Automatic simulation test system and method of semiconductor EAP system

Abstract

The invention provides an automatic simulation test system and method for a semiconductor EAP system, and belongs to the field of semiconductor manufacturing, and the method specifically comprises the steps: defining a test scene through test case coding; constructing a test environment by using the equipment simulation module and the external system simulation module; driving a test process of the tested EAP program through an automatic execution engine and generating real-time output data corresponding to the tested EAP program; and comparing the real-time output data generated by the automatic execution engine with an expected result, and generating a test report. According to the processing scheme, behaviors of equipment and an external system are truly simulated in a software simulation mode, an actual production scene is accurately restored in a test link, dependence on a physical environment is reduced, and test coverage is improved; and moreover, the test scene is solidified through codes and configuration files, so that the versioning management and one-key automatic regression test of the test cases are realized, the test efficiency is remarkably improved, and the quality of secondary development is guaranteed.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of semiconductor manufacturing, in particular to an automatic simulation test system and method for a semiconductor EAP system. BACKGROUND

[0002] In the test link of a semiconductor equipment automation program (EAP), the prior art mainly relies on two schemes: one is to build a test environment based on real production equipment and interface with a manufacturing execution system (for example, MES), and to test by manually simulating actual business scenarios; the other is to use general software test tools (such as Postman and MQ) to perform simple function tests on the interfaces of the EAP system.

[0003] These two schemes have obvious defects: in the first scheme, real equipment needs to be built in the test environment, and the test environment needs to be built by coordinating resources from multiple departments, which takes several days to prepare the environment, and is difficult to simulate extreme scenarios such as equipment failure and data transmission anomalies due to the safety of equipment operation, resulting in low test coverage; the general test tools in the second scheme are not optimized for the characteristics of the semiconductor industry, and cannot reproduce the complex business processes between the EAP and the equipment and MES, resulting in a low reference value of the test results. In addition, in the existing test process, test scenarios are recorded in the form of documents, and when the EAP program is developed again (such as adding support for new equipment or optimizing business processes), the test scenarios need to be manually reorganized and full-scale testing needs to be performed, which is a large amount of repetitive work and results in low test efficiency. SUMMARY

[0004] Therefore, in order to overcome the shortcomings of the prior art, the present application provides an automatic simulation test system and method for a semiconductor EAP system, a computer device and a storage medium, which can not only simulate the behavior of the equipment and external systems in a software simulation manner, accurately reproduce the actual production scene in the test link, reduce the dependence on the physical environment, and improve the test coverage, but also solidify the test scenarios through code and configuration files, realize version management and one-key automatic regression testing of test cases, significantly improve the test efficiency, and ensure the quality of secondary development.

[0005] To achieve the above object, the application provides an automatic simulation test system of a semiconductor EAP system, comprising: a device simulation module, configured to receive a protocol command sent by a tested EAP program, and simulate protocol interaction logic between semiconductor devices, device running state and fault behavior; an external system simulation module, configured to simulate a core interface of an external system connected to the tested EAP program; a test case management module, configured to code and define a test scene through a test case, and store and manage the test case; an automatic execution engine, configured to automatically call the device simulation module, the external system simulation module and the tested EAP program to interact and realize test process automation based on the test case in the test case management module; and a test report generation module, configured to compare real-time output data generated by the automatic execution engine with expected results, and generate a test report.

[0006] In one of the embodiments, the device simulation module comprises: a protocol analysis unit, configured to receive a protocol command sent by a tested EAP program, and analyze the protocol command and encapsulate a response message returned to the tested EAP program according to a protocol specification; a device state simulation unit, configured to dynamically switch a device state of a device where the tested EAP program is located according to test scene requirements, and synchronize state changes to the tested EAP program; and a fault injection unit, configured to configure a fault triggering time through a test case, so as to verify a fault handling capability of the tested EAP program.

[0007] In one of the embodiments, the external system simulation module comprises: a system simulation plug-in unit, configured to generate a simulation interface simulating an external system, so as to receive the test case and generate test data interacting with the tested EAP program.

[0008] In one of the embodiments, the test case management module comprises: a case template writing unit, configured to generate a test case as a template according to a communication interface of the device simulation module, a communication interface of the external system simulation module, an interface of the tested EAP program and a test scene; a version control unit, configured to record a change record of the test case, so as to facilitate tracing of an adjustment record corresponding to the test scene; and a case retrieval unit, configured to support retrieval of the test case from a test case database according to a scene type and an associated device model.

[0009] In one of the embodiments, the automatic execution engine comprises: a use case loading unit for batch importing test cases in a test case management module, and screening to-be-executed use cases from the test cases according to priorities or scene types; a flow control unit for automatically sending control instructions to the device simulation module and the external system simulation module according to step information carried by the to-be-executed use cases, and simultaneously calling interfaces of the EAP program under test to trigger a test flow; a result comparison unit for collecting output data of the EAP program in real time, and comparing the output data with expected results in the to-be-executed use cases to generate test results of the EAP program under test running the to-be-executed use cases; and a log recording unit for generating detailed execution logs according to execution conditions of the to-be-executed use cases.

[0010] In one of the embodiments, the test report generation module comprises: a data statistician for summarizing test results of the EAP program under test in all test scenes; and a test report generator for analyzing the test results to generate a test report.

[0011] An automatic simulation test method of a semiconductor EAP system comprises: receiving protocol commands sent by an EAP program under test, and simulating protocol interaction logic between semiconductor devices, device running states and fault behaviors; simulating core interfaces of external systems connected to the EAP program under test; defining test scenes by test cases, and storing and managing the test cases; automatically calling device simulation modules, external system simulation modules and the EAP program under test to realize test flow automation based on test cases in a test case management module, and generating real-time output data corresponding to the EAP program under test; comparing the real-time output data generated by an automatic execution engine with expected results to generate a test report.

[0012] An automatic simulation test method of a semiconductor EAP system comprises: defining test scenes by test cases; constructing a test environment by using device simulation modules and external system simulation modules; driving a test flow of an EAP program under test by an automatic execution engine, and generating real-time output data corresponding to the EAP program under test; comparing the real-time output data generated by the automatic execution engine with expected results to generate a test report.

[0013] A computer device comprises a memory and a processor, and the memory stores a computer program, wherein the processor implements steps of the above method when executing the computer program.

[0014] A computer readable storage medium stores a computer program, wherein the computer program is executed by a processor to implement steps of the above method.

[0015] Compared with the prior art, the advantages of the present application are that the equipment simulation module and the external system simulation module customized for the semiconductor industry are adopted, various real scenes including abnormal situations can be simulated, the problem of low simulation degree of general tools is solved, the risk of failure caused by untested scenes after going online is greatly reduced, and the test authenticity and coverage are improved. Moreover, through the test cases solidified in the test case management module, the test personnel are liberated from repeated manual operations due to the realization of the code solidification and process automation of the test scene. The full regression test time after secondary development can be shortened from several days to several hours, the efficiency is improved by more than 50%, the test efficiency is greatly improved, and the labor cost is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0017] Figure 1 is a structural flow diagram of an automatic simulation test system of a semiconductor EAP system in an embodiment of the present application; Figure 2 is a flow diagram of an automatic simulation test method of a semiconductor EAP system in an embodiment of the present application; Figure 3 is an internal structure diagram of a computer device in an embodiment of the present application. DETAILED DESCRIPTION

[0018] The embodiments of the present application will be described in detail below with reference to the drawings.

[0019] The embodiments of the present application are described below through specific concrete examples, and those skilled in the art can easily understand other advantages and effects of the present application from the disclosure. Obviously, the described embodiments are only some of the embodiments of the present application, not all. The present application can also be implemented or applied by other different specific embodiments, and each detail in the specification can be modified or changed based on different views and applications without departing from the spirit of the present application. It should be noted that the following embodiments and features in the embodiments can be combined with each other without conflict. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0020] It is to be appreciated that various aspects described herein are described in the context of examples within the scope of the present application. It should be appreciated that the aspects described herein can be embodied in a wide variety of forms and that any specific structure and / or function described herein is merely illustrative. Based on the teachings provided herein one skilled in the art will appreciate that one or more aspects described herein can be implemented independently of any other aspects described herein. The

[0021] It is also to be appreciated that the figures provided in the following examples are merely schematic and that the figures show only those components that are related to the application, while omitting other components that are not relevant to the application, and that the figures are not drawn to scale, and that the actual implementation of the components can vary in number, shape and size, and that the layout of the components can be more complex.

[0022] In addition, in the following description, specific details are provided to thoroughly understand the examples. However, one skilled in the art will appreciate that the described aspects can be practiced without these specific details.

[0023] EAP: Equipment Automation Program, refers to the core software system in the semiconductor for realizing the data interaction between production equipment and upper management system (such as MES), equipment control and production process collaboration, is the key middleware connecting equipment and factory management system.

[0024] MES: Manufacturing Execution System, a software system used in semiconductor factories to monitor, manage and optimize production processes, closely interfaces with the EAP system to realize production order issuance, production data collection and other functions.

[0025] RMS: Recipe Management System, a software system used in semiconductor factories to manage, verify and issue process recipes (Recipes) to production equipment. The EAP program usually needs to obtain the correct recipe file from the RMS and issue it to the equipment to ensure the accuracy of the production process.

[0026] SECS-II: SEMI Equipment Communication Standard 2, a communication protocol between equipment and host commonly used in semiconductor industry, which specifies the format of data exchange, command and response rules, and is the core protocol for EAP system and equipment communication.

[0027] GEM: Generic Equipment Model, a device general interface specification based on SECS-II protocol extension, which defines standardized function interfaces such as device state management, process parameter setting and fault alarm, so that devices of different manufacturers can be connected to EAP system in a unified way.

[0028] As shown in Figure 1 , the embodiment of the present application provides an automatic simulation test system of a semiconductor EAP system, which comprises a device simulation module, an external system simulation module, a test case management module, an automatic execution engine and a test report generation module.

[0029] The device simulation module is used for receiving protocol commands sent by the measured EAP program, and simulating protocol interaction logic, device running state and fault behavior between semiconductor devices. The device simulation module can support SECS-II / GEM protocol, so as to simulate SECS-II / GEM protocol interaction logic, device running state and fault behavior of semiconductor devices, etc. The device simulation module at least comprises a protocol analysis unit, a device state simulation unit and a fault injection unit. In an embodiment, the device simulation module comprises a protocol analysis unit, a device state simulation unit, a fault injection unit and a device plug-in manager. For special type devices, protocol adaptation plug-ins in the device plug-in manager can be developed to access the device simulation module, at this time, the core code of the device simulation module does not need to be modified; the fault type can be extended through a JSON configuration file, and when a new fault is added, only the fault code and performance logic need to be supplemented.

[0030] The external system simulation module is used for simulating the core interface of the external system connected to the measured EAP program.

[0031] The external system can be an MES system or other commonly used system in a semiconductor factory, such as an RMS system. The external system simulation module can simulate the core interface of the MES system connected to the EAP (such as production order issuing, production data uploading, and process recipe query), or support communication modes such as HTTP and Socket. Specifically, the external system simulation module can simulate the MES issuing production data containing batch and production quantity to the EAP program, and can also receive the device production data uploaded by the EAP and verify the correct format. The external system simulation module can also simulate the RMS system issuing production data containing a recipe file to the EAP program under test. The external system simulation module can include MES simulation interfaces, RMS simulation interfaces, and other system simulation interfaces, and then generate corresponding production data through each simulation interface and send it to the EAP program under test. The external system simulation module can also only include a system simulation plug-in unit, which generates a simulation interface of the external system according to the current demand to receive test cases and generate test data for interaction with the EAP program under test. The system simulation plug-in unit can generate simulation interfaces of various systems in real time, or can generate simulation interfaces of various systems in batches according to demand. The simulation interface is a standardized interface of each system, which can interact with the test case management module and has strong adaptability.

[0032] The test case management module codes and defines the test scene through the test case, and stores and manages the test case. The test case management module can code, store, and manage the test scene. The test case management module can include a case template writing unit. The case template writing unit can generate a test case as a template according to the communication interface of the device simulation module, the communication interface of the external system simulation module, the interface of the EAP program under test, and the test scene. The case template writing unit can solidify the test case according to the test scene, thereby constituting a regression test suite of the EAP program under test, which can quickly find defects introduced by secondary development and ensure the stability of software iteration. In one embodiment, the test case management module can use an integrated Git version control tool to associate the case template writing unit, thereby realizing multi-person collaborative editing and branch management of the test case; for non-technical personnel, the test case management module can provide a visual case editing interface to generate test logic of the test case by dragging and dropping components, and then automatically convert it into code / configuration files corresponding to the test case.

[0033] An automation execution engine is configured to automatically invoke the device simulation module, the external system simulation module and the EAP program under test to interactively implement test flow automation based on the test cases in the test case management module. The automation execution engine is connected in series with the device simulation module, the external system simulation module and the test case management module to implement test flow automation. In one embodiment, the automation execution engine supports distributed execution, which can distribute test cases to multiple execution nodes for parallel running to further shorten the full test time; the automation execution engine can also integrate a timing task function to automatically execute tests at night and generate a report the next day.

[0034] A test report generation module is configured to compare real-time output data generated by the automation execution engine with expected results to generate a test report. The test report generation module converts raw data generated by the automation execution engine into an easily understandable test report. The output format of the test report can be any one of HTML, EXCEL, CSV and the like, and the test report generation module can output a format file that is easy for testers and developers to view. The report content of the test report can include at least one of the total number of test cases, the number of passes / fails, the pass rate, the execution time of each test case, detailed error information of failed test cases (including the difference between the actual result and the expected result, and the relevant log segment) and the like.

[0035] The above system uses device simulation modules and external system simulation modules customized for the semiconductor industry, which can simulate various real scenarios including abnormal situations, solve the problem of low simulation degree of general tools, greatly reduce the risk of failure caused by untested scenarios after going online, and improve test authenticity and coverage. Moreover, the test cases in the test case management module are fixed, which liberates testers from repetitive manual operations. The full regression test time after secondary development can be shortened from several days to several hours, the efficiency is improved by more than 50%, the test efficiency is greatly improved, and the labor cost is reduced.

[0036] In one embodiment, the device simulation module includes a protocol analysis unit, a device state simulation unit and a fault injection unit.

[0037] The protocol analysis unit is configured to receive protocol commands sent by the EAP program under test, analyze the protocol commands, and encapsulate response messages returned to the EAP program under test according to protocol specifications. The protocol analysis unit supports SECS-II protocol message format analysis and encapsulation, can receive protocol commands (such as parameter issuing S2F41 and event reporting S6F11) sent by the EAP program under test, and return response messages according to protocol specifications.

[0038] A device state simulation unit is configured to dynamically switch the device state of the device where the EAP program under test is located according to the test scene requirement, and synchronize the state change to the EAP program under test. The device state simulation unit can be configured as a device state machine, typical operating states (standby, production, fault, maintenance) of a preset semiconductor device, and dynamically switch the device state according to the test scene requirement, and synchronize the state change to the EAP program.

[0039] A fault injection unit is configured to trigger a fault according to a test case to verify the fault handling capability of the EAP program under test. The fault injection unit can simulate common device faults or simulate abnormal scenarios (such as sensor abnormalities, process parameter overruns, communication interruptions), and can trigger a fault according to a test case (such as triggering a fault when the EAP issues a production command) to verify the fault handling capability of the EAP program. The fault type can be extended through a JSON configuration file, and only the fault code and performance logic need to be supplemented in the fault injection unit when a new fault is added.

[0040] The above system can simulate various states of the device by developing a protocol adaptation plug-in to access the device simulation module without modifying the core code of the module.

[0041] In one embodiment, the external system simulation module includes a system simulation plug-in unit.

[0042] The system simulation plug-in unit is configured to generate a simulation interface simulating an external system to receive a test case and generate test data for interaction with the EAP program under test. The system simulation plug-in unit can generate a compliant MES simulation interface, or an RMS simulation interface, or other semiconductor factory system simulation interfaces according to the test requirements of the semiconductor factory.

[0043] The above system realizes plug-in design through the system simulation plug-in unit. When a new device or a new system needs to be supported, only the corresponding simulation plug-in needs to be developed without modifying the core framework, which reduces long-term maintenance costs and enables the test scheme to evolve with business development.

[0044] In one embodiment, the device simulation module and the external system simulation module both support access to new device protocols or system interfaces through plug-in methods, thereby ensuring the scalability of the system.

[0045] In one embodiment, the test case management module includes a case template writing unit, a version control unit, and a case retrieval unit.

[0046] The use case template writing unit writes test cases as templates according to the communication interface of the device simulation module, the communication interface of the external system simulation module, the interface of the EAP program to be tested, and the test scene. The use case template writing unit can provide Python / Java script templates and JSON / YAML configuration templates. The script templates or configuration templates can pre-set scene definition fields (such as scene name, test step, input parameter, expected result, and associated simulation module), and then concatenate the scene definition fields through the test scene. For example, in the Python script of the "device startup test" scene, the API (interface) of the device simulation module can be called to set the initial state of the device to "standby", send a startup command to the EAP program to be tested, and then assert whether the device state returned by the EAP is "production". The use case template writing unit can solidify the test cases according to the test scene, thereby forming a regression test suite of the EAP program to be tested, quickly discovering defects introduced by secondary development, and ensuring the stability of software iteration. The use case template writing unit uses standardized templates (such as Python / Java scripts or JSON / YAML configuration files) to define test steps, simulation module behavior parameters, and expected results, thereby realizing the code solidification of the test scene.

[0047] The version control unit is used to record the change record of the test case, so as to trace the adjustment record corresponding to the test scene. The version control unit can support the addition, modification, and deletion operations of the test case, and record the version change log of each test case, so as to trace the scene adjustment record.

[0048] The use case retrieval unit is used to support the retrieval of test cases from the test case database according to the scene type and associated device model. The use case retrieval unit can support the retrieval of test cases according to the scene type (such as device control, data acquisition, and fault handling) and the associated device model, thereby facilitating the quick selection of full-amount test cases during secondary development.

[0049] The above system manages the test cases, codes the test scene through the test cases, solidifies the core, and forms a regression test suite of the EAP program through the solidified test cases, thereby quickly discovering defects introduced by secondary development, ensuring the stability of software iteration, and making the later test process traceable.

[0050] In one embodiment, the automatic execution engine includes a use case loading unit, a flow control unit, a result comparison unit, and a log recording unit.

[0051] The use case loading unit is used to batch import test cases in the test case management module, and select test cases to be executed from the test cases according to priority or scene type. The use case loading unit can select test cases to be executed according to priority (high / medium / low) or scene type.

[0052] A flow control unit is configured to automatically send control instructions to the device simulation module and the external system simulation module according to the step information carried by the use case to be executed, and to trigger the test flow by calling the interface of the EAP program to be tested.

[0053] A result comparison unit is configured to collect the output data of the EAP program in real time, and compare the output data with the expected result in the use case to be executed, to generate the test result of the EAP program to be tested in the use case to be executed. The result comparison unit collects the output data (such as device state, return code, and data packet) of the EAP program in real time, compares the output data with the expected result in the use case, and marks the test as passed or failed.

[0054] A log recording unit is configured to generate a detailed execution log according to the execution of the use case to be executed. The log recording unit can record the key events (such as the start time of the use case, the state of the simulation module, and the EAP interface call record) in the test process, generate a detailed execution log, and facilitate the positioning of the test failure reason.

[0055] The above system, the result comparison unit can compare the actual output with the expected result in real time, generate a test report, replace manual execution, and greatly shorten the test period; and the detailed execution log generated by the log recording unit can be used to locate the cause when the subsequent use case to be tested fails.

[0056] In one embodiment, the test report generation module includes a data statistic and a test report generator.

[0057] The data statistic is configured to aggregate the test results of the EAP program to be tested in all test scenarios. The data statistic can count the pass rate of the EAP program to be tested in all test scenarios; the data statistic can also count the time length of the EAP program to be tested in all test scenarios and analyze the time length; the data statistic can also count the pass rate and analyze the time length.

[0058] The test report generator is configured to analyze the test results and generate a test report.

[0059] As shown in Figure 2 A method for automatically simulating and testing a semiconductor EAP system is also provided, including the following steps: Step 201, receiving a protocol command sent by an EAP program to be tested, and simulating the protocol interaction logic between semiconductor devices, the device running state, and the fault behavior; Step 202, simulating the core interface of an external system connected to the EAP program to be tested. Step 203, code definition of the test scene is performed through the test case, and the test case is stored and managed; Step 204, based on the test case in the test case management module, the device simulation module, the external system simulation module and the tested EAP program are automatically called to interact to realize test process automation, and real-time output data corresponding to the tested EAP program is generated; Step 205, the real-time output data generated by the automatic execution engine is compared with the expected result, and a test report is generated.

[0060] In one embodiment, an automatic simulation test method of a semiconductor EAP system is also provided, comprising the following steps: The test scene is code defined through the test case; the test environment is constructed by using the device simulation module and the external system simulation module; The test process of the tested EAP program is driven by the automatic execution engine, and real-time output data corresponding to the tested EAP program is generated; The real-time output data generated by the automatic execution engine is compared with the expected result, and a test report is generated.

[0061] The specific limitations of the automatic simulation test method of the semiconductor EAP system can be referred to the limitations of the automatic simulation test device of the semiconductor EAP system in the above, which will not be repeated here. Each module in the above automatic simulation test device of the semiconductor EAP system can be realized by software, hardware and their combination in whole or in part. The above each module can be embedded in or independent of the processor in the computer device in hardware form, or can be stored in the memory in the computer device in software form, so as to call and execute the operation corresponding to each module by the processor.

[0062] In one embodiment, a computer device is provided, which can be a server, and its internal structure diagram can be as shown in Figure 3 The computer device includes a processor, a memory, a network interface and a database connected through a system bus. The processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program and a database. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The database of the computer device is used to store test case data and the like. The network interface of the computer device is used to communicate with the external terminal through the network connection. The computer program is executed by the processor to realize an automatic simulation test method of a semiconductor EAP system.

[0063] In one embodiment, a computer device is provided, comprising a memory and a processor, the memory storing a computer program, and the processor implementing the following steps when executing the computer program: receiving a protocol command sent by a measured EAP program, and simulating protocol interaction logic between semiconductor devices, device running state and fault behavior; simulating a core interface of an MES system or an RMS system interfaced with the measured EAP program; defining a test scenario by code through a test case, and storing and managing the test case; based on the test case in the test case management module, automatically calling a device simulation module, an external system simulation module and the measured EAP program to interact to realize test process automation, generating real-time output data corresponding to the measured EAP program; comparing the real-time output data generated by the automated execution engine with expected results, and generating a test report.

[0064] In one embodiment, a computer readable storage medium is provided, storing a computer program, and the computer program is executed by a processor to implement the following steps: receiving a protocol command sent by a measured EAP program, and simulating protocol interaction logic between semiconductor devices, device running state and fault behavior; simulating a core interface of an MES system or an RMS system interfaced with the measured EAP program; defining a test scenario by code through a test case, and storing and managing the test case; based on the test case in the test case management module, automatically calling a device simulation module, an external system simulation module and the measured EAP program to interact to realize test process automation, generating real-time output data corresponding to the measured EAP program; comparing the real-time output data generated by the automated execution engine with expected results, and generating a test report.

[0065] The above merely describes specific embodiments of the present application, but the protection scope of the present application is not limited thereto, and any person skilled in the art can easily think of changes or replacements within the technical scope disclosed by the present application, which should be covered within the protection scope of the present application.

Claims

1. An automated simulation and testing system for a semiconductor EAP system, characterized in that, include: The device simulation module is used to receive protocol commands sent by the EAP program under test and simulate the protocol interaction logic between semiconductor devices, the device operating status and fault behavior. The external system simulation module is used to simulate the core interface of the external system that interfaces with the EAP program under test; The test case management module defines test scenarios in code through test cases, and stores and manages the test cases. An automated execution engine is used to automatically call the device simulation module and the external system simulation module to interact with the EAP program under test based on the test cases in the test case management module to automate the test process. The test report generation module is used to compare the real-time output data generated by the automated execution engine with the expected results and generate a test report.

2. The automatic simulation testing system according to claim 1, characterized in that, The equipment simulation module includes: The protocol parsing unit is used to receive the protocol commands sent by the EAP program under test, parse the protocol commands, and encapsulate the response messages returned to the EAP program under test according to the protocol specifications. The device status simulation unit is used to dynamically switch the device status of the device where the EAP program under test is located according to the test scenario requirements, and synchronize the status changes to the EAP program under test. The fault injection unit configures the fault triggering timing through test cases to verify the fault handling capability of the EAP program under test.

3. The automatic simulation testing system according to claim 1, characterized in that, The external system simulation module includes: The system simulation plug-in unit is used to generate a simulated interface for an external system to receive the test cases and generate test data for interaction with the EAP program under test.

4. The automatic simulation testing system according to claim 1, characterized in that, The test case management module includes: The test case template writing unit generates test cases as templates based on the obtained communication interfaces of the device simulation module, the external system simulation module, the interface of the EAP program under test, and the test scenario. The version control unit is used to record the changes to the test cases, making it easy to trace the adjustment records corresponding to the test scenarios; The test case retrieval unit is used to support retrieving the test cases from the test case database by scenario type and associated device model.

5. The automatic simulation testing system according to claim 1, characterized in that, The automated execution engine includes: The test case loading unit is used to import test cases from the test case management module in batches and filter test cases to be executed from the test cases according to priority or scenario type. The process control unit is used to automatically send control commands to the device simulation module and the external system simulation module according to the step information carried by the test case to be executed, and at the same time call the interface of the EAP program under test to trigger the test process. The result comparison unit is used to collect the output data of the EAP program in real time and compare it with the expected results in the test case to be executed, and generate the test results of the EAP program under test running the test case to be executed. The logging unit is used to generate detailed execution logs based on the execution status of the test cases to be executed.

6. The automatic simulation testing system according to claim 1, characterized in that, The test report generation module includes: The data statistics tool is used to summarize the test results of the tested EAP program under all test scenarios; A test report generator is used to analyze the test results and generate a test report.

7. An automated simulation testing method for a semiconductor EAP system, characterized in that, include: It receives protocol commands sent by the EAP program under test and simulates the protocol interaction logic between semiconductor devices, device operating status, and fault behavior. Simulate the core interface of the external system that interfaces with the EAP program under test; Test scenarios are defined in code through test cases, and these test cases are stored and managed. Based on the test cases in the test case management module, the device simulation module and external system simulation module are automatically invoked to interact with the EAP program under test to automate the test process and generate real-time output data corresponding to the EAP program under test. The real-time output data generated by the automated execution engine is compared with the expected results to generate a test report.

8. An automated simulation testing method for a semiconductor EAP system, characterized in that, include: Define test scenarios by coding test cases; A test environment is constructed using equipment simulation modules and external system simulation modules; The test process of the EAP program under test is driven by an automated execution engine, and real-time output data corresponding to the EAP program under test is generated. The real-time output data generated by the automated execution engine is compared with the expected results to generate a test report.

9. A computer device comprising a memory and a processor, wherein the memory stores a computer program, characterized in that, When the processor executes the computer program, it implements the steps of the method of claim 7 or 8.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by a processor, it implements the steps of the method of claim 7 or 8.

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