Gradient interface modified aluminum oxide-aluminum nitride two-component heat-conducting filler and preparation method thereof
By modifying the alumina-alumina nitride bicomponent thermally conductive filler through gradient interface modification, the problems of limited improvement of alumina thermal conductivity and easy hydrolysis failure of aluminum nitride were solved. A highly efficient thermally conductive network was constructed, which significantly improved thermal conductivity and stability, while reducing costs.
Patent Information
- Application Number
- CN202511454821.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-13
- Publication Date
- 2026-01-23
AI Technical Summary
Among existing thermal interface materials, the thermal conductivity of alumina is limited, aluminum nitride is prone to hydrolysis and failure, and existing technologies fail to fully utilize the multiple interface control requirements between fillers and the matrix, resulting in interfacial phonon scattering and long-term stability issues at high filler contents.
A gradient interface modified alumina-alumina nitride two-component thermally conductive filler is adopted. Through the morphological synergy of spherical alumina and plate-like aluminum nitride, combined with double-layer gradient silanization modification and aluminum nitride hydrolysis protection, an efficient thermally conductive network is constructed and the long-term stability is improved.
It achieves a 3 to 4-fold increase in thermal conductivity, a more than 30% reduction in viscosity, in-depth control of interfacial thermal resistance, improved long-term stability, and a 35% to 45% reduction in raw material costs.