Display device and heat dissipation control method thereof

Abstract

The application provides a display device and a heat dissipation control method thereof. The display device comprises a shell, the shell defines an inner cavity; a heat dissipation structure is arranged in the inner cavity, the heat dissipation structure comprises a thermoelectric cooling device and a heat sink, the thermoelectric cooling device has a hot end and a cold end, the hot end exchanges heat with the heat sink, and the cold end exchanges heat with a heat output area of the display device. The application increases the passive heat dissipation mode, the size of the thermoelectric cooling device is usually thin, the heat dissipation efficiency of the display device is improved, the requirements for the air flow generating device and the space inside the display device are reduced, the layout and structure design of other electronic elements inside the display device are not affected, and the thinning of the display device is facilitated.

Description

Technical Field

[0001] This invention generally relates to the field of display device technology, and more specifically to a display device and its heat dissipation control method. Background Technology

[0002] Currently, portable display devices mostly employ passive cooling technologies such as graphite sheets or vapor chambers. However, as the power consumption of core components like internal chips continues to rise, especially driven by AI, the amount of data that display devices need to process is increasing. Stronger performance also means higher heat generation, leading to a continuous increase in overall heat output. Traditional passive cooling methods are no longer sufficient to meet these demands, resulting in a degraded user experience. To improve heat dissipation efficiency, related technologies have introduced micro-fans for active air cooling. By driving external airflow through the device's interior, these fans effectively remove accumulated heat, significantly improving heat dissipation performance.

[0003] However, the active cooling modules in related technologies usually use high-power fans, which are large in size and located inside the display device's housing, occupying a lot of internal space and affecting the layout and structural design of other electronic components. Summary of the Invention

[0004] In view of the above-mentioned defects or deficiencies in the prior art, it is desirable to provide a display device and its heat dissipation control method. By setting a thermoelectric cooling device, a passive heat dissipation method is added. The thermoelectric cooling device can usually be relatively thin, which is beneficial to improving the heat dissipation efficiency of the display device. At the same time, it can also reduce the volume of other heat dissipation structures (such as fans) and reduce the impact on the internal space of the display device. It does not affect the layout and structural design of other electronic components inside the display device, which is conducive to realizing the thinness and lightness of the display device.

[0005] In a first aspect, the present invention provides a display device, comprising:

[0006] A housing, the housing defining an internal cavity; The heat dissipation structure is located inside the cavity and includes a thermoelectric cooling device and a heat sink. The thermoelectric cooling device has a hot end and a cold end. The hot end exchanges heat with the heat sink, and the cold end exchanges heat with the heat output area of ​​the display device.

[0007] As an optional solution, the housing has an air outlet and an air inlet, the radiator defines an air outlet duct inside the cavity, the air inlet and air outlet are connected to the air duct, and the heat dissipation structure also includes an airflow generating device located inside the air duct.

[0008] As an alternative, in the thickness direction of the display device, the projection of the heat sink at least covers the projection of the thermoelectric cooling device.

[0009] As an optional solution, the heat output area includes a semiconductor device and a heat spreader, with at least one side of the semiconductor device covered by a metal shield.

[0010] As an optional solution, the metal shield and the thermoelectric cooling device are arranged side by side on the heat spreader. In the thickness direction of the display device, the side of the metal shield away from the heat spreader exchanges heat with the heat sink, the cold end exchanges heat with the heat spreader, and the hot end exchanges heat with the heat sink.

[0011] As an optional solution, a metal shield is placed on the heat spreader plate. In the thickness direction of the display device, the thermoelectric cooling device is placed on the side of the metal shield away from the heat spreader plate, and the cold end exchanges heat with the metal shield and the hot end exchanges heat with the heat sink.

[0012] As an optional solution, the heat dissipation structure also includes at least one heat-conducting block, which is disposed between the heat sink and the heat spreader.

[0013] As an optional solution, a metal shield and at least one heat-conducting block are arranged side by side on a heat spreader. In the thickness direction of the display device, a thermoelectric cooling device is arranged on the side of the metal shield away from the heat spreader. The cold end exchanges heat with the metal shield, and the hot end exchanges heat with the heat sink.

[0014] As an alternative, in the thickness direction of the display device, the projection of the thermoelectric cooling device at least covers the projection of the metal shield.

[0015] As an optional solution, a metal shield and at least one heat-conducting block are arranged side by side on a heat spreader. In the thickness direction of the display device, the side of the metal shield away from the heat spreader exchanges heat with the heat sink. A thermoelectric cooling device is arranged on the side of at least one heat-conducting block away from the heat spreader. The cold end exchanges heat with the heat-conducting block, and the hot end exchanges heat with the heat sink. The projection area of ​​the thermoelectric cooling device at least covers the projection area of ​​the heat-conducting block. Alternatively, the heat dissipation structure includes at least two heat-conducting blocks, each including a first heat-conducting block and a second heat-conducting block of different thicknesses. A metal shield, the first heat-conducting block, and the second heat-conducting block are arranged side-by-side on a heat spreader. In the thickness direction of the display device, the side of the metal shield away from the heat spreader exchanges heat with the heat sink, and the side of the second heat-conducting block away from the heat spreader exchanges heat with the heat sink. A thermoelectric cooling device is disposed on the side of the first heat-conducting block away from the heat spreader, with its cold end exchanging heat with the first heat-conducting block and its hot end exchanging heat with the heat sink. The projection of the thermoelectric cooling device at least covers the projection of the first heat-conducting block, and the thickness of the first heat-conducting block is less than the thickness of the second heat-conducting block.

[0016] As an optional solution, at least one heat-conducting block, a thermoelectric cooling device, and a metal shield are arranged side by side on the heat exchange plate. In the thickness direction of the display device, the side of the metal shield away from the heat exchange plate exchanges heat with the heat sink, the side of the heat-conducting block away from the heat exchange plate exchanges heat with the heat sink, the hot end exchanges heat with the heat sink, and the cold end exchanges heat with the heat exchange plate.

[0017] As an optional solution, the thickness of the thermoelectric cooling device in the thickness direction of the display device is 5μm-100μm.

[0018] Secondly, the present invention provides a heat dissipation control method for a display device according to the first aspect, specifically including the following steps: Obtain the current temperature of the heat output area of ​​the display device; If the current temperature is less than the first preset threshold, control the thermoelectric cooling device and the airflow generator to remain in a de-energized state. If the current temperature is greater than or equal to the first preset threshold and less than the second preset threshold, the thermoelectric cooling device is kept off, and the airflow generator is powered on and in working condition; the first preset threshold is less than the second preset threshold. If the current temperature is greater than or equal to the second preset threshold, the thermoelectric cooling device and the airflow generating device are both powered on and in working condition.

[0019] The display device of the present invention features a heat dissipation structure within a cavity defined by the housing. This structure includes a heat sink and a thermoelectric cooling device. The hot end of the thermoelectric cooling device exchanges heat with the heat sink, while the cold end exchanges heat with the heat output area of ​​the display device. When the thermoelectric cooling device is powered on, the cold end pumps heat from the heat output area of ​​the display device to the hot end, allowing heat to dissipate from the heat sink. This helps lower the temperature of the heat output area. Because the hot end exchanges heat with the heat sink, heat backflow that could cause the cold end to fail to cool is prevented. The heat from the heat output area of ​​the display device can be dissipated into the environment through the heat sink, improving the energy efficiency of the semiconductor devices and preventing frequency throttling. This also enhances the display device's performance, meeting users' diverse functional needs. Furthermore, the thermoelectric cooling device can be made relatively thin, solving the heat dissipation problem of high-power-density components without significantly increasing the thickness of the display device. This facilitates a thinner and lighter design, improving the product quality and competitiveness of the display device. Attached Figure Description

[0020] Other features, objectives, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings: Figure 1This is a top view of the structure of the first display device according to an embodiment of this application; Figure 2 for Figure 1 AA section view; Figure 3 This is a top view of a second type of display device according to an embodiment of this application; Figure 4 for Figure 3 AA section view; Figure 5 This is a top view of a third type of display device according to an embodiment of this application; Figure 6 for Figure 5 AA section view; Figure 7 This is a top view of the fourth type of display device according to an embodiment of this application; Figure 8 for Figure 7 AA section view; Figure 9 This is a top view of the fifth type of display device according to an embodiment of this application; Figure 10 for Figure 9 AA section view; Figure 11 This is a top view of the fifth type of display device according to an embodiment of this application; Figure 12 for Figure 11 AA section view; Figure 13 The energy efficiency curves of the display device under different operating conditions are shown in the embodiments of this application. Figure 14 The graph shows the power consumption and heat dissipation capacity of the airflow generator. Figure 15 A graph showing the power consumption of the thermoelectric cooling device system and the airflow generator under a 5W load on semiconductor devices; Figure 16 A graph showing the power consumption of the thermoelectric cooling device system and the airflow generator under a 10W load on the semiconductor device.

[0021] In the picture, 10. Housing; 11. Air inlet; 12. Air outlet; 13. Air duct; 20. Heat dissipation structure; 21. Heat sink; 22. Thermoelectric cooling device; 23. Airflow generating device; 24. Heat-conducting block; 241. First heat-conducting block; 242. Second heat-conducting block; 25. Thermal grease. 30. Semiconductor devices; 31. Metal shielding cover; 32. Heat sink. Detailed Implementation

[0022] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, only the parts relevant to the invention are shown in the accompanying drawings.

[0023] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0024] To improve heat dissipation efficiency, related technologies typically incorporate fans inside display devices for active air cooling. By driving external airflow through the device, accumulated heat is effectively carried away, significantly improving heat dissipation performance. However, current common fans are relatively large and are usually located in the middle of the device casing. This design occupies a significant amount of internal space, affecting the layout and structural design of other electronic components.

[0025] Embodiments of this application provide a display device, such as... Figure 1-12 As shown, it includes: Housing 10, housing 10 defining an inner cavity; The heat dissipation structure is located inside the cavity and includes a thermoelectric cooling device 22 and a heat sink 21. The thermoelectric cooling device 22 has a hot end and a cold end. The hot end exchanges heat with the heat sink 21, and the cold end exchanges heat with the display device.

[0026] It should be noted that the display device may be, but is not limited to, mobile phones, tablets, mobile gaming devices, etc. The housing 10 refers to the outer shell of the display device. The housing 10 serves as the supporting frame and protective shell of the entire display device. The housing 10 has an internal cavity for installing heat dissipation structures, semiconductor devices 30, batteries, and other components. At the same time, the housing 10 can also protect the components installed inside it.

[0027] Understandably, the heat dissipation structure includes a heat sink 21, which can be any type of existing display device heat sink 21. The heat sink 21 includes a base and multiple fins mounted on the base, typically made of aluminum, copper, or a copper-aluminum composite material. The heat sink 21 is usually installed in the heat output area of ​​the display device, and the multiple heat dissipation fins define an airflow channel 13, allowing heat from the heat output area of ​​the display device to be quickly dissipated through the airflow channel 13, thereby ensuring reliable operation of the display device.

[0028] Alternatively, the heat dissipation structure can be understood as including a thermoelectric cooling device 22, which can be a thin-film thermoelectric cooler (TFTEC). Thermoelectric cooling device 22 is a miniature device that utilizes semiconductor thin-film materials to achieve solid-state cooling through the Peltier effect. It is thin, has extremely strong cooling capacity, and high heat dissipation density. Thermoelectric cooling device 22 has a cold end and a hot end. After being energized, the temperature of the cold end decreases, pumping heat to the hot end, causing the temperature of the hot end to rise. The cold end of thermoelectric cooling device 22 is close to the heat output area of ​​the display device, and the hot end is close to the heat sink 21. This facilitates the pumping of heat from the heat output area of ​​the display device from the cold end to the hot end, which is then effectively dissipated through the heat sink 21, reducing the temperature of the display device during operation and thus ensuring reliable operation.

[0029] In actual manufacturing, the heat dissipation structure can be set in the area near the end of the housing 10 of the display device (the area near the upper part of the housing of the display device or the area near the lower part of the housing of the display device). This avoids setting it in the area near the middle of the housing 10, which would cause inconvenience to the user and reduce the user experience.

[0030] The display device of this application addresses the problems in related technologies where a single fan in the heat dissipation structure occupies a large amount of internal space, affecting the installation and layout of other components, and has poor heat dissipation efficiency. The embodiment of this application provides a heat dissipation structure within the cavity defined by the housing. The heat dissipation structure includes a heat sink 21 and a thermoelectric cooling device 22. The hot end of the thermoelectric cooling device 22 is positioned close to the heat sink 21, and the cold end is positioned close to the heat output area of ​​the display device. After the thermoelectric cooling device 22 is powered on, the cold end can transfer heat from the heat output area of ​​the display device to the hot end, thereby dissipating heat from the heat sink 21. This helps to lower the temperature of the heat output area of ​​the display device. Since the hot end is located close to the heat sink 21, heat backflow can be avoided, which could cause the cold end to fail to cool down. The heat from the heat output area of ​​the display device can be discharged into the environment through the heat sink 21, which is beneficial to the reliable operation of the display device. At the same time, it can also improve the performance of the display device and meet the diverse functional needs of users. Furthermore, the thermoelectric cooling device 22 can be made relatively thin, thus solving the heat dissipation problem of high power density components without significantly increasing the thickness and volume of the display device. This is conducive to the thin and light design of the display device, thereby improving the product quality and competitiveness of the display device.

[0031] As an implementation method, the housing 10 is provided with an air outlet 12 and an air inlet 11, the radiator 21 defines an air outlet 13 inside the inner cavity, the air inlet 11 and the air outlet 12 are respectively connected to the air outlet 13, and the heat dissipation structure also includes an airflow generating device 23, which is located inside the air outlet 13.

[0032] The air outlet 12 is used to dissipate heat from the display device to the external environment, reducing the temperature of the display device during use. The air inlet 11 allows air from the external environment to circulate into the air duct 13. Convection is formed between the air inlet 11 and the air outlet 12, accelerating the dissipation of heat from the air outlet 12. The air outlet 12 and the air inlet 11 can be located on the housing 10 near the heat sink 21, or they can be located in other positions on the housing 10. The air outlet 12 and the air inlet 11 only need to be connected to the air duct 13 defined by the heat sink 21.

[0033] It is understood that the airflow generating device 23 can be, but is not limited to, various types of fans. The fan is located inside the air duct 13. When the fan is powered on, it draws in outside air from the air inlet 11, passes through the heat sink 21, and increases the air convection speed inside the air duct 13. After the outside air exchanges heat with the heat sink 21, it is discharged from the air outlet 12, which helps to quickly dissipate heat and thus improve the heat dissipation efficiency of the display device.

[0034] In some embodiments, in the thickness direction of the display device (e.g.) Figure 2 (in the Z direction), the projection of the heat sink 21 at least covers the projection of the thermoelectric cooling device 22.

[0035] It is understandable that the projection of the heat sink 21 can completely overlap with the projection of the thermoelectric cooling device 22, or the projection area of ​​the heat sink 21 can be larger than the projection area of ​​the thermoelectric cooling device 22.

[0036] In this embodiment, the projection of the heat sink 21 at least covers the projection of the thermoelectric cooling device 22, which is beneficial to improving heat dissipation efficiency.

[0037] As an example, the heat output area includes a semiconductor device 30 and a heat spreader 32, with at least one side of the semiconductor device 30 covered by a metal shield 31.

[0038] The semiconductor device 30, as the motion hub of the display device (e.g., SOC), is a core component that ensures the normal operation of the display device. It integrates various electronic components and generates a lot of heat during operation. The semiconductor device 30 is the main source of heat output of the display device. The vapor chamber 32 (VC) is set on one side of the semiconductor device 30. For example, the heat generated by the semiconductor device 30 can be quickly diffused laterally to the entire surface of the vapor chamber by utilizing the evaporation-condensation phase change cycle of the internal medium, so that the surface temperature tends to be uniform. This transforms the high heat flux density on a small area of ​​the chip into a low heat flux density on a large area, reducing the high temperature extreme value in the high temperature area. In addition, it can also facilitate the efficient removal of heat by subsequent heat dissipation structures (such as heat sink 21 and thermoelectric cooling device 22).

[0039] The metal shielding can 31 is mainly used for electromagnetic interference shielding. When the semiconductor device 30 is working, it generates high-frequency electromagnetic radiation. The shielding can confine it inside, preventing interference with sensitive circuits such as radio frequency, audio, and sensors in the device. It also blocks external electromagnetic interference from affecting the chip, protecting the semiconductor device 30 and surrounding small components from damage caused by mechanical impact, dust, static electricity, etc. The metal material has a certain thermal conductivity. The metal shielding can 31 is in close contact with the semiconductor device 30 (through thermal adhesive or thermal pad), which can conduct the heat of the semiconductor device 30 to the surface of the metal shielding can 31, and then transfer it to the heat spreader 32 or heat sink 21. The heat spreader 32 is usually located outside the metal shielding can 31. The heat spreader 32 and the metal shielding can 31 are in contact through a thermal interface material (such as thermal grease 25 or thermal pad) to receive the heat of the semiconductor device 30; or the metal shielding can 31 is directly attached to the heat spreader 32 to achieve heat transfer.

[0040] As a feasible approach, such as Figure 1 and Figure 2 As shown, the metal shielding cover 31 and the thermoelectric cooling device 22 are arranged side by side on the heat spreader 32, in the thickness direction of the display device (e.g., Figure 2 In the Z direction), the metal shield 31 exchanges heat with the heat sink 21 on the side away from the heat spreader 32, the cold end exchanges heat with the heat spreader 32, and the hot end exchanges heat with the heat sink 21.

[0041] Understandably, thermal grease 25 can be applied between the metal shield 31 and the heat spreader 32, and similarly, thermal grease 25 can be applied between the thermoelectric cooling device 22 and the heat spreader 32. The thermal grease 25 can fill the tiny gaps between the metal shield 31 and the thermoelectric cooling device 22 and the heat spreader 32, significantly reducing contact thermal resistance and ensuring that the heat generated by the semiconductor device 30 can be quickly conducted to the heat sink 21 and carried away through the air duct 13, thereby improving heat transfer efficiency.

[0042] Among them, part of the heat generated by the semiconductor device 30 can be directly exchanged with the heat sink 21 through the metal shield 31 and discharged from the air duct 13. Another part can be transported to the cold end of the thermoelectric cooling device 22 through the heat spreader 32. The thermoelectric cooling device 22 pumps the heat from the cold end to the hot end, and the hot end exchanges heat with the heat sink 21 and discharges the heat from the air duct 13.

[0043] It is also understandable that in the thickness direction of the display device (e.g. Figure 2 In the Z direction), the size of the metal shield 31 can be the same as the thickness of the thermoelectric cooling device 22. This helps to ensure that the thickness of the thermally conductive material at the interface between the metal shield 31 and the thermoelectric cooling device 22 and the heat sink 21 is the same. At the same time, it ensures that the metal shield 31 and the thermoelectric cooling device 22 are stably set between the heat spreader 32 and the heat sink 21, thereby improving the heat dissipation efficiency while ensuring the stability of the entire heat dissipation structure.

[0044] Among them, in the direction perpendicular to the thickness of the display device (e.g. Figure 1 (shown in the X and Y directions), the dimensions of the thermoelectric cooling device 22 (as shown in the figure) Figure 1 The dimensions a2 and b2 shown are α times the dimensions (a1 and b1) of the metal shield, which is beneficial for efficient lateral heat diffusion of the high heat flux concentrated in the semiconductor device 30, reducing the heat load per unit area, avoiding local heat saturation, further improving the uniformity and efficiency of heat diffusion, and ensuring the stable operation of the heat dissipation structure.

[0045] As another possible approach, such as Figure 3 and Figure 4 As shown, the metal shield 31 is disposed on the heat spreader 32. In the thickness direction of the display device, the thermoelectric cooling device 22 is disposed on the side of the metal shield 31 away from the heat spreader 32, and the cold end exchanges heat with the metal shield 31, and the hot end exchanges heat with the heat sink 21.

[0046] It is understandable that, unlike the above implementation, in this implementation, the thermoelectric cooling device 22 is disposed on the side of the metal shield 31 away from the heat spreader 32. The metal shield 31 is mounted on the heat spreader 32. Part of the heat generated by the semiconductor device 30 is transferred to the heat spreader 32, and the other part is pumped to the hot end through the cold end of the thermoelectric cooling device 22 and discharged through the heat sink 21.

[0047] Among them, in the thickness direction of the display device ( Figure 4Along the Z-direction (as shown in the image), the thickness of the thermoelectric cooling device 22 ranges from 5μm to 100μm, employing a micron-level ultrathin film structure. This significantly reduces the electronic thermal resistance, accelerates heat transfer, and improves the response speed and temperature control accuracy of the thermoelectric cooling device 22. Simultaneously, it reduces the overall stacking height of the display device, meeting the requirements for a thinner and lighter design. Furthermore, the maximum cooling capacity of the thermoelectric cooling device 22 is inversely proportional to its thickness; the thinner the device, the stronger its cooling capacity, which can suppress localized hot spots with high heat flux density.

[0048] In the direction perpendicular to the thickness of the display device ( Figure 3 In the X and Y directions, the dimensions (a2 and b2) of the thermoelectric cooling device 22 are greater than or equal to the corresponding dimensions (a1 and b1) of the metal shield 31, so that the thermoelectric cooling device 22 completely covers the metal shield 31, which is beneficial to improving heat dissipation efficiency.

[0049] In some embodiments, the heat dissipation structure further includes at least one heat-conducting block 24, which is disposed between the heat sink 21 and the heat spreader 32.

[0050] The heat-conducting block 24 is disposed between the heat sink 21 and the heat spreader 32, which is conducive to further transferring the heat of the heat spreader 32 to the heat sink 21 and then dissipating it through the air duct 13.

[0051] The material of the heat-conducting block 24 may be, but is not limited to, copper, aluminum alloy, aluminum nitride, or a composite material of diamond and copper.

[0052] As a feasible approach, such as Figure 5 and Figure 6 As shown, a metal shielding cover 31 and at least one heat-conducting block 24 are arranged side by side on a heat spreader 32, along the thickness direction of the display device. Figure 6 (in the Z direction), the thermoelectric cooling device 22 is disposed on the side of the metal shield 31 away from the heat spreader 32, the cold end exchanges heat with the metal shield 31, and the hot end exchanges heat with the heat sink 21.

[0053] It is understood that there can be one, two, or more heat-conducting blocks 24. The metal shielding cover 31 and at least one heat-conducting block 24 being arranged side-by-side on the heat spreader 32 refers to being along the same direction (e.g.,...). Figure 5In the X direction, a metal shield 31 and at least one heat-conducting block 24 are arranged side by side in sequence. That is, one side of the metal shield 31 exchanges heat with the heat spreader 32, and one side of the heat spreader 32 exchanges heat with the heat spreader 32. The thermoelectric cooling device 22 is arranged on the side of the metal shield 31 away from the heat spreader 32. The cold end exchanges heat with the metal shield, and the hot end exchanges heat with the heat sink 21. In this way, part of the heat generated by the semiconductor device 30 is pumped to the hot end through the cold end of the thermoelectric cooling device 22 and discharged through the heat sink 21, and the other part is transferred to the heat sink 21 through the heat-conducting block 24 and discharged, which further improves the heat dissipation efficiency.

[0054] It is also understandable that thermal grease 25 is applied between the metal shield 31 and the thermoelectric cooling device 22, between the metal shield 31 and the heat spreader 32, between the heat-conducting block 24 and the heat spreader 32, and between the heat-conducting block 24 and the heat sink 21. This helps to reduce the thermal resistance caused by gaps between interfaces and reliably improves the heat exchange efficiency between interfaces. In actual manufacturing, in the thickness direction of the display device, the sum of the thickness of the thermoelectric cooling device 22 and the size of the metal shield 31 can be equal to the thickness of the heat-conducting block 24. This achieves good heat dissipation efficiency while ensuring the stability of the entire heat dissipation structure.

[0055] Among them, in the direction perpendicular to the thickness of the display device ( Figure 5 In the X and Y directions, the dimensions (a3 and b3) of the heat-conducting block 24 can be greater than or equal to the dimensions (a1 and b1) of the metal shield 31. Specifically, the dimensions of the heat-conducting block 24 are α times the dimensions of the metal shield 31, where α can be between 1.5 and 2. By enlarging the lateral dimensions by 1.5 to 2.0 times, efficient lateral heat diffusion is achieved for the high heat flux concentrated in the semiconductor device 30, reducing the heat load per unit area, avoiding local heat saturation, further improving the uniformity and efficiency of heat diffusion, and ensuring the stable operation of the heat dissipation structure in the entire heat flux range.

[0056] In the thickness direction of the display device, the projection of the thermoelectric cooling device 22 at least covers the projection of the metal shield 31, ensuring that the thermoelectric cooling device 22 provides full-area temperature control over the surface of the semiconductor device 30, eliminating heat leakage and temperature gradients in the edge area of ​​the heat source, ensuring a uniform temperature field on the surface of the semiconductor device 30, and avoiding performance degradation or device failure of the semiconductor device 30 due to local overheating.

[0057] It is also understandable that when the thermoelectric cooling device 22, the heat sink 21, the airflow generating device 23, the heat conducting block 24, and the metal shield 31 are projected into regular shapes (e.g., square or circular lights) in the thickness direction of the display device, the projection centers of the thermoelectric cooling device 22, the heat sink 21, the airflow generating device 23, the heat conducting block 24, and the metal shield 31 are roughly located on the same straight line. For example, but not limited to, the positional deviation can be 0.1mm-0.5mm. This helps to ensure that the heat flow transfer path is completely coincident with the airflow path of the air duct 13, reduce the additional thermal resistance and airflow disturbance caused by heat flow deflection, and achieve a high-efficiency heat dissipation structure with low thermal resistance and low wind resistance.

[0058] As a feasible approach, such as Figure 7 and Figure 8 As shown, a metal shield 31 and at least one heat-conducting block 24 are arranged side by side on a heat spreader 32. In the thickness direction of the display device, the side of the metal shield 31 facing away from the heat spreader 32 exchanges heat with the heat sink 21. A thermoelectric cooling device 22 is arranged on the side of at least one heat-conducting block 24 facing away from the heat spreader 32. The cold end exchanges heat with the heat-conducting block 24, and the hot end exchanges heat with the heat sink 21. The projection area of ​​the thermoelectric cooling device 22 at least covers the projection area of ​​the heat-conducting block 24.

[0059] The difference between this implementation and the above implementation is that in this implementation, the thermoelectric cooling device 22 covers the side of the heat-conducting block 24 away from the heat spreader 32. The cold end of the thermoelectric cooling device 22 exchanges heat with the heat-conducting block 24, and the hot end exchanges heat with the heat sink 21. Similarly, thermal grease 25 is provided between the thermoelectric cooling device 22 and the heat-conducting block 24. The projection area of ​​the thermoelectric cooling device 22 at least covers the projection area of ​​the heat-conducting block 24. This ensures that the heat from all parts of the heat-conducting block 24 can be pumped from the cold end of the thermoelectric cooling device 22 to the hot end and discharged through the heat sink 21.

[0060] It is understandable that in this implementation, in the thickness direction of the display device ( Figure 8 In the Z direction of the display device, the size of the metal shield 31 can be equal to the sum of the thickness of the heat-conducting block 24 and the thickness of the thermoelectric cooling device 22. The size of the thermoelectric cooling device 22 in the direction perpendicular to the thickness of the display device (a2 and b2) can be equal to the size of the heat-conducting block 24 in the direction perpendicular to the thickness of the display device (a3 and b3), and is α times the size of the metal shield 31 in the direction perpendicular to the thickness of the display device (a1 and b1), where the value of α is the same as above.

[0061] It is also understandable that at least one heat-conducting block 24 and a metal shield 31 are arranged side by side on the heat spreader 32. Each heat-conducting block 24 may be provided with a thermoelectric cooling device 22, or only one heat-conducting block 24 may be provided with a thermoelectric cooling device 22. Of course, when the number of heat-conducting blocks 24 is greater than two, some heat-conducting blocks 24 may be provided with thermoelectric cooling devices 22, while other heat-conducting blocks 24 may not be provided with thermoelectric cooling devices 22. The specific arrangement can be determined according to actual needs.

[0062] As a feasible approach, such as Figure 9 and Figure 10 As shown, the heat dissipation structure includes at least two heat-conducting blocks 24, each including a first heat-conducting block 241 and a second heat-conducting block 242 of different thicknesses. A metal shielding cover 31, the first heat-conducting block 241, and the second heat-conducting block 242 are arranged side-by-side on a heat spreader 32, along the thickness direction of the display device. Figure 10 In the Z direction), the metal shield 31, on the side away from the heat spreader 32, exchanges heat with the heat sink 21. The second heat-conducting block 242, on the side away from the heat spreader 32, exchanges heat with the heat sink 21. The thermoelectric cooling device 22 is disposed on the side of the first heat-conducting block 241 away from the heat spreader 32. The cold end exchanges heat with the first heat-conducting block 241, and the hot end exchanges heat with the heat sink 21. The projection of the thermoelectric cooling device 22 at least covers the projection of the first heat-conducting block 241. The thickness of the first heat-conducting block 241 is less than the thickness of the second heat-conducting block 242.

[0063] The implementation differs from the above implementation in that the heat-conducting block 24 includes a first heat-conducting block 241 and a second heat-conducting block 242 with different thicknesses. The thickness of the first heat-conducting block 241 is less than the thickness of the second heat-conducting block 242. In the thickness direction of the display device, the thermoelectric cooling device 22 is disposed on the side of the first heat-conducting block 241 away from the heat spreader 32. The first heat-conducting block 241 supports the thermoelectric cooling device 22, ensuring heat dissipation while allowing the thickness of the thermoelectric cooling device 22 and the first heat-conducting block 241 to be the same as the thickness of the second heat-conducting block 242. The thickness of the second heat-conducting block 242 is the same as the thickness of the metal shield 31. This ensures that the thickness of the thermal grease 25 between the interfaces of the components between the heat sink 21 and the heat spreader 32 is the same, reducing the interface thermal resistance.

[0064] In this implementation, part of the heat generated by the semiconductor device 30 is exchanged with the heat sink 21 through the metal shield 31 and discharged through the heat sink 21; part of the heat is exchanged with the second heat-conducting block 242 through the heat spreader 32 and then with the heat sink 21 through the second heat-conducting block 242 and discharged through the heat sink 21; another part of the heat is exchanged with the first heat-conducting block 241 through the heat spreader 32, the first heat-conducting block 241 and the thermoelectric cooling device 22, the thermoelectric cooling device 22 and the heat sink 21, and discharged through the heat sink 21. The increased convection velocity inside the air duct 13 defined by the airflow generating device 23 is beneficial to further improve the heat dissipation efficiency.

[0065] It is understood that the materials of the first heat-conducting block 241 and the second heat-conducting block 242 can be the same or different. Furthermore, the dimensions of the first heat-conducting block 241 perpendicular to the thickness direction of the display device, the dimensions of the thermoelectric cooling device 22 perpendicular to the thickness direction of the display device (a2 and b2), and the dimensions of the second heat-conducting block 242 perpendicular to the thickness direction of the display device (a3 and b3) are the same, and are α times the dimensions of the metal shielding cover 31 perpendicular to the thickness direction of the display device (a1 and b1), with the value of α being the same as described above.

[0066] As a feasible approach, such as Figure 11 and Figure 12 As shown, at least one heat-conducting block 24, a thermoelectric cooling device 22, and a metal shield 31 are arranged side by side on the heat spreader 32. In the thickness direction of the display device, the side of the metal shield 31 facing away from the heat spreader 32 exchanges heat with the heat sink 21, the side of the heat-conducting block 24 facing away from the heat spreader 32 exchanges heat with the heat sink 21, the hot end exchanges heat with the heat sink 21, and the cold end exchanges heat with the heat spreader 32.

[0067] In this embodiment, at least one heat-conducting block 24, a thermoelectric cooling device 22, and a metal shield 31 are arranged side by side on the heat spreader 32. In the thickness direction of the display device, the size of the metal shield 31, the thickness of the heat-conducting block 24, and the thickness of the thermoelectric cooling device 22 are as similar as possible. This ensures that the thickness of the thermal grease 25 between each interface is as similar as possible, which not only ensures heat dissipation efficiency but also ensures the stable operation of the entire heat dissipation structure.

[0068] The dimensions of the heat-conducting block 24 in the direction perpendicular to the display device (a3 and b3) are equal to the dimensions of the thermoelectric cooling device 22 in the direction perpendicular to the display device (a2 and b2), and are α times the dimensions of the metal shield 31 in the direction perpendicular to the thickness of the display device (a1 and b1), with the value of α being the same as described above.

[0069] In this embodiment, part of the heat generated by the semiconductor device 30 is exchanged with the heat sink 21 through the metal shield 31 and then discharged through the heat sink 21; part of the heat is exchanged with the heat conduction block 24 through the heat spreader 32 and the heat conduction block 24 and the heat sink 21, and then discharged through the heat sink 21; another part of the heat is exchanged with the thermoelectric cooling device 22 through the heat spreader 32 and the heat sink 21, and then discharged through the heat sink 21.

[0070] Secondly, embodiments of this application provide a heat dissipation control method for a display device according to the first aspect, specifically including the following steps: S10. Obtain the current temperature of the heat output area of ​​the display device; S20. If the current temperature is less than the first preset threshold, control the thermoelectric cooling device 22 and the airflow generating device 23 to remain in a de-energized state. S30. If the current temperature is greater than or equal to the first preset threshold and less than the second preset threshold, control the thermoelectric cooling device 22 to remain in the off state, and power on the airflow generating device 23 to be in the working state; the first preset threshold is less than the second preset threshold. S40. If the current temperature is greater than or equal to the second preset threshold, control both the thermoelectric cooling device 22 and the airflow generating device 23 to be powered on and in working condition.

[0071] It is understandable that the heat dissipation control method of the display device can be executed by the control system of the display device.

[0072] The display device has a built-in temperature sensor that is electrically connected to the control system. The temperature sensor can be used to collect the current temperature of the heat output area of ​​the display device and send it to the control system in real time. The control system has preset temperature threshold ranges for heat dissipation control. The first preset threshold and the second preset threshold can be determined according to actual needs. For example, the first preset threshold can be, but is not limited to, 40°C, and the second preset threshold can be, but is not limited to, 60°C.

[0073] For example, if the current temperature is less than 40°C, the semiconductor device 30 generates less heat, indicating that the display device is in a normal low-load working state, such as standby or daily work light. At this time, the control system controls the thermoelectric cooling period and the airflow generator 23 does not work. The heat generated by the semiconductor device 30 is transferred to the heat conduction block 24 through the heat spreader 32 and discharged through the heat sink 21. If the current temperature is greater than or equal to 40℃ and less than 60℃, after the heat generated by the semiconductor device 30 reaches a certain level, it indicates that the display device is working under normal load, such as watching video. At this time, the control system controls the thermoelectric cooling device 22 to not work, and the airflow generating device 23 to work. The heat generated by the semiconductor device 30 is transferred to the heat conduction block 24 through the heat spreader 32, and after passing through the heat sink 21, the airflow generating device 23 accelerates the heat dissipation. If the current temperature is greater than or equal to 60℃, the semiconductor device 30 generates a lot of heat, indicating that the display device is working under high load, such as gaming or edge AI computing. At this time, the control system controls the thermoelectric cooling device 22 to work and the airflow generating device 23 to work. Part of the heat generated by the semiconductor device 30 is transferred to the heat conduction block 24 through the heat spreader 32, and part is transferred to the thermoelectric cooling device 22. Finally, it passes through the heat sink 21, and the airflow generating device 23 accelerates the heat dissipation.

[0074] The heat dissipation control method of the display device according to an embodiment of this application will be described below through a specific example.

[0075] The display device includes a housing 10, a heat dissipation structure, and a control system. The housing 10 has an internal cavity, and an air inlet 11 and an air outlet 12 are provided on the housing 10. The heat dissipation structure includes a thermoelectric cooling device 22, a heat sink 21, a heat-conducting block 24, and an airflow generating device 23, such as... Figure 5 and Figure 6 As shown, the heat output area of ​​the display device includes a semiconductor device 30 and a heat spreader 32. The semiconductor device 30 is covered by a metal shield 31. The metal shield 31 and the heat conduction block 24 are arranged side by side on one side of the heat spreader 32. In the thickness direction of the display device, a thermoelectric cooling device 22 is provided on the side of the metal shield 31 away from the heat spreader 32. The cold end exchanges heat with the metal shield 31, and the hot end exchanges heat with the heat sink 21. The side of the heat conduction block 24 away from the heat spreader 32 exchanges heat with the heat sink 21. The interface between the heat-conducting block 24 and the heat sink 21 and the heat spreader 32 is filled with thermally conductive silicone grease 25. The interface between the thermoelectric cooling device 22 and the heat sink 21 and the metal shield 31 is also filled with thermally conductive silicone grease 25. The sum of the dimensions of the metal shield 31 in the thickness direction of the display device and the thickness of the thermoelectric cooling device 22 is equal to the thickness of the heat-conducting block 24. The projection area of ​​the metal shield 31 in the thickness direction of the display device at least covers the projection area of ​​the metal shield 31 in the thickness direction of the display device. The dimensions (a3 and b3) of the heat-conducting block 24 perpendicular to the thickness direction of the display device are α times the dimensions (a1 and b1) of the metal shield 31 perpendicular to the thickness direction of the display device. Figure 5 As shown, a3=α a1, b3 = α b1, α is 1.5-2.0, and the thickness h of the thermoelectric cooling device 22 is 5μm-100μm.

[0076] In practical use, the heat dissipation control method of the display device is as follows: When the temperature sensor detects that the temperature of the semiconductor device is less than 40°C, the semiconductor device generates less heat and the display device is in normal low-load operation, such as standby or scheduled operation. At this time, the control system controls the airflow generator and thermoelectric cooling device 22 to not work. The heat generated by the semiconductor device is transferred to the heat conduction block through the heat spreader and then dissipated into the environment through the heat sink. When the temperature sensor detects that the temperature of the semiconductor device is between 40℃ and 60℃, and the heat generated by the semiconductor device reaches a considerable level, the display device operates under normal load, such as watching videos. At this time, the control system controls the thermoelectric cooling device 22 to stop working, and the airflow generator to work. The heat generated by the semiconductor device is transferred to the heat conduction block through the heat spreader, and then dissipated into the environment through the heat sink and the airflow generator.

[0077] When the temperature of the semiconductor device collected by the temperature sensor is greater than 60°C, the heat generated by the semiconductor device reaches a high level, and the display device is working under high load, such as gaming or edge AI computing. At this time, the thermoelectric cooling device 22 and the fan are working simultaneously. The heat generated by the semiconductor device is transferred to the thermoelectric cooling device 22 and the heat spreader, and then dissipated into the environment through the heat sink and the airflow generator.

[0078] When the temperature of the semiconductor device collected by the temperature sensor is greater than 60℃, the energy efficiency curve test process of the semiconductor device of the display device is as follows: Using a certain simulation software (mobile port version), the no-load test Power0 (base power consumption) is performed, the CPU frequency is adjusted, the Score (score) and the whole power consumption Power1 at each frequency are tested, the no-load power consumption PowerX is calculated, the Score and no-load power consumption PowerX at each frequency are obtained, the fitting curve is generated, and the power consumption vs. score curve is plotted.

[0079] Taking passive cooling as an example: The SPEC test code is cross-compiled to run on the phone's ARM architecture and Android system, dynamically locking the CPU frequency (e.g., 1.0GHz, 1.5GHz, 2.0GHz...). A power analyzer directly supplies power to the phone's motherboard, monitoring and recording the real-time power consumption of the entire device during benchmarking, then subtracting the idle power consumption. (Idle power consumption refers to the "basic power consumption" before the test begins, after the phone boots up and enters the system, without running any test programs, with the screen on (or uniformly set to always be off). At each frequency point, the SPECint 2017 Speed ​​test is run to obtain a performance score (higher is better). The performance score measured at each frequency point is used as the Y-axis, and "power consumption" as the X-axis, resulting in an energy efficiency curve as shown below. Figure 1 As shown in Table 1, the cooling effect and performance maintenance of display devices under three heat dissipation methods are as follows: pure passive heat dissipation (without introducing active heat dissipation devices such as airflow generators and thermoelectric cooling devices 22), active heat dissipation (built-in airflow generators), and active heat dissipation (thermoelectric cooling device 22 system, including thermoelectric cooling devices 22 and airflow generators).

[0080] Table 1 Comparison of different heat dissipation methods

[0081] Note: An excellent curve located in the upper left corner means "low power consumption and strong performance" (i.e., high energy efficiency); a normal curve located in the lower right corner means "high power consumption and weak performance" (i.e., low energy efficiency).

[0082] After introducing and operating the thermoelectric cooling device 22, the energy efficiency curves for the device were obtained using the same method described above. The power consumption of the two curves corresponding to the same fraction was then calculated, and the difference was taken to obtain the system power consumption at that fraction after introducing the thermoelectric cooler. Table 1 shows that the thermoelectric cooling device 22 system can control the semiconductor device temperature at an extremely low 40℃. Compared to passive cooling alone and internal airflow generation cooling, the semiconductor device temperature in the thermoelectric cooling device 22 system is significantly lower than the other two solutions, creating an optimal working environment for the chip. The system power consumption decreased from 7.4W to 6.4W, and the total power consumption was the lowest. The mobile phone semiconductor device consumed 5.1W, and the thermal cooling system consumed 1.3W (including 1.1W of power consumption from the thermoelectric cooling device 22 + 0.2W of power consumption from the secondary airflow generator; the thermoelectric cooling device 22 works in conjunction with the airflow generator to form the thermoelectric cooling device 22 system). This demonstrates that with powerful heat dissipation capabilities, the semiconductor device can operate with higher energy efficiency. The extremely low temperature means that the semiconductor device has greater overclocking potential and a longer-lasting peak performance maintenance capability, making it the first choice for pursuing ultimate performance. Built-in airflow generator: The chip temperature is significantly reduced from 69.1℃ to 59.8℃ by passive heat dissipation, effectively avoiding performance degradation caused by overheating. However, the total power consumption is 6.5W, and the stable temperature of the semiconductor device at 59.8℃ is much lower than the semiconductor device temperature of the thermoelectric cooling device 22 system.

[0083] In addition, the upper limit of the capability of the pure airflow generator was evaluated, from Figure 14 It is evident that with continuously increasing power consumption, the improvement in fan cooling capacity is limited.

[0084] To compare the heat dissipation of a standalone airflow generator and the thermoelectric cooling device 22 system while maintaining the same temperature for the semiconductor devices, the specific test method is as follows: Under passive cooling conditions, the power consumption and CPU temperature curves of the display device are tested. Taking the thermoelectric cooling device 22 system test process as an example, SPECint2017 (mobile port version) is used, cross-compiled to ARM64, the CPU frequency is locked after rooting the phone, a power analyzer is used to replace battery power and record idle power consumption, SPEC tests are run sequentially at each frequency point, and the overall power consumption and semiconductor device CPU temperature are collected simultaneously. After each round, the device is forcibly cooled to 25℃ (to prevent the results of the previous round of testing (e.g., target temperature 55℃) from affecting the next round of testing (e.g., continuing to test at 45℃)). Finally, the total power consumption (minus idle power consumption) - chip temperature curve of the thermoelectric cooling device 22 system is plotted, as shown below. Figure 15 and Figure 16 As shown in the figure, as the temperature requirements of semiconductor devices decrease, the total power consumption of the thermoelectric cooling device 22 is significantly lower than that of a simple airflow generating device below the critical temperature (42°C@5W / 47°C@10W), and it can achieve low-temperature heat dissipation that a simple airflow generating device cannot achieve.

[0085] It should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., used above to indicate orientation or positional relationships are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the panel or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the invention, unless otherwise stated, "a plurality of" means two or more.

[0086] The above description is merely a preferred embodiment of this application and an explanation of the technical principles employed. Those skilled in the art should understand that the scope of the invention involved in this application is not limited to technical solutions formed by specific combinations of the above-described technical features, but should also cover other technical solutions formed by arbitrary combinations of the above-described technical features or their equivalents without departing from the inventive concept. For example, technical solutions formed by substituting the above features with (but not limited to) technical features with similar functions disclosed in this application.

Claims

1. A display device, characterized in that, include: A housing, the housing defining an internal cavity; A heat dissipation structure is disposed inside the inner cavity. The heat dissipation structure includes a thermoelectric cooling device and a heat sink. The thermoelectric cooling device has a hot end and a cold end. The hot end exchanges heat with the heat sink, and the cold end exchanges heat with the heat output area of ​​the display device.

2. The display device according to claim 1, characterized in that, The housing has an air outlet and an air inlet. The radiator defines an air outlet duct inside the inner cavity. The air inlet and the air outlet are each connected to the air outlet duct. The heat dissipation structure also includes an airflow generating device located inside the air outlet duct.

3. The display device according to claim 1, characterized in that, In the thickness direction of the display device, the projection of the heat sink at least covers the projection of the thermoelectric cooling device.

4. The display device according to any one of claims 1-3, characterized in that, The heat output area includes a semiconductor device and a heat spreader, and the semiconductor device is covered with a metal shield on at least one side.

5. The display device according to claim 4, characterized in that, The metal shield and the thermoelectric cooling device are arranged side by side on the heat exchange plate. In the thickness direction of the display device, the side of the metal shield away from the heat exchange plate exchanges heat with the heat sink, the cold end exchanges heat with the heat exchange plate, and the hot end exchanges heat with the heat sink.

6. The display device according to claim 4, characterized in that, The metal shield is disposed on the heat spreader plate. In the thickness direction of the display device, the thermoelectric cooling device is disposed on the side of the metal shield away from the heat spreader plate, and the cold end exchanges heat with the metal shield and the hot end exchanges heat with the heat sink.

7. The display device according to claim 4, characterized in that, The heat dissipation structure further includes at least one heat-conducting block, which is disposed between the heat sink and the heat spreader.

8. The display device according to claim 7, characterized in that, The metal shield and the at least one heat-conducting block are arranged side by side on the heat spreader. In the thickness direction of the display device, the thermoelectric cooling device is arranged on the side of the metal shield away from the heat spreader. The cold end exchanges heat with the metal shield and the hot end exchanges heat with the heat sink.

9. The display device according to claim 5 or 8, characterized in that, In the thickness direction of the display device, the projection of the thermoelectric cooling device at least covers the projection of the metal shield.

10. The display device according to claim 7, characterized in that, The metal shield and the at least one heat-conducting block are arranged side by side on the heat spreader. In the thickness direction of the display device, the side of the metal shield away from the heat spreader exchanges heat with the heat sink. The thermoelectric cooling device is arranged on the side of the at least one heat-conducting block away from the heat spreader. The cold end exchanges heat with the heat-conducting block, and the hot end exchanges heat with the heat sink. The projection area of ​​the thermoelectric cooling device at least covers the projection area of ​​the heat-conducting block. Alternatively, the heat dissipation structure includes at least two heat-conducting blocks, each comprising a first heat-conducting block and a second heat-conducting block of different thicknesses. The metal shield, the first heat-conducting block, and the second heat-conducting block are arranged side-by-side on the heat spreader. In the thickness direction of the display device, the side of the metal shield facing away from the heat spreader exchanges heat with the heat sink, and the side of the second heat-conducting block facing away from the heat spreader exchanges heat with the heat sink. The thermoelectric cooling device is disposed on the side of the first heat-conducting block facing away from the heat spreader. The cold end exchanges heat with the first heat-conducting block, and the hot end exchanges heat with the heat sink. The projection of the thermoelectric cooling device at least covers the projection of the first heat-conducting block, and the thickness of the first heat-conducting block is less than the thickness of the second heat-conducting block.

11. The display device according to claim 7, characterized in that, The at least one heat-conducting block, the thermoelectric cooling device, and the metal shield are arranged side by side on the heat exchange plate. In the thickness direction of the display device, the side of the metal shield away from the heat exchange plate exchanges heat with the heat sink, the side of the heat-conducting block away from the heat exchange plate exchanges heat with the heat sink, the hot end exchanges heat with the heat sink, and the cold end exchanges heat with the heat exchange plate.

12. The display device according to any one of claims 5-11, characterized in that, In the thickness direction of the display device, the thickness of the thermoelectric cooling device is 5μm-100μm.

13. A heat dissipation control method for a display device according to any one of claims 7-12, characterized in that, Specifically, the steps include the following: Obtain the current temperature of the heat output area of ​​the display device; If the current temperature is less than a first preset threshold, the thermoelectric cooling device and the airflow generating device are kept in a de-energized state. If the current temperature is greater than or equal to the first preset threshold and less than the second preset threshold, the thermoelectric cooling device is kept in a de-energized state, and the airflow generating device is powered on and in working state; the first preset threshold is less than the second preset threshold. If the current temperature is greater than or equal to the second preset threshold, the thermoelectric cooling device and the airflow generating device are both powered on and put into operation.

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