Semiconductor work-in-process selection methods and systems, apparatuses, devices, and media
By automating the selection of work-in-process, the problems of time consumption and omissions caused by manual selection are solved, thereby improving the efficiency and resource utilization of semiconductor production.
CN116796037BActive Publication Date: 2025-12-05CHANGXIN MEMORY TECH INC
2 Cites 0 Cited by
Patent Information
- Application Number
- CN202210255935.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-03-15
- Publication Date
- 2025-12-05
- Estimated Expiration
- 2042-03-15
AI Technical Summary
Technical Problem
In current semiconductor manufacturing processes, manual selection of work-in-process (WIP) is time-consuming and prone to omissions, resulting in wafer waste.
Method used
The selection scheme for work-in-process is automatically determined by the server or terminal device. Based on the product production requirements and the target tail code range, the selection is automated, replacing manual operation.
Benefits of technology
It improves the efficiency of work-in-process selection, avoids the time waste and omissions caused by manual selection, and enhances resource utilization and product effectiveness.
✦ Generated by Eureka AI based on patent content.
Abstract
The present disclosure relates to a work-in-process (WIP) selection method and device in a semiconductor production process, electronic equipment and a computer readable storage medium, and relates to the technical field of semiconductor production and manufacturing, and can be applied to the scene of WIP selection in a semiconductor production and manufacturing process. The method comprises: obtaining product production requirements, determining a target tail code range and a demand ratio of WIP required by a first process station according to the product production requirements; determining a selection scheme of WIP corresponding to each tail code in the target tail code range according to the target tail code range and the demand ratio; and selecting corresponding WIP at the first process station based on the selection scheme, and pushing the selected WIP to a corresponding lower production process. The present disclosure can avoid a large amount of time consumption caused by manual selection and distribution of online WIP, and can avoid wafer waste caused by possible omissions in manual selection to achieve the required ratio.
Need to check novelty before this filing date? Find Prior Art