Three-dimensional vertical inductance device and preparation method thereof

Through the three-dimensional vertical inductor device with a multi-layer magnetic thin film composite structure, the miniaturization and high efficiency problems of integrated inductor devices are solved, high integration and high inductance are achieved, and it is suitable for high-frequency and high dynamic response power management applications.

CN120600474APending Publication Date: 2025-09-05HANGZHOU DIANZI UNIV
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Patent Information

Application Number
CN202510733037.3
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-06-04
Publication Date
2025-09-05

AI Technical Summary

Technical Problem

Existing integrated inductor devices are difficult to achieve miniaturization, high efficiency and high integration in high-performance chips. The inductance value of traditional hollow coil structures is limited, and embedded magnetic cores and vertical inductor structures have problems such as complex processes, high costs or poor packaging compatibility.

Method used

The three-dimensional vertical inductor device adopts a multi-layer magnetic film composite structure. By embedding a composite magnetic core in the packaging substrate and utilizing a three-dimensional wiring method of conductive columns and horizontal conductors, combined with hot pressing and drilling processes, a vertical closed path of magnetic flux is achieved, eddy current loss is suppressed, and inductance and packaging compatibility are enhanced.

Benefits of technology

Significantly reduces the board area of ​​the inductor and improves the inductor performance. It is suitable for high-density integrated power systems, increases current density and power density, and adapts to high-frequency, high-dynamic response power management scenarios.

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Abstract

The invention discloses a three-dimensional vertical inductance device and a preparation method thereof. The three-dimensional vertical inductance device comprises a packaging substrate, a composite magnetic core, a vertical inductance column, a horizontal conductor and an interconnected conductive column. The composite magnetic core is formed by alternately stacking insulating dielectric layers and magnetic layers and is provided with a plurality of vertical inductance columns, each inductance column is composed of a conductive column and a vertical dielectric layer on the periphery of the conductive column, and the vertical dielectric layers are used for isolating the conductive columns from the magnetic layers. The packaging substrate can be of a structure with a plate core or without a plate core, and the composite magnetic core is packaged by embedding the packaging substrate into the blind groove or directly hot-pressing the packaging substrate. The horizontal conductors are connected with the conductive columns to improve the total inductance value, and the interconnected conductive columns achieve connection of the upper substrate and the lower substrate. The three-dimensional vertical inductor disclosed by the invention has good packaging compatibility, can realize a relatively large inductance value in a limited substrate area and height, improves the efficiency and the power density of a power supply, and is suitable for a high-integration power supply scheme.
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