An ultrasonic probe

Abstract

The utility model discloses an ultrasonic probe, include: shell, shell has the area for with operator contact, transducer, transducer sets up in the shell, uniform temperature part, uniform temperature part sets up in the shell, thermoelectric cooler, the cold end of thermoelectric cooler and transducer heat conduction connection, the hot end of thermoelectric cooler and uniform temperature part heat conduction connection, phase change energy storage part, phase change energy storage part and uniform temperature part heat conduction connection, wherein, thermoelectric cooler has working condition and stop state, in thermoelectric cooler is in stop state, transducer, thermoelectric cooler and uniform temperature part form passive heat conduction route, in thermoelectric cooler is in working condition, transducer, thermoelectric cooler and uniform temperature part form active heat conduction route. The ultrasonic probe provided by the utility model can adjust the heat transferred to the shell according to the actual situation on the basis of meeting the heat dissipation demand of the transducer, improve the flexibility of the heat dissipation mode, optimize the heat dissipation mode to adapt to the actual demand.

Description

Technical Field

[0001] This utility model relates to the field of ultrasonic equipment technology, and in particular to an ultrasonic probe. Background Technology

[0002] During the use of an ultrasonic probe, the temperature of the ultrasonic transducer will rise, affecting the performance of the ultrasonic probe. In order to reduce the impact on the performance of the ultrasonic probe, it is necessary to dissipate heat from the ultrasonic transducer so that at least some of the heat from the ultrasonic transducer can be conducted to the outer shell of the ultrasonic probe and dissipated into the external environment.

[0003] However, when the operator holds the ultrasonic probe, the outer casing comes into contact with the operator, and excessively high temperatures from the outer casing can affect the operator's use.

[0004] Therefore, how to optimize heat dissipation is a problem that urgently needs to be solved by those in this technical field. Utility Model Content

[0005] In view of this, the present invention provides an ultrasonic probe to optimize heat dissipation.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] An ultrasonic probe, comprising:

[0008] A housing having an area for contact with the operator;

[0009] A transducer, wherein the transducer is disposed within the housing;

[0010] A temperature equalization component, wherein the temperature equalization component is disposed within the housing;

[0011] A thermoelectric cooler, wherein the cold end of the thermoelectric cooler is thermally connected to the transducer, and the hot end of the thermoelectric cooler is thermally connected to the temperature equalization component;

[0012] A phase change energy storage component, wherein the phase change energy storage component is thermally connected to the temperature equalization component;

[0013] in,

[0014] The thermoelectric cooler has an operating state and a stopped state;

[0015] When the thermoelectric cooler is in the stopped state, the transducer, the thermoelectric cooler, and the temperature equalization component form a passive heat conduction path;

[0016] When the thermoelectric cooler is in the operating state, the transducer, the thermoelectric cooler, and the temperature equalization component form an active heat conduction path.

[0017] Optionally, in the above-mentioned ultrasonic probe, the temperature equalization component is thermally connected to the outer shell.

[0018] Optionally, in the above-mentioned ultrasonic probe, the phase change energy storage component and the heat equalization component are thermally connected on the side facing away from the outer shell.

[0019] Optionally, in the ultrasonic probe described above, the phase change energy storage component has a first side facing the transducer, and the first side is provided with a heat insulation component.

[0020] Optionally, in the above-mentioned ultrasonic probe, the temperature equalization component and the outer shell are thermally connected by pressure-sensitive adhesive.

[0021] Optionally, in the above-mentioned ultrasonic probe, the thermoelectric cooler has a ceramic substrate and a bismuth telluride thermoelectric arm.

[0022] Optionally, in the above-mentioned ultrasonic probe, the temperature equalization component is made of graphite sheet.

[0023] Optionally, in the above-mentioned ultrasonic probe, the thermoelectric cooler and the transducer are thermally connected through a first thermally conductive pad, and the thermoelectric cooler and the temperature equalization component are thermally connected through a second thermally conductive pad.

[0024] Optionally, in the above-mentioned ultrasonic probe, the phase change energy storage component has a sulfide paraffin capable of solid-solid phase change;

[0025] Alternatively, the phase change energy storage component may be a solid-liquid phase change energy storage component.

[0026] Optionally, in the ultrasonic probe described above, a temperature sensor is provided inside the housing, and the temperature sensor is communicatively connected to the thermoelectric cooler or the transducer.

[0027] As can be seen from the above technical solution, the ultrasonic probe provided by this utility model, through the above settings, can further adjust the heat transferred to the outer shell according to the actual situation while meeting the heat dissipation requirements of the transducer, thereby improving the flexibility of the heat dissipation method, so as to further optimize the heat dissipation method to adapt to actual needs. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 A cross-sectional view of the ultrasonic probe provided in an embodiment of this utility model;

[0030] Figure 2 This is a schematic diagram of the exploded structure of an ultrasonic probe provided in an embodiment of the present invention;

[0031] Figure 3 A first data comparison diagram of the ultrasonic probe provided in this embodiment of the present invention with other solutions;

[0032] Figure 4 A second data comparison chart of the ultrasonic probe provided in this embodiment of the present invention and other solutions. Detailed Implementation

[0033] This utility model discloses an ultrasonic probe to optimize heat dissipation.

[0034] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0035] like Figure 1 and Figure 2 As shown, this utility model embodiment provides an ultrasonic probe, including a transducer 101, a housing 102, a thermoelectric cooler 103, a temperature equalization component 104, and a phase change energy storage component 105.

[0036] The housing 102 has an area for contact with the operator, that is, the operator can hold the housing 102 of the ultrasound probe so that the heat of the housing 102 can be exchanged with the operator through the area in contact with the operator.

[0037] The transducer 101 and the temperature equalization component 104 are disposed inside the housing 102. The cold end of the thermoelectric cooler 103 is thermally connected to the transducer 101, and the hot end of the thermoelectric cooler 103 is thermally connected to the temperature equalization component 104. The phase change energy storage component 105 is thermally connected to the temperature equalization component 104.

[0038] Through the above configuration, the heat absorbed by the transducer 101 through the thermoelectric cooler 103 in the temperature equalization component 104 can be transferred to the outer casing 102 and the phase change energy storage component 105. That is, of the total heat transferred from the transducer 101 to the temperature equalization component 104 through the thermoelectric cooler 103, a portion of the heat transferred to the outer casing 102 can be dissipated into the external environment, while the other portion of the heat transferred to the phase change energy storage component 105 can be stored. Since the heat transferred to the outer casing 102 will affect its temperature, thus impacting the operator, storing the other portion of the heat transferred to the phase change energy storage component 105 effectively reduces the amount of heat transferred to the outer casing 102 (a portion of the heat) while keeping the total heat constant. This effectively avoids the outer casing 102 becoming too hot (e.g., causing operator discomfort or exceeding relevant regulatory limits), while meeting the heat dissipation requirements of the transducer 101, thereby ensuring the performance of the ultrasonic probe.

[0039] In some embodiments, the thermoelectric cooler 103 has an operating state and a stopped state;

[0040] When the thermoelectric cooler 103 is in a stopped state, the transducer 101, the thermoelectric cooler 103 and the temperature equalization component 104 form a passive heat conduction path.

[0041] When the thermoelectric cooler 103 is in operation, the transducer 101, the thermoelectric cooler 103, and the temperature equalization component 104 form an active heat conduction path.

[0042] When a current (such as direct current) is applied to the thermoelectric cooler 103, due to the Peltier effect (i.e., the inverse effect of the Seebeck effect, where one junction absorbs heat and the other releases heat when current passes through the contact point of two different materials (such as metal or semiconductor), one side of the thermoelectric cooler 103 heats up and is called the hot end, while the other side cools down and is called the cold end. That is, when a current (direct current) is applied to the thermoelectric cooler 103, the thermoelectric cooler 103 is in operation, and the temperature of the cold end of the thermoelectric cooler 103, which is thermally connected to the transducer 101, decreases, thereby suppressing the temperature rise of the transducer 101. A portion of the heat discharged from the hot end of the thermoelectric cooler 103 is diffused to the inner surface of the outer casing 102 through the temperature equalization component 104. The temperature equalization effect of the temperature equalization component 104 prevents the generation of local hot spots in the outer casing 102, and this portion of heat can be dissipated to the environment through the outer casing 102. Another portion of the heat is diffused to the phase change energy storage component 105 through the temperature equalization component 104 and absorbed, thereby suppressing the temperature rise of the temperature equalization component 104 and the outer casing 102.

[0043] Therefore, when the thermoelectric cooler 103 is in a stopped state, that is, no current is applied to the thermoelectric cooler 103, the heat from the transducer 101 can be transferred to the temperature equalization component 104 due to the thermal conductivity of the thermoelectric cooler 103 itself, so that the transducer 101, the thermoelectric cooler 103 and the temperature equalization component 104 form a passive heat conduction path.

[0044] When the thermoelectric cooler 103 is in operation, i.e., when current is applied to the thermoelectric cooler 103, the hot end of the thermoelectric cooler 103 can release heat and its cold end can absorb heat. Combined with the thermal conductivity of the thermoelectric cooler 103 itself, the transducer 101, the thermoelectric cooler 103 and the temperature equalization component 104 form an active heat conduction path.

[0045] Given that the transducer 101, thermoelectric cooler 103 and temperature equalization component 104 have the same structure and the temperature difference between the transducer 101 and the temperature equalization component 104 is constant, the amount of heat transferred from the thermoelectric cooler 103 to the temperature equalization component 104 varies depending on whether the thermoelectric cooler 103 is in a working state or a stopped state.

[0046] With the above settings, the heat transferred to the housing 102 can be further adjusted according to the actual situation while meeting the heat dissipation requirements of the transducer 101, thereby improving the flexibility of the heat dissipation method and making it easier to further optimize the heat dissipation method to adapt to actual needs.

[0047] Furthermore, while the temperature of the housing 102 does not exceed the limit, the thermoelectric cooler 103 is fully utilized to cool and dissipate heat from the transducer 101, thereby allowing the transducer 101 to operate with greater power consumption, which is beneficial to improving the signal-to-noise ratio and image quality of the ultrasonic signal.

[0048] like Figure 3 and Figure 4 As shown, conventional embodiment 1 is an ultrasonic probe that includes only a transducer and a housing, without a thermoelectric cooler and a phase change energy storage component. Conventional embodiment 2 is an ultrasonic probe that includes only a transducer, a housing, and a thermoelectric cooler, without a phase change energy storage component. The embodiments are embodiments of this utility model.

[0049] like Figure 3 The diagram shows a comparison of transducer lens temperature rise on a phantom at 33°C. Under the same transducer power consumption, the ultrasonic probe provided in this embodiment of the invention has the lowest lens temperature rise. That is, under the same lens temperature rise, the ultrasonic probe provided in this embodiment of the invention allows the highest ultrasonic transducer power consumption.

[0050] like Figure 4 As shown, the ultrasonic probe housing temperature rise is compared in an air environment of 30°C. The ultrasonic probe provided in this embodiment of the present invention has a moderate housing temperature rise value.

[0051] The transducer 101 includes a lens layer, a matching layer, a piezoelectric layer, a backing layer, and necessary electronic circuitry stacked sequentially. The piezoelectric layer serves as the lens layer, enabling it to contact the patient.

[0052] In some embodiments, the temperature-equalizing component 104 is thermally connected to the housing 102. That is, the temperature-equalizing component 104 is thermally coupled to the housing 102. It is understood that thermal coupling refers to achieving surface contact using methods with low thermal resistance, including filling with thermally conductive interface materials (such as thermally conductive adhesive, thermally conductive gel, thermally conductive silicone grease, graphite sheets, etc.), bonding, welding, mechanical fixing (such as threaded connections, riveting, etc.). By thermally connecting the temperature-equalizing component 104 to the housing 102, the arrangement of the temperature-equalizing component 104 within the housing 102 is facilitated, and the heat from the temperature-equalizing component 104 is also facilitated to conduct heat from the housing 102.

[0053] Alternatively, the temperature equalization component 104 can be connected to the outer casing 102 via a heat-conducting component; or, the temperature equalization component 104 and the outer casing 102 can be spaced apart, and relative heat conduction can be achieved through the filling medium (such as air or heat exchange fluid) inside the outer casing 102.

[0054] Since the temperature equalization component 104 is thermally connected to the outer casing 102, in order to optimize the spatial layout, the phase change energy storage component 105 is thermally connected to the side of the temperature equalization component 104 facing away from the outer casing 102. That is, both sides of the temperature equalization component 104 are connected to the outer casing 102 and the phase change energy storage component 105 respectively, so as to achieve thermal coupling between the temperature equalization component 104 and both the outer casing 102 and the phase change energy storage component 105.

[0055] To prevent heat from the high-temperature phase change energy storage component 105 from being transferred to the lower-temperature transducer 101 via thermal conduction, thermal radiation, or thermal convection, the phase change energy storage component 105 has a first side facing the transducer 101, and a heat insulation component 108 is provided on the first side. The heat insulation component 108 may have a low thermal conductivity (e.g., less than 0.2 W / m / K), thereby reducing the efficiency of heat conduction from the first side of the phase change energy storage component 105 to the transducer 101, and minimizing the transfer of heat from the phase change energy storage component 105 to the transducer 101, thus preventing the transducer 101 from being affected.

[0056] Specifically, the heat insulation component 108 can be a plastic component, a rubber component, an aerogel structure, a vacuum insulation panel, or a foamed plastic structure, etc.

[0057] In some specific embodiments, the thermal coupling method between the temperature equalization component 104 and the outer shell 102 is pressure-sensitive adhesive bonding, that is, the temperature equalization component 104 and the outer shell 102 are bonded together by pressure-sensitive adhesive to achieve thermally conductive connection.

[0058] The thermoelectric cooler 103 may have a ceramic substrate and a bismuth telluride thermoelectric arm. Due to the Peltier effect, it can have a hot end and a cold end. Of course, the thermoelectric cooler 103 may also have a substrate and thermoelectric arm made of other materials; no specific limitations are imposed here, and all are within the scope of protection.

[0059] To achieve the desired temperature uniformity, the temperature uniformity component 104 can be made of metals (such as aluminum and aluminum alloys, copper and copper alloys, magnesium and magnesium alloys, etc.), non-metals (such as graphite, graphene, boron nitride, etc.), ceramics (such as alumina ceramics, aluminum nitride ceramics, etc.), or other materials. Preferably, the temperature uniformity component 104 is made of graphite sheets to avoid risks such as electrical conductivity.

[0060] The temperature equalization component 104 may also include vacuum chamber devices (such as heat pipes, flattened heat pipes, vacuum chamber temperature equalization plates, etc.) to further improve the temperature equalization effect.

[0061] To ensure temperature uniformity, the temperature uniform component 104 has a high thermal conductivity (e.g., greater than 1 W / m / K) and at least covers part of the inner surface of the outer casing.

[0062] The thermoelectric cooler 103 is thermally connected to the transducer 101 via a first thermally conductive pad 107, and the thermoelectric cooler 103 is thermally connected to the temperature equalization component 104 via a second thermally conductive pad 106. That is, the cold end of the thermoelectric cooler 103 is thermally connected to the transducer 101 via the first thermally conductive pad 107 to improve the heat transfer between the cold end of the thermoelectric cooler 103 and the transducer 101. The hot end of the thermoelectric cooler 103 is thermally connected to the transducer 101 via the second thermally conductive pad 106 to improve the heat transfer between the hot end of the thermoelectric cooler 103 and the temperature equalization component 104.

[0063] The phase change energy storage component 105 has a phase change point. When the temperature rises above the phase change point, at least a portion of the phase change energy storage component 105 changes from one phase structure to another phase structure, while absorbing a large amount of heat (e.g., phase change enthalpy > 80 J / g).

[0064] The phase transition point can be set according to the actual usage requirements of the ultrasonic probe, and can be any value between 20 and 50°C.

[0065] The phase change energy storage component 105 can have a solid-solid or solid-liquid structure before and after the phase change.

[0066] The phase change energy storage material used to fabricate the phase change energy storage component 105 can have a high thermal conductivity (e.g., greater than 1 W / m / K), and the phase change energy storage material used to fabricate the phase change energy storage component 105 can be interwoven or wrapped by structures with a high thermal conductivity (e.g., greater than 1 W / m / K). The structure interwoven or wrapped by the phase change energy storage material of the phase change energy storage component 105 can be one or more of expanded graphite, graphite sheets, metal fins, foamed metal, or metal cavities.

[0067] Optionally, the temperature-equalizing component 104 can be an outer shell 102 or a part of the outer shell 102. For example, the ultrasonic probe may have an outer shell 102 made of metal material, and at least a portion of the outer shell 102 made of metal material may be the temperature-equalizing component 104. Alternatively, the metal component may be formed into the outer shell 102 by secondary injection molding of plastic, and the metal component may serve as the temperature-equalizing component 104.

[0068] In some embodiments, the phase change energy storage component 105 can be a solid-solid phase change energy storage component. The phase change energy storage component 105 may contain sulfidated fossil wax capable of solid-solid phase change. The phase change point of the sulfidated fossil wax is approximately 35°C, meaning that when the temperature rises above 35°C, at least a portion of the sulfidated fossil wax in the phase change energy storage component 105 transforms from one phase structure to another to achieve energy storage.

[0069] In other embodiments, the phase change energy storage component 105 can be a solid-liquid phase change energy storage component. Specific details are not provided here, and all are within the scope of protection.

[0070] Furthermore, a temperature sensor 109 is provided inside the housing 102, and the temperature sensor 109 is communicatively connected to the thermoelectric cooler 103 or the transducer 101.

[0071] The temperature sensor 109 can be connected to the processor via electronic circuitry or wireless communication. The processor receives the temperature data collected by the temperature sensor 109 and can control the thermoelectric cooler 103 or the transducer 101 based on the temperature data, thereby realizing the communication connection between the temperature sensor 109 and the thermoelectric cooler 103 or the transducer 101.

[0072] Taking the communication connection between temperature sensor 109 and thermoelectric cooler 103 as an example, the temperature data collected by temperature sensor 109 can be used as a parameter to control the operation of thermoelectric cooler 103 (such as working state and stop state). The collected temperature data can be used to calculate the temperature of the outer surface of housing 102. Based on the temperature value, the processor adjusts the operation of thermoelectric cooler 103, such as whether to input current to switch thermoelectric cooler 103 between working state and stop state; or, adjust the magnitude of the current input to thermoelectric cooler 103 to adjust the heat transfer efficiency between transducer 101 and temperature equalization component 104, etc.

[0073] Alternatively, the temperature sensor 109 can be connected to the transducer 101 via communication. The temperature data collected by the temperature sensor 109 can be used as a parameter to control the operation of the transducer 101. The collected temperature data can be used to calculate the temperature of the outer surface of the housing 102. Based on the temperature value, the processor adjusts the operation of the transducer 101, such as adjusting the transmission voltage of the transducer 101 to adjust its heat dissipation.

[0074] The above settings can effectively prevent the temperature of the outer casing 102 from becoming too high, causing discomfort to the operator or exceeding relevant regulatory limits.

[0075] The ultrasonic probe provided in this embodiment of the invention includes a specific ultrasonic probe thermal control method as follows:

[0076] First, the ultrasonic probe is powered on or connected to the ultrasonic system host and operates normally. At this time, the transducer 101 has a non-zero input power (P1≠0), and the thermoelectric cooler 103 has a non-zero input power (P2≠0). That is, both the transducer 101 and the thermoelectric cooler 103 are in a conductive state, making the thermoelectric cooler 103 operational. The cold end of the thermoelectric cooler 103 cools the transducer 101, suppressing the temperature rise of the transducer 101; and the temperature of the hot end of the thermoelectric cooler 103 rises, causing the temperature rise of the outer casing 102 to increase, and the temperature value collected by the temperature sensor also increases.

[0077] Then, temperature sensor 109 collects temperature data. Tsensor It also sends temperature data back to the processor. Temperature acquisition. Tsensor This represents the actual temperature surrounding the temperature sensor 109.

[0078] Then, the processor calculates the estimated surface temperature of the casing 102 using methods such as calculation or table lookup. Tcasing Among them, the temperature was collected. Tsensor It can be used to calculate and estimate surface temperature. Tcasing The parameters, namely, the temperature of the sampled sample. Tsensor With the calculated surface temperature Tcasing Related.

[0079] The processor compares and calculates the surface temperature. Tcasing The relationship between the value of the first defined temperature T1 and the temperature of comfort for the operator (e.g., 43°C). When calculating the surface temperature... Tcasing When T1 is less than or equal to 1, temperature sensor 109 can continue to collect temperature data. Tsensor And the operation of feeding back temperature data to the processor; when calculating the surface temperature Tcasing When the value is greater than T1, further adjustments can be made.

[0080] During subsequent adjustments, the processor controls the operation of the thermoelectric cooler 103. The input power of the thermoelectric cooler 103 can be zero (i.e., P2=0), causing the thermoelectric cooler 103 to be in a stopped state to prevent the heat transferred from the hot end of the thermoelectric cooler 103 from causing further temperature rise in the outer casing 102. At this time, the heat generated by the transducer 101 is transferred to the temperature equalization component 104 and the outer casing 102 via passive heat conduction through the thermoelectric cooler 103, and then dissipated to the environment through the outer casing 102.

[0081] The processor compares and calculates the surface temperature. Tcasing The relationship between the second limiting temperature T2 and T1, where T2 > T1. T2 can be set as the upper temperature limit of the enclosure 102 as restricted by regulations (e.g., 48°C). When calculating the surface temperature... Tcasing When T2 is ≤, temperature sensor 109 can continue to collect temperature data. Tsensor And the operation of feeding back temperature data to the processor; when calculating the surface temperature Tcasing When the time reaches T2, subsequent operations can be performed.

[0082] In subsequent operations, the processor controls the operation of transducer 101. The input power of transducer 101 can be zero (i.e., P1=0), so that transducer 101 stops working to avoid the transducer 101 generating heat that would cause the outer casing 102 to heat up further.

[0083] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0084] The above description of the disclosed embodiments enables those skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An ultrasonic probe, characterized in that, include: A housing having an area for contact with the operator; A transducer, wherein the transducer is disposed within the housing; A temperature equalization component, wherein the temperature equalization component is disposed within the housing; A thermoelectric cooler, wherein the cold end of the thermoelectric cooler is thermally connected to the transducer, and the hot end of the thermoelectric cooler is thermally connected to the temperature equalization component; A phase change energy storage component, wherein the phase change energy storage component is thermally connected to the temperature equalization component; in, The thermoelectric cooler has an operating state and a stopped state; When the thermoelectric cooler is in the stopped state, the transducer, the thermoelectric cooler, and the temperature equalization component form a passive heat conduction path; When the thermoelectric cooler is in the operating state, the transducer, the thermoelectric cooler, and the temperature equalization component form an active heat conduction path.

2. The ultrasonic probe as described in claim 1, characterized in that, The temperature equalization component is thermally connected to the outer casing.

3. The ultrasonic probe as described in claim 2, characterized in that, The phase change energy storage component and the heat equalization component are thermally connected to each other on the side facing away from the outer shell.

4. The ultrasonic probe as described in claim 2, characterized in that, The phase change energy storage component has a first side facing the transducer, and the first side is provided with a heat insulation component.

5. The ultrasonic probe as described in claim 2, characterized in that, The temperature equalization component is thermally connected to the outer shell via pressure-sensitive adhesive.

6. The ultrasonic probe as described in claim 1, characterized in that, The thermoelectric cooler has a ceramic substrate and a bismuth telluride thermoelectric arm.

7. The ultrasonic probe as described in claim 1, characterized in that, The temperature equalization component is made of graphite sheet.

8. The ultrasonic probe as described in claim 1, characterized in that, The thermoelectric cooler and the transducer are thermally connected via a first thermally conductive pad, and the thermoelectric cooler and the temperature equalization component are thermally connected via a second thermally conductive pad.

9. The ultrasonic probe as described in claim 1, characterized in that, The phase change energy storage component has a sulfide paraffin capable of solid-solid phase change; Alternatively, the phase change energy storage component may be a solid-liquid phase change energy storage component.

10. The ultrasonic probe according to any one of claims 1-9, characterized in that, A temperature sensor is installed inside the housing, and the temperature sensor is communicatively connected to the thermoelectric cooler or the transducer.

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