portion of the substrate 100; regardless of the method used, it is necessary to ensure that when the two LED substrates are spliced, when the substrate 100s of the two LED substrates are aligned, the thick copper layers 200s of the two LED substrates are also roughly aligned (usually a certain gap is left for filling solder).

[0041] The substrate 100 serves as a supporting base material, determining the mechanical strength of the LED substrate. The substrate 100 is typically an insulator to prevent current leakage. The thick copper layer 200 is a conductive layer located on the surface of the substrate 100. For example, a thicker copper plate is attached to the substrate 100 through a special process to form the required circuit pattern. The thick copper layer 200 has a larger conductive cross-sectional area, which can carry a larger current, thereby meeting the needs of high-power devices such as LEDs. It can also quickly conduct the heat generated by electronic components to the substrate 100, thereby utilizing the good heat dissipation properties of the substrate 100 material (such as epoxy resin and glass fiber) for heat dissipation.

[0042] The thick copper layer 200 is typically located on the back of the substrate 100. The front of the substrate 100 contains LED light-emitting units, data signal lines, and electrode pins (each LED light-emitting unit corresponds to at least three electrode pins: VDD, GND, and DATA). The lines in the thick copper layer 200 correspond one-to-one with the data signal lines on the front and extend in the same direction. During splicing, the thick copper layers 200 on the back of the two LED substrates are spot-welded to achieve physical and electrical connections between the lines, and the data signal lines on the front of the two LED substrates are electrically connected. The substrates 100 are then bonded together.

[0043] The thickness of the thick copper lines is about 0.5 mm, the thickness of the substrate 100 is about 0.3 mm, and the thickness of the data signal lines is about 0.05 mm.

[0044] The connection between the substrate 100 and the thick copper layer 200 is usually achieved through special processes to ensure that the thick copper layer is firmly attached to the substrate, while ensuring electrical performance and heat dissipation. The main processes include: achieving a tight bond between the thick copper layer 200 and the substrate 100 through hot pressing and high pressure.

[0045] In this embodiment, by setting splicing joints and splicing slots on the LED carriers, when splicing two LED carriers, the splicing joint of any LED carrier can be spliced ​​with the splicing slot of the other LED carrier to be spliced, and the splicing slot of any LED carrier can be spliced ​​with the splicing joint of the other LED carrier to be spliced. Two stress points can be formed at the splicing position of the two LED carriers, thereby achieving the effect of anti-bending and anti-breakage, improving the stability of LED carrier splicing, and avoiding bending or breakage of the spliced ​​LED carrier at the splicing point due to bending stress. By setting the splicing joint to be formed by the width edge of the carrier base layer and / or the width edge of the thick copper layer, and the splicing slot to be formed by the width edge of the carrier base layer and / or the width edge of the thick copper layer, the carrier base layer and thick copper layer of the two LED carriers can be aligned when any LED carrier is spliced ​​with another LED carrier, thereby achieving accurate splicing of the splicing joint and splicing slot.

[0046] Optionally, the splicing joint 1 includes a first splicing member 11 formed by the width edge of the substrate 100 and a second splicing member 12 formed by the width edge of the thick copper layer 200. The splicing groove 2 includes a third splicing member 13 formed by the width edge of the substrate 100 and a fourth splicing member 14 formed by the width edge of the thick copper layer 200. The first splicing member 11 of any LED substrate is used to splice with the third splicing member 13 of another LED substrate to be spliced, and the second splicing member 12 of any LED substrate is used to splice with the fourth splicing member 14 of another LED substrate to be spliced.

[0047] Specifically, as shown in Figure 4, the splicing joint 1 includes a first splicing component 11 formed by the edge of the substrate 100 and a second splicing component 12 formed by the edge of the thick copper layer 200. The splicing groove 2 includes a third splicing component 13 formed by the edge of the substrate 100 and a fourth splicing component 14 formed by the edge of the thick copper layer 200. Taking LED substrate A and LED substrate B as examples, the first splicing component 11 of LED substrate A can be spliced ​​with the third splicing component 13 of LED substrate B, and the second splicing component 12 of LED substrate A can be spliced ​​with the fourth splicing component 14 of LED substrate B. The splicing components of each splicing joint 1 and splicing groove 2 are spliced ​​in sequence to realize the splicing of LED substrate A and LED substrate B.

[0048] In this optional embodiment, by setting the first splicing piece of any LED carrier board to be spliced ​​with the third splicing piece of another LED carrier board to be spliced, and the second splicing piece of any LED carrier board to be spliced ​​with the fourth splicing piece of another LED carrier board to be spliced, the alignment of the carrier board base layer and thick copper layer of the two LED carrier boards is achieved, thereby realizing the accurate splicing of the splicing joint and splicing groove.

[0049] Optionally, the LED carrier board further includes a first connector 3, which is connected to a second splicing member 12 of any of the LED carrier boards and a fourth splicing member 14 of another LED carrier board to be spliced.

[0050] Specifically, as shown in Figures 7 and 8, the LED carrier board also includes a first connector 3. The second splicing piece 12 of the LED carrier board A and the fourth splicing piece 14 of the LED carrier board B can be physically and electrically connected through the first connector 3. The splicing pieces of each splicing joint 1 and splicing groove 2 are connected sequentially through the first connector 3, thereby realizing the splicing of LED carrier board A and LED carrier board B.

[0051] In this optional embodiment, the first connector can simultaneously achieve physical and electrical connection at the splicing joint and splicing slot, thereby improving the splicing strength of the LED carrier board.

[0052] Optionally, the first connector 3 is made of conductive material. The first connector 3 includes a first connecting segment 31, a second connecting segment 32, and a third connecting segment 33 that are fixedly connected in sequence. The first connecting segment 31 is used to be embedded in the first groove 121 of the second splicing member 12 of any of the LED carrier boards. The third connecting segment 33 is used to be embedded in the second groove 141 of the fourth splicing member 14 of another LED carrier board to be spliced.

[0053] Specifically, as shown in Figure 8, the first connector 3 includes a first connecting segment 31, a second connecting segment 32, and a third connecting segment 33 that are fixedly connected in sequence. The entire first connector 3 can be wide at both ends and narrow in the middle. The first connector 3 is made of conductive material. A first groove 121 is provided in the second splicing component 12, and the first connecting segment 31 is embedded in the first groove 121 (the shape of the first connecting segment 31 matches that of the first groove 121). A second groove 141 is provided in the fourth splicing component 14, and the third connecting segment 33 is embedded in the second groove 141 (the shape of the third connecting segment 33 matches that of the second groove 141). The splicing components of each splicing joint 1 and splicing groove 2 are connected sequentially through the first connector 3, thereby realizing the physical splicing and electrical connection of LED carrier A and LED carrier B. Furthermore, after installation, the first connector 3 can be soldered by brushing solder to ensure the reliability of the physical and electrical connections.

[0054] As shown in Figures 4 and 5, in order to ensure that there is enough space on the thick copper layer 200 to set the first groove 121 and the second groove 141, the first groove 121 and the second groove 141 are usually set in the middle of the island-shaped region 400 of the thick copper layer 200.

[0055] In this optional embodiment, by setting the first connecting segment to be embedded in the first groove and the third connecting segment to be embedded in the second groove, the splicing of the splicing joint and the splicing groove is realized, thereby improving the splicing strength of the LED carrier board.

[0056] Optionally, the end of the second splicing member 12 is stepped, and the end of the fourth splicing member 14 is stepped to match the shape of the end of the second splicing member 12. The second splicing member 12 of any LED carrier and the fourth splicing member 14 of another LED carrier to be spliced ​​are spliced ​​together by matching each other through the steps.

[0057] Specifically, as shown in Figure 9, the end of the second splicing piece 12 is stepped, and the end of the fourth splicing piece 14 is stepped to match the shape of the end of the second splicing piece 12. Taking the first step 310 at the end of the second splicing piece 12 of LED carrier A and the second step 320 at the end of the fourth splicing piece 14 of LED carrier B as examples, when LED carrier A and LED carrier B are spliced, the first step 310 and the second step 320 cooperate with each other, the second step 320 overlaps the first step 310, and a gap 300 for filling the welding material is left between the first step 310 and the second step 320. At this time, the gap 300 presents a "Z" shape.

[0058] In actual production, after the vertical surface of the second splicing component 12 of the LED carrier board A is etched, the LED carrier board A needs to form a dark base plate by inkjet printing. During the inkjet printing process, the vertical surface of the second splicing component 12 formed by inkjet printing is prone to ink accumulation. After ink accumulation, the vertical surface is contaminated. When solder is brushed into the reserved gap 300, the vertical surface of the second splicing component 12 is not easy to be soldered. As a result, the solder brushed into the reserved gap 300 will bulge out and form a protruding solder ball on the reserved gap 300. The protruding solder ball not only affects the current carrying capacity, but also causes the LED carrier board to be uneven. In this embodiment, the "Z"-shaped pre-reserved gap 300 formed by the overlap of the first step 310 and the second step 320 has a larger welding surface, which can make the LED carrier A and the LED carrier B more firmly spliced, and the overcurrent effect is ideal. Since the first step 310 and the second step 320 are usually milled, the milled first step 310 and the second step 320 are easy to tin, and it is easy to fill the gap 300 with solder without forming a protruding solder ball on the welding surface.

[0059] In this embodiment, in addition to using a single-step step, more steps can be used to further improve the stability and conductivity of the splicing of LED carrier A and LED carrier B.

[0060] In this optional embodiment, by setting the second splicing component of any LED carrier board to be spliced ​​with the fourth splicing component of another LED carrier board to be spliced ​​through a stepped matching, the stability and conductivity of the LED carrier board splicing are effectively improved.

[0061] Optionally, when the splicing joint 1 of any of the LED carrier boards is spliced ​​with the splicing groove 2 of another LED carrier board to be spliced, a gap 300 for filling the weld is provided between the thick copper layer 200 of the LED carrier board and the thick copper layer 200 of the other LED carrier board to be spliced.

[0062] Specifically, when LED carrier A and LED carrier B are spliced, a gap 300 is reserved between the thick copper layers 200 for filling with solder. By filling the gap 300 with solder, both the physical connection and the electrical connection between LED carrier A and LED carrier B can be achieved.

[0063] Among them, a gap 300 for filling the welded material may also be provided between the first step 310 and the second step 320.

[0064] The materials to be soldered include copper or tin, but because tin solder has poor current carrying capacity, the solder joint is prone to overheating and melting under high current, which can lead to an open circuit. Therefore, copper solder is usually preferred. Taking the scheme with a 300mm gap as an example, tin solder is preferred because it can meet the current carrying capacity requirements and is inexpensive and simple to process. In the scheme without a 300mm gap, since tin solder is only a surface soldering and the current only passes through the surface solder joint, the solder pressure at the solder joint is high and it is prone to overheating and melting. Therefore, this scheme should choose copper solder, which has a higher process and cost.

[0065] As shown in Figures 4 and 6, for a single LED carrier board, the edge of its thick copper layer 200 usually ends when the line of the thick copper layer 200 is at its widest point (e.g., 3 mm at its widest point and 0.9 mm at its narrowest point), thereby ensuring that the gap 300 can be filled with more solder, thus improving the stability and conductivity of the LED carrier board splicing.

[0066] In this optional embodiment, by leaving a gap between the thick copper layers of the two LED carrier boards for filling with solder, both physical connection and electrical connection between the LED carrier boards can be achieved by filling the gap with solder.

[0067] Optionally, the sum of the length of the first splicing piece 11 and the length of the third splicing piece 13 is equal to the sum of the length of the second splicing piece 12, the length of the fourth splicing piece 14, and the width of the gap 300.

[0068] Specifically, referring to Figure 4, taking LED carrier A as an example, the length of the first splicing piece 11 is greater than the length of the second splicing piece 12. In the LED carrier B that is aligned with it, the length of the third splicing piece 13 is less than the length of the fourth splicing piece 14. The sum of the lengths of the first splicing piece 11 and the third splicing piece 13 is equal to the sum of the lengths of the second splicing piece 12, the fourth splicing piece 14, and the width of the gap 300.

[0069] As shown in Figure 4, taking LED carrier B as an example, the length of its first splicing piece 11 is less than the length of the second splicing piece 12 (the splicing joint 1 of LED carrier B shown in the figure). In the LED carrier A that is aligned with it, the length of the third splicing piece 13 is greater than the length of the fourth splicing piece 14. It can also be ensured that the sum of the length of the first splicing piece 11 and the length of the third splicing piece 13 is equal to the sum of the length of the second splicing piece 12, the length of the fourth splicing piece 14, and the width of the gap 300.

[0070] In this optional embodiment, by setting the length of each splicing component, sufficient space is reserved for the gaps. By filling the gaps with welding material, both physical connection and electrical connection between LED carrier boards can be achieved.

[0071] Optionally, the soldering material includes flux and conductive solder, which is used for electrical connection between the thick copper layer 200 of one of the LED carrier boards and the thick copper layer 200 of the other LED carrier board to be spliced.

[0072] Specifically, the soldering material includes flux and conductive solder, which enables electrical connection between the thick copper layers 200 of the two LED carrier boards, thereby achieving electrical connection between the LED carrier boards.

[0073] Solder is the most important welding material, responsible for connecting the pins of electronic components to the copper traces on the circuit board; flux is used to remove oxides from the welding surface, prevent solder oxidation, and improve welding quality.

[0074] In this optional embodiment, an electrical connection between the thick copper layers of the two LED carrier boards is achieved by solder, thereby realizing an electrical connection between the LED carrier boards.

[0075] Optionally, the second splicing component 12 includes a first island area 122, and the fourth splicing component 14 includes a second island area 142. When the second splicing component 12 of any LED carrier board is spliced ​​with the fourth splicing component 14 of another LED carrier board to be spliced, the first island area 122 and the second island area 142 are spliced ​​to form an island-shaped region 400, and the gap 300 is located within the island-shaped region 400.

[0076] Specifically, as shown in Figures 4 and 5, the second splicing component 12 includes a first island area 122, and the fourth splicing component 14 includes a second island area 142. When the second splicing component 12 of any LED carrier board is spliced ​​with the fourth splicing component 14 of another LED carrier board to be spliced, the first island area 122 and the second island area 142 are spliced ​​to form an island-shaped area 400, and the gap 300 is located within the island-shaped area 400. The first island area 122 and the second island area 142 are located on both sides of the gap 300, respectively.

[0077] In this optional embodiment, by setting the first island area and the second island area to splice together to form an island-shaped area, it is beneficial to realize the splicing of the splicing joint and splicing groove, and improve the splicing strength of the LED carrier board.

[0078] Optionally, the LED carrier board further includes a second connector 4, which is disposed between the second splicing piece 12 to be spliced ​​and the fourth splicing piece 14, and a gap 300 for filling the weld is provided between the second connector 4 and the second splicing piece 12 and the fourth splicing piece 14.

[0079] Specifically, as shown in Figures 10 and 11, the cut-out portions of the second splicing piece 12 of LED carrier A and the fourth splicing piece 14 of LED carrier B are connected by the second connector 4. A gap 300 is reserved between the two ends of the second connector 4 and the second splicing piece 12 and the fourth splicing piece 14. Solder is applied in the gap 300 to complete the circuit layer connection between LED carrier A and LED carrier B.

[0080] In this optional embodiment, the splicing between LED carrier boards is achieved through the second connector 4, which can improve the reliability of the data connection line.

[0081] Optionally, the second connector 4 includes an insulating layer 41 and a signal conduction layer 42, wherein the signal conduction layer 42 is connected to the data signal pin of the LED light emitter 700 disposed on the substrate 100 through a via 600.

[0082] Specifically, as shown in Figure 12, the second connector 4 includes an insulating layer 41 and a signal conduction layer 42. Since the data signal line and the LED light source 700 are disposed on the side of the substrate 100 away from the thick copper layer 200, the data signal line is disconnected at the splice. In related technologies, complex methods are usually used to connect and conduct the data signal line on the substrate 100 on the side where the LED light source 700 is disposed, which is difficult to implement. Therefore, in this embodiment, the data signal line is connected and conducted on the side of the substrate 100 near the thick copper layer 200. The connection is made so that one end of the via 600 is connected to the data signal pin of the LED light source 700, and the other end is set on the substrate 100. When two LED substrates are spliced, the signal conduction layer 42 of the second connector 4 covers the splicing area downward and makes electrical contact with the two vias (contact electrode plates are provided around the via 600, or a thin layer of copper is left around the via when the thick copper line on the island-shaped area at the end of the splicing joint and splicing groove is cut out, so that the signal conduction layer can cover and make electrical contact with the via), thereby realizing the connection of the data signal line.

[0083] The insulating layer 41 and the signal conduction layer 42 can be FPC (flexible printed circuit board). During splicing, a thick copper connector is covered on the FPC, and then solder is applied in the gap 300 to complete the physical and electrical connection between the two LED carrier boards. The second connector 4 can also be a whole PCB board, including a thick copper connector layer, an insulating layer 41, and a signal conduction layer 42. During splicing, the PCB board is inserted into the connection notch, and then solder is applied in the gap 300 to complete the physical and electrical connection between the two LED carrier boards.

[0084] The signal conduction layer 42 is insulated at both ends near the second splicing piece 12 and the fourth splicing piece 14 to prevent short circuits with the second splicing piece 12 and the fourth splicing piece 14 when soldering is applied in the gap 300.

[0085] In this optional embodiment, by providing the second connector 4 including an insulating layer 41 and a signal conduction layer 42, the data signal line is connected through a via 600, which is simpler to implement than the existing solution.

[0086] Optionally, the carrier plate base layer 100 is provided with through holes 500.

[0087] Specifically, as shown in Figure 4, the substrate 100 has through holes 500, which reduces the weight of the LED substrate while ensuring the overall strength of the LED substrate and enhancing the light transmission effect.

[0088] The via 500 can be positioned opposite to the island region 400 (i.e., the island region 400 is located on the thick copper layer 200, and the via 500 is located on the substrate 100).

[0089] In this optional embodiment, by providing through holes 500 on the substrate 100, the weight of the LED carrier is reduced while ensuring the overall strength of the LED carrier and enhancing the light transmission effect.

[0090] Optionally, the LED carrier board further includes data signal lines, which are disposed on the carrier board base layer 100, and the extension direction of the data signal lines is the same as the splicing direction of the splicing joint 1 and the splicing groove 2.

[0091] Specifically, the LED carrier board also includes data signal lines, which are disposed on the carrier board base layer 100. The carrier board base layer 100 is also provided with LED light-emitting units and electrode pins (such as VDD, GND and DATA). The extension direction of the data signal lines is the same as the splicing direction of the splicing joint 1 and the splicing slot 2. The connection between the LED light-emitting units is realized through the data signal lines, thereby realizing the light-emitting control of the LED light-emitting units.

[0092] Among them, splicing joint 1 and splicing groove 2 are connected only in the splicing direction (i.e., the length direction of the LED carrier board) and not in other directions.

[0093] In this optional embodiment, data signal lines are provided on the substrate of the carrier board to achieve the light emission control of the LED light-emitting unit.

[0094] Another embodiment of the present invention provides a display device including the above-described LED carrier board.

[0095] Specifically, the display device in this embodiment also includes LEDs mounted on an LED carrier plate.

[0096] While the present invention has been disclosed above, its scope of protection is not limited thereto. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, and all such changes and modifications will fall within the scope of protection of the present invention.

Claims

1. An LED carrier board, characterized in that, The LED carrier includes multiple splicing joints (1) and multiple splicing slots (2), which are distributed along the width edge of the LED carrier. The splicing joint (1) of any LED carrier is used to splice with the splicing slot (2) of another LED carrier to be spliced, and the splicing slot (2) of any LED carrier is used to splice with the splicing joint (1) of another LED carrier to be spliced. The LED carrier includes a carrier base layer (100) and a thick copper layer (200), which is fixed on the carrier base layer (100). The splicing joint (1) is formed by the width edge of the carrier base layer (100) and / or the width edge of the thick copper layer (200), and the splicing slot (2) is formed by the width edge of the carrier base layer (100) and / or the width edge of the thick copper layer (200).

2. The LED carrier board according to claim 1, characterized in that, The splicing joint (1) includes a first splicing piece (11) formed by the width edge of the substrate (100) and a second splicing piece (12) formed by the width edge of the thick copper layer (200). The splicing groove (2) includes a third splicing piece (13) formed by the width edge of the substrate (100) and a fourth splicing piece (14) formed by the width edge of the thick copper layer (200). The first splicing piece (11) of any LED substrate is used to splice with the third splicing piece (13) of another LED substrate to be spliced. The second splicing piece (12) of any LED substrate is used to splice with the fourth splicing piece (14) of another LED substrate to be spliced.

3. The LED carrier board according to claim 2, characterized in that, It also includes a first connector (3), which is connected to the second splicing piece (12) of any of the LED carrier boards and the fourth splicing piece (14) of the other LED carrier board to be spliced.

4. The LED carrier board according to claim 3, characterized in that, The first connector (3) is made of conductive material. The first connector (3) includes a first connecting segment (31), a second connecting segment (32) and a third connecting segment (33) that are fixedly connected in sequence. The first connecting segment (31) is used to be embedded in the first groove (121) of the second splicing component (12) of any of the LED carrier boards. The third connecting segment (33) is used to be embedded in the second groove (141) of the fourth splicing component (14) of another LED carrier board to be spliced.

5. The LED carrier board according to claim 2, characterized in that, The end of the second splicing piece (12) is stepped, and the end of the fourth splicing piece (14) is stepped to match the end shape of the second splicing piece (12). The second splicing piece (12) of any LED carrier board and the fourth splicing piece (14) of another LED carrier board to be spliced ​​are used to splice each other by matching the steps.

6. The LED carrier board according to claim 3, characterized in that, When the splicing joint (1) of any of the LED carrier boards is spliced ​​with the splicing groove (2) of another LED carrier board to be spliced, a gap (300) for filling the weld is provided between the thick copper layer (200) of the LED carrier board and the thick copper layer (200) of the other LED carrier board to be spliced.

7. The LED carrier board according to claim 6, characterized in that, The sum of the length of the first splice (11) and the length of the third splice (13) is equal to the sum of the length of the second splice (12), the length of the fourth splice (14), and the width of the gap (300).

8. The LED carrier board according to claim 6, characterized in that, The soldering material includes flux and conductive solder, which is used for electrical connection between the thick copper layer (200) of one of the LED carrier boards and the thick copper layer (200) of the other LED carrier board to be spliced.

9. The LED carrier board according to claim 6, characterized in that, The second splicing component (12) includes a first island area (122), and the fourth splicing component (14) includes a second island area (142). When the second splicing component (12) of any LED carrier board is spliced ​​with the fourth splicing component (14) of another LED carrier board to be spliced, the first island area (122) and the second island area (142) are spliced ​​to form an island-shaped area (400), and the gap (300) is located within the island-shaped area (400).

10. The LED carrier board according to claim 2, characterized in that, It also includes a second connector (4), which is disposed between the second splice (12) to be spliced ​​and the fourth splice (14), and the second connector (4) and the second splice (12) and the fourth splice (14) are provided with gaps (300) for filling the weld.

11. The LED carrier board according to claim 10, characterized in that, The second connector (4) includes an insulating layer (41) and a signal conduction layer (42), the signal conduction layer (42) being connected to the data signal pin of an LED light emitter (700) disposed on the substrate (100) through a via (600).

12. The LED carrier board according to claim 1, characterized in that, The carrier plate base layer (100) is provided with through holes (500).

13. The LED carrier board according to any one of claims 2 to 12, characterized in that, It also includes a data signal line, which is disposed on the substrate (100) of the carrier plate, and the extension direction of the data signal line is the same as the splicing direction of the splicing joint (1) and the splicing groove (2).

14. A display device, characterized in that, Includes the LED carrier as described in any one of claims 1 to 13.

Images