Manufacturing method of display panel, display panel and display device

Abstract

Embodiments of the present application provide a manufacturing method of a display panel, the display panel and a display device, and relate to the technical field of display, and improve the transfer precision of light emitting elements. The manufacturing method comprises the following steps: providing a back plate; forming a bonding part on the back plate, the back plate comprising a first area and a second area surrounding the first area, and the bonding part being located in the first area; forming an auxiliary layer covering the back plate and the bonding part on the back plate, the auxiliary layer comprising a first part located in the first area and a second part located in the second area; releasing a light emitting element on the auxiliary layer, so that an electrode of the light emitting element is in contact with the first part to form a temporary back plate; placing the temporary back plate in a first preset condition, and under the first preset condition, the fluidity of the first part is greater than that of the second part; bonding the electrode and the bonding part to form a eutectic bonding layer, and placing the temporary back plate in a second preset condition, so that the first part forms a solid first part, and the second part forms a solid second part.

Description

[Technical Field]

[0001] This invention relates to the field of display technology, and in particular to a method for manufacturing a display panel, the display panel itself, and a display device. [Background Technology]

[0002] In one manufacturing process of display panels, mass transfer technology is used to transfer light-emitting elements to a backplane. However, the current transfer accuracy of light-emitting elements is relatively low, which in turn affects the yield of display panels. [Summary of the Invention]

[0003] In view of this, embodiments of the present invention provide a method for manufacturing a display panel, a display panel, and a display device to improve the transfer accuracy of light-emitting elements.

[0004] On one hand, embodiments of the present invention provide a method for manufacturing a display panel, including:

[0005] Provide back panel;

[0006] A bonding portion is formed on the backplate, the backplate including a plurality of first regions and a second region surrounding the plurality of first regions, the bonding portion being located in the first regions;

[0007] An auxiliary layer is formed on the backplate, the auxiliary layer covering the backplate and the bonding portion, the auxiliary layer including a first portion located in the first region and a second portion located in the second region;

[0008] The light-emitting element is released onto the auxiliary layer, and the electrode of the light-emitting element is brought into contact with the first part to form a transient backplate;

[0009] The transient backplate is placed under a first preset condition, under which the fluidity of the first part is greater than that of the second part.

[0010] The electrode and the bonding portion are bonded to form a eutectic bonding layer, and the transient backplate is placed under a second preset condition, so that the first portion forms a solid first portion and the second portion forms a solid second portion.

[0011] On the other hand, embodiments of the present invention provide a display panel, including:

[0012] Back panel;

[0013] A eutectic bonding layer and an auxiliary layer are located on one side of the backplate. The auxiliary layer includes a first portion and a second portion, wherein at least a portion of the first portion surrounds the eutectic bonding layer, and the second portion surrounds the first portion.

[0014] The light-emitting element body is located on one side of the eutectic bonding layer, and the light-emitting element body is connected to the eutectic bonding layer.

[0015] Furthermore, embodiments of the present invention provide a display device, including the aforementioned display panel. One of the above-described technical solutions has the following beneficial effects:

[0016] In the technical solution provided by the embodiments of the present invention, by providing an auxiliary layer on the backplate, the position of the light-emitting element can be adjusted using the auxiliary layer, enabling the light-emitting element to achieve self-alignment. Specifically, the first part located in the first region and the second part located in the second region of the auxiliary layer have different fluidity under the first preset conditions. Therefore, when the transient backplate is placed under the first preset conditions, the first part can have higher fluidity, for example, the first part can be in a liquid state. When the first part flows, the molecules in its surface layer are subjected to a pulling force pointing inwards under the action of molecules inside the material and under the action of gas molecules, causing the material surface to have a tendency to contract. This surface tension acts on the electrodes of the light-emitting element, generating a force on the electrodes, thereby causing the light-emitting element to undergo a slight translation, pulling the light-emitting element into the preset area, enabling the light-emitting element to achieve self-alignment. At the same time, since the second part has lower fluidity under the first preset conditions, for example, the second part can be in a solid state, the second part can also act as a barrier layer to contain the flow of the first part, strengthening the effect of the first part on the light-emitting element and improving the self-alignment effect of the light-emitting element.

[0017] Therefore, by differentiating the material properties of different parts of the auxiliary layer under a first preset condition, the surface tension of the first part can be used to enable the light-emitting element to achieve self-alignment in the process of display panel manufacturing, thereby improving the transfer accuracy of the light-emitting element.

[0018] Furthermore, it should be noted that in the mass transfer process, the transfer accuracy and transfer efficiency of the light-emitting element are usually correlated: Currently, due to the influence of stability and temperature on the accuracy of the galvanometer during high-speed scanning, as well as the bottleneck of rapid switching of the stage position of the equipment platform, transfer efficiency is often sacrificed in order to achieve transfer accuracy. However, after improving the transfer accuracy of the light-emitting element in the embodiments of the present invention, the transfer efficiency can also be further improved to a certain extent. [Attached Image Description]

[0019] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 A flowchart illustrating a method for manufacturing a display panel according to an embodiment of the present invention;

[0021] Figure 2 A structural flowchart illustrating a method for manufacturing a display panel according to an embodiment of the present invention;

[0022] Figure 3 A top view of the backplate provided in an embodiment of the present invention;

[0023] Figure 4 A top view of the auxiliary layer provided in this embodiment of the invention before the first preset condition;

[0024] Figure 5 This is a schematic diagram of a film structure of a light-emitting element provided in an embodiment of the present invention;

[0025] Figure 6 This is a schematic diagram of a light-emitting element self-alignment provided in an embodiment of the present invention;

[0026] Figure 7 This is another structural flowchart of the method for manufacturing a display panel provided in an embodiment of the present invention;

[0027] Figure 8 This is a schematic diagram of the structure of the first region provided in an embodiment of the present invention;

[0028] Figure 9 This is another structural schematic diagram of the first region provided in an embodiment of the present invention;

[0029] Figure 10 This is another structural schematic diagram of the first region provided in an embodiment of the present invention;

[0030] Figure 11 This is another structural schematic diagram of the first region provided in an embodiment of the present invention;

[0031] Figure 12 This is another structural schematic diagram of the first region provided in an embodiment of the present invention;

[0032] Figure 13 This is another structural schematic diagram of the first region provided in an embodiment of the present invention;

[0033] Figure 14 Another flowchart illustrating the manufacturing method of the display panel provided in an embodiment of the present invention;

[0034] Figure 15 This is another structural flowchart of the method for manufacturing a display panel provided in an embodiment of the present invention;

[0035] Figure 16This is another structural flowchart of the method for manufacturing a display panel provided in an embodiment of the present invention;

[0036] Figure 17 This is another flowchart illustrating a method for manufacturing a display panel according to an embodiment of the present invention.

[0037] Figure 18 This is another structural flowchart of the method for manufacturing a display panel provided in an embodiment of the present invention;

[0038] Figure 19 This is another structural flowchart of the method for manufacturing a display panel provided in an embodiment of the present invention;

[0039] Figure 20 This is another structural flowchart of the method for manufacturing a display panel provided in an embodiment of the present invention;

[0040] Figure 21 This is a schematic diagram illustrating the configuration of a third region provided in an embodiment of the present invention;

[0041] Figure 22 Another top view of the auxiliary layer provided in the embodiments of the present invention before the first preset condition;

[0042] Figure 23 This is a schematic diagram of a backplate provided in an embodiment of the present invention;

[0043] Figure 24 This is another structural flowchart of the method for manufacturing a display panel provided in an embodiment of the present invention;

[0044] Figure 25 This is a schematic diagram of a display panel provided in an embodiment of the present invention;

[0045] Figure 26 This is a schematic diagram of another structure of the display panel provided in an embodiment of the present invention;

[0046] Figure 27 This is a schematic diagram of another structure of the display panel provided in an embodiment of the present invention;

[0047] Figure 28 This is a partial top view of the display panel provided in an embodiment of the present invention;

[0048] Figure 29 for Figure 28 A sectional view along the A1-A2 direction;

[0049] Figure 30 This is another partial top view of the display panel provided in an embodiment of the present invention;

[0050] Figure 31This is another partial top view of the display panel provided in an embodiment of the present invention;

[0051] Figure 32 This is yet another partial top view of the display panel provided in an embodiment of the present invention;

[0052] Figure 33 This is yet another partial top view of the display panel provided in an embodiment of the present invention;

[0053] Figure 34 This is yet another partial top view of the display panel provided in an embodiment of the present invention;

[0054] Figure 35 This is another structural schematic diagram of the display panel provided in an embodiment of the present invention;

[0055] Figure 36 This is a schematic diagram of another structure of the display panel provided in an embodiment of the present invention;

[0056] Figure 37 This is a schematic diagram of a display device provided in an embodiment of the present invention.

Detailed Implementation Methods

[0057] To better understand the technical solution of the present invention, the embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0058] It should be understood that the described embodiments are merely some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0059] The terminology used in the embodiments of this invention is for the purpose of describing particular embodiments only and is not intended to limit the invention. The singular forms “a,” “the,” and “the” as used in the embodiments of this invention and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0060] It should be understood that the term "and / or" used in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.

[0061] This invention provides a method for manufacturing a display panel, such as... Figures 1-4 As shown, Figure 1 This is a flowchart illustrating a method for manufacturing a display panel according to an embodiment of the present invention. Figure 2This is a structural flowchart of a method for manufacturing a display panel according to an embodiment of the present invention. Figure 3 This is a top view of the back plate 1 provided in an embodiment of the present invention. Figure 4 A top view of the auxiliary layer 5 provided in this embodiment of the invention before the first preset condition, the manufacturing method includes:

[0062] Step S1: Provide backplate 1.

[0063] Step S2: A bonding portion 2 is formed on a backplate 1. The backplate 1 includes a plurality of first regions 3 and a second region 4 surrounding the plurality of first regions 3. The bonding portion 2 is located in the first region 3.

[0064] In this embodiment, the bonding portion 2 is located in the first region 3, meaning the first region 3 covers the bonding portion 2. Taking the first region 3 covering one bonding portion 2 as an example, the bonding portion 2 includes multiple edges. For any given edge, an edge parallel to that edge, defined at a certain distance from it, can be considered an edge of the first region 3. See, for example... Figure 3 The bonding portion 2 is rectangular in shape, and the first region 3 is also rectangular in shape, with a certain distance between the edge of the first region 3 and the edge of the bonding portion 2 it covers.

[0065] Step S3: An auxiliary layer 5 is formed on the backplate 1, covering the backplate 1 and the bonding portion 2. The auxiliary layer 5 includes a first portion 6 located in the first region 3 and a second portion 7 located in the second region 4. The first region 3 can be defined by the first portion 6.

[0066] Step S4: Release the light-emitting element 8 onto the auxiliary layer 5, so that the electrode 9 of the light-emitting element 8 contacts the first part 6 to form a transient backplate 10.

[0067] The light-emitting element 8 can be an inorganic light-emitting diode, specifically a micro light-emitting diode, such as a micro LED or mini LED. The light-emitting element 8 can be mass-transferred from the source substrate or intermediate substrate onto the back plate 1. During release, the light-emitting element 8 can be released individually, for example, by using a laser to selectively release the light-emitting elements 8 located on the source substrate or intermediate substrate. Alternatively, multiple light-emitting elements 8 can be mass-transferred simultaneously, for example, by using a stamp transfer method, adjusting the adhesion of the film layer contacting the light-emitting element to release multiple light-emitting elements 8 simultaneously. For example, when the light-emitting element 8 includes red, green, and blue light-emitting elements, multiple red light-emitting elements 8 can be released onto the back plate 1 first, then multiple green light-emitting elements 8 can be released onto the back plate 1 first, and finally multiple blue light-emitting elements 8 can be released onto the back plate 1 first.

[0068] Step S5: Place the transient backplate 10 under the first preset condition. Under the first preset condition, the fluidity of the first part 6 is greater than that of the second part 7.

[0069] Step S6: Bond the electrode 9 and the bonding portion 2 to form a eutectic bonding layer 11, and place the transient backplate 10 under a second preset condition, so that the first portion 6 forms a solid first portion 12 and the second portion 7 forms a solid second portion 13. That is, in the final auxiliary layer 5, the auxiliary layer 5 includes the first portion 12 and the second portion 13.

[0070] In one embodiment of the present invention, a hot-press bonding process can be used to bond the electrode 9 of the light-emitting element 8 to the bonding portion 2. In the hot-press bonding process, the electrode 9 of the light-emitting element 8 is pressed down to contact the bonding portion 2, thereby bonding with the bonding portion 2 to form a eutectic bonding layer 11. Taking an example where the electrode 9 of the light-emitting element 8 is formed of metallic gold (Au) and the bonding portion 2 is formed of metallic indium (In), the eutectic bonding layer 11 formed after bonding can be an AuIn compound.

[0071] It should also be noted that, such as Figure 5 As shown, Figure 5 This is a schematic diagram of a film structure for a light-emitting element provided in an embodiment of the present invention. In addition to electrodes 9, the light-emitting element 8 may also include an n-type semiconductor 51, a p-type semiconductor 53, and an active layer 52 located between the n-type semiconductor 51 and the p-type semiconductor 53. The electrodes 9 of the light-emitting element 8 may include a positive electrode 54 and a negative electrode 55, wherein the positive electrode 54 is electrically connected to the p-type semiconductor 53, and the negative electrode 55 is electrically connected to the n-type semiconductor 51.

[0072] Before bonding the electrode 9 and the bonding portion 2 of the light-emitting element 8, the electrode 9 and the bonding portion 2 are independent of each other. However, after bonding the electrode 9 and the bonding portion 2, the electrode 9 and the bonding portion 2 will bond to form a eutectic bonding layer 11. At this time, the part of the light-emitting element 8 other than the electrode 9 can be defined as the main body portion 21 of the light-emitting element. For example, the main body portion 21 of the light-emitting element may specifically include the above-mentioned n-type semiconductor 51, active layer 52 and p-type semiconductor 53 and other structures.

[0073] In the prior art, after the light-emitting element 8 is released from the source substrate or intermediate substrate onto the back plate 1, the electrode 9 of the light-emitting element 8 is directly bonded to the bonding portion 2. However, considering the influence of factors such as alignment deviation, the position of the light-emitting element 8 on the back plate 1 may deviate from its preset area, resulting in the electrode 9 of the light-emitting element 8 not being directly aligned with its corresponding bonding portion 2, which in turn affects the connection reliability when the electrode 9 is subsequently bonded to the bonding portion 2.

[0074] In the manufacturing method provided in this embodiment of the invention, by providing an auxiliary layer 5 on the back plate 1, the position of the light-emitting element 8 can be adjusted using the auxiliary layer 5, enabling the light-emitting element 8 to achieve self-alignment. Specifically, the first part 6 located in the first region 3 and the second part 7 located in the second region 4 of the auxiliary layer 5 have different fluidity under the first preset conditions. Therefore, when the transient back plate 10 is placed under the first preset conditions, the first part 6 can have higher fluidity; for example, the first portion 12 can be in a liquid state. At this time, as... Figure 6 As shown, Figure 6 This is a schematic diagram illustrating the self-alignment of the light-emitting element 8 provided in an embodiment of the present invention. When the first part 6 flows, the molecules within its surface layer are subjected to a pulling force pointing inwards from the molecules inside the material and the gas molecules, causing the material surface to tend to contract. This surface tension acts on the electrode 9 of the light-emitting element 8, generating a force F on the electrode 9, which in turn causes the light-emitting element 8 to undergo a slight translation, pulling it into a preset area, thus enabling the light-emitting element 8 to achieve self-alignment. Simultaneously, because the second part 7 has low fluidity under the first preset conditions (for example, the second part 7 can be solid), it can also act as a barrier layer to contain the flow of the first part 6, strengthening the effect of the first part 6 on the light-emitting element 8 and improving the self-alignment effect of the light-emitting element 8.

[0075] Therefore, by differentiating the material properties of different parts of the auxiliary layer 5 under the first preset condition, the surface tension of the first part 6 can be used to enable the light-emitting element 8 to achieve self-alignment in the process of manufacturing the display panel, thereby improving the transfer accuracy of the light-emitting element 8.

[0076] Furthermore, it should be noted that during mass transfer, the transfer accuracy and transfer efficiency of the light-emitting element 8 are usually correlated: Currently, due to the influence of stability and temperature on the accuracy of the galvanometer during high-speed scanning, as well as the bottleneck of rapid switching of the stage position of the equipment platform, transfer efficiency is often sacrificed in order to achieve transfer accuracy. However, after improving the transfer accuracy of the light-emitting element 8 in the embodiments of the present invention, the transfer efficiency can also be further improved to a certain extent.

[0077] Furthermore, in this embodiment of the invention, the first portion 12 refers to the solid structure ultimately formed by the material of the first portion 6 after the display panel manufacturing process is completed, and the second portion 13 refers to the solid structure ultimately formed by the material of the second portion 7 after the display panel manufacturing process is completed. It is understood that the initial form of the first portion 6, the form of the first portion 6 under the first preset conditions, and the form of the first portion 12 may be different; similarly, the initial form of the second portion 7, the form of the second portion 7 under the first preset conditions, and the form of the second portion 13 may also be different.

[0078] In one feasible implementation, such as Figure 7 and Figure 8 As shown, Figure 7 This is another structural flowchart of the method for manufacturing a display panel provided in an embodiment of the present invention. Figure 8 This is a schematic diagram of a first region 3 provided in an embodiment of the present invention. The back plate 1 has multiple light-emitting element preset regions 14, each light-emitting element preset region 14 being used to set a light-emitting element 8. The area of ​​the light-emitting element preset region 14 can be the same as the area of ​​the orthographic projection of the light-emitting element 8 onto the back plate 1. In this embodiment of the present invention, the multiple first regions 3 can correspond one-to-one with the multiple light-emitting element preset regions 14.

[0079] The light-emitting element preset area 14 includes multiple edges. For any given edge, an edge parallel to that edge, defined at a certain distance from it, can be considered an edge of the first area 3. For example, see... Figure 8 The shape of the light-emitting element preset area 14 is rectangular, and the shape of the first area 3 is also rectangular.

[0080] In the above configuration, one first region 3 corresponds to one light-emitting element 8, that is, one first part 6 corresponds to one light-emitting element 8. Therefore, when the transient backplate 10 is subsequently placed under the first preset condition, the flow of one first part 6 only acts on the electrode 9 of one light-emitting element 8. The surface tension of the first part 6 during flow will be more conducive to pulling the corresponding light-emitting element 8 into the light-emitting element preset region 14, so that the final position of the light-emitting element 8 coincides with the light-emitting element preset region 14, thereby improving the transfer accuracy of the light-emitting element 8.

[0081] Furthermore, in one setup, see again... Figure 8The first region 3 covers the corresponding light-emitting element preset region 14, and the geometric center O1 of the first region 3 can coincide with the geometric center O2 of the corresponding light-emitting element preset region 14. At this time, after the auxiliary layer 5 is formed, the geometric center of the first part 6 also coincides with the geometric center O2 of the light-emitting element preset region 14. The surface tension of the first part 6 has a more uniform effect on the light-emitting element 8 in all directions, which is more conducive to the self-alignment of the light-emitting element 8.

[0082] In one feasible implementation, combined with Figure 2 and Figure 9 , Figure 9 This is another structural schematic diagram of the first region 3 provided in an embodiment of the present invention, wherein multiple first regions 3 correspond one-to-one with multiple bonding portions 2.

[0083] The bonding portion 2 includes multiple edges. For any given edge, an edge parallel to that edge, defined at a certain distance from it, can be considered an edge of the first region 3. For example, see... Figure 9 The bonding part 2 is rectangular in shape, and the first region 3 is also rectangular in shape.

[0084] It is understood that the electrode 9 of the light-emitting element 8 includes a positive electrode and a negative electrode, with the positive electrode corresponding to a bonding portion 2 and the negative electrode corresponding to a bonding portion 2. In the above configuration, when a first region 3 corresponds to a bonding portion 2, when the transient backplate 10 is subsequently placed under the first preset condition, the flow of a first portion 6 only acts on one positive electrode or one negative electrode of the light-emitting element 8. The surface tension of the first portion 6 during flow is more conducive to pulling the corresponding positive electrode or negative electrode to face the bonding portion 2, thereby making the final setting position of the light-emitting element 8 coincide with the preset region 14 of the light-emitting element.

[0085] Furthermore, based on the above configuration, after the auxiliary layer 5 is formed, a second portion 7 is spaced between two adjacent bonding portions 2. Subsequently, when the transient backplate 10 is placed under the first preset condition, the second portion 7 can restrict the movement of the positive and negative electrodes of the light-emitting element 8 to a certain extent, preventing the positive electrode of the light-emitting element 8 from moving to the bonding portion 2 that should be in contact with the negative electrode or preventing the negative electrode of the light-emitting element 8 from moving to the bonding portion 2 that should be in contact with the negative electrode, thereby effectively reducing the risk of short circuit between the positive and negative electrodes of the light-emitting element 8.

[0086] Furthermore, in one setup, see again... Figure 9The first region 3 covers its corresponding bonding portion 2, and the geometric center O1 of the first region 3 can coincide with the geometric center O3 of its corresponding bonding portion 2. At this time, after the auxiliary layer 5 is formed, the geometric center of the first part 6 also coincides with the geometric center of the bonding portion 2. The surface tension of the first part 6 has a more uniform effect on the electrode 9 of the light-emitting element 8 in all directions, which is more conducive to the self-alignment of the light-emitting element 8.

[0087] In one feasible implementation, see again Figure 8 and Figure 9 The first region 3 covers the bonding portion 2, for example, covering one bonding portion 2 or covering two bonding portions 2 in a light-emitting element preset region 14. The distance between the edge of the first region 3 and the edge of the bonding portion 2 it covers is d, where 3μm≤d<30μm.

[0088] exist Figure 8 and Figure 9 In the first region 3, the distance d between the edge extending along the first direction x in the first region 3 and the edge extending along the first direction x in the bonding part 2 is represented by d1, and the distance d between the edge extending along the second direction y in the first region 3 and the edge extending along the first direction x in the bonding part 2 is represented by d2. 3μm≤d1<30μm and 3μm≤d2<30μm. d1 and d2 can be equal or unequal.

[0089] Considering factors such as process precision, the actual placement of the bonding portion 2 may be slightly offset. By setting the minimum distance between the edge of the first region 3 and the edge of the bonding portion 2 it covers to 3 μm, the bonding portion 2 can remain within the first region 3 even with slight offset. This allows the first portion 6 to cover the bonding portion 2 during the subsequent formation of the auxiliary layer 5. Furthermore, by setting the maximum distance between the edge of the first region 3 and the edge of the bonding portion 2 it covers to within 30 μm, the area of ​​the first region 3 can be prevented from becoming too large, thus enhancing the effect of the flow of the first portion 6 on the light-emitting element 8.

[0090] In one feasible implementation, see again Figure 8 and Figure 9 The shape of the first region 3 can be rectangular. Or, as shown below... Figure 10 and Figure 11 As shown, Figure 10 This is another structural schematic diagram of the first region 3 provided in an embodiment of the present invention. Figure 11 This is another structural schematic diagram of the first region 3 provided in an embodiment of the present invention. The shape of the first region 3 can also be a rounded rectangle. Alternatively, as shown below... Figure 12 and Figure 13 As shown, Figure 12This is another structural schematic diagram of the first region 3 provided in an embodiment of the present invention. Figure 13 This is another structural schematic diagram of the first region 3 provided in an embodiment of the present invention. The shape of the first region 3 can also be circular or elliptical.

[0091] In the above configuration, the first region 3 has a regular shape, and when the first part 6 flows, the surface tension of the first part 6 does not vary much in its effect on the light-emitting element 8 in all directions, which is more conducive to achieving self-alignment of the light-emitting element 8.

[0092] Furthermore, when one first region 3 corresponds to one preset region 14 of a light-emitting element, see again... Figure 8 If the first region 3 is rectangular, the long side of the first region 3 is parallel to the long side of the preset region 14 of the light-emitting element; see again Figure 12 If the first region 3 is elliptical, the long diameter of the first region 3 is parallel to the long side of the light-emitting element preset region 14, so as to avoid the first region 3 occupying a large space in the short side direction of the light-emitting element preset region 14, and to achieve a reasonable division of the position of the first region 3.

[0093] When one first region 3 corresponds to one bonding part 2, see again Figure 9 If the first region 3 is a rectangle, and the long side of the first region 3 is parallel to the long side of the bonding part 2, see again. Figure 13 If the first region 3 is elliptical, the major diameter of the first region 3 is parallel to the long side of the bonding part 2, so as to avoid the first region 3 occupying a large space in the direction of the short side of the bonding part 2, and to achieve a reasonable division of the position of the first region 3.

[0094] In one feasible implementation, such as Figure 14 and Figure 15 As shown, Figure 14 This is another flowchart illustrating a method for manufacturing a display panel according to an embodiment of the present invention. Figure 15 This is another structural flowchart of the method for manufacturing a display panel provided in an embodiment of the present invention. Step S3 may specifically include:

[0095] Step S31: Apply photoresist 15 to the backplate 1 to form a coating covering the backplate 1 and the bonding portion 2.

[0096] Step S32: Do not expose the photoresist in the first region 3. Use the unexposed photoresist (for clarity, the unexposed photoresist is indicated by reference numeral 15_1 in the attached figure) to form the first part 6. Expose the photoresist in the second region 4. Use the exposed photoresist (for clarity, the exposed photoresist is indicated by reference numeral 15_2 in the attached figure) to form the second part 7.

[0097] in, Figure 15 The light shown in step S32 is a schematic diagram of the light after passing through the photomask. During the exposure process, a photomask is placed above the photoresist. Before passing through the photomask, the light density is the same at all positions. However, after passing through the photomask, only the light in the second region 4 can be emitted, so that only the photoresist in the second region 4 is exposed.

[0098] Based on this, the process of placing the transient backplate 10 under the first preset conditions includes: heating the transient backplate 10 to a first preset temperature range, wherein, within the first preset temperature range, the viscosity of the unexposed photoresist 15_1 is less than the viscosity of the exposed photoresist 15_2.

[0099] The process of placing the transient backplate 10 under the second preset conditions includes: heating the transient backplate 10 to a second preset temperature range, wherein, within the second preset temperature range, the unexposed photoresist 15_1 is solid to form the first portion 12, and the exposed photoresist 15_2 is solid to form the second portion 13.

[0100] In the above configuration, both the first part 6 and the second part 7 are formed using photoresist material. Photoresist itself has viscosity. When unexposed, it does not undergo a cross-linking reaction and harden. Within a certain temperature range, the viscosity of the photoresist decreases as the temperature increases, thus exhibiting high fluidity. However, after exposure, the photoresist hardens due to a cross-linking reaction and remains in a solidified state after heating, exhibiting very low or even no fluidity. This ensures that the fluidity of the first part 6 and the second part 7 meets the design requirements.

[0101] Furthermore, since the first part 6 and the second part 7 are formed using the same material, when the photoresist covering the back plate 1 and the bonding part 2 is coated on the back plate 1, the upper surface of the entire photoresist layer facing away from the back plate 1 can be flat. This can reduce the undulation of the upper surface of the first part 6 and the upper surface of the second part 7. When the light-emitting element 8 is subsequently released onto the auxiliary layer 5, the placement stability of the light-emitting element 8 can be improved, and its tilting can be avoided.

[0102] It should be noted that, in the embodiments of the present invention, the electrodes 9 and bonding portions 2 of the light-emitting element 8 can be bonded using a hot-press bonding process. Since the hot-press bonding process also requires a high-temperature environment, the operation of heating the transient backplate 10 to the second preset temperature range can be performed simultaneously with the hot-press bonding process. That is, during the bonding process of the electrodes 9 and bonding portions 2 of the light-emitting element 8, the transient backplate 10 can be kept within the second preset temperature range, thereby making the unexposed photoresist solid to form the first portion 12, and the exposed photoresist solid to form the second portion 13.

[0103] Furthermore, it should be noted that when the photoresist in the second region 4 is exposed, the light source illuminates this part of the photoresist from top to bottom (from the auxiliary layer 5 to the back plate 1). Therefore, the cross-linking reaction of the photoresist in the second region 4 during the exposure process is from top to bottom. However, when the transient back plate 10 is heated to the second preset temperature range, the cross-linking reaction of the photoresist in the first region 3 is from bottom to top (from the back plate 1 to the auxiliary layer 5). If the two parts of the photoresist do not react completely in their respective cross-linking reactions, the composition of the first part 12 and the second part 13 that are finally formed may be different.

[0104] Furthermore, the minimum temperature value in the first preset temperature range is 80℃, the maximum temperature value in the first preset temperature range is 120℃, and the minimum temperature value in the second preset temperature range is 150℃.

[0105] For photoresist that has not undergone exposure treatment, heating it to about 80℃~120℃ will result in high fluidity, which can meet its fluidity requirements. When further heated to above 150℃, the photoresist that has not undergone exposure treatment will be cured to form a solid first part 12, thereby fixing the position of the eutectic bonding layer 11.

[0106] Furthermore, when applying photoresist to the backplate 1, the coating temperature of the second region 4 is lower than that of the first region 3.

[0107] By controlling the coating temperature of the first region 3 and the second region 4, the thickness of the photoresist formed in the first region 3 and the second region 4 can be adjusted. In an embodiment of the present invention, as... Figure 16 As shown, Figure 16 This is another structural flowchart of the display panel manufacturing method provided in the embodiment of the present invention. By lowering the coating temperature of the second region 4, the thickness of the photoresist formed in the second region 4 can be increased. This makes the upper surface of the photoresist (second part 7) in the second region 4 facing away from the back plate 1 higher than the upper surface of the photoresist (first part 6) in the first region 3 facing away from the back plate 1. This reduces the risk of overflow when the photoresist (first part 6) in the first region 3 flows.

[0108] In one feasible implementation, such as Figure 17 and Figure 18 As shown, Figure 17 This is another flowchart illustrating the method for manufacturing a display panel according to an embodiment of the present invention. Figure 18 This is another structural flowchart of the method for manufacturing a display panel provided in an embodiment of the present invention. Step S3 may specifically include:

[0109] Step S31': A first colloid 16 is formed in the first region 3, and the first part 6 is formed using the first colloid 16.

[0110] Step S32': A second colloid 17 is formed in the second region 4, and the second part 7 is formed using the second colloid 17.

[0111] Based on this, the process of placing the transient backplate 10 under the first preset condition includes: applying an external force to the transient backplate 10, wherein when an external force is applied to the transient backplate 10, the thixotropy of the first colloid 16 is greater than the thixotropy of the second colloid 17.

[0112] The process of placing the transient backplate 10 under the second preset condition includes: stopping the application of external force to the transient backplate 10, allowing the transient backplate 10 to stand still, the first colloid 16 solidifying to form the first portion 12, and the second colloid 17 solidifying to form the second portion 13.

[0113] The first colloid 16 can be a highly thixotropic epoxy colloid, and the second colloid 17 can be a low-thixotropic epoxy colloid.

[0114] Under external force, the first colloid 16 and the second colloid 17 can become a sol with a certain degree of fluidity, and after being left to stand for a period of time, they gradually return to their original gel state. When external force is applied, the first colloid 16 has greater thixotropy, and therefore the first colloid 16 has higher fluidity, which allows the self-alignment of the light-emitting element 8 to be achieved by utilizing the flow of the first colloid 16.

[0115] It should be noted that the first colloid 16 and the second colloid 17 can be formed using different patterning processes, therefore the upper surface of the first colloid 16 on the side opposite to the back plate 1 and the upper surface of the second colloid 17 on the side opposite to the back plate 1 may not be flush. For example, as... Figure 19 As shown, Figure 19 This is another structural flowchart of the method for manufacturing a display panel provided in the embodiment of the present invention. The upper surface of the second colloid 17 facing away from the back plate 1 can be higher than the upper surface of the first colloid 16 facing away from the back plate 1. In this way, when the transient back plate 10 is subsequently subjected to external force conditions, the risk of the first colloid 16 flowing out and overflowing can be reduced.

[0116] Furthermore, it should be noted that when bonding the electrode 9 and bonding portion 2 of the light-emitting element 8 using the hot-press bonding process, since the transient backplate 10 does not need to be shaken, the operation of keeping the transient backplate 10 stationary can be carried out simultaneously with the hot-press bonding process. That is, during the bonding process of the electrode 9 and bonding portion 2 of the light-emitting element 8, the transient backplate 10 can be kept stationary, thereby allowing the first colloid 16 to solidify to form the first portion 12 and the second colloid 17 to solidify to form the second portion 13.

[0117] In a feasible implementation of light emission, such as Figures 20-22 As shown, Figure 20 This is another structural flowchart of the method for manufacturing a display panel provided in an embodiment of the present invention. Figure 21 This is a schematic diagram illustrating one configuration of the third region 18 provided in an embodiment of the present invention. Figure 22 Another top view of the auxiliary layer 5 provided in the embodiment of the present invention before the first preset condition is provided. The back plate 1 also includes a plurality of third regions 18, the third regions 18 surround the first region 3, and the third regions 18 are located between the first region 3 and the second region 4.

[0118] When forming the auxiliary layer 5, the auxiliary layer 5 also includes a third part 19 located in the third region 18, wherein, under the first preset condition, the fluidity of the third part 19 is less than the fluidity of the first part 6 and greater than the fluidity of the second part 7.

[0119] When the transient backplate 10 is placed under the second preset condition, the third part 19 forms a solid third portion 20.

[0120] When the backplate 1 is placed under the first preset condition, the flowability of the third part 19 is between that of the first part 6 and the second part 7. The third part 19 can act as a transition buffer for the flow of the first part 6, weakening the blocking force exerted by the second part 7 on the first part 6, thereby weakening the influence of the force on the flow of the first part 6.

[0121] In one feasible implementation, under a first preset condition, the first part 6 is in a liquid state and the second part 7 is in a solid state. Under this condition, the first part 6 has higher fluidity and greater surface tension, which better drives the light-emitting element 8 to achieve self-alignment. Simultaneously, the second part 7 is solid and does not flow, effectively containing the flow of the first part 6 and further enhancing its effect on the light-emitting element 8.

[0122] In one feasible implementation, see again Figure 18 When the auxiliary layer 5 is formed, the upper surface of the first part 6 on the side away from the back plate 1 and the upper surface of the second part 7 on the side away from the back plate 1 are flush. When the light-emitting element 8 is subsequently released onto the auxiliary layer 5, the stability of the light-emitting element 8 can be improved and its tilting can be avoided.

[0123] In one feasible implementation, see again Figure 16 and Figure 19When the auxiliary layer 5 is formed, the distance between the upper surface of the first part 6 away from the back plate 1 and the back plate 1 is less than the distance between the upper surface of the second part 7 away from the back plate 1 and the back plate 1. At this time, the upper surface of the second part 7 is higher than the upper surface of the first part 6, which can reduce the risk of the first part 6 overflowing when the first part 6 flows subsequently.

[0124] It should be noted that, in conjunction with the foregoing, in one configuration, both the first part 6 and the second part 7 are photoresist. When coating the photoresist on the backplate 1, the upper surface of the second part 7 can be made higher than the upper surface of the first part 6 by controlling the first region 3 and the second region 4 to have different coating temperatures. Alternatively, in another configuration, the first part 6 is a first colloid 16, and the second part 7 is a second colloid 17. The first colloid 16 and the second colloid 17 can be formed through different patterning processes to achieve the same result, where the upper surface of the second part 7 is higher than the upper surface of the first part 6.

[0125] In addition, it should be noted that, such as Figure 23 and Figure 24 As shown, Figure 23 This is a schematic diagram of a backplate structure provided in an embodiment of the present invention. Figure 24 This is another structural flowchart of the method for manufacturing a display panel provided in an embodiment of the present invention. The backplate 1 may further include a substrate 60, a circuit layer 61, and backplate electrodes 23. The circuit layer 61 includes a buffer layer 63, a semiconductor layer 64, a gate insulating layer 65, a first metal layer 66, a first interlayer insulating layer 67, a second metal layer 68, and a planarization layer 69 stacked on the substrate 60. The semiconductor layer 64 is used to form structures such as the active layer p of the transistor 70; the first metal layer 66 is used to form structures such as the gate g of the transistor 70; and the second metal layer 68 is used to form structures such as the first electrode s of the transistor 70, the second electrode d of the transistor 70, and the negative power signal line 71.

[0126] The backplane electrode 23 is located on the side of the circuit layer 61 facing away from the substrate 60. In one configuration, the backplane electrode 23 includes a first backplane electrode 72 and a second backplane electrode 73. The first backplane electrode 72 is electrically connected to the second electrode d of the transistor 70 and is used to receive the driving voltage transmitted to it by the transistor 70. The second backplane electrode 73 is electrically connected to the negative power supply signal line 71 and is used to receive the negative power supply voltage transmitted to it by the negative power supply signal line 71.

[0127] When forming the bonding portion 2, the bonding portion 2 is located on one side of the back plate electrode 23 and is in contact with the back plate electrode 23. The first region 3 can cover the back plate electrode 23 so that the subsequently formed first portion 6 has a larger volume, thereby increasing the effect of the flow of the first portion 6 on the light-emitting element 8.

[0128] Based on the same inventive concept, embodiments of the present invention also provide a display panel, which can be manufactured by the above-described manufacturing method. In conjunction with... Figure 2 ,like Figure 25 As shown, Figure 25 This is a schematic diagram of a display panel provided in an embodiment of the present invention. The display panel includes a back plate 1, a eutectic bonding layer 11 and an auxiliary layer 5 located on one side of the back plate 1, and a light-emitting element main body 21 located on one side of the eutectic bonding layer 11.

[0129] The auxiliary layer 5 includes a first portion 12 and a second portion 13, wherein at least a portion of the first portion 12 surrounds the eutectic bonding layer 11, and the second portion 13 surrounds the first portion 12. The main body portion 21 of the light-emitting element is connected to the eutectic bonding layer 11, and the main body portion 21 of the light-emitting element may specifically include structures such as an epitaxial layer, a hole injection layer, an electron injection layer, a hole transport layer, an electron transport layer, and a light-emitting layer.

[0130] Based on the foregoing description of the display panel manufacturing method, in the display panel manufacturing process, when forming the auxiliary layer 5, specifically, a first portion 6 is formed in the first region 3, and then the first portion 6 is used to form the first sub-section 12; and a second portion 7 is formed in the second region 4, and then the second portion 7 is used to form the second sub-section 13. Since the material of the first sub-section 12 has high fluidity under the first preset conditions, the surface tension of the material flowing in the first sub-section 12 can be used to drive the light-emitting element 8 to undergo slight translation, thereby pulling the light-emitting element 8 into the preset area, enabling the light-emitting element 8 to achieve self-alignment, and thus improving the transfer accuracy.

[0131] In one feasible implementation, see Figure 26 and Figure 27 The maximum distance between the upper surface of the first portion 12 away from the back plate 1 and the back plate 1 is l1, and the maximum distance between the upper surface of the second portion 13 away from the back plate 1 and the back plate 1 is l2, where l1 ≠ l2. Because the first portion 6 flows during the display panel manufacturing process, causing a change in its shape, the upper surfaces of the first portion 6 and the second portion 13 may not be flush when the first portion 6 further solidifies to form the first portion 12.

[0132] Furthermore, such as Figure 26 As shown, Figure 26 This is another schematic diagram of the display panel provided in an embodiment of the present invention. The first portion 12 includes a surrounding portion 24 and an overflow portion 25. The surrounding portion 24 surrounds the eutectic bonding layer 11, the second portion 13 surrounds the surrounding portion 24, and the overflow portion 25 communicates with the surrounding portion 24. The overflow portion 25 is located on the side of the second portion 13 away from the back plate 1. In this case, l1 > l2.

[0133] In conjunction with the foregoing, both the first portion 12 and the second portion 13 can be formed of photoresist material. In this case, the materials of the first portion 12 and the second portion 13 are coated together onto the backplate 1. By making the coated photoresist surface smooth, the upper surfaces of the first portion 6 and the second portion 7 can have fewer undulations. When the first portion 6 finally solidifies to form the first portion 12, some material may overflow to form an overflow portion 25. In this structure, the initially formed first portion 6 has a relatively large height. When the first portion 6 flows, it can exert a greater force on the light-emitting element 8, increasing the intensity of the force and thus enabling the light-emitting element 8 to achieve better self-alignment.

[0134] Or, such as Figure 27 As shown, Figure 27 This is a schematic diagram of another structure of the display panel provided in an embodiment of the present invention. The first part 12 surrounds the eutectic bonding layer 11, the second part 13 surrounds the first part 12, and l1 < l2.

[0135] In conjunction with the foregoing, in one configuration, both the first portion 12 and the second portion 13 can be formed of photoresist material. When coating the photoresist on the backplate 1, the upper surface of the second portion 13 can be made higher than the upper surface of the first portion 12 by controlling the first region 3 and the second region 4 to have different coating temperatures. Alternatively, in another configuration, the material of the first portion 12 is a first colloid 16, and the material of the second portion 13 is a second colloid 17. The first colloid 16 and the second colloid 17 can be formed using different patterning processes to achieve the same result, where the upper surface of the second portion 13 is higher than the upper surface of the first portion 12. In this structure, the initially formed first portion 6 has a smaller height, preventing overflow during flow or solidification.

[0136] In one feasible implementation, such as Figure 28 and Figure 29 As shown, Figure 28 This is a partial top view of the display panel provided in an embodiment of the present invention. Figure 29 for Figure 28 A cross-sectional view along the A1-A2 direction shows that the second portion 13 has multiple cutouts 22, each of which corresponds to a multiple light-emitting element body portions 21. At least a portion of the first portion 12 is located within the cutouts 22, and the eutectic bonding layers 11 to which the light-emitting element body portions 21 are connected are all located within their corresponding cutouts 22.

[0137] In this structure, one first section 12 corresponds to one light-emitting element 8, and the second section 13 has a larger cutout area 22. The first section 12 simultaneously surrounds the two eutectic bonding layers 11 corresponding to the light-emitting element 8. In the display panel manufacturing process, combined with... Figure 7When the transient backplate 10 is placed under the first preset condition, the flow of a first part 6 acts only on the electrode 9 of a light-emitting element 8. The surface tension of the first part 6 during flow is more conducive to pulling the corresponding light-emitting element 8 into the light-emitting element preset area 14, so that the final position of the light-emitting element 8 coincides with the light-emitting element preset area 14, thereby improving the transfer accuracy of the light-emitting element 8.

[0138] In one feasible implementation, such as Figure 30 As shown, Figure 30 This is another partial top view of the display panel provided in an embodiment of the present invention. The second portion 13 has a plurality of cutouts 22, and the plurality of cutouts 22 correspond one-to-one with a plurality of eutectic bonding layers 11. At least a portion of the first portion 12 is located within the cutouts 22, and the eutectic bonding layer 11 is located within its corresponding cutout 22.

[0139] In this structure, one first segment 12 corresponds to one eutectic bonding layer 11, and the cutout 22 of the second segment 13 has a smaller surrounding area. In the manufacturing process of the display panel, combined with... Figure 2 When the transient backplate 10 is placed under the first preset condition, the flow of the first part 6 acts only on one positive or one negative electrode of the light-emitting element 8. The surface tension of the first part 6 during flow is more conducive to pulling the corresponding positive or negative electrode to face the bonding part 2, thereby making the final setting position of the light-emitting element 8 coincide with the preset area 14 of the light-emitting element. Moreover, the second part 7 can also restrict the movement of the positive and negative electrodes of the light-emitting element 8 to a certain extent, preventing the positive electrode of the light-emitting element 8 from moving to the bonding part 2 that should contact the negative electrode and preventing the negative electrode of the light-emitting element 8 from moving to the bonding part 2 that should contact the positive electrode, thereby effectively avoiding the risk of short circuit between the positive and negative electrodes of the light-emitting element 8.

[0140] In one feasible implementation, combined with Figures 28-34 The second part 13 has multiple openings 22, and at least a portion of the first part 12 is located within the openings 22.

[0141] See you again Figure 28 and Figure 30 The shape of the cutout 22 can be rectangular. Or, as... Figure 31 and Figure 32 As shown, Figure 31 This is another partial top view of the display panel provided in an embodiment of the present invention. Figure 32 This is another partial top view of the display panel provided in an embodiment of the present invention. The shape of the cutout 22 can also be a rounded rectangle. Alternatively, as... Figure 33 and Figure 34 As shown, Figure 33 This is another partial top view of the display panel provided in an embodiment of the present invention. Figure 34This is another partial top view of the display panel provided in an embodiment of the present invention. The shape of the cutout 22 can also be circular or elliptical.

[0142] In the above structure, the regular shape of the cutout 22 in the second part 13 indicates that the structure in the first part 6 is also relatively regular when the auxiliary layer 5 is formed. Therefore, when the first part 6 flows, the surface tension of the first part 6 will not have a significant difference in its effect on the light-emitting element 8 in various directions, which is more conducive to the self-alignment of the light-emitting element 8.

[0143] In one feasible implementation, see again Figure 25 The thickness d1 of the eutectic bonding layer 11 in the plane perpendicular to the back plate 1 is greater than the thickness d2 of the second part 13 in the plane perpendicular to the back plate 1.

[0144] It should be noted that, in combination Figure 2 After the hot-press bonding process, the thickness of the eutectic bonding layer 11 formed by the electrode 9 of the light-emitting element 8 and the bonding portion 2 will be less than the sum of the thicknesses of the electrode 9 and the bonding portion 2 of the light-emitting element 8 before hot-press bonding. For example, if the thickness of the electrode 9 of the light-emitting element 8 is 2 μm and the thickness of the bonding portion 2 is 3 μm, the thickness of the eutectic bonding layer 11 formed after bonding will be 4 μm. However, it is understandable that the larger the thickness of the eutectic bonding layer 11, the larger the sum of the thicknesses of the electrode 9 and the bonding portion 2 of the light-emitting element 8 before hot-press bonding. That is, when the thickness of the eutectic bonding layer 11 is greater than the thickness of the second portion 13, the sum of the thicknesses of the electrode 9 and the bonding portion 2 of the light-emitting element 8 before hot-press bonding is also greater than the thickness of the second portion 7.

[0145] Based on the above structure, in the manufacturing process of the display panel, when the transient backplate 10 is placed under the first preset condition, the material of the first part 6 has high fluidity and may overflow to the upper surface of the second part 7. By setting the total thickness of the bonding part 2 and the electrode 9 electrically connected to it to be larger, when the first part 6 and the second part 7 solidify to form the first part 12 and the second part 13, a certain space will be left between the upper surface of the second part 13 and the light-emitting element body 21, which can accommodate the overflowing part in the first part 12, thereby preventing the overflowing part of the first part 12 from lifting the light-emitting element body 21, thereby avoiding affecting the stability of the light-emitting element body 21.

[0146] In one feasible implementation, such as Figure 35 As shown, Figure 35This is a schematic diagram of another structure of the display panel provided in an embodiment of the present invention. The back plate 1 includes a back plate electrode 23, and a eutectic bonding layer 11 is located between the back plate electrode 23 and the light-emitting element body 21. The back plate electrode 23 is in contact with the eutectic bonding layer 11. The thickness d2 of the second portion 13 in the direction perpendicular to the plane of the back plate 1 is greater than the thickness d3 of the back plate electrode 23 in the direction perpendicular to the plane of the back plate 1.

[0147] Based on the above structure, combined with Figure 24 When the auxiliary layer 5 is formed, the second part 7 is higher than the back electrode 23, thus it can surround the electrode 9 of the light-emitting element 8, reducing the risk of the light-emitting element 8 tilting when the display panel is subjected to external force. Moreover, under the first preset condition, the second part 7 can also surround the flow of the first part 6, strengthening the effect of the flow of the first part 6 on the light-emitting element 8.

[0148] In one feasible implementation, under a first preset condition, the material of the first portion 12 has a greater fluidity than the material of the second portion 13.

[0149] Based on the description of the manufacturing method of the display panel, when the transient backplate 10 is placed under the first preset condition, the first part 6 has high fluidity, and the surface tension of the first part 6 can be used to drive the light-emitting element 8 to make a slight translation, pull the light-emitting element 8 into the preset area, and enable the light-emitting element 8 to achieve self-alignment.

[0150] In one feasible implementation, the first preset condition includes heating to a first preset temperature range, within which the viscosity of the material of the first portion 12 is less than the viscosity of the material of the second portion 13.

[0151] Viscosity characterizes the flowability of a material; the lower the viscosity, the higher the flowability. Within the first preset temperature range, the material in the first portion 12 has a lower viscosity, indicating that it has higher flowability, thus meeting the requirements for its flowability.

[0152] In one feasible implementation, within a first preset temperature range, as the temperature increases by ΔT, the viscosity of the material in the first portion 12 decreases by Δη1, and the viscosity of the material in the second portion 13 decreases by Δη2, where Δη1 > Δη2.

[0153] As the temperature increases by ΔT, the viscosity of the material in the first part 12 decreases more than that in the second part 13, resulting in lower viscosity and higher fluidity. This allows the material in the first part 12 to achieve better self-alignment of the light-emitting element 8 during the manufacturing process of the display panel.

[0154] In one feasible implementation, within a first preset temperature range, as the temperature increases, the acceleration of the rate at which the viscosity of the material in the first portion 12 decreases is greater than 0.

[0155] That is, as the temperature increases, the viscosity of the material in the first part 12 decreases at an increasingly faster rate, so that the flowability requirements of the first part 6 can be met even at slightly lower temperatures, reducing the need for the first preset temperature range.

[0156] Furthermore, within the first preset temperature range, as the temperature increases, the acceleration of the viscosity decrease rate of the material in the second portion 13 is greater than 0, and the acceleration of the viscosity decrease rate of the material in the second portion 13 is less than the acceleration of the viscosity decrease rate of the material in the first portion 12. Alternatively, the acceleration of the viscosity decrease rate of the material in the second portion 13 is equal to 0. Alternatively, the acceleration of the viscosity decrease rate of the material in the second portion 13 is less than 0.

[0157] When the material of the second part 13 has the above-mentioned characteristics, as the temperature rises, while meeting the requirements for the fluidity of the material of the first part 12, the material of the second part 13 can also have lower fluidity. In this way, the second part 7 can be used to better contain the flow of the first part 6 in the process of manufacturing the display panel, thereby strengthening the effect of the flow of the first part 6 on the light-emitting element 8.

[0158] In one feasible implementation, the first preset condition includes applying an external force, wherein when the external force is applied, the thixotropy of the material of the first portion 12 is greater than that of the material of the second portion 13.

[0159] Thixotropy reflects the ability of a fluid to recover its original structure after being damaged by shear force. When a material is subjected to external force, the greater the thixotropy, the greater the fluidity of the material under the influence of external force. When an external force is applied, the material in the first section 12 exhibits greater thixotropy, indicating that it has higher fluidity and can thus meet the requirements for fluidity.

[0160] In one possible implementation, the first portion 12 includes acrylic adhesive, nonconductive paste (NCP), nonconductive film (NCF), or unexposed photoresist, and the second portion 13 includes exposed photoresist.

[0161] For example, the first portion 12 includes unexposed photoresist, and the second portion 13 includes exposed photoresist, i.e., the first portion 12 and the second portion 13 are formed of the same material. Alternatively, the first portion 12 includes acrylic adhesive, liquid adhesive, or film adhesive, and the second portion 13 includes exposed photoresist, i.e., the first portion 12 and the second portion 13 are formed of different materials.

[0162] When the first portion 12 and / or the second portion 13 include photoresist, the photoresist itself has viscosity. Before exposure, the photoresist does not undergo a cross-linking reaction and harden. Within a certain temperature range, the viscosity of the photoresist decreases as the temperature increases, thus giving it high fluidity after heating. After exposure, the photoresist hardens due to a cross-linking reaction and remains in a solidified state after heating, resulting in very low fluidity. When the first portion 12 includes acrylic adhesive, liquid adhesive, or film adhesive, these materials all possess a certain degree of viscoelasticity, and their viscosity decreases and fluidity increases after heating, thus also meeting the fluidity requirements of the first portion 12.

[0163] In one feasible implementation, such as Figure 36 As shown, Figure 36 This is another structural schematic diagram of the display panel provided in an embodiment of the present invention. The auxiliary layer 5 further includes a plurality of third portions 20. The third portions 20 surround the first portion 12 and are located between the first portion 12 and the second portion 13. Under a first preset condition, the fluidity of the material of the third portion 20 is less than that of the material of the first portion 12 and greater than that of the material of the second portion 13.

[0164] Correspondingly, combined Figure 20 In the manufacturing process of the display panel, a third region 18 surrounding the first region 3 needs to be defined on the back panel 1. When forming the auxiliary layer 5, the auxiliary layer 5 also includes a third part 19 located in the third region 18. Subsequently, when the transient back panel 10 is placed under the first preset condition, the fluidity of the material in the third part 19 is between that of the first part 6 and the second part 7. The third part 19 can act as a transition buffer for the flow of the first part 6, weakening the blocking force exerted by the second part 7 on the first part 6, thereby reducing the influence of this force on the flow of the first part 6.

[0165] Based on the same inventive concept, embodiments of the present invention also provide a display device, such as... Figure 37 As shown, Figure 37 This is a schematic diagram of a display device provided in an embodiment of the present invention. The display device includes the aforementioned display panel. The specific structure of the display panel 100 has been described in detail in the above embodiments and will not be repeated here. Of course, Figure 37The display device shown is for illustrative purposes only. The display device can be any electronic device with display function, such as a mobile phone, tablet computer, laptop computer, e-reader or television.

[0166] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

[0167] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for manufacturing a display panel, characterized in that, include: Provide back panel; A bonding portion is formed on the backplate, the backplate including a plurality of first regions and a second region surrounding the plurality of first regions, the bonding portion being located in the first regions; An auxiliary layer is formed on the backplate, the auxiliary layer covering the backplate and the bonding portion, the auxiliary layer including a first portion located in the first region and a second portion located in the second region; The light-emitting element is released onto the auxiliary layer, and the electrode of the light-emitting element is brought into contact with the first part to form a transient backplate; The transient backplate is placed under a first preset condition, under which the fluidity of the first part is greater than that of the second part. The electrode and the bonding portion are bonded to form a eutectic bonding layer, and the transient backplate is placed under a second preset condition, so that the first portion forms a solid first portion and the second portion forms a solid second portion.

2. The manufacturing method according to claim 1, characterized in that, The back panel has multiple light-emitting element preset areas, and one light-emitting element preset area is used to set one light-emitting element; Among them, each of the first regions corresponds one-to-one with a preset region of a light-emitting element.

3. The manufacturing method according to claim 1, characterized in that, Each of the first regions corresponds one-to-one with one of the bonding portions.

4. The manufacturing method according to claim 1, characterized in that, The first region covers the bonding portion, and the distance between the edge of the first region and the edge of the bonding portion it covers is d, where 3μm≤d<30μm.

5. The manufacturing method according to claim 1, characterized in that, The shape of the first region is rectangular, rounded rectangle, circle or ellipse.

6. The manufacturing method according to claim 1, characterized in that, The process of forming the auxiliary layer includes: A photoresist is applied to the back plate to form a coating covering the back plate and the bonding portion; The photoresist in the first region is not exposed; the first part is formed using the unexposed photoresist. The photoresist in the second region is exposed; the second part is formed using the exposed photoresist. The process of placing the transient backplate under the first preset condition includes: heating the transient backplate to a first preset temperature range, wherein, within the first preset temperature range, the viscosity of the unexposed photoresist is less than the viscosity of the exposed photoresist. The process of placing the transient backplate under the second preset condition includes: heating the transient backplate to a second preset temperature range, wherein, within the second preset temperature range, the unexposed photoresist is solid to form the first portion, and the exposed photoresist is solid to form the second portion.

7. The manufacturing method according to claim 6, characterized in that, The minimum temperature value in the first preset temperature range is 80℃, and the maximum temperature value in the first preset temperature range is 120℃. The minimum temperature value in the second preset temperature range is 150℃.

8. The manufacturing method according to claim 6, characterized in that, When the photoresist is applied to the backing plate, the application temperature of the second region is lower than that of the first region.

9. The manufacturing method according to claim 1, characterized in that, The process of forming the auxiliary layer includes: A first colloid is formed in the first region, and the first portion is formed using the first colloid; a second colloid is formed in the second region, and the second portion is formed using the second colloid. The process of placing the transient backplate under the first preset condition includes: applying an external force to the transient backplate, wherein when an external force is applied to the transient backplate, the thixotropic property of the first colloid is greater than that of the second colloid; The process of placing the transient backplate under the second preset condition includes: stopping the application of external force to the transient backplate, allowing the transient backplate to stand still, the first colloid solidifying to form the first portion, and the second colloid solidifying to form the second portion.

10. The manufacturing method according to claim 1, characterized in that, The back panel also includes a plurality of third regions surrounding the first region and located between the first region and the second region; When forming the auxiliary layer, the auxiliary layer further includes a third part located in the third region, wherein, under the first preset condition, the fluidity of the third part is less than the fluidity of the first part and greater than the fluidity of the second part; When the transient backplate is placed under the second preset condition, the third part forms a solid third portion.

11. The manufacturing method according to claim 1, characterized in that, Under the first preset conditions, the first part is in a liquid state and the second part is in a solid state.

12. The manufacturing method according to claim 1, characterized in that, When the auxiliary layer is formed, the upper surface of the first part away from the back plate and the upper surface of the second part away from the back plate are flush.

13. The manufacturing method according to claim 1, characterized in that, When the auxiliary layer is formed, the distance between the upper surface of the first part away from the back plate and the back plate is less than the distance between the upper surface of the second part away from the back plate and the back plate.

14. A display panel, characterized in that, include: Back panel; A eutectic bonding layer and an auxiliary layer are located on one side of the backplate. The auxiliary layer includes a first portion and a second portion, wherein at least a portion of the first portion surrounds the eutectic bonding layer, and the second portion surrounds the first portion. A light-emitting element body located on one side of the eutectic bonding layer, the light-emitting element body being connected to the eutectic bonding layer; The first portion includes a surrounding portion and an overflow portion, wherein the surrounding portion surrounds the eutectic bonding layer, the second portion surrounds the surrounding portion, the overflow portion communicates with the surrounding portion, and the overflow portion is located on the side of the second portion away from the backplate.

15. The display panel according to claim 14, characterized in that, The maximum distance between the upper surface of the first portion away from the back plate and the back plate is l1, and the maximum distance between the upper surface of the second portion away from the back plate and the back plate is l2, where l1 ≠ l2.

16. The display panel according to claim 15, characterized in that, The first portion surrounds the eutectic bonding layer, the second portion surrounds the first portion, and l1 < l2.

17. The display panel according to claim 14, characterized in that, The second portion has multiple cutouts, and each of the multiple cutouts corresponds one-to-one with a multiple of the light-emitting element main body portions; At least a portion of the first division is located within the cutout, and the eutectic bonding layers to which the main body of the light-emitting element is connected are all located within the corresponding cutouts.

18. The display panel according to claim 14, characterized in that, The second portion has multiple cutouts, and each of the multiple cutouts corresponds to one of the multiple eutectic bonding layers; At least a portion of the first segment is located within the cutout, and the eutectic bonding layer is located within the corresponding cutout.

19. The display panel according to claim 14, characterized in that, The second portion has multiple cutouts, and at least a portion of the first portion is located within the cutouts; The hollowed-out shape can be rectangular, rounded rectangle, circular, or elliptical.

20. The display panel according to claim 14, characterized in that, The thickness of the eutectic bonding layer in the direction perpendicular to the plane of the backplate is greater than the thickness of the second portion in the direction perpendicular to the plane of the backplate.

21. The display panel according to claim 14, characterized in that, The backplate includes a backplate electrode, the eutectic bonding layer is located between the backplate electrode and the main body of the light-emitting element, and the backplate electrode is in contact with the eutectic bonding layer; The thickness of the second portion in the direction perpendicular to the plane of the back plate is greater than the thickness of the back plate electrode in the direction perpendicular to the plane of the back plate.

22. The display panel according to claim 14, characterized in that, Under a first preset condition, the fluidity of the material forming the first portion is greater than the fluidity of the material forming the second portion.

23. The display panel according to claim 22, characterized in that, The first preset condition includes heating to a first preset temperature range, within which the viscosity of the material forming the first portion is less than the viscosity of the material forming the second portion.

24. The display panel according to claim 23, characterized in that, Within the first preset temperature range, when the temperature increases by ΔT, the decrease in viscosity of the material forming the first part is Δη1, and the decrease in viscosity of the material forming the second part is Δη2, where Δη1 > Δη2.

25. The display panel according to claim 23, characterized in that, Within the first preset temperature range, as the temperature increases, the acceleration of the rate at which the viscosity of the material forming the first portion decreases is greater than 0.

26. The display panel according to claim 25, characterized in that, Within the first preset temperature range, as the temperature increases, the acceleration of the viscosity reduction rate of the material forming the second part is greater than 0, and the acceleration of the viscosity reduction rate of the material forming the second part is less than the acceleration of the viscosity reduction rate of the material forming the first part. Alternatively, the acceleration of the viscosity decrease rate of the material forming the second portion is equal to 0; Alternatively, the acceleration of the viscosity decrease rate of the material forming the second portion is less than 0.

27. The display panel according to claim 22, characterized in that, The first preset condition includes applying an external force, wherein when the external force is applied, the thixotropic property of the material forming the first portion is greater than that of the material forming the second portion.

28. The display panel according to claim 14, characterized in that, The materials forming the first portion include acrylic adhesive, liquid adhesive, film adhesive, or unexposed photoresist, and the materials forming the second portion include exposed photoresist.

29. The display panel according to claim 14, characterized in that, The auxiliary layer also includes a plurality of third portions, which surround the first portion and are located between the first portion and the second portion. Under a first preset condition, the fluidity of the material forming the third portion is less than the fluidity of the material forming the first portion and greater than the fluidity of the material forming the second portion.

30. A display device, characterized in that, Includes the display panel as described in any one of claims 14 to 29.

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