A method and system for adjusting a silicon-based resonant device based on image recognition
Through image recognition technology, the camera calibration and microstructure recognition of silicon-based resonant devices are performed, and the center of the laser spot is positioned, which solves the problem of low adjustment accuracy and efficiency of silicon-based resonant devices, and realizes high-precision automated laser adjustment.
CN115272221BActive Publication Date: 2025-07-29PEKING UNIV
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Patent Information
- Application Number
- CN202210875580.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-07-25
- Publication Date
- 2025-07-29
- Estimated Expiration
- 2042-07-25
AI Technical Summary
Technical Problem
The laser adjustment of existing silicon-based resonant devices has complex microstructure, large processing errors, and high positioning difficulties, resulting in low adjustment accuracy and low batch efficiency.
Method used
The camera calibration is performed based on image recognition, identify the microstructure type, measure the size, locate the laser spot center, plan the processing route, and realize automatic laser adjustment.
Benefits of technology
It improves the adjustment accuracy and efficiency of silicon-based resonant devices, reduces the impact of image distortion on processing accuracy, and realizes high-precision automatic positioning and processing.
✦ Generated by Eureka AI based on patent content.
Abstract
An embodiment of the present invention provides a method and system for adjusting a silicon-based resonant device based on image recognition, which reduces the influence of image distortion on the accuracy of image processing through a camera calibration method; calculates the center position of the laser spot by using an adaptive threshold segmentation method and a gray center-of-gravity method; quickly identifies the microstructure in the silicon-based resonant device through a shape matching algorithm; accurately measures the relevant dimensions of the microstructure by using a Hough detection algorithm; the image processing system serves as the feedback for motion control and laser processing, and the frequency detection circuit serves as the feedback for adjusting the performance of the silicon-based resonant device, and cooperatively controls the motion parameters of the four-axis motion platform and the energy parameters of the ultrafast pulsed laser, thereby realizing the automatic and precise trimming of the structural dimensions of the silicon-based resonant device. The present invention has the advantages of controllable trimming method, high adjustment accuracy, high adjustment efficiency, etc., and is applicable to the batch manufacturing of high-performance silicon-based resonant devices.
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