Anti-interference vibration temperature composite sensor

Abstract

The present application belongs to the technical field of vibration and temperature detection, and particularly relates to an anti-interference vibration and temperature composite sensor, which comprises a shell, the shell defining a first chamber and a second chamber; a vibration sensing element accommodated in the first chamber; a temperature sensing element accommodated in the second chamber; a circuit board accommodated in the first chamber; a shielding cover covering the vibration sensing element; a first potting body made of low-thermal-conductivity material is arranged in the first chamber, and a second potting body made of high-thermal-conductivity material is arranged in the second chamber; and an air gap is arranged between the second potting body and the vibration sensing element. By arranging the air gap between the second potting body and the vibration sensing element, the direct extrusion of the axial expansion stress of the second potting body due to thermal expansion and cold contraction on the vibration sensing element is effectively relieved, so that the bonding interface between the vibration sensing element and the first wall of the shell is prevented from being invalid due to stress concentration.

Description

Technical Field

[0001] This invention belongs to the field of vibration and temperature detection technology, and specifically relates to an anti-interference vibration and temperature composite sensor. Background Technology

[0002] A vibration-temperature composite sensor is a device that integrates vibration sensing and temperature measurement functions. It is widely used in industrial equipment inspection, fault diagnosis, and predictive maintenance, such as in axle boxes, gearboxes, and motors of intelligent high-speed trains to detect vibration and temperature signals. To achieve miniaturization, existing vibration-temperature composite sensors typically coaxially mount the vibration detection module and the temperature detection module. The temperature detection module can penetrate into the mounting holes of the equipment under test to accurately identify the temperature of critical components, while the vibration detection module contacts the outer casing of the equipment to sense its mechanical vibration.

[0003] In a vibration-temperature composite sensor, the vibration detection module and temperature detection module are encapsulated within the same housing. To ensure the mechanical reliability and detection accuracy of the sensing elements, the encapsulation area of ​​the temperature detection module is typically filled with thermally conductive adhesive, while the encapsulation area of ​​the vibration detection module is typically filled with structural adhesive. The vibration detection module is usually located between the structural adhesive and the thermally conductive adhesive. However, because the encapsulation area of ​​the temperature detection module generally has a relatively long longitudinal dimension, the thermal expansion and contraction of the thermally conductive adhesive is more pronounced in environments with drastic temperature changes. The expansion of the thermally conductive adhesive will generate axial stress on the vibration detection module. Since the vibration detection module is generally bonded to the inner wall of the housing with structural adhesive, the stress exerted by the thermally conductive adhesive may cause the bonding surface between the vibration detection module and the housing to fail. Consequently, the vibration of the housing cannot be fully transmitted to the vibration detection module, reducing the sensor's lifespan. Furthermore, the sensitive elements of the vibration detection module, such as piezoelectric components, are susceptible to external signal interference, which can affect its detection accuracy. Summary of the Invention

[0004] In view of the shortcomings of the prior art described above, the purpose of this invention is to provide an anti-interference vibration temperature composite sensor that can improve service life and detection accuracy.

[0005] To achieve the above and other related objectives, the present invention provides an anti-interference vibration-temperature composite sensor, comprising:

[0006] The housing defines a first chamber and a second chamber protruding from a first wall of the first chamber in a first direction; the first direction is the normal to the first wall; the end of the second chamber away from the first chamber is an integrally closed structure.

[0007] A vibration sensing element is housed in the first chamber and mounted on the first wall. The projection of the vibration sensing element in the first direction covers the projection of the second chamber in the first direction. A wire passage connecting the first chamber and the second chamber is reserved between the vibration sensing element and the first wall.

[0008] A temperature sensing element is housed in the second chamber, and the communication area between the second chamber and the first chamber is configured to allow the temperature sensing element to pass through.

[0009] A circuit board is housed in the first chamber, and the circuit board is electrically connected to the vibration sensing element and the temperature sensing element respectively via signal lines;

[0010] A shielding cover is provided over the vibration sensing element, and the shielding cover is provided with an electrical connection for grounding;

[0011] The first chamber contains a first potting compound made of a low thermal conductivity material, and the second chamber contains a second potting compound made of a high thermal conductivity material;

[0012] An air gap is provided between the second potting compound and the vibration sensing element.

[0013] In an optional embodiment of the present invention, the first chamber is provided with an exhaust channel, one end of which is connected to the air gap and the other end is connected to the atmosphere.

[0014] In an optional embodiment of the present invention, the housing has a second wall opposite to the first wall, the second wall is provided with a cable connector, and the circuit board is disposed close to the second wall.

[0015] In an optional embodiment of the present invention, the electrical connection portion includes a hollow tube extending from one end of the shield near the first wall toward the second wall. A radial channel is provided on the side wall of the second chamber near the end of the vibration sensing element. The radial channel communicates with the central hole of the hollow tube, and the radial channel and the central hole of the hollow tube constitute the exhaust channel.

[0016] In an optional embodiment of the present invention, the wire passage includes a groove disposed radially on the first wall along the second chamber.

[0017] In an optional embodiment of the present invention, an insert is provided on the first wall, the insert including a tubular portion and a protruding portion radially protruding from the outer wall of the tubular portion; the tubular portion is installed in a recess provided on the first wall, and the tubular portion is coaxially arranged with the second chamber, the protruding portion is disposed in the groove, and a gap is provided between the protruding portion and the bottom and end of the groove for the signal line to pass through.

[0018] In an alternative embodiment of the invention, the radial channel is disposed on the insert.

[0019] In an optional embodiment of the present invention, the vibration sensing element includes a base and a piezoelectric assembly. The piezoelectric assembly is mounted on the base, the base is bonded to the first wall, the edge of the base protrudes beyond the edge of the piezoelectric assembly, and a shielding cover is disposed on the piezoelectric assembly, with the end face of the shielding cover fitting against the surface of the base. The hollow tube includes a fixing part integrally formed with the outer wall of the shielding cover and a detachable part connected to the fixing part. The base is provided with a hole or groove through which the fixing part passes, and the fixing part communicates with the radial channel through the hole or groove.

[0020] In an optional embodiment of the present invention, a third potting compound made of a low thermal conductivity material is provided in the cavity between the shield and the piezoelectric component.

[0021] In an optional embodiment of the present invention, the shielding cover is provided with a via for the signal line to pass through at one end away from the base, and a rigid sleeve is provided in the area of ​​the signal line that mates with the via.

[0022] The technical advantages of this invention are as follows: By creating an air gap between the second potting body and the vibration sensing element, this invention effectively alleviates the direct compression of the vibration sensing element by the axial expansion stress generated by the thermal expansion and contraction of the second potting body. This prevents the bonding interface between the vibration sensing element and the first wall of the housing from failing due to stress concentration. The buffering effect of the air gap not only ensures the stability of the vibration transmission path and guarantees that the vibration of the housing can be reliably transmitted to the vibration sensing element, but also reduces the mechanical interference of temperature changes on the vibration detection module through physical isolation. Ultimately, this improves the long-term reliability and detection accuracy of the sensor and extends its service life. Attached Figure Description

[0023] Figure 1 This is a perspective view of the anti-interference vibration temperature composite sensor provided in an embodiment of the present invention;

[0024] Figure 2 This is a cross-sectional view of the anti-interference vibration temperature composite sensor provided in an embodiment of the present invention;

[0025] Figure 3 This is an exploded view of the anti-interference vibration temperature composite sensor provided in an embodiment of the present invention;

[0026] Figure 4 This is an exploded view of the first wall of the housing and the insert provided in an embodiment of the present invention;

[0027] Figure 5This is an exploded view of the shielding cover provided in an embodiment of the present invention;

[0028] Figure 6 This is an exploded view of the vibration sensing element provided in an embodiment of the present invention;

[0029] Explanation of reference numerals in the attached drawings: 10, housing; 101, first chamber; 1011, first potting compound; 102, second chamber; 1021, second potting compound; 1022, air gap; 11, first wall; 111, groove; 112, recess; 12, second wall; 13, first cylinder; 14, second cylinder; 15, insert; 151, tubular part; 152, protrusion; 153, radial channel; 20, vibration sensing element; 21, base; 211, hole; 22, piezoelectric assembly; 23, rigid sleeve; 30, temperature sensing element; 40, shield; 401, third potting compound; 41, electrical connection part; 411, fixing part; 412, detachable part; 42, through hole; 50, circuit board; 60, cable connector. Detailed Implementation

[0030] The following specific examples illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that, unless otherwise specified, the following embodiments and features described therein can be combined with each other.

[0031] It should be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of the present invention. Therefore, the illustrations only show the components related to the present invention and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0032] The vibration-temperature composite sensor provided by this invention is used to simultaneously detect vibration and temperature signals of a device. To ensure the temperature detection section is as close as possible to the target temperature measurement area of ​​the device, the temperature sensing element needs to be mounted at the end of a tubular structure. During temperature measurement, this tubular structure is inserted into the device. The tubular structure is filled with a heat-conducting medium. Due to the large axial dimension of the tubular structure, the thermal expansion and contraction of the heat-conducting medium in the axial direction is significant. To prevent the heat-conducting medium from compressing the vibration sensing element during expansion, this invention incorporates an air gap between the heat-conducting medium and the vibration sensing element. This air gap buffers the expansion of the heat-conducting medium, preventing direct compression of the vibration sensing element and thus avoiding failure of the adhesive surface between the vibration sensing element and the housing. This ensures normal vibration transmission between the housing and the vibration sensing element, extending the service life of the vibration-temperature composite sensor. The technical solution of this invention will be described in detail below with reference to specific embodiments.

[0033] Please see Figures 1-6As shown, the anti-interference vibration-temperature composite sensor provided in the embodiment of the present invention includes a housing 10, a vibration sensing element 20, a temperature sensing element 30, a circuit board 50, and a shielding cover 40. The housing 10 defines a first chamber 101 and a second chamber 102 protruding from the first wall 11 of the first chamber 101 in a first direction. The first direction is the normal direction of the first wall 11. The end of the second chamber 102 away from the first chamber 101 is an integrally closed structure. The vibration sensing element 20 is housed in the first chamber 101 and mounted on the first wall 11. The projection of the vibration sensing element 20 in the first direction covers the projection of the second chamber 102 in the first direction. A space is reserved between the vibration sensing element 20 and the first wall 11 to communicate with the first chamber 101. A wiring passage is provided between the first chamber 101 and the second chamber 102; a temperature sensing element 30 is housed in the second chamber 102, and the communication area between the second chamber 102 and the first chamber 101 is configured to allow the temperature sensing element 30 to pass through; a circuit board 50 is housed in the first chamber 101, and the circuit board 50 is electrically connected to the vibration sensing element 20 and the temperature sensing element 30 respectively via signal lines; a shield 40 is provided over the vibration sensing element 20, and the shield 40 is provided with an electrical connection portion 41 for grounding; a first potting compound 1011 made of low thermal conductivity material is provided in the first chamber 101, and a second potting compound 1021 made of high thermal conductivity material is provided in the second chamber 102; an air gap 1022 is provided between the second potting compound 1021 and the vibration sensing element 20. This embodiment effectively alleviates the direct compression of the vibration sensing element 20 by providing an air gap 1022 between the second potting body 1021 and the vibration sensing element 20 due to the axial expansion stress of the second potting body 1021 caused by thermal expansion and contraction. This avoids the failure of the bonding interface between the vibration sensing element 20 and the first wall 11 of the housing 10 due to stress concentration. The buffering effect of the air gap 1022 not only ensures the stability of the vibration transmission path and ensures that the vibration of the housing 10 can be reliably transmitted to the vibration sensing element 20, but also reduces the mechanical interference of temperature changes on the vibration detection module through physical isolation. Ultimately, this improves the long-term reliability and detection accuracy of the sensor and extends its service life.Since the connecting area between the second chamber 102 and the first chamber 101 allows the temperature sensing element 30 to pass through, the temperature sensing element 30 can be installed into the second chamber 102 from one side of the first chamber 101. The side of the second chamber 102 away from the first chamber 101 can be designed as an integral closed structure. By designing the end of the second chamber 102 away from the first chamber 101 as an integral closed structure and using the connecting area between the first chamber 101 and the second chamber 102 as the installation channel for the temperature sensing element 30, the risk of weld defects caused by the traditional welded end cap structure is completely eliminated. This not only improves the overall sealing performance and structural strength of the second chamber 102, but also simplifies the assembly process, avoids the problem of internal component thermal damage or sealing performance degradation that may be caused by welding, and makes the sensor end appearance flatter, thus improving the reliability of the product.

[0034] Please see Figure 2 As shown, in an optional embodiment of the present invention, an exhaust channel is provided in the first chamber 101, one end of which is connected to the air gap 1022 and the other end is connected to the atmosphere. This further embodiment, by providing an exhaust channel connecting the air gap 1022 to the atmosphere within the first chamber 101, can promptly discharge gas remaining in the air gap 1022 due to temperature changes or the potting process, preventing imbalance in the expansion stress transmission or the formation of a sealing cavity effect due to air pressure fluctuations. This further stabilizes the buffering performance of the air gap 1022, ensuring that the thermal expansion stress of the thermally conductive potting compound is always effectively released, while preventing gas accumulation from affecting the mechanical coupling stability or long-term reliability of the vibration sensing element 20.

[0035] Please see Figure 2 , Figure 3As shown, in an optional embodiment of the present invention, the housing 10 has a second wall 12 opposite to the first wall 11, and a cable connector 60 is provided on the second wall 12. The circuit board 50 is disposed close to the second wall 12. In a specific embodiment, in order to facilitate the assembly and packaging of the components, the housing 10 can be configured as multiple split structures, and then the split structures can be welded into a whole. For example, the first wall 11 and the second wall 12 can be configured as independent structures, and a cylindrical sidewall can be provided between the first wall 11 and the second wall 12. In order to further facilitate packaging, the cylindrical sidewall can be further divided into a first cylindrical body 13 and a second cylindrical body 14. This further embodiment, by designing the housing 10 as a split structure, significantly improves the assembly convenience and packaging efficiency of the internal components of the sensor, facilitating the precise positioning and installation of the vibration sensing element 20, the temperature sensing element 30, and the circuit board 50. At the same time, the split structure optimizes the implementation of the potting process, ensuring the uniformity of filling of the first potting body 1011 and the second potting body 1021, and reducing packaging stress. Thus, while ensuring the mechanical strength of the sensor, it further improves the reliability of the overall structure and the flexibility of the production process.

[0036] Please see Figure 2 , Figure 5 As shown, in an optional embodiment of the present invention, the electrical connection portion 41 includes a hollow tube extending from one end of the shield 40 near the first wall 11 toward the second wall 12. A radial channel 153 is provided on the side wall of the second chamber 102 adjacent to the end of the vibration sensing element 20. The radial channel 153 communicates with the central hole of the hollow tube, and the radial channel 153 and the central hole of the hollow tube constitute the exhaust channel. This further embodiment cleverly utilizes the grounding structure of the shield 40 to form an exhaust channel by connecting the hollow tube of the shield 40 to the radial channel 153 of the second chamber 102. This achieves reliable communication between the air gap 1022 and the external atmosphere to balance air pressure, while avoiding the problem of reduced sealing caused by additional exhaust holes. Simultaneously, the hollow tube structure enhances the mechanical strength of the shield 40, ensuring that the electromagnetic shielding effect is not affected by the exhaust function, further optimizing the stability and integration of the sensor.

[0037] Please see Figure 2 , Figure 4As shown, in an optional embodiment of the present invention, the cable passage includes a groove 111 radially disposed on the first wall 11 along the second chamber 102; an insert 15 is provided on the first wall 11, the insert 15 including a tubular portion 151 and a protruding portion 152 radially protruding from the outer wall of the tubular portion 151; the tubular portion 151 is installed in a recess 112 disposed on the first wall 11, and the tubular portion 151 is coaxially disposed with the second chamber 102, the protruding portion 152 is disposed in the groove 111, and a gap is provided between the protruding portion 152 and the bottom and end of the groove 111 for the signal line to pass through; the radial channel 153 is disposed on the insert 15. This further embodiment provides a groove 111 with an insert 15 in the first wall 11. The tubular portion 151 and protrusion 152 of the insert 15 are used for precise positioning, forming a wire passage and a radial channel 153. This ensures the orderly arrangement and reliable fixation of the signal lines, preventing cable displacement or wear under vibration. Simultaneously, the integrated radial channel 153 design of the insert 15 further optimizes the sealing of the exhaust path and the feasibility of the manufacturing process, improving the overall structural strength and long-term reliability of the sensor. In a specific embodiment, the insert 15 can be made of insulating material, for example, and can be press-fitted to the first wall 11. When filling the second chamber 102, the exhaust channel can be blocked first. At this time, since the gas in the top area of ​​the second chamber 102 cannot be discharged, the filling material will be prevented from entering the area, thus forming the air gap 1022 at the top of the second chamber 102. After filling, the exhaust channel can be opened. During filling, the gas is naturally blocked to form the air gap 1022, which eliminates the need for precision molds or post-processing steps required for traditional air gap processing. The insert 15, as an independent component, can be formed separately by injection molding or machining, avoiding the direct processing of complex channels on the main structure of the shell, and reducing the processing accuracy requirements of the first wall 11.

[0038] Please see Figure 5 , Figure 6As shown, in an optional embodiment of the present invention, the vibration sensing element 20 includes a base 21 and a piezoelectric assembly 22. The piezoelectric assembly 22 is mounted on the base 21, the base 21 is bonded to the first wall 11, the edge of the base 21 protrudes beyond the edge of the piezoelectric assembly 22, the shield 40 covers the piezoelectric assembly 22, and the end face of the shield 40 is in contact with the surface of the base 21. The hollow tube includes a fixing part 411 integrally formed with the outer wall of the shield 40, and a detachable part 412 connected to the fixing part 411. The base 21 is provided with a hole 211 or groove through which the fixing part 411 passes, and the fixing part 411 communicates with the radial channel 153 through the hole or groove. This further embodiment simplifies the assembly process and improves the structural compactness by designing the hollow tube of the shield 40 as a combination of a fixed part 411 and a detachable part 412, and by using the holes / grooves on the base 21 to achieve communication with the radial channel 153. This improves the anti-interference performance while taking into account the mechanical reliability of the sensor.

[0039] Please see Figure 2 As shown, in an optional embodiment of the present invention, a third potting compound 401 made of a low thermal conductivity material is provided in the cavity between the shielding cover 40 and the piezoelectric component 22. This further embodiment, by filling the cavity between the shielding cover 40 and the piezoelectric component 22 with a third potting compound 401 made of a low thermal conductivity material, effectively blocks external temperature fluctuations from interfering with the thermal conduction of the piezoelectric component 22, thereby significantly improving the temperature stability and detection accuracy of the vibration sensing element 20. Simultaneously, the third potting compound 401 also enhances the mechanical fixation and moisture-proof sealing performance of the piezoelectric component 22, further optimizing the sensor's resistance to environmental interference and long-term operational reliability. In a specific embodiment, the first potting compound 1011 and the third potting compound 401 can be, for example, epoxy resin, and the second potting compound 1021 can be, for example, silicone.

[0040] In an optional embodiment of the present invention, the shielding cover 40 has a through-hole 42 at the end away from the base 21 for the signal line to pass through, and a rigid sleeve 23 is provided on the area of ​​the signal line that mates with the through-hole 42. This further embodiment, by providing a signal line through-hole 42 with a rigid sleeve 23 at the end of the shielding cover 40 away from the base 21, ensures reliable fixation of the signal line in a vibration environment, prevents stress from being generated on the signal line during the curing of the first potting compound 1011, and improves the mechanical reliability of the encapsulation structure.

[0041] In summary, by providing an air gap 1022 between the second potting body 1021 and the vibration sensing element 20, this invention effectively alleviates the direct compression of the vibration sensing element 20 by the axial expansion stress generated by the thermal expansion and contraction of the second potting body 1021. This prevents the bonding interface between the vibration sensing element 20 and the first wall 11 of the housing 10 from failing due to stress concentration. The buffering effect of the air gap 1022 not only ensures the stability of the vibration transmission path and guarantees that the vibration of the housing 10 can be reliably transmitted to the vibration sensing element 20, but also reduces the mechanical interference of temperature changes on the vibration detection module through physical isolation, ultimately improving the long-term reliability and detection accuracy of the sensor and extending its service life. By providing an exhaust channel connecting the air gap 1022 to the atmosphere in the first chamber 101, gas remaining in the air gap 1022 due to temperature changes or potting process can be discharged in a timely manner, preventing the air gap 1022 from becoming unbalanced in expansion stress transmission or forming a sealed cavity due to air pressure fluctuations. This effect further stabilizes the buffering performance of the air gap 1022, ensuring that the thermal expansion stress of the thermally conductive potting compound is always effectively released, while preventing gas accumulation from affecting the mechanical coupling stability or long-term reliability of the vibration sensing element 20. By connecting the hollow tube of the shield 40 to the radial channel 153 of the second chamber 102, the grounding structure of the shield 40 is cleverly used to form an exhaust channel. This achieves reliable communication between the air gap 1022 and the external atmosphere to balance the air pressure, while avoiding the problem of reduced sealing caused by additional exhaust holes. At the same time, the hollow tube structure enhances the mechanical properties of the shield 40. The strength ensures that the electromagnetic shielding effect is not affected by the exhaust function, further optimizing the stability and integration of the sensor; by setting a groove 111 with an insert 15 in the first wall 11, the tubular part 151 and the protrusion 152 of the insert 15 are used to accurately position and form a wire passage and a radial channel 153, which not only ensures the orderly arrangement and reliable fixation of the signal lines, avoiding the displacement or wear of the cables under vibration, but also the integrated radial channel 153 design of the insert 15 further optimizes the sealing and process feasibility of the exhaust path, and improves the overall structural strength and long-term reliability of the sensor; By designing the hollow tube of the shielding cover 40 as a combination of a fixed part 411 and a detachable part 412, and utilizing the holes / grooves on the base 21 to achieve communication with the radial channel 153, the assembly process is simplified and the structural compactness is improved, thereby enhancing the anti-interference performance while ensuring the mechanical reliability of the sensor. By providing a signal line through-hole 42 with a rigid sleeve 23 at the end of the shielding cover 40 away from the base 21, reliable fixation of the signal line in a vibration environment is ensured, preventing stress from being generated on the signal line when the first potting body 1011 is cured, thus improving the mechanical reliability of the encapsulation structure.

[0042] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in the present invention should still be covered by the claims of the present invention.

[0043] Throughout this description, numerous specific details, such as examples of components and / or methods, are provided to provide a complete understanding of embodiments of the invention. However, those skilled in the art will recognize that embodiments of the invention may be practiced without one or more of these specific details or by other devices, systems, components, methods, parts, materials, components, etc. In other instances, well-known structures, materials, or operations have not been specifically shown or described in detail to avoid obscuring aspects of embodiments of the invention.

Claims

1. An anti-interference vibration-temperature composite sensor, characterized in that, include: A housing (10) defines a first chamber (101) and a second chamber (102) extending from a first wall (11) of the first chamber (101) in a first direction; the first direction is the normal of the first wall (11); the end of the second chamber (102) away from the first chamber (101) is an integral closed structure; A vibration sensing element (20) is housed in the first chamber (101) and mounted on the first wall (11). The projection of the vibration sensing element (20) in the first direction covers the projection of the second chamber (102) in the first direction. A wire passage is reserved between the vibration sensing element (20) and the first wall (11) to connect the first chamber (101) and the second chamber (102). A temperature sensing element (30) is housed in the second chamber (102), and the communication area between the second chamber (102) and the first chamber (101) is configured to allow the temperature sensing element (30) to pass through. A circuit board (50) is housed in the first chamber (101), and the circuit board (50) is electrically connected to the vibration sensing element (20) and the temperature sensing element (30) respectively via signal lines; A shield (40) is provided on the vibration sensing element (20), and the shield (40) is provided with an electrical connection part (41) for grounding. The first chamber (101) is provided with a first potting body (1011) made of a low thermal conductivity material, and the second chamber (102) is provided with a second potting body (1021) made of a high thermal conductivity material. An air gap (1022) is provided between the second potting body (1021) and the vibration sensing element (20). The wire passage includes a groove (111) arranged radially along the second chamber (102) on the first wall (11). An insert (15) is provided on the first wall (11). The insert (15) includes a tubular part (151) and a protruding part (152) that protrudes radially from the outer wall of the tubular part (151). The tubular part (151) is installed in a recess (112) provided on the first wall (11), and the tubular part (151) is coaxially arranged with the second chamber (102). The protruding part (152) is provided in the groove (111), and a gap is provided between the protruding part (152) and the bottom and end of the groove (111) for the signal line to pass through. The first chamber (101) is provided with an exhaust channel, one end of which is connected to the air gap (1022) and the other end is connected to the atmosphere.

2. The anti-interference vibration temperature composite sensor according to claim 1, characterized in that, The housing (10) has a second wall (12) opposite to the first wall (11), and a cable connector (60) is provided on the second wall (12). The circuit board (50) is located close to the second wall (12).

3. The anti-interference vibration temperature composite sensor according to claim 2, characterized in that, The electrical connection part (41) includes a hollow tube extending from one end of the shield (40) near the first wall (11) toward the second wall (12). A radial channel (153) is provided on the side wall of the second chamber (102) near the end of the vibration sensing element (20). The radial channel (153) communicates with the central hole of the hollow tube. The radial channel (153) and the central hole of the hollow tube constitute the exhaust channel.

4. The anti-interference vibration temperature composite sensor according to claim 3, characterized in that, The radial channel (153) is disposed on the insert (15).

5. The anti-interference vibration temperature composite sensor according to claim 3, characterized in that, The vibration sensing element (20) includes a base (21) and a piezoelectric assembly (22). The piezoelectric assembly (22) is mounted on the base (21). The base (21) is bonded to the first wall (11). The edge of the base (21) protrudes beyond the edge of the piezoelectric assembly (22). The shield (40) covers the piezoelectric assembly (22), and the end face of the shield (40) is in contact with the surface of the base (21). The hollow tube includes a fixing part (411) integrally formed with the outer wall of the shield (40) and a detachable part (412) connected to the fixing part (411). The base (21) is provided with a hole (211) or groove through which the fixing part (411) passes. The fixing part (411) communicates with the radial channel (153) through the hole or groove.

6. The anti-interference vibration temperature composite sensor according to claim 5, characterized in that, A third potting compound (401) made of low thermal conductivity material is provided in the cavity between the shield (40) and the piezoelectric component (22).

7. The anti-interference vibration temperature composite sensor according to claim 6, characterized in that, The shield (40) has a via (42) at one end away from the base (21) for the signal line to pass through, and a rigid sleeve (23) is provided in the area of ​​the signal line that mates with the via (42).

Images