Optically Investigating Flaws/Contamination TRIZ Cases

Transparent transmission plate presses stacked iron cores to align surfaces perpendicular to the optical axis for accurate imaging.

Automated optical inspection tool captures series of images at varying focal depths using adaptive optics and video microscope unit.

Segmenting laser beams via diffraction gratings resolves the contradiction between measurement precision and inspection speed for semiconductor wafers.

A magnifying imaging optical unit uses displaceable mirrors to adjust magnification values between 100 and 200 for EUV mask inspection.

Segmented emitter groups provide dynamic illumination angles without mechanical movement, enabling rapid high-contrast image combination.

A wafer inspection method generates test and reference images from scanned frame data to enable precise cell-to-cell comparison for defect identification.

A scanning device with a 2D line scanner generates 3D image data of conduit interiors.

Dual-angle light detection separates scattered particle signals from pattern diffraction, reducing erroneous detection on complex substrates.

A telecentric lens unit with a central reflector captures base portion images to calculate bottle top inclination during rotation.

Adjustable light source device simulates scattered optical signals for photodetector calibration.

Multi-angle light detection separates scattered signals from regular reflection to classify surface anomalies on magnetic disks.

Replacing manual inspection, this optical system detects panel defects by analyzing brightness differences through polarized light and digital imaging.

A ground glass panel arrangement with a frosted surface touching a non-frosted panel reduces light loss and enhances luminous efficacy.

Simultaneous multi-wavelength detection via high numerical aperture lenses eliminates sequential scanning delays while maintaining measurement precision.

Vertical container positioning enables sequential multi-angle illumination that detects cracks without stopping the production line.

A beam distributor combines non-mutually coherent laser pulses into composite output beams directed to specific inspection regions.

An array of light sources illuminates a sample surface sequentially from varying directions to enhance shadow contrast.

Polarization modulation distinguishes short-circuit defects from edge roughness below the optical resolution limit.

Counter-rotational mirrors compensate for stage movement to maintain image sharpness while increasing throughput in semiconductor inspection systems.

A structured light inspection tool projects patterns onto cylindrical surfaces to generate 3D profiles for defect detection.

A portable inspection device uses a camera and evaluation unit to determine quality parameters of processed sheets.

An electron gun cracks hydrocarbons on a substrate to prevent carbon deposition on reflective optical elements, maintaining reflectivity.

A line camera detects bottle edges using parallel light generated by a collimator to produce distortion-free shadow images.

A converging optical system with a divided aperture lens group forms multiple images on a matrix detector to capture scattered light from semiconductor samples.

A defect inspection apparatus detects haze in reticle non-pattern areas using scattered light signals.

Merged optical sensors detect bottle rotation in a control unit, reducing sensor count and manufacturing costs.

A field stop isolates the region where all light sources overlap, eliminating measurement errors caused by inconsistent yarn path stability.

An adaptive diffuse illumination system disperses specular light to create uniform profiles on curved unit under test surfaces.

A silicon carbide inspection apparatus uses ultraviolet illumination to generate photoluminescence images alongside reflected light images for defect detection.

A rack with stacked detection, loading, and discharge channels moves qualified cases into packaging boxes via a transfer device.

A defect tracking system standardizes inspection reports into a common reference frame for accurate comparison.

A laser bond inspection system directs a low-power beam to a target patch for precise aiming.

Segmented illumination expands the range of imageable inclination angles, resolving trade-offs between device complexity and adaptability.

Tapered light director elements eliminate mirror reflections from adjacent containers, enabling accurate defect detection on cylindrical surfaces.

Designing dome light and coaxial light optical systems eliminates image capturing non-uniformity on high-gloss objects with complex shapes.