Material Analysis Using Wave/Particle Radiation TRIZ Cases
- Lithium Secondary Battery Degradation Diagnosis Using XRD d-Spacing
XRD tracking of c-axis d-spacing during charging identifies lithium loss and cathode capacity loss without disassembling the battery.
- Silicon Drift X-Ray Detection for Picosecond Temporal Resolution
A silicon drift detector uses linearly graded cathode voltages to turn X-ray pulse timing into spatial charge readout with 10 ps resolution.
- Optical CD Metrology Using ML Spectral Inference for 3D Features
ML spectral inference improves optical critical dimension measurement of complex 3D and embedded semiconductor features beyond diffraction limits.
- Secondary Battery Electrode Pore Analysis via Silicon EDS Mapping
Ion milling and silicon-polymer pore filling let EDS separate pores from electrode materials for accurate porosity analysis and performance prediction.
- Cryogenic FIB Sample Attachment Without Gas Deposition
Gas-less redeposition in a cryogenic FIB chamber secures TEM samples while reducing contamination, stress, and preparation time.
- Electron Diffraction Imaging With Adaptive Peak Counting Areas
Adaptive coincidence areas for diffraction peaks and background extend direct-detection camera dynamic range while limiting coincidence loss.
- EBSD Pattern Subtraction for Sub-100 nm Phase Separation
Spatial subtraction of nearby EBSD patterns isolates overlapped secondary-phase signals below 100 nm without low-keV operation or difficult sample prep.
- Sample Carrier Positioning With Spring Contacts for Vacuum Biasing
Spring contacts link a transferable sample carrier to stage electrodes, enabling precise vacuum positioning and electrical biasing across CPA and XPS tools.
- Silicon-Core Negative Electrode With Carbon Layer Against Expansion Cracking
Amorphous carbon-coated silicon and 10 wt%+ conductive carbon help limit expansion cracking, preserve contact, and extend lithium battery cycle life.
- Standard Sample Film Composition for Stable LA-ICP-MS Signals
A polymer standard sample film with metal and an internal standard reduces position-based signal variation and improves LA-ICP-MS accuracy.
- XPS Film Measurement in Small Boxes Using Multi-Spot Deconvolution
Multiple XPS spot sizes separate box and surrounding signals, improving thin film thickness and composition measurement in small bore structures.
- Movable X-Ray Detector Array for Super-Resolution CT Imaging
Sub-pixel detector motion and image merging boost CT spatial resolution and SNR while maintaining or reducing x-ray dose.
- High-Z Coating for Semiconductor Profile Scan Contrast
Applying a high atomic number coating boosts backscattered electron contrast, enabling accurate critical dimension measurement of buried wafer structures.