Capacitive feedback two-stage lever MEMS security device with fusing lock pin device

Abstract

A capacitive feedback two-stage lever MEMS security device with a fusing lock pin device comprises a lower security chip and an upper security chip connected with the lower security chip, and motion of a silicon baffle is controlled by an electric heating actuator to realize control of detonation energy; meanwhile, multiple mechanisms are arranged to improve the overall rigidity of the device, and the possible failure condition of the device due to the fact that the partition plates are burst open is avoided; in addition, a feedback function is introduced, and real-time feedback of the working state of the MEMS security device is realized by measuring capacitance. The system has the advantages of being intelligent, safe and miniaturized.

Description

Technical Field

[0001] This invention relates to the field of miniature ammunition technology, specifically to a capacitive feedback dual-stage lever MEMS security device with a fusible locking pin device. Background Technology

[0002] As a crucial component of weapon systems, security devices control the energy transfer of energetic materials in the detonation sequence, and their operation directly affects the safe and reliable detonation of weapons and ammunition. MEMS security devices utilize microelectromechanical systems technology, driving the movement of micro-partitions through various actuation methods (such as electrothermal, electromagnetic, and inertial actuation) to control micro-detonation energy. They feature mass production capabilities, low cost, miniaturization, intelligence, and integration, making them highly valuable for improving the miniaturization and intelligence of weapons.

[0003] However, in practical applications, due to the high integration of micro-munitions, the operation of MEMS security devices, such as those disclosed in patent application CN113916072A ("A Multiphysics Field De-escalation MEMS Security Device"), is often difficult to observe directly, affecting the overall intelligence of the micro-munition. Furthermore, for MEMS security devices applied to ignition and detonation, such as those in patent application CN112033227A ("Controllable Ignition Energy Multimode MEMS Pyrotechnic"), the high-temperature gases generated by the flame explosion may breach the partition of the security mechanism, causing the security device to malfunction and affecting the safety of the micro-munition. Therefore, it is urgent to address these two shortcomings to improve the operational capabilities of MEMS security devices. Summary of the Invention

[0004] To overcome the shortcomings of the prior art, the present invention aims to provide a capacitor feedback dual-stage lever MEMS security device with a fusible locking pin device. This device utilizes an electrothermal actuator to control the movement of a silicon baffle, thereby controlling the detonation energy. Simultaneously, multiple mechanisms are incorporated to enhance the overall rigidity of the device, preventing potential failure due to the baffle being breached. Furthermore, a feedback function is introduced, using capacitance measurement to provide real-time feedback on the operating status of the MEMS security device. The device possesses advantages of intelligence, safety, and miniaturization.

[0005] To achieve the above objectives, the technical solution adopted by the present invention is as follows:

[0006] A capacitive feedback dual-stage lever MEMS security device with a fusible locking pin includes a lower security chip 100 and an upper security chip 200 connected thereto.

[0007] The lower security chip 100 includes a lower security chip substrate 101, on which two lower multi-stage lever actuators 300-1 and two lower fuse locking pins 400-1 are disposed symmetrically around a center. Each lower multi-stage lever actuator 300-1 is connected to a lower driving electrode 103, a lower common electrode 102 and a lower detection electrode 104 symmetrically distributed around a center. Each lower fuse locking pin 400-1 is connected to a lower fuse electrode 108 and a lower common electrode 102 symmetrically distributed around a center. The lower fuse electrodes 108 are distributed in the lower security chip. On the substrate 101, a lower detonation cavity 111 is provided at the center of the lower security chip substrate 101; multiple lower heat dissipation cavities 112 are opened on the lower security chip substrate 101 at the corresponding position of the lower multi-stage lever actuator 300-1, and multiple lower drop holes 110 are opened on the lower security chip substrate 101 at the corresponding position of the lower fuse locking pin 400-1. The lower security chip substrate 101 is also provided with a lower adhesive area 113 for easy assembly, a lower release hole 109, an upper common and fuse electrode groove 105, an upper drive electrode groove 106, and an upper detection electrode groove 107.

[0008] The upper security chip 200 includes an upper security chip substrate 201, on which two upper multi-stage lever actuators 300-2 and two upper fuse locking pins 400-2 are symmetrically distributed around a center. Each upper multi-stage lever actuator 300-2 is connected to an upper driving electrode 203, an upper common electrode 204, and an upper detection electrode 202 symmetrically distributed around a center. The upper driving electrode 203, the upper common electrode 204, and the upper detection electrode 202 are all distributed on the upper security chip substrate 201. Each upper fuse locking pin 400-2 is connected to an upper fuse electrode 200 symmetrically distributed around a center. 5. The upper common electrode 204 and the upper fuse electrode 205 are distributed on the upper security chip substrate 201. An upper detonation cavity 207 is provided at the center of the upper security chip substrate 201. Multiple upper heat dissipation cavities 211 are opened on the upper security chip substrate 201 at the corresponding position of the upper multi-stage lever actuator 300-2. Multiple upper drop holes 209 are opened at the corresponding position of the upper fuse locking pin 400-2. The upper security chip substrate 201 is also provided with an upper pasting area 206, an upper release hole 210, a lower common and fuse electrode groove 208, a lower drive electrode groove 213 and a lower detection electrode groove 212 for easy assembly.

[0009] The aforementioned MEMS security device has a stacked structure, consisting of a lower security chip 100 and an upper security chip 200 bonded together by adhesive. The adhesive portion is the lower bonding area 113 and the upper bonding area 206.

[0010] After bonding, the lower multi-stage lever actuator 300-1 and the lower fusible locking pin 400-1 on the lower security chip 100 are aligned with the upper heat dissipation cavity 211 and the upper drop hole 209 on the upper security chip 200, respectively; the lower drive electrode 103, the lower common electrode 102, the lower fusible electrode 108, and the lower detection electrode 104 on the lower security chip 100 are respectively located in the lower drive electrode groove 213, the lower common and fusible electrode groove 208, and the lower detection electrode groove 21 on the upper security chip 200. 2. Alignment: The upper multi-stage lever actuator 300-2 and the upper fuse locking pin 400-2 on the upper security chip 200 are respectively aligned with the lower heat dissipation cavity 112 and the lower drop hole 110 of the lower security chip 100. The upper drive electrode 203, the upper common electrode 204, the upper fuse electrode 205 and the upper detection electrode 202 on the upper security chip 200 are respectively aligned with the upper drive electrode slot 106, the upper common and fuse electrode slot 105 and the upper detection electrode slot 107 on the lower security chip 100.

[0011] The lower-level multi-stage lever actuator 300-1 and the upper-level multi-stage lever actuator 300-2 have the same structure, including a V-shaped electrothermal actuator 301, which is connected sequentially to the first-level lever mechanism and the second-level lever mechanism. Both are driven by multiple sets of V-shaped electrothermal actuators 301. The two ends of the V-shaped electrothermal actuator 301 in the lower-level multi-stage lever actuator 300-1 are respectively connected to the lower drive electrode 103 and the lower common electrode 102, while the two ends of the V-shaped electrothermal actuator 301 in the upper-level multi-stage lever actuator 300-2 are respectively connected to the upper drive electrode 203 and the upper common electrode 204. Multiple sets of V-shaped electrothermal actuators 301 are connected to the first-level lever connecting beam 311 of the first-level lever mechanism via an intermediate beam 302. The first-level lever mechanism consists of... The system comprises a primary lever 310, a primary lever connecting beam 311, a primary lever supporting beam 312, and a primary lever fixing area 313. The primary lever fixing area 313 is distributed on the upper security chip substrate 201 / lower security chip substrate 101. The primary lever 310 is connected to the secondary lever 320 via the secondary lever connecting beam 321 of the secondary lever mechanism. The secondary lever mechanism comprises a secondary lever 320, a secondary lever connecting beam 321, a secondary lever supporting beam 322, and a secondary lever fixing area 323. The secondary lever fixing area 323 is distributed on the upper security chip substrate 201 / lower security chip substrate 101 and is provided with an upper detection electrode 202 / lower detection electrode 104. A semi-circular partition 303 is provided at the end of the secondary lever 320.

[0012] The lower layer fusible locking pin 400-1 and the upper layer fusible locking pin 400-2 have the same structure, including two leads 401, which are connected to the upper fusible electrode 205 / lower fusible electrode 108 and the upper common electrode 204 / lower common electrode 102 through the leads 401; a thermal bridge 402 is connected between the two leads 401, and a fusible beam 403 is set at the midpoint of the thermal bridge 402. The thermal bridge 402 is connected to one end of the limiting beam 404 through the fusible beam 403, and the free end of the limiting beam 404 is close to the semi-circular partition 303.

[0013] In the safe state, the limiting beam 404 is in a limited state, the semi-circular partition 303 is in a closed state, and the upper detonation chamber 207 and the lower detonation chamber 111 are isolated, preventing the detonation energy from passing through. At the same time, the semi-circular partition 303 in the upper security chip 200 and the semi-circular partition 303 in the lower security chip 100 form a parallel plate capacitor, and the capacitance value is detected by the upper detection electrode 202 and the lower detection electrode 104. In the unsafe state, the limiting beam 404 falls out of the device through the lower drop hole 110, the semi-circular partition 303 opens, the upper detonation chamber 207 and the lower detonation chamber 111 are connected, and the detonation energy passes through normally. At the same time, the semi-circular partition 303 in the upper security chip 200 and the semi-circular partition 303 in the lower security chip 100 are misaligned, and the status feedback is achieved by the change in capacitance value detected by the upper detection electrode 202 and the lower detection electrode 104.

[0014] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0015] This invention utilizes the principle of capacitive feedback. By measuring the capacitance changes of the upper security chip 200 and lower security chip 100 caused by the movement of the semi-circular partition 303, the status of the MEMS security device is fed back in real time, enabling intelligent judgment of the security release status. A multi-stage lever actuator is introduced to improve the overall rigidity of the device while compressing the overall size of the mechanism. A locking pin mechanism is also introduced to limit the displacement of the semi-circular partition 303 in a safe state, reducing the possibility of failure due to excessive impact. Furthermore, the device adopts a stacked structure. The stacking of the upper security chip 200 and lower security chip 100 forms a double-layer partition structure composed of four multi-stage lever actuators 300 arranged in a circular pattern, further improving the reliability of the device.

[0016] The present invention has the following advantages: (1) Intelligent: Real-time feedback of the working status of the MEMS security device is realized through capacitive feedback, which can intelligently judge the release status during the ammunition launch process; (2) Safe: The safety of the MEMS security device is improved through double-stage levers, fused locking pins and double-layer chips; (3) Miniaturized: The overall device size is extremely small, only 5mm×5mm×1mm, which can be adapted to various micro unmanned platforms and micro-caliber ammunition. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of an embodiment of the present invention.

[0018] Figure 2 This is a schematic diagram of the security chip structure according to an embodiment of the present invention.

[0019] Figure 3 This is a schematic diagram of the security chip structure in an embodiment of the present invention.

[0020] Figure 4 This is a top view of an embodiment of the present invention.

[0021] Figure 5 This is a bottom view of an embodiment of the present invention.

[0022] Figure 6 This is a schematic diagram of the structure of a multi-stage lever actuator according to an embodiment of the present invention.

[0023] Figure 7 This is a schematic diagram of the structure of the fusible locking pin in an embodiment of the present invention.

[0024] Figure 8 This is a schematic diagram of the working principle of the fusible locking pin in an embodiment of the present invention, wherein (a) is a diagram of the safe state, (b) is a diagram of the safe state under impact, and (c) is a diagram of the fusible locking pin being released.

[0025] Figure 9 This is a schematic diagram of the working principle of an embodiment of the present invention, wherein (a) is a safe state diagram and (b) is a desafe state diagram.

[0026] Figure 10 This is a schematic diagram of the state feedback principle in an embodiment of the present invention, where (a) is a safe state diagram and (b) is a desafe state diagram.

[0027] Figure 11 This is an overall working state diagram of an embodiment of the present invention, wherein (a) is a safe state diagram and (b) is a desafe state diagram. Detailed Implementation

[0028] The present invention will be further described below with reference to the embodiments and accompanying drawings.

[0029] Reference Figure 1 A capacitive feedback dual-stage lever MEMS security device with a fusible locking pin includes a lower security chip 100 and an upper security chip 200, which are connected and fixed by epoxy resin adhesive.

[0030] Reference Figure 2The lower security chip 100 includes a lower security chip substrate 101. Two lower-level multi-stage lever actuators 300-1 and two lower-level fusible locking pins 400-1 are symmetrically distributed around a center on the lower security chip substrate 101. The lower-level multi-stage lever actuators 300-1 control the opening and closing of the lower detonation chamber 111, and the lower-level fusible locking pins 400-1 limit the movement of the lower-level multi-stage lever actuators 300-1. Each lower-level multi-stage lever actuator 300-1... A lower drive electrode 103, a lower common electrode 102, and a lower detection electrode 104, symmetrically distributed around a center, are connected. The lower drive electrode 103 and the lower common electrode 102 are used to power the lower multi-stage lever actuator 300-1, while the lower detection electrode 104 is used for status feedback. The lower drive electrode 103, the lower common electrode 102, and the lower detection electrode 104 are all distributed on the lower security chip substrate 101. Each lower fuse pin 400-1 is connected to a lower drive electrode 103, a lower common electrode 102, and a lower detection electrode 104, symmetrically distributed around a center. The fusible electrode 108 and the lower common electrode 102 are used to supply power to the lower fusible locking pin 400. The lower fusible electrode 108 is also distributed on the lower security chip substrate 101. A lower detonation cavity 111 is provided at the center of the lower security chip substrate 101, through which the detonation energy will be transmitted backward. Four lower heat dissipation cavities 112 are formed on the lower security chip substrate 101 at the corresponding positions of the lower multi-stage lever actuator 300-1. These cavities have a heat insulation function, which can increase thermal resistance and improve the multi-stage lever actuator. To improve the thermal efficiency of the lever actuator 300, four lower drop holes 110 are provided on the lower security chip substrate 101 at the corresponding position of the lower fuse locking pin 400-1. These holes are used to release the limiting beam 404 after the lower fuse locking pin 400-1 melts. In addition, the lower security chip substrate 101 is also provided with a lower adhesive area 113 for easy assembly, a lower release hole 109, an upper common and fuse electrode groove 105, an upper drive electrode groove 106, and an upper detection electrode groove 107.

[0031] Reference Figure 3The upper security chip 200 includes an upper security chip substrate 201. Two upper-level multi-stage lever actuators 300-2 and two upper-level fusible locking pins 400-2 are symmetrically distributed around a center on the upper security chip substrate 201. The upper-level multi-stage lever actuators 300-2 are used to control the opening and closing of the upper detonation chamber 207, and the upper-level fusible locking pins 400-2 limit the movement of the upper-level multi-stage lever actuators 300-2. Each upper-level multi-stage lever actuator 300-... 2. Connected to an upper driving electrode 203, an upper common electrode 204, and an upper detection electrode 202 symmetrically distributed around the center. The upper driving electrode 203 and the upper common electrode 204 are used to power the upper multi-stage lever actuator 300-2, while the upper detection electrode 202 is used for status feedback. The upper driving electrode 203, the upper common electrode 204, and the upper detection electrode 202 are all distributed on the upper security chip substrate 201; each upper fuse locking pin 400-2 is connected to an upper driving electrode 203, an upper common electrode 204, and an upper detection electrode 202 symmetrically distributed around the center. The upper fusible electrode 205 and the upper common electrode 204 are used to supply power to the upper fusible locking pin 400-2. The upper fusible electrode 205 is distributed on the upper security chip substrate 201. An upper detonation cavity 207 is provided at the center of the upper security chip substrate 201, through which the detonation energy will be transmitted backward. Four upper heat dissipation cavities 211 are opened on the upper security chip substrate 201 at the corresponding positions of the upper multi-stage lever actuator 300-2, which have a heat insulation function and can increase the heat dissipation capacity. To improve the thermal efficiency of the upper multi-stage lever actuator 300-2, four upper drop holes 209 are provided at the corresponding positions of the upper fuse locking pin 400-2 for the release of the limiting beam 404 after the upper fuse locking pin 400-2 melts. In addition, the upper security chip substrate 201 is also provided with an upper bonding area 206 for easy assembly, an upper release hole 210, a lower common and fuse electrode groove 208, a lower drive electrode groove 213, and a lower detection electrode groove 212.

[0032] Reference Figure 4 After the upper security chip 200 and lower security chip 100 are pasted on, viewed from above, the upper detonation chamber 207 and the lower detonation chamber 111 are aligned, forming a detonation transmission path; the lower multi-stage lever actuator 300-1 on the lower security chip 100 is aligned with the two upper heat dissipation chambers 211 on the upper security chip 200, which increases thermal resistance and heat accumulation, which helps to raise the temperature of the lower multi-stage lever actuator 300-1 and generate a larger output displacement; the lower fusible locking pin 400- 1. Align the upper drop hole 209 and the lower drop hole 110 so that it can be removed from the device after melting and avoid affecting the operation of the actuator; the lower drive electrode 103, lower common electrode 102, lower melting electrode 108 and lower detection electrode 104 on the lower security chip 100 are respectively aligned with the lower drive electrode slot 213, lower common and melting electrode slot 208 and lower detection electrode slot 212 on the upper security chip 200, which facilitates subsequent gold wire welding and electrode lead-out.

[0033] Reference Figure 5 After the upper security chip 200 and the lower security chip 100 are pasted, viewed from below, the upper multi-stage lever actuator 300-2 on the upper security chip 200 is aligned with the two lower heat dissipation cavities 112 of the lower security chip 100, which increases thermal resistance and heat accumulation, thus helping to raise the temperature of the upper multi-stage lever actuator 300-2 and generate a larger output displacement. The upper fusible locking pin 400-2 is aligned with the lower drop hole 110 and the upper drop hole 209, so that it can be removed from the device after fusing, avoiding affecting the operation of the actuator. The upper drive electrode 203, upper common electrode 204, upper fusible electrode 205 and upper detection electrode 202 on the upper security chip 200 are aligned with the upper drive electrode slot 106, upper common and fusible electrode slot 105 and upper detection electrode slot 107 on the lower security chip 100, respectively, to facilitate subsequent gold wire welding and electrode lead-out.

[0034] Reference Figure 6The lower-level multi-stage lever actuator 300-1 and the upper-level multi-stage lever actuator 300-2 have the same structure, including a V-shaped electrothermal actuator 301. The V-shaped electrothermal actuator 301 is connected to the first-level lever mechanism and the second-level lever mechanism in sequence. In this embodiment, both are driven by 6 sets of V-shaped electrothermal actuators 301. The two ends of the V-shaped electrothermal actuator 301 of the lower-level multi-stage lever actuator 300-1 are respectively connected to the lower drive electrode 103 and the lower common electrode 102. The two ends of the V-shaped electrothermal actuator 301 of the upper-level multi-stage lever actuator 300-2 are respectively connected to the upper drive electrode 203 and the upper common electrode 202. Electrode 204; 6 sets of V-shaped electric heating actuators 301 are connected to the primary lever connecting beam 311 of the primary lever mechanism via intermediate beam 302; after applying voltage to the upward driving electrode 203 / lower driving electrode 103 and the upper common electrode 204 / lower common electrode 102, the V-shaped electric heating actuator 301 will generate heat due to the Joule heating effect, and then deform through the principle of thermal expansion, causing the intermediate beam 302 to undergo a small displacement, which is transmitted to the primary lever mechanism; the primary lever mechanism consists of a primary lever 310, a primary lever connecting beam 311, a primary lever support beam 312 and a... The primary lever is composed of a primary lever fixing area 313, which is distributed on the upper security chip substrate 201 and the lower security chip substrate 101. The primary lever 310 is connected to the secondary lever 320 via the secondary lever connecting beam 321 of the secondary lever mechanism. A small displacement of the primary lever connecting beam 311 drives the primary lever 310 to move. Under the support of the primary lever support beam 312, the primary lever 310 will undergo a small-angle displacement and transmit the displacement to the secondary lever mechanism, completing the initial amplification of the displacement. The secondary lever mechanism consists of the secondary lever 320 and the secondary lever connecting beam 312. 21. The secondary lever is composed of a secondary lever support beam 322 and a secondary lever fixing area 323. The secondary lever fixing area 323 is distributed on the upper security chip substrate 201 / lower security chip substrate 101 and is provided with an upper detection electrode 202 / lower detection electrode 104. A semi-circular partition 303 is provided at the end of the secondary lever 320. Similar to the primary lever mechanism, the secondary lever 320 generates a certain angular displacement. Since the ratio of the power arm to the resistance arm of the secondary lever is small, this angular displacement eventually generates a considerable linear output displacement at the semi-circular partition 303 at the end, which can open the explosion transmission channel.

[0035] Reference Figure 7The lower-layer fusible locking pin 400-1 and the upper-layer fusible locking pin 400-2 have the same structure, including two leads 401, which are connected to the upper fusible electrode 205 / lower fusible electrode 108 and the upper common electrode 204 / lower common electrode 102. A thermal bridge 402 is connected between the two leads 401, and a fusible beam 403 is set at the midpoint of the thermal bridge 402. The thermal bridge 402 is connected to one end of the limiting beam 404 through the fusible beam 403. The free end of the limiting beam 404 is close to... The semi-circular partition 303; after the voltage is supplied to the upper fusible electrode 205 / lower fusible electrode 108 and the upper common electrode 204 / lower common electrode 102, a large amount of heat will be generated on the lead-out terminal 401 and the thermal bridge 402 due to the Joule heating effect. Since the thermal bridge 402 is small in size, the heat will be concentrated on the thermal bridge 402 and the fusible beam 403 connected to it. This will cause the temperature on it to rise sharply and eventually melt at the thinnest beam, i.e., the fusible beam 403, and the limiting beam 404 will fall off.

[0036] Since the upper security chip 200 and the lower security chip 100 have the same structure and working principle, the working principle of the present invention will be explained below using the lower security chip (100) as an example:

[0037] Reference Figure 8 In (a), the end of the limiting beam 404 of the lower layer fuse locking pin 400-1 of the lower security chip 100 approaches the arc end of the semi-circular partition 303 of the lower layer multi-stage lever actuator 300-1 in a safe state; as shown Figure 8 As shown in (b), when an impact is received in the lower detonation chamber 111 while it is in a safe state (such as due to a flame caused by accidental ignition), the semi-circular partition 303 receives the impact and moves in the release direction. However, due to the obstruction of the limiting beam 404, it cannot move significantly, ensuring that the lower detonation chamber 111 will not open, thereby preventing accidental detonation. When the device is ready to release, refer to... Figure 8 In step (c), a fusing voltage U1 is applied between the fusing electrode 108 and the common electrode 102 on the lower security chip 100. Under the action of U1, the lower fusing lock pin 400-1 begins to generate heat due to the Joule heating principle, and heat is concentrated in the area of ​​its thermal bridge 402 and fusing beam 403, burning off the fusing beam 403. After the fusing beam 403 breaks, the limiting beam 404 connected to it will be released from the device through the lower drop hole 110, so that the semi-circular partition 303 can move to the unlocked state.

[0038] Reference Figure 9 In (a) of the diagram, under safe conditions, the upper detonation chamber 207 and the lower detonation chamber 111 are separated by a double-layered partition composed of four semi-circular partitions 303, preventing detonation energy from passing through. Furthermore, the limiting beam 404 is located at the arc end of the semi-circular partition 303, preventing it from moving in the release direction, thus the device is in a safe state. (Refer to...) Figure 9In (b), after the lower layer fuse locking pin 400-1 and the upper layer fuse locking pin 400-2 blow (refer to...) Figure 8 c) When driving voltage U2 is applied to the upper driving electrode 203 / lower driving electrode 103 and the upper common electrode 204 / lower common electrode 102, the semi-circular partition 303 moves in the release direction, so that the upper detonation chamber 207 / lower detonation chamber 111 opens, the detonation energy can pass through, and the device is in the release state.

[0039] Reference Figure 10 In (a) of the diagram, under safe conditions, the semi-circular partition 303 on the upper security chip 200 and the semi-circular partition 303 in the lower security chip 100 form a parallel plate capacitor. By using the upper detection electrode 202 and the lower detection electrode 104 as the two electrodes of the capacitor, the capacitance value of this parallel plate capacitor can be detected. (Refer to...) Figure 10 In (b), when the security is released, the semicircular partition 303 on the upper security chip 200 and the semicircular partition 303 in the lower security chip 100 are misaligned. At this time, the capacitance values ​​detected by the upper detection electrode 202 and the lower detection electrode 104 will change, thereby realizing device status feedback.

[0040] Reference Figure 11 In (a) of the present invention, under safe conditions, the four limiting beams 404 are in a limited state, the four semi-circular partitions 303 are in a closed state, the upper detonation chamber 207 and the lower detonation chamber 111 are isolated, and the detonation energy cannot pass through; at the same time, the semi-circular partitions 303 in the upper security chip 200 and the semi-circular partitions 303 in the lower security chip 100 form a parallel plate capacitor, and the capacitance value can be detected by the upper detection electrode 202 and the lower detection electrode 104. (See reference...) Figure 11 In (b) of the present invention, in the unlocked state, the four limiting beams 404 fall off the device through the lower drop hole 110, the four semi-circular partitions 303 open, the upper detonation chamber 207 and the lower detonation chamber 111 are connected, and the detonation energy can pass normally; at the same time, the semi-circular partitions 303 in the upper security chip 200 and the semi-circular partitions 303 in the lower security chip 100 are misaligned, and the status feedback is realized by the change in capacitance value detected by the upper detection electrode 202 and the lower detection electrode 104.

Claims

1. A capacitive feedback dual-stage lever MEMS security device with a fusible locking pin device, comprising a lower security chip (100) and an upper security chip (200) connected thereto; The lower security chip (100) includes a lower security chip substrate (101), on which two lower multi-stage lever actuators (300-1) and two lower fuse locking pins (400-1) are disposed symmetrically around a center; each lower multi-stage lever actuator (300-1) is connected to a lower driving electrode (103), a lower common electrode (102) and a lower detection electrode (104) symmetrically distributed around a center; each lower fuse locking pin (400-1) is connected to a lower fuse electrode (108) and a lower common electrode (102) symmetrically distributed around a center, and the lower fuse electrode (108) is distributed on the lower security chip substrate. On the bottom (101); a lower detonation cavity (111) is provided at the center of the lower security chip substrate (101); multiple lower heat dissipation cavities (112) are opened on the lower security chip substrate (101) at the corresponding position of the lower multi-stage lever actuator (300-1); multiple lower drop holes (110) are opened on the lower security chip substrate (101) at the corresponding position of the lower fuse locking pin (400-1); the lower security chip substrate (101) is also provided with a lower adhesive area (113) for easy assembly, a lower release hole (109), an upper common and fuse electrode groove (105), an upper drive electrode groove (106) and an upper detection electrode groove (107).

2. The apparatus according to claim 1, characterized in that: The aforementioned upper security chip (200) includes an upper security chip substrate (201), on which two upper multi-stage lever actuators (300-2) and two upper fuse locking pins (400-2) are disposed symmetrically around a center; each upper multi-stage lever actuator (300-2) is connected to an upper driving electrode (203), an upper common electrode (204), and an upper detection electrode (202) symmetrically distributed around a center, and the upper driving electrode (203), upper common electrode (204), and upper detection electrode (202) are all distributed on the upper security chip substrate (201); each upper fuse locking pin (400-2) is connected to an upper fuse electrode (205) symmetrically distributed around a center. The upper shared electrode (204) and the upper fuse electrode (205) are distributed on the upper security chip substrate (201); an upper detonation cavity (207) is provided at the center of the upper security chip substrate (201); multiple upper heat dissipation cavities (211) are opened on the upper security chip substrate (201) at the corresponding position of the upper multi-stage lever actuator (300-2); multiple upper drop holes (209) are opened at the corresponding position of the upper fuse locking pin (400-2); the upper security chip substrate (201) is also provided with an upper pasting area (206), an upper release hole (210), a lower shared and fuse electrode groove (208), a lower drive electrode groove (213), and a lower detection electrode groove (212) for easy assembly.

3. The apparatus according to claim 2, characterized in that: The MEMS security device has a stacked structure, consisting of a lower security chip (100) and an upper security chip (200) bonded together by adhesive. The adhesive portion is the lower bonding area (113) and the upper bonding area (206).

4. The apparatus according to claim 3, characterized in that: After bonding, the lower multi-stage lever actuator (300-1) and lower fusible locking pin (400-1) on the lower security chip (100) are aligned with the upper heat dissipation cavity (211) and upper drop hole (209) on the upper security chip (200), respectively; the lower drive electrode (103), lower common electrode (102), lower fusible electrode (108) and lower detection electrode (104) on the lower security chip (100) are aligned with the lower drive electrode slot (213), lower common and fusible electrode slot (208) and lower detection electrode slot (212) on the upper security chip (200), respectively. Alignment: The upper multi-stage lever actuator (300-2) and upper fuse lock pin (400-2) on the upper security chip (200) are aligned with the lower heat dissipation cavity (112) and lower drop hole (110) of the lower security chip (100), respectively. The upper drive electrode (203), upper common electrode (204), upper fuse electrode (205) and upper detection electrode (202) on the upper security chip (200) are aligned with the upper drive electrode slot (106), upper common and fuse electrode slot (105) and upper detection electrode slot (107) on the lower security chip (100), respectively.

5. The apparatus according to claim 2, characterized in that: The lower-level multi-stage lever actuator (300-1) and the upper-level multi-stage lever actuator (300-2) have the same structure, including a V-shaped electrothermal actuator (301). The V-shaped electrothermal actuator (301) is connected to the first-level lever mechanism and the second-level lever mechanism in sequence. Both are driven by multiple sets of V-shaped electrothermal actuators (301). The two ends of the V-shaped electrothermal actuator (301) of the lower-level multi-stage lever actuator (300-1) are respectively connected to the lower drive electrode (103) and the lower common electrode (102). The two ends of the V-shaped electrothermal actuator (301) of the upper-level multi-stage lever actuator (300-2) are respectively connected to the upper drive electrode (203) and the upper common electrode (204). The multiple sets of V-shaped electrothermal actuators (301) are connected to the first-level lever connecting beam (311) of the first-level lever mechanism through the intermediate beam (302). The first-level lever mechanism consists of a first-level lever ( The first-level lever (310) consists of a first-level lever connecting beam (311), a first-level lever supporting beam (312), and a first-level lever fixing area (313). The first-level lever fixing area (313) is distributed on the upper security chip substrate (201) or the lower security chip substrate (101). The first-level lever (310) is connected to the second-level lever (320) through the second-level lever connecting beam (321) of the second-level lever mechanism. The second-level lever mechanism consists of a second-level lever (320), a second-level lever connecting beam (321), a second-level lever supporting beam (322), and a second-level lever fixing area (323). The second-level lever fixing area (323) is distributed on the upper security chip substrate (201) or the lower security chip substrate (101) and is provided with an upper detection electrode (202) or a lower detection electrode (104). A semi-circular partition (303) is provided at the end of the second-level lever (320).

6. The apparatus according to claim 2, characterized in that: The lower fuse locking pin (400-1) and the upper fuse locking pin (400-2) have the same structure, including two leads (401), which are connected to the upper fuse electrode (205) and the upper common electrode (204) through the leads (401), or connected to the lower fuse electrode (108) and the lower common electrode (102) through the leads (401); a thermal bridge (402) is connected between the two leads (401), and a fuse beam (403) is set at the midpoint of the thermal bridge (402). The thermal bridge (402) is connected to one end of the limiting beam (404) through the fuse beam (403), and the free end of the limiting beam (404) is close to the semi-circular partition (303).

7. The apparatus according to claim 5 or 6, characterized in that: In the safe state, the limiting beam (404) is in the limiting state, the semi-circular partition (303) is in the closed state, the upper detonation chamber (207) and the lower detonation chamber (111) are isolated, and the detonation energy cannot pass through; at the same time, the semi-circular partition (303) in the upper security chip (200) and the semi-circular partition (303) in the lower security chip (100) form a parallel plate capacitor, and the capacitance value is detected by the upper detection electrode (202) and the lower detection electrode (104); in the unlocked state The limiting beam (404) falls off the device through the lower drop hole (110), the semi-circular partition (303) opens, the upper detonation chamber (207) and the lower detonation chamber (111) are connected, and the detonation energy passes normally; at the same time, the semi-circular partition (303) in the upper security chip (200) is misaligned with the semi-circular partition (303) in the lower security chip (100), and the status feedback is realized by the change in capacitance value detected by the upper detection electrode (202) and the lower detection electrode (104).

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