Thermoelectric Device Junction Materials TRIZ Cases
- Semiconductor Fin Energy Harvesting via Seebeck Effect
Retained semiconductor fins exploit the Seebeck effect to convert waste heat from active circuits into supplemental power, reducing overall device consumption.
- Thermoelectric Materials Decoupling Conductivity via Composite Coatings
Composite structures decouple electronic and thermal conductivity to achieve figure of merit greater than 2, overcoming bulk material limitations.
- R1-xMnxCuP Phosphide Thermoelectric Materials for Medium-Temperature Energy Conversion
R1-xMnxCuP phosphide compounds convert heat to electricity using magnesium, manganese, copper, and phosphorus elements.
- Thermoelectric Material Composition for High-Temperature Stability
Optimized filled skutterudite composition resists element sublimation at 600°C while maintaining high conversion efficiency.
- OLED Power Interconnection Structure Prevents Film Separation
A stacked power interconnection line without insulating layers stabilizes opposite electrode contacts in organic light-emitting displays.
- Thermoelectric Composite Material with Nano-Carbon Units
Nano-carbon units spaced in a thermoelectric matrix boost the ZT value by obstructing phonon transmission to improve energy conversion efficiency.