Temperature control system based on double-loop design and application

Abstract

The invention relates to the technical field of temperature control systems and discloses a temperature control system based on double-loop design and application, the temperature control system comprises a case, a plate heat exchanger and a cooling unit, the plate heat exchanger and the cooling unit are located on one side in the case, and a system pipeline is arranged in the case; the liquid-phase heat dissipation loop system comprises a water pump, a second condenser, a confluence plate and an electronic flow divider which are sequentially connected through pipelines; the double-loop design is adopted, heat exchange is achieved through the central plate heat exchanger, and the first loop is a liquid-phase heat dissipation loop system; and the second loop is a gas-phase refrigeration loop system. The two loops can realize heat exchange through the central plate heat exchanger, the scheme can effectively reduce the refrigeration power required by the second loop, can meet the same temperature rise requirement, and has the advantages of smaller size and lighter module weight compared with other schemes; and under the condition that the size / weight is reduced, the device can be used in application scenes with high requirements on high-power heat dissipation and temperature rise.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of temperature control systems, in particular to a temperature control system based on a double-loop design and application. BACKGROUND

[0002] The laser generator / charging pile needs a small volume, and a large amount of heat is generated when the laser generator / charging pile is working. In order to ensure the normal use of the laser generator / charging pile, a refrigeration system needs to be installed in the laser generator / charging pile. The existing refrigeration system is usually a wind-cooled system or a liquid-cooled system, which has the defects of large volume and high weight. The current laser generator / charging pile works, and the simple wind-cooled system or liquid-cooled system has the defect of slow cooling. At the same time, the existing wind-cooled system or liquid-cooled system increases the overall volume of the laser generator / charging pile, which is not convenient for practical application. Therefore, the present application provides a temperature control system based on a double-loop design and application. SUMMARY

[0003] The present application aims to provide a temperature control system based on a double-loop design and application to solve the problems in the background art.

[0004] To achieve the above-mentioned purpose, the present application provides the following technical scheme: a temperature control system based on a double-loop design, comprising a case, a plate heat exchanger located on one side of the inside of the case and a cooling unit, the inside of the case is provided with a system pipeline, the system pipeline comprises a liquid phase heat dissipation loop system and a gas phase refrigeration loop system; The liquid phase heat dissipation loop system and the gas phase refrigeration loop system exchange heat through the plate heat exchanger; The gas phase refrigeration loop system comprises a gas-liquid separator, a compressor and a first condenser connected by pipes in sequence, the condensed gas flowing out of the first condenser flows into the plate heat exchanger, and the gas after heat exchange in the plate heat exchanger flows back to the gas-liquid separator; The liquid phase heat dissipation loop system comprises a water pump, a second condenser, a bus bar and an electronic shunt connected by pipes in sequence, the electronic shunt comprises an upper channel and a lower channel, the upper channel of the electronic shunt is directly connected with the water pump, and the lower channel of the electronic shunt is connected with the water pump through the plate heat exchanger; The bus bar is connected with the cooling pipeline of the cooling unit through the pipeline.

[0005] The first water cooling row is provided in the first condenser for the flow of condensed gas, one end of the first water cooling row is connected with the compressor through the pipeline, and the other end of the first water cooling row is connected with the plate heat exchanger through the pipeline.

[0006] The pipeline between the plate heat exchanger and the gas-liquid separator is provided with a filter.

[0007] The pipeline between the first water cooling row and the plate heat exchanger is provided with an electronic pressure relief valve.

[0008] The plate heat exchanger is provided with a first temperature sensor at a condensate gas inflow end of the plate heat exchanger, and the first temperature sensor is used to detect the temperature of the condensate gas flowing into the plate heat exchanger.

[0009] The second water cooling row is internally provided with a second water cooling row for flowing of the condensate liquid, one end of the second water cooling row is connected with a water pump through a pipeline, and the other end of the second water cooling row is connected with the bus bar through a pipeline.

[0010] The pipeline between the second water cooling row and the bus bar is sequentially provided with a pressure sensor and a second temperature sensor. The pressure sensor is used to detect the pressure of the condensate liquid flowing into the bus bar. The second temperature sensor is used to detect the temperature of the condensate liquid flowing into the bus bar.

[0011] The pipeline between the bus bar and the electronic flow divider is sequentially provided with a third temperature sensor and a flow meter. The third temperature sensor is used to detect the temperature of the liquid flowing from the bus bar to the electronic flow divider. The flow meter is used to detect the flow rate of the liquid flowing from the bus bar to the electronic flow divider.

[0012] The machine case is internally provided with a cooling fan corresponding to the positions of the first condenser and the second condenser, and the machine case is uniformly provided with ventilation holes corresponding to the positions of the cooling fan at the top of the machine case. The machine case is internally provided with a cooling fan corresponding to the positions of the first condenser and the second condenser, and the machine case is uniformly provided with ventilation holes corresponding to the positions of the cooling fan at the top of the machine case.

[0013] The application of the temperature control system based on the double-circuit design to a cooling unit. The cooling unit is one of a charging pile and a laser generator.

[0014] Compared with the prior art, the application has the following beneficial effects: The application adopts a double-loop design, realizes heat exchange through a center plate heat exchanger, a first loop is a liquid phase heat dissipation loop system, and a second loop is a gas phase refrigeration loop system. The two loops can realize heat exchange through the center plate heat exchanger, the scheme can effectively reduce the required refrigeration power of the second loop, can meet the same temperature rise requirement, has the advantages of smaller volume and lighter module weight compared with other schemes, and can be used in high-power heat dissipation and high-temperature rise application scenarios under the condition of reducing the volume / weight. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 a temperature control system loop flow direction diagram of the application; Figure 2 a schematic diagram of the overall device structure of the application; Figure 3 a schematic diagram of the overall device explosion structure of the application; Figure 4 a schematic diagram of the system pipeline first direction structure of the application; Figure 5 a schematic diagram of the system pipeline second direction structure of the application; Figure 6 a schematic diagram of the system pipeline third direction structure of the application.

[0016] In the figure, 100, case; 101, hollow groove; 102, ventilation hole; 103, heat dissipation fan; 200, system pipeline; 201, gas-liquid separator; 202, compressor; 203, first condenser; 204, first water cooling row; 205, filter; 206, electronic pressure relief valve; 207, water pump; 208, second condenser; 209, second water cooling row; 210, plate heat exchanger; 211, electronic flow divider; 212, first temperature sensor; 213, pressure sensor; 214, second temperature sensor; 215, third temperature sensor; 216, flow meter; 217, busbar; 218, cooling unit. DETAILED DESCRIPTION

[0017] The technical solutions in the embodiments of the application will be clearly and completely described below with reference to the drawings in the embodiments of the application. Obviously, the described embodiments are only part of the embodiments of the application, not all the embodiments. Based on the embodiments in the application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the application.

[0018] Please refer to Figures 1-6The application provides a technical scheme: a temperature control system based on a double-loop design, which comprises a case 100, a plate heat exchanger 210 and a cooling unit 218 located on one side inside the case 100, and a system pipeline 200 arranged inside the case 100, wherein the system pipeline 200 comprises a liquid-phase heat dissipation loop system and a gas-phase refrigeration loop system, and heat exchange is realized between the liquid-phase heat dissipation loop system and the gas-phase refrigeration loop system through the plate heat exchanger 210; the double-loop design is adopted, heat exchange is realized through the central plate heat exchanger 210, the first loop is the liquid-phase heat dissipation loop system, and the second loop is the gas-phase refrigeration loop system. The two loops can realize heat exchange through the central plate heat exchanger 210, the scheme can effectively reduce the required refrigeration power of the second loop, can meet the same temperature rise requirement, has the advantages of smaller volume and lighter module weight compared with other schemes, and can be used in the application scenarios with high power heat dissipation and high temperature rise requirements under the condition of reducing the volume and weight.

[0019] Specifically, the temperature control system can be applied to the cooling unit 218; the cooling unit 218 is one of a charging pile and a laser generator, the laser generator / charging pile requires a small volume, a large amount of heat is generated when the laser generator / charging pile works, and in order to ensure the normal use of the laser generator / charging pile, a refrigeration system needs to be installed in the laser generator / charging pile, therefore, the temperature control system has small volume and weight and can meet the heat dissipation requirement of the laser generator / charging pile.

[0020] The gas-phase refrigeration loop system comprises a gas-liquid separator 201, a compressor 202 and a first condenser 203 connected by pipelines in sequence, condensed gas flowing out of the first condenser 203 flows into the plate heat exchanger 210, and the gas after heat exchange in the plate heat exchanger 210 flows back to the gas-liquid separator 201; a first water cooling row 204 arranged in the first condenser 203 can effectively preliminarily cool the condensed gas, and then the condensed gas enters the plate heat exchanger 210 to further exchange heat, this design ensures that the condensed gas can reach a suitable temperature before returning to the gas-liquid separator 201, thereby improving the efficiency of the entire gas-phase refrigeration loop system. Meanwhile, the filter 205 arranged between the plate heat exchanger 210 and the gas-liquid separator 201 effectively prevents impurities from entering the system and ensures stable operation of the system. The electronic pressure relief valve 206 between the first water cooling row 204 and the plate heat exchanger 210 can release pressure in time when the pressure is abnormal, thereby protecting the system from damage.

[0021] The liquid phase heat dissipation loop system includes a water pump 207, a second condenser 208, a busbar 217 and an electronic flow divider 211 connected in sequence by pipelines. The electronic flow divider 211 includes an upper passage and a lower passage. The upper passage of the electronic flow divider 211 is directly connected with the water pump 207, and the lower passage of the electronic flow divider 211 is connected with the water pump 207 through a plate heat exchanger 210. The second water cooling row 209 arranged in the second condenser 208 can efficiently cool the condensed liquid. After being cooled by the second water cooling row 209, the condensed liquid flows into the busbar 217 for subsequent flow distribution. During the process of the condensed liquid flowing to the busbar 217, a pressure sensor 213 and a second temperature sensor 214 monitor the pressure and temperature of the condensed liquid respectively, to ensure the stability and safety of the system. Subsequently, the condensed liquid passes through the detection of a third temperature sensor 215 and a flow meter 216, enters the electronic flow divider 211, and is distributed according to actual needs to meet the needs of different heat dissipation areas.

[0022] The busbar 217 is connected with the cooling pipeline of the cooling unit 218 through a pipeline. After passing through the busbar 217, the condensed liquid flows to the cooling unit 218. The cooling unit 218 is the final cooling place, which uses the cooling effect of the condensed liquid to cool the charging pile or the laser generator. This design not only improves the heat exchange efficiency, but also ensures that the cooling unit 218 can uniformly and stably dissipate heat, effectively avoiding the problems of local overheating or uneven heat dissipation.

[0023] The first condenser 203 is internally provided with a first water cooling row 204 for the flow of condensed gas. One end of the first water cooling row 204 is connected with the compressor 202 through a pipeline, and the other end of the first water cooling row 204 is connected with the plate heat exchanger 210 through a pipeline. The first water cooling row 204 arranged in the first condenser 203 can effectively cool the condensed gas initially, and then the condensed gas enters the plate heat exchanger 210 for further heat exchange.

[0024] The pipeline between the plate heat exchanger 210 and the gas-liquid separator 201 is provided with a filter 205. The filter 205 effectively intercepts impurities in the system, prevents them from entering the gas-liquid separator 201, and ensures the purity of the fluid inside the system and the normal operation of the system. At the same time, this design also prolongs the service life of the key components of the system, reduces the failure and maintenance cost caused by impurities.

[0025] The electronic pressure relief valve 206 is arranged on the pipeline between the first water cooling row 204 and the plate heat exchanger 210. The electronic pressure relief valve 206 between the first water cooling row 204 and the plate heat exchanger 210 can monitor the pressure state of the system in real time. When the system pressure exceeds the preset safety value, the electronic pressure relief valve 206 will automatically open to release the excess pressure, thereby protecting the system from high pressure damage. This automatic pressure relief function not only improves the safety of the system, but also reduces the risk of shutdown caused by abnormal pressure.

[0026] The first temperature sensor 212 is arranged at the condensing gas inflow end of the plate heat exchanger 210, and is used to detect the temperature of the condensing gas flowing into the plate heat exchanger 210.

[0027] The second water cooling row 209 is arranged inside the second condenser 208 for the flow of condensing liquid. One end of the second water cooling row 209 is connected to the water pump 207 through a pipeline, and the other end of the second water cooling row 209 is connected to the busbar 217 through a pipeline. After the condensing liquid is cooled by the second water cooling row 209, it flows into the busbar 217 for subsequent flow distribution.

[0028] The pressure sensor 213 and the second temperature sensor 214 are arranged in sequence on the pipeline between the second water cooling row 209 and the busbar 217. The pressure sensor 213 is used to detect the pressure of the condensing liquid flowing into the busbar 217. The second temperature sensor 214 is used to detect the temperature of the condensing liquid flowing into the busbar 217. The pressure sensor 213 is used to monitor the pressure change of the condensing liquid inside the system in real time, to ensure that the system is within a stable working pressure range. The second temperature sensor 214 is responsible for monitoring the temperature of the condensing liquid to provide accurate temperature data to help the control system adjust the heat dissipation efficiency according to actual needs.

[0029] The third temperature sensor 215 and the flow meter 216 are arranged in sequence on the pipeline between the busbar 217 and the electronic shunt 211. The third temperature sensor 215 is used to detect the temperature of the liquid flowing from the busbar 217 to the electronic shunt 211. The flow meter 216 is used to detect the flow rate of the liquid flowing from the busbar 217 to the electronic shunt 211. The arrangement of the third temperature sensor 215 and the flow meter 216 provides accurate flow and temperature monitoring for the system. The third temperature sensor 215 can detect the temperature of the liquid flowing from the busbar 217 to the electronic shunt 211 in real time, to ensure that the liquid reaches the ideal temperature range before entering the electronic shunt, thereby improving the heat dissipation efficiency. The flow meter 216 is responsible for monitoring the flow rate of the liquid to ensure reasonable distribution of the flow to meet the specific needs of different heat dissipation areas.

[0030] The heat dissipation fan 103 is arranged in the position corresponding to the first condenser 203 and the second condenser 208 in the cabinet 100, and the ventilation holes 102 are uniformly arranged in the position corresponding to the heat dissipation fan 103 on the top of the cabinet 100; the hollow grooves 101 are arranged in the positions corresponding to the first condenser 203 and the second condenser 208 on the two sides of the cabinet 100; the arrangement of the heat dissipation fan 103 effectively accelerates the air flow in the cabinet 100, and improves the heat dissipation efficiency of the first condenser 203 and the second condenser 208; the ventilation holes 102 and the hollow grooves 101 work together to further enhance the air convection in and out of the cabinet 100, ensure the timely discharge of heat, and maintain the efficient and stable operation of the system. In addition, this design also optimizes the structural layout inside the cabinet 100, makes the whole temperature control system more compact and reasonable, and improves the space utilization.

[0031] The temperature control system based on the double-loop design has three working modes when working. In the three working modes, the actual environment temperature T1 is detected in real time by the temperature sensor, the temperature TO of the laser generator / pile when working is detected in real time, the designed temperature threshold A, and the preset temperature T3 of the second gas phase refrigeration loop system, specifically: Working mode one, as shown in the figure: Figure 1 The device (laser generator / pile) starts / initial temperature rising stage: when T0-T1>A, the temperature control system works as the first loop and the second loop works alone.

[0032] The first loop: the circulating speed of the liquid phase heat dissipation loop system is controlled by controlling the rotating speed of the water pump 207 alone, and the heat dissipation is provided for the device (laser generator / pile), and when T0-T1 The second loop: the compressor 202 works at full speed alone, the center plate heat exchanger 210 stores the liquid cooling medium temperature, and the temperature of the condensing gas flowing into the plate heat exchanger 210 is detected by the first temperature sensor 212, and when the detected temperature reaches the preset value T3, the power of the compressor 202 is adjusted and reduced, and the power is constant when the temperature detected by the first temperature sensor 212 maintains T3 temperature unchanged.

[0033] Working mode two, as shown in the figure: Figure 1 When working mode one detects T0-T1

[0034] The first circuit: when T0-T1<A, the upper passage and the lower passage of the electronic shunt 211 are opened simultaneously by opening the electronic shunt 211. When T0-T1>A is detected, the lower passage of the electronic shunt 211 is closed, and the working mode one is restored. When the upper passage and the lower passage of the electronic shunt 211 are continuously opened for 10S and T0-T1<A+1 is still detected, the working mode three is switched. The second circuit: when T0-T1<A is detected, the compression pump 202 works at full speed. Only when T0-T1<A is restored to the working mode one.

[0035] The working mode three, as shown in the figure, when the working mode two continuously works for 10S and T0-T1<A+1 is still detected, the first circuit and the second circuit are completely coupled to work. Figure 1

[0036] The first circuit: when the working mode two continuously works for 10S and T0-T1<A+1 is still detected, the upper passage of the electronic shunt 211 is closed, and the lower passage is opened. At this time, the first circuit and the second circuit are completely coupled to work. When T0-T1<A is detected, the working mode two is switched. The second circuit: when T0-T1<A is detected, the compression pump 202 works at full speed. Only when T0-T1<A is restored to the working mode one.

[0037] In summary, the application adopts a double-circuit design, realizes heat exchange through the center plate heat exchanger 210, the first circuit is a liquid-phase heat dissipation circuit system, and the second circuit is a gas-phase refrigeration circuit system. The two circuits can realize heat exchange through the center plate heat exchanger 210. The scheme can effectively reduce the required refrigeration power of the second circuit, can meet the same temperature rise requirement, has the advantages of smaller volume and lighter module weight compared with other schemes, and can be used in high-power heat dissipation and high-temperature rise application scenarios under the condition of reducing the volume / weight.

[0038] Although the embodiments of the present application have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and spirits of the present application, and the scope of the present application is defined by the appended claims and their equivalents.​

Claims

1. A temperature control system based on a double-loop design, comprising a cabinet (100), a plate heat exchanger (210) and a cooling unit (218) located on one side inside the cabinet (100), characterized in that: The cabinet (100) is internally provided with a system pipeline (200), and the system pipeline (200) comprises a liquid-phase heat dissipation loop system and a gas-phase refrigeration loop system; Heat exchange is realized between the liquid-phase heat dissipation loop system and the gas-phase refrigeration loop system through the plate heat exchanger (210); The gas-phase refrigeration loop system comprises a gas-liquid separator (201), a compressor (202) and a first condenser (203) connected by pipelines in sequence, condensed gas flowing out of the first condenser (203) flows into the plate heat exchanger (210), and the gas after heat exchange in the plate heat exchanger (210) flows back to the gas-liquid separator (201); The liquid-phase heat dissipation loop system comprises a water pump (207), a second condenser (208), a bus plate (217) and an electronic shunt (211) connected by pipelines in sequence, the electronic shunt (211) comprises an upper channel and a lower channel, the upper channel of the electronic shunt (211) is directly connected with the water pump (207), and the lower channel of the electronic shunt (211) is connected with the water pump (207) through the plate heat exchanger (210); The bus plate (217) is connected with a cooling pipeline of a cooling unit (218) through a pipeline.

2. The temperature control system based on a double-loop design according to claim 1, characterized in that: The first condenser (203) is internally provided with a first water cooling row (204) for condensed gas to flow, one end of the first water cooling row (204) is connected with the compressor (202) through a pipeline, and the other end of the first water cooling row (204) is connected with the plate heat exchanger (210) through a pipeline.

3. The temperature control system based on a double-loop design according to claim 1, characterized in that: A filter (205) is arranged on a pipeline between the plate heat exchanger (210) and the gas-liquid separator (201).

4. The temperature control system based on a double-loop design according to claim 2, characterized in that: An electronic pressure relief valve (206) is arranged on a pipeline between the first water cooling row (204) and the plate heat exchanger (210).

5. The temperature control system based on a double-loop design according to claim 1, characterized in that: A first temperature sensor (212) is arranged at a condensed gas inflow end of the plate heat exchanger (210), and the first temperature sensor (212) is used for detecting the temperature of condensed gas flowing into the plate heat exchanger (210).

6. The temperature control system based on a double-loop design according to claim 1, characterized in that: The second condenser (208) is internally provided with a second water cooling row (209) for condensed liquid to flow, one end of the second water cooling row (209) is connected with the water pump (207) through a pipeline, and the other end of the second water cooling row (209) is connected with the bus plate (217) through a pipeline.

7. The temperature control system based on a double-loop design according to claim 1, characterized in that: A pressure sensor (213) and a second temperature sensor (214) are sequentially arranged on the pipeline between the second water cooling row (209) and the manifold (217); The pressure sensor (213) is used for detecting the pressure of the condensed liquid flowing into the manifold (217); The second temperature sensor (214) is used for detecting the temperature of the condensed liquid flowing into the manifold (217).

8. The temperature control system based on the double-loop design according to claim 1, characterized in that: A third temperature sensor (215) and a flow meter (216) are sequentially arranged on the pipeline between the manifold (217) and the electronic flow divider (211); The third temperature sensor (215) is used for detecting the temperature of the liquid flowing from the manifold (217) to the electronic flow divider (211); The flow meter (216) is used for detecting the flow rate of the liquid flowing from the manifold (217) to the electronic flow divider (211).

9. The temperature control system based on the double-loop design according to claim 1, characterized in that: A cooling fan (103) is arranged inside the case (100) corresponding to the positions of the first condenser (203) and the second condenser (208), and a plurality of ventilation holes (102) are uniformly arranged on the top of the case (100) corresponding to the positions of the cooling fan (103); Hollow grooves (100) are arranged on both sides of the case (100) corresponding to the positions of the first condenser (203) and the second condenser (208).

10. Use of a temperature control system based on a dual circuit design according to any one of claims 1 to 9, characterized in that The temperature control system is applied to a cooling unit (218); The cooling unit (218) is one of a charging pile and a laser generator.

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