Galvanometer scanning laser precision etching method and device based on machine vision measurement feedback

By using machine vision measurement feedback, the position of the laser spot is detected in real time and interpolation calculation is performed, which solves the problem of unstable control of laser etching depth by galvanometer scanning and realizes stable and precise control of laser etching depth.

CN121755901APending Publication Date: 2026-03-31HUAZHONG UNIV OF SCI & TECH
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Patent Information

Application Number
CN202511984976.1
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-12-26
Publication Date
2026-03-31

AI Technical Summary

Technical Problem

Existing galvanometer scanning laser precision etching technology has difficulty maintaining stable control over processing depth. It is greatly affected by the environment, laser parameters, and material surface condition, especially when forming deep structures through multiple scans, the effect is unstable.

Method used

The method of machine vision measurement feedback is adopted. The position of the laser spot is measured in real time by an industrial microscope camera. Combined with interpolation calculation, the laser etching depth is detected and controlled in real time. Closed-loop control is performed using a coaxial indicator light and control software.

Benefits of technology

It enables real-time detection and control of laser etching depth under complex process conditions, reducing measurement errors and ensuring the stability and accuracy of etching depth.

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Abstract

The invention provides a galvanometer scanning laser precise etching method and device based on machine vision measurement feedback. The method comprises the following steps: S1, height calibration: aligning an industrial microscopic camera to a processing area, and establishing and storing a light spot coordinate and surface height h mapping table by using coaxial indicating light; s2, parameter setting: presetting process parameters such as processing depth in control software; s3, initial height detection: obtaining surface light spot coordinates through a microscopic camera, and calculating the initial height by combining mapping table interpolation; s4, laser etching is carried out, wherein galvanometer scanning machining is carried out according to a set graph and parameters; s5, depth feedback: detecting the coordinates of the processed surface in real time and calculating the current height and the etching depth; and S6, closed-loop control: if the etching depth does not reach the processing depth, returning to the step S4 to continue processing until the target depth is reached. According to the invention, the height information is fed back in real time to realize closed-loop control, the problems of real-time detection and precision control of the etching depth under a complex process are solved, and the processing consistency is remarkably improved.
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