Optically Investigating Flaws/Contamination TRIZ Cases

A modular inspection module uses airflow and solenoids to divert defective tablets during continuous manufacturing.

A thermal welding device measures sealed portion thickness to verify resin package seal integrity.

Motorized belts compress flexible containers to maintain a geometric head space, allowing tunable light absorption measurements at high line speeds.

Digital imaging and optical analysis evaluate capsule filling contours to ensure precise 100% quality assurance.

Variable current control enables multi-directional imaging across defect types, increasing detection versatility without adding hardware complexity.

Multi-angle illumination and rotating support enable precise defect visualization in pharmaceutical cylindrical containers.

A semiconductor defect inspection apparatus uses obliquely incident excitation light converted to specific polarization states for photoluminescence imaging.

A container inspection system uses multiple radiation sources and a mirror assembly to capture simultaneous images from different angles.

A surface inspection apparatus measures diffracted and scattered light intensities to determine foreign matter adhering conditions on specular surfaces.

Multi-modal optical scanning detects coating and substrate defects while managing device complexity through segmented sensing modalities.

Luminescent tags bind to wafer defects and emit light, overcoming weak scattering limits to enable 1-2 nm detection.

A portable inspection device guides operators through visual alignment regions and active lighting adjustments for accurate measurements.

Vibration generator unit transmits mechanical oscillation to a solid immersion lens holder main body.

Auxiliary optics transform screen patterns to resolve accuracy versus speed trade-offs.

Aligning optical modes to design data improves signal box placement accuracy, resolving overlay errors near memory device edges.

Polarized illumination filters ambient glare to reduce false detections and enable faster scanning speeds in machine vision systems.

Computational deconvolution extracts target signals from diffraction contamination, enabling precise metrology within reduced box sizes.

A superluminescent diode generates linear light to measure strip surface geometry.

Light detection replaces visual inspection for curved paths, ensuring adequate refrigerant supply and preventing foreign matter accumulation.

A radiation detector measures characteristic test radiation projected onto containers to verify inspection device function.

Automated optical inspection replaces manual checks for cylindrical metal parts, enabling high-speed defect detection through borosilicate guide tubes.

A rotating lens array divides laser beams into multiple sub-beams to generate a scanning point light source.

Simultaneous multi-wavelength LED illumination detects scratches and dings on metallic lids, eliminating sequential processing delays.

Multiple imaging devices capture product images from different orientations, resolving low manual inspection efficiency.

A cholesteric liquid crystal polymer electro-optic modulator provides precise surface quality and efficient electric field transmission.

A connector inspector integrates pivoting joints and biasing springs to shift a microscope imaging axis in two dimensions for multi-fiber inspection.

A near-infrared inspection device selects dense spectral data groups to identify objects in blister packaging.

A metrology method determines overlay error by extracting systematic errors from apparent measurements on lithographic substrates.

Segmented inspection and pattern grouping reduce manual review time while maintaining systematic defect detection accuracy.

A mobile scanning booth uses hybrid active stereo and deflectometry to acquire precise surface data.

An automated optical inspection apparatus captures bright field and dark field images of transmissive lenses using adjustable illumination modules.

Segmented lighting and reflective mirrors overcome high light absorption on dark labels, ensuring clear imaging of surface defects.

Segmenting light collection into lateral and longitudinal paths balances focal depth with sensitivity for high-speed substrate inspection.

Calculating the optimal central transmissive region dimension at minimal beam deformation maximizes peripheral light collection efficiency.

A camera assembly records moving wafers using controlled continuous illumination and limited exposure time to maintain high resolution.

Automated optical modules detect foreign materials and surface defects in moving straw sheets for precise quality control.

Pulsed UV laser generates photoluminescence signals from polysilicon layers, avoiding thermal damage while maintaining high detection sensitivity.

A placing table with a transparent surface and an irradiation part emits planar light toward the inspection target object.

Radial laser arrays replace contact probes to eliminate wear and speed up measurement cycles while capturing thread geometry via optical reflection.

Modulated laser pulses illuminate particles to generate mixed signals that classify position and velocity while suppressing environmental interference.

Segmented LED arrays coupled with aberration-corrected cylindrical optics resolve poor far field uniformity in machine vision inspection.

A dual supporting structure with high transmittance and reflectance materials enables precise pollutant detection in optical inspection systems.

An optical film attachment system uses auxiliary conveyance paths to divert panels between inspection units and downstream devices.

A semiconductor inspection system segregates edge and center dies to apply distinct detection parameters.

A tunable light source interferometer generates interference patterns to determine distances between reference and raised surface features.

Adjustable apodization elements reduce diffraction artifacts and noise levels in unpatterned wafer regions while maintaining light collection efficiency.

Circular calibration sample uses intentional defects in a grid pattern to establish precise coordinate references.

Tunable diode laser absorption spectroscopy detects gas concentration through flexible container walls, enabling non-destructive integrity verification.