Preparation method and preparation device of glass through hole
By using mask coating and magnetic powder grinding in laser induced etching, the problems of edge rupture of ultra-thin glass through-holes and high inner wall roughness are solved, and a more regular and smooth through-hole preparation is achieved.
CN120127007APending Publication Date: 2025-06-10ZHEJIANG CHUANGROU DISPLAY TECH CO LTD +1
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Patent Information
- Application Number
- CN202510160727.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-13
- Publication Date
- 2025-06-10
AI Technical Summary
Technical Problem
In the process of processing through holes of ultra-thin glass using laser induced etching, problems often occur with the edge of the through hole and the roughness of the inner wall of the through hole.
Method used
The glass substrate is coated with a mask, and the holes are prefabricated by pulsed laser, and then etched in the etching liquid, and polished and polished by reciprocating movement of magnetic powder in the magnetic field to reduce the roughness of the inner wall of the through hole.
Benefits of technology
It effectively avoids fission at the edge of the prefabricated hole, improves the regularity of the through holes and the smoothness of the inner wall, and reduces the difficulty of subsequent grinding and polishing.
✦ Generated by Eureka AI based on patent content.
Abstract
The invention provides a preparation method and a preparation device of a glass through hole, and relates to the technical field of glass preparation. The preparation method comprises the following steps: S1, providing a glass substrate, and carrying out surface pretreatment on the glass substrate; s2, performing prefabricated punching on the target area of the glass substrate by adopting pulse laser so as to form a prefabricated hole in the target area; s3, performing etching and magnetic grinding on the prefabricated hole of the glass substrate; s4, carrying out surface post-treatment on the glass substrate to prepare the glass substrate with a through hole; wherein etching and magnetic grinding are carried out on the prefabricated hole in the step S3, specifically, the glass substrate is soaked in etching liquid for etching, polishing and grinding are carried out on the prefabricated hole through reciprocating motion of magnetic powder in a magnetic field, and the etching liquid is a ternary mixed acid system formed by mixing hydrogen fluoride, hydrogen chloride and nitric acid.
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